CN109451678A - A kind of production method of KU wave band 40W power amplifier module - Google Patents
A kind of production method of KU wave band 40W power amplifier module Download PDFInfo
- Publication number
- CN109451678A CN109451678A CN201811509592.4A CN201811509592A CN109451678A CN 109451678 A CN109451678 A CN 109451678A CN 201811509592 A CN201811509592 A CN 201811509592A CN 109451678 A CN109451678 A CN 109451678A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- component
- wave band
- power amplifier
- production method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Microwave Amplifiers (AREA)
Abstract
Invention broadly provides a kind of production method of KU wave band 40W power amplifier module, including amplifier shell, the making step of the amplifier module are as follows: S1: by welding circuit board inside amplifier shell, obtaining first assembly；S2: some components are welded into specified location on circuit boards, obtain the second component；S3: production control circuit board component；S4: the machine assembly of module；S5: the cavity paster component that assembly is completed is covered, is tested.The production method of KU wave band 40W power amplifier module of the invention is simple, production technique is more scientific practical, the qualification rate that product qualification rate is produced compared with prior art is higher, powerful guarantee is provided for mass production, fabrication processing is simple, equipment investment is small, is applicable in and produces in enormous quantities.
Description
Technical field
The invention mainly relates to the technical fields of microwave module processing, and in particular to a kind of KU wave band 40W power amplifier
The production method of module.
Background technique
Either in wireless communication system, satellite navigation system or military radar and electronic warfare system, power amplification
Device is all one of core component, it contains many important key technologies an of system, and microwave power amplifier is that microwave is logical
Believe the important component of equipment, its performance largely influences the quality of communication.The power amplifier of function admirable, in addition to
Outside accurate reasonable circuit and structure design work guarantee, also there is good manufacture craft.In existing microwave power amplifier
Manufacturing process in, it is unexcellent due to production method, cause the qualification rate of product relatively low, meanwhile, existing microwave function
The complex production process of rate amplifier, equipment investment is larger, and it is impossible to meet the purposes of mass production.
Summary of the invention
Invention broadly provides a kind of production methods of KU wave band 40W power amplifier module, to solve above-mentioned back
The technical issues of being proposed in scape technology.
The present invention solves the technical solution that above-mentioned technical problem uses are as follows:
A kind of production method of KU wave band 40W power amplifier module, including amplifier shell, the production of the amplifier module
Steps are as follows:
S1: by welding circuit board inside amplifier shell, first assembly is obtained；
S2: some components are welded into specified location on circuit boards, obtain the second component；
S3: production control circuit board component；
S4: the machine assembly of module；
S5: the cavity paster component that assembly is completed is covered, is tested.
A kind of production method of KU wave band 40W power amplifier module, the specific operation method is as follows by the step S1:
S11: inside amplifier shell, at circuit board position to be welded, low-residual scaling powder is coated with fine arts hairbrush, is made low residual
Scaling powder is stayed to flow naturally 0.5~1 minute；
S12: weld tabs is chosen according to forming requirements and is cut into dimension and shape, then is placed on inside amplifier shell one by one
On corresponding position, then on each weld tabs surface coat low-residual scaling powder, and make low-residual scaling powder flow 0.5 naturally~
1 minute；
S13: circuit board is placed in amplifier shell on corresponding position, then selects briquetting to be put into amplifier shell again
It is interior, make briquetting that circuit board be completely covered, be reloaded into cover board, with screwdriver by screw locking；
S14: the component after the completion of above-mentioned steps S13 being placed into after heating 3~4 minutes on 260 DEG C of heating platform, removed,
It is placed on radiating block and radiates, removed after temperature is reduced to 140 DEG C or so, then by cover board and pressing plate, pass through X-RAY machine testing
Circuit board penetration rate, penetration rate reaches 90%, and the above are qualified products, obtain first assembly.
A kind of production method of KU wave band 40W power amplifier module, the specific operation method is as follows by the step S2:
S21: on the circuit board for the first assembly that above-mentioned steps obtain, 183 DEG C of spot printing of soldering paste on circuit boards, and by portion
Component is divided to mount on corresponding position on circuit boards；
S22: the obtained component of above-mentioned steps S21 being placed on heating platform after being sintered 1~1.5 minute, removed, and is placed
On radiating block, natural cooling；
S23: weld tabs is chosen according to forming requirements and is cut into dimension and shape, is being placed on the corresponding position of circuit board one by one
It sets, then each chip is placed on weld tabs one by one, and weld tabs is fixed in amplifier shell using screw；
S24: the obtained component of above-mentioned steps S23 is placed into after being sintered 1~1.5 minute on 180 DEG C of heating platform, is taken
Under, it is placed on radiating block, natural cooling；
S25: above-mentioned component after cooling is placed into the rinse bath of cleaning machine, using ultrasonic cleaning 10-15 minutes, rinsing
It 7-10 minutes, further takes out, is sent into drying box, to get the second component after cooling drying 3-5 minutes.
A kind of production method of KU wave band 40W power amplifier module, the specific operation method is as follows by the step S3:
S31: choosing control circuit board, bite 183 DEG C of soldering paste in control circuit board with screen process press, will with automatic placement machine
In component attachment to control circuit board；
S32: the obtained component of above-mentioned steps S31 being placed on 205 DEG C of heating platform and is sintered 1-1.5 minutes, and sintering is completed
After remove, be placed on radiating block and radiate；
S33: the sintered component of step S32 being put into the rinse bath of cleaning machine and carries out ultrasonic cleaning 5-6 minutes, rinses 2-3
It after minute, takes out, is sent into drying box, it is cooling 1-2 minutes dry, obtain control circuit board component；
S34: the control circuit board component that above-mentioned steps S34 is obtained is fixed in amplifier shell using screw.
A kind of production method of KU wave band 40W power amplifier module, the specific operation method is as follows by the step S4:
S41: the first briquetting, the second briquetting and third briquetting, second briquetting and third briquetting are installed on the circuit board
On be respectively fixed with two the first feedthrough capacitors；
S42: by screw by pre-amplifier, filter, the first feedthrough capacitor, the second feedthrough capacitor, earthing rod, evil spirit T, waveguide
Isolator and radio frequency connector are separately fixed at the specified location of amplifier shell.
A kind of production method of KU wave band 40W power amplifier module, the specific operation method is as follows by the step S5:
S51: mark is stamped on the cover board with laser marking machine；
S52: cover board installation is fixed in amplifier shell with screw.
A kind of production method of KU wave band 40W power amplifier module, the KU wave band 40W power amplifier module use
Manufacture craft as claimed in claims 1-9 processes skill.
Compared with prior art, the invention has the benefit that the system of KU wave band 40W power amplifier module of the invention
It is simple to make method, production technique is more scientific practical, and the qualification rate that product qualification rate is produced compared with prior art is higher,
Powerful guarantee is provided for mass production, fabrication processing is simple, and equipment investment is small, is applicable in and produces in enormous quantities.
Detailed explanation is carried out to the present invention below with reference to attached drawing and specific embodiment.
Detailed description of the invention
Fig. 1 is module machine assembly figure of the invention；
Fig. 2 is circuit board and cavity installation diagram of the invention；
Fig. 3 is control circuit board installation diagram of the invention；
Fig. 4 is the installation diagram of the first briquetting of the invention；
Fig. 5 is the installation diagram of the second briquetting of the invention；
Fig. 6 is the installation diagram of third briquetting of the invention；
Fig. 7 is function structure chart of the invention.
In figure: 1- amplifier shell；The first briquetting of 2-；The second briquetting of 3-；4- third briquetting；5- control circuit board；6- filter
Wave device；7- pre-amplifier；8- evil spirit T；9- waveguide isolator；10- radio frequency connector；The first feedthrough capacitor of 11-；12- second is worn
Electrocardio holds；13- earthing rod.
Detailed explanation is carried out to the present invention below with reference to attached drawing and specific embodiment.
Specific embodiment
To facilitate the understanding of the present invention, the present invention is described more fully below with reference to relevant drawings, attached drawing
In give several embodiments of the invention, but the present invention can be realized by different forms, however it is not limited to text institute
The embodiment of description, opposite, it theses embodiments are provided so that more thorough and comprehensive to present disclosure.
Embodiment
A kind of production method of KU wave band 40W power amplifier module, specific processing method are as follows:
It please be emphatically referring to attached drawing 2, S1: by ROGERS welding circuit board inside amplifier shell 1, obtaining first assembly；
S11: inside amplifier shell, in the position ROGERS circuit board RG1, RG2, RG3, RG4, RG5, RG6, RG7 to be welded
Place coats low-residual scaling powder with fine arts hairbrush, flows low-residual scaling powder naturally 0.5~1 minute；
S12: choosing weld tabs-SAC0.5, and thick 0.05mm is cut into dimension and shape according to forming requirements, is placing one by one
Inside the amplifier shell on the corresponding position RG1, RG2, RG3, RG4, RG5, RG6, RG7, then coat on each weld tabs surface
Low-residual scaling powder, and flow low-residual scaling powder naturally 0.5~1 minute；
S13: ROGERS circuit board is placed in amplifier shell on corresponding position, then briquetting is selected to be put into amplification again
In device shell, make briquetting that ROGERS circuit board be completely covered, be reloaded into cover board, then with screwdriver by the tack of cover board M2 × 8
Screw locking；
S14: the component after the completion of above-mentioned steps S13 being placed into after heating 3~4 minutes on 260 DEG C of heating platform, removed,
It is placed on radiating block and radiates, after temperature is reduced to 140 DEG C or so, remove flat head screw M2 × 8 with screwdriver, then by cover board
It is removed with pressing plate, by X-RAY machine testing circuit board penetration rate, penetration rate reaches 90%, and the above are qualified products, obtain first group
Part.
It please be emphatically referring to attached drawing 2, S2: some components being welded on specified location on ROGERS circuit board, obtain second
Component；
S21: on the ROGERS circuit board for the first assembly that above-mentioned steps obtain, the soldering paste-that 183 DEG C of spot printing
SN63CR37AGS89.5, and some components are mounted on the corresponding position of circuit board；
S22: the obtained component of above-mentioned steps S21 being placed on heating platform after being sintered 1~1.5 minute, removed, and is placed
On radiating block, natural cooling；
S23: choosing weld tabs-Sn43Pb43Bi14, and thick 0.05mm is cut into dimension and shape according to forming requirements, by
One is placed at the position ROGERS circuit board corresponding chip U3, U4, U5, U6, then chip U3, U4, U5, U6 are placed on one by one
On weld tabs-Sn43Pb43Bi14, and each weld tabs-Sn43Pb43Bi14 is separately fixed at amplifier shell 1 using screw
It is interior；
S24: the obtained component of above-mentioned steps S23 is placed into after being sintered 1~1.5 minute on 180 DEG C of heating platform, is taken
Under, it is placed on radiating block, natural cooling；
S25: above-mentioned component after cooling is placed into the rinse bath of cleaning machine, using ultrasonic cleaning 10-15 minutes, rinsing
It 7-10 minutes, further takes out, is sent into drying box, to get the second component after cooling drying 3-5 minutes.
It please be emphatically referring to attached drawing 3, S3: production control circuit board component；
S31: it chooses control circuit board 5 and utilizes 183 DEG C of soldering paste with screen process press in control circuit board 5
SN63CR37AGS89.5 bites, and is mounted component onto control circuit board 5 with automatic placement machine；
S32: the obtained component of above-mentioned steps S31 being placed on 205 DEG C of heating platform and is sintered 1-1.5 minutes, and sintering is completed
After remove, be placed on radiating block and radiate；
S33: the sintered component of step S32 being put into the rinse bath of cleaning machine and carries out ultrasonic cleaning 5-6 minutes, rinses 2-3
It after minute, takes out, is sent into drying box, it is cooling 1-2 minutes dry, obtain control circuit board component；
S34: the control circuit board component that above-mentioned steps S34 is obtained is fixed in amplifier shell 1 using the screw of M2x6.
S4: the machine assembly of module；
It please be emphatically referring to attached drawing 4-6, S41: the first briquetting 2, the second briquetting 3 and third briquetting 4, institute are installed on the circuit board
It states and is respectively fixed with two the first feedthrough capacitor 11---CT52-4Q-2C1-50V-15 on the second briquetting 2 and third briquetting 3,
It is fixed on third briquetting 4 that there are four the first feedthrough capacitor 11---CT52-4Q-2C1-50V-152, each first feedthrough capacitors
The screw that 11---CT52-4Q-2C1-50V-15 passes through M2.5X4 respectively is fixed on briquetting；
It please be emphatically referring to attached drawing 1, S42: pre-amplifier 7 being mounted on the corresponding position of amplifier shell 1, and with M2 × 12
Screw is fixed, and both ends insulator is connect with micro-strip plate GR1, GR2 lap-joint with electric iron fusion weld tin wire bond；
S43: filter 6 is mounted on 1 corresponding position of amplifier shell, and is fixed with the screw of M2 × 12, both ends insulator with
Micro-strip plate GR2, GR3 lap-joint is connect with electric iron fusion weld tin wire bond；
S44: the first feedthrough capacitor 11---CT52-4Q-2C1-50V-15 is screwed by the screw thread of itself and is mounted on amplifier shell
On body 1；
S45: M4 earthing rod 13 is screwed by the screw thread of itself and is mounted in amplifier shell 1；
S46: magic T8---PDMT14125BT750L33A6MS is mounted in amplifier shell 1 with the screw of M2.5 × 8, evil spirit
Two inner cores and micro-strip plate RG6, RG7 lap-joint electric iron fusion weld tin silk on T8---PDMT14125BT750L33A6MS
Welding；
S47: waveguide isolator 9---BG120-25M1 hex(agonal)screw M4 × 6 are mounted in amplifier shell 1；
S48: SMA radio frequency connector 10---SMA-KWFD-3KS17-4 is mounted on shell with the screw of M2 × 6；
It please be emphatically referring to attached drawing 7, S5: the cavity paster component that assembly is completed being covered, is tested.
S51: mark is stamped on the cover board with laser marking machine, laser marking machine parameter: set of frequency 2.445KHz, electricity
Stream is 7.4A；
S52: cover board installation is fixed in amplifier shell 1 with the sunk screw of M2x6.
So far, a kind of KU wave band 40W power amplifier module completes.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of production method of KU wave band 40W power amplifier module, including amplifier shell, which is characterized in that described to put
The making step of big device module is as follows:
S1: by welding circuit board inside amplifier shell, first assembly is obtained；
S2: some components are welded into specified location on circuit boards, obtain the second component；
S3: production control circuit board component；
S4: the machine assembly of module；
S5: the cavity paster component that assembly is completed is covered, is tested.
2. a kind of production method of KU wave band 40W power amplifier module according to claim 1, which is characterized in that institute
Stating step S1, the specific operation method is as follows:
S11: inside amplifier shell, at circuit board position to be welded, low-residual scaling powder is coated with fine arts hairbrush, is made low residual
Scaling powder is stayed to flow naturally 0.5~1 minute；
S12: weld tabs is chosen according to forming requirements and is cut into dimension and shape, then is placed on inside amplifier shell one by one
On corresponding position, then on each weld tabs surface coat low-residual scaling powder, and make low-residual scaling powder flow 0.5 naturally~
1 minute；
S13: circuit board is placed in amplifier shell on corresponding position, then selects briquetting to be put into amplifier shell again
It is interior, make briquetting that circuit board be completely covered, be reloaded into cover board, with screwdriver by screw locking；
S14: the component after the completion of above-mentioned steps S13 is placed into after being heated 3~4 minutes on heating platform, removes, is placed into scattered
It radiates in heat block, is removed after temperature is reduced to 140 DEG C or so, then by cover board and pressing plate, obtain first assembly.
3. a kind of production method of KU wave band 40W power amplifier module according to claim 2, which is characterized in that
In step S14, before component is placed into warm table, the temperature of warm table need to adjust to 260 DEG C preheating 1-2 minutes.
4. a kind of production method of KU wave band 40W power amplifier module according to claim 2, which is characterized in that
In step S14, after removing cover board and pressing plate, need to penetrate obtained first assembly by X-RAY machine testing circuit board
Rate, penetration rate reaches 90%, and the above are qualified products.
5. a kind of production method of KU wave band 40W power amplifier module according to claim 1, which is characterized in that institute
Stating step S2, the specific operation method is as follows:
S21: on the circuit board for the first assembly that above-mentioned steps obtain, 183 DEG C of spot printing of soldering paste on circuit boards, and by portion
Component is divided to mount on corresponding position on circuit boards；
S22: the obtained component of above-mentioned steps S21 being placed on heating platform after being sintered 1~1.5 minute, removed, and is placed
On radiating block, natural cooling；
S23: weld tabs is chosen according to forming requirements and is cut into dimension and shape, is being placed on the corresponding position of circuit board one by one
It sets, then each chip is placed on weld tabs one by one, and weld tabs is fixed in amplifier shell using screw；
S24: the obtained component of above-mentioned steps S23 is placed into after being sintered 1~1.5 minute on 180 DEG C of heating platform, is taken
Under, it is placed on radiating block, natural cooling；
S25: above-mentioned component after cooling is placed into the rinse bath of cleaning machine, using ultrasonic cleaning 10-15 minutes, rinsing
It 7-10 minutes, further takes out, is sent into drying box, to get the second component after cooling drying 3-5 minutes.
6. a kind of production method of KU wave band 40W power amplifier module according to claim 1, which is characterized in that institute
Stating step S3, the specific operation method is as follows:
S31: choosing control circuit board, bite 183 DEG C of soldering paste in control circuit board with screen process press, will with automatic placement machine
In component attachment to control circuit board；
S32: the obtained component of above-mentioned steps S31 being placed on 205 DEG C of heating platform and is sintered 1-1.5 minutes, and sintering is completed
After remove, be placed on radiating block and radiate；
S33: the sintered component of step S32 being put into the rinse bath of cleaning machine and carries out ultrasonic cleaning 5-6 minutes, rinses 2-3
It after minute, takes out, is sent into drying box, it is cooling 1-2 minutes dry, obtain control circuit board component；
S34: the control circuit board component that above-mentioned steps S34 is obtained is fixed in amplifier shell using screw.
7. a kind of production method of KU wave band 40W power amplifier module according to claim 1, which is characterized in that institute
Stating step S4, the specific operation method is as follows:
S41: being equipped with multiple briquettings on the circuit board, is fixed at least two first punchings by screw on each briquetting
Capacitor；
S42: by screw by pre-amplifier, filter, the first feedthrough capacitor, the second feedthrough capacitor, earthing rod, evil spirit T, waveguide
Isolator and radio frequency connector are separately fixed at the specified location of amplifier shell.
8. a kind of production method of KU wave band 40W power amplifier module according to claim 7, which is characterized in that
In above-mentioned steps S41, the briquetting includes the first briquetting, the second briquetting and third briquetting, is fixed with four on first briquetting
A feedthrough capacitor is respectively fixed with two feedthrough capacitors on second briquetting and third briquetting.
9. a kind of production method of KU wave band 40W power amplifier module according to claim 1, which is characterized in that institute
Stating step S5, the specific operation method is as follows:
S51: mark is stamped on the cover board with laser marking machine；
S52: cover board installation is fixed in amplifier shell with screw.
10. a kind of production method of KU wave band 40W power amplifier module according to claim 1, which is characterized in that institute
KU wave band 40W power amplifier module is stated to process using manufacture craft as claimed in claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811509592.4A CN109451678A (en) | 2018-12-11 | 2018-12-11 | A kind of production method of KU wave band 40W power amplifier module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811509592.4A CN109451678A (en) | 2018-12-11 | 2018-12-11 | A kind of production method of KU wave band 40W power amplifier module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109451678A true CN109451678A (en) | 2019-03-08 |
Family
ID=65557215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811509592.4A Withdrawn CN109451678A (en) | 2018-12-11 | 2018-12-11 | A kind of production method of KU wave band 40W power amplifier module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109451678A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109769390A (en) * | 2019-03-14 | 2019-05-17 | 安徽华东光电技术研究所有限公司 | A kind of production method of pre-amplifier module |
| CN110167284A (en) * | 2019-06-27 | 2019-08-23 | 安徽华东光电技术研究所有限公司 | A kind of manufacture craft of power amplifier module |
| CN110798992A (en) * | 2019-11-22 | 2020-02-14 | 安徽华东光电技术研究所有限公司 | Manufacturing method of L-band pulse amplifier module |
| CN111988913A (en) * | 2020-08-04 | 2020-11-24 | 安徽华东光电技术研究所有限公司 | Manufacturing method of Ku-band power amplifier driver module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106535497A (en) * | 2016-11-04 | 2017-03-22 | 安徽华东光电产业研究院有限公司 | T/R receiving front-end module processing method |
| CN107708400A (en) * | 2017-09-01 | 2018-02-16 | 安徽华东光电技术研究所 | Power connects the processing method of pulse amplifier in X-band |
| CN107968632A (en) * | 2017-11-02 | 2018-04-27 | 安徽华东光电技术研究所 | A kind of manufacture craft of 40 watts of power amplifiers of Ku wave bands |
| CN108111128A (en) * | 2017-12-15 | 2018-06-01 | 安徽华东光电技术研究所 | A kind of manufacture craft of 60 watts of miniaturization power amplifiers of Ku wave bands |
-
2018
- 2018-12-11 CN CN201811509592.4A patent/CN109451678A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106535497A (en) * | 2016-11-04 | 2017-03-22 | 安徽华东光电产业研究院有限公司 | T/R receiving front-end module processing method |
| CN107708400A (en) * | 2017-09-01 | 2018-02-16 | 安徽华东光电技术研究所 | Power connects the processing method of pulse amplifier in X-band |
| CN107968632A (en) * | 2017-11-02 | 2018-04-27 | 安徽华东光电技术研究所 | A kind of manufacture craft of 40 watts of power amplifiers of Ku wave bands |
| CN108111128A (en) * | 2017-12-15 | 2018-06-01 | 安徽华东光电技术研究所 | A kind of manufacture craft of 60 watts of miniaturization power amplifiers of Ku wave bands |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109769390A (en) * | 2019-03-14 | 2019-05-17 | 安徽华东光电技术研究所有限公司 | A kind of production method of pre-amplifier module |
| CN110167284A (en) * | 2019-06-27 | 2019-08-23 | 安徽华东光电技术研究所有限公司 | A kind of manufacture craft of power amplifier module |
| CN110167284B (en) * | 2019-06-27 | 2021-12-24 | 安徽华东光电技术研究所有限公司 | Manufacturing process of power amplifier module |
| CN110798992A (en) * | 2019-11-22 | 2020-02-14 | 安徽华东光电技术研究所有限公司 | Manufacturing method of L-band pulse amplifier module |
| CN111988913A (en) * | 2020-08-04 | 2020-11-24 | 安徽华东光电技术研究所有限公司 | Manufacturing method of Ku-band power amplifier driver module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109451678A (en) | A kind of production method of KU wave band 40W power amplifier module | |
| US20200245495A1 (en) | Method of fixing flexible printed circuit and mobile terminal | |
| CN103008814A (en) | Vacuum braze welding method of antenna submatrix | |
| CN109769352B (en) | Manufacturing method of 80W power amplifier module | |
| CN109688725B (en) | Manufacturing method of K1 waveband frequency source module | |
| CN105530017A (en) | Method for manufacturing receiving front end of broadband receiving and transmitting system | |
| KR20170029375A (en) | Fusion Sheet For Absorption extinction and Shielding of Electromagnetic Wave | |
| CN102123562B (en) | Method for manufacturing metal substrate by adopting reflow soldering | |
| CN103447646B (en) | The welding method of soft chip circuit plate and metallic matrix is realized without special tooling | |
| CN110266279A (en) | A kind of manufacture craft of 6 watts of power amplifiers of C-band | |
| CN115003017B (en) | Circuit board, manufacturing method thereof and terminal equipment | |
| CN110416671B (en) | Resonator, cavity filter and debugging method thereof | |
| CN203120303U (en) | Apparatus used for manufacturing heat dissipation structure of printed circuit board | |
| CN109618502A (en) | A kind of high-gain amplifier module making processing method | |
| CN114434894A (en) | Copper foil graphite film and preparation method thereof | |
| CN111774682B (en) | Welding method for special-shaped porous printed board | |
| CN209562936U (en) | A kind of ceramic multilayer electroplating circuit board Multi-axis simultaneous machining equipment | |
| CN204596786U (en) | A kind of power model | |
| CN110798992A (en) | Manufacturing method of L-band pulse amplifier module | |
| CN203967062U (en) | A kind of metal-packaged shell | |
| CN106910635A (en) | A kind of orderly hole array anode tantalum foil for tantalum capacitor and preparation method thereof | |
| CN203590670U (en) | Heat radiation structure of radio frequency power amplifier | |
| CN110977072A (en) | Low-temperature sintering method of eutectic component | |
| CN106392229B (en) | Cage PCB induction soldering methods | |
| CN205847735U (en) | Anti-deformation crosses furnace carrier |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190308 |