CN203120303U - Apparatus used for manufacturing heat dissipation structure of printed circuit board - Google Patents
Apparatus used for manufacturing heat dissipation structure of printed circuit board Download PDFInfo
- Publication number
- CN203120303U CN203120303U CN 201220694703 CN201220694703U CN203120303U CN 203120303 U CN203120303 U CN 203120303U CN 201220694703 CN201220694703 CN 201220694703 CN 201220694703 U CN201220694703 U CN 201220694703U CN 203120303 U CN203120303 U CN 203120303U
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- copper sheet
- metal plate
- metallic plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Disclosed is an apparatus used for manufacturing a heat dissipation structure of a printed circuit board. A backside blank area of the printed circuit board is attached with a first copper sheet, and the first copper sheet is provided with a heat dissipation reinforcement area. The apparatus comprises a metal plate attached to the heat dissipation reinforcement area and a sleeve film. The metal plate is provided with array holes. Tin solder paste is applied inside the array holes of the metal plate so that when the metal plate is placed inside a reflow oven, the tin solder paste can be heated to form tin solder balls and attached to the heat dissipation reinforcement area of the first copper sheet. The sleeve film is used for wrapping the metal plate when the metal plate goes through a wave-soldering process. According to the aforementioned apparatus used for manufacturing the heat dissipation structure of the printed circuit board, the array holes are arranged on the metal plate, the tin solder paste is applied in the array holes, the tin solder paste forms the tin solder balls when the metal plate goes through the reflow oven, and the metal plate is wrapped by the sleeve film when the metal plate is under wave-soldering, so that the secondary tin application is prevented and the usage amount of tin is reduced; and the metal plate is provided with the array holes so that the applied tin solder paste can form the tin solder balls uniformly and thus the metal plate can be applied with the tin in a uniform manner.
Description
Technical field
The utility model relates to the device for the manufacture of the printed circuit board radiating structure, particularly relate to a kind of go up the tin amount few, go up tin uniformly for the manufacture of the device of printed circuit board radiating structure.
Background technology
Because the power density of electronic equipment is increasing, in order to reduce the whole plate temperature of printed circuit board (PCB), more and more to depend on printed circuit board (PCB) is dispelled the heat.Method in common is exactly at the big copper sheet of trying one's best in the back side of printed circuit board (PCB) white space shop, and copper sheet is windowed, and the green oil that is about to the copper sheet surface is removed.When crossing wave-soldering, by wave-soldering back side copper sheet windowed regions is applied tin cream, thereby dispel the heat by increasing surface area.But to apply the amount of tin cream very big for the copper sheet windowed regions overleaf, and when crossing wave-soldering tin cream since be heated irregular cause the copper sheet windowed regions on tin inhomogeneous, be unfavorable for dispelling the heat.
The utility model content
Based on this, provide a kind of go up the tin amount few, go up tin uniformly for the manufacture of the device of printed circuit board radiating structure.
A kind of device for the manufacture of the printed circuit board radiating structure, the back side white space of described printed circuit board (PCB) adheres to first copper sheet, and described first copper sheet is offered heat radiation and is strengthened the district; Comprise be used to being attached to described heat radiation and strengthen metallic plate and the mantle in district;
Described metallic plate is provided with array hole;
Be used for brush in the array hole of described metallic plate and establish tin cream, make that the district was strengthened in the heat radiation that described tin cream is subjected to thermosetting tin ball to be attached to described first copper sheet when described metallic plate placed reflow ovens;
Described mantle is used for coating described metallic plate when described metallic plate carries out wave-soldering.
Among embodiment, described metallic plate is sheetmetal therein.
Among embodiment, described sheetmetal thickness is 0.1mm-0.3mm therein.
Among embodiment, described sheetmetal thickness is 0.15mm therein.
Among embodiment, described metallic plate is second copper sheet therein.
Among embodiment, the described second copper sheet thickness is 0.1mm-0.3mm therein.
Therein among embodiment, the described first copper sheet back side is removed surperficial green oil and is formed described heat radiation and strengthen the district.
Among embodiment, the described second copper sheet thickness is 0.15mm therein.
Among embodiment, described array hole is the circular array hole therein, and the circular port diameter in the described circular array hole is 1.5mm, and spacing is 2mm.
Above-mentioned device for the manufacture of the printed circuit board radiating structure is by arranging array hole at metallic plate, and brushes tin cream at array hole.When crossing reflow ovens, tin cream is subjected to thermosetting tin ball.When crossing wave-soldering, with clad metal plate, avoid tin on the secondary with mantle, thereby saved the tin amount of using.And at metallic plate array hole is set, make the tin cream brush can form the tin ball uniformly, thereby make that tin is even on the metallic plate.
Description of drawings
Fig. 1 is the apparatus structure schematic diagram for the manufacture of the printed circuit board radiating structure.
Embodiment
As shown in Figure 1, be the structural representation for the manufacture of the device of printed circuit board radiating structure.
A kind of device for the manufacture of the printed circuit board radiating structure comprises be used to being attached to heat radiation and strengthens metallic plate and the mantle (not shown) in district.The back side white space of printed circuit board (PCB) adheres to first copper sheet, and first copper sheet is offered heat radiation and strengthened the district; Metallic plate 101 is provided with array hole 103.Be used for brush in the array hole 103 of metallic plate 101 and establish tin cream, make that the district was strengthened in the heat radiation that tin cream is subjected to thermosetting tin ball to be attached to first copper sheet when metallic plate 101 placed reflow ovens.Mantle is used for clad metal plate 101 when metallic plate 101 carries out wave-soldering.
Metallic plate 101 comprises sheetmetal and second copper sheet.
When metallic plate 101 was sheetmetal, the thickness of sheetmetal was defined as 0.1mm-0.3mm.Preferably, owing to brush tin cream at metallic plate 101, thereby the optimal thickness of sheetmetal is 0.15mm.
When metallic plate 101 was second copper sheet, the thickness of second copper sheet was defined as 0.1mm-0.3mm.Preferably, owing to brush tin cream at metallic plate 101, thereby the optimal thickness of second copper sheet is 0.15mm.
The first copper sheet back side is removed surperficial green oil and is formed heat radiation reinforcement district, namely second copper sheet is carried out fenestration procedure.
The array hole of offering on the metallic plate 101 103 is the circular array hole, and the circular port diameter in the circular array hole is 1.5mm, and the spacing between each circular port is 2mm.
The tin cream of brush on the metallic plate 101, after being heated in reflow ovens, forming diameter is the tin ball of 1mm.
Particularly, array hole is set to brushing tin cream at metallic plate 101, the process that arrives reflow ovens and wave-soldering again is as follows:
At first, at metallic plate 101 array hole 103 is set; The diameter of array hole 103 mesopores is that 1.5mm, spacing are 2mm.Array hole 103 at metallic plate 101 brushes tin cream, thereby has formed the tin cream array of diameter 1.5mm, spacing 2mm at array hole 103.When crossing reflow ovens, be brushed with the zone of tin cream because being heated, can form the tin ball of diameter 1mm the two cerebral hemispheres shape.When crossing wave-soldering, with the tin ball on the clad metal plate 101, avoid going up again tin with mantle.Thereby can effectively increase the cooling surface area of first copper sheet, saved the tin amount of using simultaneously, and it is very even to go up tin.
Above-mentioned device for the manufacture of the printed circuit radiator structure is by arranging array hole 103 at metallic plate 101, and brushes tin cream at array hole 103.When crossing reflow ovens, tin cream is subjected to thermosetting tin ball.When crossing wave-soldering, with clad metal plate 101, avoid tin on the secondary with mantle, thereby saved the tin amount of using.And at metallic plate 101 array hole 103 is set, make the tin cream brush can form the tin ball uniformly, thereby make that tin is even on the metallic plate 101.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (9)
1. device for the manufacture of the printed circuit board radiating structure, the back side white space of described printed circuit board (PCB) adheres to first copper sheet, and described first copper sheet is offered heat radiation and is strengthened the district; It is characterized in that, comprise be used to being attached to described heat radiation and strengthen metallic plate and the mantle in district;
Described metallic plate is provided with array hole;
Be used for brush in the array hole of described metallic plate and establish tin cream, make that the district was strengthened in the heat radiation that described tin cream is subjected to thermosetting tin ball to be attached to described first copper sheet when described metallic plate placed reflow ovens;
Described mantle is used for coating described metallic plate when described metallic plate carries out wave-soldering.
2. the device for the manufacture of the printed circuit board radiating structure according to claim 1 is characterized in that, described metallic plate is sheetmetal.
3. the device for the manufacture of the printed circuit board radiating structure according to claim 2 is characterized in that, described sheetmetal thickness is 0.1mm-0.3mm.
4. the device for the manufacture of the printed circuit board radiating structure according to claim 3 is characterized in that, described sheetmetal thickness is 0.15mm.
5. the device for the manufacture of the printed circuit board radiating structure according to claim 1 is characterized in that, described metallic plate is second copper sheet.
6. the device for the manufacture of the printed circuit board radiating structure according to claim 5 is characterized in that, the described second copper sheet thickness is 0.1mm-0.3mm.
7. the device for the manufacture of the printed circuit board radiating structure according to claim 1 is characterized in that, the described first copper sheet back side is removed surperficial green oil and formed described heat radiation reinforcement district.
8. the device for the manufacture of the printed circuit board radiating structure according to claim 5 is characterized in that, the described second copper sheet thickness is 0.15mm.
9. the device for the manufacture of the printed circuit board radiating structure according to claim 1 is characterized in that, described array hole is the circular array hole, and the circular port diameter in the described circular array hole is 1.5mm, and spacing is 2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220694703 CN203120303U (en) | 2012-12-14 | 2012-12-14 | Apparatus used for manufacturing heat dissipation structure of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220694703 CN203120303U (en) | 2012-12-14 | 2012-12-14 | Apparatus used for manufacturing heat dissipation structure of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203120303U true CN203120303U (en) | 2013-08-07 |
Family
ID=48900609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220694703 Expired - Lifetime CN203120303U (en) | 2012-12-14 | 2012-12-14 | Apparatus used for manufacturing heat dissipation structure of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203120303U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104333971A (en) * | 2014-10-14 | 2015-02-04 | 深圳市华星光电技术有限公司 | Printed circuit board and display device |
| CN104754856A (en) * | 2013-12-30 | 2015-07-01 | 深圳市共进电子股份有限公司 | Method for arranging solder ball on printed circuit board |
| CN107498128A (en) * | 2017-09-01 | 2017-12-22 | 安徽华东光电技术研究所 | For covering the manufacture craft of tin copper sheet during Microwave Measurement And Adjustment |
-
2012
- 2012-12-14 CN CN 201220694703 patent/CN203120303U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104754856A (en) * | 2013-12-30 | 2015-07-01 | 深圳市共进电子股份有限公司 | Method for arranging solder ball on printed circuit board |
| CN104754856B (en) * | 2013-12-30 | 2018-05-01 | 深圳市共进电子股份有限公司 | The method that tin ball is set on a printed circuit |
| CN104333971A (en) * | 2014-10-14 | 2015-02-04 | 深圳市华星光电技术有限公司 | Printed circuit board and display device |
| WO2016058190A1 (en) * | 2014-10-14 | 2016-04-21 | 深圳市华星光电技术有限公司 | Printed circuit board and display apparatus |
| CN107498128A (en) * | 2017-09-01 | 2017-12-22 | 安徽华东光电技术研究所 | For covering the manufacture craft of tin copper sheet during Microwave Measurement And Adjustment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI479966B (en) | Printed circuit board having heat gathering structures and process for making the same | |
| US20130298396A1 (en) | Method of making a heat radiating structure for high-power led | |
| CN102164455B (en) | Process for assembling radio frequency power amplifier circuit board | |
| US11264163B2 (en) | Method of manufacturing winding-type coil component | |
| CN203120303U (en) | Apparatus used for manufacturing heat dissipation structure of printed circuit board | |
| CN102387671B (en) | Manufacturing method for single face windowing hole plugging of tin spayed plate | |
| CN102065646B (en) | Surface mount technology of ratio frequency power amplification mainboard | |
| CN203590670U (en) | Heat radiation structure of radio frequency power amplifier | |
| CN203722987U (en) | Simple heat radiation structure of multiple power devices | |
| CN205789927U (en) | Reduce the power supply chip encapsulating structure of heat radiation interference | |
| US8420948B2 (en) | Printed circuit board | |
| CN202587579U (en) | Welding type printed circuit board (PCB) | |
| US20120018199A1 (en) | Printed circuit board | |
| CN203788546U (en) | Heat dissipating PCB | |
| CN201869440U (en) | Heat dissipation bonding pad | |
| CN204518212U (en) | The pcb board of current carrying capacity can be increased | |
| CN210042368U (en) | High heat conduction circuit board | |
| US20110094787A1 (en) | Printed circuit board and manufacturing method thereof | |
| KR20110037522A (en) | Pad printing internal antenna and manufacturing method thereof | |
| US20120187111A1 (en) | Method for soldering electronic components to a circuit board by means of high-frequency soldering | |
| CN221306176U (en) | PCBA miniature heat radiation structure | |
| CN206389603U (en) | A kind of durable type pcb board | |
| CN203057680U (en) | Low heat-dissipation circuit board of double welding structures | |
| CN210257528U (en) | High-voltage-resistant high-thermal-conductivity aluminum-based copper-clad plate | |
| CN202841681U (en) | Printed circuit board (PCB) possessing heat dissipation function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130807 |
|
| CX01 | Expiry of patent term |