CN205789927U - Reduce the power supply chip encapsulating structure of heat radiation interference - Google Patents
Reduce the power supply chip encapsulating structure of heat radiation interference Download PDFInfo
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- CN205789927U CN205789927U CN201620405350.0U CN201620405350U CN205789927U CN 205789927 U CN205789927 U CN 205789927U CN 201620405350 U CN201620405350 U CN 201620405350U CN 205789927 U CN205789927 U CN 205789927U
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- power supply
- supply chip
- heat radiation
- encapsulating structure
- radiation interference
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Abstract
This utility model provides a kind of power supply chip encapsulating structure reducing heat radiation interference, comprising: power supply chip；Encapsulation welding tray, described power supply chip on a printed circuit, is pasted on a printed circuit by its printing；Described encapsulation welding tray includes the big pad of central authorities, and the big pad of described central authorities offers multiple through hole；And fin, its welding on the printed circuit board and is close to the setting of described power supply chip.The encapsulation welding tray that printed circuit board (PCB) pastes power supply chip offers multiple through hole, and be sticked fin in the surrounding of power supply chip, utilize through hole and fin to be distributed by the heat of power supply chip simultaneously, thus the problem efficiently solving the heat radiation interference of power supply chip.
Description
Technical field
This utility model belongs to encapsulated circuit field, particularly to a kind of power supply chip encapsulating structure reducing heat radiation interference.
Background technology
Power supply chip is the necessary devices of most electronic equipment.Power supply chip needs to provide voltage to each road modular circuit; power supply chip can produce substantial amounts of heat, if it is bad to dispel the heat, hot environment can make to produce between each modular circuit being connected on power supply chip electromagnetic interference; each modular circuit signal frequency reduces; thus various problem occurs, such as, electronic equipment there will be the picture time-out that display screen shows; electronic equipment cannot wake up up; the problem such as constantly restart, especially when unprotected circuit in electronic equipment, it is also possible to damage circuit power chip.So how improve the effect of power supply chip heat radiation, particularly significant for electronic product.
At present, people are usually taken increase pcb board area, thus increase area of dissipation, solve the heat dissipation problem of power supply chip；Or, use the power supply chip of low-power consumption in the electronic device, the heat produced during to reduce power supply chip work.Above two method can not fundamentally solve the heat dissipation problem of power supply chip, increases the area of pcb board, and not only radiating effect is limited, but also increases production cost；And use the power supply chip of low-power consumption, although can reduce the generation of heat, the power supply chip of low-power consumption can not meet the job demand of electronic equipment.
Therefore, the most more effectively, the more economical heat radiation reducing power supply chip is disturbed, and is technical problem urgently to be resolved hurrily.
Utility model content
In order to solve the problems referred to above, this utility model has designed and developed a kind of power supply chip encapsulating structure reducing heat radiation interference, it is pasted at printed circuit board (PCB) and offers multiple through hole on the encapsulation welding tray of power supply chip, utilize through hole to be dispersed on the Copper Foil of printed circuit board (PCB) by the heat that power supply chip produces, by Copper Foil, heat quick heat radiating is being gone out；Meanwhile, be sticked on power supply chip fin, and the heat of power supply chip passes to fin, and heat spreader is gone out by recycling fin, it is achieved gone out by the heat Quick diffusing of power supply chip, reduces the effect of power supply chip heat radiation interference.
This utility model provides a kind of power supply chip encapsulating structure reducing heat radiation interference, comprising:
Power supply chip；
Encapsulation welding tray, described power supply chip on a printed circuit, is pasted on a printed circuit by its printing；Described encapsulation welding tray includes the big pad of central authorities, and the big pad of described central authorities offers multiple through hole；
And fin, its welding on the printed circuit board and is close to the setting of described power supply chip.This utility model its paste on a printed circuit and offer multiple through hole on the big pad of central authorities of power supply chip, and, weld fin on a printed circuit, and fin is sticked on power supply chip, so, utilize through hole that the heat that power supply chip produces distributes the copper foil layer to printed circuit board surface, and utilize the fin being sticked on power supply chip to transmit and dispel the heat heat, thus rapidly the heat that power supply chip produces is distributed, reduce the heat radiation interference of power supply chip.
Wherein in an embodiment, in the described power supply chip encapsulating structure reducing heat radiation interference, described through hole is arranged in matrix on the big pad of described central authorities.Through hole is uniformly arranged on the big pad of central authorities so that through hole corresponds on power supply chip equably, can be distributed to the Copper Foil on printed circuit board (PCB) top layer by the even heat on power supply chip, quick heat radiating.
Wherein in an embodiment, in the described power supply chip encapsulating structure reducing heat radiation interference, the distance values of the described through hole that each two is adjacent is 1mm.Keeping 1mm spacing between two adjacent through holes, the heat can avoided between two adjacent through-holes in horizontal direction transmits, and beneficially heat is transferred to the copper foil layer of printed circuit board surface vertically by through hole.
Wherein in an embodiment, in the described power supply chip encapsulating structure reducing heat radiation interference, each described through hole is circulus；
A diameter of 0.5mm of the cylindrical of described circulus, a diameter of 0.25mm of inner circle.Through hole is arranged to loop configuration, it is to avoid heat carries out the circulation on circumferencial direction in through-holes, improves radiating rate and radiating effect.
Wherein in an embodiment, in the described power supply chip encapsulating structure reducing heat radiation interference, described fin arranges multiple connection pin；
Described connection pin is welded on described encapsulation welding tray.Utilize connection pin fin and encapsulation welding tray to be linked into an integrated entity, and connection pin is connected to the ground on pin, after fin absorbs heat, by connecting pin, heat can be distributed from ground pin；Meanwhile, the radiation produced in power supply chip work process, it is also possible to pin spreads out from ground.The most both can improve the radiating efficiency of power supply chip, the power supply chip electromagnetic interference to other modular circuits can have been reduced again.
Wherein in an embodiment, in the described power supply chip encapsulating structure reducing heat radiation interference, the one-tenth-value thickness 1/10 of each described connection pin is 0.6mm, and described connection pin is higher than described power supply chip 0.5mm to 1mm.
The height value connecting pin of fin sets according to the height value of different electrical power chip, such as, when the height value of power supply chip is 1.7mm, the height value connecting pin can be set to 2.3mm, in addition, the one-tenth-value thickness 1/10 connecting pin is set to 0.6mm, has the most both guaranteed the stability of fin, radiating effect will not have been affected because connection pin is the thickest again.
Wherein in an embodiment, in the described power supply chip encapsulating structure reducing heat radiation interference, the distance value of two adjacent described connection pins is 3.57mm or 2.86mm.Adjacent connects the spacing keeping 3.57mm or 2.86mm between pin, to avoid the generation of short circuit phenomenon in power supply chip encapsulating structure.
The beneficial effects of the utility model are:
1, in the described power supply chip encapsulating structure reducing heat radiation interference, the encapsulation welding tray that printed circuit board (PCB) pastes power supply chip offers multiple through hole, and the fin that is sticked on power supply chip, utilize through hole and fin to be distributed by the heat of power supply chip simultaneously, thus the problem efficiently solving the heat radiation interference of power supply chip.
2, in the described power supply chip encapsulating structure reducing heat radiation interference, offering multiple through hole, meanwhile, arrange fin, simple in construction on power supply chip on the encapsulation welding tray pasting power supply chip, production cost is low.
3, in the described power supply chip encapsulating structure reducing heat radiation interference, power supply chip arranges fin, so can play the effect of heat radiation, the power supply chip electromagnetic interference to other circuit modules can be reduced again.
Accompanying drawing explanation
Fig. 1 is the power supply chip encapsulating structure reducing heat radiation interference described in one of them embodiment of this utility model；
Fig. 2 is the power supply chip encapsulating structure reducing heat radiation interference described in one of them embodiment of this utility model；
Fig. 3 is the power supply chip encapsulating structure reducing heat radiation interference described in one of them embodiment of this utility model；
Fig. 4 is the structure of fin in the power supply chip encapsulating structure reducing heat radiation interference described in one of them embodiment of this utility model.
Detailed description of the invention
Below in conjunction with the accompanying drawings this utility model is described in further detail, to make those skilled in the art can implement according to this with reference to description word.
As depicted in figs. 1 and 2, a kind of power supply chip encapsulating structure reducing heat radiation interference described in one of them embodiment of this utility model, comprising:
Power supply chip 1；
Encapsulation welding tray 2, it is printed on printed circuit board (PCB) 3, is pasted onto on printed circuit board (PCB) 3 by described power supply chip 1；Described encapsulation welding tray 2 includes the big pad 200 of central authorities, and the big pad of described central authorities 200 is offered multiple through hole 201；
And fin 4, it is welded on described printed circuit board (PCB) 3 and is close to described power supply chip 1 and arranges.
In such scheme, described through hole 201 is arranged in matrix on the big pad of described central authorities 200, and the distance values of the adjacent described through hole 201 of each two is 1mm.
As shown in figures 1 and 3, a kind of power supply chip encapsulating structure reducing heat radiation interference described in one of them embodiment of this utility model,
Power supply chip 1；
Encapsulation welding tray 2, it is printed on printed circuit board (PCB) 3, is pasted onto on printed circuit board (PCB) 3 by described power supply chip 1；Described encapsulation welding tray 2 includes the big pad 200 of central authorities, and the big pad of described central authorities 200 is offered multiple through hole 201；
And fin 4, it is welded on described printed circuit board (PCB) 3 and is close to described power supply chip 1 and arranges.
In such scheme, each described through hole 201 is circulus, a diameter of 0.5mm of the cylindrical of described circulus, a diameter of 0.25mm of inner circle；Described through hole 201 is arranged in matrix on the big pad of described central authorities 200, and the distance values of the adjacent described through hole 201 of each two is 1mm.
As shown in Figure 4, the heat radiating fin structure in a kind of power supply chip encapsulating structure reducing heat radiation interference described in one of them embodiment of this utility model, comprising:
Fin 4, it is welded on described printed circuit board (PCB) 3 and is close to the surrounding of described power supply chip 1.Fin 4 uses the metal material that heat radiation is good, as used the metal material such as copper, aluminum.
Multiple connection pin 400 is set on described fin；Described connection pin 400 is welded on described encapsulation welding tray 2.
Wherein, the one-tenth-value thickness 1/10 of each described connection pin 400 is 0.6mm, and described connection pin is higher than described power supply chip 0.5mm to 1mm；The distance value of two adjacent described connection pins 400 is 3.57mm or 2.86mm.
Although embodiment of the present utility model is disclosed as above, but it is not restricted in description and embodiment listed utilization, it can be applied to various applicable field of the present utility model completely, for those skilled in the art, it is easily achieved other amendment, therefore, under the general concept limited without departing substantially from claim and equivalency range, this utility model is not limited to specific details and shown here as the legend with description.
Claims (7)
1. the power supply chip encapsulating structure reducing heat radiation interference, it is characterised in that including:
Power supply chip；
Encapsulation welding tray, described power supply chip on a printed circuit, is pasted onto printed circuit board (PCB) by its printing
On；Described encapsulation welding tray includes the big pad of central authorities, and the big pad of described central authorities offers multiple through hole；
And fin, its welding on the printed circuit board and is close to the setting of described power supply chip.
2. the power supply chip encapsulating structure reducing heat radiation interference as claimed in claim 1, it is characterised in that
Described through hole is arranged in matrix on the big pad of described central authorities.
3. the power supply chip encapsulating structure reducing heat radiation interference as claimed in claim 2, it is characterised in that
The distance values of the described through hole that each two is adjacent is 1mm.
4. the power supply chip encapsulating structure reducing heat radiation interference as claimed in claim 3, it is characterised in that
Each described through hole is circulus；
A diameter of 0.5mm of the cylindrical of described circulus, a diameter of 0.25mm of inner circle.
5. the power supply chip encapsulating structure reducing heat radiation interference as claimed in claim 4, it is characterised in that
Multiple connection pin is set on described fin；
Described connection pin is welded on described encapsulation welding tray.
6. the power supply chip encapsulating structure reducing heat radiation interference as claimed in claim 5, it is characterised in that
The one-tenth-value thickness 1/10 of each described connection pin is 0.6mm, and described connection pin is higher than described power supply chip 0.5
Mm to 1mm.
7. the power supply chip encapsulating structure reducing heat radiation interference as claimed in claim 6, it is characterised in that
The distance value of two adjacent described connection pins is 3.57mm or 2.86mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620405350.0U CN205789927U (en) | 2016-05-06 | 2016-05-06 | Reduce the power supply chip encapsulating structure of heat radiation interference |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620405350.0U CN205789927U (en) | 2016-05-06 | 2016-05-06 | Reduce the power supply chip encapsulating structure of heat radiation interference |
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| Publication Number | Publication Date |
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| CN205789927U true CN205789927U (en) | 2016-12-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201620405350.0U Active CN205789927U (en) | 2016-05-06 | 2016-05-06 | Reduce the power supply chip encapsulating structure of heat radiation interference |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108112169A (en) * | 2018-01-31 | 2018-06-01 | 深圳市德彩光电有限公司 | A kind of circuit board radiating device for IC chip |
| CN112533450A (en) * | 2020-12-01 | 2021-03-19 | 苏州浪潮智能科技有限公司 | Power supply conversion device for printed circuit board |
-
2016
- 2016-05-06 CN CN201620405350.0U patent/CN205789927U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108112169A (en) * | 2018-01-31 | 2018-06-01 | 深圳市德彩光电有限公司 | A kind of circuit board radiating device for IC chip |
| CN112533450A (en) * | 2020-12-01 | 2021-03-19 | 苏州浪潮智能科技有限公司 | Power supply conversion device for printed circuit board |
| CN112533450B (en) * | 2020-12-01 | 2022-06-14 | 苏州浪潮智能科技有限公司 | Power supply conversion device for printed circuit board |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 16, cuixing Road, Hui Xing street, Yubei District, Chongqing Patentee after: Chongqing Lanan Technology Co.,Ltd. Address before: No. 13-2, Jiangying Road, Nanan District, Chongqing, Chongqing Patentee before: CHONGQING BLUEBANK COMMUNICATION TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address |