CN205071462U - Multilayer circuit board heat conduction radiation structure - Google Patents
Multilayer circuit board heat conduction radiation structure Download PDFInfo
- Publication number
- CN205071462U CN205071462U CN201520908384.7U CN201520908384U CN205071462U CN 205071462 U CN205071462 U CN 205071462U CN 201520908384 U CN201520908384 U CN 201520908384U CN 205071462 U CN205071462 U CN 205071462U
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- CN
- China
- Prior art keywords
- circuit board
- heat
- radiating fin
- heat radiation
- heat dissipation
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- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to a multilayer circuit board heat conduction radiation structure, which comprises a circuit board body, circuit edition of books body upper surface is equipped with a plurality of electron chip, the circuit edition of books body is kept away from and is equipped with thermal adhesive layer on the lateral wall of electron chip one side, thermal adhesive layer contacts with the layer of dispelling the heat, it is the patch that dispels the heat to be equipped with on the one side of heat dissipation layer, the heat dissipation patch is wavyly, be equipped with a plurality of radiating fin between the heat dissipation patch, heat dissipation patch, a radiating fin are connected with the heat dissipation stratum reticulare respectively, be equipped with the 2nd radiating fin of a plurality of on the circuit edition of books body. The utility model discloses can realize effectual heat dissipation under thermal adhesive layer, heat dissipation layer, heat dissipation patch, a radiating fin and the 2nd radiating fin's combined action, improve the radiating rate, be favorable to electronic component's heat to distribute, increase of service life.
Description
Technical field
The utility model relates to electronic technology field, particularly relates to a kind of multilayer circuit board heat conduction and heat radiation structure.
Background technology
Printed circuit board, also known as printed circuit board (PCB), is the supplier of electronic devices and components electrical connection.Its development has the history of more than 100 year; Its design mainly layout design; Adopt the major advantage of circuit board to be the mistake greatly reducing wiring and assembling, improve the gentle productive labor rate of Automated water.Single sided board, double sided board, four laminates, six laminates and other multilayer circuit boards can be divided into according to the wiring board number of plies.
Due to printed circuit board (PCB) not general end product, therefore slightly chaotic in the definition of title, such as: the motherboard of PC, be called mainboard, and directly can not be called circuit board, although it is not there is the existence of circuit board in motherboard, identical, relevant but not talkative identical both therefore during assessment industry.Again for example: because there is integrated circuit part to load on circuit boards, thus news media claim him to be IC plate, but he is not also equal to printed circuit board (PCB) in fact.The printed circuit board (PCB) that we usually say refers to the circuit board of bare board-namely do not go up components and parts.
Therefore current traditional circuit-board there is no any radiator structure, so that electronic building brick can produce high heat in the course of the work, the time has been grown and has easily caused the overheated of electronic building brick, causes the life-span of electronic building brick short.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of multilayer circuit board heat conduction and heat radiation structure.
The utility model is achieved through the following technical solutions:
A kind of multilayer circuit board heat conduction and heat radiation structure, comprise circuit board body, described circuit board body upper surface is provided with several electronic chips, described circuit board body is provided with heat conduction glue-line away from electronic chip side sidewall, described heat conduction glue-line contacts with heat dissipating layer, it is heat radiation knee-piece that described heat dissipating layer side is provided with, described heat radiation knee-piece is wavy, several first radiating fins are provided with between described heat radiation knee-piece, described heat radiation knee-piece, the first radiating fin are connected with heat radiation stratum reticulare respectively, and described circuit board body is provided with several the second radiating fins.
As optimal technical scheme of the present utility model, described heat conduction glue-line with between heat dissipating layer for being fixedly connected with.
As optimal technical scheme of the present utility model, described first radiating fin, the second radiating fin are that aluminium flake or copper sheet are made.
As optimal technical scheme of the present utility model, be fixedly connected with between described heat radiation knee-piece, the first radiating fin with heat radiation stratum reticulare.
Compared with prior art, the beneficial effects of the utility model are: the utility model structure is simple, reasonable in design, the utility model is by arranging heat conduction glue-line, heat dissipating layer, heat radiation knee-piece, the first radiating fin and the second radiating fin, effective heat radiation can be realized like this under the acting in conjunction of heat conduction glue-line, heat dissipating layer, heat radiation knee-piece, the first radiating fin and the second radiating fin, improve radiating rate, the heat being conducive to electronic building brick distributes, and increases the service life.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure: 1. circuit board body; 2. electronic chip; 3. heat conduction glue-line; 4. heat dissipating layer; 5. dispel the heat knee-piece; 6. the first radiating fin; 7. dispel the heat stratum reticulare; 8. the second radiating fin.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1, Fig. 1 is structural representation of the present utility model.
A kind of multilayer circuit board heat conduction and heat radiation structure, comprise circuit board body 1, described circuit board body 1 upper surface is provided with several electronic chips 2, described circuit board body 1 is provided with heat conduction glue-line 3 away from electronic chip 2 side sidewall, described heat conduction glue-line 3 contacts with heat dissipating layer 4, wherein said heat conduction glue-line 3 with between heat dissipating layer 4 for being fixedly connected with, be convenient to the connection between heat conduction glue-line 3 and heat dissipating layer 4 like this.It is heat radiation knee-piece 5 that described heat dissipating layer 4 side is provided with, described heat radiation knee-piece 5 is in wavy, several first radiating fins 6 are provided with between described heat radiation knee-piece 5, described heat radiation knee-piece 5, first radiating fin 6 is connected with heat radiation stratum reticulare 7 respectively, is fixedly connected with between wherein said heat radiation knee-piece 5, first radiating fin 6 with heat radiation stratum reticulare 7.
Described circuit board body 1 is provided with several the second radiating fins 8, and wherein said first radiating fin 6, second radiating fin 8 is made for aluminium flake or copper sheet.Can realize effective heat radiation like this under the acting in conjunction of heat conduction glue-line 3, heat dissipating layer 4, heat radiation knee-piece 5, first radiating fin 6 and the second radiating fin 8, improve radiating rate, the heat being conducive to electronic building brick distributes, and increases the service life.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (4)
1. a multilayer circuit board heat conduction and heat radiation structure, comprise circuit board body (1), described circuit board body (1) upper surface is provided with several electronic chips (2), it is characterized in that: described circuit board body (1) is provided with heat conduction glue-line (3) away from electronic chip (2) side sidewall, described heat conduction glue-line (3) contacts with heat dissipating layer (4), it is heat radiation knee-piece (5) that described heat dissipating layer (4) side is provided with, described heat radiation knee-piece (5) is in wavy, several first radiating fins (6) are provided with between described heat radiation knee-piece (5), described heat radiation knee-piece (5), first radiating fin (6) is connected with heat radiation stratum reticulare (7) respectively, described circuit board body (1) is provided with several the second radiating fins (8).
2. multilayer circuit board heat conduction and heat radiation structure according to claim 1, is characterized in that: described heat conduction glue-line (3) with between heat dissipating layer (4) for being fixedly connected with.
3. multilayer circuit board heat conduction and heat radiation structure according to claim 1, is characterized in that: described first radiating fin (6), the second radiating fin (8) are made for aluminium flake or copper sheet.
4. multilayer circuit board heat conduction and heat radiation structure according to claim 1, is characterized in that: described heat radiation knee-piece (5), be fixedly connected with between the first radiating fin (6) and heat radiation stratum reticulare (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520908384.7U CN205071462U (en) | 2015-11-13 | 2015-11-13 | Multilayer circuit board heat conduction radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520908384.7U CN205071462U (en) | 2015-11-13 | 2015-11-13 | Multilayer circuit board heat conduction radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205071462U true CN205071462U (en) | 2016-03-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520908384.7U Expired - Fee Related CN205071462U (en) | 2015-11-13 | 2015-11-13 | Multilayer circuit board heat conduction radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205071462U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105977888A (en) * | 2016-06-25 | 2016-09-28 | 江苏万威电气有限公司 | Efficient heat-dissipation type bus duct |
| CN106714442A (en) * | 2015-11-13 | 2017-05-24 | 建业科技电子（惠州）有限公司 | Multilayer circuit board heat radiating structure |
| CN108847450A (en) * | 2018-06-12 | 2018-11-20 | 武汉华星光电半导体显示技术有限公司 | A kind of substrate of Organic Light Emitting Diode and preparation method thereof |
| CN108882510A (en) * | 2018-08-27 | 2018-11-23 | 陈赵军 | The Multi-layer circuit board structure of height heat dissipation |
-
2015
- 2015-11-13 CN CN201520908384.7U patent/CN205071462U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714442A (en) * | 2015-11-13 | 2017-05-24 | 建业科技电子（惠州）有限公司 | Multilayer circuit board heat radiating structure |
| CN105977888A (en) * | 2016-06-25 | 2016-09-28 | 江苏万威电气有限公司 | Efficient heat-dissipation type bus duct |
| CN108847450A (en) * | 2018-06-12 | 2018-11-20 | 武汉华星光电半导体显示技术有限公司 | A kind of substrate of Organic Light Emitting Diode and preparation method thereof |
| CN108882510A (en) * | 2018-08-27 | 2018-11-23 | 陈赵军 | The Multi-layer circuit board structure of height heat dissipation |
| CN108882510B (en) * | 2018-08-27 | 2021-12-21 | 深圳华秋电子有限公司 | High-heat-dissipation multilayer circuit board structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160302 Termination date: 20211113 |