CN109588023B

CN109588023B - Heat dissipation structure and related equipment

Info

Publication number: CN109588023B
Application number: CN201811649344.XA
Authority: CN
Inventors: 赵伟星; 向志强; 李彬; 何明敬; 韩君伟
Original assignee: Xian Huawei Technologies Co Ltd
Current assignee: Xian Huawei Technologies Co Ltd
Priority date: 2018-12-30
Filing date: 2018-12-30
Publication date: 2020-10-09
Anticipated expiration: 2038-12-30
Also published as: CN109588023A

Abstract

The embodiment of the application discloses heat radiation structure and relevant equipment, the horizontal frame of support frame comprises two at least frames, two at least frames are around forming the opening, when there is the heat-conducting medium between heating element and the radiator, because heating element is located the opening, then can realize fixing the support frame earlier, carry out the reflow soldering back together with the load board, rethread opening installation heat-conducting medium and radiator, the heat-conducting medium has been avoided passing through reflow soldering, thereby a heat radiation structure that can adapt to reflow soldering is provided. The heat dissipation structure comprises a support frame and a heat radiator; the support frame contains horizontal load and vertical load, and horizontal load comprises two at least frames, and two at least frames are around forming the opening, and horizontal load is fixed in on the circuit board through vertical load for heating element is located the opening, and on the radiator was fixed in horizontal load, be connected with heating element heat conduction through the opening.

Description

Heat dissipation structure and related equipment

Technical Field

The present application relates to the field of electronic technology, and in particular, to a heat dissipation structure and related devices.

Background

A Board Mounted Power (BMP) has advantages of small size, unified size and interface, and the like, so the BMP is widely applied to load boards of various circuit board assemblies requiring power conversion. As shown in fig. 1, naked BMP contains pin and circuit board main part, installs electronic component in the circuit board main part, because part electron original paper in the BMP is along with the promotion of power, the heat that gives off is more, in order to make the BMP can be applied to high-power scene, need dispel the heat to naked BMP's electronic component, it is specific, it has the heat-conducting glue to cover on naked BMP's electron original paper, it has the plane base plate still to cover on the heat-conducting glue, form and take base plate BMP, thereby encapsulate the heat-conducting glue between plane base plate and circuit board main part. And then install the radiator on the radiating basal plate to realize the heat dissipation to the electron original paper of BMP.

The BMP with the base plate is usually welded on the load plate by wave soldering, specifically, the BMP with the base plate is formed after the heat conducting glue and the base plate are installed on the bare BMP, and the BMP with the base plate and the load plate are welded together in a wave soldering furnace, so that the pins of the BMP with the base plate are welded on the load plate at high temperature in the tin soldering furnace. Because manual repair welding is needed after wave soldering, the quality consistency is poor, and along with the continuous development of the manufacturing industry towards the intelligent direction, reflow soldering is used as one of intelligent manufacturing technologies for load board welding, and wave soldering is gradually replaced. However, the reflow soldering temperature is higher than that of wave soldering, and the heat conducting glue in the BMP with the substrate provided by the prior art cannot adapt to the high temperature during reflow soldering, so that the BMP with the substrate provided by the prior art cannot be applied to reflow soldering generation, full reflow cannot be realized in the processing procedure of the circuit board assembly, and the wave soldering procedure is required to be reserved, which results in low automation degree of the manufacturing procedure of the circuit board assembly and high manufacturing cost.

In order to solve the above problems, the prior art proposes a scheme of performing reflow soldering on a bare BMP and a load board together, and then mounting a planar substrate, specifically, one scheme is to increase the size of the planar substrate, and fix the planar substrate on the load board directly, but increase the area of the whole BMP, reduce the space utilization rate of the load board, and increase the manufacturing cost; the other method is to use 120-degree high-temperature curing glue to bond the planar substrate to the bare brick BMP, but because the BMP is fixed on the load plate, the BMP and the load plate need to be put into a high-temperature box together for curing for 40 minutes, and because the area of the load plate is large, the production efficiency is low and the manufacturing cost is high.

To sum up, it is easy to see that because the BMP that prior art provided can not adapt to reflow soldering, improved manufacturing cost, adopt different solution after, or reduced the space utilization of load board, or the production process is more complicated, consequently, a novel heat radiation structure that can adapt to reflow soldering is urgent to be released.

Disclosure of Invention

The application provides a heat radiation structure, circuit board assembly's processing method and relevant equipment, because the horizontal frame of support frame comprises two at least frames, two at least frames are around forming the opening, heating element is located the opening, thereby can realize still being in naked state heating element after will being fixed in on the circuit board, when there is heat-conducting medium between heating element and the radiator, then can realize fixing the support frame in on the circuit board earlier, carry out reflow soldering with the load board together after, install heat-conducting medium and radiator again, the heat-conducting medium has been avoided crossing reflow soldering, thereby the heat radiation structure that can adapt to reflow soldering is provided, aforementioned heat radiation structure can be applicable to in the electronic parts including BMP.

In a first aspect, an embodiment of the present application provides a heat dissipation structure. The heat dissipation structure is used for dissipating heat of a heating element mounted on the circuit board, and comprises a support frame and a heat radiator, wherein the support frame comprises a horizontal load and a vertical load, the horizontal load is composed of at least two side frames, the at least two side frames surround to form an opening part, and the horizontal load is fixed on the circuit board through the vertical load, so that the heating element is positioned in the opening part; the radiator is fixed on the horizontal load and is connected with the heating element through the opening part in a heat conduction mode.

In the application, the support frame contained in the heat dissipation structure contains a horizontal load and a vertical load, and the horizontal frame of the support frame consists of at least two frames which surround to form an opening part, so that the heating element is still in an exposed state after being fixed on the circuit board; the support frame is opposite to the plane substrate, so that the substrate material is saved, and the manufacturing cost is saved; in addition, the heat dissipation structure provided by the scheme is not only suitable for the BMP, but also can be applied to other electronic components comprising heating elements, so as to accelerate the intelligent development process of the manufacturing industry.

In a possible implementation manner of the first aspect, the horizontal load may be composed of three frames, and a frame shape formed by at least two frames composing the horizontal load may be a C shape; or the horizontal load can be formed by four frames, and the frame formed by at least two frames forming the horizontal load can be in a square shape; the horizontal load can also be formed by five frames, and the shape of the frame formed by at least two frames forming the horizontal load can be a Chinese character 'ri'.

In this application, three kinds of frame shapes that two at least frames that provide the horizontal load formed are C font, mouth font and day font respectively, and simple easy the realization has improved the realizability of this scheme, and has provided the different scheme of waiting to select, is favorable to the user to select in aforementioned three kinds of shapes according to the product needs of reality, has richened the application scene of this scheme.

In a possible implementation manner of the first aspect, the inner surface of the heat sink may include a first portion and a second portion, where the first portion is a portion of the inner surface of the heat sink, which is in contact with the horizontal load, and the second portion is a portion of the inner surface of the heat sink, which is not in contact with the horizontal load, and the second portion may have at least one protrusion, and the at least one protrusion is received in the opening portion.

In the application, the inner surface of the radiator is provided with at least one bulge, when a heat-conducting medium exists between the radiator and the heating element, the thickness of the heat-conducting medium can be relatively reduced, and the manufacturing cost of the heat-conducting medium is relatively high, so that the use of the heat-conducting medium is reduced, and the manufacturing cost is reduced; the heat conduction performance of the radiator is far higher than that of the heat conduction medium, so that the heat radiation performance of the whole electronic assembly can be improved by reducing the use of the heat conduction medium; when no heat-conducting medium exists between the radiator and the heating element, the at least one protrusion can also shorten the distance between the inner surface of the radiator and the heating element in the vertical direction, so that the radiating performance of the radiator is improved.

In a possible implementation manner of the first aspect, the heat sink may further include a heat conducting medium, the heat conducting medium is located between the heat generating element and the heat sink, and specifically, the heat conducting medium may cover the heat generating element and contact with a lower surface of the heat sink.

In the application, the heat-conducting medium is arranged between the radiator and the heating element, and can conduct heat emitted by the heating element to the radiator, so that the heat radiation performance diagram of the heat radiation structure is improved, and the direct contact between the radiator and the heating element is avoided; in addition, the heat transfer medium can also play a role in tolerance absorption.

In one possible implementation of the first aspect, the connection between the heat sink and the horizontal load comprises at least one of a threaded connection or an adhesive connection.

In this application, provide two kinds of connected modes between radiator and the support frame, and no matter be threaded connection or adhesive connection all easy operation and easily realize, improved the realizability of this scheme.

In one possible implementation manner of the first aspect, the vertical load may be a pin, so that the supporting frame may be fixedly connected with the circuit board through the pin.

In this application, the support frame passes through the second pin and welds on the circuit board to guarantee the stability of support frame, and then guaranteed whole electronic component's stability.

In one possible implementation manner of the first aspect, the vertical load is a vertical metal plate, and the support frame is connected with the circuit board through the vertical metal plate in a welding manner; or the vertical load is a vertical metal plate, and the support frame is connected with the circuit board through the vertical metal plate by an adhesive; or the vertical load is a bolt, and the support frame is in threaded connection with the circuit board through the bolt.

In this application, still provide and be fixed in the multiple implementation on the frame position of circuit board with vertical load, improved the realizability and the flexibility of this scheme.

In a second aspect, an embodiment of the present application provides an electronic assembly, where the electronic assembly includes a circuit board, a heating element and a heat dissipation structure mounted on the circuit board, and the heat dissipation structure is used for dissipating heat from the heating element, where the heat dissipation structure includes a support frame and a heat sink;

the support frame comprises a horizontal load and a vertical load, the horizontal load is composed of at least two side frames, the at least two side frames surround to form an opening part, and the horizontal load is fixed on the circuit board through the vertical load so that the heating element is positioned in the opening part;

the radiator is fixed on the horizontal load and is connected with the heating element through the opening part in a heat conduction mode.

In one possible implementation manner of the second aspect, the at least two frames constituting the horizontal load form a frame shape including a C-shape, a square-shape, or a japanese-shape.

In one possible implementation of the second aspect, the inner surface of the heat sink has at least one protrusion, and the at least one protrusion is received in the opening.

In one possible implementation of the second aspect, the heat sink further comprises a heat conducting medium, the heat conducting medium being located between the heat generating element and the heat sink.

In one possible implementation of the second aspect, the connection between the heat sink and the horizontal load comprises at least one of a threaded connection or an adhesive connection.

In a possible implementation manner of the second aspect, the vertical load is a pin, and the support frame is fixedly connected with the circuit board through the pin.

In one possible implementation manner of the second aspect, the vertical load is a vertical metal plate, and the support frame is connected with the circuit board through the vertical metal plate in a welding manner; or the vertical load is a vertical metal plate, and the support frame is connected with the circuit board through the vertical metal plate by an adhesive; or the vertical load is a bolt, and the support frame is in threaded connection with the circuit board through the bolt.

In one possible implementation of the second aspect, the electronic component is a power module.

For specific implementation and beneficial effects of each component included in the electronic component provided by the second aspect of the present application, reference may be made to the first aspect, and details are not repeated here.

A third aspect, the embodiment of the present application provides a communication device, a circuit board assembly is configured in the communication device, the circuit board assembly includes a load board and at least one electronic assembly installed on the load board, the electronic assembly includes a circuit board and a first pin installed on the circuit board, a heating element and a heat dissipation structure, the heat dissipation structure is used for dissipating heat from the heating element, wherein the heat dissipation structure includes a support frame and a heat sink, the electronic assembly is fixedly connected with the load board through the first pin, the support frame includes a horizontal load and a vertical load, the horizontal load is composed of at least two frames, the at least two frames surround to form an opening, the horizontal load is fixed on the circuit board through the vertical load, so that the heating element is located in the opening, the heat sink is fixed on the horizontal load, and is connected with.

In one possible implementation manner of the third aspect, the at least two frames constituting the horizontal load form a frame shape including a C-shape, a square-shape, or a japanese-shape.

In one possible implementation of the third aspect, the inner surface of the heat sink has at least one protrusion, and the at least one protrusion is received in the opening.

In one possible implementation manner of the third aspect, the heat sink further includes a heat conducting medium, and the heat conducting medium is located between the heat generating element and the heat sink.

In one possible implementation of the third aspect, the connection between the heat sink and the horizontal load comprises at least one of a threaded connection or an adhesive connection.

In a possible implementation manner of the third aspect, the vertical load is a second pin, and the support frame is fixedly connected with the circuit board through the second pin.

In a possible implementation manner of the third aspect, the vertical load is a vertical metal plate, and the support frame is connected with the circuit board through the vertical metal plate in a welding manner; or the vertical load is a vertical metal plate, and the support frame is connected with the circuit board through the vertical metal plate by an adhesive; or the vertical load is a bolt, and the support frame is in threaded connection with the circuit board through the bolt.

In one possible implementation of the third aspect, the at least one electronic component includes a power module therein.

For specific implementation and beneficial effects of each component of the electronic component included in the communication device provided by the third aspect of the present application, reference may be made to the first aspect, and details are not repeated here.

In a fourth aspect, an embodiment of the present application provides a method for processing a circuit board assembly, where the circuit board assembly includes a load board and at least one heat dissipation structure, and the heat dissipation structure includes a circuit board, a first pin, a heat-generating element, a support frame, a heat-conducting medium, and a heat sink, where the support frame includes a horizontal load and a vertical load, and the method includes: sequentially mounting the first pin and the heating element on the circuit board; fixing a support frame on the frame part of the circuit board through vertical load, wherein the horizontal load is composed of at least two frames, and the opening part is formed by the at least two frames in a surrounding manner; inserting the first pin into the load board, and carrying out reflow soldering on the circuit board provided with the first pin, the heating element and the support frame along with the load board so as to weld the circuit board on the load board through the first pin; covering the heat-conducting medium on the heating element in the exposed state; the heat sink is fixed to the horizontal load such that the inner surface of the heat sink contacts the heat transfer medium for transferring heat from the heat generating component to the heat sink to form the electronic assembly.

In this application, with first pin, heating element installs on the circuit board in proper order, and after being fixed in the support frame on the frame portion of circuit board, insert first pin in the load board, carry out reflow soldering together with the load board after, because the support frame can contain horizontal load and vertical load, horizontal load comprises two at least frames, horizontal load and vertical load are connected perpendicularly, when the support frame is fixed in on the circuit board, heating element still is in the exposed state, then can cover heat-conducting medium on heating element in the exposed state again, and then install the radiator, heat-conducting medium has been avoided crossing reflow soldering, thereby got rid of the reservation demand to wave-soldering, in order to accelerate the intelligent development process of manufacturing.

In one possible implementation manner of the fourth aspect, the at least two frames constituting the horizontal load form a frame shape including a C shape, a square shape, or a japanese shape.

In one possible implementation manner of the fourth aspect, the inner surface of the heat sink has at least one protrusion, the at least one protrusion is received in the opening, and the at least one protrusion is received in the opening.

In a possible implementation manner of the fourth aspect, the vertical load is a second pin; fix the support frame in the frame position of circuit board through vertical load, include: inserting the second pin into the frame part of the circuit board; the circuit board that will install first pin, heating element and support frame follows the load board and carries out reflow soldering, includes: and carrying out reflow soldering on the circuit board provided with the first pins, the heating element and the support frame and the second pins on the support frame along with the load board so as to enable the support frame to be soldered on the frame part of the circuit board through the second pins.

In this application, can realize that the second pin of support frame passes through reflow soldering's mode and welds on the circuit board to guarantee the stability of support frame, and then guaranteed whole electronic component's stability.

In a possible implementation manner of the fourth aspect, the vertical load is a vertical metal plate, and the support frame is fixed to the frame portion of the circuit board through the vertical load, including: welding a vertical metal plate to a frame part of the circuit board; or the vertical metal plate is bonded to the frame part of the circuit board by using an adhesive.

In a possible implementation manner of the fourth aspect, the vertical load is a bolt, and the support frame is fixed to the frame portion of the circuit board through the vertical load, including: and the support frame is in threaded connection with the frame part of the circuit board by using the bolt.

In one possible implementation manner of the fourth aspect, the fixing the radiator to a horizontal load includes: forming a threaded connection between the radiator and the horizontal load by using a bolt; or an adhesive to bond the heat sink to a horizontal load.

In one possible implementation manner of the fourth aspect, the power module is contained in at least one heat dissipation structure.

For a specific implementation manner of each component of the electronic assembly included in the circuit board assembly provided by the fourth aspect of the present application, reference may be made to the first aspect, and details are not repeated here.

Drawings

Fig. 1 is a schematic structural diagram of a printed board power supply in the prior art provided in an embodiment of the present application;

fig. 2 is a schematic perspective view of an electronic assembly according to an embodiment of the present disclosure;

fig. 3 is a schematic cross-sectional view of an electronic assembly provided by an embodiment of the present application in a vertical direction;

fig. 4 is a schematic cross-sectional view of a circuit board assembly provided in an embodiment of the present application in a vertical direction;

FIG. 5 is a schematic diagram of a subassembly in a heat dissipation structure according to an embodiment of the present disclosure;

FIG. 6 is a schematic diagram of another structure of a central subassembly of a heat dissipation structure provided in an embodiment of the present application;

fig. 7 is a schematic top view of a subassembly in a heat dissipation structure according to an embodiment of the present disclosure;

fig. 8 is another schematic top view of a subassembly in a heat dissipation structure provided in an embodiment of the present application;

fig. 9 is another schematic top view of a subassembly in a heat dissipation structure provided in an embodiment of the present application;

fig. 10 is another perspective view of a heat dissipation structure according to an embodiment of the present application;

fig. 11 is a schematic structural diagram of an inner surface of a heat sink of a heat dissipation structure according to an embodiment of the present application;

fig. 12 is a schematic flowchart of a method for processing a circuit board assembly according to an embodiment of the present disclosure.

Detailed Description

The embodiment of the application provides a heat radiation structure and related equipment, because the horizontal frame of the support frame is composed of at least two frames, and the at least two frames surround to form an opening part, the heating element is still in an exposed state after being fixed on a circuit board, when a heat-conducting medium exists between the heating element and a radiator, the support frame can be fixed on the circuit board firstly, and is subjected to reflow soldering together with a load board, and then the heat-conducting medium and the radiator are installed, so that the heat radiation structure which can adapt to reflow soldering is avoided; the aforementioned heat dissipation structure may be applicable to electronic components including BMP.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the above-described drawings (if any) are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that the embodiments described herein may be practiced otherwise than as specifically illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The present application will be described in further detail below with reference to the attached drawings in the embodiments of the present application. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention.

Referring to fig. 2, fig. 3 and fig. 6, fig. 2 is a schematic perspective view of an electronic component 10 provided in the embodiment of the present application, fig. 3 is a schematic cross-sectional view of the electronic component 10 provided in the embodiment of the present application in a vertical direction, and fig. 6 is a schematic structural view of the electronic component 10 that does not include a heat sink. The electronic assembly 10 may include a circuit board 11, a heat generating component 12 mounted on the circuit board, and a heat dissipation structure 13, and the electronic assembly 10 may further include a first pin 14, and the heat dissipation structure 13 is used for dissipating heat from the heat generating component 12.

Specifically, the heat dissipation structure 13 may include a support bracket 131 and a heat sink 132, and the heat dissipation structure may further include a heat conducting medium 133. The supporting frame 131 comprises a horizontal load 1311 and a vertical load 1312, the horizontal load 1311 is composed of at least two frames, the at least two frames surround and form an opening 13111, the horizontal load 1311 is fixed on the circuit board 11 through the vertical load 1312, so that the heating element is located in the opening 13111, and the heat sink 132 is fixed on the horizontal load 1312 and is in heat conduction connection with the heating element 12 through the opening 13111.

In the embodiment of the present application, the electronic component 10 may be applied to a circuit board assembly, and the circuit board assembly is installed in a communication device, referring to fig. 4, where fig. 4 is a schematic cross-sectional view of the circuit board assembly in a vertical direction according to the embodiment of the present application. The circuit board assembly comprises at least one electronic assembly 10 and a load board 20, wherein the electronic assembly 10 is fixedly connected with the load board 20 of the circuit board assembly through the first pins 14. Specifically, the circuit board assembly may be a core component of the communication device, and includes a load board 20, a plurality of electronic assemblies mounted on the load board 20, and an interface for connecting with other components in the communication device. The circuit board assembly has functions of, but not limited to, providing power, processing data, and enabling information transmission between other components in the communication device, and may be embodied as a motherboard in a computer, a main circuit board in a mobile phone, or a component with a corresponding function in other communication devices.

The load Board 20 is configured to carry and fix a plurality of electronic components, where the electronic components on the load Board 20 include at least one electronic component 10, and specifically, the Board body of the load Board 20 may be a rigid Circuit Board, such as a Printed Circuit Board (PCB), for example, or another type of rigid Circuit Board, which is not limited herein. The heat dissipation structure 13 may be embodied as a power module on a circuit board assembly, or may be a processor module on the circuit board assembly, or other modules including electronic components that generate heat on the circuit board assembly, and it should be understood that in this embodiment and the following embodiments, only the electronic component 10 is taken as an example of the power module for description.

In the embodiment of the present application, the circuit board 11 is a hard circuit board, and specifically, may be a printed circuit board, and may also be other types of hard circuit boards. The specific material of the circuit board 11 may be determined flexibly according to actual conditions, and is not limited herein. More specifically, the cross-sectional shape of the circuit board 11 may be rectangular, polygonal or other shapes, and it should be understood that the cross-sectional shape of the circuit board 11 is only illustrated as rectangular in this embodiment and the following embodiments.

In the embodiment of the present application, the first Pin (Pin), also called a first Pin, refers to a connection wire that is led out from an internal circuit of the circuit board 11 and electrically connected to the load board 20, and the first Pin 14 may be composed of 4 pins, 6 pins, or other number of pins, and all the pins form an interface between the circuit board 11 and the load board 20.

In the embodiment of the present application, referring to fig. 4, first pins 14 are mounted on a circuit board 11, the circuit board 11 is fixed on a load board 20 through the first pins 14, and the first pins 14 are used for supporting the circuit board 11 and various components fixed on the circuit board 11, and are also used for electrically connecting the circuit board 11 and the load board 20. The first pins 14 may be fixed on any two edges of the circuit board 11, and the first pins 14 may also be installed at 4 corners of the circuit board 11, as long as the circuit board 11 can be fixed on the load board 20, where the first pins 14 are located at specific positions on the circuit board 11. And are not limited herein.

Specifically, the process of fixing the first pins 14 on the load board 20 may specifically include mounting the first pins 204 on the load board 20 by using a mounting process, and then soldering the first pins 14 on the load board 20 by using a soldering process, where specifically, the mounting process may be Surface Mount Technology (SMT), or other types of mounting processes; the soldering process may be a reflow soldering process or other more intelligent soldering processes.

In the embodiment of the present application, reflow soldering refers to spreading solder around the first leads 14 after the chip mounting process is completed, heating air or nitrogen to a high enough temperature, and blowing the heated air or nitrogen to the load board 20 to melt the solder around the first leads 14 and then bonding the melted solder to the load board 20. The solder may be a tin-lead solder or a soft solder of other material, and is not limited herein.

In the embodiment of the present application, the heat generating element 12 refers to an electronic component that generates heat when energized. Referring to fig. 5, fig. 5 is a schematic structural diagram of the electronic component 10 without the heat dissipation structure 13 according to the embodiment of the present disclosure. At least one heating element 12 is mounted on the circuit board 11. Wherein, part of the heating element 12 is fixed on the surface of the circuit board 11, and part of the heating element 12 is embedded on the circuit board 11 to form an electrical connection between the heating element 12 and the circuit board 11. In particular, the heating element 12 may be embodied as a resistor, a capacitor, a Metal Oxide Semiconductor (MOS), a magnetic core, or other types of electronic components. It should be understood that the illustration of the fixing position of the heating element 12 on the circuit board 11 in fig. 5 is merely an illustration, and the position of each heating element 12 on the circuit board 11 should be flexibly determined according to the actual situation of the product, and is not limited herein.

Specifically, the process of fixing the heating element 12 on the circuit board 11 may specifically include mounting the heating element 12 on the circuit board 11 by using a surface mount technology (smt), a dual in-line package (DIP) technology or other processes, and then soldering the heating element 12 on the circuit board 11 by using a soldering technology.

In the embodiment of the present application, the supporting frame 131 is used to provide support for the heat sink 132, referring to fig. 3, the supporting frame 131 may include a horizontal load 1311 and a vertical load 1312, referring to fig. 6, the horizontal load 1311 is composed of at least two frames, the at least two frames surround to form an opening 13111, the horizontal load 1311 is fixed on the circuit board 11 through the vertical load 1312, so that the heat generating element is located in the opening 13111, so that after the supporting frame 131 is fixed on the circuit board 11, the heat generating element 12 is still in an exposed state, and thus the heat sink 132 may be in heat conduction connection with the heat generating element 12 through the opening 13111.

In the embodiment of the present application, the heating elements 12 in the exposed state may be all the heating elements 12 in the completely exposed state; or part of the heating elements 12 may be in a completely exposed state, and part of the heating elements 12 may be in a partially exposed state; it is also possible that all the heating elements 12 are partially exposed.

In this embodiment, the horizontal load 1311 of the supporting frame 131 may be composed of at least two frames, specifically, two frames, three frames, four frames, five frames, or other number of frames. The material of the horizontal load 1311 may be aluminum, copper, or other types of metals, and the material of the horizontal load is not limited herein.

In the embodiment of the present invention, since the horizontal load 1311 of the supporting frame 131 is used to fix the heat sink 132, and three points can determine a plane, the horizontal load of the supporting frame 131 can provide at least three supporting points for the heat sink 132, and at least two frames satisfying the horizontal load 1311 surround to form the opening 13111, so that when the supporting frame 131 is fixed on the circuit board 11, the heat generating element 12 is still in an exposed state. Referring to fig. 7 to 9, three schematic top views of the electronic component 10 including the supporting frame 13 according to the embodiment of the present disclosure are respectively shown, which respectively correspond to three different implementations of the horizontal load 1311.

Specifically, referring to fig. 7, as an implementation manner, at least two sides of the horizontal load 1311 form a C-shaped frame, the C-shaped horizontal load 1311 is composed of three sides, as shown by a dashed line portion in fig. 7, the three sides surround to form the opening 13111, and the heating element 12 is located in the opening 13111, specifically, three sides of the C-shaped horizontal load 1311 may be fixed to an upper right portion of the side frame portion of the circuit board 11, three sides of the C-shaped horizontal load 1311 may also be fixed to an upper left portion of the side frame portion of the circuit board 11, three sides of the C-shaped horizontal load 1311 may also be fixed to a lower seat portion of the side frame portion of the circuit board 11, and the three sides of the C-shaped horizontal load 1311 may be used to provide a fixed support for the heat sink 132.

As another implementation manner, referring to fig. 8, at least two sides of the horizontal load 1311 form a square frame, the square horizontal load 1311 is composed of four sides, as shown by a dotted line portion in fig. 8, the four sides surround the opening 13111, and the heating element 12 is located in the opening 13111, specifically, four sides of the square horizontal load 1311 are respectively fixed to four sides of the circuit board 11, and the four sides of the square horizontal load 1311 can be used to provide a fixing support for the heat sink 132.

As another implementation manner, referring to fig. 9, at least two frames of the horizontal load 1311 form a frame shape in a shape of a "d", the "d" shaped horizontal load 1311 is composed of four outer frames and one inner frame, as shown by a dashed line portion in fig. 9, five frames of the "d" shaped horizontal load 1311 surround to form an opening 13111, the opening 13111 is two independent openings, the heating element 12 is located in the opening 13111, specifically, four outer edges of the "d" shaped horizontal load 1311 are respectively fixed to four edges of the circuit board 11, and four outer edges and one inner edge of the "d" shaped horizontal load 1311 can be used to provide a fixed support for the heat sink 132.

In the embodiment of the present application, each of at least two frames constituting the horizontal load 1311 has a narrow width to increase the area of the opening 13111. The three frame shapes formed by the at least two frames of the horizontal load 1311 are respectively C-shaped, square-shaped and Japanese-shaped, the implementation is simple and easy, different schemes to be selected are provided, a user can select the three frame shapes according to actual product requirements, and application scenes of the scheme are enriched. It should be understood that the shapes of the frames of the at least two frames of the horizontal load 1311 in fig. 7 to 9 are only examples for facilitating understanding of the present embodiment, and the shapes of the frames of the at least two frames of the horizontal load 1311 are not limited as long as they can satisfy both the requirement of providing the fixed support for the heat sink 132 and the requirement of surrounding the frame forming the opening portion.

In the embodiment of the present application, the vertical load 1312 of the supporting bracket 131 is vertically connected to the horizontal load 1311, and the supporting bracket 131 is fixed to the frame of the circuit board 11 through the vertical load 1312.

As one implementation, referring to fig. 6, the vertical load 1312 of the support bracket 131 may be a second pin, which is composed of at least two pins for providing support for the horizontal load 1311 of the support bracket 131 and the heat sink 132. Specifically, the second pin may be composed of 3 pins, 4 pins, or another number of pins.

More specifically, the plurality of pins included in the second pin may be fixed at the end points of the frame of the horizontal load 1311, or may be fixed at any position on the frame of the horizontal load 1311. For example, referring to fig. 7, when the frame formed by at least two frames of the horizontal load 1311 is C-shaped, and the second pin is composed of 3 pins, the 3 pins respectively fix three end points formed by the C-shaped horizontal load 1311; as another example, for example, when the shape of the frame formed by at least two frames of the horizontal load 1311 is a square shape, and the second pin is composed of 3 pins, the 3 pins may be respectively fixed at three upper left end points of the square horizontal load 1311 as shown in fig. 8, or at three lower right end points of the square horizontal load 1311; as another example, for example, when the shape of the frame formed by at least two frames of the horizontal load 1311 is a shape of a japanese character and the second pin is composed of 3 pins, the 3 pins may be respectively fixed at any three end points of the horizontal load 1311. It should be understood that the foregoing examples of the number and the fixing positions of the plurality of pins included in the second pin are merely to demonstrate the feasibility of the present solution, and the number and the fixing positions of the plurality of pins included in the second pin are not limited herein.

More specifically, the specific process of fixing the supporting frame 131 on the circuit board 11 through the second pins may include respectively pressing a plurality of pins included in the second pins onto a frame of the horizontal load 1311 of the supporting frame 131, mounting the second pins on the frame of the circuit board 11 by using a chip mounting process under the condition that the first pins 14 and the heating element 12 are already mounted on the circuit board 11, and performing reflow soldering along with the load board 20 under the condition that the first pins 14 are already mounted on the load board 20 to solder the second pins onto the load board 20, that is, fixing the supporting frame 131 on the circuit board 11 through the second pins is achieved. The supporting frame 131 is soldered to the circuit board 11 through the second pin, so that the stability of the supporting frame 131 is ensured, and the stability of the whole electronic assembly 10 is further ensured.

As another implementation manner, the vertical load 1312 of the supporting bracket 131 may also be a metal plate perpendicular to the horizontal load 1311, and may include at least two metal plates, which are fixedly connected to the frame portion of the circuit board 11. The metal plate can be composed of two, three, four or other vertical metal plates. The cut surface shape of the metal plate in the vertical direction can be obtained by cutting the metal plate in the vertical direction, and the cut surface shape of the metal plate in the vertical direction can be a rectangle, a square, an irregular polygon, or the like, and is not limited herein.

Specifically, the material of the vertical load 1312 may be aluminum, copper or other types of metals, and the material of the vertical load is not limited herein. As an example, for example, when the frame shape formed by at least two frames of the horizontal load 1311 is C-shaped, the vertical load 1312 may be two vertical metal plates respectively perpendicular to two long sides of three sides of the C-shaped horizontal load 1311; as another example, for example, when the shape of the frame formed by at least two frames of the horizontal load 1311 is a square, the square horizontal load 1311 includes 4 sides, and the vertical load 1312 may be two vertical metal plates perpendicular to any two sides of the 4 sides, or may be three vertical metal plates perpendicular to any three sides of the 4 sides; as another example, for example, when at least two frames of the horizontal load 1311 form a frame shape of a japanese character, the japanese character horizontal load 1311 includes 4 outer edges and one inner edge, and the vertical load 1312 may be two vertical metal plates perpendicular to any two of the 4 outer edges, or may be three vertical metal plates perpendicular to any three of the 4 outer edges. It should be understood that the foregoing examples of the number and the fixing positions of the vertical metal plates are merely to demonstrate the feasibility of the present solution, and are not limited herein.

More specifically, the connection manner of the vertical metal plate and the circuit board 11 may be soldering; the adhesive connection may be achieved by applying an adhesive to the contact surface of the vertical metal plate and/or the circuit board 11, pressing the vertical metal plate to be closely attached to the circuit board 11, and continuing the pressing for a while, thereby achieving the adhesive connection between the vertical metal plate and the circuit board 11. The adhesive between the vertical metal plate and the circuit board 11 may be an epoxy adhesive, an acrylate adhesive, a polyurethane adhesive, a rubber adhesive, or other types of metal adhesives.

As another implementation, the vertical load 1312 of the support bracket 131 may be at least two bolts for providing support for the horizontal load 1311 of the support bracket 131 and the radiator 132. Specifically, the at least two bolts may be fixed to end points of the frame of the horizontal load 1311, or may be fixed to any position on the frame of the horizontal load 1311. The number and the fixing positions of the bolts can refer to the number and the fixing positions of the pins in the second pins, and are not described in detail here.

More specifically, the specific process of fixing the supporting frame 131 to the circuit board 11 by using the bolt may include that threaded holes are respectively formed in the horizontal load 1311 of the supporting frame 131 and the circuit board 11, the position of the threaded hole in the horizontal load 1311 is similar to that of the second pin in fig. 7 to 9, the position of the threaded hole in the horizontal load 1311 corresponds to that of the threaded hole in the circuit board 11 one by one, and the bolt is rotated to sequentially pass through the threaded hole in the horizontal load 1311 and the threaded hole in the circuit board, so that the threaded connection between the supporting frame 131 and the circuit board 11 is achieved.

In the embodiment of the present application, a plurality of implementation manners for fixing the vertical load 1312 to the frame portion of the circuit board 11 are provided, and the realizability and flexibility of the scheme are improved.

In the embodiment of the present application, referring to fig. 3 and fig. 10, fig. 10 is a schematic structural diagram of an electronic component 10 provided in the embodiment of the present application. The heat dissipation structure 13 may further include a heat conductive medium 133, the heat conductive medium 133 is located between the heat generating element 12 and the heat sink 132, and the heat conductive medium 133 is used for conducting heat emitted from the heat generating element 12 to the heat sink 132 and absorbing structural tolerance. The heat conducting medium 133 may be embodied as a heat conducting pad, a heat conducting gel, a heat conducting silicone grease or other type of heat conducting medium, etc.

The heat conducting pad can also be called as a heat conducting silica gel sheet, a heat conducting silica gel pad, an insulating heat conducting sheet, a soft heat radiating pad and the like, is a high-performance gap filling heat conducting material, is mainly used for heat transfer between electronic equipment and a heat radiating sheet or a product shell, and has good viscosity, flexibility, good compression performance and good heat conductivity.

The heat conducting gel is a heat conducting material with ultrahigh viscosity, is prepared by mixing multiple heat conducting powder bodies and heat conducting silica gel after being completely cured, and the whole production process is completed in a vacuum state.

The heat-conducting silicone grease is also called as heat-dissipating grease, and takes organic silicone as a main raw material, and a material with excellent heat resistance and heat-conducting property is added to prepare the heat-conducting type silicone grease-like compound, so that the grease state can be kept for a long time at the temperature of between 50 ℃ below zero and 230 ℃.

In the embodiment of the present invention, since the heating element 12 is still in the exposed state when the supporting frame 131 is fixed on the circuit board 11, the heat conducting medium 133 can be covered on the heating element 12 after the supporting frame 131 is fixed on the circuit board 11 and reflows with the circuit board 11, the first pins 14 and the heating element 12 mounted on the circuit board 11 and the load board 20. Specifically, the cut heat conducting pad may be pressed onto the heating element 12, or the heat conducting gel may be coated on the heating element 12 by a dispensing process, or the heat conducting silicone grease may be coated on the heating element 12, or the heat conducting silicone grease may be encapsulated on the heating element, or the heat conducting medium 133 may be covered on the heating element 12 by other methods.

It should be understood that the above examples of the specific expression of the heat transfer medium and the method of using the heat transfer medium are only to demonstrate the feasibility of the present solution, and are not limited herein.

In the embodiment of the present invention, the heat sink 132 is fixed on the horizontal load 1311 of the supporting frame 131, and the inner surface of the heat sink 132 contacts with the heat conducting medium 133 for dissipating heat generated by the heat generating element 12, which may be embodied as a heat sink or other type of heat sink. The shape of the horizontal section of the heat sink 132 may correspond to the shape of the horizontal section of the circuit board 11, and is embodied as a rectangle, a polygon or other shapes; the material of the heat sink 132 may be a metal with a high thermal conductivity, such as copper, aluminum, silver, gold, or other types of metals with a high thermal conductivity, and is not limited herein.

In some embodiments of the present application, referring to fig. 11, the inner surface of the heat sink 132 may include a first portion 1321 and a second portion 1322, wherein the first portion 1321 is a portion of the inner surface of the heat sink that is in contact with the horizontal load 1311, and the second portion 1322 is a portion of the inner surface of the heat sink that is not in contact with the horizontal load 1311. Since the heat sink 132 is fixed to the outer surface of the horizontal load 1311 of the supporting frame 131, and each of the plurality of electronic components included in the heat generating element 12 is different in height from the circuit board 11, in order to prevent the heat sink 132 from crushing the heat generating element 12, a certain safety distance exists between the outer surface of the horizontal load 1311 of the supporting frame 131 and the circuit board in the vertical direction, that is, the height of the opening 13111 in the vertical direction is greater than the height of any one of the plurality of electronic components included in the heat generating element 12 from the circuit board 11. Since the heating element 12 is still exposed when the supporting bracket 131 is fixed on the circuit board 11 by the vertical load 1312, referring to fig. 11, at least one protrusion 13221 may be disposed on the second portion 1322 of the inner surface of the heat sink 132, and the at least one protrusion 13221 is received in the opening 13111, so as to shorten a distance between the inner surface of the heat sink 132 and the heating element 12 in the vertical direction.

Specifically, the at least one protrusion 13221 may be one protrusion; the at least one protrusion 13221 may also include at least two protrusions, and the position of each protrusion 13221 on the inner surface and the position of the heat generating element 12 on the circuit board 11 may correspond to each other, and the height of each protrusion 13221 and the height of the heat generating element 12 higher than the circuit board 11 may correspond to each other, and although each protrusion 13221 shortens the distance between the inner surface of the heat sink 132 and each heat generating element 12, the heat conducting medium 133 may still exist between each protrusion 13221 and the heat generating element 12, so as to avoid damage to the heat generating element 12. It should be understood that although 4 protrusions are shown in fig. 3 and 3 protrusions are shown in fig. 11, the number, position and height of the specific protrusions should be flexibly set in combination with the number, position and height of the heat generating elements, and are not limited herein.

In the embodiment of the present application, at least one protrusion is disposed on the inner surface of the heat sink 132, when the heat conducting medium 133 exists between the heat sink and the heat generating element, the thickness of the heat conducting medium 133 can be relatively reduced, and the manufacturing cost of the heat conducting medium 133 is relatively high, thereby reducing the usage of the heat conducting medium 133 and reducing the manufacturing cost; the heat conduction performance of the heat sink 132 is much higher than that of the heat-conducting medium 133, so that the heat dissipation performance of the whole electronic assembly 10 can be improved by reducing the use of the heat-conducting medium 133; when the heat transfer medium 133 is not present between the heat sink and the heat generating element, the at least one protrusion may also shorten a distance between the inner surface of the heat sink and the heat generating element in the vertical direction, thereby improving the heat dissipation performance of the heat sink 132.

Although fig. 3, 4, 10, and 11 all illustrate a heat spreader with protrusions, in other embodiments of the present application, the inner surface of the heat spreader 132 may be flat, i.e., the heat spreader 132 does not include any protrusions. Specifically, after the supporting frame 131 is fixed to the circuit board 11, the heat conducting medium 133 is covered on the heating element 12 until the upper surface of the heat conducting medium 133 and the upper surface of the horizontal load 1311 of the supporting frame 131 are at the same level, so that the heat sink 132 can be in contact with the heat conducting medium 133 after the heat sink 132 is fixed to the horizontal load 1311 of the supporting frame 131. As an example, the heat-conducting medium 133 is, for example, a heat-conducting silicone grease, and the heat-conducting silicone grease is applied to the plurality of electronic components included in the heat-generating element 12 until the upper surface of the heat-conducting silicone grease is flush with the upper surface of the horizontal load 1311; as another example, for example, the heat conducting medium is a heat conducting pad, and the heat conducting pad is respectively pressed on a plurality of electronic components included in the heating element 12, and since each of the plurality of electronic components included in the heating element 12 is different in height from the circuit board 11, the number of the heat conducting pads on different electronic components may be different until the upper surface of the entire heat conducting pad is flush with the upper surface of the horizontal load 1311; it should be understood that the above examples are merely illustrative of the feasibility of the present solution and are not intended to be limiting.

In the embodiment of the present invention, when the heat sink 132 is fixed on the outer surface of the horizontal load 1311, the heat conducting medium 133 covers the heating element 12, and the heat conducting medium 133 does not resist high temperature, so that the connection manner between the heat sink 132 and the horizontal load 1311 of the supporting frame 131 needs to satisfy the requirement of realizability in a non-high temperature environment. The connection between the heat sink 132 and the horizontal load 1311 of the support bracket 131 may be a threaded connection, an adhesive connection, or other connection structure that can be achieved in a non-high temperature environment.

As an implementation manner, the connection manner between the horizontal load 1311 of the heat sink 132 and the support bracket 131 is a threaded connection, specifically, referring to fig. 5 to 8 and 9, a first threaded hole 1313 is present at a corner of the horizontal load 1311 of the support bracket 131, a second threaded hole 1323 is also present at a corner of the heat sink 132, and the position of the first threaded hole 1313 on the horizontal load 1311 corresponds to the position of the second threaded hole 1323 on the heat sink 132, so that the heat sink 132 is fixed to the horizontal load 1311 of the support bracket 131 by bolts. More specifically, the number of the first threaded holes 1313 on the horizontal load 1311 and the number of the second threaded holes 1323 on the heat sink 132 are at least two, that is, two, three or another number of threaded holes are included, and the number is not limited herein.

As another implementation, the connection between the heat sink 132 and the horizontal load 1311 of the supporting bracket 131 is an adhesive connection, wherein the adhesive between the heat sink 132 and the supporting bracket 131 may be an epoxy adhesive, an acrylate adhesive, a polyurethane adhesive, a rubber adhesive, or other types of metal adhesives. Specifically, an adhesive is applied to the first portion 1321 of the heat sink 132 and/or the upper surface of the horizontal load 1311 of the support bracket 131, and the heat sink 132 is pressed to be closely attached to the support bracket 131 for a period of time, thereby achieving adhesive bonding between the heat sink 132 and the horizontal load 1311 of the support bracket 131.

In the embodiment of the present application, two connection modes between the heat sink 132 and the support frame 131 are provided, and no matter the connection is a threaded connection or an adhesive connection, the operation is simple and easy to implement, and the realizability of the present scheme is improved.

In the embodiment of the present application, the supporting frame 131 includes a horizontal load 1311 and a vertical load 1312, and since the horizontal load 1311 is composed of at least two frames, and the vertical load 1312 is vertically connected to the horizontal load 1311, the supporting frame 131 is fixed to the frame of the circuit board 11 through the vertical load 1312, so that after the supporting frame 131 is fixed to the circuit board 11, the heating element is still in an exposed state. That is, the electronic component 10 provided in the present embodiment can fix the supporting frame 131 on the circuit board 11, perform reflow soldering together with the load board 20, cover the heat conducting medium 133 on the exposed heating element 12, and then mount the heat sink 132, so as to prevent the heat conducting medium 133 from being subjected to reflow soldering, thereby providing the heat dissipation structure 13 capable of adapting to reflow soldering, and not only reducing the space utilization rate of the load board 20, but also not causing the complexity of the processing procedure of the circuit board component; compared with the plane substrate in the prior art, the support frame 131 saves the substrate material and saves the manufacturing cost; in addition, the heat dissipation structure provided by the scheme is not only suitable for the BMP, but also can be applied to other electronic components comprising heating elements, so as to accelerate the intelligent development process of the manufacturing industry.

The embodiment of the present application further provides an electronic component 10, where the electronic component 10 includes a circuit board 11, and a heating element 12 and a heat dissipation structure 13 mounted on the circuit board 11, and the heat dissipation structure 13 is configured to dissipate heat of the heating element 12, where the heat dissipation structure 13 includes a support frame 131 and a heat sink 132;

the supporting frame 131 contains a horizontal load 1311 and a vertical load 1312, the horizontal load 1311 is composed of at least two frames which surround and form an opening 13111, and the horizontal load 1311 is fixed on the circuit board 11 through the vertical load 1312, so that the heating element 12 is located in the opening 13111;

the heat sink 132 is fixed to the horizontal load 1311 and is thermally connected to the heat generating element 12 through the opening 13111.

In one possible implementation, the at least two frames that make up the horizontal load 1311 form a frame shape that includes a C-shape, a square shape, or a japanese shape.

In one possible implementation, the heat sink 132 has at least one protrusion 13221 on an inner surface thereof, and the at least one protrusion 13221 is received in the opening 13111.

In one possible implementation, the heat sink 132 further includes a heat conducting medium 133, and the heat conducting medium 133 is located between the heat generating element 12 and the heat sink 132.

In one possible implementation, the connection between the heat sink 132 and the horizontal load 1311 comprises at least one of a threaded connection or an adhesive connection.

In one possible implementation manner, the vertical load 1312 is a pin, and the supporting frame 131 is fixedly connected to the circuit board 11 through the pin; or the vertical load 1312 is a vertical metal plate, and the support bracket 131 is connected with the circuit board 11 through welding; or the vertical load 1312 is a vertical metal plate through which the supporting bracket 131 is adhesively connected with the circuit board 11; or the vertical load 1312 is a bolt, and the support bracket 131 is in threaded connection with the circuit board 11 through the bolt.

In one possible implementation, the electronic component 10 is a power module.

Specific implementation manners and beneficial effects of the components in the electronic assembly 10 provided in the embodiment of the present application may refer to specific descriptions in the embodiments corresponding to fig. 2 to fig. 11, and are not described again.

The embodiment of the present application further provides a circuit board assembly configured in the communication device, where the circuit board assembly includes a load board and at least one electronic component 10 mounted on the load board, the electronic component 10 includes a circuit board 11, and a heat generating element 12, a heat dissipating structure 13 and first pins 14 mounted on the circuit board 11, the heat dissipating structure 13 is configured to dissipate heat of the heat generating element 12, where the heat dissipating structure 13 includes a supporting frame 131 and a heat sink 132;

the electronic component 10 is fixedly connected to the load board through the first pins 14.

In a possible implementation manner, the vertical load 1312 is a second pin, and the supporting frame 131 is fixedly connected to the circuit board 11 through the second pin; or the vertical load 1312 is a vertical metal plate, and the support bracket 131 is connected with the circuit board 11 through welding; or the vertical load 1312 is a vertical metal plate through which the supporting bracket 131 is adhesively connected with the circuit board 11; or the vertical load 1312 is a bolt, and the support bracket 131 is in threaded connection with the circuit board 11 through the bolt.

In one possible implementation, the at least one electronic component 10 includes a power module therein.

Specific implementation manners and advantageous effects of each component in the circuit board assembly included in the communication device provided in the embodiment of the present application may refer to specific descriptions in the embodiments corresponding to fig. 2 to fig. 11, and are not described again here.

Fig. 2 to 11 are diagrams illustrating a specific structure of a circuit board assembly in detail, and a method for processing a circuit board assembly is described in detail below with reference to the embodiment shown in fig. 12, where the circuit board assembly includes a load board 20 and at least one electronic component 10, the electronic component 10 includes a circuit board 11, a heat generating element 12, a heat dissipating structure 13, and first leads 14, where the heat dissipating structure 13 may include a supporting frame 131 and a heat sink 132, and the heat dissipating structure 13 may further include a heat conducting medium 133, please refer to fig. 12, and fig. 12 is a schematic diagram illustrating an embodiment of a method for processing a circuit board assembly in this embodiment of the present application, and as shown in the drawings, the method for processing a circuit board assembly may include:

101. the first lead 14 and the heating element 12 are mounted on the circuit board 11 in this order.

In the embodiment of the present application, the first pin 204 and the heating element 12 may be sequentially mounted on the load board 20 by using a chip mounting process and/or a chip mounting process, specifically, the first pin 14 may be mounted first, and then the heating element 12 may be mounted; the heating element 12 may be mounted first, and then the first lead 14 may be mounted, which is not limited herein.

In the embodiments of the present application, the chip process includes, but is not limited to, Surface Mount Technology (SMT), and the tab process includes, but is not limited to, dual inline-package (DIP).

102. The supporting frame 131 is fixed to the frame of the circuit board 11 by a vertical load 1312.

In this embodiment, the supporting frame 131 may include a horizontal load 1311 and a vertical load 1312, the horizontal load 1311 is composed of at least two frames, the at least two frames of the horizontal load 1311 surround to form an opening 13111, and the horizontal load 1311 and the vertical load 1312 are vertically connected, so that when the supporting frame 131 is fixed on the circuit board 11, the heating element 12 is located in the opening 13111, that is, the heating element 12 is still in an exposed state. Specifically, the vertical load 1312 includes, but is not limited to, pins, vertical metal plates, and bolts, and since the vertical loads 1312 are different, the specific process of fixing the supporting bracket 131 to the frame of the circuit board 11 through the vertical load 1312 may be different.

As an implementation manner, the vertical load 1312 is a second pin, and the step 12 may specifically include: the second leads are inserted into the frame portion of the circuit board 11. Specifically, under the condition that the first pins 14 and the heating element 12 are already mounted on the circuit board 11, the second pins may be mounted on the frame portion of the circuit board 11 by using a mounting process, so that the support frame 131 is primarily fixed on the frame portion of the circuit board through the second pins.

As another implementation, the vertical load 1312 is a vertical metal plate, and the step 12 may specifically include: the vertical metal plate is soldered to the frame portion of the circuit board 11.

As another implementation, the vertical load 1312 is a vertical metal plate, and the step 12 may specifically include: the vertical metal plate is bonded to the frame portion of the circuit board 11 with an adhesive.

As another implementation, the vertical load 1312 is a bolt, and the step 12 may specifically include: a screw connection is formed between the support bracket 131 and the frame portion of the circuit board 11 by using a bolt.

103. The first pins 14 are inserted into the load board 20, and the circuit board 11 mounted with the first pins 14, the heat generating component 12 and the support bracket 131 is subjected to reflow soldering following the load board 20, so that the circuit board 11 is soldered on the load board 20 through the first pins 14.

In the embodiment of the present application, after the first pin 14, the heating element 12 and the supporting frame 131 have been mounted on the circuit board 11, the first pin 204 may be mounted on the load board 20 by using a chip mounting process, and then solder may be applied around the first pin 14, further, when the vertical load 1312 of the supporting frame 131 is the second pin, solder may be applied around the second pin, air or nitrogen is heated to a sufficiently high temperature and then blown to the load board 20, so that the solder around the first pin 14 is melted and then bonded to the load board 20, and the solder around the second pin is melted and then bonded to the circuit board 11, thereby realizing that the circuit board 11 is soldered to the load board 20 through the first pin 14 by reflow soldering, and the supporting frame 131 is soldered to the frame portion of the circuit board 11 through the second pin.

In the embodiment of the present application, the circuit board 11 is soldered to the load board 20 through the first pins 14, and the supporting frame 131 is soldered to the circuit board 11 through the second pins, so as to ensure the stability of the circuit board 11 and the supporting frame 131, and further ensure the stability of the whole electronic assembly 10.

104. The heat transfer medium 133 is coated on the heat generating element 12 in an exposed state.

In the embodiment of the present invention, after the supporting frame 131 is fixed on the circuit board 11 and the circuit board 11 is soldered on the load board 20, since the heating element 12 is still in the exposed state, the heat conducting medium 133 can be covered on the exposed heating element 12.

105. The heat sink 132 is fixed to the horizontal load 1311 such that the inner surface of the heat sink 132 is in contact with the heat transfer medium 133 to form the electronic component 10, the heat transfer medium 133 serving to transfer heat emitted from the heat generating element 12 to the heat sink 132.

In the embodiment of the present invention, when the heat sink 132 is fixed on the outer surface of the horizontal load 1311, the heat conducting medium 133 covers the heating element 12, and the heat conducting medium 133 does not resist high temperature, so that the connection manner between the heat sink 132 and the horizontal load 1311 of the supporting frame 131 needs to satisfy the requirement of realizability in a non-high temperature environment. Specifically, the connection between the heat sink 132 and the horizontal load 1311 of the support bracket 131 may be a threaded connection, an adhesive connection, or other connection structure that can be implemented in a non-high temperature environment.

In one implementation, the connection between the heat sink 132 and the horizontal load 1311 of the support bracket 131 is a threaded connection, a first threaded hole 1313 is formed at a corner of the horizontal load 1311 of the support bracket 131, a second threaded hole 1323 is also formed at a corner of the heat sink 132, and the first threaded hole 1313 of the horizontal load 1311 corresponds to the second threaded hole 1323 of the heat sink 132, so that the heat sink 132 is fixed to the horizontal load 1311 of the support bracket 131 by bolts.

As another implementation manner, the connection between the heat sink 132 and the horizontal load 1311 of the supporting frame 131 is adhesive connection, specifically, an adhesive is coated on the first portion 1321 of the heat sink 132 and/or the upper surface of the horizontal load 1311 of the supporting frame 131, the heat sink 132 is pressed to be closely attached to the supporting frame 131, and the pressing is continued for a period of time, so that the adhesive connection between the heat sink 132 and the horizontal load 1311 of the supporting frame 131 is achieved.

In the embodiment of the present application, the inner surface of the heat sink 132 includes a first portion 1321 and a second portion 1322, the first portion 1321 is a portion of the inner surface of the heat sink 132 that is in contact with the horizontal load 1311, and the second portion 1322 is a portion of the inner surface of the heat sink 132 that is not in contact with the horizontal load 1311, because an intermediate layer exists between a horizontal plane where the horizontal load 1311 is located and a horizontal plane where the circuit board 11 is located, the inner surface of the heat sink 132 may be a flat surface, and the second portion 1322 may have at least one protrusion 13221.

In some embodiments of the present application, if there is at least one protrusion 13221 on the second portion 1322, then when the first portion 1321 of the heat sink 132 is fixed to the horizontal load 1311, the at least one protrusion 13221 may be embedded in the interlayer, so as to shorten the distance between the heat sink 132 and the heat generating element 12 in the vertical direction.

In the embodiment of the present application, the first pins 14 and the heating element 12 are sequentially mounted on the circuit board 11, and after the supporting frame 131 is fixed on the frame portion of the circuit board 11, the first pins 14 are inserted into the load board 20, and after reflow soldering is performed with the load board 20, because the supporting frame 131 may include the horizontal load 1311 and the vertical load 1312, the horizontal load 1311 is composed of at least two frames, and the horizontal load 1311 and the vertical load 1312 are vertically connected, when the supporting frame 131 is fixed on the circuit board 11, the heating element 12 is still in an exposed state, the heat conducting medium 133 may be covered on the heating element 12 in the exposed state, and then the heat sink 132 is mounted, thereby avoiding over reflow soldering of the heat conducting medium 133, thereby removing the requirement for wave soldering retention, and accelerating the intelligent development process of the manufacturing industry.

It can be clearly understood by those skilled in the art that, for convenience and brevity of description, the shapes, the numbers, the positions, and the specific implementation manners of the implementation processes of the electronic components included in the circuit board assembly described above may refer to the corresponding descriptions in the structural embodiments described in fig. 2 to fig. 10, and are not repeated herein.

In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other manners. For example, the above-described apparatus embodiments are merely illustrative, and for example, a division of a unit is merely a logical division, and an actual implementation may have another division, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.

Claims

1. A heat radiation structure is characterized in that the heat radiation structure is used for radiating heat of a heating element arranged on a circuit board and comprises a support frame and a radiator;

the support frame comprises a horizontal load and a vertical load, the horizontal load is composed of at least two side frames, an opening part is formed by the at least two side frames in a surrounding mode, the horizontal load is fixed on the circuit board through the vertical load, and therefore the heating element is located in the opening part;

the supporting frame is fixed on the circuit board firstly, and is used for mounting the heat-conducting medium and the radiator after reflow soldering together with the load board;

the radiator is fixed on the horizontal load and is in heat conduction connection with the heating element through the opening part;

the heat conducting medium is located between the heat generating element and the heat sink.

2. The heat dissipating structure of claim 1, wherein the at least two frames constituting the horizontal load form a frame shape including a C-shape, a square-shape or a japanese-shape.

3. The heat dissipating structure of claim 1, wherein the heat sink has at least one protrusion on an inner surface thereof, the at least one protrusion being received in the opening.

4. The heat dissipating structure of any of claims 1 to 3, wherein the connection between the heat sink and the horizontal load comprises at least one of a threaded connection or an adhesive connection.

5. The heat dissipation structure of any one of claims 1 to 3, wherein the vertical load is a pin, and the support frame is fixedly connected with the circuit board through the pin; or

The vertical load is a vertical metal plate, and the support frame is connected with the circuit board in a welding mode through the vertical metal plate; or

The vertical load is a vertical metal plate, and the support frame is connected with the circuit board through the vertical metal plate by an adhesive; or

The vertical load is a bolt, and the support frame is in threaded connection with the circuit board through the bolt.

6. An electronic component, comprising a circuit board, a heating element mounted on the circuit board, and a heat dissipation structure for dissipating heat from the heating element, wherein the heat dissipation structure comprises a support frame and a heat sink;

7. The electronic assembly of claim 6, wherein the at least two frames forming the horizontal load form a frame shape comprising a C-shape, a square-shape or a Japanese-shape.

8. The electronic assembly of claim 6, wherein the heat sink has at least one protrusion on an inner surface thereof, the at least one protrusion being received in the opening.

9. The electronic assembly of any of claims 6 to 8, wherein the connection between the heat sink and the horizontal load comprises at least one of a threaded connection or an adhesive connection.

10. The electronic assembly of any one of claims 6 to 8, wherein the vertical load is a pin, and the supporting frame is fixedly connected with the circuit board through the pin; or

11. The electronic component of any of claims 6 to 8, wherein the electronic component is a power module.

12. A communication device, wherein a circuit board assembly is disposed in the communication device, the circuit board assembly comprising a load board and at least one electronic component mounted on the load board, the electronic component being the electronic component of any one of claims 6 to 11; wherein,

and pins are also arranged on the circuit board of the electronic component, and the electronic component is fixedly connected with the load board through the pins.