CN214154942U

CN214154942U - Circuit board assembly

Info

Publication number: CN214154942U
Application number: CN202022737655.0U
Authority: CN
Inventors: 陈达龙
Original assignee: Shenzhen Qihu Intelligent Technology Co ltd
Current assignee: Shenzhen 3600 Smart Life Technology Co ltd
Priority date: 2020-11-23
Filing date: 2020-11-23
Publication date: 2021-09-07
Anticipated expiration: 2030-11-23

Abstract

The utility model discloses a circuit board assembly, including chip, circuit board and radiating piece, the chip is located on the circuit board and with the circuit board electricity is connected, be equipped with the through-hole on the circuit board, the at least part of through-hole is located the chip is in the orthographic projection region of circuit board, the radiating piece is including being located the circuit board is kept away from the main part and the connection of one side of chip the grafting portion of main part, grafting portion via the through-hole with the chip contact, it is right with the chip heat dissipation. The utility model discloses a set up the through-hole on the circuit board and provide the heat dissipation way for the chip, the heat-dissipating piece is add grafting portion and is passed the chip contact on through-hole and the circuit board, can be effectively with the heat conduction of the chip that generates heat to the heat-dissipating piece on, the heat in the heat-dissipating piece is through modes such as convection current or radiation again give off to the surrounding environment in, realize the quick radiating effect of chip, promoted the radiating efficiency and the effect of circuit board greatly.

Description

Circuit board assembly

Technical Field

The application relates to the technical field of circuit board heat dissipation, in particular to a circuit board assembly.

Background

With the development of electronic design and manufacturing technology, the electronics and related industries pursue miniaturization, integration, high frequency and high operation speed, which will lead to a rapid increase in the heat productivity of electronic components, especially integrated chips, while printed Circuit board (pcb), etc. Circuit board components are common media for carrying electronic components in electronic devices, and the accumulation of heat on the Circuit board components will cause great damage to the components, affect the life of the components, even cause the failure of the components, etc., thereby seriously affecting the reliability of the electronic devices. Therefore, it is necessary to design a heat dissipation device for a circuit board assembly, and a practical and effective heat dissipation measure is taken to dissipate heat generated by the electronic component during the operation process to the outside of the circuit board assembly.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a circuit board assembly which can be used for radiating a chip and has the advantages of high heat transfer efficiency and good radiating effect; the technical scheme is as follows:

according to an embodiment, a circuit board assembly is provided, which includes: the heat dissipation device comprises a chip, a circuit board and a heat dissipation part, wherein the chip is located on the circuit board and is electrically connected with the circuit board, a through hole is formed in the circuit board, at least part of the through hole is located in an orthographic projection area of the chip on the circuit board, the heat dissipation part comprises a main body part located on one side, far away from the chip, of the circuit board and an insertion part connected with the main body part, and the insertion part is in contact with the chip through the through hole so as to dissipate heat of the chip. According to the above embodiment, this application provides the heat dissipation way for the chip through set up the through-hole on the circuit board, and the heat sink is add grafting portion and passes the chip contact on through-hole and the circuit board, can be effectively with the heat conduction of the chip that generates heat to the heat sink on, the heat in the heat sink is through in modes such as convection current or radiation give off to the surrounding environment again, realizes the quick radiating effect of chip, has promoted the radiating efficiency and the effect of circuit board greatly.

For example, in a circuit board assembly provided in at least one embodiment of the present application, the chip has a first surface facing the circuit board, a heat dissipation pad is disposed in a middle of the first surface, signal pins are disposed around the heat dissipation pad at an edge of the first surface, the chip is electrically connected to the circuit board through the signal pins, and the insertion part is in contact with the heat dissipation pad to conduct heat of the chip to the heat dissipation member via the heat dissipation pad. According to the embodiment, the exposed heat dissipation welding disc is arranged at the central position of the bottom surface of the chip for heat conduction, and the heat dissipation part is in contact with the heat dissipation welding disc to improve the heat conduction efficiency.

For example, in a circuit board assembly provided in at least one embodiment of the present application, the through hole is located in an orthographic projection area of the heat dissipation pad on the circuit board. According to the above embodiments, the effective contact area of the heat sink and the heat dissipation pad is increased to maximally transfer heat of the chip to the heat sink.

For example, in a circuit board assembly provided by at least one embodiment of the present application, the main body portion has a second surface facing the circuit board, the insertion portion is located on the second surface and is inserted into and matched with the through hole, and the second surface is bonded or soldered to an outer surface of the circuit board facing away from the chip. According to the embodiment, the heat dissipation member is tightly assembled with the circuit board, and the heat dissipation member is prevented from being separated from the circuit board or falling off.

For example, in a circuit board assembly provided in at least one embodiment of the present application, the through hole is a rectangular hole, and the insertion portion includes a boss protruding from the second surface, and the boss is inserted into the through hole and contacts with the heat dissipation pad, so that the heat dissipation member dissipates heat to the chip.

For example, in a circuit board assembly provided in at least one embodiment of the present application, the through hole includes a plurality of rectangular holes, the insertion portion includes a plurality of bosses protruding relative to the second surface, the plurality of bosses correspond to the plurality of through holes one to one, and the bosses are inserted into the corresponding through holes and contact with the heat dissipation pads, so that the heat dissipation member dissipates heat from the chip.

For example, in a circuit board assembly provided in at least one embodiment of the present application, the through hole includes a plurality of circular holes, the insertion portion includes a plurality of protruding pillars protruding relative to the second surface, the plurality of protruding pillars correspond to the plurality of through holes one to one, and the protruding pillars are inserted into the corresponding through holes and contact with the heat dissipation pads, so that the heat dissipation member dissipates heat to the chip.

For example, in a circuit board assembly provided in at least one embodiment of the present application, a thermal grease is filled in a gap between the insertion portion and the through hole and/or a gap between the insertion portion and the heat dissipation pad. According to the above embodiments, the heat conduction structure of heat sink pad-thermal grease-heat sink is formed, and compared with the heat conduction structure of heat sink pad-thermal grease-circuit board-heat sink in the related art, the heat conduction mode of the present application is simpler and more convenient, and the defect of low heat conduction efficiency of the circuit board is overcome.

For example, in a circuit board assembly provided in at least one embodiment of the present application, a solder joint is provided around the through hole to improve grounding performance of the heat dissipation pad.

For example, in a circuit board assembly provided in at least one embodiment of the present application, the main body portion includes a base connected to the socket portion and a plurality of heat sinks connected to a side of the base away from the socket portion and spaced apart from the socket portion, and the heat sinks are configured to dissipate heat conducted from the chip to the heat sinks via the socket portion and the main body portion in a convection manner. According to the embodiment, the radiating surface area of the radiating piece can be improved by arranging the plurality of radiating fins which are arranged at intervals, and the larger the surface area is, the better the radiating effect is.

Some embodiments of the present application provide a circuit board assembly brings beneficial effect does: through set up the through-hole on the circuit board and provide the heat dissipation way for the chip, the radiating piece is add grafting portion and passes the chip contact on through-hole and the circuit board, can be effectively with the heat conduction of the chip that generates heat to the radiating piece on, heat transfer efficiency is high, the radiating effect is good, the heat in the radiating piece is distributed to the surrounding environment through modes such as convection current or radiation again, the realization is to the quick radiating effect of chip, the radiating efficiency and the effect of circuit board have been promoted greatly, the application is practical and simple, high operability, low cost, and convenient popularization.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is an exploded perspective view of a circuit board assembly according to an embodiment of the present application;

FIG. 2 is a cross-sectional view of the circuit board assembly of the embodiment shown in FIG. 1;

FIG. 3 is an exploded perspective view of a circuit board assembly according to another embodiment of the present application;

FIG. 4 is a cross-sectional view of the circuit board assembly of the embodiment shown in FIG. 3;

FIG. 5 is an exploded perspective view of a circuit board assembly according to yet another embodiment of the present application;

fig. 6 is a schematic diagram of a chip structure of a circuit board assembly according to an embodiment of the present application.

Reference numerals: 100-chip, 110-first surface, 111-heat dissipation pad, 112-signal pin, 200-circuit board, 210-through hole, 300-heat dissipation piece, 310-main body part, 311-second surface, 312-heat dissipation piece, 313-base body, 320-plug part, 321-boss, 322-convex column.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.

In the related art, the circuit board (e.g., PCB) in the circuit board assembly has poor thermal conductivity, and the heat-generating chip usually needs to be assisted by a peripheral heat dissipation assembly, such as a heat sink, a heat dissipation fan, etc. The installation of a conventional radiator is generally carried out in two ways: the first type is that the heat dissipation equipment is arranged on the front surface of the heating chip and is attached to the upper surface of the chip; the other type is placed on the surface of the circuit board, which is deviated from the chip, and is jointed with the circuit board, and the circuit board is jointed with the lower surface of the chip. The first method does not fully utilize the heat dissipation characteristics of the circuit board itself; the second approach is again greatly limited by the conditions of the circuit board itself (e.g., die bonding, via hole diameter and density, etc.). Other technical solutions for dissipating heat of a circuit board in the related art enhance the heat dissipation capability of the circuit board to some extent, but have disadvantages such as complex manufacturing process and relatively high cost.

In view of the above, the present invention provides a circuit board assembly, which, as shown in fig. 1 to 5, includes: the heat dissipation device comprises a chip 100, a circuit board 200 and a heat dissipation member 300, wherein the chip 100 is located on the circuit board 200 and is electrically connected with the circuit board 200, a through hole 210 is arranged on the circuit board 200, the through hole 210 is located in an orthographic projection area of the chip 100 on the circuit board 200, so that the bottom surface of the chip 100 is exposed outside the circuit board 200, the heat dissipation member 300 is opposite to the through hole 210, specifically, the heat dissipation member 300 comprises a main body part 310 located on one side of the circuit board 200 far away from the chip 100 and a plug part 320 connected with the main body part 310, and the plug part 320 is in contact with the chip 100 through the through hole 210 to dissipate heat of the chip 100.

This application provides the heat dissipation way for the chip through set up the through-hole on the circuit board, and the chip contact on through-hole and the circuit board is passed to the radiating piece is add grafting portion and grafting portion to the radiating piece, can be effectively with the heat conduction of the chip that generates heat to the radiating piece on, the heat in the radiating piece gives off to the surrounding environment through modes such as convection current or radiation again, realizes the quick radiating effect of chip, has promoted the radiating efficiency and the effect of circuit board greatly.

For example, in a circuit board assembly provided in at least one embodiment of the present application, as shown in fig. 6, the chip 100 has a first surface 110 facing the circuit board 200, a heat dissipation pad 111 is disposed in the middle of the first surface 110, signal pins 112 are disposed around the heat dissipation pad 111 at the edge of the first surface 110, the chip 100 is electrically connected to the circuit board 200 through the signal pins 112, the signal pins 112 of the chip 100 are disposed near the edge of the chip 100, specifically, as shown in fig. 6, two rows of signal pins 112 are disposed at each side of the chip 100, and the chip 100 is connected to the traces on the circuit board 200 through the signal pins 112 by soldering. It should be noted that the chip 100 in the present application may be a Quad Flat No-leads (QFN) Package, and the chip 100 is square or rectangular, and a heat dissipation pad 111 is disposed at the center of the bottom of the chip 100 for heat conduction.

Further, the insertion portion 320 of the heat sink 300 contacts the heat dissipation pad 111 to conduct the heat of the chip 100 to the heat sink 300 through the heat dissipation pad 111, and the heat sink dissipates the heat to the surrounding environment by convection or radiation.

For example, in the circuit board assembly provided in at least one embodiment of the present application, as shown in fig. 1 to 6, the through hole 210 is located in the orthographic projection region of the heat dissipation pad 111 on the circuit board 100, so that the through hole 210 faces the heat dissipation pad 111 of the chip 100, and the effective contact area between the heat dissipation member 300 and the heat dissipation pad 111 is increased, so as to transfer heat of the chip 100 to the heat dissipation member 300 to the maximum extent.

For example, in the circuit board assembly provided in at least one embodiment of the present application, as shown in fig. 1 to 6, the main body portion 310 has a second surface 311 facing the circuit board 200, the insertion portion 320 is located on the second surface 311 and is inserted into and mated with the through hole 210, the second surface 311 and an outer surface of the circuit board 200 facing away from the chip 100 are adhered by means of an adhesive, or are welded, so that the heat sink 300 is firmly connected with the circuit board 200, and the heat sink 300 is prevented from being detached from or falling off the circuit board 200.

For example, in the circuit board assembly provided in at least one embodiment of the present application, as shown in fig. 1-2, the through hole 210 is a rectangular hole, the insertion portion 320 is a boss 321 protruding from the second surface 311, the boss 321 is adapted to the through hole 210, the size of the boss 321 is slightly smaller than that of the through hole 210 so as to facilitate assembly, and the boss 321 is inserted into the through hole 210 and contacts the heat dissipation pad 111 so that the heat dissipation member 300 dissipates heat to the chip 100.

For example, in the circuit board assembly provided in at least one embodiment of the present application, as shown in fig. 3 to 4, the through hole 210 includes a plurality of rectangular holes, the insertion portion 320 includes a plurality of bosses 321 protruding from the second surface 311, the number of the bosses 321 is the same as that of the through holes 210, each boss 321 is adapted to each through hole 210, the plurality of bosses 321 corresponds to the plurality of through holes 210 one by one, and the bosses 321 are inserted into the corresponding through holes 210 and contact the heat dissipation pads 111, so that the heat dissipation member 300 dissipates heat to the chip 100.

For example, in the circuit board assembly provided in at least one embodiment of the present application, as shown in fig. 4 to 5, the through hole 210 includes a plurality of circular holes, the inserting portion 320 includes a plurality of protruding pillars 322 protruding from the second surface 311, the number of the protruding pillars 322 is the same as the number of the through holes 210, each of the protruding pillars 322 is matched with each of the through holes 210, the plurality of protruding pillars 322 corresponds to the plurality of through holes 210 one by one, and the protruding pillars 322 are inserted into the through holes 210 and contact the heat dissipation pad 111, so that the heat dissipation member 300 dissipates heat to the chip 100.

Wherein, the gaps between the insertion part 320 and the through hole 210, and between the insertion part 320 and the heat dissipation pad 111 are filled with heat conduction grease, heat generated by the chip 100 during operation is transferred to the heat conduction grease through the heat dissipation pad 111 at the bottom of the chip 100, and then transferred to the heat dissipation member 300 by the heat conduction grease, and the heat in the heat dissipation member 300 is dissipated to the surrounding environment by two ways of convection or radiation, so as to realize the effect of rapid heat dissipation of the chip 100, that is: the heat transfer of chip 100 in this application forms the heat conduction structure from heat dissipation pad 111 to heat conduction grease to heat sink 300 again, compares with the heat conduction structure that the heat of chip 100 was arrived circuit board 200 again to heat abstractor by heat dissipation pad 111 to heat conduction grease in the correlation technique, and the heat conduction mode of this application is more simple and convenient, and the heat conduction efficiency of this link of conduction by circuit board 200 is very low in the correlation technique, can seriously influence the radiating efficiency of chip 100.

The through holes 210 may be metalized holes or non-metalized holes, and are selected according to practical situations, and the application is not limited thereto.

For example, in a circuit board assembly provided in at least one embodiment of the present application, a solder joint is reserved around the through hole 210 to improve the grounding performance of the heat dissipation pad 111.

For example, in a circuit board assembly provided in at least one embodiment of the present disclosure, as shown in fig. 1, the main body 310 includes a base 313 connected to the inserting portion 320 and a plurality of heat dissipation fins 312 connected to one side of the base 313 away from the inserting portion 320 and arranged at intervals, heat of the chip 100 is conducted to the heat dissipation fins 312 through the inserting portion 320 and the main body 310 by conduction, and the heat dissipation fins 312 dissipate the heat by convection after absorbing the heat. In the process of convection heat dissipation, the heat dissipation area is determined by the surface area of the heat dissipation fins 312, the heat dissipation surface area of the heat dissipation member 300 can be increased by arranging a plurality of heat dissipation fins 312 arranged at intervals, and the larger the surface area is, the better the heat dissipation effect is.

This application only needs to increase the through-hole to the circuit board, add the boss on the radiating piece and can realize the quick heat dissipation to the chip, with the aluminum plate of milling processing of increase monoblock in the correlation technique, perhaps the manufacturing process of change circuit board and in the circuit board technique such as embedded copper piece compare in order to dispel the heat to the chip, this application has low cost, processing and equipment convenient advantage, see from the radiating efficiency and the effect that promote, this application has brought the big benefit through little change, and the maneuverability is strong, and is suitable for popularization.

Although embodiments of the present application have been disclosed for illustrative purposes, those skilled in the art will recognize that: various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.

Claims

1. A circuit board assembly, comprising:

a chip;

the chip is positioned on the circuit board and is electrically connected with the circuit board, a through hole is formed in the circuit board, and at least part of the through hole is positioned in an orthographic projection area of the chip on the circuit board; and

the heat dissipation piece comprises a main body part and an insertion part, wherein the main body part is positioned on one side, far away from the chip, of the circuit board, the insertion part is connected with the main body part, and the insertion part is in contact with the chip through the through hole so as to dissipate heat of the chip.

2. The circuit board assembly of claim 1, wherein the chip has a first surface facing the circuit board, a heat dissipation pad is disposed in a middle of the first surface, signal pins are disposed around the heat dissipation pad at an edge of the first surface, the chip is electrically connected to the circuit board through the signal pins, and the insertion part is in contact with the heat dissipation pad to conduct heat of the chip to the heat dissipation member via the heat dissipation pad.

3. The circuit board assembly of claim 2, wherein the through-hole is located in an orthographic projection area of the heat dissipation pad on the circuit board.

4. The circuit board assembly according to claim 3, wherein the main body portion has a second surface facing the circuit board, the insertion portion is located on the second surface and is inserted into the through hole, and the second surface is bonded or soldered to an outer surface of the circuit board facing away from the chip.

5. The circuit board assembly of claim 4, wherein the through hole is a rectangular hole, and the insertion portion includes a projection projecting from the second surface, the projection being inserted into the through hole and contacting the heat-dissipating pad to dissipate heat from the heat sink to the chip.

6. The circuit board assembly of claim 4, wherein the through-holes comprise rectangular holes, the insertion portions comprise bosses protruding from the second surface, the bosses are corresponding to the through-holes, and the bosses are inserted into the corresponding through-holes and contact the heat dissipation pads to dissipate heat from the heat dissipation member to the chip.

7. The circuit board assembly of claim 4, wherein the through holes include a plurality of circular holes, the insertion portion includes a plurality of protruding posts protruding from the second surface, the plurality of protruding posts are corresponding to the plurality of through holes, and the protruding posts are inserted into the corresponding through holes and contact the heat dissipation pads, so that the heat dissipation member dissipates heat from the chip.

8. A circuit board assembly according to any one of claims 2-7, wherein a heat conducting grease is filled in the gap between the plug part and the through hole and/or the plug part and the heat sink pad.

9. The circuit board assembly of claim 2, wherein solder joints are provided around the through-holes to improve grounding performance of the heat dissipating pads.

10. The circuit board assembly of claim 1, wherein the main body portion includes a base connected to the mating portion and a plurality of spaced apart heat sinks connected to a side of the base remote from the mating portion, the heat sinks configured to convectively dissipate heat conducted from the chip to the heat sinks via the mating portion and the main body portion.