JP2005109005A - Heat dissipation structure of module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the heat dissipation efficiency of a module 1. <P>SOLUTION: In the module 1 mounted on a mother board 6, a heating component 4H is arranged on the top face of a module substrate 2, and a via hole 10 for heat dissipation is formed in part of the module substrate 2, where the heating component 4H is arranged. On the mother board 6, an electrode 11 for heat dissipation is formed at least in part of the mother board 6, which is located opposite to the part of the module substrate 2 where the via hole 10 for heat dissipation is formed. There is a heat dissipation block 12, formed between the part of the module substrate 2 where the via hole 10 for heat dissipation is formed, and the electrode 11 for heat dissipation is formed on the mother board 6. The heat dissipation block 12 is thermally jointed to both the bottom of the module substrate 2, and the electrode 11 for heat dissipation is formed on the mother board 6. Consequently, a heat dissipation path for dissipating the heat, from the heating component 4H to the mother board 6 side can be established, and the entire part of the heat dissipation path is formed of a heat conductive material, resulting in improved the heat dissipation efficiency. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a heat dissipation structure for a module having a heat generating component.

  FIG. 10 schematically shows an example of the appearance of the module. The module 1 includes a module substrate 2 and terminals 3 attached to the module substrate 2. For example, an electrical circuit such as a switching power supply circuit is formed on the module substrate 2. That is, a component 4 such as a capacitor, an inductor, or a resistor constituting an electric circuit is provided on one or both of the front surface and the back surface of the module substrate 2, and the module substrate 2 has, for example, wiring for connecting the components. A conductor pattern (not shown) such as a pattern is formed. In this example, the module substrate 2 is a non-molded type that is not molded with resin, for example.

  The terminal 3 is connected to an edge portion of the substrate 2 and is formed to extend downward from the connection portion from the substrate 2. The module 3 is mounted on the mother board 6 with the module substrate 2 being placed on the upper side of the mother board 6 with a distance from the mother board 6 by joining the tip of the terminal 3 to the mother board 6, for example. In addition, at least one or more of the plurality of terminals 3 attached to the module substrate 2 is a function for electrically connecting the electric circuit formed on the module substrate 2 and the electric circuit of the motherboard 6. It has.

JP 2001-237353 A

  A module substrate 2 of the module 1 may be mounted with a heat generating component that generates heat when energized (for example, a semiconductor component such as a MOSFET or a diode). For example, when the temperature of the module substrate 2 or the temperature of components around the heat generating component rises to a high temperature due to the heat generated from the heat generating component, the operation of the component becomes abnormal due to the heat. There is a possibility that the electric circuit formed on the module substrate 2 may not operate normally.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a module heat dissipation structure that can efficiently dissipate heat from a heat-generating component.

  In order to achieve the above object, the present invention has the following configuration as means for solving the above problems. That is, the present invention provides a module heat dissipating structure that includes a module substrate provided with a heat generating component that generates heat when energized and is mounted on a motherboard. The module substrate of the module is a non-mold type, and the module The board is configured to be disposed above the mother board with a space from the mother board. A heat generating component is provided on the upper surface of the module board, and the module board portion on which the heat generating component is provided includes the module board. A heat dissipation via hole is formed to thermally connect the upper surface side and the bottom surface side, and a heat dissipation electrode is formed on the motherboard at least in a portion facing the module substrate portion where the heat dissipation via hole is formed. A module substrate portion on which the heat dissipation via hole is formed, and a mother board Between the heat dissipation electrode on the board, the heat dissipation block made of a heat conductive material is in direct contact with the bottom surface of the module substrate and the heat dissipation electrode on the motherboard, or the heat conductive material The heat of the heat generating component of the module board is dissipated to the motherboard side through the heat dissipation via hole and the heat dissipation block of the module board. It is characterized by that.

  Further, the present invention provides a module heat dissipation structure provided with a module board on which a heat generating component that generates heat when energized is provided, and the module board of the module is a non-mold type. The board is configured to be disposed above the mother board with a gap from the mother board. A heat generating component is provided on the back surface of the module board, and the heat generating component is positioned on the outer side along the back surface of the module board. An extended conductor pattern is formed, and on the motherboard, a heat radiation electrode is formed at least on a portion facing the conductor pattern extending from the position of the heat generating component. Between the heat dissipating electrode and the conductor pattern of the module substrate facing the heat dissipating electrode The heat dissipation block consisting of the heat dissipation electrode directly contacts the heat dissipation electrode on the motherboard and the conductor pattern of the module substrate opposed to the heat dissipation block, or heats via a bonding material made of a heat conductive material. The heat of the heat generating components of the module substrate is radiated to the motherboard side through the conductor pattern and the heat dissipation block of the module substrate.

  According to the present invention, the heat of the heat generating component formed on the surface of the module substrate is radiated to the motherboard side through the heat dissipation via hole and the heat dissipation block of the module substrate, and is also formed on the back surface of the module substrate. The heat generated from the heat generating component is radiated to the mother board through a conductive pattern and a heat radiating block extending from the position of the heat generating component. That is, in the present invention, the heat radiation path from the heat generating component to the motherboard side is all formed of a heat conductive material such as metal. For this reason, compared with the case where an insulating material or the like that is not a heat conduction material is interposed in the middle of the heat radiation path, the heat of the heat generating component can be efficiently transmitted to the motherboard side, and the heat radiation efficiency can be improved. Thereby, it becomes easy to suppress the temperature rise of the heat generating component and its peripheral components and the module substrate.

  Since the temperature rise of the heat generating component can be suppressed, the amount of current supplied to the heat generating component can be increased. In addition, it is possible to avoid heating the module substrate and the components and conductor patterns provided on the module substrate to a high temperature during the operation of the module, so that thermal deterioration of the components and conductor patterns can be suppressed. As a result, the life of the parts can be extended and the reliability of the module can be improved.

  Further, for example, in the manufacturing process, if the component is fixed to the module substrate and the heat dissipation block is also fixed to the module substrate, the heat dissipation block can be attached to the module substrate without increasing the manufacturing process. The module heat-dissipating structure of the present invention can be constructed by simply mounting the module to which such a heat-dissipating block is mounted on the motherboard as before.

  Furthermore, in addition to or instead of the heat dissipation electrode on the motherboard, a heat dissipation electrode is formed inside the motherboard, and the heat dissipation block and the heat dissipation electrode in the motherboard are heated. The following effects can be obtained by providing a heat radiating via hole for connection. That is, a plurality of components are mounted on the motherboard, and many conductor patterns for connecting the components are formed. When forming the heat dissipation electrode on the motherboard, the heat dissipation electrode is formed in a part other than the part or conductor pattern formation part, so the area of the part where the heat dissipation electrode can be formed is not wide. It was difficult to increase the area of the heat radiation electrode.

  On the other hand, since the inside of the mother board has fewer portions where the conductor pattern or the like is formed than the upper surface, the area of the portion where the heat radiation electrode can be formed is large. For this reason, the heat radiation electrode inside the mother board can be formed wider than the heat radiation electrode provided on the mother board. As a result, by forming the heat radiation electrode inside the motherboard wider than the heat radiation electrode on the motherboard, the heat radiation amount from the heat radiation electrode can be increased, and the heat radiation efficiency of the heat-generating component is further improved. be able to.

  Furthermore, since the surface area of the side peripheral surface of the heat dissipation block can be increased by providing irregularities on the side peripheral surface of the heat dissipation block, the amount of heat released from the side peripheral surface of the heat dissipation block can be increased. This also contributes to the improvement of the heat radiation efficiency of the heat-generating component.

  In addition, when the module board is configured to be electrically connected to the motherboard via block-shaped terminals, the same heat sink block as the block-shaped terminals can be used to share components. Can be planned. Thereby, reduction of component cost can be aimed at. In addition, since the block terminal for electrical connection and the heat dissipation block arranged between the motherboard and the module substrate are composed of the same thing, the height variation between the block terminal for electrical connection and the heat dissipation block can be reduced. As a result, it becomes easy to define (guarantee) the coplanarity between the block-like terminal for electrical connection and the heat dissipation block. Thereby, the inclination of the module substrate with respect to the mother board and mounting defects can be substantially avoided.

  Further, in the case where the heat generating component is bonded to the surface of the module substrate with a bonding material, a part of the bonding material protrudes from the heat radiating via hole and is on the lower side (motherboard side). May protrude. When such a case is assumed, a module is provided on the surface of the heat dissipation block on the module substrate side by providing a recess for accommodating the protruding portion of the bonding material protruding from the heat dissipation via hole. Even if there is a protruding part of the bonding material on the back side of the board, the entire surface of the module board side of the heat dissipation block can be brought into contact with the bottom surface of the module board or thermally connected via the bonding material It becomes. As a result, a problem caused by the protrusion (for example, only a part of the surface of the heat dissipation block on the module substrate side contacts the bottom surface of the module substrate, or only a part of the surface of the heat dissipation block on the module substrate side is used for bonding. It is possible to prevent the occurrence of problems such as a loss of heat dissipation efficiency due to the inability to thermally connect through the material.

  Furthermore, in what is provided with the structure where the heat generating component is provided on the surface of the module substrate, the heat dissipation block is provided with a protruding portion protruding upward from the surface on the module substrate side. Instead of forming the heat radiating via hole, the portion where the heat generating component is provided has a through hole through which the protruding portion of the heat radiating block penetrates from the top surface to the bottom surface. Since the tip of the protruding part of the heat dissipation block can be brought into direct contact with the heat generating component through the heat, the heat of the heat generating component is directly transmitted to the heat dissipation block, and the heat of the heat generating component passes through the heat dissipation via hole. It is possible to dissipate the heat of the heat-generating component more efficiently than being transmitted to the heat dissipation block.

  Embodiments according to the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic cross-sectional view showing a module heat dissipation structure according to the first embodiment. In the first embodiment, the module 1 includes a module substrate 2 as shown in FIG. 10 and a terminal 3 attached to the module substrate 2. In the first embodiment, the terminal 3 is made of a conductor plate. The terminal 3 is provided with a clip portion, and the clip portion allows the edge portion of the module substrate 2 to be formed from both the front and back sides of the module substrate 2. The terminals 3 are attached to the module substrate 2 by being sandwiched. The distal end side of the terminal 3 is formed to extend downward from the module substrate 2, and the distal end portion of the terminal 3 is connected to the mother board 6 by a bonding material 8 such as solder as shown in FIG. As a result, the module substrate 2 is disposed above the mother board 6 with a gap from the mother board 6. The terminal 3 thus has a function of mounting the module substrate 2 on the mother board 6 and also has a function of electrically connecting the module substrate 2 and the mother board 6. In addition, the code | symbol 7 in FIG. 1 has shown the electrode pad for terminal connection.

  The module substrate 2 is provided with components 4, conductor patterns, and the like, and an electric circuit such as a switching power supply circuit is formed. In the first embodiment, the heat generating component 4H that generates heat by energization among the plurality of components 4 constituting the electric circuit is formed on the upper surface of the module substrate 2. Specific examples of the heat generating component 4H include semiconductor components such as transistors, diodes, and ICs, transformers, and choke coils.

  Further, the module substrate 2 is provided with one or more heat dissipation via holes 10 that thermally connect the upper surface side and the bottom surface side of the module substrate 2 in the portion where the heat generating component 4H is formed. There are a case where a heat conductive material such as a metal is formed on the inner wall surface of the heat radiating via hole 10 and a case where a heat conductive material is filled and formed in the entire inside of the heat radiating via hole 10. Cases may be adopted. However, the amount of the heat conductive material provided in the heat radiating via hole 10 is larger when the heat conductive material is filled and formed than the structure in which the heat conductive material such as metal is formed on the inner wall surface. The heat conduction efficiency from the upper surface side to the bottom surface side of the substrate 2 can be improved.

  On the upper surface of the mother board 6, a heat radiation electrode 11 is formed at least at a portion facing the part of the module substrate 2 where the heat radiation via hole 10 is formed.

  A rectangular heat radiation block 12 is provided between the heat radiation electrode 11 on the mother board 6 and the part of the module substrate 2 where the heat radiation via hole 10 is formed. The heat dissipation block 12 is made of a heat conductive material such as metal (for example, copper). The entire surface (upper surface) of the heat dissipation block 12 on the module substrate 2 side is thermally bonded to the module substrate 2 via a bonding material 8 made of a heat conductive material such as solder. The entire surface (bottom surface) of the heat dissipation block 12 on the side of the mother board 6 is joined to the heat radiation electrode 11 via a joining material 8 made of a heat conductive material such as solder. Note that the bonding material 8 between the module substrate 2 and the heat dissipation block 12 is also bonded to the heat conductive material in the heat dissipation via hole 10.

  The module heat dissipation structure of the first embodiment is configured as described above. In this heat dissipation structure, the heat generating component 4H is thermally connected to the heat dissipation electrode 11 through the heat dissipation via hole 10, the bonding material 8, the heat dissipation block 12, and the bonding material 8 of the module substrate 2, and the heat generating component 4H. The heat dissipation path of the heat is configured. Thereby, the heat of the heat generating component 4H is radiated to the mother board 6 side through the heat radiation path. In the first embodiment, all of the heat radiation path from the heat generating component 4H to the mother board 6 side is made of a heat conductive material.

  By the way, for example, copper which is a heat conductive material has a thermal conductivity of 395 W / mK, and an epoxy resin which is an insulating material which is not a heat conductive material has a thermal conductivity of 0.2 W / mK. For example, if an insulating material such as epoxy resin is interposed on the heat dissipation path of the heat generating component 4H, it is difficult to improve the heat dissipation efficiency of the heat generating component 4H due to the poor thermal conductivity of the insulating material. On the other hand, in the first embodiment, all of the heat radiation path of the heat generating component 4H is composed of only a heat conductive material having a thermal conductivity about 1000 times higher than that of the insulating material. It is easy to increase the heat dissipation efficiency.

  In addition to the above configuration, as shown by the dotted line in FIG. 1, the heat radiation electrode 13 is provided inside the mother board 6, and the heat radiation electrode 11 on the mother board 6 and the heat radiation electrode 13 inside the mother board 6 are provided. A heat radiating via hole 14 may be provided for thermally connecting the two. Alternatively, when a ground electrode is formed inside the mother board 6, the ground electrode is configured to function as the heat radiating electrode 13, and the ground electrode (heat radiating electrode 13) and the heat radiating electrode on the mother board 6 are configured. A heat radiating via hole 14 may be provided for connecting to the heat sink 11. As described above, when the heat radiation electrode 13 is provided inside the mother board 6, the heat of the heat generating component 4 </ b> H is transferred to the heat radiation electrode 11 on the mother board 6 and then from the heat radiation electrode 11 to the heat radiation via hole 14. Then, the heat is transmitted to the heat radiation electrode 13 to be radiated. Since the heat radiation electrode 13 can have a larger area than the heat radiation electrode 11, by providing the heat radiation electrode 13 having a larger area, the heat radiation amount of the heat generating component 4H can be increased. The heat radiation efficiency of the heat generating component 4H can be improved.

  Further, when it is difficult to form a wide heat radiation electrode 11 on the mother board 6 due to problems such as the formation position of the conductor pattern, for example, the heat radiation electrode 11 on the mother board 6 is omitted and only the inside of the mother board 6 is omitted. Alternatively, the heat radiation electrode 13 may be formed.

  Hereinafter, an example of the manufacturing process of the module heat dissipation structure of the first embodiment will be described with reference to FIG. For example, a mother board 6 as shown in FIG. On the mother board 6, the heat radiation electrode 11 is formed at least in a portion facing the module substrate 2 portion on which the heat generating component 4H is formed, and a bonding material is provided above the heat radiation electrode 11. 8 is formed.

  Then, the module 1 as shown in FIG. 2B is conveyed toward the mother board 6. A heat generating component 4H is mounted on the upper surface of the module substrate 2 of the module 1, and a heat dissipation via hole 10 is formed in the module substrate 2 portion on which the heat generating component 4H is mounted. Further, a heat dissipation block 12 is fixed by a bonding material 8 at a portion where a heat dissipation via hole 10 is formed on the back surface of the module substrate 2.

  As shown in FIG. 2C, each terminal 3 of the module 1 is connected to the bonding material 8 at a predetermined set position on the mother board 6, and the bottom surface of the heat dissipation block 12 is bonded. The module 1 is aligned and placed on the mother board 6 so as to be connected to the heat radiation electrode 11 through the material 8. Thereafter, the mother board 6 on which the module 1 is placed is passed through a reflow furnace. As a result, the bonding material 8 is melted, the tip of the terminal 3 is bonded to the electrode pad 7 on the mother board 6 by the bonding material 8, and the module 1 is mounted on the mother board 6. The heat dissipation electrode 11 on the mother board 6 is bonded by the bonding material 8. In this manner, the module heat dissipation structure of the first embodiment can be constructed.

  The second embodiment will be described below. In the description of the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and duplicate descriptions of common portions are omitted.

  The second embodiment is characterized by the shape of the heat dissipation block 12, and the other configuration is the same as that of the first embodiment.

  By the way, for example, when the module substrate 2 is passed through a reflow furnace in order to mount the heat generating component 4H on the module substrate 2 using the bonding material 8 such as solder, the bonding material 8 is melted. Since the heat radiating via hole 10 is formed in the module substrate 2 portion where the heat generating component 4H is provided, a part of the bonding material 8 melted in the reflow furnace passes through the heat radiating via hole 10 and the bottom side of the module substrate 2 May erode downward from the top. Thereafter, cooling is performed in that state, and a protruding portion 18 made of a bonding material protruding downward from the heat dissipation via hole 10 may be formed as shown in the model diagram of FIG.

  If there is such a protrusion 18, the upper surface of the heat dissipation block 12 cannot be brought into close contact with the bottom surface of the module substrate 2, which causes a problem that the heat dissipation efficiency of the heat generating component 4 </ b> H decreases. In addition, when the heat dissipation block 12 is fixed to the module substrate 2 with such a gap between the module substrate 2 and the heat dissipation block 12, the bottom surface of the heat dissipation block 12 is positioned at the terminal 3. When the module 1 is placed on the mother board 6 when protruding from the tip position, the tip portion of the terminal 3 is in a floating state, and the tip portion of the terminal 3 is connected to the bonding material 8 (electrode) to be connected. There arises a problem that the pad 7) cannot be connected. Furthermore, if the heat dissipation block 12 is tilted and fixed with respect to the module substrate 2 by the protrusions 18, the module substrate 2 is inclined with respect to the mother board 6 due to the inclined heat dissipation block 12. There is a fear.

  In the second embodiment, in order to prevent such a problem, as shown in the schematic cross-sectional view of FIG. A recess 20 is formed that can accommodate the protrusion 18 made of a bonding material protruding from the via hole 10. By accommodating the protrusion 18 in the recess 20, it is possible to suppress various problems caused by the protrusion 18 as described above.

  The third embodiment will be described below. In the description of the third embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and overlapping description of common portions is omitted.

  In the third embodiment, as shown in the schematic cross-sectional view of FIG. 4, the module substrate 2 is provided with a heat dissipation component 4H in place of the heat dissipation via hole 10 instead of providing the heat dissipation via hole 10 on the upper surface side. A through-hole 22 penetrating from the bottom to the bottom side is formed. A protrusion 12 a that protrudes upward is formed on the module substrate side surface of the heat dissipation block 12. The protruding portion 12a is inserted into the through hole 22 of the module substrate 2, and the tip end portion of the protruding portion 12a is in direct contact with the heat generating component 4H.

  The configuration other than the above configuration is the same as that of the first embodiment. In the third embodiment, the heat dissipation block 12 directly contacts the heat generating component 4H, so that the heat dissipation efficiency from the heat generating component 4H to the heat dissipation block 12 can be further improved.

  The fourth embodiment will be described below. In the description of the fourth embodiment, the same components as those in the first to third embodiments are denoted by the same reference numerals, and duplicate descriptions of the common portions are omitted.

  In the fourth embodiment, an example of a structure for radiating the heat of the heat generating component 4H provided on the back surface of the module substrate 2 to the mother board 6 side will be described. That is, in the module heat dissipation structure of the fourth embodiment, as shown in FIG. 5A, the heat generating component 4H is provided on the back surface of the module substrate 2 via the conductor pattern 24. 24 extends outward from the position of the heat generating component 4 </ b> H along the back surface of the module substrate 2. On the mother board 6, the heat radiation electrode 11 is formed at least at a portion facing the conductor pattern 24 extending from the position of the heat generating component 4H. Between the heat radiation electrode 11 on the mother board 6 and the conductor pattern 24 of the module substrate 2 facing the heat radiation electrode 12, the heat radiation block 12 applies the bonding material 8 to both the heat radiation electrode 11 and the conductor pattern 24. It is provided in the form of being thermally joined. Thereby, the heat of the heat generating component 4 </ b> H formed on the back surface of the module substrate 2 can be radiated to the heat radiation electrode 11 on the mother board 6 through the conductor pattern 24 and the heat radiation block 12.

  5 (b) and 5 (c), an example of the conductive pattern 24 for thermally connecting the heat generating component 4H on the back surface of the module substrate 2 and the heat dissipation block 11 is seen from the mother board 6 side. Shown in state. Reference numerals 25 a and 25 b shown in FIGS. 5B and 5C respectively indicate electrode pads for connecting heat-generating components formed on the back surface of the module substrate 2. The heat generating component 4H is disposed so as to span the electrode pads 25a and 25b, and is bonded to the electrode pads 25a and 25b via the bonding material 8. In this manner, the heat generating component 4H is bonded to the electrode pads 25a and 25b, so that the heat generating component 4H is fixed to the module substrate 2 and the wiring pattern (conductor pattern) 26 connected to the electrode pads 25a and 25b. Is electrically incorporated into an electric circuit formed on the module substrate 2.

  In the example of FIG. 5B, the conductor pattern 27 is formed so as to extend outward from the gap between the electrode pads 25a and 25b. In this conductor pattern 27, a portion 27b disposed between the electrode pads 25a and 25b is a portion that is thermally bonded to the heat generating component 4H via the bonding material 8. Further, for example, a portion 27 a surrounded by a dotted line in FIG. 5B that extends from the gap between the electrode pads 25 a and 25 b is a portion that is thermally bonded to the heat dissipation block 12 via the bonding material 8. That is, in the example of FIG. 5B, the conductor pattern 27 functions as the conductor pattern 24 for thermally connecting the heat generating component 4H and the heat dissipation block 12. The conductor pattern 24 is a conductor pattern that is not connected to the electric circuit.

  In the example of FIG. 5B, the heat of the heat generating component 4H is radiated to the mother board 6 side through the portions 27b and 27a of the conductor pattern 27 and the heat dissipation block 12 in order. The conductor pattern portion 27 a that is thermally bonded to the heat dissipation block 12 has an area corresponding to the area of the upper surface of the heat dissipation block 12.

  In the example of FIG. 5C, a part 26 a of the wiring pattern 26 connected to the electrode pad 25 a has an area corresponding to the area of the upper surface of the heat dissipation block 12, and the part 26 a is interposed via the bonding material 8. It becomes a part thermally joined to the heat dissipation block 12. That is, in the example of FIG. 5C, the electrode pad 25 a and the wiring pattern 26 constitute a conductor pattern 24 for thermally connecting the heat generating component 4 </ b> H and the heat dissipation block 12. In this example, the heat of the heat generating component 4H is radiated to the mother board 6 side through the electrode pad 25a, the wiring pattern 26, and the heat dissipation block 12 in order.

  There is a coil component integrated with the module substrate 2. This coil component has, for example, a coil pattern provided at the same formation position on a plurality of layers of the module substrate 2 formed of a multilayer structure substrate. In order to dissipate the heat of such coil parts, a heat dissipating structure as shown below can be adopted. For example, a coil pattern 28 as shown in FIG. 6 constituting the coil component is formed on the back surface of the module substrate 2, and a wiring pattern 29 connected to the coil pattern 28 is disposed outside the coil component formation position. It is formed into an extension. On the mother board 6, the heat radiation electrode 11 is provided at least in a portion facing the portion 29 a outside the coil component in the wiring pattern 29. The heat radiation block 12 is interposed between the heat radiation electrode 11 and the wiring pattern portion 29a facing the heat radiation electrode 11. The heat dissipation block 12 is thermally bonded to both the wiring pattern portion 29 a and the mother board 6. In this case, the coil pattern 28 and the wiring pattern 29 function as a conductor pattern 24 for thermally connecting the coil component and the heat dissipation block 12.

  In the heat dissipation structure shown here, the heat of the coil component is radiated from the coil pattern 28 to the mother board 6 side through the wiring pattern 29 and the heat dissipation block 12. Also in this case, since the entire heat dissipation path from the coil component to the mother board 6 is made of the heat conductive material, the heat of the coil component can be efficiently radiated.

  The fifth embodiment will be described below. In the description of the fifth embodiment, the same components as those in the first to fourth embodiments are denoted by the same reference numerals, and duplicate descriptions of the common portions are omitted.

  In the fifth embodiment, the heat dissipating block 12 has a form in which irregularities are formed on the side peripheral surface thereof. In the fifth embodiment, the configuration other than the form of the heat dissipation block 12 is the same as that of the first to fourth embodiments.

  Various forms can be considered as the form in which the unevenness is formed on the side peripheral surface of the heat dissipating block 12. Here, although not particularly limited, specific examples are shown in FIGS. 7 and 8, respectively. Has been. In the example of FIG. 7, the heat dissipation block 12 has a configuration in which a plurality of grooves (concave portions) 16 extending from the upper surface side to the bottom surface side are formed on the side peripheral surface. In the example of Fig.8 (a), the thermal radiation block 12 has comprised the recessed part 17 which circulates the side surrounding surface. FIG. 8B is a cross-sectional view taken along the line aa in FIG.

  In the fifth embodiment, since the surface area of the side peripheral surface of the heat dissipation block 12 is increased by forming irregularities on the side peripheral surface of the heat dissipation block 12, the amount of heat dissipation from the heat dissipation block 12 to the outside, for example, air. Can be increased. Thereby, the heat radiation efficiency of the heat generating component 4H can be further improved.

  The sixth embodiment will be described below. In the description of the sixth embodiment, the same components as those in the first to fifth embodiments are denoted by the same reference numerals, and duplicate descriptions of the common portions are omitted.

  In each of the first to fifth embodiments, the terminal 3 is plate-shaped, but in the sixth embodiment, the schematic cross-sectional views of FIGS. 9A and 9B are shown. As described above, the terminal 3 is a block-shaped terminal. The heat dissipation block 12 is composed of the same block-shaped terminals 3. Configurations other than the terminal 3 and the heat dissipation block 12 are the same as those in the first to fifth embodiments. FIG. 9A shows a configuration unique to the sixth embodiment, which has the configuration shown in the first embodiment for dissipating the heat of the heat generating component 4H formed on the surface of the module substrate 2. It is an example at the time of applying a structure. FIG. 9B shows a characteristic of the sixth embodiment, which has the configuration shown in the fourth embodiment for dissipating the heat of the heat generating component 4H formed on the back surface of the module substrate 2. It is an example at the time of applying a structure.

  In the sixth embodiment, by configuring the terminal 3 and the heat dissipation block 12 with the same components, the components can be shared, and the cost of the components can be reduced.

  In addition, this invention is not limited to the form of each 1st-6th embodiment, Various embodiments can be taken. For example, in the case where the heat of the heat generating component 4H provided on the surface of the module substrate 2 is dissipated, in the example of FIGS. 1 and 3, the module substrate 2 portion where the heat generating component 4H is provided Although a plurality of heat dissipation via holes 10 are formed for one heat generating component 4H, the number of heat dissipation via holes 10 formed in the module substrate 2 portion where the heat generating components 4H are provided is as follows. It is set as appropriate in consideration of the size of the heat generating component 4H, the size of the heat dissipation via hole 10, and the like, and the numerical value is not limited.

  Further, when a plurality of heat generating components 4H are formed on the module substrate 2, the heat radiation block 12 is not disposed corresponding to all of the heat generating components 4H, but the most heat generating component among all the heat generating components 4H. The heat dissipating block 12 may be arranged corresponding to only the specified heat generating component 4H including at least the large amount of heat generating component 4H.

  Further, in each of the first to sixth embodiments, the bottom surface of the heat dissipation block 12 is bonded to the heat dissipation electrode 11 on the mother board 6 via the bonding material 8. Can be manufactured with high accuracy so that the height can be substantially set, the bottom surface of the heat dissipation block 12 is directly connected to the heat dissipation electrode 11 on the mother board 6 without using the bonding material 8. It is good also as a structure to contact | abut.

  Furthermore, although the example which fixed the module 1 and the thermal radiation block 12 to the motherboard 6 through the process of letting the module 1 and the thermal radiation block 12 pass through a reflow furnace was shown, of course, the module 1 and the thermal radiation block 12 do not use a reflow furnace. In addition, it may be fixed to the mother board 6 by other means.

  Further, in each of the first to sixth embodiments, the heat dissipation block 12 has a rectangular parallelepiped shape, but may be, for example, a columnar shape, a triangular prism shape, or a pentagonal shape or more. The shape is not limited as long as it is a block shape.

It is typical sectional drawing for demonstrating the thermal radiation structure of the module of 1st Embodiment. It is a figure for demonstrating an example of the manufacturing process of the thermal radiation structure of the module of 1st Embodiment. It is typical sectional drawing for demonstrating one example of a heat dissipation block characteristic in 2nd Embodiment. It is a model figure which shows the example of 1 form of the thermal radiation block in 3rd Embodiment. It is a figure for demonstrating the thermal radiation structure of the module of the example of 4th Embodiment. It is a figure for demonstrating one example of the heat dissipation structure of the coil components integrally formed with the module board. It is a model figure which shows one example of a heat dissipation block characteristic in the example of 5th Embodiment. It is a model figure which shows another example of 1 form of the thermal radiation block provided with the characteristic structure in the example of 5th Embodiment. It is typical sectional drawing for demonstrating the thermal radiation structure of the module of the example of 6th Embodiment. It is a model figure for demonstrating an example of a module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Module 2 Module board | substrate 3 Terminal 4H Heat-emitting component 6 Mother board 8 Joining material 10, 14 Heat radiating via hole 11, 13 Heat radiating electrode 12 Heat radiating block 20 Concavity 22 Through-hole 24 Conductor pattern

Claims (7)

  In a heat dissipation structure of a module that is mounted on a motherboard with a module board on which a heat generating component that generates heat when energized is provided, the module board of the module is a non-mold type, and the module board is above the motherboard The heat generating component is provided on the top surface of the module substrate, and the module substrate portion on which the heat generating component is provided has a top surface side and a bottom surface side of the module substrate. A heat dissipation via hole is formed to thermally connect the heat dissipation electrode, and a heat dissipation electrode is formed on the motherboard at least in a portion facing the module substrate portion where the heat dissipation via hole is formed. Module board part with via holes for heat dissipation, and heat dissipation electrode on motherboard In between, the heat dissipation block made of a heat conductive material is in direct contact with each of the bottom surface of the module board and the heat dissipation electrode on the motherboard, or through a bonding material made of a heat conductive material. The heat generating component of the module board is dissipated to the motherboard side through the heat dissipation via hole and the heat dissipation block of the module board. Heat dissipation structure.   The heat-generating component is bonded to the module substrate by a bonding material made of a heat conductive material, and a part of the bonding material protrudes below the module substrate through the heat dissipation via hole of the module substrate. The surface of the heat dissipation block on the module substrate side is provided with a recess for accommodating the protruding portion of the bonding material protruding downward from the heat dissipation via hole. The heat dissipation structure for a module according to claim 1.   The heat dissipation block has a configuration in which a protrusion protruding upward from the surface on the module substrate side is provided, and the module substrate portion provided with the heat generating component is replaced with a heat dissipation via hole instead of the heat dissipation via hole. The through hole from the top surface to the bottom surface through which the protrusion of the heat dissipation block is inserted is provided, and the tip of the protrusion of the heat dissipation block is in direct contact with the heat generating component through the through hole. A heat dissipation structure for a module according to claim 1.   In a heat dissipation structure of a module that is mounted on a motherboard with a module board on which a heat generating component that generates heat when energized is provided, the module board of the module is a non-mold type, and the module board is above the motherboard A heat generating component is provided on the back surface of the module substrate, and a conductor extending from the position of the heat generating component to the outside of the module substrate along the back surface of the module substrate. A pattern is formed, and on the motherboard, a heat radiation electrode is formed at least in a portion facing the conductor pattern extending from the position of the heat generating component, and the heat radiation electrode on the motherboard, A heat dissipation block made of a heat conductive material is provided between the conductive pattern of the module substrate facing the module. Directly contact each of the heat radiation electrode on the motherboard and the conductor pattern of the module substrate opposite to the electrode, or thermally bond via a bonding material made of a heat conductive material. A heat dissipation structure for a module, wherein the heat of a heat generating component of the module substrate is dissipated to the motherboard side through a conductor pattern and a heat dissipation block of the module substrate.   In addition to the heat dissipation electrode on the motherboard or in place of the heat dissipation electrode on the motherboard, a heat dissipation electrode is provided inside the motherboard. The motherboard has a heat dissipation electrode, a heat dissipation block, The heat dissipation structure for a module according to any one of claims 1 to 4, characterized in that a heat dissipation via hole for thermally connecting the heat dissipation holes is formed.   6. The heat treatment block according to claim 1, wherein unevenness is provided on a side peripheral surface of the heat dissipation block to increase a surface area, and an amount of heat dissipation from the side peripheral surface of the heat dissipation block is increased. The heat dissipation structure of the module described in 1.   7. The module substrate is configured to be electrically connected to a mother board through block-shaped terminals, and the same heat dissipation block as the block-shaped terminals is used. The heat dissipation structure of the module as described in any one of these.

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