CN207219146U - Heat abstractor for heat dissipation for circuit board - Google Patents
Heat abstractor for heat dissipation for circuit board Download PDFInfo
- Publication number
- CN207219146U CN207219146U CN201720991742.4U CN201720991742U CN207219146U CN 207219146 U CN207219146 U CN 207219146U CN 201720991742 U CN201720991742 U CN 201720991742U CN 207219146 U CN207219146 U CN 207219146U
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- CN
- China
- Prior art keywords
- heat
- circuit board
- fin
- fixed seat
- abstractor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a kind of heat abstractor for heat dissipation for circuit board.The circuit board includes at least one heating element；The heat abstractor includes fixed seat, fin, heat transfer structure and screw or/and bolt, the fixed seat is formed with an opening, the fin is fixed in the fixed seat and covers the opening, the heat transfer structure fits in the fin, and the screw or/and bolt are through the circuit board and are locked in the fixed seat to cause side of the heat transfer structure away from the fin to be bonded with the heating element.Compared with correlation technique, heat abstractor of the present utility model can effectively reduce the operating temperature of the heating element on the circuit board.
Description
Technical field
Radiator structure field is the utility model is related to, specifically, being related to a kind of heat abstractor for heat dissipation for circuit board.
Background technology
With the progress developed rapidly with microelectric technique of the high frequency of electronic device, high speed and integrated circuit technique,
The power density of electronic component increases substantially, and the physical structure of pcb board is less and less, and heat flow density increases therewith
Add, so the temperature environment in high temperature will necessarily influence the service behaviour of electronic component, this requires to enter electronic component
Row increases efficient thermal control, therefore, the effective heat dissipation problem for solving electronic component turned into Current electronic component and
The key technology of electronic equipment manufacturing.
Pcb board is also known as printed circuit board (PCB), is the supplier of electronic component electrical connection, the conventional one kind of PCB plates is with glass
The insulated part of fiber, not fabric material and resin composition, then suppressed with epoxy resin and copper foil and to form " bonding plate " use,
And certain size is cut into, at least have a conductive pattern thereon, and hole (such as component hole, fastener hole, plated through-hole) is furnished with,
For replacing the chassis of conventional device electronic component, and realize the interconnection between electronic component.Because this plate is
Made using electron printing, therefore be referred to as " printing " circuit board；According to the wiring board number of plies can be divided into single sided board, dual platen,
Four laminates, six laminates and other multilayer circuit boards.Due to substantial amounts of electronic component can be installed on pcb board, so with
The work of pcb board, electronic component will produce substantial amounts of heat, and highly integrated circuit structure can cause to radiating on pcb board
Very big influence.
Therefore, it is necessary to a kind of heat abstractor is provided to solve the above problems.
Utility model content
In order to solve the above-mentioned technical problem, the utility model provides a kind of heat abstractor for heat dissipation for circuit board, and this dissipates
Thermal can effectively reduce the operating temperature of the heating element on circuit board.
The technical solution of the utility model is as follows：
A kind of heat abstractor for heat dissipation for circuit board, for being carried out to the circuit board including at least one heating element
Radiating, the heat abstractor for heat dissipation for circuit board include：
Fixed seat, formed with an opening；
Fin, it is fixed in the fixed seat and covers the opening；
Heat transfer structure, fit in the fin；
Screw or/bolt, through the circuit board and it is locked in the fixed seat to cause the heat transfer structure remote
The side of the fin is bonded with the heating element.
Preferably, the heat transfer structure is made up of heat-conducting substrate.
Preferably, the heat transfer structure includes the heat-conducting substrate fitted on the fin and located at the heat-conducting substrate
Heat conductive pad away from the fin side, the heat conductive pad and the board dielectric.
Preferably, the heat conductive pad is silicagel pad.
Preferably, the fin, the fixed seat and the heat-conducting substrate are made up of aluminium alloy.
Preferably, the fin and the fixed seat are made up of aluminium alloy, and the heat-conducting substrate is made from a material that be thermally conductive.
Preferably, the fin is radiating fin.
Preferably, in addition to for the fixed seat mounting bar fixed, the mounting bar are fixedly arranged on the fixed seat
Two opposite ends.
Compared with correlation technique, the heat abstractor provided by the utility model for heat dissipation for circuit board at least has and had as follows
Beneficial effect：By the heat transfer structure respectively with the larger heating element that generated heat on the fin and the circuit board
Fitting, make it that heat is passed by the heat transfer structure and the fin caused by the heating element, so as to
The operating temperature of the heating element on the circuit board can effectively be reduced.
Brief description of the drawings
, below will be to needed for embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
The accompanying drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some realities of the present utility model
Example is applied, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to these accompanying drawings
Other accompanying drawings are obtained, wherein：
Fig. 1 is the structural representation for the heat abstractor that the utility model is used for heat dissipation for circuit board.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only part of the embodiment of the present utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The all other embodiment obtained, belong to the scope of the utility model protection.
Fig. 1 is refer to, the structural representation of the heat abstractor of heat dissipation for circuit board is used for for the utility model.It is described to be used for electricity
The heat abstractor 100 of road plate radiating radiates for circuit board 200, and the circuit board 200 includes at least one heating element
201, the heat abstractor 100 for heat dissipation for circuit board include fixed seat 1, fin 3, heat transfer structure 5 and screw or/and
Bolt 7, the fixed seat 1 are fixed in the fixed seat 1 formed with an opening, the fin 3 and cover the opening,
The heat transfer structure 5 fits in the fin 3, and the screw or/and bolt 7 are through the circuit board 200 and are locked in institute
State in fixed seat 1 with so that side of the heat transfer structure 2 away from the fin 3 is bonded with the heating element 201.Its
In, the part that the screw or/bolt 7 are embedded at the circuit board 200 is made of conductive material, exposes to the circuit board
Part outside 200, which is adopted, to be made from an insulative material.As a preferred embodiment of the present utility model, the fin 3 is radiating
Fin.Due to the heat transfer structure 5 respectively with generate heat larger on the fin 3 and the circuit board 200 the heating member
Device 201 is bonded, make it that heat is passed by the heat transfer structure 5 and the fin 3 caused by the heating element 201
Pass away, so as to effectively reduce the operating temperature of the heating element 201 on the circuit board 200.
It should be noted that the heat transfer structure 5 and the quantity of the screw or/and bolt 7 can be according to actual need
Set, the present embodiment is not construed as limiting to this.That is, the heat transfer structure 5 and the heating on the circuit board 200
The quantity of component 201 is identical, and the quantity and set location of the screw or/and bolt 7 need to make the heat transfer structure 5 one by one
It is corresponding to fit on the heating element 201.
The heat transfer structure 5 includes the heat-conducting substrate 51 fitted on the fin 3 and located at the heat-conducting substrate 51
Heat conductive pad 53 away from the side of fin 3, the heat conductive pad 53 insulate with the circuit board 200.As the utility model
One embodiment, the heat conductive pad 53 is silicagel pad.
In the present embodiment, the fin 3, the fixed seat 1 and the heat-conducting substrate 51 are made up of aluminium alloy, from
And the weight of the heat abstractor 100 for heat dissipation for circuit board can be mitigated and reduced to the fin 3, the fixation
The requirement of the mould of seat 1 and the heat-conducting substrate 51.Because the heat-conducting substrate 51 is metal material, its directly with it is above-mentioned
Heating element 201 contacts, and is easily caused the damage of the heating element 201, therefore, in the heat-conducting substrate 51 and the hair
Increase the heat conductive pad 53 among hot component 201, you can prevent the heating element 201 from being connect with the heat-conducting substrate 51
It is damaged when tactile, heat transfer of the heating element 201 to the heat transfer structure 5 can be increased again.
It is appreciated that in other embodiments, the heat transfer structure 5 only can be made up of the heat-conducting substrate 51, enter one
Step ground, in order to be damaged when preventing the heating element 201 from being contacted with the heat-conducting substrate 51, the heat-conducting substrate 51 is by leading
Hot material is made, and such as can be the ceramic substrate for having good pyroconductivity.
As one embodiment of the present utility model, the heat abstractor 100 for heat dissipation for circuit board also includes being used for
The mounting bar 9 that the fixed seat 1 is fixed, the mounting bar 9 are fixedly arranged on two opposite ends of the fixed seat 1.Pass through the installation
The heat abstractor 10 is fixed bar 9 with cabinet, can prevent under vibrating conditions to described on the circuit board 200
Heating element 201 causes to damage.
Heat abstractor provided by the utility model for heat dissipation for circuit board at least has the advantages that：By described
Heat transfer structure 5 is bonded with the larger heating element 201 that generated heat on the fin 3 and the circuit board 200 respectively,
Make it that heat is passed by the heat transfer structure 5 and the fin 3 caused by the heating element 201, so as to
The operating temperature of the heating element 201 on the circuit board 200 can effectively be reduced.
More than, only it is preferred embodiment of the present utility model, not makees any formal limit to the utility model
System, although the utility model is disclosed above with preferred embodiment, but is not limited to the utility model, any to be familiar with sheet
Technical professional, do not departing from the range of technical solutions of the utility model, when the technology contents work using the disclosure above
Go out a little change or be modified to the equivalent embodiments of equivalent variations, as long as be without departing from the content of the technical scheme of the utility model, according to
Any simple modification, equivalent change and modification made according to the technical essence of the utility model to above example, still falls within
In the range of technical solutions of the utility model.
Claims (8)
- A kind of 1. heat abstractor for heat dissipation for circuit board, for being dissipated to the circuit board including at least one heating element Heat, it is characterised in that the heat abstractor for heat dissipation for circuit board includes：Fixed seat, formed with an opening；Fin, it is fixed in the fixed seat and covers the opening；Heat transfer structure, fit in the fin；Screw or/bolt, through the circuit board and it is locked in the fixed seat to cause the heat transfer structure away from described The side of fin is bonded with the heating element.
- 2. it is used for the heat abstractor of heat dissipation for circuit board as claimed in claim 1, it is characterised in that the heat transfer structure is by heat conduction base Plate is formed.
- 3. it is used for the heat abstractor of heat dissipation for circuit board as claimed in claim 1, it is characterised in that the heat transfer structure includes fitting In the heat-conducting substrate on the fin and located at heat conductive pad of the heat-conducting substrate away from the fin side, the heat conduction Pad and the board dielectric.
- 4. it is used for the heat abstractor of heat dissipation for circuit board as claimed in claim 3, it is characterised in that the heat conductive pad is silicagel pad.
- 5. it is used for the heat abstractor of heat dissipation for circuit board as described in Claims 2 or 3 or 4, it is characterised in that the fin, institute State fixed seat and the heat-conducting substrate is made up of aluminium alloy.
- 6. it is used for the heat abstractor of heat dissipation for circuit board as claimed in claim 2, it is characterised in that the fin and the fixation Seat is made up of aluminium alloy, and the heat-conducting substrate is made from a material that be thermally conductive.
- 7. it is used for the heat abstractor of heat dissipation for circuit board as claimed in claim 1, it is characterised in that the fin is heat radiating fin Piece.
- 8. it is used for the heat abstractor of heat dissipation for circuit board as claimed in claim 1, it is characterised in that also include being used for the fixed seat Fixed mounting bar, the mounting bar are fixedly arranged on two opposite ends of the fixed seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720991742.4U CN207219146U (en) | 2017-08-09 | 2017-08-09 | Heat abstractor for heat dissipation for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720991742.4U CN207219146U (en) | 2017-08-09 | 2017-08-09 | Heat abstractor for heat dissipation for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207219146U true CN207219146U (en) | 2018-04-10 |
Family
ID=61818166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720991742.4U Expired - Fee Related CN207219146U (en) | 2017-08-09 | 2017-08-09 | Heat abstractor for heat dissipation for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207219146U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109588023A (en) * | 2018-12-30 | 2019-04-05 | 西安华为技术有限公司 | Radiator structure and relevant device |
| CN113950223A (en) * | 2021-09-17 | 2022-01-18 | 杭州电子科技大学 | Heat dissipation end cover under airtight space |
| CN114126329A (en) * | 2020-08-31 | 2022-03-01 | 华为技术有限公司 | Heat dissipation assembly and automobile |
| CN116709725A (en) * | 2023-04-19 | 2023-09-05 | 东莞市万亨达热传科技有限公司 | High-density composite radiator |
-
2017
- 2017-08-09 CN CN201720991742.4U patent/CN207219146U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109588023A (en) * | 2018-12-30 | 2019-04-05 | 西安华为技术有限公司 | Radiator structure and relevant device |
| CN109588023B (en) * | 2018-12-30 | 2020-10-09 | 西安华为技术有限公司 | Heat dissipation structure and related equipment |
| CN114126329A (en) * | 2020-08-31 | 2022-03-01 | 华为技术有限公司 | Heat dissipation assembly and automobile |
| WO2022042091A1 (en) * | 2020-08-31 | 2022-03-03 | 华为技术有限公司 | Heat dissipating assembly and automobile |
| CN113950223A (en) * | 2021-09-17 | 2022-01-18 | 杭州电子科技大学 | Heat dissipation end cover under airtight space |
| CN116709725A (en) * | 2023-04-19 | 2023-09-05 | 东莞市万亨达热传科技有限公司 | High-density composite radiator |
| CN116709725B (en) * | 2023-04-19 | 2024-02-06 | 东莞市万亨达热传科技有限公司 | High-density composite radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180410 Termination date: 20190809 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |