CN207884962U - A kind of high heat conduction printed circuit board - Google Patents
A kind of high heat conduction printed circuit board Download PDFInfo
- Publication number
- CN207884962U CN207884962U CN201721854578.9U CN201721854578U CN207884962U CN 207884962 U CN207884962 U CN 207884962U CN 201721854578 U CN201721854578 U CN 201721854578U CN 207884962 U CN207884962 U CN 207884962U
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- China
- Prior art keywords
- layer
- heat
- printed circuit
- heat dissipating
- circuit board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of high heat conduction printed circuit boards, including board layer, thermally conductive insulating layer and the metal back layer from top to bottom set gradually, the positioning table for holding electronic component welding is provided on the board layer, the metal back layer lower surface is covered with heat-conducting glue layer, the lower surface of the heat-conducting glue layer is covered with heat dissipating layer, and the lower surface of the heat dissipating layer is provided with several radiating fins；It is also covered with the metal back layer of perfect heat-dissipating on board layer, heat dissipating layer is additionally provided with below metal back layer, heat dissipating layer is equipped with several radiating fins increased with air contact area so that heat dissipation effect is more preferable.
Description
Technical field
The utility model is related to printed-board technology field more particularly to a kind of high heat conduction printed circuit boards.
Background technology
Printed circuit board (Printed Circuit Board, PCB) is one of important component of electronics industry.PCB can be
Electronic component provides fixed, assembly mechanical support, it can be achieved that electrical connection between electronic component.Almost each electronics is set
It is standby, it is small to electronic watch, calculator, computer, communication electronic device, military issue weapons system are arrived greatly, as long as there is integrated circuit etc.
Electronic component will use for the electric interconnection between them and arrive printed circuit board.
With the development of integrated technology and microelectronic packaging technology, the overall power density of electronic component constantly increases, and
The physical size of electronic component and electronic equipment is but gradually intended to small-sized, micromation, and generated heat is accumulated rapidly, led
The heat flow density around integrated device is caused also to increase, hot environment is huge on the influence of the performance of electronic component and equipment, this
With regard to needing more efficient thermal control scheme.Therefore, the heat dissipation problem of electronic component has evolved into as Current electronic component
With a large focal spot of electronic equipment manufacturing.
Utility model content
In order to overcome the above-mentioned deficiencies of the prior art, the utility model provides a kind of height improving product heat conductivility
Heat conduction printed circuit board.
To achieve the goals above, the technical solution adopted in the utility model is：
A kind of high heat conduction printed circuit board, including the board layer, thermally conductive insulating layer and the metal that from top to bottom set gradually
Bottom is provided with the positioning table for holding electronic component welding on the board layer, and the metal back layer lower surface is covered with heat conduction
The lower surface of glue-line, the heat-conducting glue layer is covered with heat dissipating layer, and the lower surface of the heat dissipating layer is provided with several radiating fins.
As being further improved for said program, the heat dissipating layer and radiating fin are metal product, the radiating fin
Piece is uniformly arranged, and there are gaps between radiating fin.
As being further improved for said program, the radiating fin is integrally formed with heat dissipating layer.
As being further improved for said program, the upper surface of the heat dissipating layer is provided with several thermal vias, described to dissipate
Heat through-hole penetrates through the heat dissipating layer.
As being further improved for said program, the thermally conductive insulating layer is Pi heat-conducting glues.
The beneficial effects of the utility model：
A kind of high heat conduction printed circuit board of the utility model, is also covered with the metal bottom of perfect heat-dissipating on board layer
Layer, metal back layer lower section are additionally provided with heat dissipating layer, and heat dissipating layer is equipped with several radiating fins increased with air contact area, makes
It is more preferable to obtain heat dissipation effect.
Description of the drawings
It is required in being described below to embodiment in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing to be used is briefly described.Obviously, described attached drawing is a part of the embodiment of the utility model, rather than complete
Portion's embodiment, those skilled in the art without creative efforts, can also be obtained according to these attached drawings
Other design schemes and attached drawing：
Fig. 1 is the utility model preferred embodiment structural schematic diagram.
Specific implementation mode
The technique effect of the design of the utility model, concrete structure and generation is carried out below with reference to embodiment and attached drawing
It clearly and completely describes, to be completely understood by the purpose of this utility model, feature and effect.Obviously, described embodiment
It is a part of the embodiment of the utility model, rather than whole embodiments, it is based on the embodiments of the present invention, the skill of this field
The other embodiment that art personnel are obtained without creative efforts belongs to the model of the utility model protection
It encloses.
Referring to Fig.1, a kind of high heat conduction printed circuit board, including the board layer 1, the heat conductive insulating that from top to bottom set gradually
Layer 2 and metal back layer 3, the thermally conductive insulating layer 2 are Pi heat-conducting glues, and Pi itself is a kind of high temperature resistant, and the good material of insulating properties is situated between
Electric strength ＞ 4KV/mil, can improve the voltage-resistent characteristic of Double-side line plank, meet the proof voltage requirement of high-end product, institute
The positioning table 4 for being provided on board layer 1 and holding electronic component welding is stated, 3 lower surface of the metal back layer is covered with heat-conducting glue layer
5, the lower surface of the heat-conducting glue layer 5 is covered with heat dissipating layer 6.
The upper surface of the heat dissipating layer 6 is provided with several thermal vias 8, and the thermal vias 8 penetrates through the heat dissipating layer 6,
The lower surface of the heat dissipating layer 6 is provided with several radiating fins 7, and the radiating fin 7 is integrally formed with heat dissipating layer 6, described to dissipate
Thermosphere 6 and radiating fin 7 are metal product, and the radiating fin 7 is uniformly arranged, and there are gaps between radiating fin 7.
3 thermal diffusivity of metal back layer, the heat that energy absorbing circuit plate layer 1 generates, 3 lower section of metal back layer are additionally provided with heat dissipation
Layer 6, heat dissipating layer 6 are equipped with several increase and the radiating fin of air contact area 7 so that heat dissipation effect is more preferable.On heat dissipating layer 6
Thermal vias 8 heat dissipating layer 6 and the heat inside metal back layer 3 can be distributed, substantially increase rate of heat dispation.
It is to be illustrated to the preferred embodiment of the utility model, but the utility model creation is not limited to above
The embodiment, those skilled in the art can also make various etc. without departing from the spirit of the present invention
With modification or replacement, these equivalent modifications or replacement are all contained in the application claim limited range.
Claims (5)
1. a kind of high heat conduction printed circuit board, it is characterised in that：Including from top to bottom set gradually board layer (1), heat conduction
Insulating layer (2) and metal back layer (3) are provided with the positioning table (4) for holding electronic component welding on the board layer (1), described
Metal back layer (3) lower surface is covered with heat-conducting glue layer (5), and the lower surface of the heat-conducting glue layer (5) is covered with heat dissipating layer (6), institute
The lower surface for stating heat dissipating layer (6) is provided with several radiating fins (7).
2. high heat conduction printed circuit board according to claim 1, it is characterised in that：The heat dissipating layer (6) and radiating fin
(7) it is metal product, the radiating fin (7) is uniformly arranged, and there are gaps between radiating fin (7).
3. high heat conduction printed circuit board according to claim 1, it is characterised in that：The radiating fin (7) and heat dissipating layer
(6) it is integrally formed.
4. high heat conduction printed circuit board according to claim 1, it is characterised in that：The upper surface of the heat dissipating layer (6) is set
Several thermal vias (8) are equipped with, the thermal vias (8) penetrates through the heat dissipating layer (6).
5. high heat conduction printed circuit board according to claim 1, it is characterised in that：The thermally conductive insulating layer (2) is led for Pi
Hot glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721854578.9U CN207884962U (en) | 2017-12-25 | 2017-12-25 | A kind of high heat conduction printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721854578.9U CN207884962U (en) | 2017-12-25 | 2017-12-25 | A kind of high heat conduction printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207884962U true CN207884962U (en) | 2018-09-18 |
Family
ID=63503641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721854578.9U Expired - Fee Related CN207884962U (en) | 2017-12-25 | 2017-12-25 | A kind of high heat conduction printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207884962U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108135075A (en) * | 2017-12-25 | 2018-06-08 | 珠海欣中祺电子科技有限公司 | A kind of high heat conduction printed circuit board |
-
2017
- 2017-12-25 CN CN201721854578.9U patent/CN207884962U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108135075A (en) * | 2017-12-25 | 2018-06-08 | 珠海欣中祺电子科技有限公司 | A kind of high heat conduction printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180918 Termination date: 20201225 |