CN207305059U - A kind of PCB circuit board of high efficiency and heat radiation multilayer - Google Patents
A kind of PCB circuit board of high efficiency and heat radiation multilayer Download PDFInfo
- Publication number
- CN207305059U CN207305059U CN201721298205.8U CN201721298205U CN207305059U CN 207305059 U CN207305059 U CN 207305059U CN 201721298205 U CN201721298205 U CN 201721298205U CN 207305059 U CN207305059 U CN 207305059U
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- China
- Prior art keywords
- substrate
- heat
- circuit board
- pcb circuit
- thermal insulation
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Abstract
The utility model discloses a kind of PCB circuit board of high efficiency and heat radiation multilayer, including main body, first substrate is provided with main body, the both ends of first substrate are both provided with radiating groove, heat emission fan is provided with radiating groove, first substrate is internally provided with heat-conducting plate, the bottom of first substrate is provided with the first insulating layer, the bottom of first insulating layer is provided with first thermal insulation layer, the bottom of first thermal insulation layer is provided with second substrate, the bottom of second substrate is provided with the second insulating layer, the bottom of second insulating layer is provided with second thermal insulation layer, the bottom of second thermal insulation layer is provided with the 3rd substrate, the inside of second substrate and the 3rd substrate is both provided with heat-conducting plate, first substrate, heat emission hole is both provided with second substrate and the 3rd substrate.The heat-conducting plate using aluminum substrate as material is provided with the device, easy to which heat is transmitted in air.It is provided with thermal insulation layer between each laminar substrate, separates the heat transfer between substrate, the heat emission fan of setting, enhances the heat-sinking capability of PCB circuit board entirety.
Description
Technical field
A kind of PCB circuit board is the utility model is related to, more particularly relates to a kind of PCB circuit board of high efficiency and heat radiation multilayer.
Background technology
With the development of social economy and the lifting of people's living standard, various electronic products are got the favour of people, competing
It is also increasingly fierce to strive, and a PCB circuit board part indispensable as various electronic products, also plays very important work
With all circuits are all disposed within a plane by the PCB circuit board of the most common plane arrived, this circuit board, operator
Member, it is necessary to carry out global analysis, just will appreciate which part that to be checked belongs to, and adds work people when checking circuit
The burden of member, it is impossible to it is open-and-shut to know which coil the circuit is, in addition, cannot radiate between coil, some PCB
Circuit board needs to work long hours, if circuit board cannot can be burnt out over time well by heat derives, present individual layer
Circuit board cannot meet the needs of people, and multilayer circuit board just has a good economic market, but multilayer circuit board
Shortcoming is it is also obvious that heat radiation energy force difference.A kind of a kind of PCB circuit board for the high efficiency and heat radiation multilayer that can solve the problems, such as this is now provided.
Utility model content
The problem of the technical problems to be solved in the utility model is existing multilayer circuit board heat radiation energy force difference, there is provided a kind of
The PCB circuit board of high efficiency and heat radiation multilayer.
In order to solve the above-mentioned technical problem, the utility model provides following technical solution：
The utility model provides a kind of PCB circuit board of high efficiency and heat radiation multilayer, including main body, is provided with the main body
First substrate, the both ends of the first substrate are both provided with radiating groove, and heat emission fan, first base are provided with the radiating groove
Plate is internally provided with heat-conducting plate, and the bottom of the first substrate is provided with the first insulating layer, the bottom of first insulating layer
First thermal insulation layer is provided with, the bottom of the first thermal insulation layer is provided with second substrate, and the bottom of the second substrate is provided with
Second insulating layer, the bottom of second insulating layer are provided with second thermal insulation layer, and the bottom of the second thermal insulation layer is provided with
The inside of three substrates, the second substrate and the 3rd substrate is both provided with heat-conducting plate, the first substrate, second base
Heat emission hole is both provided with plate and the 3rd substrate.
As a kind of optimal technical scheme of the utility model, the plate of the first substrate, second substrate and the 3rd substrate
Material is epoxy glass fabric base material.
As a kind of optimal technical scheme of the utility model, the heat-conducting plate material is aluminum substrate, and the heat-conducting plate
There is the lug of protrusion on first substrate, second substrate and the 3rd substrate.
As a kind of optimal technical scheme of the utility model, the heat emission hole is uniformly distributed on substrate.
As a kind of optimal technical scheme of the utility model, the first substrate, the second substrate and the described 3rd
What the electrical connection of substrate was realized by the plated-through-hole on circuit board cross section.
The beneficial effect that the utility model is reached is：The device is a kind of PCB circuit board of high efficiency and heat radiation multilayer, at this
The heat-conducting plate using aluminum substrate as material is both provided with the first substrate of device, second substrate and the 3rd substrate, is provided with the same time
Lug, easy to which heat is transmitted in air.Thermal insulation layer is provided between each laminar substrate, avoids the heat biography between each laminar substrate
Pass, avoid thermal energy from accumulating, the heat emission hole set on substrate, adds PCB circuit board and the contact area of air, makes its heat dissipation
Ability is stronger.First substrate is provided with heat emission fan, enhances the heat-sinking capability of PCB circuit board entirety.The utility model structure
Simply, design is reasonable, easy to spread.
Brief description of the drawings
Attached drawing is used to provide a further understanding of the present invention, and a part for constitution instruction, with this practicality
New embodiment is used to explain the utility model together, does not form the limitation to the utility model.In the accompanying drawings：
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the partial structural diagram of the utility model；
In figure：1st, main body；2nd, first substrate；3rd, second substrate；4th, the 3rd substrate；5th, radiating groove；6th, the first insulating layer；7、
First thermal insulation layer；8th, heat-conducting plate；9th, the second insulating layer；10th, second thermal insulation layer；11st, heat emission hole；12nd, heat emission fan.
Embodiment
The preferred embodiment of the utility model is illustrated below in conjunction with attached drawing, it will be appreciated that described herein excellent
Select embodiment to be only used for describing and explaining the present invention, be not used to limit the utility model.
Embodiment 1
As shown in Figs. 1-2, the utility model provides a kind of PCB circuit board of high efficiency and heat radiation multilayer, including main body 1, main body 1
On be provided with first substrate 2, the both ends of first substrate 2 are both provided with radiating groove 5, are provided with heat emission fan 12 in radiating groove 5, first
Substrate 2 is internally provided with heat-conducting plate 8, and the bottom of first substrate 2 is provided with the first insulating layer 6, and the bottom of the first insulating layer 6 is set
It is equipped with first thermal insulation layer 7, the bottom of first thermal insulation layer 7 is provided with second substrate 3, and it is exhausted that the bottom of second substrate 3 is provided with second
Edge layer 9, the bottom of the second insulating layer 9 are provided with second thermal insulation layer 10, and the bottom of second thermal insulation layer 10 is provided with the 3rd substrate 4,
The inside of 3 and the 3rd substrate 4 of second substrate is both provided with heat-conducting plate 8, on first substrate 2,3 and the 3rd substrate 4 of second substrate
It is provided with heat emission hole 11.
First substrate 2, the plate of 3 and the 3rd substrate 4 of second substrate are epoxy glass fabric base material, have excellent electrical resistance
Energy and processing performance.
8 material of heat-conducting plate is aluminum substrate, and heat-conducting plate 8 have on first substrate 2,3 and the 3rd substrate 4 of second substrate it is convex
The lug gone out, increases the heat-sinking capability of heat-conducting plate 8, PCB circuit board is obtained heat-sinking capability stronger.
Heat emission hole 11 is uniformly distributed on substrate, and heat emission hole 11 adds PCB circuit board and the contact area of air, makes it
Heat-sinking capability is stronger.
First substrate 2, the electrical connection of 3 and the 3rd substrate 4 of second substrate are real by the plated-through-hole on circuit board cross section
Existing, facilitate the electrical connection between substrate, easy to the conducting of electric elements.
During specific work, by the lug that is set on heat-conducting plate 8 by first substrate 2,3 and the 3rd substrate 4 of second substrate
Into air, heat emission hole 11 is radiated the heat transfer that upper electric elements produce by the circulation of air, each laminar substrate it
Between the thermal insulation layer that sets, avoid the heat transfer between each laminar substrate, while when substantial amounts of heat cannot distribute, first can be passed through
Heat emission fan on substrate 2 carries out efficient heat dissipation, and the PCB circuit board of high efficiency and heat radiation multilayer is formed with this.
The beneficial effect that the utility model is reached is：The device is a kind of PCB circuit board of high efficiency and heat radiation multilayer, at this
The heat-conducting plate using aluminum substrate as material is both provided with the first substrate of device, second substrate and the 3rd substrate, is provided with the same time
Lug, easy to which heat is transmitted in air.Thermal insulation layer is provided between each laminar substrate, avoids the heat biography between each laminar substrate
Pass, avoid thermal energy from accumulating, the heat emission hole set on substrate, adds PCB circuit board and the contact area of air, makes its heat dissipation
Ability is stronger.First substrate is provided with heat emission fan, enhances the heat-sinking capability of PCB circuit board entirety.The utility model structure
Simply, design is reasonable, easy to spread.
Finally it should be noted that：The above descriptions are merely preferred embodiments of the present invention, is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it can still modify the technical solution described in foregoing embodiments, or to which part technical characteristic
Carry out equivalent substitution.Where within the spirit and principles of the present invention, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (5)
1. a kind of PCB circuit board of high efficiency and heat radiation multilayer, including main body (1), it is characterised in that be provided with the main body (1)
First substrate (2), the both ends of the first substrate (2) are both provided with radiating groove (5), heat dissipation are provided with the radiating groove (5)
Fan (12), the first substrate (2) is internally provided with heat-conducting plate (8), and it is exhausted that the bottom of the first substrate (2) is provided with first
Edge layer (6), the bottom of first insulating layer (6) are provided with first thermal insulation layer (7), and the bottom of the first thermal insulation layer (7) is set
Second substrate (3) is equipped with, the bottom of the second substrate (3) is provided with the second insulating layer (9), second insulating layer (9)
Bottom is provided with second thermal insulation layer (10), and the bottom of the second thermal insulation layer (10) is provided with the 3rd substrate (4), second base
The inside of plate (3) and the 3rd substrate (4) is both provided with heat-conducting plate (8), the first substrate (2), the second substrate (3)
Heat emission hole (11) is both provided with the 3rd substrate (4).
A kind of 2. PCB circuit board of high efficiency and heat radiation multilayer according to claim 1, it is characterised in that the first substrate
(2), the plate of second substrate (3) and the 3rd substrate (4) is epoxy glass fabric base material.
A kind of 3. PCB circuit board of high efficiency and heat radiation multilayer according to claim 1, it is characterised in that the heat-conducting plate (8)
Material is aluminum substrate, and the heat-conducting plate (8) has protrusion on first substrate (2), second substrate (3) and the 3rd substrate (4)
Lug.
A kind of 4. PCB circuit board of high efficiency and heat radiation multilayer according to claim 1, it is characterised in that the heat emission hole
(11) it is uniformly distributed on substrate.
A kind of 5. PCB circuit board of high efficiency and heat radiation multilayer according to claim 1, it is characterised in that the first substrate
(2), the electrical connection of the second substrate (3) and the 3rd substrate (4) is realized by the plated-through-hole on circuit board cross section
's.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721298205.8U CN207305059U (en) | 2017-10-10 | 2017-10-10 | A kind of PCB circuit board of high efficiency and heat radiation multilayer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721298205.8U CN207305059U (en) | 2017-10-10 | 2017-10-10 | A kind of PCB circuit board of high efficiency and heat radiation multilayer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207305059U true CN207305059U (en) | 2018-05-01 |
Family
ID=62413897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721298205.8U Expired - Fee Related CN207305059U (en) | 2017-10-10 | 2017-10-10 | A kind of PCB circuit board of high efficiency and heat radiation multilayer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207305059U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108566725A (en) * | 2018-07-16 | 2018-09-21 | 湖北荣宝电子科技有限公司 | A kind of corrosion resistant type multi-layer PCB board |
-
2017
- 2017-10-10 CN CN201721298205.8U patent/CN207305059U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108566725A (en) * | 2018-07-16 | 2018-09-21 | 湖北荣宝电子科技有限公司 | A kind of corrosion resistant type multi-layer PCB board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180501 Termination date: 20211010 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |