CN202652697U - PCB with metal substrate - Google Patents
PCB with metal substrate Download PDFInfo
- Publication number
- CN202652697U CN202652697U CN 201220291132 CN201220291132U CN202652697U CN 202652697 U CN202652697 U CN 202652697U CN 201220291132 CN201220291132 CN 201220291132 CN 201220291132 U CN201220291132 U CN 201220291132U CN 202652697 U CN202652697 U CN 202652697U
- Authority
- CN
- China
- Prior art keywords
- metal substrate
- metal
- oxide film
- pcb
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a PCB with a metal substrate. The PCB with the metal substrate includes the metal substrate. The metal substrate is covered with a plurality of metal oxide film layers arranged at intervals. The metal oxide film layers are covered with aluminum nitride coatings. Heat dissipating units are arranged among the metal oxide film layers. Through the above structural improvement, the PCB with metal substrate provided by the utility model has good heat dissipation performance on a basis of keeping a good electric insulation characteristic.
Description
Technical field
The utility model relates to a kind of pcb board, belongs to the electric component field.
Background technology
Existing printed circuit board (PCB) (pcb board) thermal conduction characteristic is relatively poor, volume owing to pcb board when being used for now increasingly sophisticated electronic product is increasing, caloric value is more and more higher, existing technology is to utilize metallic heat radiating plate to be combined with printed circuit board (PCB) for this problem mostly, reaches the heat radiation purpose.Yet in this scheme, usually need to process perforate at pcb board, then fix relevant heat-sink unit, increase the complexity of structure, pcb board can't be accomplished slimming.
Summary of the invention
In order to overcome the defective of existing pcb board, the utility model discloses the pcb board with metal substrate, by the improvement to radiator structure, can effectively improve radiating effect.
For achieving the above object, the utility model is achieved through the following technical solutions:
Have the pcb board of metal substrate, comprise metal substrate, wherein be covered with a plurality of metal-oxide film layers separately on the metal substrate, be covered with aluminium nitride coating on the metal-oxide film layer, be provided with heat-sink unit between the metal-oxide film layer.
Pass through said structure, in the end during printed wire, circuit is printed on the aluminium nitride coating, link tester is each other crossed the wire connection and is got final product, because metal-oxide film layer, aluminium nitride coating have good insulation characterisitic, can make the horizontal rapid diffusion of heat, promote vertical heat transfer speed, heat-sink unit then can carry out efficiently radiates heat to the zone that is not covered by thin layer.
The pcb board that this is novel, owing to heat-sink unit is directly installed on the metal substrate, and printed wire is printed on the aluminium nitride coating, and metal substrate itself is printed wire not, has realized the effective separation of heat conduction with the signal conduction, prevents from disturbing; Simultaneously, thin layer and aluminium nitride coating have good insulation characterisitic and hardness, can effectively prevent from forming short circuit between printed wire and the metal substrate.
In the utility model, metal substrate is copper base or aluminium base; The metal-oxide film layer is alumina layer.
In the utility model, heat-sink unit is thermal grease or graphite, normally makes cylinder or then prismatic is installed on the metal substrate.
Improve by said structure, pcb board of the present utility model has good radiating effect, and can effectively prevent signal shorts.
Description of drawings
Fig. 1 is the utility model pcb board structural representation.
Embodiment
With reference to figure 1, pcb board of the present utility model, comprise metal substrate 1,1 is coated with a plurality of aluminum oxide film retes 2 separately on metal substrate, be coated with aluminium nitride coating 3 on the aluminum oxide film rete, in use printed wire layer 4 is made on the aluminium nitride coating 3,1 zone is provided with a plurality of heat-sink units 5. on 2 metal substrates that are separated out of aluminum oxide film rete
Claims (4)
1. have the pcb board of metal substrate, comprise metal substrate, it is characterized in that being covered with on the metal substrate a plurality of metal-oxide film layers separately, be covered with aluminium nitride coating on the metal-oxide film layer, be provided with heat-sink unit between the metal-oxide film layer.
2. the pcb board with metal substrate according to claim 1 is characterized in that metal substrate is copper base or aluminium base.
3. the pcb board with metal substrate according to claim 1 is characterized in that the metal-oxide film layer is alumina layer.
4. the pcb board with metal substrate according to claim 1 is characterized in that heat-sink unit is thermal grease or graphite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220291132 CN202652697U (en) | 2012-06-20 | 2012-06-20 | PCB with metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220291132 CN202652697U (en) | 2012-06-20 | 2012-06-20 | PCB with metal substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202652697U true CN202652697U (en) | 2013-01-02 |
Family
ID=47421712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220291132 Expired - Fee Related CN202652697U (en) | 2012-06-20 | 2012-06-20 | PCB with metal substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202652697U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103354698A (en) * | 2013-06-17 | 2013-10-16 | 苏州晶品光电科技有限公司 | A patterned ceramic layer printed circuit substrate for optical and electronic devices |
| CN103354697A (en) * | 2013-06-17 | 2013-10-16 | 苏州晶品光电科技有限公司 | Patterned composite ceramic layer printed circuit substrate for optical and electronic device |
| CN109168252A (en) * | 2018-10-26 | 2019-01-08 | 业成科技（成都）有限公司 | Circuit board and preparation method thereof |
-
2012
- 2012-06-20 CN CN 201220291132 patent/CN202652697U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103354698A (en) * | 2013-06-17 | 2013-10-16 | 苏州晶品光电科技有限公司 | A patterned ceramic layer printed circuit substrate for optical and electronic devices |
| CN103354697A (en) * | 2013-06-17 | 2013-10-16 | 苏州晶品光电科技有限公司 | Patterned composite ceramic layer printed circuit substrate for optical and electronic device |
| CN103354698B (en) * | 2013-06-17 | 2016-02-24 | 苏州晶品光电科技有限公司 | For the patterning ceramic layer printed circuit substrate of optics and electronic device |
| CN103354697B (en) * | 2013-06-17 | 2016-04-20 | 苏州晶品光电科技有限公司 | For the patterning composite ceramic layer printed circuit substrate of optics and electronic device |
| CN109168252A (en) * | 2018-10-26 | 2019-01-08 | 业成科技（成都）有限公司 | Circuit board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130102 Termination date: 20210620 |