CN205051965U - Compound heat conduction circuit board - Google Patents
Compound heat conduction circuit board Download PDFInfo
- Publication number
- CN205051965U CN205051965U CN201520789224.5U CN201520789224U CN205051965U CN 205051965 U CN205051965 U CN 205051965U CN 201520789224 U CN201520789224 U CN 201520789224U CN 205051965 U CN205051965 U CN 205051965U
- Authority
- CN
- China
- Prior art keywords
- heat
- circuit board
- conducting plate
- flexible board
- fixed area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to a compound heat conduction circuit board, including heat -conducting plate, flexible board and tie coat, be equipped with the fixed area on the heat -conducting plate, the tie coat sets up between heat -conducting plate and flexible board, and the flexible board setting is in the tie coat top, the fixed area top is equipped with at least one mounting hole, the mounting hole runs through tie coat and flexible board, be equipped with at least one through -hole on the flexible board, be equipped with the tin ingot on the fixed area, the tin ingot top is equipped with electron device. The utility model discloses a compound heat conduction circuit board passes through the tin ingot and gives the heat -conducting plate with the direct transmission of heat that electron device produced, then leads away the heat through the heat -conducting plate, can promote the radiating efficiency, in addition, connect required space through the reducible a plurality of electron device of conducting layer for the circuit board can miniaturize, simultaneously, interconnecting link is arranged to the accessible through -hole, the electron device's of being convenient for connection.
Description
Technical field
The utility model relates to a kind of circuit board, particularly a kind of composite heat-conducting circuit board.
Background technology
Along with the fast development of electronic technology, modern electronic product becomes more and more less, function becomes increasingly complex, the printed circuit board (PCB) (PCB) electronic devices and components being played to support and interconnection effect develops into two-sided, multilayer from one side, to high accuracy, high density and high reliability future development, volume constantly reduces.At present, be usually called soft PCB or flexible PCB with the PCB that flexible insulating base material is made, it has adapted to the needs of current electronic product to high density and high reliability, miniaturization, lightweight future development.At present, the heat radiation of traditional circuit board mainly relies on substrate arranges that heat dissipating layer is with improving heat radiation efficiency, or multiple through hole is set on circuit boards, make substrate directly and extraneous contact, thus raising radiating effect, but the lifting of technique scheme to radiating effect is limited, the cooling requirements that circuit board is higher can not be met.
Utility model content
The utility model is in order to solve the problem of prior art, and provide a kind of radiating effect better, electronic device connects composite heat-conducting circuit board more easily.
Concrete technical scheme is as follows: a kind of composite heat-conducting circuit board, comprise heat-conducting plate, flexible board and tack coat, described heat-conducting plate is provided with fixed area, and described tack coat is arranged between heat-conducting plate and flexible board, flexible board is arranged on above tack coat, be provided with at least one installing hole above described fixed area, described installing hole runs through tack coat and flexible board, and described flexible board is provided with at least one through hole, described fixed area is provided with block tin, is provided with electronic device above block tin.
It is below attached technical scheme of the present utility model.
Preferably, described flexible board surface is provided with conductive layer, and conductive layer covers the sidewall of surface, fixed area and installing hole.
Preferably, described heat-conducting plate is made up of copper product.
Preferably, described electronic device comprises Embedded Division and support portion, and described support portion is arranged on Embedded Division both sides, and described Embedded Division is arranged in installing hole.
Preferably, described electronic device has multiple, and multiple electronic device is disposed side by side in installing hole.
Technique effect of the present utility model: the heat that electronic device produces is directly passed to heat-conducting plate by block tin by composite heat-conducting circuit board of the present utility model, is then led away by heat by heat-conducting plate, can improving heat radiation efficiency; In addition, the space needed for the connection of multiple electronic device can be reduced by conductive layer, make circuit board Miniaturizable; Meanwhile, by via arrangement connection line, be convenient to the connection of electronic device.
Accompanying drawing explanation
Fig. 1 is the cutaway view of the composite heat-conducting circuit board of the utility model embodiment.
Fig. 2 is another cutaway view of the composite heat-conducting circuit board of the utility model embodiment.
Fig. 3 is the schematic diagram of the conductive layer of the utility model embodiment.
Fig. 4 is the schematic diagram of the composite heat-conducting circuit board of the utility model embodiment.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described further.
As shown in Figures 1 to 4, the composite heat-conducting circuit board 100 of this enforcement comprises heat-conducting plate 1, flexible board 2 and tack coat 3, and described heat-conducting plate 1 is provided with fixed area 11, and in the present embodiment, described heat-conducting plate is made up of copper product.Described tack coat 3 is arranged between heat-conducting plate 1 and flexible board 2, and flexible board 2 is arranged on above tack coat 3, is provided with at least one installing hole 12 above described fixed area 11, and described installing hole 12 runs through tack coat 3 and flexible board 2.Described flexible board 2 is provided with at least one through hole 21, can arrange connection line by through hole 21.Described fixed area 11 is provided with block tin 4, is provided with electronic device 5 above block tin 4.When electronic device 5 uses, the heat of generation is directly shed (as shown by arrows in FIG.) by heat-conducting plate by block tin 4, thus improving radiating effect.Technique scheme can promote the heat-sinking capability of circuit board, simultaneously by via arrangement connection line, is convenient to the connection of electronic device.
As shown in Figures 1 to 4, described flexible board 2 surface is provided with conductive layer 22, and conductive layer 22 covers the sidewall 121 of surface, fixed area 11 and installing hole 12.Can be electrically connected by supplied for electronic device 5 by conductive layer 22, and other electronic devices 6 can be increased and do not need to set up other circuit boards, thus save space, make circuit board Miniaturizable.In the present embodiment, multiple electronic device can be disposed side by side in installing hole.Described electronic device 5 comprises Embedded Division 51 and support portion 52, and described support portion 52 is arranged on Embedded Division 51 both sides, and described Embedded Division 51 is arranged in installing hole 12, thus makes the connection of electronic device and circuit board more firm.
The heat that electronic device produces is directly passed to heat-conducting plate by block tin by the composite heat-conducting circuit board of the present embodiment, is then led away by heat by heat-conducting plate, can improving heat radiation efficiency; In addition, the space needed for the connection of multiple electronic device can be reduced by conductive layer, make circuit board Miniaturizable; Meanwhile, by via arrangement connection line, be convenient to the connection of electronic device.
It is to be noted; above-mentioned preferred embodiment is only and technical conceive of the present utility model and feature is described; its object is to person skilled in the art can be understood content of the present utility model and implement according to this, protection range of the present utility model can not be limited with this.All equivalences done according to the utility model Spirit Essence change or modify, and all should be encompassed within protection range of the present utility model.
Claims (5)
1. a composite heat-conducting circuit board, it is characterized in that: it comprises heat-conducting plate, flexible board and tack coat, described heat-conducting plate is provided with fixed area, and described tack coat is arranged between heat-conducting plate and flexible board, flexible board is arranged on above tack coat, be provided with at least one installing hole above described fixed area, described installing hole runs through tack coat and flexible board, and described flexible board is provided with at least one through hole, described fixed area is provided with block tin, is provided with electronic device above block tin.
2. composite heat-conducting circuit board as claimed in claim 1, is characterized in that: described flexible board surface is provided with conductive layer, and conductive layer covers the sidewall of surface, fixed area and installing hole.
3. composite heat-conducting circuit board as claimed in claim 2, is characterized in that: described heat-conducting plate is made up of copper product.
4. composite heat-conducting circuit board as claimed in claim 3, it is characterized in that: described electronic device comprises Embedded Division and support portion, described support portion is arranged on Embedded Division both sides, and described Embedded Division is arranged in installing hole.
5. composite heat-conducting circuit board as claimed in claim 4, it is characterized in that: described electronic device has multiple, multiple electronic device is disposed side by side in installing hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520789224.5U CN205051965U (en) | 2015-10-13 | 2015-10-13 | Compound heat conduction circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520789224.5U CN205051965U (en) | 2015-10-13 | 2015-10-13 | Compound heat conduction circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205051965U true CN205051965U (en) | 2016-02-24 |
Family
ID=55345502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520789224.5U Expired - Fee Related CN205051965U (en) | 2015-10-13 | 2015-10-13 | Compound heat conduction circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205051965U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114390782A (en) * | 2020-10-16 | 2022-04-22 | 庆鼎精密电子（淮安）有限公司 | Composite circuit board, preparation method thereof and camera module |
-
2015
- 2015-10-13 CN CN201520789224.5U patent/CN205051965U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114390782A (en) * | 2020-10-16 | 2022-04-22 | 庆鼎精密电子（淮安）有限公司 | Composite circuit board, preparation method thereof and camera module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160224 Termination date: 20201013 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |