CN109168252A - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
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- CN109168252A CN109168252A CN201811257789.3A CN201811257789A CN109168252A CN 109168252 A CN109168252 A CN 109168252A CN 201811257789 A CN201811257789 A CN 201811257789A CN 109168252 A CN109168252 A CN 109168252A
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- layer
- substrate
- barrier layer
- barrier
- aluminum oxide
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
A kind of circuit board, comprising: first substrate, the first substrate are metal material；First barrier layer, the ingredient of first barrier layer include aluminum oxide, and first barrier layer is set to a first substrate at least surface, and surface of first barrier layer far from the first substrate is aluminum oxide；And first line layer, the first line layer are set to first barrier layer far from the first substrate side.The present invention also provides the production methods of foregoing circuit plate.
Description
Technical field
The present invention relates to a kind of circuit board and preparation method thereof more particularly to a kind of preferable circuit board of heating conduction and its
Production method.
Background technique
In recent years, electronic product is widely used in routine work and life, with the increasingly increasing of electronic product function
By force, electronic product is used time and the intensity used are also gradually increased.But the use electronics of long-time or high intensity
Product inevitably results in electronic product fever seriously, and lasting high temperature can damage electronic product.
Current electronic product, especially mobile terminal electronic product, since its is small in size and structure is frivolous, heat dissipation
Performance is often not ideal enough, especially applies the huge circuit board of area, and traditional board structure of circuit is often made using organic matter
For substrate, therefore, traditional circuit board overall thermal conductivity is lower and heat dissipation performance is poor.
Summary of the invention
A kind of circuit board, comprising:
First substrate, the first substrate are metal material；
The ingredient of first barrier layer, first barrier layer includes aluminum oxide, and first barrier layer is set to institute
An at least surface for first substrate is stated, surface of first barrier layer far from the first substrate is an aluminum oxide layer；
And
First line layer, the first line layer are set to first barrier layer far from the first substrate side.
A kind of production method of circuit board, includes the following steps:
A first substrate is provided, the first substrate is metal material；
On a first substrate at least surface, setting one includes one first barrier layer of aluminum oxide, makes described the
Surface of one barrier layer far from the first substrate is aluminum oxide layer；And
A first line layer is formed far from the first substrate surface in first barrier layer.
Circuit board of the invention, aluminum oxide body impedance with higher, body impedance are generally greater than 1014Ohmcm,
Although the first barrier layer, first substrate and first line layer are conductive material, the higher impedance of aluminum oxide can be effective
The effect of completely cutting off the electric connection of line layer and first substrate, realizing insulation.And first substrate, first in circuit board of the invention
Barrier layer and first line layer are metal or metal oxide materials, so that the whole thermally conductive system with higher of circuit board
Number, circuit board have good heat-sinking capability.
Detailed description of the invention
Fig. 1 is the schematic cross-sectional view of the circuit board of first embodiment of the invention.
Fig. 2 is the schematic cross-sectional view of the circuit board of first embodiment of the invention.
Fig. 3 is the schematic cross-sectional view of the circuit board of second embodiment of the invention.
Fig. 4 is the schematic cross-sectional view of the circuit board of third embodiment of the invention.
Fig. 5 is the schematic cross-sectional view of the circuit board of third embodiment of the invention.
Fig. 6 is the production process schematic diagram of the circuit board of one embodiment of the invention.
Main element symbol description
| Circuit board | 10、20、30 |
| First substrate | 11、21、31 |
| First barrier layer | 12、22、32 |
| Aluminium layer | 121、221、321 |
| Aluminum oxide layer | 122、222、322 |
| First line layer | 13、23、33 |
| Soldermask layer | 14、24、34 |
| Connection gasket | 15、25、35 |
| The second substrate | 36 |
| Second barrier layer | 37 |
| Second line layer | 38 |
| Connector | 39 |
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
With reference to the accompanying drawing, it elaborates to some embodiments of the present invention.In the absence of conflict, following
Feature in embodiment and embodiment can be combined with each other.
As shown in Figure 1, the schematic cross-sectional view of the circuit board 10 for first embodiment of the invention.In an embodiment, circuit
Plate 10 can be a single layer board.Circuit board 10 includes at least first substrate 11, the first barrier layer 12, first line layer 13, prevents
Layer 14 and connection gasket 15.First substrate 11 is the arrying main body of circuit board 10, and the first barrier layer 12 is set to first substrate
11 surface, first line layer 13 are set to the first side of the barrier layer 12 far from first substrate 11, the covering of soldermask layer 14 the
At least partly surface of one line layer 13, at least partly company of being provided on the surface that first line layer 13 is not covered by soldermask layer 14
Connection pad 15.
First substrate 11 is metal material, can be the metal simple-substances material such as copper, silver, nickel in an embodiment, can also be with
For alloy materials such as stainless steel, brass (ormolu), or metal composite, such as titanium aluminium titanium.First substrate 11 has
Standby good ductility and thermal conductivity, make it easier to process, and be allowed to have preferable heat dissipation performance.
The ingredient of first barrier layer 12 includes aluminum oxide, and further, the first barrier layer 12 is far from first substrate 11
Surface be aluminum oxide layer.
In an embodiment, the first barrier layer 12 include an aluminium layer 121 and an aluminum oxide layer 122, aluminium layer 121 with
First substrate 11 directly contacts, and aluminum oxide layer 122 is located at side of the aluminium layer 121 far from first substrate 11, that is, the first barrier
12 surface far from first substrate 11 of layer are aluminum oxide layer.Aluminum oxide layer 122 can be by being attached to 11 table of first substrate
121 partial oxidation of aluminium layer in face is formed.
In other embodiments, as shown in Fig. 2, being the schematic cross-sectional view of circuit board 10 of the invention.First barrier layer 12
Bulk composition be aluminum oxide, can be used the modes such as physical coating or plated film 11 surface of first substrate deposit shape
At.
First line layer 13 has a scheduled circuit pattern, and first line layer 13 may include multiple conducting wires, multiple
Conducting wire can possess reasonable arrangement mode.In an embodiment, first line layer 13 is copper, in other embodiments,
First line layer 13 or other conductive material materials, such as can be metal simple-substance, alloy, metal oxide etc..
Soldermask layer 14 covers at least partly surface of the first line layer 13 far from 12 side of the first barrier layer, and soldermask layer 14 is
Insulating materials can be ink.Soldermask layer 14 plays the role of insulation protection to first line layer 13, first line layer 13
At least partly surface is not covered by soldermask layer 14, and first line layer 13 not can be used as conductive connection by the part that soldermask layer 14 covers
Mouthful.
Connection gasket 15 can be to be multiple, and each connection gasket 15 is set to first line layer 13 is not covered by soldermask layer 14 one
The surface of section bare conducting circuit, and be electrically connected with first line layer 13.Connection gasket 15 is conductive material, can be gold
Category, semiconductor, doped with conductive materials such as the organic matters of conductive particle, can be metallic gold or metallic silver in an embodiment
The equal preferable conductive material of electric conductivities.
Circuit board 10 of the invention, aluminum oxide body impedance with higher, body impedance are generally greater than 1014ohm·
Cm, although aluminium layer 121, first substrate 11 and first line layer 13 are conductive material, the higher impedance of aluminum oxide can
The effect of insulating, is realized in the effectively electric connection of isolation first line layer 13 and aluminium layer 121 or first substrate 11.And it is of the invention
First substrate 11, the first barrier layer 12 and first line layer 13 are metal or metal oxide materials in circuit board 10,
So that the whole thermal coefficient with higher of circuit board 10, circuit board 10 have good heat-sinking capability.
Second embodiment
As shown in figure 3, the schematic cross-sectional view of the circuit board 20 for second embodiment of the invention.In an embodiment, circuit
Plate 20 can be a double-sided PCB.Circuit board 20 includes at least first substrate 21, the first barrier layer 22, first line layer 23, prevents
Layer 24 and connection gasket 25.First substrate 21 is the arrying main body of circuit board 20, and the quantity of the first barrier layer 22 is two, two
A first barrier layer 22 is respectively arranged at two opposite surfaces of first substrate 21, and first line layer 23 is set to the first barrier layer 22
Far from 21 side of first substrate, soldermask layer 24 covers at least partly surface of first line layer 23, and first line layer 23 is not prevented
The surface that layer 24 covers at least partly is provided with connection gasket 25.
First substrate 21 is metal material, can be the metal simple-substances material such as copper, silver, nickel in an embodiment, can also be with
For alloy materials such as stainless steel, brass (ormolu), or metal composite, such as titanium aluminium titanium.First substrate 21 has
Standby good ductility and thermal conductivity, make it easier to process, and be allowed to have preferable heat dissipation performance.
The ingredient of first barrier layer 22 includes aluminum oxide, and further, the first barrier layer 22 is far from first substrate 21
Surface be aluminum oxide layer.In an embodiment, the first barrier layer 22 includes an aluminium layer 221 and an aluminum oxide layer
222, aluminium layer 221 is directly contacted with first substrate 21, and aluminum oxide layer 222 is located at one of aluminium layer 221 far from first substrate 21
Side, that is, surface of first barrier layer 22 far from first substrate 21 is aluminum oxide layer 222.Aluminum oxide layer 222 can be by attached
221 partial oxidation of aluminium layer in 21 surface of first substrate formed.In other embodiments, the first barrier layer 22 can be real for first
Structure described in example is applied, the first barrier layer 22 includes an aluminum oxide layer 222, and aluminum oxide layer 222 is directly formed
In 21 surface of first substrate, the method for formation can be the modes such as physical coating or plated film.
First line layer 23 has a scheduled circuit pattern, and first line layer 23 may include multiple conducting wires, multiple
Conducting wire can possess reasonable arrangement mode.In an embodiment, first line layer 23 is copper, in other embodiments,
First line layer 23 or other conductive material materials, such as can be metal simple-substance, alloy, metal oxide etc..
Soldermask layer 24 covers at least partly surface of the first line layer 23 far from 22 side of the first barrier layer, and soldermask layer 24 is
Insulating materials can be ink.Soldermask layer 24 plays the role of insulation protection to first line layer 23, first line layer 23
At least partly surface is not covered by soldermask layer 24, and first line layer 23 not can be used as conductive connection by the part that soldermask layer 24 covers
Mouthful.
Connection gasket 25 can be to be multiple, and each connection gasket 25 is set to first line layer 23 is not covered by soldermask layer 24 one
The surface of section bare conducting circuit, and be electrically connected with first line layer 23.Connection gasket 25 is conductive material, can be gold
Category, semiconductor, doped with conductive materials such as the organic matters of conductive particle, can be metallic gold or metallic silver in an embodiment
The equal preferable conductive material of electric conductivities.
Circuit board 20 of the invention, aluminum oxide body impedance with higher, body impedance are generally greater than 1014ohm·
Cm, although aluminium layer 221, first substrate 21 and first line layer 23 are conductive material, the higher impedance of aluminum oxide can
The effect of insulating, is realized in the effectively electric connection of isolation first line layer 23 and aluminium layer 221 or first substrate 21.And it is of the invention
First substrate 21, the first barrier layer 22 and first line layer 23 are metal or metal oxide materials in circuit board 20,
So that the whole thermal coefficient with higher of circuit board 20, circuit board 20 have good heat-sinking capability.
3rd embodiment
As shown in figure 4, the schematic cross-sectional view of the circuit board 30 for third embodiment of the invention.In an embodiment, circuit
Plate 30 can be a multilayer circuit board.Circuit board 30 includes at least first substrate 31, the second substrate 36, the first barrier layer 32, second
Barrier layer 37, first line layer 33, the second line layer 38, soldermask layer 34 and connection gasket 35.First substrate 31 and the second substrate
36 be the arrying main body of circuit board 30, and the quantity of the first barrier layer 32 is two, and two the first barrier layers 32 are respectively arranged at the
Two opposite surfaces of one substrate 31, first line layer 33 are set to the first barrier layer 32 far from 31 side of first substrate.Second resistance
The quantity of interlayer 37 is two, and two the second barrier layers 37 are respectively arranged at two opposite surfaces of the second substrate 36, the second route
Layer 38 is set to one layer of second side of the barrier layer 37 far from the second substrate 36, and first substrate 31 is set with the stacking of the second substrate 36
It sets, one layer of second barrier layer 37 is directly contacted with one layer of first line layer 33.Soldermask layer 34 covers first substrate 31 far from second
The first line layer 33 of 36 side of substrate and the second line layer 38 at least partly surface, first substrate 31 is far from the second substrate 36
The first line layer 33 of side and the second line layer 38 are at least partly provided with connection gasket by the surface that soldermask layer 34 covers
35。
First substrate 31 is metal material, is specifically as follows the metal simple-substances material such as copper, silver, nickel, or stainless steel,
The alloy materials such as brass (ormolu), or metal composite, such as titanium aluminium titanium.First substrate 31 has good prolong
Malleability and thermal conductivity make it easier to process, and are allowed to have preferable heat dissipation performance.The second substrate 36 is metal material, specifically
It can be the metal simple-substances materials such as copper, silver, nickel, or the alloy materials such as stainless steel, brass (ormolu), or
Metal composite, such as titanium aluminium titanium.In an embodiment, first substrate 31 and the material having the same of the second substrate 36 and knot
Structure.
The ingredient of first barrier layer 32 includes aluminum oxide, and further, the first barrier layer 32 is far from first substrate 31
Surface be aluminum oxide layer.In an embodiment, the first barrier layer 32 includes an aluminium layer 321 and an aluminum oxide layer
322, aluminium layer 321 is directly contacted with first substrate 31, and aluminum oxide layer 322 is located at one of aluminium layer 321 far from first substrate 31
Side, that is, surface of first barrier layer 32 far from first substrate 31 is aluminum oxide layer 322.Aluminum oxide layer 322 can be by attached
321 partial oxidation of aluminium layer in 31 surface of first substrate formed.In other embodiments, the first barrier layer 32 can be real for first
Structure described in example is applied, the first barrier layer 32 includes an aluminum oxide layer 322, and aluminum oxide layer 322 is directly formed
In 31 surface of first substrate, the method for formation can be the modes such as physical coating or plated film.
The ingredient of second barrier layer 37 includes aluminum oxide, and surface of second barrier layer 37 far from the second substrate 36 is three
Al 2 O.In an embodiment, the first barrier layer 32 and the material having the same of the second barrier layer 37 and structure.
First line layer 33 has a scheduled circuit pattern, and First Line floor road 33 may include multiple conducting wires, multiple
Conducting wire can possess reasonable arrangement mode.In an embodiment, first line layer 33 is copper, in other embodiments,
First line layer 33 or other conductive material materials, such as can be metal simple-substance, alloy, metal oxide etc..The
Two line layers 38 can be used as an internal layer circuit layer, and the second line layer 38 has a scheduled circuit pattern, and the second line layer 38 can
Including multiple conducting wires, multiple conducting wires can possess reasonable arrangement mode.In an embodiment, the second line layer 38
With the material having the same of first line layer 33 and structure.
Soldermask layer 34 covers first line layer 33 and second line layer of the first substrate 31 far from 36 side of the second substrate
At least partly surface of 38 dew, soldermask layer 34 are insulating materials, can be ink.Soldermask layer 34 is to first line layer 33 and
Two line layers 38 play the role of insulation protection, and at least partly surface of first line layer 33 and the second line layer 38 is not anti-welding
Layer 34 covers, and first line layer 33 and the second line layer 38 not can be used as conductive connection mouth by the part that soldermask layer 34 covers.
Connection gasket 35 can be to be multiple, and each connection gasket 35 is set to the of first substrate 31 far from 36 side of the second substrate
The surface for one section of bare conducting circuit that one line layer 33 and the second line layer 38 are not covered by soldermask layer 34, and and first line
Layer 33 and the second line layer 38 are electrically connected.Connection gasket 35 is conductive material, can be metal, semiconductor, doped with conduction
The conductive materials such as the organic matter of particle are specifically as follows the preferable conductive material of the electric conductivities such as metallic gold or metallic silver.
Circuit board 30 includes two arrying main bodies, and two arrying main bodies are respectively first substrate 31 and the second substrate 36, the
One substrate 31 is stacked with the second substrate 36 to be arranged, and the two can be reinforced by the connector 39 at 30 edge of circuit board.Such as Fig. 5 institute
Show, be the partial schematic sectional view of the circuit board 30 of third embodiment of the invention, in an embodiment, connector 39 is outside one
Encirclement property ruggedized construction by first substrate 31, the second substrate 36 and can be set in first substrate 31 and the second substrate 36
Other structures are at least partly wrapped in the reinforcing that circuit board 30 is realized inside connector 39.In other embodiments, it connects
Part 39 is not limited only to structure or connection type shown in fig. 5, and connector 39 can also be card and type connection structure, by first
Mutually matched card is set on substrate 31 or the second substrate 36 and part realize first substrate 31 and the second substrate 36 card and.
Fourth embodiment
As shown in fig. 6, being the production process schematic diagram of circuit board 10 of the invention.In the present embodiment, circuit board 10 is
One single layer board.
Step S11: providing a first substrate 11, and first substrate 11 is metal material.
The first substrate 11 of one metal material is provided, first substrate 11 is cleaned to remove 11 surface of first substrate
Impurity.
Step S12: on at least surface of first substrate 11, setting includes one first barrier layer 12 of aluminum oxide, is made
Surface of first barrier layer 12 far from first substrate 11 is aluminum oxide.
In an embodiment, the method for forming the first barrier layer 12 may include following steps:
Step S121: first substrate 11 is immersed in the aluminium simple substance of molten condition；
Step S122: reducing the temperature of the aluminium simple substance of molten condition, makes first substrate 11 surface solidification, one layer of pure aluminum, and
There is the first substrate 11 of pure aluminum to take out surface solidification and is allowed to cooling；
Step S123: being surface-treated the pure aluminum adhered on first substrate 11, can pass through mechanical grinding or change
The mode for learning etching makes the surface smoothness of pure aluminum reach preassigned；
Step S124: anodized is carried out to the pure aluminum adhered on first substrate 11, is made far from first substrate 11
The pure aluminum of side is converted into aluminum oxide；
Step S125: being surface-treated aluminum oxide, is enclosed to form the hole on aluminum oxide surface
One complete fine and close aluminum oxide layer, and obtain the first barrier layer 12.
In other embodiments, the method for forming the first barrier layer 12 may include following steps:
Step S126: on 11 surface of first substrate by way of plating, physical vapour deposition (PVD) or chemical vapor deposition
Form one layer of pure aluminum；
Step S123: being surface-treated the pure aluminum adhered on first substrate 11, can pass through mechanical grinding or change
The mode for learning etching makes the surface smoothness of pure aluminum reach preassigned；
Step S124: anodized is carried out to the pure aluminum adhered on first substrate 11, is made far from first substrate 11
The pure aluminum of side is converted into aluminum oxide；
Step S125: being surface-treated aluminum oxide, is enclosed to form the hole on aluminum oxide surface
One complete fine and close aluminum oxide layer, and obtain the first barrier layer 12.
In other embodiments, the method for forming the first barrier layer 12 may include following steps:
Step S127: one is formed on 11 surface of first substrate by way of physical vapour deposition (PVD) or chemical vapor deposition
Layer aluminum oxide, and obtain the first barrier layer 12.
Step S13: first line layer 13 is formed far from the surface of first substrate 11 in the first barrier layer 12.
One layer is formed by modes such as wire mark, printing, photoetch on the first surface of the barrier layer 12 far from first substrate 11
First line layer 13 with predetermined pattern makes first line layer 13 have multiple conducting wires.Then, at 200 DEG C to 400 DEG C
At a temperature of or using laser to first line layer 13 carry out annealing fix the shape of conducting wire and pattern.Yu Yishi
It applies in example, the material of first line layer 13 is metallic copper, in annealing process, is protected between first line layer 13 and the first barrier layer 12
There are copper oxide.
Step S14: an at least soldermask layer 14 is set far from 12 surface of the first barrier layer in first line layer 13, makes First Line
At least partly surface of road floor 13 is covered by soldermask layer 14.
In an embodiment, the first soldermask layer 14 can its for ink or other organic matters or containing organic matter
He insulate anti-welding material, and at least partly exposed surface of first line layer 13 is not covered by soldermask layer 14.
Step S15: providing at least one connection gasket 15, is arranged on the surface that first line layer 13 is not covered by soldermask layer 14
Connection gasket 15 is electrically connected connection gasket 15 and first line layer 13.
When circuit board 10 be a double-sided PCB when, the production method of production method and single layer board the difference is that:
At least two layers of first barrier layers 12 are set on first substrate 11, at least two layers of first barrier layers 12 is made to be set to first substrate 11
Two opposite surfaces, in manufacturing process, at least two layers of first barrier layers 12 can complete in identical step and process；
At least two layers first line layer 13 is set on first substrate 11, every layer of first line layer 13 is made to be set to one first barrier
12 surface far from first substrate 11 of layer, in manufacturing process, at least two layers of first line layer 13 can be in identical step and work
It completes in sequence.
When circuit board 10 be a multilayer circuit board when, circuit board 10 further include the second substrate 36, the second barrier layer 37 and
Second line layer 38, it is possible to understand that, the second substrate 36 can be identical as first substrate 11, and the second barrier layer 37 can be with the first barrier
Layer 12 is identical, and the second line layer 38 can be identical as first line layer 13, and corresponding, making step and technique can also be identical.
The above is only better embodiment of the invention, not the limitation to the present invention in any form, though
The right present invention has been that better embodiment is disclosed above, is not intended to limit the invention, any person skilled in the art,
Without departing from the scope of the present invention, when the technology contents using the disclosure above are modified or are modified to
With the equivalent implementations of variation, but without departing from the technical solutions of the present invention, according to the technical essence of the invention to
Any simple modification, equivalent change and modification that upper embodiment is done, all of which are still within the scope of the technical scheme of the invention.
Claims (10)
1. a kind of circuit board characterized by comprising
First substrate, the first substrate are metal material；
First barrier layer, the ingredient of first barrier layer include aluminum oxide, and first barrier layer is set to described the
An at least surface for one substrate, surface of first barrier layer far from the first substrate is an aluminum oxide layer；And
First line layer, the first line layer are set to first barrier layer far from the first substrate side.
2. circuit board as described in claim 1, it is characterised in that:
At least two layers first barrier layer is provided on the first substrate, at least two layers of first barrier layers are set to institute
State two opposite surfaces of first substrate；
At least two layers first line layer is provided on the first substrate, every layer of first line layer is set to described in one
Surface of first barrier layer far from the first substrate.
3. circuit board as claimed in claim 1 or 2, which is characterized in that further include:
The second substrate, the second substrate are metal material；
Second barrier layer, the ingredient of first barrier layer include aluminum oxide, and second barrier layer is set to described the
Two opposite surfaces of two substrates, surface of second barrier layer far from the second substrate is aluminum oxide；
Second line layer, second line layer are set to one layer of second barrier layer far from the second substrate side；With
And the first substrate and the second substrate stack and are arranged, one layer of second barrier layer and one layer of first line layer are straight
Contact, the second line layer setting is with the second substrate far from the first substrate side.
4. circuit board as claimed in claim 3, which is characterized in that further include:
Connector, the connector are detachably arranged in the edge of the first substrate and the second substrate, and described first
Substrate and the second substrate are connected by the connector.
5. circuit board as claimed in claim 1 or 2, which is characterized in that further include:
Soldermask layer, the soldermask layer are set to the first line layer far from the first barrier layer surface, and the soldermask layer is
At least partly surface of insulating materials, the first line layer is not covered by the soldermask layer；
Connection gasket, the connection gasket are set to the surface that the first line layer is not covered by the soldermask layer, the connection gasket
For conductive material.
6. circuit board as claimed in claim 3, which is characterized in that the ingredient of first barrier layer also includes aluminium, and described
One barrier layer is identical as second barrier material.
7. circuit board as claimed in claim 5, which is characterized in that the first line layer or second line layer are including more
A conducting wire, the conducting wire and the connection gasket are electrically connected.
8. a kind of production method of circuit board, includes the following steps:
A first substrate is provided, the first substrate is metal material；
On a first substrate at least surface, setting includes one first barrier layer of aluminum oxide, makes first barrier
Surface of the layer far from the first substrate is aluminum oxide layer；And
A first line layer is formed far from the first substrate surface in first barrier layer.
9. the production method of circuit board as claimed in claim 8, further includes following steps:
At least two layers first barrier layer is set on the first substrate, is set at least two layers of first barrier layers
Two opposite surfaces of the first substrate；
At least two layers first line layer is set on the first substrate, every layer of first line layer is made to be set to an institute
State surface of first barrier layer far from the first substrate；
An at least soldermask layer is set far from the first barrier layer surface in the first line layer, makes the first line layer
At least partly surface is covered by the soldermask layer；
At least one connection gasket is provided, the connection is set on the surface that the first line layer is not covered by the soldermask layer
Pad, and it is electrically connected the connection gasket and the first line layer.
10. the production method of circuit board as claimed in claim 8 or 9, which is characterized in that in a first substrate at least table
Face forms one and includes one first barrier layer of aluminum oxide and make the table of first barrier layer far from the first substrate
Face is the method for aluminum oxide are as follows:
An aluminium layer is formed on a first substrate at least surface, oxygen is carried out far from the surface of the first substrate to the aluminium layer
Change processing and form aluminum oxide on the surface, the combination of the aluminium layer and the aluminum oxide is first resistance
Interlayer；Or, making an aluminum oxide layer on a first substrate at least surface, the aluminum oxide layer is described first
Barrier layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811257789.3A CN109168252A (en) | 2018-10-26 | 2018-10-26 | Circuit board and preparation method thereof |
| TW107141552A TWI700019B (en) | 2018-10-26 | 2018-11-21 | Printed circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811257789.3A CN109168252A (en) | 2018-10-26 | 2018-10-26 | Circuit board and preparation method thereof |
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| CN109168252A true CN109168252A (en) | 2019-01-08 |
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| CN201811257789.3A Pending CN109168252A (en) | 2018-10-26 | 2018-10-26 | Circuit board and preparation method thereof |
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| TW (1) | TWI700019B (en) |
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| CN113905517B (en) * | 2020-07-06 | 2023-09-22 | 庆鼎精密电子（淮安）有限公司 | Circuit board, preparation method thereof and backlight plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101437355A (en) * | 2007-11-12 | 2009-05-20 | 林玉雪 | Circuit substrate and manufacturing method thereof |
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| CN108419359A (en) * | 2018-04-28 | 2018-08-17 | 孝感市奇思妙想文化传媒有限公司 | A kind of single-sided circuit board of good heat dissipation effect |
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| CN102256440A (en) * | 2010-05-20 | 2011-11-23 | 姚富翔 | Aluminum based circuit board, manufacturing method thereof and electroplate liquid used by method |
| CN102256441A (en) * | 2011-05-23 | 2011-11-23 | 中山大学 | Metal substrate of heat conducting aluminium-based core and preparation method thereof |
| CN102811554A (en) * | 2011-06-02 | 2012-12-05 | 熊大曦 | Base plate for high-power electronic device module and preparation method thereof |
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| CN104822226A (en) * | 2015-04-28 | 2015-08-05 | 武汉华星光电技术有限公司 | Circuit board assembly |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI700019B (en) | 2020-07-21 |
| TW202017439A (en) | 2020-05-01 |
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