CN102740604A - Method for manufacturing insulating metal base plate of electronic circuit - Google Patents
Method for manufacturing insulating metal base plate of electronic circuit Download PDFInfo
- Publication number
- CN102740604A CN102740604A CN2012102407121A CN201210240712A CN102740604A CN 102740604 A CN102740604 A CN 102740604A CN 2012102407121 A CN2012102407121 A CN 2012102407121A CN 201210240712 A CN201210240712 A CN 201210240712A CN 102740604 A CN102740604 A CN 102740604A
- Authority
- CN
- China
- Prior art keywords
- layer
- electronic circuit
- metal
- metal substrate
- preparing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a method for manufacturing an insulating metal base plate of an electronic circuit. The method comprises the following steps of: 1. treating the surface of a metal base plate to obtain a clean and smooth surface; 2. depositing a ceramic heat-conduction insulating layer on the surface of a metal plate in a thermal spraying manner; 3. depositing a conductive metal layer on ceramic by utilizing the thermal spraying manner; and 4. etching a wiring pattern on the conductive metal layer of the upper part by utilizing a mask photoetching method. Through the method for manufacturing the insulating metal base plate of the electronic circuit disclosed by the invention, the manufacturing cost of the insulating metal base plate is low, and the manufactured insulating metal base plate has great potential to replace an existing expensive DBC base plate.
Description
Technical field
The present invention relates to the material preparation process field, particularly a kind of method for preparing the electronic circuit insulating metal substrate.
Background technology
Along with the develop rapidly of manufacturing technology, the power of electronic product is increasing, and volume is more and more littler, causes integrated level increasingly high.Great power LED is a kind of electronic device commonly used, and heater members wherein mainly is a chip, and the heat energy that chip produces mainly exports on the substrate through package support.Along with the power of single LEDs is increasing, the caloric value of chip is also increasing, so the package support of LED has also been proposed higher thermal diffusivity requirement.Current, be applied to the support of high-power LED encapsulation, mainly contain two kinds, be divided into Metal Substrate and ceramic base.The ceramic base support generally has only two-layer, i.e. the ceramic layer of substrate and top conductive layer.The major advantage of ceramic base support is a good insulating, and stability is high, but topmost shortcoming is the complex process of forming process of ceramics and sintering; And power consumption greatly, and cost is relatively more expensive, and the Metal Substrate support constitutes by three layers usually; Be respectively metal-based layer, insulating barrier and conductive layer, wherein, insulating barrier mainly plays bonding, insulation and heat conduction; Its main component is epoxy resin, silicones or acrylic adhesive, and its conductive coefficient is usually less than 1 W/m.K, with respect to the huge caloric value of great power LED; Its thermal diffusivity is insufficient, has a strong impact on the heat dispersion of entire bracket.Improved method is, in this organic insulator, adds thermal conductive ceramic filler nitride based, the carbonization system, and promoting its heat conductivility, but the conductive coefficient after improving is not high yet, is usually less than 3 W/m.K, and radiating effect is unsatisfactory.Owing to the ceramic material good insulating, can have good thermal conductivity simultaneously, therefore in the future possible alternate collar epoxy resins is come the metal substrate of bonding frame bottom and the conductive layer on top, plays the effect of insulation, heat conduction.But the growth pottery is a technical difficult problem always on metal, does not still have universally recognized standing procedure at present.
Ceramic base copper-clad plate (DBC) is the another kind of substrate that typically is used for the high-power electric and electronic circuit; It adopts Copper Foil at high temperature to be bonded directly on the ceramic substrate of aluminium oxide or aluminium nitride; Thereby has the excellent electric insulation performance; High thermal conduction characteristic, excellent solderability and high adhesive strength.It can etch various figures as pcb board, has very big current capacity, has therefore become the basic material of high-power electric and electronic circuit.The advantage of DBC substrate is obvious, will use ceramic substrate but topmost shortcoming is it, and the complex process of forming process of ceramics and sintering, and power consumption is greatly, causes the cost of DBC substrate relatively more expensive.
Summary of the invention
In order to overcome above-mentioned defective; The invention provides a kind of new method for preparing the electronic circuit insulating metal substrate; The various plasma spray technologies that comprise plasma spray coating, electric arc spraying through utilization; On metal substrate, deposit dielectric ceramic layer easily, play heat conduction and insulation function, and then utilize hot spray process depositing metal layers on ceramic layer.Because the ceramic spraying technical maturity can be realized combining closely of pottery and metal, obtains the good package support of good insulation and thermal conductivity.And the output of spraying coating process is high, can reduce the cost of package support greatly.
The present invention for the technical scheme that solves its technical problem and adopt is: 1, a kind of method for preparing the electronic circuit insulating metal substrate may further comprise the steps:
One, handles with metallic substrate surfaces, obtain cleaning even curface;
Two, adopt thermal spraying at metal sheet surface ceramic deposition heat conductive insulating layer;
Three, adopt thermal spraying conductive metal deposition layer on pottery;
Four, adopt the method for mask lithography, etching wiring pattern on the conductive metal layer on top.
As further improvement of the present invention, said metal substrate is aluminium or aluminium alloy or copper or copper alloy or iron or ferroalloy.
As further improvement of the present invention, said ceramic heat conductive insulating layer is aluminium nitride, aluminium oxide or carborundum.
As further improvement of the present invention, said conductive metal layer is copper or the single metal layer of copper alloy or silver or silver alloy or gold or billon or many metal levels that two or more metal level is formed.
As further improvement of the present invention, the plasma spray technology in said step 2 and the step 3 is plasma spray coating, electric arc spraying, detonation flame spraying or supersonic spray coating.
As further improvement of the present invention, said many metal levels adopt the electroless plating mode to process.
The invention has the beneficial effects as follows: the metal substrate that the present invention adopts generally is good, the cheap metal of heat conductivility, and like copper and alloy, aluminium and alloy thereof, iron and alloy thereof, the present invention mainly uses aluminium alloy.For aluminium base, before spraying, only need polish and blasting treatment.The effect of sandblast is to form rough micropore on the surface, has been equivalent to improve the micro interface area on aluminium base surface, and ceramic powder is penetrated in the micropore more easily, forms better bond strength.After the spraying of aluminium nitride ceramics layer accomplished, before the conductive metal layer spraying, need judge whether that carry out surface finish to the aluminium nitride ceramics layer handles, this will be decided by the roughness of aln layer and spray deposit technology afterwards.In the spraying process of conducting metal, different spraying coating process requires different to the roughness of aln layer.For example, if the surface smoothness of later stage technological requirement aluminium nitride is high, and the aln layer roughness that spraying is come out is high, then needs it is polished, otherwise need not polish.After the conductive metal layer spraying is accomplished, before the etching wiring pattern, also need be according to the requirement of circuit on the substrate, whether decision carries out surface finish to conductive metal layer, can choose various types of polishing machines during polishing.The making of wiring pattern can be adopted very ripe mask lithography technology.Because spraying coating process is stable, speed is fast, so this insulating metal substrate is with low cost, the DBC substrate that very potential replacement is expensive now.
Description of drawings
Fig. 1 is preparation technology's flow chart of insulating metal substrate of the present invention;
Fig. 2 is the structural representation of insulating metal substrate substrate of the present invention.
Embodiment
In order to deepen to understanding of the present invention, will combine embodiment that the present invention is made further detailed description below, this embodiment only is used to explain the present invention, does not constitute the qualification to protection range of the present invention.
Embodiment one:
With the aluminium alloy be insulating metal substrate base material, generally select to have high thermal conductivity and certain mechanical strength, can tolerate the aluminium sheet of uniform temperature again, like the aluminium sheet of the trades mark such as 5052,6061.The used pottery of preparation insulating barrier is an aluminium nitride, and electric conducting material is a copper.
1. remove the greasy dirt and the impurity of surface of aluminum plate earlier with machinery or chemical method, adopt blasting craft then, the surface of the work that obtains cleaning, the thickness of aluminium sheet are 0.5mm;
2. using plasma is sprayed on surface of aluminum plate growing aluminum nitride ceramic layer; The technology of control plasma spray coating, the aluminium nitride coating that obtains and the bond strength of aluminum layer are greater than 30MPa, and the thickness of aln layer is 0.2mm; The porosity is lower than 5%, and resistivity reaches 10
12More than the Ω cm;
3. the aluminium oxide ceramics layer is polished, make its fineness Ra reach 1.6 μ m;
4. adopt electric arc spraying in aluminium nitride ceramics layer copper layer, thickness is 0.1mm;
5. conductive copper layer is polished, make fineness reach 0.4 μ m.Through the planar whole conducting of testing conductive copper layer, but with the insulation of the aluminium base of bottom;
6. adopt the mask lithography method that conductive copper layer is carried out etching, form wiring pattern;
Embodiment two:
With the copper alloy be insulating metal substrate base material, generally select the industrial pure copper of high-termal conductivity.The used pottery of preparation insulating barrier is an aluminium oxide, and electric conducting material is that copper covers silver, mainly is in order to satisfy the high request of high-power package support to the conductive metal layer surface reflectivity;
1. remove the greasy dirt and the impurity on copper coin surface with machinery or chemical method earlier, adopt blasting craft then, the surface of the work that obtains cleaning, the thickness of copper coin are 1 mm;
2. using plasma is sprayed on surface of aluminum plate growth aluminium oxide ceramic layer; The technology of control plasma spray coating, the aluminum oxide coating layer that obtains and the bond strength of aluminum layer are greater than 30MPa, and the thickness of alumina layer is 0.4mm; The porosity is lower than 5%, and resistivity reaches 10
12More than the Ω cm.
3. the aluminium oxide ceramics layer is polished, make its fineness Ra reach 1.6 μ m;
4. adopt electric arc spraying in aluminium oxide ceramics layer copper layer, thickness is 0.2mm.Through the planar whole conducting of testing conductive copper layer, but with the insulation of the aluminium base of bottom;
5. adopt the mask lithography method that conductive copper layer is carried out etching, form wiring pattern;
6. on the copper wiring case, plate one deck silver through chemical plating method, obtain the high copper of surface reflectivity and apply silver layer.
Claims (6)
1. method for preparing the electronic circuit insulating metal substrate is characterized in that: may further comprise the steps:
One, handles with metal substrate (1) surface, obtain cleaning even curface;
Two, adopt thermal spraying at metal sheet surface ceramic deposition heat conductive insulating layer (2);
Three, adopt thermal spraying conductive metal deposition layer (3) on pottery;
Four, adopt the method for mask lithography, etching wiring pattern on the conductive metal layer on top.
2. the method for preparing the electronic circuit insulating metal substrate according to claim 1 is characterized in that: said metal substrate (1) is aluminium or aluminium alloy or copper or copper alloy or iron or ferroalloy.
3. the method for preparing the electronic circuit insulating metal substrate according to claim 1 is characterized in that: said ceramic heat conductive insulating layer (2) is aluminium nitride, aluminium oxide or carborundum.
4. the method for preparing the electronic circuit insulating metal substrate according to claim 1 is characterized in that: said conductive metal layer (3) is copper or the single metal layer of copper alloy or silver or silver alloy or gold or billon or many metal levels that two or more metal level is formed.
5. the method for preparing the electronic circuit insulating metal substrate according to claim 1 is characterized in that: the plasma spray technology in said step 2 and the step 3 is plasma spray coating, electric arc spraying, detonation flame spraying or supersonic spray coating.
6. the method for preparing the electronic circuit insulating metal substrate according to claim 4 is characterized in that: said many metal levels adopt the electroless plating mode to process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102407121A CN102740604A (en) | 2012-07-12 | 2012-07-12 | Method for manufacturing insulating metal base plate of electronic circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102407121A CN102740604A (en) | 2012-07-12 | 2012-07-12 | Method for manufacturing insulating metal base plate of electronic circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102740604A true CN102740604A (en) | 2012-10-17 |
Family
ID=46995112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102407121A Pending CN102740604A (en) | 2012-07-12 | 2012-07-12 | Method for manufacturing insulating metal base plate of electronic circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102740604A (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103118494A (en) * | 2013-01-29 | 2013-05-22 | 苏州市嘉明机械制造有限公司 | Pressing runner plate of electric press for pressing processing of printed circuit boards |
| CN103277749A (en) * | 2013-05-28 | 2013-09-04 | 上海九军电子科技有限公司 | Integrated all-round-light circuit board and manufacturing method thereof |
| CN103298244A (en) * | 2013-06-15 | 2013-09-11 | 鑫茂电子（昆山）有限公司 | Circuit board |
| CN103327732A (en) * | 2013-06-09 | 2013-09-25 | 中山大学 | High heat conduction substrate and manufacturing method thereof |
| CN103327734A (en) * | 2013-05-28 | 2013-09-25 | 上海九军电子科技有限公司 | Integrated type high-thermal-conductivity circuit board and manufacturing method thereof |
| CN103353065A (en) * | 2013-06-17 | 2013-10-16 | 苏州晶品光电科技有限公司 | Optical engine structure with same substrate |
| CN103811433A (en) * | 2012-11-13 | 2014-05-21 | 通用电气公司 | Low profile surface mount package with isolated tab |
| CN103813642A (en) * | 2013-11-07 | 2014-05-21 | 溧阳市江大技术转移中心有限公司 | Method for forming conductive circuit on insulated metal substrate |
| CN104349586A (en) * | 2013-07-31 | 2015-02-11 | 黄小蔓 | Ceramic-based manganese coating wire PCB and preparation method thereof |
| WO2015074552A1 (en) * | 2013-11-21 | 2015-05-28 | 何文铭 | Led lighting module structure and method for manufacturing same |
| CN105098049A (en) * | 2015-07-13 | 2015-11-25 | 宁波亚茂光电股份有限公司 | LED (Light Emitting Diode) aluminium substrate having high thermal conductivity and manufacturing process thereof |
| CN107267806A (en) * | 2017-06-06 | 2017-10-20 | 深圳天珑无线科技有限公司 | Shell fragment and preparation method thereof, electronic installation |
| CN107640961A (en) * | 2017-09-28 | 2018-01-30 | 江西理工大学 | A kind of preparation method of high heat conduction aluminum oxide ceramics copper-clad plate |
| CN107708296A (en) * | 2017-10-19 | 2018-02-16 | 深圳职业技术学院 | A kind of metal-based circuit board of high heat conduction and preparation method thereof |
| CN107858625A (en) * | 2017-05-24 | 2018-03-30 | 武汉华工激光工程有限责任公司 | A kind of preparation technology and equipment of aluminium alloy base plate printed circuit board |
| CN107864560A (en) * | 2017-05-02 | 2018-03-30 | 武汉华工激光工程有限责任公司 | The PCB that the manufacture method of ceramic PCB a kind of and manufacture obtain |
| CN109168252A (en) * | 2018-10-26 | 2019-01-08 | 业成科技（成都）有限公司 | Circuit board and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0575225A (en) * | 1991-09-18 | 1993-03-26 | Hitachi Chem Co Ltd | Metallic base printed wiring substrate and its manufacture |
| CN101257140A (en) * | 2007-03-02 | 2008-09-03 | 耀登科技股份有限公司 | Method for manufacturing aerial module group through laser engraving |
| CN101661977A (en) * | 2008-08-27 | 2010-03-03 | 北京盘天新技术有限公司 | Preparation method of insulating metal substrate for high-power LED packaging |
-
2012
- 2012-07-12 CN CN2012102407121A patent/CN102740604A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0575225A (en) * | 1991-09-18 | 1993-03-26 | Hitachi Chem Co Ltd | Metallic base printed wiring substrate and its manufacture |
| CN101257140A (en) * | 2007-03-02 | 2008-09-03 | 耀登科技股份有限公司 | Method for manufacturing aerial module group through laser engraving |
| CN101661977A (en) * | 2008-08-27 | 2010-03-03 | 北京盘天新技术有限公司 | Preparation method of insulating metal substrate for high-power LED packaging |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103811433B (en) * | 2012-11-13 | 2019-01-01 | 通用电气公司 | A kind of surface mount package |
| CN103811433A (en) * | 2012-11-13 | 2014-05-21 | 通用电气公司 | Low profile surface mount package with isolated tab |
| CN103118494A (en) * | 2013-01-29 | 2013-05-22 | 苏州市嘉明机械制造有限公司 | Pressing runner plate of electric press for pressing processing of printed circuit boards |
| CN103118494B (en) * | 2013-01-29 | 2015-09-16 | 苏州市嘉明机械制造有限公司 | For the runner plate of circuit board pressing processing procedure electric press pressing |
| CN103327734A (en) * | 2013-05-28 | 2013-09-25 | 上海九军电子科技有限公司 | Integrated type high-thermal-conductivity circuit board and manufacturing method thereof |
| CN103277749A (en) * | 2013-05-28 | 2013-09-04 | 上海九军电子科技有限公司 | Integrated all-round-light circuit board and manufacturing method thereof |
| CN103327734B (en) * | 2013-05-28 | 2016-06-22 | 上海九军电子科技有限公司 | High heat-conduction circuit board of integration and preparation method thereof |
| CN103327732A (en) * | 2013-06-09 | 2013-09-25 | 中山大学 | High heat conduction substrate and manufacturing method thereof |
| CN103327732B (en) * | 2013-06-09 | 2016-06-08 | 中山大学 | A kind of high thermal conductive substrate and preparation method thereof |
| CN103298244A (en) * | 2013-06-15 | 2013-09-11 | 鑫茂电子（昆山）有限公司 | Circuit board |
| CN103353065A (en) * | 2013-06-17 | 2013-10-16 | 苏州晶品光电科技有限公司 | Optical engine structure with same substrate |
| CN103353065B (en) * | 2013-06-17 | 2015-02-18 | 苏州晶品光电科技有限公司 | Optical engine structure with same substrate |
| CN104349586A (en) * | 2013-07-31 | 2015-02-11 | 黄小蔓 | Ceramic-based manganese coating wire PCB and preparation method thereof |
| CN103813642A (en) * | 2013-11-07 | 2014-05-21 | 溧阳市江大技术转移中心有限公司 | Method for forming conductive circuit on insulated metal substrate |
| CN103813642B (en) * | 2013-11-07 | 2017-02-01 | 溧阳市江大技术转移中心有限公司 | Method for forming conductive circuit on insulated metal substrate |
| WO2015074552A1 (en) * | 2013-11-21 | 2015-05-28 | 何文铭 | Led lighting module structure and method for manufacturing same |
| CN105098049A (en) * | 2015-07-13 | 2015-11-25 | 宁波亚茂光电股份有限公司 | LED (Light Emitting Diode) aluminium substrate having high thermal conductivity and manufacturing process thereof |
| CN107864560A (en) * | 2017-05-02 | 2018-03-30 | 武汉华工激光工程有限责任公司 | The PCB that the manufacture method of ceramic PCB a kind of and manufacture obtain |
| CN107858625A (en) * | 2017-05-24 | 2018-03-30 | 武汉华工激光工程有限责任公司 | A kind of preparation technology and equipment of aluminium alloy base plate printed circuit board |
| CN107267806A (en) * | 2017-06-06 | 2017-10-20 | 深圳天珑无线科技有限公司 | Shell fragment and preparation method thereof, electronic installation |
| CN107640961A (en) * | 2017-09-28 | 2018-01-30 | 江西理工大学 | A kind of preparation method of high heat conduction aluminum oxide ceramics copper-clad plate |
| CN107640961B (en) * | 2017-09-28 | 2020-06-23 | 江西理工大学 | Preparation method of high-thermal-conductivity aluminum oxide ceramic copper-clad plate |
| CN107708296A (en) * | 2017-10-19 | 2018-02-16 | 深圳职业技术学院 | A kind of metal-based circuit board of high heat conduction and preparation method thereof |
| CN109168252A (en) * | 2018-10-26 | 2019-01-08 | 业成科技（成都）有限公司 | Circuit board and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102740604A (en) | Method for manufacturing insulating metal base plate of electronic circuit | |
| CN107078110A (en) | IGBT modules and its manufacture method | |
| CN103985691B (en) | Semiconductor device | |
| US20060234021A1 (en) | Multi-layer ceramic substrate, method for manufacturing the same and electronic device using the same | |
| KR20150073041A (en) | Method of forming conductive traces on insulated substrate | |
| TW201041093A (en) | Section-difference type ceramics base copper-clad laminate set and manufacturing method thereof | |
| KR101096114B1 (en) | Manufacturing Method for Integrated Semiconductor Power Module Substrate | |
| CN102291928A (en) | Heat-conducting insulating aluminum nitride metal base plate and manufacturing method thereof | |
| CN103094126B (en) | The preparation method of the trickle three-dimensional conducting wire of ceramic components | |
| CN103313509B (en) | A kind of Metal Substrate conducting wire plate and preparation method thereof | |
| JP5902557B2 (en) | Multilayer wiring board and electronic device | |
| KR101045307B1 (en) | Method for manufacturing metal core pcb | |
| CN104439724A (en) | Method for machining conductive channels on ceramic substrate through lasers | |
| JP5486608B2 (en) | Insulating structure and manufacturing method thereof | |
| KR20100121187A (en) | Base metal printed circuit board for hi-effective light-emitting diode package and the method thereof | |
| KR101897641B1 (en) | Method for manufacturing power module package and the power module package using the same | |
| CN106340581A (en) | CSP lamp bead packaging method | |
| CN105914283B (en) | Heat-radiating substrate, power module and the method for preparing heat-radiating substrate | |
| CN109148411A (en) | Heat-radiating substrate and preparation method thereof | |
| CN103966538A (en) | Tungsten-copper composite material for electronic packaging and heat sink materials and preparation method of tungsten-copper composite material | |
| JP7198178B2 (en) | CERAMIC SUBSTRATE, CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND POWER MODULE | |
| TWM536989U (en) | Large area ceramic substrate structure | |
| CN1702863A (en) | Circuit device | |
| CN1174445C (en) | Process for preparing etched single-layer and laminated pellet inductor | |
| KR102621334B1 (en) | Manufacturing method of ceramic heat dissipation substrate simplified masking process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20121017 |