CN103118494B - For the runner plate of circuit board pressing processing procedure electric press pressing - Google Patents
For the runner plate of circuit board pressing processing procedure electric press pressing Download PDFInfo
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- CN103118494B CN103118494B CN201310033282.0A CN201310033282A CN103118494B CN 103118494 B CN103118494 B CN 103118494B CN 201310033282 A CN201310033282 A CN 201310033282A CN 103118494 B CN103118494 B CN 103118494B
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- insulating barrier
- runner plate
- pressing
- electric press
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Abstract
The invention discloses a kind of runner plate for the pressing of circuit board pressing processing procedure electric press, described runner plate comprises intermediate layer, upper insulating barrier and lower insulating barrier, described intermediate layer is folded between described upper insulating barrier and described lower insulating barrier, described intermediate layer is the metallic plate of hardness within the scope of HV170 ~ HV700, the hardness of described upper insulating barrier and described lower insulating barrier is HV300 ~ HV2000, and its surface roughness is Ra0.05 ~ Ra2.1.The present invention is used for the runner plate of electric press pressing, can improve the useful life of runner plate, improves the workmanship of wiring board, thus reduces the cost manufacturing wiring board.
Description
Technical field
The present invention relates to wiring board manufacture field, particularly relate to a kind of runner plate for the pressing of circuit board pressing processing procedure electric press.
Background technology
Existing wiring board (pcb) electric press process for pressing, needs very large pressure (400PSI/cm because press closes technique
2), thus existing mainly exist following two problems: be 1,6 layers and 6 layers of Above Transmission Lines plate for product, before pressing, need pre-riveted (general a slice plate 4 ~ 8 points), the out-of-flatness of this riveted point can cause runner plate in bonding processes, by the impact of high pressure, produce distortion and depression.The distortion of runner plate and be recessed in and follow-up recycle in process, the quality of wiring board (pcb) will be had influence on, thus produce a large amount of scrap cost, and the hardness of the runner plate that existing aluminum is made generally only has HV100, its useful life generally can only press about 60 ~ 100 times (very low), and this also will increase the production cost that wiring board (pcb) manufactures greatly.2, the raw material of existing runner plate are aluminium materials, and the coefficient of cubical expansion that is heated of aluminium material is: 23.0 × 10
-6~ 23.5 × 10
-61/K(is larger), when heated, under the effect of the pressure, wiring board (pcb) can produce distortion along with the volumetric expansion of runner plate, programming rate is faster, the distortion that wiring board (pcb) produces is larger, thus makes wiring board (pcb) produce certain scrapping, and this also will increase the production cost that wiring board (pcb) manufactures greatly.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of runner plate for the pressing of circuit board pressing processing procedure electric press, by improving the hardness of runner plate itself, reduce degree and the area of distortion and depression, thus promote the useful life of runner plate, improve the quality of wiring board (pcb) product, reduce consumer product quality to scrap, and then reduce overall manufacturing cost.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of runner plate for the pressing of circuit board pressing processing procedure electric press, comprise intermediate layer, upper insulating barrier and lower insulating barrier, described intermediate layer is folded between described upper insulating barrier and described lower insulating barrier, described intermediate layer is the metallic plate of hardness within the scope of HV170 ~ HV700, the hardness of described upper insulating barrier and described lower insulating barrier is HV300 ~ HV2000, and its surface smoothness is Ra0.05 ~ Ra2.1.
In a preferred embodiment of the present invention, described runner plate also comprises aluminium lamination, and described aluminium lamination lays respectively at the both sides in described intermediate layer, and on described between insulating barrier and described lower insulating barrier.
In a preferred embodiment of the present invention, described time outer field surface forms described upper insulating barrier and described lower insulating barrier by oxidation processes.
In a preferred embodiment of the present invention, described intermediate layer is steel plate, corrosion resistant plate or titanium plate.
In a preferred embodiment of the present invention, the material of described upper insulating barrier and described lower insulating barrier is metal oxide or pottery.
In a preferred embodiment of the present invention, described metal oxide is oxide or the zirconia of aluminium.
In a preferred embodiment of the present invention, the thickness range in described intermediate layer is 0.4-10mm, and the thickness range of described surface insulation layer is 0.01-2mm.
The invention has the beneficial effects as follows: the runner plate that the present invention is used for the pressing of circuit board pressing processing procedure electric press has the following advantages:
1. select new type steel (or titanium material, stainless steel stainless iron etc.) manufacture electric press pressing runner plate, useful life promotes more than 187% than raw material, reduces the consumption of resource, reduce the manufacturing cost of wiring board (pcb), also will reduce the manufacturing cost of whole electronic product.
2. select new type steel (or titanium material, stainless steel, stainless iron etc.) manufacture electric press pressing runner plate, due to the hardness raising of material itself and the reduction of the coefficient of cubical expansion that is heated, runner plate distortion and sinking degree can be reduced, improve the deformation stability produced with the volumetric expansion of runner plate in heating process, thus improve the quality of wiring board (pcb), minimizing is scrapped, and reduces the manufacturing cost of wiring board (pcb), thus also reduces solid pollution.
In sum, the present invention is used for the runner plate of circuit board pressing processing procedure electric press pressing, and the hardness of the steel (or titanium material) of employing is HV200 ~ HV700, improves 100% ~ 600% than primary aluminum material hardness.Test by experiment, useful life can promote more than 200% (>230 time), and reduces the integrated cost about 20% of runner plate, and reduce the consumption of bauxite resource, have lifting to consumer product quality, minimizing is scrapped, thus reduces solid pollution.
Accompanying drawing explanation
Fig. 1 is the structure tangent plane schematic diagram of the present invention for runner plate one preferred embodiment of electric press pressing;
Fig. 2 is the structure tangent plane schematic diagram of the present invention for another preferred embodiment of runner plate of electric press pressing;
Fig. 3 is the schematic diagram of electric press;
Fig. 4 is primary aluminum material deformation tendency chart;
Fig. 5 is runner plate material deformation tendency chart of the present invention.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in detail, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
Refer to Fig. 1, the embodiment of the present invention comprises:
A kind of runner plate 100 for the pressing of circuit board pressing processing procedure electric press, form by three layers, comprise intermediate layer 10 and the surface insulation layer 21,22 being compounded in upper and lower surface, described intermediate layer 10, described intermediate layer 10 is steel plate, corrosion resistant plate or titanium plate, the hardness range in described intermediate layer 10 is HV170 ~ HV700, and the thickness range in described intermediate layer 10 is 0.4-10mm; Described surface insulation layer 21,22 is oxide or the metal oxide such as pottery or zirconia of aluminium, described surface insulation layer 21,22 hardness range is HV300 ~ HV2000, its surface smoothness scope is Ra0.05 ~ Ra2.1, and the thickness range of described surface insulation layer 21,22 is 0.01-2mm.
Figure 2 shows that the structural representation of the present invention for another embodiment of runner plate 100 ' of electric press pressing, described runner plate 100 ' forms by five layers, comprises intermediate layer 10 ', secondary outer 31,32 and surface insulation layer 21 ', 22 '.Described intermediate layer 10 ' is steel plate, corrosion resistant plate or titanium plate, and its thickness range is preferably 0.4-20mm, and its hardness is HV200 ~ HV700.Described time outer 31 ', 32 ' is aluminum, the thickness range on its surface is 0.01-2mm, the aluminium of described outer 31,32 surface thickness scopes makes it have the feature of insulation and high rigidity (HV is greater than 300) by surface treatment (a kind of oxidation technology), thus forms surface insulation layer 21 ', 22 '.
Shown in composition graphs 3, a kind of wiring board (pcb) electric press pressing working procedure, electric press pressing material, and apply certain pressure (400PSI/cm
2), epoxide resin material is melted and makes it flow, then change into solidification thus by one or more internal layer etching after plate 300(through melanism or brown process) and Copper Foil 200 be bonded into one piece of multilayer circuit board (pcb).Runner plate 100 is be superimposed in the middle of multilayer line panel products in this processing procedure, and for runner plate 100 is positioned in the middle of adjacent two layers Copper Foil 200 shown in Fig. 3, insulation is played in the effect of runner plate 100, and heat transfer supports and centrifugation.
The runner plate of electric press pressing of the present invention can be effective as follows:
1) hardness of steel (or titanium material, stainless steel stainless iron etc.) is HV170 ~ HV700, improves 100% ~ 600% than primary aluminum material hardness.Do experiment in the technique that wiring board (pcb) is identical, result is as follows:
1. different hardness runner plate is in useful life, the performance that cost etc. are local:
| Hardness (HV) | Useful life (secondary) | Life-span increases |
| 100 | 80 | Raw material |
| 250 | 230 | 187% |
| 600 | 350 | 337% |
2. hardness is HV100 runner plate with HV250 runner plate when identical useful life, runner plate distortion and depression picture contrast (useful life is at 80 times)
| Hardness | Life-span | Distortion or depression size | Rejection judgment |
| HV250 | 80 times | Diameter 8mm | OK |
| HV100 | 80 times | Diameter 23mm | Scrap |
Conclusion: from experimental result above, select new type steel (or titanium material, stainless steel stainless iron etc.) to manufacture electric press pressing runner plate, because the hardness of material itself improves, the life-span can promote more than 187%.
2) because the coefficient of cubical expansion that is heated of steel (or titanium material, stainless steel stainless iron etc.) is: be less than 12.0 × 10
-61/K, less by more than 100% than the coefficient of cubical expansion that is heated of primary aluminum material, do experiment in the technique that wiring board (pcb) is identical, result as shown in Figure 4 and Figure 5.
From experimental result above, select new type steel (or titanium material, stainless steel stainless iron etc.) manufacture electric press pressing runner plate, because the coefficient of cubical expansion that is heated of material itself improves, in equal programming rate situation, the deformation stability that wiring board (pcb) produces with the volumetric expansion of runner plate can improve more than 20%.
The runner plate that the present invention is used for electric press pressing has the following advantages:
1. select new type steel (or titanium material, stainless steel stainless iron etc.) manufacture electric press pressing runner plate, useful life promotes more than 187% than raw material, reduces the consumption of resource, reduce the manufacturing cost of wiring board (pcb), also will reduce the manufacturing cost of whole electronic product
2. select new type steel (or titanium material, stainless steel, stainless iron etc.) manufacture electric press pressing runner plate, due to the hardness raising of material itself and the reduction of the coefficient of cubical expansion that is heated, runner plate distortion and sinking degree can be reduced, improve the deformation stability produced with the volumetric expansion of runner plate in heating process, thus improve the quality of wiring board (pcb), minimizing is scrapped, and reduces the manufacturing cost of wiring board (pcb), thus also reduces solid pollution.
In sum, the present invention is used for the runner plate of electric press pressing, and the hardness of the steel (or titanium material) of employing is HV200 ~ HV700, improves 100% ~ 600% than primary aluminum material hardness.Test by experiment, useful life can promote more than 200% (>230 time), and reduces the integrated cost about 20% of runner plate, reduce the consumption of bauxite resource, have lifting to consumer product quality, minimizing is scrapped, thus reduces solid pollution.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (6)
1. the runner plate for the pressing of circuit board pressing processing procedure electric press, it is characterized in that, comprise intermediate layer, upper insulating barrier and lower insulating barrier, described intermediate layer is folded between described upper insulating barrier and described lower insulating barrier, described intermediate layer is the metallic plate of hardness within the scope of HV170 ~ HV700, the hardness of described upper insulating barrier and described lower insulating barrier is HV300 ~ HV2000, and its surface roughness is Ra0.05 ~ Ra2.1, described runner plate also comprises time outer field aluminium lamination, described aluminium lamination lays respectively at the both sides in described intermediate layer, and on described between insulating barrier and described lower insulating barrier.
2. the runner plate for the pressing of circuit board pressing processing procedure electric press according to claim 1, is characterized in that, described time outer field surface forms described upper insulating barrier and described lower insulating barrier by oxidation processes.
3. the runner plate for the pressing of circuit board pressing processing procedure electric press according to claim 1, is characterized in that, described intermediate layer is steel plate or titanium plate.
4. according to the runner plate for the pressing of circuit board pressing processing procedure electric press described in claim 1, it is characterized in that, the material of described upper insulating barrier and described lower insulating barrier is metal oxide or pottery.
5. according to the runner plate for the pressing of circuit board pressing processing procedure electric press described in claim 4, it is characterized in that, described metal oxide is oxide or the zirconia of aluminium.
6. according to the runner plate for the pressing of circuit board pressing processing procedure electric press described in claim 1, it is characterized in that, the thickness range in described intermediate layer is 0.4-10mm, and the thickness range of described surface insulation layer is 0.01-2mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310033282.0A CN103118494B (en) | 2013-01-29 | 2013-01-29 | For the runner plate of circuit board pressing processing procedure electric press pressing |
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| CN201310033282.0A CN103118494B (en) | 2013-01-29 | 2013-01-29 | For the runner plate of circuit board pressing processing procedure electric press pressing |
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| CN103118494A CN103118494A (en) | 2013-05-22 |
| CN103118494B true CN103118494B (en) | 2015-09-16 |
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Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104862692B (en) * | 2015-05-22 | 2017-07-21 | 苏州市嘉明机械制造有限公司 | A kind of low breathing runner plate of anti-depression |
| CN104927414B (en) * | 2015-05-22 | 2017-10-24 | 苏州市嘉明机械制造有限公司 | A kind of insulating coating for being used to protect runner plate |
| CN104862689B (en) * | 2015-05-22 | 2017-08-01 | 苏州市嘉明机械制造有限公司 | A kind of runner plate high life insulating coating of resistance to hot pressing |
| CN105483601A (en) * | 2015-12-10 | 2016-04-13 | 苏州市嘉明机械制造有限公司 | Method for manufacturing long-life insulation mirror plate based on plasma spraying |
| CN105586563A (en) * | 2015-12-10 | 2016-05-18 | 苏州市嘉明机械制造有限公司 | Manufacturing method for anti-sinking insulation mirror plates based on plasma spraying |
| CN105517334A (en) * | 2015-12-10 | 2016-04-20 | 苏州市嘉明机械制造有限公司 | Impregnation technology based production process of high-strength insulation runner plate |
| CN105568204A (en) * | 2015-12-10 | 2016-05-11 | 苏州市嘉明机械制造有限公司 | Plasma-spray-based manufacturing method of hot-pressing-resistant insulating mirror plate |
| CN105568203A (en) * | 2015-12-10 | 2016-05-11 | 苏州市嘉明机械制造有限公司 | Plasma-spray-based manufacturing method of scratch-resistant insulating mirror plate |
| CN105349929A (en) * | 2015-12-10 | 2016-02-24 | 苏州市嘉明机械制造有限公司 | Production process of low-dilatation and low-shrinkage insulated mirror boards based on impregnation process |
| CN105420660A (en) * | 2015-12-10 | 2016-03-23 | 苏州市嘉明机械制造有限公司 | Abrasion-resistant insulating thrust runner manufacturing method based on plasma spraying |
| CN108966509A (en) * | 2018-09-27 | 2018-12-07 | 盐城嘉腾机电有限公司 | A kind of traceable spontaneous heating runner plate |
| CN109068489B (en) * | 2018-09-27 | 2024-04-26 | 盐城嘉腾机电有限公司 | Self-heating mirror plate for laminating circuit board |
| CN108925052B (en) * | 2018-09-27 | 2024-03-22 | 盐城嘉腾机电有限公司 | Self-heating insulating mirror plate |
| CN111278241A (en) * | 2020-02-20 | 2020-06-12 | 盐城维信电子有限公司 | Composite film for voltage machine and use method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102625571A (en) * | 2012-03-19 | 2012-08-01 | 苏州市嘉明机械制造有限公司 | Pressed aluminum mirror board for electric press |
| CN102740604A (en) * | 2012-07-12 | 2012-10-17 | 苏州衡业新材料科技有限公司 | Method for manufacturing insulating metal base plate of electronic circuit |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10131887A1 (en) * | 2001-07-04 | 2003-01-23 | Dieter Backhaus | Divider or method for producing a divider for a multilayer press package |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102625571A (en) * | 2012-03-19 | 2012-08-01 | 苏州市嘉明机械制造有限公司 | Pressed aluminum mirror board for electric press |
| CN102740604A (en) * | 2012-07-12 | 2012-10-17 | 苏州衡业新材料科技有限公司 | Method for manufacturing insulating metal base plate of electronic circuit |
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