CN107267806A - Shell fragment and preparation method thereof, electronic installation - Google Patents
Shell fragment and preparation method thereof, electronic installation Download PDFInfo
- Publication number
- CN107267806A CN107267806A CN201710420536.2A CN201710420536A CN107267806A CN 107267806 A CN107267806 A CN 107267806A CN 201710420536 A CN201710420536 A CN 201710420536A CN 107267806 A CN107267806 A CN 107267806A
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- CN
- China
- Prior art keywords
- shell fragment
- copper
- mass percentage
- percentage content
- copper alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Non-Insulated Conductors (AREA)
Abstract
The present invention provides the electronic installation of a kind of shell fragment, the preparation method and application of the shell fragment shell fragment.The shell fragment is applied to electronic installation, and the shell fragment includes containing nickel element, element silicon, Zn-ef ficiency, tin element, magnesium elements, chromium and copper in copper alloy matrix, the copper alloy matrix.The shell fragment of the present invention has the advantages that price is low and electric conductivity is good.
Description
Technical field
The present invention relates to technical field of electronic device, more particularly to a kind of shell fragment, the preparation method and application of the shell fragment should
The electronic installation of shell fragment.
Background technology
At present, in electronic installation antenna shrapnel and the material of grounding elastic part is usually CTB alloy, so that antenna shrapnel
There is preferably electric conductivity with grounding elastic part.However, CTB alloy has the shortcomings that price is high.
The content of the invention
It is a primary object of the present invention to provide a kind of shell fragment, it is desirable to provide the shell fragment that cost is low and electric conductivity is good.
In order to solve the above technical problems, the shell fragment that the present invention is provided is applied to electronic installation, the shell fragment includes copper alloy
Contain nickel element, element silicon, Zn-ef ficiency, tin element, magnesium elements, chromium and copper in matrix, the copper alloy matrix.
Preferably, in the copper alloy matrix containing mass percentage content for 3~4.5% nickel element, quality percentage
Zn-ef ficiency that the element silicon for being 0.5~1.5% than content, mass percentage content are 0.2~1.0%, mass percentage content
The magnesium elements for being 0.05~0.15% for 0.05~0.15% tin element, mass percentage content, mass percentage content are
0.1~0.3% chromium, surplus is copper.
Preferably, contain in the copper alloy matrix containing the nickel element, mass percent that mass percentage content is 3.8%
The tin member that Zn-ef ficiency that element silicon that amount is 0.9%, mass percentage content are 0.5%, mass percentage content are 0.1%
Element, mass percentage content be 0.1% magnesium elements, mass percentage content be 0.2% chromium, surplus is copper.
Preferably, the shell fragment also includes at least one layer of metal level for being formed at the copper alloy matrix surface, the metal
The material of layer is selected from least one of gold, silver, nickel, copper, tungsten and aluminium.
Preferably, the scope of the thickness of the metal level is 0.05~0.2 micron.
Preferably, the scope of the thickness of the metal level is 0.1~0.15 micron.
Preferably, the shell fragment also includes being formed at the antirust coat of the layer on surface of metal, the material of the antirust coat be selected from zinc,
Or kirsite.
Preferably, the scope of the thickness of the antirust coat is 0.2~0.4 micron.
The present invention also provides a kind of preparation method of shell fragment, comprises the following steps：
Nickel element, element silicon, Zn-ef ficiency, tin element, magnesium elements, chromium and copper are provided；
Casting processing is carried out to nickel element, element silicon, Zn-ef ficiency, tin element, magnesium elements, chromium and copper, obtained
Copper alloy matrix, is made shell fragment.
The present invention also provides a kind of electronic installation, including circuit board and antenna, in addition to the shell fragment, one end of the shell fragment
Antenna is abutted, the other end is electrically connected with circuit board.
The present invention also provides another electronic installation, including battery, in addition to the shell fragment, and one end of the shell fragment is grounded,
The other end abuts battery.
The shell fragment of technical solution of the present invention includes containing nickel element, element silicon, zinc in copper alloy matrix, the copper alloy matrix
Element, tin element, magnesium elements, chromium and copper.Preferably metallic element is had conductivity because the copper alloy matrix contains,
Such as：Nickel element, Zn-ef ficiency, tin element, magnesium elements, chromium and copper so that the conductive advantage that can be good of the shell fragment.
Further, nickel element, element silicon, Zn-ef ficiency, tin element, magnesium elements, chromium and the copper of copper alloy matrix is made
Relative low price so that the shell fragment also has the advantages that cost is low.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Structure according to these accompanying drawings obtains other accompanying drawings.
Fig. 1 is the sectional view of the shell fragment of one embodiment of the invention.
Fig. 2 is the sectional view of the shell fragment of another embodiment of the present invention.
Drawing reference numeral explanation：
| Label | Title | Label | Title |
| 100 | Shell fragment | 30 | Metal level |
| 10 | Matrix | 50 | Antirust coat |
The realization, functional characteristics and advantage of the object of the invention will be described further referring to the drawings in conjunction with the embodiments.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art obtained under the premise of creative work is not made it is all its
His embodiment, belongs to the scope of protection of the invention.
It is to be appreciated that institute is directional in the embodiment of the present invention indicates that (such as up, down, left, right, before and after ...) is only used
In explaining relative position relation, motion conditions under a certain particular pose (as shown in drawings) between each part etc., if should
When particular pose changes, then directionality indicates also correspondingly therewith to change.
In addition, the description for being related to " first ", " second " etc. in the present invention is only used for describing purpose, and it is not intended that referring to
Show or imply its relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, " first ", " are defined
At least one this feature can be expressed or be implicitly included to two " feature.In addition, the technical scheme between each embodiment can
To be combined with each other, but must can be implemented as basis with those of ordinary skill in the art, when the combination of technical scheme occurs
It is conflicting or when can not realize it will be understood that the combination of this technical scheme is not present, also not in the protection model of application claims
Within enclosing.
Fig. 1-2 is refer to, the present invention provides a kind of shell fragment 100.
The shell fragment 100 is applied to electronic installation.
The shell fragment 100 includes copper alloy matrix 10, in the copper alloy matrix 10 containing nickel element, element silicon, Zn-ef ficiency,
Tin element, magnesium elements, chromium and copper.
The shell fragment 100 also has the advantages that intensity is good and processability is good.
Physical property to the shell fragment 100 is tested, and test result is shown：The thermal coefficient of expansion of the shell fragment be 17 ×
10-6~18 × 10-6K, pyroconductivity is 140~160W/m.K, and conductance is 35~40%, and proportion is 8~9, and coefficient of elasticity is
100~120, modulus of elasticity coefficient is 90~100GPa.
The shell fragment 100 of technical solution of the present invention includes containing nickel element, silicon in copper alloy matrix 10, the copper alloy matrix 10
Element, Zn-ef ficiency, tin element, magnesium elements, chromium and copper.Had conductivity preferably because the copper alloy matrix 10 contains
Metallic element, such as：Nickel element, Zn-ef ficiency, tin element, magnesium elements, chromium and copper so that the shell fragment 100 has conduction
The advantage of excellent performance.Further, nickel element, element silicon, Zn-ef ficiency, tin element, magnesium elements, the chromium of copper alloy matrix 10 is made
The relative low price of element and copper so that the shell fragment 100 also has the advantages that cost is low.
Nickel element, mass percentage content in the copper alloy matrix 10 containing mass percentage content for 3~4.5%
The Zn-ef ficiency for being 0.2~1.0% for 0.5~1.5% element silicon, mass percentage content, mass percentage content are 0.05
Magnesium elements that~0.15% tin element, mass percentage content are 0.05~0.15%, mass percentage content be 0.1~
0.3% chromium, surplus is copper.
Nickel element, Zn-ef ficiency, tin element, magnesium elements, chromium and copper in the copper alloy matrix 10 be respectively provided with compared with
Good electric conductivity so that the electric conductivity of the copper alloy matrix 10 is good.
Nickel element, matter in the copper alloy matrix 10 of technical solution of the present invention containing mass percentage content for 3~4.5%
Measure degree be 0.5~1.5% element silicon, mass percentage content be 0.2~1.0% Zn-ef ficiency, quality percentage
Magnesium elements that the tin element for being 0.05~0.15% than content, mass percentage content are 0.05~0.15%, mass percent
Content is 0.1~0.3% chromium, and surplus is copper so that the copper alloy matrix 10 has preferably electric conductivity, and
Easy processing.The main component of the copper alloy matrix 10 is copper, and the price of copper is more cheap, and in copper alloy matrix 10
Price containing other elements is also more cheap so that the cost of the copper alloy matrix 10 is relatively low.
The nickel element for being 3.8% containing mass percentage content in the copper alloy matrix 10, mass percentage content are
Tin element that Zn-ef ficiency that 0.9% element silicon, mass percentage content are 0.5%, mass percentage content are 0.1%, matter
Measure degree be 0.1% magnesium elements, mass percentage content be 0.2% chromium, surplus is copper.
Nickel element, quality in the copper alloy matrix 10 of technical solution of the present invention containing mass percentage content for 3.8%
Zn-ef ficiency that element silicon that degree is 0.9%, mass percentage content are 0.5%, mass percentage content are 0.1%
Tin element, mass percentage content be 0.1% magnesium elements, mass percentage content be 0.2% chromium, surplus is copper
Element so that the copper alloy matrix 10 has preferably electric conductivity, and easy processing.The main component of the copper alloy matrix 10 is
Copper, the price of copper is more cheap, and the price containing other elements is also more cheap in copper alloy matrix 10 so that
The cost of the copper alloy matrix 10 is relatively low.
The shell fragment 100 also includes at least one layer of metal level 30 for being formed at the surface of copper alloy matrix 10, the metal
The material of layer 30 is selected from least one of gold, silver, nickel, copper, tungsten and aluminium.Preferably gold element and nickel element.
It should be understood that the shell fragment 100 includes the layer of metal layer 30 for being formed at the surface of copper alloy matrix 10, the metal level
30 material is selected from least one of gold, silver, nickel, copper, tungsten and aluminium.
It should be understood that the shell fragment 100 includes being sequentially formed in the two metal layers 30 on the surface of copper alloy matrix 10, this two
The material of layer metal level 30 is selected from least one of gold, silver, nickel, copper, tungsten and aluminium, and the two metal layers 30 material not
Together.
The shell fragment 100 of technical solution of the present invention also includes at least one layer of metal for being formed at the surface of copper alloy matrix 10
Layer 30, the material of the metal level 30 is selected from least one of gold, silver, nickel, copper, tungsten and aluminium so that the metal level 30 also has
Preferably electric conductivity, to strengthen the electric conductivity of shell fragment 100.And the metal level 30 is covered in the surface of copper alloy matrix 10,
To protect copper alloy matrix 10 not corroded so that the copper alloy matrix 10 is difficult to get rusty.
The scope of the thickness of the metal level 30 is 0.05~0.2 micron.Preferably, the scope of the thickness of the metal level 30 is
0.1~0.15 micron.
The scope of the thickness of the metal level 30 of technical solution of the present invention is the gold in 0.05~0.2 micron, the thickness range
Belonging to layer 30 not only has preferably electric conductivity, and also copper alloy matrix 10 can be effectively protected.
The shell fragment 100 also includes the antirust coat 50 for being formed at the surface of metal level 30, and the material of the antirust coat 50 is selected from
Zinc or kirsite.
The shell fragment 100 of technical solution of the present invention also includes the antirust coat 50 for being formed at the surface of metal level 30, the antirust coat
50 material is selected from zinc or kirsite, and the antirust coat 30 can protect copper alloy matrix 10 to be difficult to get rusty, do not corroded, also protect
Metal level 30 is not by scratch, so that the service life of the shell fragment 100 is longer.
The scope of the thickness of the antirust coat 50 is 0.2~0.4 micron.Preferably 0.25~0.3 micron.
The scope of the thickness of the antirust coat 50 of technical solution of the present invention is the antirust in 0.2~0.4 micron, the thickness range
Layer 30 can preferably be protected to metal level 30 and copper alloy matrix 10.
The present invention also provides a kind of preparation method of shell fragment, comprises the following steps：
Nickel element, element silicon, Zn-ef ficiency, tin element, magnesium elements, chromium and copper are provided；
Casting processing is carried out to nickel element, element silicon, Zn-ef ficiency, tin element, magnesium elements, chromium and copper, obtained
Copper alloy matrix 10, is made shell fragment 100.
It should be understood that casting processing can be to nickel element, element silicon, Zn-ef ficiency, tin element, magnesium elements, chromium
And copper is carried out after melting processing, then pressure bundle processing formation crude green body is carried out, forming processes formation copper alloy is carried out to the crude green body
Matrix 10.
The present invention also provides a kind of electronic installation (not shown), including circuit board and antenna, the shell fragment 100, the shell fragment
100 one end abuts antenna, and the other end is electrically connected with circuit board.
The shell fragment 100 is antenna shrapnel.
Because the electronic installation employs whole technical schemes of above-mentioned all embodiments, therefore at least there is above-mentioned implementation
All beneficial effects that the technical scheme of example is brought, this is no longer going to repeat them.
It should be understood that the electronic installation also includes the necessary element of other its function of implementation, such as：Display screen, battery
Deng.
The electronic installation can be mobile phone, desktop computer, notebook, tablet personal computer etc..
The present invention also provides another electronic installation (not shown), including battery, in addition to the shell fragment 100, the shell fragment
100 one end ground connection, the other end abuts battery.
The shell fragment 100 is grounding elastic part.
Because the electronic installation employs whole technical schemes of above-mentioned all embodiments, therefore at least there is above-mentioned implementation
All beneficial effects that the technical scheme of example is brought, this is no longer going to repeat them.
It should be understood that the electronic installation also includes the necessary element of other its function of implementation, such as：Circuit board, display
Screen etc..
The electronic installation can be mobile phone, desktop computer, notebook, tablet personal computer etc..
The preferred embodiments of the present invention are these are only, are not intended to limit the scope of the invention, it is every in the present invention
Inventive concept under, the equivalent structure transformation made using description of the invention and accompanying drawing content, or be directly or indirectly used in
Other related technical fields are included in the scope of patent protection of the present invention.
Claims (11)
1. a kind of shell fragment, applied to electronic installation, it is characterised in that the shell fragment includes copper alloy matrix, the copper alloy matrix
In contain nickel element, element silicon, Zn-ef ficiency, tin element, magnesium elements, chromium and copper.
2. shell fragment as claimed in claim 1, it is characterised in that it is 3 to contain mass percentage content in the copper alloy matrix
Element silicon that~4.5% nickel element, mass percentage content are 0.5~1.5%, mass percentage content are 0.2~1.0%
Zn-ef ficiency, mass percentage content be 0.05~0.15% tin element, mass percentage content be 0.05~0.15%
Magnesium elements, mass percentage content are 0.1~0.3% chromium, and surplus is copper.
3. shell fragment as claimed in claim 2, it is characterised in that be containing mass percentage content in the copper alloy matrix
Zn-ef ficiency that element silicon that 3.8% nickel element, mass percentage content are 0.9%, mass percentage content are 0.5%, matter
Amount degree be 0.1% tin element, mass percentage content be 0.1% magnesium elements, mass percentage content be
0.2% chromium, surplus is copper.
4. the shell fragment as described in claim 1-3 is any, it is characterised in that the shell fragment also includes being formed at the copper alloy base
At least one layer of metal level in body surface face, the material of the metal level is selected from least one of gold, silver, nickel, copper, tungsten and aluminium.
5. shell fragment as claimed in claim 4, it is characterised in that the scope of the thickness of the metal level is 0.05~0.2 micron.
6. shell fragment as claimed in claim 5, it is characterised in that the scope of the thickness of the metal level is 0.1~0.15 micron.
7. shell fragment as claimed in claim 4, it is characterised in that the shell fragment also includes the antirust for being formed at the layer on surface of metal
Layer, the material of the antirust coat is selected from zinc or kirsite.
8. shell fragment as claimed in claim 7, it is characterised in that the scope of the thickness of the antirust coat is 0.2~0.4 micron.
9. a kind of preparation method of shell fragment, comprises the following steps：
Nickel element, element silicon, Zn-ef ficiency, tin element, magnesium elements, chromium and copper are provided；
Casting processing is carried out to nickel element, element silicon, Zn-ef ficiency, tin element, magnesium elements, chromium and copper, copper is obtained and closes
Auri body, is made shell fragment.
10. a kind of electronic installation, including circuit board and antenna, it is characterised in that also including as described in claim 1-8 is any
Shell fragment, one end of the shell fragment abuts antenna, and the other end is electrically connected with circuit board.
11. a kind of electronic installation, including battery, it is characterised in that also including the shell fragment as described in claim 1-8 is any, should
One end ground connection of shell fragment, the other end abuts battery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710420536.2A CN107267806A (en) | 2017-06-06 | 2017-06-06 | Shell fragment and preparation method thereof, electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710420536.2A CN107267806A (en) | 2017-06-06 | 2017-06-06 | Shell fragment and preparation method thereof, electronic installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107267806A true CN107267806A (en) | 2017-10-20 |
Family
ID=60065873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710420536.2A Pending CN107267806A (en) | 2017-06-06 | 2017-06-06 | Shell fragment and preparation method thereof, electronic installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107267806A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1770437A (en) * | 2004-11-02 | 2006-05-10 | 台湾积体电路制造股份有限公司 | Bond pad structure |
| CN101605917A (en) * | 2007-02-16 | 2009-12-16 | 株式会社神户制钢所 | Intensity and the copper alloy plate for electric and electronic parts that has excellent formability |
| CN101983249A (en) * | 2008-03-31 | 2011-03-02 | Jx日矿日石金属株式会社 | Cu-ni-si-co-cr alloy for electronic material |
| CN102714915A (en) * | 2010-01-15 | 2012-10-03 | 吉坤日矿日石金属株式会社 | Electronic circuit, method for forming same, and copper clad laminate for electronic circuit formation |
| CN102740604A (en) * | 2012-07-12 | 2012-10-17 | 苏州衡业新材料科技有限公司 | Method for manufacturing insulating metal base plate of electronic circuit |
| CN103703154A (en) * | 2011-08-04 | 2014-04-02 | 株式会社神户制钢所 | Copper alloy |
-
2017
- 2017-06-06 CN CN201710420536.2A patent/CN107267806A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1770437A (en) * | 2004-11-02 | 2006-05-10 | 台湾积体电路制造股份有限公司 | Bond pad structure |
| CN101605917A (en) * | 2007-02-16 | 2009-12-16 | 株式会社神户制钢所 | Intensity and the copper alloy plate for electric and electronic parts that has excellent formability |
| CN101983249A (en) * | 2008-03-31 | 2011-03-02 | Jx日矿日石金属株式会社 | Cu-ni-si-co-cr alloy for electronic material |
| CN102714915A (en) * | 2010-01-15 | 2012-10-03 | 吉坤日矿日石金属株式会社 | Electronic circuit, method for forming same, and copper clad laminate for electronic circuit formation |
| CN103703154A (en) * | 2011-08-04 | 2014-04-02 | 株式会社神户制钢所 | Copper alloy |
| CN102740604A (en) * | 2012-07-12 | 2012-10-17 | 苏州衡业新材料科技有限公司 | Method for manufacturing insulating metal base plate of electronic circuit |
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Application publication date: 20171020 |
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| RJ01 | Rejection of invention patent application after publication |