CN1174445C - Process for preparing etched single-layer and laminated pellet inductor - Google Patents
Process for preparing etched single-layer and laminated pellet inductor Download PDFInfo
- Publication number
- CN1174445C CN1174445C CNB001210785A CN00121078A CN1174445C CN 1174445 C CN1174445 C CN 1174445C CN B001210785 A CNB001210785 A CN B001210785A CN 00121078 A CN00121078 A CN 00121078A CN 1174445 C CN1174445 C CN 1174445C
- Authority
- CN
- China
- Prior art keywords
- inductor
- substrate body
- layer
- wire loop
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
The present invention relates to a method for manufacturing etched single-layer and laminated inductors, which comprises the following steps: a metal film is coated on a base board body; traces are formed on the metal film through exposure and development; a required coil circuit is made by an etching mode; after being etched, the surface of the base board body is cleaned and dried; a protective isolation layer is coated on the surface of the coil circuit; a plurality of base board bodies are piled from top to bottom, and a conductor penetration technology is applied; during piling, isolation layers and insulation layers are coated for protection; a single-layer or laminated wafer body is made in a cutting mode; metal film terminals are made at both ends of the single-layer or laminated wafer body for testing inductor characteristics; a laminated inductor is made. The present invention can greatly increase the number and the density of laminated inductor turns, and thus, the value of the laminated inductor is several times or higher as large as a normal inductor.
Description
Technical field
The present invention relates to a kind of manufacture method of inductance, refer to a kind of manufacture method of pellet inductor especially.
Background technology
Electronic component for adapting to communication, household electrical appliances and compactization of information product and high performance demand, just must make electronic component after volume-diminished now, also need meet the demand of high efficiency performance simultaneously.
Electronic component has been widely used in the pellet inductor of communication, household electrical appliances and information product now, and its wafer surface coil is made mode, and it is to reach with Wound-rotor type, printing or laser cutting mode that tradition is made mode.On traditional winding mode, it is loaded down with trivial details that formality is gone up in terminal processing behind its winding coil processing procedure and die casting processing, easily causes the interruption coil windings, so the specification requirement height.
On the traditional printing mode, its coil is printed on the substrate, is difficult for reaching the granular wire loop because of silk screen printing easily causes problems such as filling in net on processing procedure, does not also attain ideal.
Again on the conventional laser cutting mode, though precisely there is cutting width broad problem in the sectioned coil loop, equally also can't provide the granular coil line, number of inductor and density just can't improve relatively, can't meet the pellet inductor of high now sense value small size demand.
Summary of the invention
Main purpose of the present invention promptly at the bottleneck that is faced on the present industry, provides a kind of wafer of can organizing to process simultaneously more, and the etched single-layer of the granular wire loop of thickness unanimity and the manufacture method of laminated pellet inductor.
Above-mentioned purpose of the present invention is realized by following technical scheme.
The present invention makes the method for etched single-layer pellet inductor, and its step comprises:
(1) the substrate body that provides a slice to make by pottery or magnetic core material;
(2) form at least one metal film with the coating technology in this substrate body;
(3) form a plurality of pattern definition traces by the exposure imaging technology in this metal film;
(4) the pattern definition trace is made the required wire loop of reservation with the etching reaction processing;
(5) etching metacoxal plate surface is given and being cleaned and the oven dry processing:
(6) the wire loop surface coating forms separator protection;
(7) make the individual layer chip body with the cutting means;
(8) dip gilding film terminal on the two side ends of this individual layer chip body is implemented the testing electrical property operation and is finished the inductance characteristic test.
By said procedure, can improve number of inductor and density, enable to provide the pellet inductor of high inductance value.
Except that above-mentioned essential features, in specific implementation process, also can replenish following technology contents:
(be step 5), the technical finesse of perforation conductor was given in the substrate surface, and the conducting of being connected of two-sided etching wire loop is connected, and same again implementation step 8 test jobs are just made the two-sided pellet inductor of individual layer after wherein the substrate body was finished two-sided etching wire loop;
The present invention makes the method for etching formula laminated pellet inductor, and its step comprises:
(1) the substrate body that provides a slice to make by pottery or magnetic core material;
(2) form at least one metal film with the coating technology in this substrate body;
(3) form a plurality of pattern definition traces by the exposure imaging technology in this metal film;
(4) the pattern definition trace is made the required wire loop of reservation with the etching reaction processing;
(5) etching metacoxal plate surface is given and being cleaned and the oven dry processing:
(6) initial end points, the end point with wire loop imposes perforation conductor technology;
(7) the wire loop surface coating forms separator protection;
(8) the multi-disc perforation is connected the substrate body of finishing and implement stacked on top, and gluing or the protection of barrier isolation material formation separator again between piling up;
(9) make the lamination chip body with the cutting means;
(10) dip gilding film terminal on the two side ends of this lamination chip body is implemented the testing electrical property operation and is finished the inductance characteristic test.
The invention has the advantages that:
1. not only have many group wafers and process operation simultaneously, and wire circle significantly improves, so inductance value and production efficiency all significantly improves, and the granular wire loop of thickness unanimity, can make inductance value keep stability characteristic (quality), enable to reach the effectiveness of high inductance value.
2. the manufacture method of two-sided many group granular wire loops can further be provided on the substrate body, and with perforation conductor technology the connection of series connection conduction is given in the duolateral coil loop and made the two-sided pellet inductor of individual layer, therefore wire circle further significantly improves, inductance value significantly improves at double relatively, reaches the more characteristic of high efficiency inductance value.
3. can further pile up and down to build on the substrate body and make laminated pellet inductor, therefore reach the execution mode of lamination inductance value, have the characteristic of higher level power inductance value with multi-disc.
According to the manufacture method of the etching formula pellet inductor shown in the above-mentioned purpose of the present invention, reach embodiment now in conjunction with the accompanying drawings and be described in detail as follows:
Description of drawings
Fig. 1 is the embodiment flow chart of the manufacture method of etched single-layer pellet inductor of the present invention.
Fig. 2 is the embodiment schematic perspective view of many picture groups of printing case definition trace that develops on the substrate body of the present invention.
Fig. 3 is the embodiment profile of individual layer pellet inductor of the present invention.
Fig. 4 is the embodiment schematic perspective view of monomer pellet inductor of the present invention.
Fig. 5 is the embodiment flow chart of the manufacture method of the two-sided pellet inductor of etched single-layer of the present invention.
Fig. 6 is the embodiment schematic perspective view of the two-sided pellet inductor of etched single-layer of the present invention.
Fig. 7 is the embodiment back side schematic perspective view of the two-sided pellet inductor of etched single-layer of the present invention.
Fig. 8 is the single embodiment profile that belongs to two-sided pellet inductor of etching formula of the present invention.
Fig. 9 is the embodiment flow chart of the manufacture method of etching formula laminated pellet inductor of the present invention.
Figure 10 implements the schematic diagram of boring a hole in regular turn for each laminate of etching formula laminated pellet inductor of the present invention.
Figure 11 is the embodiment schematic perspective view of etching formula laminated pellet inductor of the present invention.
Embodiment
Be illustrated in figure 1 as the flow chart of preferred embodiment of the manufacture method of etched single-layer pellet inductor of the present invention.
In step 501, be to make substrate body 1 with pottery or magnetic core material.
In step 502, be the metal film of the substrate body 1 upper surface layer coating (modes such as plating or vacuum splashing and plating) of step 501 being gone up high conductivity material.
In step 503, be that the substrate body 1 that will be coated with the metal film top layer adopts exposure imaging technology (negative film principle), form the pattern definition trace 2 ' (as shown in Figure 2) in a plurality of pattern definitions loop to make substrate body 1 superficial layer.
In step 504, be with a plurality of pattern definition traces 2 ' of above-mentioned formation, by the chemical etching medicament pattern definition trace on the exposure imaging metacoxal plate body 12 ' is implemented etching reaction to finish stick coil loop 2, so means are reached the wire loop 2 with conductivity, the track width of control coil loop 2 certain limits easily not only, allow the more accurate granular in loop, this be known laser cutting trace mode can not reach, therefore on coil number and density, can significantly promote, relative inductance value has also significantly promoted, and reaches the inductance characteristic of high sense value.
In step 505, be that the substrate body 1 after etching is finished places cleaning device to do to clean and the processing of the baking universe, remove reaction molten slag and clean chemical etching medicament to finish.
In step 506; be with the substrate body 1 that cleans and oven dry is finished; adopt gluing (coating) or barrier isolation material so that superficial layer has a separator 3 (as shown in Figure 3); this separator 3 can be a resin or protective layer that glass forms; with protection wire loop 2 top layers, do not have foreign substance and influence inductance characteristic.
In step 507, be to finish the substrate body 1 of protecting insulating layer 3, with diamond wheel cutting or laser cutting technique the individuality that has the equidistant wire loop 2 of many groups on the substrate body 1 is cut into individual layer chip body (as shown in Figure 4) respectively.
In step 508, be the metal film terminal 4 (as shown in Figure 4) that the both sides dip-coating of individual layer chip body is had high conductivity, be provided with carrying out next step testing electrical property operation.
In step 509, be promptly to finish the finished product of pellet inductor to carry out the testing electrical property operation.
By above-mentioned steps, can finish many group pellet inductors and process operation simultaneously, and can provide the wire loop 2 of granular, so that wire circle significantly improves, inductance value has also significantly promoted, to have the characteristic of high inductance value, the granular wire loop of its thickness unanimity, can make inductance value keep stability characteristic (quality), so make the individual layer pellet inductor of high inductance value.
And for example shown in Figure 5, a preferred embodiment that has higher inductance value for the present invention, it is roughly the same with the manufacture method of above-mentioned individual layer pellet inductor embodiment, its step 602 be with substrate body 1 upper and lower surface respectively coating form a metal film, step 603 is that exposure imaging finishes that substrate body 1 is two-sided to have a required pattern definition trace 2 ' of etching, and step 604 is with the required main coil of substrate body 1 two-sided etching formation loop 2, and processing is cleaned and dried to step 605 with substrate body 1.
In step 606, be that the end point 22 of substrate body 1 on wire loop 2 after etching is finished imposes perforation conductor technology, this end point 22 is run through a through hole 5, in the hole and fill metallic conductor 6, the wire loop 2 series connection conductions on upper and lower surface are connected, to finish the substrate body 1 (as Fig. 6 to 8) in individual layer duolateral coil loop 2.
Same implement with abovementioned steps 506 to the step 607 of step 509 same approach to step 610, to finish the test of inductance characteristic, promptly make as the two-sided pellet inductor of the individual layer of Figure 6 and Figure 7.
Hence one can see that, for reaching the purpose of higher inductance value, can further use the manufacture method of the two-sided pellet inductor of individual layer, make same individual layer pellet inductor body have duolateral coil loop 2, reach multiple number of inductor and density,, have the usefulness of higher electric inductance power so that inductance value significantly promotes.
And for example shown in Figure 9, be another more preferred embodiment again of high efficiency level inductance value of the present invention, its step 701 to step 705 is identical with the manufacture method of individual layer pellet inductor embodiment.
In step 706, be with substrate body 1 initial end points 21 on wire loop 2, end point 22 imposes perforation conductor technology, with this top point 21, end point 22 runs through through hole 5, in the hole and fill metallic conductor 6 with on making, the wire loop 2 series connection conductive junction points on infrabasal plate body 1 surface, its visual demand desires to pile up the initial end points 21 of coil route 2 on the substrate body 1 of the number of plies, end point 22 imposes perforation conductor technology respectively (as shown in figure 10, (A) be ground floor substrate body 1, (B) be second layer substrate body 1, (C) be the 3rd laminar substrate body 1, (D) be the 4th laminar substrate body 1, and (A) on the substrate body 1 the initial end points 21 on the widely different road 2 of coil and (D) on the substrate body 1 end point 22 of wire loop 2 lead film 41 with substrate body 1 edge coating metal respectively, 42 connect).
In step 707, be with the wire loop 2 superficial layer gluings of substrate body 1 so that wire loop 2 superficial layers have a separator 3 is protected.
In step 708; be the multi-disc perforation to be connected the substrate body of finishing 1 can further implement upper and lower piling up ((A) is to the program of (D) figure as shown in figure 10); till the required number of plies is piled up in regular turn; and impose at interval gluing again or the barrier isolation material forms separator 3 protections in piling up, not having foreign substance influences inductance characteristic.
In step 709, be stacked on top and the substrate body 1 of finishing separator 3 to be given the cutting means make the lamination chip body.
In step 710, it has the metal film terminal 4 of conductivity with the both sides dip-coating of substrate wafer body, carry out in the next step 711 again, impose the testing electrical property operation and finish the test of inductance characteristic, promptly make the laminated pellet inductor that shows as Figure 11, therefore can reach higher multiple number of inductor and density, to have the more value of high efficiency level inductance value.
To sum up institute is old, the manufacture method of etched single-layer of the present invention and laminated pellet inductor, not only made the granular wire loop, can significantly improve inductance coil number and density, and make the two-sided or laminated pellet inductor body of individual layer with perforation conductor technology, can have multiple and reach the more characteristic of high efficiency level inductance value.
Claims (3)
1, a kind of manufacture method of etched single-layer pellet inductor is characterized in that this step of manufacturing comprises:
(1) the substrate body that provides a slice to make by pottery or magnetic core material;
(2) form at least one metal film with the coating technology in this substrate body;
(3) form a plurality of pattern definition traces by the exposure imaging technology in this metal film;
(4) the pattern definition trace is made the required wire loop of reservation with the etching reaction processing;
(5) etching metacoxal plate surface is given and being cleaned and the oven dry processing:
(6) the wire loop surface coating forms separator protection;
(7) make the individual layer chip body with the cutting means;
(8) dip gilding film terminal on the two side ends of this individual layer chip body is implemented the testing electrical property operation and is finished the inductance characteristic test.
2, as the manufacture method of the said etched single-layer pellet inductor of claim 1, it is characterized in that: wherein behind the substrate body completing steps 5, the technical finesse of perforation conductor is given in the substrate surface, the conducting of being connected of two-sided etching wire loop is connected, and same again implementation step 8 test jobs are made the two-sided pellet inductor of individual layer.
3, a kind of manufacture method of etching formula laminated pellet inductor is characterized in that this step of manufacturing comprises:
(1) the substrate body that provides a slice to make by pottery or magnetic core material;
(2) form at least one metal film with the coating technology in this substrate body;
(3) form a plurality of pattern definition traces by the exposure imaging technology in this metal film;
(4) the pattern definition trace is made the required wire loop of reservation with the etching reaction processing;
(5) etching metacoxal plate surface is given and being cleaned and the oven dry processing:
(6) initial end points, the end point with wire loop imposes perforation conductor technology;
(7) the wire loop surface coating forms separator protection;
(8) the multi-disc perforation is connected the substrate body of finishing and implement stacked on top, and gluing or the protection of barrier isolation material formation separator again between piling up;
(9) make the lamination chip body with the cutting means;
(10) dip gilding film terminal on the two side ends of this lamination chip body is implemented the testing electrical property operation and is finished the inductance characteristic test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001210785A CN1174445C (en) | 2000-07-18 | 2000-07-18 | Process for preparing etched single-layer and laminated pellet inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001210785A CN1174445C (en) | 2000-07-18 | 2000-07-18 | Process for preparing etched single-layer and laminated pellet inductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1334574A CN1334574A (en) | 2002-02-06 |
| CN1174445C true CN1174445C (en) | 2004-11-03 |
Family
ID=4588576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001210785A Expired - Fee Related CN1174445C (en) | 2000-07-18 | 2000-07-18 | Process for preparing etched single-layer and laminated pellet inductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1174445C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050079450A1 (en) * | 2003-08-28 | 2005-04-14 | Tdk Corporation | Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet |
| TW200826745A (en) * | 2006-08-07 | 2008-06-16 | Messier Bugatti | Power control for densification of one or more porous articles |
| CN101183602B (en) * | 2007-10-08 | 2010-06-16 | 熊猫电子集团有限公司 | Method of assembling ceramic silver-coated coil backbone and copper pedestal assembly on communication equipment |
| CN102867615A (en) * | 2011-07-04 | 2013-01-09 | 官淑燕 | Low-configuration and high-power inductor |
-
2000
- 2000-07-18 CN CNB001210785A patent/CN1174445C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1334574A (en) | 2002-02-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105609267B (en) | Without substrate electronic building brick and its manufacturing method | |
| CN1260746C (en) | Thin film type common mode choke and its producing method | |
| TWI234172B (en) | Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module | |
| CN1798479A (en) | Printed circuit board including embedded chips and method of fabricating the same | |
| CN1497619A (en) | Stach coil device and manufacturing method thereof | |
| CN1914699A (en) | Method for manufacturing electronic component, parent board and electronic component | |
| CN102740604A (en) | Method for manufacturing insulating metal base plate of electronic circuit | |
| CN1946271A (en) | Printed circuit board and manufacturing method thereof | |
| CN1177339C (en) | Inductor device and process of production thereof | |
| CN1968576A (en) | Fabricating method of printed circuit board having embedded component | |
| CN1829416A (en) | Embedded chip printed circuit board and method of manufacturing the same | |
| CN106205954A (en) | Inducer and forming method thereof | |
| CN101047159A (en) | Multilayer interconnection substrate, semiconductor device, and solder resist | |
| CN1825581A (en) | Printed circuit board, flip chip ball grid array board and method of fabricating the same | |
| CN1324698C (en) | Ceramic multi-layer substrate and mfg method thereof | |
| CN1234262C (en) | Clad board for printed-circuit board, multilayered printed-circuit board, and method for mfg. same | |
| TW200820865A (en) | Circuit board structure having embedded compacitor and fabrication method thereof | |
| CN106783120A (en) | The preparation method and electronic component of a kind of electrodes of electronic components | |
| CN107799281A (en) | Inductor and the method for manufacturing inductor | |
| CN104112727A (en) | Methods and apparatuses related to an improved package including a semiconductor die | |
| CN1444051A (en) | Low-intensity magnetic field and its mfg. method using printed circuit board mfg. technology | |
| CN1174445C (en) | Process for preparing etched single-layer and laminated pellet inductor | |
| CN1635637A (en) | Three dimensional integrated inductance and manufacturing method thereof | |
| CN1424758A (en) | Semiconductor devices and manufacture thereof | |
| CN102548254A (en) | Nuclear-free preparation method of chip carrier |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20041103 Termination date: 20100718 |