TWM536989U - Large area ceramic substrate structure - Google Patents

Description

Large area ceramic substrate structure

The invention relates to a large-area ceramic substrate structure for an electronic printed circuit board, comprising: a thin layer of copper adjacent to the heat-generating component; a ceramic layer and a heat-conducting layer, which are oppositely constructed; and the feature is high thermal conductivity of the ceramic layer The high-insulation property separates the thin layer of copper from the heat-conducting layer to protect the copper thin-layer conductive circuit; the high thermal conductivity of the heat-conducting layer is used to evenly remove the heat energy of the heat-generating component to achieve the heat dissipation function. A large-area ceramic substrate structure for use in an electronic printed circuit board, a building, an energy industry, and a heat sink, comprising: a ceramic layer adjacent to a heat generating component and a heat conducting layer, the relative composition thereof; characterized by the use of a ceramic layer for high thermal conductivity The high insulation property is used to protect the electrical components; the thermal conductivity of the heat-generating component is evenly removed by the high thermal conductivity of the heat-conducting layer to achieve the heat dissipation function.

Fine Ceramics is a kind of refined high-purity inorganic material, which is controlled by chemical or physical methods to precisely control the composition and uniformity, and then formed by dry pressing, casting, or injection molding. And processed into finished products. It has the characteristics of hardness, wear resistance, pressure resistance, high heat resistance, acid resistance and alkali resistance. According to the field of application, precision ceramics can be divided into three categories: (1) electronic ceramics, (2) structural ceramics, and (3) biomedical ceramics. Ceramic substrates are an application in electronic ceramics. Generally, the ceramic substrate has a sufficiently high mechanical strength, and can be used as a supporting member in addition to the components; the processability is good, the dimensional accuracy is high, and the multilayering is easy; the surface is smooth, and there is no warpage, bending, microcracking, etc. Insulation resistance and dielectric breakdown voltage are high; low dielectric constant, low dielectric loss; stable performance under high temperature and high humidity conditions, ensuring reliability; high thermal conductivity; excellent heat resistance; good chemical stability and easy Metallization, circuit graphics and strong adhesion, etc., more importantly, raw materials are rich in resources and mature technology.

The three most common manufacturing methods for ceramic substrates are: (1) lamination, hot pressing, degreasing, substrate firing, circuit pattern formation, circuit firing; (2) lamination, surface printed circuit pattern, hot pressing, degreasing, Co-firing; (3) printed circuit pattern, lamination, hot pressing, degreasing, co-firing. FIG. 1 is a cross-sectional view showing a conventional ceramic substrate structure, showing a conventional ceramic substrate structure 1 including an aluminum thin layer 101, a ceramic layer 102, a thermal conductive adhesive layer 103, and The copper thin layer 104 is composed of. The ceramic substrate can be classified into an alumina substrate: a firing temperature of 1550 to 1600 ° C, and a thick film method and a co-firing method, and a substrate for integrated circuit, a substrate for LSI packaging, and a multilayer circuit substrate. Aluminum nitride substrate: The manufacturing cost is 15 times that of the alumina substrate, and it is used for a VHF (Ultra High Frequency) band power amplifier module, a high power device, and a laser diode substrate. Tantalum carbide substrate: firing temperature of 2000 ° C or higher, usually by vacuum hot pressing, mostly used in low voltage circuits and VLSI high heat dissipation package substrates, such as high speed, high integration logic LSI with heat dissipation package, in very large computers , substrate application of laser diode for optical communication, etc. Beryllium oxide substrate (BeO): Its thermal conductivity is more than ten times that of Al ₂ O ₃ , suitable for high-power circuits, and its dielectric constant is low, which can be used for high-frequency circuits. The BeO substrate is basically made by dry pressing. Generally, the ceramic substrate needs to be formed by vapor deposition, and its size is limited by the equipment, and the preparation price is relatively expensive.

The electronic components are often required to be used with a heat dissipating material, and the prior art is directed to a heat dissipating structure, such as the Republic of China Patent No. I476572, which discloses a heat dissipating tape for various electronic products and a manufacturing method thereof, and provides a heat dissipating belt and The manufacturing method is characterized in that the heat dissipation tape comprises a metal substrate, a graphite ink layer, an adhesive layer and a release layer, and the graphite ink layer is formed on one side of the metal substrate, and the adhesive layer is formed on the metal substrate On the other side, the release layer is formed to contact the adhesive layer from the other side of the adhesive layer. The heat dissipating belt conducts heat conduction and dispersion simultaneously in the horizontal and vertical directions, and not only has excellent thermal conductivity, but also can effectively dissipate heat. As disclosed in the Republic of China Patent No. M461298, a flexible metal heat sink comprising: a flexible thermally conductive metal layer; and a heat dissipation coating comprising a fluorocarbon resin as a base material and a pore structure. The heat-dissipating coating of the filler mixture is coated and cured on the surface of the thermally conductive metal layer, thereby being compounded into a flexible metal heat sink having a thin shape and excellent heat dissipation. Thereby, it is thin, and has excellent heat dissipation and stain resistance. In addition, the Republic of China Patent No. I495716 discloses a graphene heat dissipating structure comprising a substrate and a graphene heat dissipating layer, which can receive heat from a heat source and escape through a graphene heat dissipating layer by conduction or radiation. To the outside, to achieve heat dissipation. According to the Republic of China Patent No. M526101 and M529869, an average temperature and heat dissipation composite film structure of an electronic device is characterized in that a uniform temperature heat dissipation composite film is installed in an electronic device near a heat source or directly mounted on the electronic device. In the heat source, the structure of the uniform temperature heat dissipation composite film is sequentially stacked from bottom to top and comprises: a metal layer, which is composed of at least one layer of heat conductive metal, and has a thickness of 3 um to 150 um, and the metal layer has an upper layer. a surface and a surface; a uniform temperature layer, a coating prepared by a layered structure filler, coated on the upper surface of the metal layer, and having a thickness of 3um-100um, a uniform temperature heat conductive coating; and a heat dissipation layer, The heat radiation coating is applied on the upper surface of the temperature equalizing layer and has a thickness of 3 um to 100 um of heat radiation and a heat conductive coating; accordingly, a three-layer composite structure uniform temperature heat dissipation composite film is formed. Conventionally, a ceramic substrate having conduction and heat dissipation is limited in size, and a large-area ceramic substrate cannot be fabricated. Only one surface may be adjacent to the aluminum sheet, and the other surface must be attached with a copper sheet, and the structure and the manufacturing process are complicated.

The creator of this creation has been working in the electronics-related industry for many years. He knows that there are still some shortcomings in the electrical breakdown resistance, heat dissipation and production capacity that need to be improved and improved. He is committed to the development of a simplified ceramic substrate process without pre-coating procedures. Development. The ceramic layer directly follows the copper thin layer to eliminate the precoating process, that is, there is no need to provide a thermal conductive adhesive layer, which saves the heat transfer adhesive layer and improves the heat transfer effect; however, the thermal conductive layer is directly sprayed or coated/applied to the ceramic surface, and then passed through the oven. After the surface is dry and fixed, the structure is designed to achieve a roll-to-roll process structure and enhance the mass production capacity. The present invention is a large-area ceramic substrate structure comprising: a thin layer of copper adjacent to the heat-generating component; a ceramic layer and a heat-conducting layer, the opposite of which is formed; the feature is that the ceramic layer has high thermal conductivity and high insulating properties. The thin layer is separated from the heat conductive layer to protect the copper thin layer conductive circuit; the high thermal conductivity of the heat conductive layer is used to evenly remove the heat energy of the heat generating component to achieve the heat dissipation function. The invention relates to a large-area ceramic substrate structure, comprising: a ceramic layer, adjacent to the heat-generating component and a heat-conducting layer, and the opposite structure; the feature is that the ceramic layer has high thermal conductivity and high insulation property to protect the electrical component; The heat conduction property uniformly removes the heat energy of the heating element, thereby achieving the heat dissipation function. The novel has different differentiation from the prior art, and its novelty, progress and practical benefits are correct. With regard to the techniques, means and functions of the present invention, a preferred embodiment is described in detail with reference to the drawings, and it is believed that the above objects, structures and features of the present invention can be obtained from an in-depth and specific understanding. .

The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily appreciate other advantages and effects of the present invention from the disclosure herein. The present invention can also be implemented or applied by various other specific embodiments. The details of the present specification can also be modified and changed without departing from the spirit of the present invention.

First of all, please refer to Figure 2 for a cross-sectional view of the two-layer ceramic substrate structure with conductive appearance. This shows that the two-layer large-area ceramic substrate structure 2 is electrically conductive. The structure includes one of the two surfaces of the copper thin layer 201. Covering the ceramic layer 202. The thin copper layer 201 applied to the heat-generating electronic component is selected from a thin copper material, and is etched by a conductive line for electronic component assembly to provide electrical conduction of the electronic component. The ceramic layer 202 is made of a ceramic coating containing a functional group that can be bonded to the copper thin layer 201. Since the copper thin layer 201 has a carrier film function, the roll-to-roll coating or coating/bonding process can be performed. The ceramic layer 202 is applied to the surface of the copper thin layer 201. The present invention has a conductive double-layered large-area ceramic substrate structure 2, which is different from the first drawing showing a conventional ceramic substrate structure sectional view, which shows a conventional ceramic substrate structure 1 comprising an aluminum thin layer 101 and a ceramic layer 102. The thermal conductive adhesive layer 103 and the copper thin layer 104 are composed of. The present invention has a conductive double-layer large-area ceramic substrate structure 2, and the ceramic layer 202 directly follows the copper thin layer 201 to eliminate the pre-coating procedure, that is, it is not necessary to provide the thermal conductive adhesive layer 103, which saves the thermal transfer effect of the thermal conductive adhesive layer 103; After the oven is dried, the ceramic coating and copper can be reacted to achieve the roll-to-roll process structure and increase the production capacity; the large-area ceramic substrate can be provided for downstream users to cut according to the required size.

Please continue to see Figure 3 is a cross-sectional view showing the three-layer composite structure of the present ceramic substrate, showing the creation of a three-layer composite large-area ceramic substrate structure 3, the structure comprising: one of the two surfaces of the copper thin layer 201, covering the ceramic layer 202. Finally, the copper thin layer 201 adjacent to the ceramic layer 202 is provided with a heat conductive layer 301 opposite to the other side. Wherein, the copper thin layer 201 applied close to the heat-generating electronic component is selected from a thin copper material, and the conductive circuit is etched to provide an electronic component to provide electrical conduction. The ceramic layer 202 is made of a ceramic coating containing a functional group that can be bonded to the copper thin layer 201. Since the copper thin layer 201 has a carrier film function, the roll-to-roll coating or coating/bonding process can be performed. The ceramic layer 202 is applied to the surface of the copper thin layer 201. The heat conductive layer 301 is made of a graphite material, or a heat conductive material containing a heat conductive material having high thermal conductivity, and is coated on the surface of the ceramic layer 202 by a roll-to-roll coating or coating/bonding process. The present invention creates a three-layer composite large-area ceramic substrate structure 3, and the ceramic layer 202 directly follows the copper thin layer 201 to save the pre-coating process, which saves one layer to enhance the heat transfer effect; and the thermal conductive layer 301 is directly sprayed or coated/applied. On the surface of the ceramic, after the surface of the oven is dried and fixed, the structure is designed to achieve a roll-to-roll process structure and enhance the mass production capacity; the large-area ceramic substrate can be provided for downstream users to cut according to the required size. .

In order to make the review committee further understand the structure of the creation, another ceramic structure design application is illustrated. Figure 4 shows a cross-sectional view of the double-layer large-area ceramic substrate structure with heat conduction, which shows that the double-layer large-area ceramic with heat conduction is created. The substrate structure 4 includes one surface of two surfaces of the heat conductive substrate layer 401 covering the ceramic layer 202. The heat conductive substrate layer 401 is made of a graphite paper material, which has a carrier film function, and can be wound-coated or coated/bonded, and the ceramic layer 202 is selected to cover the surface of the heat-conductive substrate layer 401 with a ceramic coating. . The heat conductive substrate layer 401 is made of a heat conductive material and a metal or non-metal heat conductive material having high thermal conductivity to provide a heat dissipation function. Further, the heat conductive layer may be selected from a metal or non-metal heat conductive material such as a thin paper sheet, a plate or a block, and also provides a heat dissipation functional layer. The present invention has a heat-conducting double-layer large-area ceramic substrate structure 4, and the ceramic layer 202 is adjacent to the surface of the heat-conductive substrate layer 401. After drying the surface of the oven, the ceramic coating and the heat-conducting material can be followed to achieve a large-area roll pair. The roll process structure enhances the mass production capacity; the large-area ceramic substrate of the creation can provide downstream users to cut and use according to the required size.

The present invention is a large-area ceramic substrate structure applied to an electronic printed circuit board, comprising: a copper thin layer 201 adjacent to the heat generating component; a ceramic layer 202 and a heat conductive layer 301, which are oppositely constructed; The high thermal conductivity and high insulating property of the ceramic layer 202 separates the copper thin layer 201 from the heat conductive layer 301 to protect the conductive circuit of the copper thin layer 201; the thermal conductivity of the heat conducting layer 301 is further removed by the high thermal conductivity of the heat conducting layer 301 to achieve heat dissipation. Features. A large-area ceramic substrate structure for use in an electronic printed circuit board, a building, an energy industry, and a heat sink, comprising: a ceramic layer 202 adjacent to the heat generating component and a thermally conductive substrate layer 401, the relative composition thereof; The ceramic layer 202 has high thermal conductivity and high insulation properties to protect the electrical components; the thermal conductivity of the heat-conductive component layer 401 is further removed by the high thermal conductivity of the heat-conductive substrate layer 401 to achieve a heat dissipation function. The novel has the characteristics of large area, simplified structure, large-scale production and cutting and use according to the user's demand size, which is different from the prior art, and its novelty, progress and practical benefits are correct. Therefore, the lack of conventional knowledge can be effectively improved, and the utility is quite practical.

Looking at the above, the specific structure disclosed in the present embodiment can indeed provide the application of the large-area ceramic substrate structure of the electronic printed circuit board, the building, the energy industry and the heat sink, and the overall structure is neither seen in the same kind. In the product, it has not been disclosed before the application. Cheng has already complied with the statutory requirements of the Patent Law and has filed a new type of patent application according to law.

However, the above is only a preferred embodiment of the present invention. When it is not possible to limit the scope of the creation of the present invention, that is, the equivalent changes and modifications made by the applicant in accordance with the scope of the patent application and the content of the creation specification are all It should remain within the scope of this creation patent.

1‧‧‧Chinese ceramic substrate structure
101‧‧‧a thin layer of aluminum
102‧‧‧Ceramic layer
103‧‧‧thermal adhesive layer
104‧‧‧thin copper layer
2‧‧‧This creation has a conductive double-layer large-area ceramic substrate structure
201‧‧‧ copper thin layer
202‧‧‧Ceramic layer
3‧‧‧This creation of three-layer composite large-area ceramic substrate structure
301‧‧‧thermal layer
4‧‧‧This two-layer large-area ceramic substrate structure with heat conduction
401‧‧‧thermal substrate layer

Fig. 1 is a cross-sectional view showing the structure of a conventional ceramic substrate. Figure 2 is a cross-sectional view showing the structure of a two-layer large-area ceramic substrate with conductive properties. Figure 3 is a cross-sectional view showing the structure of a three-layer composite large-area ceramic substrate. Figure 4 is a cross-sectional view showing the structure of a double-layer large-area ceramic substrate with heat conduction.

3‧‧‧This creation of three-layer composite large-area ceramic substrate structure

201‧‧‧ copper thin layer

202‧‧‧Ceramic layer

301‧‧‧thermal layer

Claims (11)

A large-area ceramic substrate structure comprising: a thin layer of copper adjacent to one side of the ceramic layer, adjacent to the heat-generating electronic component; and a ceramic layer disposed on one side of the thin layer of copper; the relative composition thereof; The high thermal conductivity and high insulation properties of the ceramic layer will be a thin layer of copper to protect the thinned large-area ceramic substrate structure of the copper thin-layer conductive circuit. A large-area ceramic substrate structure according to claim 1, wherein the thin copper layer is made of a thin copper material, and the conductive wires are etched to form an electronic component to provide electrical conduction of the electronic component. A large-area ceramic substrate structure according to claim 1, wherein the ceramic layer is made of a ceramic coating containing a functional group bonded to a thin layer of copper, which is coated by a roll-to-roll coating or a coating/bonding process. Covered on the surface of a thin layer of copper. A large-area ceramic substrate structure according to claim 1, further comprising a heat conductive layer disposed on the opposite side of the copper thin layer adjacent to the ceramic layer. A large-area ceramic substrate structure according to claim 4, wherein the heat-conducting layer is made of a graphite material, and is coated on the surface of the ceramic layer by a roll-to-roll coating or coating/bonding process. The large-area ceramic substrate structure according to claim 4, further, the heat-conducting layer is made of a heat-conductive coating, and the heat-conducting material with high thermal conductivity is coated on the surface of the ceramic layer by a roll-to-roll coating or coating/bonding process. . A large-area ceramic substrate structure comprising: a ceramic layer adjacent to one side of the heat-conducting layer; and a heat-conducting layer adjacent to the side of the ceramic layer, which are oppositely configured; the feature is that the ceramic layer is highly thermally conductive and high Insulation characteristics, with protection circuit function; the thermal conductivity of the heat-generating component is evenly removed by the high thermal conductivity of the heat-conducting layer to achieve the heat dissipation function. A large-area ceramic substrate structure according to claim 7, wherein the heat conductive layer is made of a graphite paper material, and is coated on the surface of the ceramic layer by a roll-to-roll coating or coating/bonding process. The large-area ceramic substrate structure according to claim 7, further, the heat-conducting layer is made of a heat-conducting material and a metal or non-metal heat-conductive material having high thermal conductivity to provide a heat dissipation function. The large-area ceramic substrate structure according to claim 7, further, the heat-conducting layer may be selected from a metal or non-metal heat conductive material such as a thin paper sheet, a plate or a block to provide a heat dissipation functional layer. A large-area ceramic substrate structure according to claim 7, wherein the ceramic layer is selected from a ceramic coating, and is coated on the surface of the heat conductive layer by a roll-to-roll coating or coating/bonding process.