KR101531630B1 - Thin-heat film and heat-radiation sheet comparing the same - Google Patents

Abstract

The present invention relates to an ultra thin heat radiation film and a multilayer heat diffusion sheet including the same. The ultra thin heat radiation film has a structure which includes an insulation thin film, a heat diffusion and radiation thin film which is in surface contact with a first surface of the insulation thin film, and a heat diffusion bonding thin film which is in surface contact with the heat diffusion and radiation thin film. The multilayer heat diffusion sheet includes the ultra thin heat radiation film, a first heat diffusion and radiation bonding thin film, a heat diffusion thin film, and a second heat diffusion and radiation bonding thin film. The heat diffusion sheet with the described structure has the same heat diffusion effect as an existing synthetic graphite sheet with high manufacturing costs.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heat dissipation film,

The present invention relates to an ultra thin film heat dissipation film and a thermal diffusion sheet including the same, and more particularly, to an ultra thin film heat dissipation film that effectively dissipates heat generated in electronic products and parts thereof and a thermal diffusion sheet including the same.

In general, in general, various components that are slim and are mounted on a main board in operation of high-tech communication and digital electric and electronic products efficiently transmit and emit heat generated inside a light communication type digital communication and electric / It is possible to reduce the function of the device and shorten the lifetime of the device.

In addition, recent high-tech digital products tend to become more slim and high-capacity, and therefore, diffusion and emission of heat generated from semiconductor chipsets, battery mounting sites, and backlight are very important factors in determining the performance and reliability of digital products .

In order to maximize the heat dissipation area of the conventional heat sink, a metallic material such as aluminum, which maximizes the thickness of the protruding portion, is used. In recent years, a thick-film ceramic heat sink is used. Is applied.

Such a heat sink has a disadvantage in that the thickness of the product must be maximized in order to improve the heat dissipation characteristic, and thus there is a limit to effectively transmit and radiate the heat generated in the digital electric / electronic device which is slimmer, thinner and shorter.

A technique to apply ultra thin synthetic graphite sheet has been suggested as an alternative. The ultra-thin synthetic graphite sheet has a disadvantage in that it is difficult to produce and roll production compared with natural graphite sheet. However, despite the high horizontal thermal conductivity (1500 W / mk), the cost increases and the additional cost increase Problems with economics have problems.

In addition, Korean Unexamined Patent Publication No. 10-2008-0036698 discloses a method for producing a heat-radiating sheet having an electromagnetic wave shielding function using nanocomposite carbon fibers, wherein a thermosetting resin or a thermoplastic resin having a volume of 100% To 80% by volume of the thermally conductive filler and 0.5 to 5% by weight of the EMI powder; Impregnating the mixed raw material with the nanocomposite carbon fibers; Placing the impregnated nanocomposite carbon fiber into a mold for producing a heat radiation sheet heated to 50 to 250 ° C; And a step of hot-pressing the upper mold by closing the upper mold by adjusting the upper and lower gaps of the mold in accordance with the thickness of the heat radiation sheet to be molded.

However, the above method fails to provide a method that effectively reflects heat transfer and heat dissipation characteristics. Therefore, there is a need for a heat-radiating film having a multi-layer structure and optimized for each layer.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide an ultra-thin heat-radiating film which is applied to manufacture a heat-

It is another object of the present invention to provide a thermal diffusion sheet having a high heat dissipation efficiency to the outside while improving the thermal diffusivity in the vertical direction as well as the horizontal direction by applying the ultra thin film heat dissipation film.

According to one aspect of the present invention, there is provided an ultra thin film heat dissipation film comprising: an insulating thin film; a heat dissipating heat dissipating thin film which is in contact with a first surface of the insulating thin film; And a thermal diffusion bonding thin film which is in contact with the thermal diffusion heat radiation thin film.

In one embodiment, the thermally diffusing heat radiating thin film is a metal thin film formed by vacuum-depositing aluminum or copper on the surface of the insulating thin film.

In one embodiment, the thermal diffusion thin film is formed by preparing a slurry containing at least one filler selected from carbon nanotubes, graphite nano plates (GNP), nano-dispersed carbon, and nano-dispersed graphite, It is preferably a thin film formed by gravure printing on the surface.

In one embodiment, the thermal diffusion junction thin film may be one selected from the group consisting of the horizontal thermal diffusion junction film, the vertical thermal diffusion junction film, and the horizontal-vertical thermal diffusion junction film.

Among the thermal diffusion bonding thin films, the horizontal thermal diffusion bonding film may include at least one first filler selected from carbon nanotubes, graphite nano plates (GNP), nano-dispersed carbon, and nano-dispersed graphite. In addition, the perpendicular thermal diffusion junction thin film may include at least one second filler selected from the group consisting of alumina, aluminum hydroxide, aluminum nitride, and boron nitride. In particular, the horizontal-vertical thermal diffusion junction thin film may include at least one first filler selected from carbon nanotubes, graphite nano plates (GNP), nano-dispersed carbon, and nano-dispersed graphite, and at least one first filler selected from the group consisting of alumina, aluminum hydroxide, aluminum nitride, And at least one second filler selected from the group consisting of rubbers may be mixed and used.

According to another aspect of the present invention, there is provided an ultra thin film heat dissipation film comprising: an insulating thin film; a thermally diffusing heat dissipating thin film to be in contact with a first surface of the insulating thin film; a first heat dissociating thin film to be in contact with the heat dissipating heat dissipating thin film; And a second thermal diffusion junction thin film which is in contact with the second side of the insulating thin film.

In one embodiment, the first thermal diffusion junction film or the second thermal diffusion junction film may be one selected from the horizontal thermal diffusion junction film, the vertical thermal diffusion junction film, and the horizontal-vertical thermal diffusion junction film.

The composite thermal diffusion sheet according to another embodiment of the present invention has a structure including an ultra thin film heat dissipation film, a first thermal diffusion bonding thin film, a thermal diffusion thin film, and a second thermal diffusion heat fusion bonding thin film.

In one embodiment, the thermal diffusion thin film may be a thin film selected from a copper thin film and an aluminum thin film.

According to another aspect of the present invention, there is provided a composite thermal diffusion sheet including a first ultra thin film heat dissipation film, a first thermal diffusion heat junction film, a thermal diffusion thin film, a second thermal diffusion bonding film, a second ultra thin film heat dissipation film, And a third thermal diffusion bonding thin film.

When the heat-radiating sheet according to the present invention is applied to a thermal substrate (metal thin film) having cost competitiveness, the same level of thermal diffusing effect as the conventional synthetic graphite can be obtained. At the same time, it is very useful in reducing the cost of low-cost smart electronic devices, and it is advantageous to implement the improved thermal performance when the existing synthetic graphite is applied to the thermal substrate.

1 is a cross-sectional view showing an ultra-thin heat dissipation film according to an embodiment of the present invention.
2 is a cross-sectional view showing an ultra-thin heat dissipation film according to another embodiment of the present invention.
3 is a cross-sectional view showing a composite thermal diffusion sheet according to an embodiment of the present invention.
4 is a cross-sectional view showing a composite thermal diffusion sheet according to another embodiment of the present invention.

Hereinafter, the present invention will be described in more detail. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

In this application, the terms "comprises" or "having", etc. are intended to specify the presence of stated features, components, steps, processes, compositions, or combinations thereof in the specification, and not to limit the presence or addition of one or more other features or components, Steps, processes, compositions, or combinations thereof, which are not intended to be limiting.

Also, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Ultra-thin heat-radiating film

1 is a cross-sectional view showing an ultra-thin heat dissipation film according to an embodiment of the present invention.

Referring to FIG. 1, an ultra-thin heat dissipation film 150 of the present invention includes an insulation thin film 110, a thermal diffusion thin film 120 to be in contact with a first side of the insulation thin film, and a thermal diffusion junction thin film 130).

The insulating thin film 110 is located on the outermost layer of the ultra thin film heat-radiating film of the present invention and is used to impart insulation to the heat-radiating film. As an example, the insulating thin film may have a thickness of 1.3 to 5 占 퐉.

For example, the heat dissipation thin film 120 may be a thin metal film formed on the first surface of the insulating thin film. The metal thin film may be formed by vacuum depositing aluminum or copper on the surface of the insulating thin film.

As another example, the thermal diffusion thin film 120 may be formed by preparing a slurry composition containing at least one filler selected from carbon nanotubes, graphite nano plate (GNP), nano-dispersed carbon, and nano-dispersed graphite, Heat-radiating thin film formed by gravure printing on the surface of the substrate. At this time, the slurry composition may be prepared by mixing 20 to 40% by weight of a filler, 1 to 3% by weight of a dispersant, and an excess solvent.

The thermally diffusing thin film 130 has a function of transferring or externally discharging the heat transferred from the thermal substrate to the thermally diffusing heat-radiating thin film and having a property of being adhered or adhered to the thermal substrate. The thermal diffusion bonding film 130 may be used as a thermal diffusion bonding film or a thermal diffusion bonding film.

As an example, the horizontal thermal diffusion junction thin film may be used as the thermal diffusion junction thin film. The horizontal thermal diffusion junction thin film may include at least one first filler selected from carbon nanotubes, GNP (Graphite nano plate), nano-dispersed carbon, and nano-dispersed graphite.

Specifically, the horizontal thermal diffusion bonding thin film may be prepared by preparing a horizontal thermal diffusion dispersing slurry in which the first filler is dispersed, adding a horizontal thermal diffusion dispersing slurry to any adhesive resin selected from acrylic, urethane, silicone, By weight of a heat dissipation adhesive for thermal diffusion formed by mixing the thermally dissipative thin film with a thickness of about 1 to 15 탆.

As an example, the heat radiation adhesive for thermal diffusion may be formed by mixing 1 to 5% by weight of nano-carbon and 6 to 12% by weight of nano-graphite with respect to 100% by weight of the spot-wearing resin selected from acrylic, urethane, silicone and epoxy have.

In this case, when the horizontal thermal diffusion junction thin film is formed to a thickness of about 1 탆 to 5 탆, microgravure, reverse gravure, or slot die coating is preferred. When the horizontal thermal diffusion junction thin film is formed to have a thickness of 5 탆 to 10 탆, .

As another example, the perpendicular thermal diffusion junction thin film may be used as the thermal diffusion junction thin film. The vertical thermal diffusion junction thin film may include at least one second filler selected from the group consisting of alumina, aluminum hydroxide, aluminum nitride, and boron nitride.

Specifically, the vertical thermal diffusion bonding thin film may be produced by preparing a vertical thermal diffusion dispersing slurry in which the second filler is dispersed, and then adding a vertical thermal diffusion dispersing slurry to the adhesive resin such as acryl, urethane, silicone, epoxy or the like in an amount of 8 to 25% To form a heat dissipation adhesive for thermal diffusion, and then coating and drying the heat dissipation thin film to a thickness of about 1 to 15 탆.

As another example, the heat dissipation adhesive for thermal diffusion may comprise at least one second filler selected from the group consisting of alumina, aluminum hydroxide, aluminum nitride and boron nitride for 100 weight% of the spot-wearing resin selected from acrylic, urethane, To 8% by weight and 25% by weight, respectively.

As another example, the horizontal-vertical thermal diffusion junction thin film may be used as the thermal diffusion junction thin film. The horizontal-vertical thermal diffusion junction thin film may include at least one first filler selected from carbon nanotubes, graphite nano plates (GNP), nano-dispersed carbon, nano-dispersed graphite, and alumina, aluminum hydroxide, aluminum nitride, and boron nitride And at least one second filler selected from the group consisting of the first filler and the second filler.

Specifically, the horizontal-vertical thermal diffusion bonding thin film may be prepared by mixing a horizontal thermal diffusion dispersion slurry in which a first filler is dispersed and a vertical thermal diffusion dispersion slurry in which a second filler is dispersed to prepare a horizontal-vertical thermal diffusion slurry, , Epoxy, or the like, in a ratio of 8 to 25% by weight of the total amount of the horizontal-vertical thermal diffusion slurry to the thermally dissipative thin film, to a thickness of about 1 to 15 탆. .

The heat dissipation adhesive for thermal diffusion may be formed by mixing a mixture of the first filler and the second filler at a ratio of 8 to 25% by weight based on 100% by weight of the spot-wearing resin selected from acrylic, urethane, silicone and epoxy.

The ultra-thin heat dissipation film 150 having the above-described structure is advantageous in cost competitiveness due to the application of the horizontal thermal diffusion junction film, the vertical thermal diffusion junction film or the horizontal-vertical thermal diffusion film as the thermal diffusion junction film 130, . ≪ / RTI >

   2 is a cross-sectional view showing an ultra-thin heat dissipation film according to another embodiment of the present invention.

Referring to FIG. 2, the ultra-thin heat dissipation film 250 according to another embodiment of the present invention includes an insulation thin film 210, a thermal diffusion thin film 220 to be in contact with a first side of the insulation thin film, And a second thermal diffusion junction film 240 which is in contact with a second surface of the insulating thin film.

The insulating thin film 210, the thermal diffusion heat dissipation thin film 220 and the first thermal diffusion bonding thin film 230 among the constituent elements of the ultra thin film heat dissipation film 250 may be formed on the insulating thin film 110 of the ultra thin heat dissipation film 150 shown in FIG. The thermal diffusing heat dissipating thin film 120, and the thermal diffusing thin film 130, and a detailed description thereof will be omitted.

The second thermal diffusion bonding film 240 is formed on a second surface of the insulating thin film facing the first surface, and has a function of externally discharging the transmitted heat and being capable of being adhered to or adhered to the thermal substrate. The second thermal diffusion bonding film 130 may be used as a second thermal diffusion bonding film or a second thermal diffusion bonding film.

As an example, a horizontal thermal diffusion junction thin film may be used as the second thermal diffusion junction film 240. The horizontal thermal diffusion junction thin film may include at least one first filler selected from carbon nanotubes, GNP (Graphite nano plate), nano-dispersed carbon, and nano-dispersed graphite.

Specifically, the horizontal thermal diffusion bonding thin film may be prepared by preparing a horizontal thermal diffusion dispersing slurry in which the first filler is dispersed, adding a horizontal thermal diffusion dispersing slurry to the adhesive resin such as acrylic, urethane, silicone, epoxy or the like in an amount of 8 to 25% And then coating and drying the formed heat dissipation adhesive for thermal diffusion on the insulating thin film 210 to a thickness of about 1 to 15 탆. As an example, the heat radiation adhesive for thermal diffusion may be formed by mixing 1 to 5% by weight of nano-carbon and 6 to 12% by weight of nano-graphite with respect to 100% by weight of the spot-wearing resin selected from acrylic, urethane, silicone and epoxy have

In this case, when the horizontal thermal diffusion junction thin film is formed to a thickness of about 1 탆 to 5 탆, it is preferably coated by microgravure, reverse gravure, slot die or the like, and when it is formed to a thickness of 5 탆 to 15 탆, Coating method is preferable.

As another example, the second thermal diffusion junction thin film 240 may be a vertical thermal diffusion junction thin film. The vertical thermal diffusion junction thin film may include at least one second filler selected from the group consisting of alumina, aluminum hydroxide, aluminum nitride, and boron nitride.

Specifically, the vertical thermal diffusion bonding thin film may be produced by preparing a vertical thermal diffusion dispersing slurry in which the second filler is dispersed, and then adding a vertical thermal diffusion dispersing slurry to the adhesive resin such as acryl, urethane, silicone, epoxy or the like in an amount of 8 to 25% And then coating the formed heat-insulating adhesive with a thickness of about 1 to 15 탆 on the insulating thin film, followed by drying. As another example, the heat dissipation adhesive for thermal diffusion may comprise at least one second filler selected from the group consisting of alumina, aluminum hydroxide, aluminum nitride and boron nitride for 100 weight% of the spot-wearing resin selected from acrylic, urethane, To 8% by weight and 25% by weight, respectively.

As another example, a horizontal-vertical thermal diffusion junction film may be used as the second thermal diffusion junction film 240. The horizontal-vertical thermal diffusion junction thin film may include at least one first filler selected from carbon nanotubes, graphite nano plates (GNP), nano-dispersed carbon, nano-dispersed graphite, and alumina, aluminum hydroxide, aluminum nitride, and boron nitride And at least one second filler selected from the group consisting of the first filler and the second filler. Specifically, the horizontal-vertical thermal diffusion bonding thin film may be prepared by preparing a horizontal-vertical thermal diffusion slurry by mixing a horizontal thermal diffusion dispersion slurry in which a first filler is dispersed and a vertical thermal diffusion dispersion slurry in which a second filler is dispersed, , Epoxy, or the like, at a ratio of 8 to 25% by weight of the total weight of the horizontal-vertical thermal diffusion slurry to the insulating thin film, to a thickness of about 1 to 15 탆 .

For example, the heat dissipation adhesive for thermal diffusion may be formed by mixing a mixture of a first filler and a second filler in an amount of 8 to 25% by weight based on 100% by weight of a spot-wearing resin selected from acrylic, urethane, silicone and epoxy .

The first thermal diffusion bonding film 230 and the second thermal diffusion bonding film 240 are selected from the horizontal thermal diffusion bonding film, the vertical thermal diffusion bonding film and the horizontal-vertical thermal diffusion bonding film, respectively, of the ultra-thin thermal insulation film 250 of the present invention It can have the following structure.

In one embodiment, the ultra thin film heat dissipation film 250 includes an insulation thin film 210, a thermal diffusion thin film 220 to be in contact with the first side of the insulation thin film, a first horizontal thermal diffusion junction film 230 to be in contact with the thermal diffusion thin film And a second horizontal thermal diffusion junction film 240 that is in contact with the second side of the insulating thin film.

In another embodiment, the ultra thin film heat dissipation film 250 includes an insulation thin film 210, a thermal diffusion thin film 220 that is in contact with the first side of the insulation thin film, a first vertical thermal diffusion junction film 230 And a second vertical thermal diffusion junction film 240 which is in contact with the second surface of the insulating thin film.

In yet another embodiment, the ultra thin film heat dissipation film 250 may include an insulating thin film 210, a thermal diffusion thin film 230 that is in contact with the first side of the insulating thin film, a horizontal thermal diffusion junction film 230 that is in contact with the heat dissipating heat dissipation thin film, And a vertical thermal diffusion junction film 240 that is in contact with the second surface of the insulating thin film.

In yet another embodiment, the ultra thin film heat dissipation film 250 may include an insulation thin film 210, a first horizontal-vertical thermal diffusion bonding film 220 which is in contact with the first surface of the insulation thin film 220, And a second horizontal-vertical thermal diffusion junction film 240 that is in contact with the second surface of the insulating thin film.

In yet another embodiment, the ultra thin film heat dissipation film 250 may include an insulating thin film 210, a thermally diffusing heat dissipating thin film 220 to be in contact with the first side of the insulating thin film, And a horizontal-vertical thermal diffusion junction film 240 that is in contact with the second surface of the insulating thin film.

The ultra-thin heat radiation film having the above-described structure maximizes the performance of the thermal substrate, and the effect equivalent to or higher than that of the synthetic graphite sheet can be obtained.

Composite thermal diffusion sheet

3 is a cross-sectional view showing a composite thermal diffusion sheet according to an embodiment of the present invention.

3, the composite thermal diffusion sheet 380 according to the present embodiment includes an ultra-thin heat dissipation film 310, a first thermal diffusion bonding thin film 320, a thermal diffusion thin film 330, and a second thermal diffusion heat fusion bonding film 340 ).

The ultra thin film heat dissipation film 310 may be the ultra thin film heat dissipation film 150 shown in FIG. 1 or the ultra thin film heat dissipation film disclosed in FIG. A detailed description of the ultra thin film heat dissipation film and the structure thereof are omitted because they have been specifically described with reference to FIG. 1 and FIG.

The first thermal diffusion bonding thin film 320 is located under the ultra thin film thermal conductive film and can be used as the first thermal diffusion bonding film or the first thermal diffusion bonding film. The first thermal diffusion bonding thin film 320 may be applied to a first horizontal thermal diffusion bonding film, a first vertical thermal diffusion bonding film, or a first horizontal-vertical thermal diffusion bonding film depending on the use purpose of the thermal diffusion sheet.

For example, when the first thermal diffusion bonding thin film 320 is applied to the first thermal diffusion bonding thin film 320, the first horizontal thermal diffusion bonding thin film 320 may include carbon nanotubes, graphite nano plates (GNP), nano- And at least one first filler selected from nano-dispersed graphite. Specifically, the first horizontal thermal diffusion bonding thin film is prepared by preparing a horizontal thermal diffusion dispersing slurry in which the first filler is dispersed, adding a horizontal thermal diffusion dispersing slurry to the adhesive resin such as acrylic, urethane, silicone, %, And coating the formed thermally conductive adhesive for thermal diffusion to the ultra thin film heat radiation film to a thickness of about 1 to 15 탆 and drying the resultant. In one embodiment, the heat dissipation adhesive for thermal diffusion is formed by mixing 1 to 5% by weight of nano-carbon and 6 to 12% by weight of nano-graphite with respect to 100% by weight of the spot-wearing resin selected from acrylic, urethane, silicone and epoxy Can

As another example, a first vertical thermal diffusion junction thin film may be used as the first thermal diffusion thermal junction film (320). The first vertical thermal diffusion junction thin film may include at least one second filler selected from the group consisting of alumina, aluminum hydroxide, aluminum nitride, and boron nitride. Specifically, the first vertical thermal diffusion bonding thin film is prepared by preparing a vertical thermal diffusion dispersing slurry in which a second filler is dispersed, and then applying a vertical thermal diffusion dispersing slurry to the adhesive resin such as acryl, urethane, silicone, %, And then coating the thermally conductive adhesive for thermal diffusion formed on the ultra thin film heat-dissipating film to a thickness of about 1 to 15 μm, followed by drying. As another example, the heat dissipation adhesive for thermal diffusion may comprise at least one second filler selected from the group consisting of alumina, aluminum hydroxide, aluminum nitride and boron nitride for 100 weight% of the spot-wearing resin selected from acrylic, urethane, To 8% by weight and 25% by weight, respectively.

As another example , a first horizontal-vertical thermal diffusion junction thin film may be used as the first thermal diffusion thermal junction film (320). The first horizontal-vertical thermal diffusion junction thin film may include at least one first filler selected from carbon nanotubes, graphite nano plates (GNP), nano-dispersed carbon, and nano-dispersed graphite, and at least one first filler selected from the group consisting of alumina, aluminum hydroxide, aluminum nitride, And at least one second filler selected from the group consisting of ridges. Specifically, the horizontal-vertical thermal diffusion bonding thin film may be prepared by preparing a horizontal-vertical thermal diffusion slurry by mixing a horizontal thermal diffusion dispersion slurry in which a first filler is dispersed and a vertical thermal diffusion dispersion slurry in which a second filler is dispersed, , Epoxy, or the like, in a ratio of 8 to 25% by weight of the total amount of the horizontal-vertical thermal diffusion slurry to the adhesive resin such as epoxy, to a thickness of about 1 to 15 μm on the ultra thin film heat- .

The thermal diffusion thin film 330 may be a thin film used as a thermal substrate in a thermal diffusion sheet, or a copper thin film or an aluminum thin film.

The second thermal diffusion bonding thin film 340 is located below the thermal diffusion thin film 330 and may be used as the second thermal diffusion bonding film or the second thermal diffusion bonding film. The second thermal diffusion bonding thin film 340 serves to first heat the heat from the heat source and to transfer the heat to the thermal substrate. In particular, the second thermal diffusion bonding thin film 340 may be selectively applied to the second horizontal thermal diffusion bonding film, the second vertical thermal bonding film or the second horizontal-vertical thermal bonding film depending on the purpose of the thermal diffusion sheet. The second horizontal thermal diffusion junction film, the second vertical thermal diffusion junction film, or the second horizontal-vertical thermal diffusion junction film may include a first horizontal thermal diffusion junction film, a first vertical thermal diffusion junction film, or a first vertical thermal diffusion junction film disclosed in the first thermal diffusion heat- 1 horizontally-perpendicular thermal diffusion junction thin film.

The composite heat-radiating sheet having the above-described structure can be applied to a heat-dissipating junction thin film in addition to the ultra-thin heat-radiating film of the present invention. The heat-radiating sheet has excellent thermal diffusion, thermal conduction, It can have an anisotropic heat dissipation property.

4 is a cross-sectional view showing a composite thermal diffusion sheet according to another embodiment of the present invention.

Referring to FIG. 4, the composite thermal diffusion sheet 480 according to the present embodiment includes a first ultra thin film heat dissipation film 410, a first thermal diffusion joint thin film 420, a thermal diffusion thin film 430, The second ultra thin film heat dissipation film 450, and the third thermal diffusion heat dissociation thin film 460.

In the composite thermal diffusion sheet 480 having the above-described structure, the first ultra thin film heat dissipation film 410, the first heat dissipation heat dissociation thin film 420, and the second heat dissipation heat dissociation thin film 440 are formed on the thermal diffusion sheet The heat dissipation film 310, the first heat dissipation heat dissociation thin film 320, and the second heat dissipation heat dissociation thin film 340 described in the first embodiment of the present invention are not described in detail.

The thermal diffusion thin film 430 may additionally include a graphite thin film in addition to the metal thin film mentioned in FIG. 3 as a thermal substrate of the thermal diffusion sheet.

The second ultra thin film heat dissipation film 450 is provided between the second thermal diffusion bonding thin film 440 and the third thermal diffusion bonding thin film 460 and the heat transferred from the heat source to the thermal substrate in the thermal diffusion sheet is again cut into a heat source To maximize heat dissipation performance. Since the second ultra thin film heat dissipation film 450 can be used as the ultra thin film heat dissipation film disclosed in FIG. 2, a detailed description of the second ultra thin film heat dissipation film will be omitted.

The third thermal diffusion bonding film 460 is located below the second ultra thin film heat dissipation film 450 and is used for transferring heat from the heat source to the thermal substrate in the thermal diffusion sheet. The third thermal diffusion bonding adhesive thin film 460 is disposed between the third thermal diffusion heat- .

The third thermal diffusion bonding thin film 460 can be selectively applied to the third horizontal thermal diffusion bonding film, the third vertical thermal bonding film or the third horizontal-vertical thermal bonding film depending on the purpose of the thermal diffusion sheet. The third horizontal thermal diffusion junction thin film, the third vertical thermal diffusion junction film, or the third horizontal-vertical thermal diffusion junction film may be a first horizontal thermal diffusion junction film disclosed in the first thermal diffusion bonding film 320 of FIG. 3, a first vertical thermal diffusion junction film Thin film or the first horizontal-vertical thermal diffusion junction thin film is formed in the same composition or the same way, a detailed description thereof is given.

As described above, the composite thermal diffusion sheet of the present invention can achieve the same level of thermal diffusing effect as that of the synthetic graphite, and at the same time, it is very suitable in terms of lowering the cost of the smart smart electronic device in the future. In addition, it has better thermal performance than conventional synthetic graphite when used as a thermal diffusion thin film.

Hereinafter, the present invention will be described in more detail with reference to the following examples and experimental examples. However, the scope of the present invention is not limited to the following examples.

≪ Example 1 >

A heat dissipation film (1 mu m) formed by gravure coating of an insulating film (4.5 mu m), a nano-dispersed carbon slurry, and a first thermal diffusion bonding film (4.5 mu m) including nano- (10 mu m). In order to produce the thermal diffusion bonded thin film, a first thermal diffusion thermal slurry is prepared by rapidly dispersing a solvent containing 30 wt% of high purity carbon having high thermal conductivity and a dispersant in a basket mill. Then, a second heat dissipation heat dissipation slurry is prepared by rapidly dispersing a solvent containing 30 wt% of Graphite 5 μm powder excellent in thermal diffusibility and a dispersant in a basket mill. Subsequently, the first and second thermal diffusion thermal spray slurry mixtures were mixed and stirred (1600 rpm) in the range of 15 to 20 wt% with respect to 100 wt% of the acrylic adhesive resin to prepare a thermal diffusion adhesive, A thermal diffusion junction film was formed by laminating under temperature conditions.

≪ Example 2 >

A first thermal diffusion junction film (4.5 탆) comprising a second thermal diffusion junction film, an insulation film (4.5 탆), a heat dissipation thin film (1 탆) formed by gravure coating of a nano-dispersed carbon slurry, and nano dispersed carbon and graphite filler Sided heat dissipation film was prepared. The first and second thermal diffusion junction films are formed by the same method as the first thermal diffusion junction films of Example 1.

≪ Example 3 >

The thermal diffusion sheet of Example 1 was laminated on the first surface of a copper thin film (35 탆), and then the thermal diffusion adhesive 10 탆 was coated on the second surface of a copper thin film (35 탆) to prepare a thermal diffusion sheet.

<Example 4>

The cross-sectional thermal diffusing heat-radiating film of Example 1 was laminated on the first surface of a copper thin film (35 탆), and a heat dissipating film of both surfaces of Example 2 was laminated on the second surface of a copper thin film (35 탆) To prepare a thermal diffusion sheet.

&Lt; Example 5 >

The cross-sectional thermal diffusing heat-radiating film of Example 1 was laminated on the first surface of a synthetic graphite thin film (4.5 탆), and the heat-diffusing films of both sides of Example 2 were laminated on the second surface of the aluminum thin film using a thermal diffusing adhesive, .

&Lt; Example 6 >

The cross-sectional thermal diffusing heat-radiating film of Example 1 was laminated on the first surface of the aluminum thin film (4.5 탆), and the heat-diffusing film of both sides of Example 2 was laminated on the second surface of the aluminum thin film by using a thermal diffusing adhesive, .

&Lt; Test Example 1 >

Heat dissipation properties of the heat-radiating sheet of the third to sixth embodiments and the Japanese synthetic graphite sheet (47 μm, 1500 W / mk) were evaluated by the method shown in Table 1 below. The evaluation results are shown in Table 2.

Graphite sheet (Japan) Example 3 Example 4 Example 5 Example 6 Heater temperature (캜) 99.07 99.38 99.16 99.11 98.25 Dispersion temperature (캜) 83.32 83.68 83.23 82.10 82.7 Cooling temperature (℃) 15.75 15.7 15.93 17.1 15.55

As can be seen from the results shown in Table 2, when the thermal diffusion sheets of Examples 3 to 6 were produced by applying the heat radiating film of the present invention to a thermal substrate (copper thin film, aluminum thin film) having high economic efficiency, It was confirmed that the sheet had excellent heat diffusibility at the same level as that of the sheet.

Claims (16)

Ultra thin film heat dissipation film;
A first thermal diffusion bonding thin film which is in contact with the ultra thin film heat dissipation film;
A thermal diffusion thin film which is in contact with the first thermal diffusion bonding thin film; And
And a second thermal diffusion joint thin film which is in contact with the thermal diffusion thin film,
The ultra thin film heat dissipation film may include an insulation thin film; A slurry comprising at least one filler selected from the group consisting of carbon nanotubes, GNP (Graphite nano plate), nano-dispersed carbon, and nano-dispersed graphite, formed by vacuum-depositing aluminum or copper on the surface of the first surface of the insulating thin film A thermal diffusion thin film formed by gravure printing on the surface of the insulating thin film; And a first thermal diffusion bonding thin film which is in contact with the thermal diffusion heat radiation thin film. delete delete The composite thermal diffusion sheet according to claim 1, wherein the first thermal diffusion bonding film is used as a thermal diffusion bonding film or a thermal diffusion bonding film. The composite thermal diffusion sheet according to claim 1, wherein the first thermal diffusion bonding thin film is one selected from the group consisting of a horizontal thermal diffusion bonding film, a vertical thermal diffusion bonding film and a horizontal-vertical thermal diffusion bonding film. The method of claim 5, wherein the horizontal thermal diffusion junction thin film comprises at least one first filler selected from carbon nanotubes, graphite nano plates (GNP), nano-dispersed carbon, and nano-dispersed graphite, And at least one second filler selected from the group consisting of alumina, aluminum hydroxide, aluminum nitride, and boron nitride, wherein the horizontal-vertical thermal diffusion junction thin film comprises a carbon nanotube, a graphite nano plate (GNP) , At least one first filler selected from nano-dispersed graphite and at least one second filler selected from the group consisting of alumina, aluminum hydroxide, aluminum nitride and boron nitride. The composite thermal diffusion sheet according to claim 1, further comprising a second thermal diffusion junction film that is in contact with a second side of the insulation thin film. delete The composite thermal diffusion sheet of claim 7, wherein the second thermal diffusion bonding thin film is one of a horizontal thermal diffusion bonding film, a vertical thermal diffusion bonding film, and a horizontal-vertical thermal diffusion bonding film. delete The method of claim 1, wherein the first thermal diffusion bonding thin film is any one of a horizontal thermal diffusion junction film, a vertical thermal diffusion junction film, and a horizontal-vertical thermal diffusion junction film, and the second thermal diffusion bonding film is a horizontal thermal diffusion junction A vertical thermal diffusion bonding thin film, and a horizontal-vertical thermal diffusion bonding thin film. 12. The method of claim 11, wherein the horizontal thermal diffusion junction thin film comprises at least one first filler selected from carbon nanotubes, graphite nano plates (GNPs), nano-dispersed carbon, and nano-dispersed graphite, And at least one second filler selected from the group consisting of alumina, aluminum hydroxide, aluminum nitride, and boron nitride, wherein the horizontal-vertical thermal diffusion junction thin film comprises a carbon nanotube, a graphite nano plate (GNP) , At least one first filler selected from nano-dispersed graphite and at least one second filler selected from the group consisting of alumina, aluminum hydroxide, aluminum nitride and boron nitride. The composite thermal diffusion sheet according to claim 1, wherein the ultra thin film thermal insulation film further comprises a second thermal diffusion bonding film which is in contact with a second surface of the insulation thin film. A first ultra thin film heat dissipation film;
A first thermal diffusion bonding thin film which is in contact with the first ultra thin film heat dissipation film;
A thermal diffusion thin film which is in contact with the first thermal diffusion bonding thin film;
A second thermal diffusion bonding thin film which is in contact with the thermal diffusion thin film;
A second ultra thin film heat dissipation film that is in contact with the second heat dissipation junction thin film; And
And a third thermal diffusion bonding thin film which is in contact with the second ultra thin film heat dissipation film,
Wherein the first and second ultra thin film heat dissipation films comprise an insulating thin film; A slurry comprising at least one filler selected from the group consisting of carbon nanotubes, GNP (Graphite nano plate), nano-dispersed carbon, and nano-dispersed graphite, formed by vacuum-depositing aluminum or copper on the surface of the first surface of the insulating thin film A heat dissipation heat dissipation thin film formed by gravure printing on the surface of the insulating thin film; And a first thermal diffusion bonding thin film which is in contact with the thermal diffusion heat radiation thin film. 15. The method of claim 14, wherein the first thermal diffusion bonding thin film is any one of a horizontal thermal diffusion junction film, a vertical thermal diffusion junction film, and a horizontal-vertical thermal diffusion junction film, and the second thermal diffusion bonding film is a horizontal thermal diffusion junction Wherein the third thermal diffusion bonding film is one selected from the group consisting of the horizontal thermal diffusion junction film, the vertical thermal diffusion junction film, and the horizontal-vertical thermal diffusion junction film. Wherein the thermal diffusion sheet is a single bonded thin film. The method of claim 14, wherein the thermal diffusion thin film is one selected from the group consisting of a copper thin film, an aluminum thin film, and a graphite thin film, and the first and second ultra thin film heat dissipation films include a second thermal diffusion junction film Further comprising a thermal diffusion sheet. Wherein the thermal diffusion sheet is a composite thermal diffusion sheet.

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