KR20180055014A - Graphite sheet having excellent plane thermal conduction for heat radiation solution, Heat radiation solution containing the same and Manufacturing method thereof - Google Patents

Abstract

The present invention relates to a graphite sheet including a through hole with excellent horizontal heat conductivity, a heat radiation solution integrated with electromagnetic wave shielding and heat dissipating functions including the same, and a manufacturing method thereof. The present invention relates to the heat dissipation solution which is thin, and has high horizontal heat diffusion performance, an electromagnetic wave shielding property, and thermal shock resistance while securing high adhesion between a second electromagnetic wave shielding layer and the graphite sheet by introducing the graphite sheet which includes the through hole alternatively arranged with a proper interval and optimizes the total area of the through hole as a heat diffusion layer, and a manufacturing method thereof.

Description

TECHNICAL FIELD The present invention relates to a graphite sheet for a heat dissipation solution having excellent horizontal thermal conductivity, a heat dissipation solution including the same, and a method for manufacturing the same,

The present invention relates to a graphite sheet for a heat dissipation solution and a heat dissipation solution including the graphite sheet. More particularly, the present invention relates to a graphite sheet capable of providing a thin electromagnetic shielding heat dissipation solution excellent in horizontal heat conductivity and durability against thermal shock, A heat dissipation solution in which electromagnetic wave shielding and heat dissipation functions are combined, and a method of manufacturing the same.

[0002] With the recent trend toward high performance and light weight and short life of electrical and electronic devices, there has been a steady increase in demand for heat-radiating sheets capable of effectively dissipating heat generated from heat sources such as semiconductor components and light- Functionalization is required.

Generally, a heat-radiating sheet uses copper foil, a copper foil / graphite laminate, and a graphite sheet. The copper foil has both heat dissipation properties and electromagnetic shielding characteristics. However, when the thickness is thick, flexibility is insufficient. It is insignificant and has a high density, which limits its weight. If the thickness exceeds about 50 탆, flexibility is insufficient, and thus there is a limit to the application as a heat radiation sheet having a complicated shape.

In addition, although a commercial product made of various materials is widely used as an electromagnetic wave shielding sheet for shielding electromagnetic waves, a conventional electromagnetic wave shielding sheet has a low thermal conductivity and can not sufficiently obtain a heat radiation effect, Is being developed. For example, Korean Patent No. 10-1457914 discloses a thermal diffusion sheet having an electromagnetic wave absorbing layer in which an electromagnetic wave absorbing layer is laminated on one surface or both surfaces of a thermal diffusion sheet composed of a metal foil layer and a graphite layer. It is disadvantageous in that it is thinned. Therefore, there are technical limitations in application to a portable electronic device such as a smart phone, which is a small electronic device, and there is a problem that flexibility is greatly reduced.

2. Description of the Related Art In recent years, portable electronic devices have been required to be flexible and thin. As a result, the heat radiation sheet and the electromagnetic wave shielding sheet which are essential parts used therefor have been increasingly demanded for flexibility and thinness.

U.S. Published Patent Application No. 2007-0246208 (published on October 25, 2007)

SUMMARY OF THE INVENTION The present invention has been conceived to solve the problems described above, and it is an object of the present invention to provide a graphite sheet having a specific shape through hole having a suitable area in a graphite sheet, By arranging the holes, it is possible to largely improve the adhesive force between the graphite layer and the layer bonded to the graphite layer, and it is possible to prevent peeling between the thermal diffusion layer and another bonded layer when the composite sheet is bent, And a heat radiation solution-integrated heat dissipation solution and a method of manufacturing the same.

According to an aspect of the present invention, there is provided an electromagnetic shielding and heat dissipating integrated heat dissipation solution comprising a graphite sheet having a plurality of alternately arranged through holes, the total area of the through holes in the graphite sheet being larger than the upper surface or the lower surface of the graphite sheet. To 11%, preferably 11% to 16%.

As a preferred embodiment of the present invention, the graphite sheet includes a plurality of through holes repeatedly formed at regular intervals in a row formed in the x-axis direction when one surface of the graphite sheet is viewed in xy coordinates, (Y-axis) of the first through-hole in the odd-numbered columns and the center axis (y '-axis) of the second through-hole in the odd-numbered columns (Y "axis) of the first through-hole in the even-numbered column.

In one preferred embodiment of the present invention, the distance between the through holes of the graphite sheet may satisfy the following equation (1).

[Equation 1]

d = (0.3 to 1.2) L

In Equation (1), L is the distance between the center axis of the through hole formed in the x axis direction (column direction) and the neighboring through hole, and d is the distance between the center axis (x axis) of the through hole existing in each of the odd column and the even column.

In one preferred embodiment of the present invention, the through hole of the graphite sheet may have a cross-sectional shape having a profile of the following formula (2).

&Quot; (2) "

0.500 ≤

In the formula (2), the stereogram is ^1/2 of the inner width of the shape / the peripheral length of the shape.

In one preferred embodiment of the present invention, the cross-sectional shape of the through hole may include at least one selected from a circle, an ellipse, a +, a x, a ┣, a ┏, an I and a line.

In the preferred embodiment of the present invention, when the cross-sectional shape of the through-hole is circular, the diameter of the ellipse is 1: 2 to 10 and the diameter of the ellipse is 1: 2 to 10, The diameter ratio of the circumscribed circle may be 1: 2 ~ 10.

In one preferred embodiment of the present invention, the graphite sheet may be a graphite sheet containing at least one of pyrolytic graphite and graphitized polyimide.

Another object of the present invention is to provide a heat dissipation solution in which the above-described various types of graphite sheets are introduced into a thermal diffusion layer. In the heat dissipation solution of the present invention, the relative heat degradation rate satisfying Equation 1 below may be 0 to 30%.

[Equation 1]

In the above equation 1,? T ₁ And ΔT ₂ is when heat is applied and the 80 ℃ to one end of the thermal solution, as a difference of heat measured at opposite ends of said end, ΔT ₁ is ΔT ₂ is a train value of a heat dissipation solution in which a graphite sheet with a through hole is introduced into a thermal diffusion layer, and ΔT ₂ is a train heat value obtained by introducing a graphite sheet having no through hole into a thermal diffusion layer.

In one preferred embodiment of the present invention, the heat-dissipating solution of the present invention can have two types, and the first type of heat-dissipating solution includes a first electromagnetic wave-shielding layer, an adhesive layer, And the second electromagnetic wave shielding layer may be laminated in order.

In one preferred embodiment of the present invention, the second electromagnetic wave shielding layer of the first type heat dissipation solution includes a cured sheet formed of a resin containing an electromagnetic wave shielding component, and the inside of the graphite sheet through- And a resin derived from the resin.

In a preferred embodiment of the present invention, the inside of the through hole of the first type heat radiation solution is filled with resin derived from the second electromagnetic wave shielding layer; Or a resin derived from the second electromagnetic wave shielding layer and an adhesive derived from the adhesive layer may be filled.

As a preferred embodiment of the present invention, the resin (or adhesive component) derived from the second electromagnetic wave shielding layer of the first type heat radiation solution may be a non-adhesive component.

In a preferred embodiment of the present invention, the second electromagnetic wave shielding layer of the first type heat dissipation solution is a mixed resin including a thermosetting epoxy resin, a rubber binder, a silane coupling agent, a fluorine surfactant, a soft magnetic powder, .

In one preferred embodiment of the present invention, the mixed resin used for forming the second electromagnetic wave shielding layer of the first type heat dissipation solution contains 160 to 350 parts by weight of a rubber binder, 100 to 500 parts by weight of a silane coupling agent, 0.5 to 5 parts by weight of a fluorinated surfactant, 700 to 1,500 parts by weight of a soft magnetic powder, 2 to 30 parts by weight of a curing agent and 1 to 25 parts by weight of a moisture resistant agent.

In one preferred embodiment of the present invention, the soft magnetic powder is selected from the group consisting of Fe-Si-Al alloys, Fe-Si-Cr alloys, Fe-Si-B alloys, highflux, permalloy alloys , A Ni-Zn ferrite alloy, and a Mn-Zn ferrite alloy.

In one preferred embodiment of the present invention, the soft magnetic powder may have an average particle diameter of 20 to 100 mu m.

In one preferred embodiment of the present invention, in the first type heat dissipation solution, the first electromagnetic wave shielding layer has an average thickness of 5 탆 to 70 탆, the adhesive layer has an average thickness of 2 탆 to 25 탆, And the second electromagnetic wave shielding layer may have an average thickness of 30 mu m to 300 mu m.

In a preferred embodiment of the present invention, the second type heat dissipation solution different from the first type heat dissipation solution includes a first electromagnetic wave shielding layer, a first adhesive layer, a thermal diffusion layer composed of various types of graphite sheets as described above, The adhesive layer and the second electromagnetic wave shielding layer may be stacked in order.

As a preferred embodiment of the present invention, in the second type heat dissipation solution, the first adhesive layer, the thermal diffusion layer and the second heat dissipation adhesive layer may satisfy the following equation (2).

[Equation 2]

(d2 + d3)? d1? 4 (d2 + d3)

In Equation 2, d1 is the average thickness of the thermal diffusion layer, d2 is the average thickness of the first adhesive layer, and d3 is the average thickness of the second adhesive layer.

As a preferred embodiment of the present invention, in the second type heat dissipation solution, the first adhesive layer and the second adhesive layer may satisfy the following equation (3).

[Equation 3]

d2? d3

In Equation 3, d2 is the average thickness of the first adhesive layer, and d3 is the average thickness of the second adhesive layer.

In a preferred embodiment of the present invention, in the second type heat dissipation solution, the inside of the through hole of the graphite layer may be filled with an adhesive derived from the first adhesive layer and the second adhesive layer.

As a preferred embodiment of the present invention, a metal sheet layer may be further laminated on the second electromagnetic wave shielding layer in the second type heat dissipation solution.

As a preferred embodiment of the present invention, the passivation film may not be provided on the upper and lower portions of the graphite sheet constituting the thermal diffusion layer of the first type and / or the second type of the heat dissipation solution.

As a preferred embodiment of the present invention, in the first type and / or second type of heat dissipation solution, the first electromagnetic wave shielding layer may be a copper foil or an aluminum foil.

As a preferred embodiment of the present invention, in the first type and / or second type of heat dissipation solution, the first adhesive layer and / or the second adhesive layer may be formed of a thermosetting epoxy resin, a rubber binder, a silane coupling agent, A hardening agent, a hardening accelerator, a flame retardant, and a humidifier.

In a preferred embodiment of the present invention, in the first type and / or second type of heat dissipation solution, the first adhesive layer and / or the second adhesive layer is composed of a rubber binder of 25 to 100 wt% based on 100 wt parts of the thermosetting epoxy resin 1 to 10 parts by weight of a silane coupling agent, 0.01 to 2 parts by weight of a fluorinated surfactant, 5 to 20 parts by weight of a curing agent, 1 to 5 parts by weight of a curing accelerator, 30 to 60 parts by weight of a flame retardant and 0.5 to 10 parts by weight of a moisture- can do.

In a preferred embodiment of the present invention, in the first type and / or second type of heat dissipation solution, the first adhesive layer and / or the second adhesive layer may further comprise a thermally conductive filler.

As a preferred embodiment of the present invention, the thermally conductive filler may be a graphite powder, a carbon nanotube (CNT), a carbon black powder, a carbon fiber, a ceramic powder, and a metal And may include at least one selected from metal powder.

As a preferred embodiment of the present invention, in the first type and / or the second type of the heat dissipation solution of the present invention, the peeling strength of the through hole in the thermal diffusion layer when measured according to JIS C 6741 is expressed by the following equation Can be satisfied.

[Equation 4]

 (Maximum peel strength-minimum peel strength)? 300 gf / hole

As a preferred embodiment of the present invention, the maximum peel strength in Equation 4 may be 400 to 1,500 gf / hole.

As a preferred embodiment of the present invention, the electromagnetic shielding and heat-dissipating integrated composite sheet of the present invention may have a horizontal thermal conductivity of 250 to 1,000 W / m · k and a vertical thermal conductivity of 3 to 20 W / m · k.

Another object of the present invention is to provide a method of manufacturing the heat dissipation solution of the present invention in various forms described above, wherein the first type heat dissipation solution comprises a first electromagnetic wave shielding layer, an adhesive layer, a thermal diffusion layer having a plurality of through holes, A first step of putting a laminate obtained by laminating a second electromagnetic wave shielding layer into a hot press equipment; A second step of heating and pressing the laminate under a pressure of 145 to 160 占 폚 and 45 to 60 kgf / cm2 to perform a hot press process; And a third step of cooling the hot press and then separating the composite sheet integrated from the hot press.

In a preferred embodiment of the present invention, the second type of heat dissipation solution comprises a first electromagnetic wave shielding layer, a first adhesive layer, a thermal diffusion layer comprising a graphite sheet of any one of the first to fourth aspects, Layer and a second electromagnetic wave shielding layer in this order on a hot press equipment; Two steps of heating and pressing the laminate under a pressure of 145 to 160 DEG C and 45 to 60 kgf / cm < 2 > for 50 to 70 minutes; And a third step of cooling the hot press and then separating the composite sheet integrated from the hot press.

As a preferred embodiment of the present invention, in the method of manufacturing the first type and / or the second type of the heat dissipation solution, the warming in the second step may be performed by heating the hot press at 10 to 35 DEG C at 3 DEG C / Min to 145 < 0 > C to 160 < 0 > C.

As a preferred embodiment of the present invention, in the method of manufacturing the first type and / or the second type of the heat dissipation solution, the three stages of cooling are hot press at 145 ° C to 160 ° C at 3 ° C / Min to 10 < 0 > C to 35 < 0 > C.

Another object of the present invention is to provide a coverlay film and / or a flexible circuit board comprising the integrated composite sheet of the present invention in various forms described above.

Further, it is desirable to provide an electronic apparatus, preferably a portable electronic apparatus, including the integral composite sheet of the present invention.

In a preferred embodiment of the present invention, the electronic device may be a flexible electronic device.

The electromagnetic shielding and heat radiation composite sheet of the present invention has a maximum peel strength and a minimum peel strength value minimized by introducing a graphite sheet having a plurality of through holes satisfying specific conditions to maintain uniform peel strength, It is possible to prevent peeling between layers when the composite sheet is bent. The composite sheet of the present invention incorporating such a graphite sheet minimizes the vertical thermal conductivity and maximizes the horizontal thermal conductivity, , And has an excellent electromagnetic wave shielding effect. In addition, the integrated composite sheet of the present invention can provide an integrated electromagnetic shielding and heat-dissipating composite sheet having excellent impact resistance and flexibility, which can be thinned without having a separate adhesive layer between the graphite sheet and the second electromagnetic wave shielding layer have.

FIG. 1 is a schematic view of a graphite sheet used in a heat dissipation solution of the present invention, as a preferred embodiment of the present invention.
2 is a schematic cross-sectional view of a heat dissipation solution (first type) of the present invention as a preferred embodiment of the present invention.
3 is a schematic cross-sectional view of a heat dissipation solution (second type) of the present invention as a preferred embodiment of the present invention.
4 (a) to 4 (c) show a state in which a resin (or a second adhesive layer) derived from the adhesive layer (or the first adhesive layer) and / or the second electromagnetic wave shielding layer is filled in the through- Fig.
5 shows a schematic diagram of a digitizer module incorporating a first type of heat dissipation solution 100 of the present invention.
Figure 6 shows a schematic diagram of a digitizer module incorporating a second type of heat dissipation solution 100 of the present invention.

Hereinafter, the present invention will be described in more detail.

Conventionally, the heat-radiating sheet and / or the composite sheet use a copper foil, a copper foil / graphite laminate, a graphite sheet or the like as a heat dissipating material. The copper foil has both heat dissipation characteristics and electromagnetic wave shielding characteristics. However, , The thermal conductivity in the horizontal direction is not good compared with the graphite, and the density is high, so there is a limit in weight reduction.

 Commercial products made of various materials are widely used as electromagnetic wave shielding sheets for shielding electromagnetic waves. However, conventional electromagnetic wave shielding sheets have low thermal conductivity and can not sufficiently obtain a heat radiation effect. Therefore, it is required to simultaneously realize a heat radiation effect and an electromagnetic wave shielding effect.

1, a heat dissipation solution (hereinafter referred to as a composite sheet) of the present invention includes a graphite sheet (or a thermal diffusion layer) 10 having a plurality of alternately arranged through holes 1 to be.

By providing the through holes so as to alternately arrange them in this manner, it is possible to prevent the peeling between the graphite sheet and the bonded layer when the composite sheet is bent while increasing the flexibility of the composite sheet, which is not arranged alternately.

The graphite sheet will be described in more detail with reference to FIG. 1. When one surface of the graphite sheet is viewed in xy coordinates, a plurality of through holes are formed in the rows formed in the x axis direction at regular intervals. If the rows are divided into an odd column (1 column, 3 columns, 5 columns) and an even column (2 columns, 4 columns, 6 columns, etc.), the center axis (y axis) (Y "axis) of the first through-hole in the even-numbered column exists between the center axis (y 'axis) of the hole, while the y" axis is preferably located in the center of the y- may be formed closer to the y'-axis direction.

The through hole area of the graphite sheet may be 11% to 18%, preferably 11% to 16%, and more preferably 12% to 14% of the total area of the upper or lower surface of the graphite sheet. If the hole area is less than 11%, there is a problem that the peeling strength between the second electromagnetic wave shielding layer and the thermal diffusion layer is low. If it exceeds 18%, the peeling strength is excellent. However, there may be a problem that the vertical thermal conductivity increases, There may be a problem that the through hole is formed so as to have the above-mentioned area ratio.

In addition, the graphite sheet may be formed so that the distance between the penetrating holes satisfies the following equation (1).

[Equation 1]

d = (0.3 to 1.2) L, preferably d = (0.4 to 1.0) L, more preferably d = (0.45 to 0.8) L

In Equation (1), d is the distance between the center axis of the through hole formed in the x axis direction (column direction) and the center axis of the neighboring through hole, and L is the distance between the center axis (x axis) of the through hole existing in each of the odd column and the even column.

If the value of d is less than 0.3L, the horizontal thermal conductivity may be lowered. If the value of d is more than 1.2L, the distance between the odd numbered columns and the even numbered through holes may be relatively large and the difference between the maximum through- It is preferable to form the through-holes so as to have an interval satisfying the above-mentioned formula (1).

Further, the graphite sheet uses a graphite sheet having through-holes so as to have an excellent degree of horizontal thermal conductivity and a degree of dissociation that satisfies the following formula (2) so as to realize high peeling strength between the second electromagnetic wave shielding layer and the thermal diffusion layer.

&Quot; (2) "

0.500 ≤ 1 ≤ 1.300, preferably 0.520 ≤

In the formula (2), the stereogram is ^1/2 of the inner width of the shape / the peripheral length of the shape.

If the degree of dissociation is less than 0.500, the overall thermal diffusibility is excellent, but the peeling strength such as peeling strength per through hole may be low and the peeling strength between the second electromagnetic wave shielding layer and the thermal diffusion layer may be low. But there is a problem that the vertical thermal conductivity increases.

The cross-sectional shape of the through-hole may have a cross-sectional shape satisfying the above-described schematic diagram, and may have one or two or more species selected from a circle, an ellipse, a +, a x, a ┣, Preferably one or two or more selected from the group consisting of a circle, an ellipse and a + type.

For example, when the cross-sectional shape of the through-hole is circular, the diameter of the ellipse is 1: 2 to 10, and the diameter of the ellipse is 1: 2 to 10, The diameter ratio of the circumscribed circle may be 1: 2 ~ 10.

As a specific example, in the case of a circular through hole, the average diameter of the circular cross-sectional shape may be 0.5 mm to 8 mm, preferably 0.5 mm to 5 mm, and more preferably 1 mm to 4 mm. If the average diameter of the through holes is less than 0.5 mm There is a problem that the durability against thermal shock due to the increase in the number of the through holes provided with the thermal diffusion layer may be reduced and the filling rate of the adhesive component filled in the through holes may be reduced to reduce the durability against thermal shock When the thickness exceeds 8 mm, the thermal diffusing performance in the horizontal direction of the thermal diffusion layer is decreased. In the production of the composite sheet, the ability to maintain the shape of each layer may decrease and the percentage of defects may increase. May be lowered.

The graphite sheet (or film) constituting the thermal diffusion layer may be a graphite sheet common to those skilled in the art and preferably a graphite sheet containing at least one of pyrolytic graphite and graphitized polyimide. .

The pyrolytic graphite refers to high purity graphite having high thermal conductivity and electrical conductivity, is used at high temperature, and is manufactured by vapor deposition method and can have a very well developed microstructure.

The graphitized polyimide may be prepared through the following graphitization process.

First, as a preparation step of the graphitization process, polyimide may be put into a firing furnace by being laminated on a natural graphite sheet. Such a preparation step may be carried out in order to prevent fusion of the films, in which the polyimide may have a film form.

Next, the carbonization step of the polyimide can be carried out at a temperature of 600 ° C to 1,800 ° C for 2 to 7 hours in the first step of the graphitization process. This carbonization step removes nitrogen and hydrogen, as well as carbon in the polyimide.

Finally, as a second step in the graphitization process, a heat treatment step can be performed at a temperature between 2,000 ° C and 3,200 ° C. This heat treatment step can lead to different alignments of the carbon atoms. Specifically, there may be pores between the stacks of carbon in the polyimide after the first step. By passing through a rolling roll at a temperature of 2,000 DEG C to 3,200 DEG C, pore removal and density are increased, This maximized graphitized polyimide can be produced.

As shown in the schematic diagram in FIG. 2, the heat dissipation solution of the present invention is a composite sheet type integrated with an electromagnetic wave shielding and heat dissipating function, and includes a first electromagnetic wave shielding layer 40, an adhesive layer 20, (100, first type heat dissipation solution) having a structure in which a thermal diffusion layer (10) and a second electromagnetic wave shielding layer (30) are stacked in this order.

3, the heat dissipation solution of the present invention includes a first electromagnetic wave shielding layer 40, an adhesive layer 20, a thermal diffusion layer 10 including a graphite sheet having the plurality of through holes, (Second type heat radiation solution) having a structure in which a second adhesive layer 20 'and a second electromagnetic wave shielding layer 30' are stacked in order.

The heat dissipation solution (first type and second type heat dissipation solution) of the present invention can satisfy 0 to 30% of the relative heat degradation rate satisfying the following equation (1), preferably 0 to 20% , And more preferably 1 to 12%.

[Equation 1]

In the above equation 1,? T ₁ And ΔT ₂ is when heat is applied and the 80 ℃ to one end of the thermal solution, as a difference of heat measured at opposite ends of said end, ΔT ₁ is ΔT ₂ is a train value of a heat dissipation solution in which a graphite sheet with a through hole is introduced into a thermal diffusion layer, and ΔT ₂ is a train heat value obtained by introducing a graphite sheet having no through hole into a thermal diffusion layer.

Generally, the graphite sheet constituting the thermal diffusion layer of the first type and / or the second type heat dissipation solution of the present invention may have no passivation film at the upper part and the lower part when the heat radiating film is manufactured using the graphite sheet.

Since the plane size of the thermal diffusion layer is smaller than the planar size of the first electromagnetic wave shielding layer 40 and the second electromagnetic wave shielding layer 30 or 30 ', when viewed in the plane direction of the electromagnetic wave shielding layer, Shielding layer and the second electromagnetic wave shielding layer, and when the adhesive (including the adhesive component originating from the first adhesive layer and / or the second adhesive layer) and / or the resin derived from the second electromagnetic wave shielding layer are not present , There is a space between the outside of the thermal diffusion layer and the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer due to the thickness of the thermal diffusion layer when viewed from the side of the integral composite sheet.

The thermal diffusion layer 10 is formed of the above-described graphite sheet, and is provided with an adhesive agent (a first adhesive layer and / or a second adhesive agent) in the through hole in the graphite sheet and in the spacing space between the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer The first electromagnetic wave shielding layer 40, the thermal diffusion layer 10 and the second electromagnetic wave shielding layer 30 or 30 'are filled with an adhesive component derived from the second electromagnetic wave shielding layer And are integrated.

Particularly, in the case of the first type heat radiation solution, since the adhesive layer is semi-cured and the second electromagnetic wave shielding layer is also semi-cured, when heat and pressure are applied by hot pressing after stacking the respective layers, A part of the adhesive layer 20 'is melted to be filled in the through hole and the spacing space, and the adhesive 20 of the adhesive layer is also filled in the spacing space from the through hole (see FIGS. 4A to 4C).

In the case of the second type heat dissipation solution, the first adhesive layer, the thermal diffusion layer and the second adhesive layer may be formed to have a thickness satisfying the following equation (2).

[Equation 2]

(d2 + d3) ≤ d1 ≤ 4 (d2 + d3), preferably (d2 + d3) ≤ d1 ≤ 3.5 (d2 + d3), more preferably (d2 + d3) ≤ d1 ≤ 2.5 )

D1 is the average thickness of the graphite layer, d2 is the average thickness of the first adhesive layer, and d3 is the average thickness of the second adhesive layer.

At this time, if d1 is smaller than (d2 + d3), the first and second adhesive layers are entirely too thick as a whole, which is disadvantageous in making the composite sheet thinner and the heat radiation effect may be lowered. If d1 is larger than 4 (d2 + d3), the first and second adhesive layers are relatively thin, so that the adhesive component can not be sufficiently filled in the holes in the graphite layer and the peel strength per hole of the graphite layer is lowered Can be.

The first adhesive layer and the second adhesive layer of the second type heat radiation solution preferably satisfy the following equation (3).

[Equation 3]

d2? d3

In Equation 3, d2 is the average thickness of the first adhesive layer, and d3 is the average thickness of the second adhesive layer.

It is preferable that the first adhesive layer and the second adhesive layer satisfy the equation (2), and preferably the equation (3) is also satisfied. When the first adhesive layer (d2) is thick in the heat radiation direction, The thickness of the first adhesive layer and the thickness of the second adhesive layer are different from each other because the second adhesive layer is formed sufficiently thick so as to sufficiently fill the adhesive component in the holes of the graphite layer It is preferable that the second adhesive layer is thicker than the first adhesive layer.

Each layer constituting the integral composite sheet 100 of the present invention will be described more specifically.

First, the first electromagnetic wave shielding layer of the first type heat dissipating solution and / or the second type heat dissipating solution will be described. The first electromagnetic wave shielding layer is a material having heat dissipation and electromagnetic wave shielding function. As a preferable example, a copper foil or an aluminum foil can be used.

In the case of the second type heat dissipation solution, when the second electromagnetic wave shielding layer is formed of a conductive material of metal foil, the first electromagnetic wave shielding layer may be composed of a metal foil such as a copper foil or an aluminum foil or a metal sheet.

The first electromagnetic wave shielding layer 40 preferably has an average thickness of 5 to 70 탆, preferably 8 to 40 탆, more preferably 8 to 35 탆. At this time, the average thickness of the first electromagnetic wave shielding layer If it is less than 5 mu m, there may be a problem that an appearance problem occurs and a tear phenomenon occurs. If it exceeds 70 mu m, it may be difficult to form a thin film and a product flexibility may be lowered.

Next, the adhesive layer (or adhesive 20) of the first type heat dissipation solution and the first adhesive layer and / or the second adhesive layer of the second type heat dissipation solution will be described.

The adhesive layer, the first adhesive layer and the second adhesive layer serve to bond the first electromagnetic wave shielding layer and the thermal diffusion layer and / or the first electromagnetic wave shielding layer, the thermal diffusion layer and the second electromagnetic wave shielding layer to each other, 1 It is preferable to use a high heat-resistant adhesive that can transfer heat from the electromagnetic wave shielding layer to the thermal diffusion layer well.

In the case of the first type heat dissipation solution, the adhesive constituting the adhesive layer of the first type heat dissipation solution preferably has a melting point higher than that of the second electromagnetic wave shield layer component.

The adhesive layer, the first adhesive layer, and the second adhesive layer may include a thermosetting resin, a rubber binder, a silane coupling agent, a fluorine surfactant, a curing agent, a curing accelerator, a flame retardant, and a humidifier.

Among the components of the adhesive layer (the first adhesive layer and the second adhesive layer), the thermosetting resin may include at least one of a thermosetting epoxy resin, a thermosetting phenoxy resin, a thermosetting amino resin, a thermosetting polyester resin and a thermosetting polyurethane resin , Preferably a thermosetting epoxy resin, and more preferably one or two or more selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F epoxy resin, a novaleak epoxy resin and a halogen-containing epoxy resin.

When two or more kinds of thermosetting epoxy resins are used in combination, it is preferable to mix bisphenol A epoxy resin and novaleak epoxy resin at a weight ratio of 1: 0.15 to 0.4, preferably 1: 0.18 to 0.35, It is advantageous in terms of improvement and adhesion.

Among the components of the adhesive layer (one adhesive layer and the second adhesive layer), the rubber binder may play a role of imparting bending resistance and may be formed of an acrylic rubber, a silicone rubber, a carboxylated nitrile elastomer, Phenoxy), and preferably one or two or more of acrylic rubber and silicone rubber may be included. Carboxylic elastomer may be used, and it is preferable to use a carboxylnitrile elastomer. The carboxyl-series elastomer preferably has a weight-average molecular weight of 180,000 to 350,000, preferably a weight-average molecular weight of 210,000 to 280,000, more preferably a weight-average molecular weight of 215,000 to 255,000, And the heat resistance of the adhesive layer. The rubber binder may be used in an amount of 25 to 100 parts by weight, preferably 35 to 80 parts by weight, based on 100 parts by weight of the thermosetting resin. When the rubber binder is used in an amount of less than 25 parts by weight, When the composite sheet is bent, the first electromagnetic wave shielding layer and the thermal diffusion layer bonding part may be partially peeled off. If the composite sheet is used in excess of 100 parts by weight, the amount of other components in the adhesive layer may decrease, There is a problem that the adhesiveness of the adhesive layer may be reduced.

Among the components of the adhesive layer (1 adhesive layer and second adhesive layer), the silane coupling agent serves to disperse the particles. Typical silane coupling agents used in the art can be used. Preferably, (C2 to C5 alkyl) trialkoxysilane, Vinyltri (C2 to C5 alkoxy) silane, and aminoethylaminopropylsilane triol. And more preferably glycidoxyethyltrimethoxysilane, glycidoxypropyltrimethoxysilane, glycidoxypropylethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, aminoethylaminopropylsilane Triols, or a mixture of two or more thereof. The amount of the silane coupling agent to be used may be 1 to 10 parts by weight, preferably 1 to 5 parts by weight, based on 100 parts by weight of the thermosetting resin. When the amount of the silane coupling agent is less than 1 part by weight, The effect of dispersing the particles may not be seen. If the dispersing agent is used in an amount exceeding 10 parts by weight, there may be a problem that particle aggregation occurs due to the reaction between the coupling agents.

Among the components of the adhesive layer (one adhesive layer and the second adhesive layer), the fluorochemical surfactant lowers the surface tension and improves the coating property. The fluorochemical surfactant generally used in the related art can be used, A fluoroaliphatic polymeric ester may be used. Specific examples thereof include FC4430 of 3M, Novec 4300 of Du Pont, DuPont Capstone of DuPont, and the like. The amount of the fluorinated surfactant to be used may be 0.01 to 2 parts by weight, preferably 0.02 to 1.2 parts by weight, based on 100 parts by weight of the thermosetting resin. When the fluorinated surfactant is used in an amount of less than 0.01 part by weight, It may not be effective to improve the coating property. If it is used in excess of 2 parts by weight, there may be a problem that the adhesive strength is lowered.

Among the components of the adhesive layer (one adhesive layer and the second adhesive layer), at least one of an amine type hardener, an anhydride type hardener and a phenol type hardener may be used as the curing agent And may include at least one of an amine type hardener and an acid type anhydride type hardener. Specific examples thereof include 4,4'-diaminodiphenylsulfone (4,4'-diaminodiphenlysulfone) can be used as a curing agent. The curing agent may be used in an amount of 5 to 20 parts by weight, preferably 8 to 17 parts by weight, based on 100 parts by weight of the thermosetting resin. If the amount of the curing agent is less than 5 parts by weight, durability may be reduced. If it is used in an amount exceeding 20 parts by weight, there may arise a problem that the heat insulation adhesive strength is lowered.

Among the components of the adhesive layer (1 adhesive layer and second adhesive layer), the curing accelerator may include at least one of an aromatic amine, an aliphatic amine and an aromatic tertiary amine, preferably one of aromatic amine and aromatic tertiary amine Or more species. The curing accelerator may be used in an amount of 1 to 5 parts by weight, preferably 1.5 to 4.5 parts by weight based on 100 parts by weight of the thermosetting resin. If the amount of the curing accelerator is less than 1 part by weight, the curing speed of the adhesive is too slow, If it is used in an amount exceeding 5 parts by weight, the adhesive layer may be cured too quickly, and the heat-curing layer may be completely cured before hot pressing.

Among the components of the adhesive layer (one adhesive layer and the second adhesive layer), the flame retardant is used for obtaining a flame retardant effect of the product, and any of those commonly used in the art can be used, and phosphorus flame retardant, inorganic flame retardant, (Clariant EXOLIT OP 935), H42M (Showa Denko), H32 (Showa Denko), Showa Denko Co., Ltd., and Showa Denko Co., Ltd. can be used alone or in combination of two or more. H43M of Denko Co., Ltd., and the like. The flame retardant may be used in an amount of 30 to 60 parts by weight, preferably 35 to 55 parts by weight, based on 100 parts by weight of the thermosetting resin. When the amount of the flame retardant is less than 30 parts by weight, If it is used in an amount exceeding 60 parts by weight, there is a problem that the adhesive strength of the product may be lowered due to the excessive use of the flame retardant component.

Among the components of the adhesive layer (one adhesive layer and the second adhesive layer), the moisture-proofing agent is used for controlling the water content in the adhesive layer and for controlling the viscosity of the adhesive, and may be any of those generally used in the art. Preferred examples thereof include aluminum sulfate, A silicone emulsion, a poly (organosiloxane), a hydrophobic polymer emulsion, a silicone-based moisture-proofing agent, or the like, or a mixture of two or more thereof. The amount of the humectant to be used may be 0.5 to 10 parts by weight, preferably 1.5 to 8 parts by weight, based on 100 parts by weight of the thermosetting resin. If the amount of the humectant is less than 0.5 parts by weight, If it is used in excess of 10 parts by weight, it may be difficult to control the proper amount of water in the adhesive layer due to overuse.

On the other hand, the adhesive layer (the first adhesive layer and / or the second adhesive layer) of the present invention may further include a thermally conductive filler and / or a dispersing agent. In the case of the second type heat dissipation solution, Conductive filler, and the second adhesive layer may not include a thermally conductive filler.

The thermally conductive filler may be one or a mixture of graphite powder, carbon nanotube (CNT), carbon black, carbon fiber, ceramic, and metal powder. Two or more of them may be used in combination. Preferably, graphite powder, ceramics and metal powder may be used alone or in combination of two or more. When the thermally conductive filler is further used, it may contain 45 to 1,100 parts by weight, preferably 75 to 800 parts by weight, based on 100 parts by weight of the thermosetting resin. If the thermally conductive filler is used in excess of 1100 parts by weight, The vertical thermal conductivity of the composite sheet can be greatly increased.

The thermally conductive filler preferably has an average particle diameter of 3 to 25 占 퐉. If the average particle diameter is less than 3 占 퐉, it may be difficult to disperse the particles. If the average particle diameter exceeds 25 占 퐉, It is preferable to use a thermally conductive filler having a particle size within the above range.

The dispersant may be any of those generally used in the art, and preferably an acrylic block amine dispersant may be used.

The adhesive layer (the first adhesive layer and / or the second adhesive layer) is formed by mixing a mixture of the above-mentioned curable resin, rubber binder, silane coupling agent, fluorine surfactant, curing agent, curing accelerator, flame retardant, The viscosity and solids content of the adhesive can be adjusted by adjusting the viscosity and the amount of the cross-linked components. Thus, the surface condition of the composition for forming a heat-releasable adhesive layer can be improved and the adhesion of the base and the orientation of the particles can be controlled. At this time, the organic solvent may be used alone or in combination of two or more of methyl ethyl ketone, toluene, tetrahydrofuran (THF), and cyclohexanone.

The adhesive (or the first adhesive layer) having the composition and the composition ratio is applied (or coated) to the upper portion of the first electromagnetic wave shielding layer and then dried to form an adhesive layer. At this time, It is preferable to apply the adhesive layer so that the adhesive layer has an average thickness of 2 탆 to 25 탆, preferably an average thickness of 4 to 15 탆, on the basis of the composite sheet subjected to the hot pressing process. At this time, if the average thickness of the adhesive layer in the composite sheet is less than 2 탆, the bonding force (or adhesive force) between the first electromagnetic wave shielding layer and the thermal diffusion layer may be lowered.

Next, the second electromagnetic wave shielding layer 30 constituting the first type heat dissipation solution of the present invention will be described.

The second electromagnetic wave shielding layer 30 of the first type heat dissipation solution is not only capable of shielding electromagnetic waves, but also a layer capable of absorbing electromagnetic waves, such as a thermosetting epoxy resin, a rubber binder, a silane coupling agent, a fluorine surfactant, A hardening agent, and a curing accelerator, and may be a metal sheet, for example, a metal sheet.

In the second electromagnetic wave shielding layer 30 of the first type heat dissipation solution, a part of the adhesive component in the second electromagnetic wave shielding layer 30 is melted and filled in the through hole of the thermal diffusion layer during the hot press process for producing the composite sheet. Since the melting point of the second electromagnetic wave shielding layer is lower than that of the adhesive layer, the adhesive component to be filled in the through hole of the thermal diffusion layer is larger in the amount of the adhesive component originating from the second electromagnetic wave shielding layer than that of the adhesive layer- . Therefore, it is advantageous that the second electromagnetic wave shielding layer and the mixed resin constituting the second electromagnetic wave shielding layer have a melting point equal to or lower than the hot press process temperature (145 DEG C to 160 DEG C), or preferably a somewhat lower melting point.

Among the mixed resin components used for forming the second electromagnetic wave shielding layer of the first type heat radiation solution, the thermosetting epoxy resin may be one or two selected from bisphenol A epoxy resin, bisphenol F epoxy resin, novolak epoxy resin and Br- More than two species can be used.

The rubber binder of the mixed resin component may be the same as or different from the rubber binder of the adhesive layer, and may include at least one of acrylic rubber, silicone rubber, carboxylated nitrile elastomer, and phenoxy And preferably one or two or more of acrylic rubber and silicone rubber may be included. At this time, the carboxylnitrile elastomer is the same as mentioned in the description of the adhesive layer. The amount of the rubber binder used in the mixed resin may be 160 to 350 parts by weight, preferably 180 to 300 parts by weight, more preferably 200 to 280 parts by weight, based on 100 parts by weight of the thermosetting epoxy resin. If the amount of the binder used is less than 160 parts by weight, flexibility of the second electromagnetic wave shielding layer may be deteriorated, and when the composite sheet is bent, there may be a problem that the second electromagnetic wave shielding layer and the region between the thermal diffusion layers are partially peeled off. The use of the second electromagnetic wave shielding layer is uneconomical and the use of relatively different composition is decreased, and the electromagnetic wave shielding performance of the second electromagnetic wave shielding layer and the adhesive force with the thermal diffusion layer may be lowered.

The silane coupling agent serves to disperse the particles. The silane coupling agent may be a conventional silane coupling agent used in the art. Preferably, the silane coupling agent is a glycidoxy (C2 to C5 alkyl) trialkoxysilane C2-C5 alkyl) trialkoxysilane, vinyltri (C2-C5 alkoxy) silane, and aminoethylaminopropylsilane triol. More preferably, One or two selected from the group consisting of glycidoxypropyltrimethoxysilane, glycidoxypropyltrimethoxysilane, glycidoxypropylethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, and aminoethylaminopropylsilane triol, More than two species can be used. The amount of the silane coupling agent to be used may be 4 to 25 parts by weight, preferably 4 to 18 parts by weight, more preferably 4 to 12 parts by weight, relative to 100 parts by weight of the thermosetting epoxy resin. When the silane coupling agent is used in an amount of 4 When used in an amount less than 1 part by weight, the amount thereof used is too small so that the effect of dispersing the particles in the mixed resin can not be seen. If the amount is more than 25 parts by weight, there may be a problem of aggregation due to the reaction between the coupling agents. .

Among the mixed resin components, the fluorine-based surfactant plays a role of improving the coating property by lowering the surface tension, and it is possible to use a general one used in the art, preferably a fluoroaliphatic polymeric ester Specific examples thereof include FC4430 of 3M, Novec 4300 of Du Pont, DuPont Capstone of DuPont, and the like. The amount of the fluorinated surfactant to be used may be 0.5 to 5 parts by weight, preferably 0.5 to 3 parts by weight, based on 100 parts by weight of the thermosetting resin. When the fluorinated surfactant is used in an amount of less than 0.5 parts by weight, The coating property may not be good, and when it is used in an amount exceeding 5 parts by weight, there may be a problem that the adhesion with the thermal diffusion layer is lowered.

Mixed Resin Component The soft magnetic powder is at least one selected from the group consisting of Fe-Si-Al alloys, Fe-Si-Cr alloys, Fe-Si-B alloys, highflux, permalloy alloys, ferrite and Mn-Zn ferrite. The Fe-Si-Al alloy, the Fe-Si-Cr alloy and the Fe-Si-B alloy May be used alone or in combination of two or more. The soft magnetic powder may be used in an amount of 700 to 1,500 parts by weight, preferably 850 to 1,350 parts by weight, more preferably 900 to 1,300 parts by weight, based on 100 parts by weight of the thermosetting epoxy resin. If the amount is less than 700 parts by weight There may be a problem that the electromagnetic wave absorbing performance due to reduction of the permeability is lowered. If it is used in excess of 1,500 parts by weight, the electromagnetic wave shielding effect is excellent, but the mechanical properties such as flexibility may be deteriorated.

The soft magnetic powder preferably has an average particle diameter of 20 to 100 mu m, preferably 30 to 70 mu m. If the average particle diameter is less than 20 mu m, there is a problem that the electromagnetic wave shielding or absorption performance is deteriorated When the average particle size exceeds 100 탆, the coating property may be deteriorated. Therefore, it is preferable to use a soft magnetic powder having a particle size within the above range.

Mixed resin component The above-mentioned curing agent may be the same as or different from the curing agent of the adhesive layer, and preferably the same kind of curing agent is used. The curing agent may be used in an amount of 2 to 30 parts by weight, preferably 3 to 20 parts by weight, more preferably 4 to 15 parts by weight, based on 100 parts by weight of the thermosetting epoxy resin. If the amount of the curing agent is less than 2 parts by weight There may be a problem that the curing rate becomes too long and workability is deteriorated. If it is used in excess of 30 parts by weight, the adhesive component filled in the through hole may be decreased during the hot press process, and the adhesive force with the thermal diffusion layer may be lowered .

The humidity resistant agent is for controlling the water content in the second electromagnetic wave shielding layer and controlling the viscosity of the adhesive. Preferable examples thereof include aluminum sulfate, latex, silicone emulsion, poly (organosiloxane), hydrophobic polymer emulsion, These can be used singly or in combination of two or more. The amount of the humectant to be used may be 1 to 25 parts by weight, preferably 5 to 20 parts by weight, based on 100 parts by weight of the thermosetting resin. If the amount of the humectant is less than 1 part by weight, If it is used in an amount exceeding 25 parts by weight, it may be difficult to control the proper amount of water of the second electromagnetic wave shielding layer due to overuse.

The mixed resin may be prepared by mixing an organic solvent with a mixture of the thermosetting epoxy resin, the rubber binder, the silane coupling agent, the fluorine surfactant, the soft magnetic particles, the curing agent and the moisture absorber described above to adjust the viscosity and the viscosity of the composition for forming the second electromagnetic wave- The solids content can be controlled. At this time, the organic solvent used may include at least one of methyl ethyl ketone, toluene, tetrahydrofuran (THF), and cyclohexanone.

The mixed resin is preferably adjusted to have a viscosity of 800 to 1,200 cps at 25 ° C and a solid content of 40 to 60% by weight, preferably a viscosity of 950 to 1,200 cps at 25 ° C and a solid content of 48 to 56% .

The mixed resin having such composition and composition ratio is applied (or coated) on the top of the thermal diffusion layer, followed by drying and semi-curing to form a second electromagnetic wave shielding layer on the thermal diffusion layer. In the composite sheet of the present invention, The electromagnetic wave shielding layer may have an average thickness of 30 mu m to 300 mu m, preferably 30 mu m to 200 mu m, and more preferably 35 mu m to 100 mu m. At this time, if the average thickness of the second electromagnetic wave shielding layer is less than 30 mu m, the electromagnetic wave shielding effect may be insufficient. If the average thickness of the second electromagnetic wave shielding layer is more than 300 mu m,

In addition, the second electromagnetic wave shielding layer 30 'of the second type heat dissipation solution may be a conductor or an insulator, and may preferably be composed of a conductor such as a metal foil. Specific examples of the metal foil include a copper foil or an aluminum foil.

The second type heat dissipation solution may further include a metal sheet layer on the second electromagnetic wave shielding layer 30 '(see FIG. 3). At this time, the metal sheet layer may be the same as that of the second electromagnetic wave shielding layer of the first type heat radiation solution.

The first type heat dissipation solution of the present invention is a heat dissipation solution of the first type which is formed by laminating a laminate of a first electromagnetic wave shielding layer, an adhesive layer, a heat dissipating layer including a graphite sheet having a plurality of through holes and a second electromagnetic wave shielding layer, Stage 1; A second step of heating and pressing the laminate under a pressure of 145 to 160 占 폚 and 45 to 60 kgf / cm2 to perform a hot press process; And a third step of cooling the hot press and then separating the composite sheet integrated from the hot press.

In the first step, the compositions and composition ratios of the first electromagnetic wave shielding layer, the adhesive layer, the heat dissipation layer, and the second electromagnetic wave shielding layer are the same as those described above.

In addition, the second type heat dissipation solution of the present invention includes a laminate in which a first electromagnetic wave shielding layer, a first adhesive layer, a thermal diffusion layer having a plurality of through holes, a second adhesive layer, and a second electromagnetic wave shielding layer are laminated in order A step 1 of putting into hot press equipment; Two steps of heating and pressing the laminate under a pressure of 145 to 160 DEG C and 45 to 60 kgf / cm < 2 > for 50 to 70 minutes; And a third step of cooling the hot press and then separating the composite sheet integrated from the hot press.

The composition and composition ratio of the first electromagnetic wave shielding layer, the first adhesive layer, the thermal diffusion layer, the second adhesive layer, and the second electromagnetic wave shielding layer in the first step are the same as those described above.

In addition, a metal sheet layer may be further formed on the second electromagnetic wave shielding layer in the first step, and the metal sheet layer may be composed of the same components as the second electromagnetic wave shielding layer of the first type heat dissipation solution, Of the metal sheet.

If the temperature of the hot press process is less than 145 占 폚 in step 2 in the manufacturing method of the first type and / or second type heat radiation solution, adhesive components of the second electromagnetic wave shielding layer and / or the adhesive layer are not sufficiently melted, If the temperature exceeds 160 ° C, the adhesive component in the second electromagnetic wave shielding layer may melt too much to maintain the shape of the second electromagnetic wave shielding layer and the mechanical properties may be deteriorated.

If the pressure is less than 45 kgf / cm < 2 > during the two-step hot pressing process, the amount of the adhesive component in the second electromagnetic wave shielding layer and / or the adhesive component of the adhesive layer may be small, Exceeding is uneconomical.

It is preferable that the hot press process is performed by heating and pressing the laminate under the above pressure and temperature for 40 minutes to 80 minutes, preferably 50 minutes to 70 minutes. At this time, Minute, the adhesive component does not sufficiently flow out from the second electromagnetic wave shielding layer, so that there is a problem that the amount of filling into the hole of the thermal diffusion layer is small and the peel strength is lowered, and it is uneconomical to exceed 70 minutes.

The heating in the second step may be carried out by warming a hot press at 10 ° C to 35 ° C at a rate of 3 ° C / min to 5 ° C / min to 145 ° C to 160 ° C.

In addition, in the manufacturing method of the first type and / or the second type heat radiation solution, the cooling in the above three stages is carried out at a temperature of 145 ° C to 160 ° C at a rate of 3 ° C / min to 5 ° C / Followed by cooling.

The composite sheet of the present invention produced by the above-described structure, composition and composition ratio of each layer and the manufacturing method of the present invention has a horizontal thermal conductivity of 250 to 1,000 W / m · k and a vertical thermal conductivity of 3 to 20 W / m · k And preferably has a horizontal thermal conductivity of 300 to 1,000 W / m · k and a vertical thermal conductivity of 3.5 to 15 W / m · k.

The first type and the second type heat dissipation solution of the present invention are characterized in that the peel strength per through hole is measured in a through hole of the thermal diffusion layer by a 90 degree peel test in accordance with JIS C 6741 standard The peel strength for the film can satisfy the following equation 4, preferably the equation 4-1, more preferably the equation 4-2.

[Equation 4]

 (Maximum peel strength-minimum peel strength)? 300 gf / hole

[Equation 4-1]

(Maximum peel strength - minimum peel strength)? 200 gf / hole

[Equation 4-2]

20 gf / hole? (Maximum peel strength - minimum peel strength)? 100 gf / hole

The maximum peel strengths in the equations (4) to (4-2) may be 400 to 1,500 gf / hole, preferably 400 to 1,000 gf / hole, and more preferably 450 to 950 gf / hole.

The first and second type heat dissipation solutions of the present invention are characterized in that the peel strength of the thermal diffusion layer is in the range of 420 gf / cm ² to 820 gf / cm ² when measured by a 180 ° peel test in accordance with JIS C 6741 ² It is, and preferably may be ^{470 gf / cm 2 ~ 780gf /} cm 2, more preferably from ^{520 gf / cm 2 ~ 770gf /} cm 2.

The electromagnetic shielding and heat-dissipating function integrated composite sheet of the present invention can be used as an electromagnetic wave shielding and heat dissipation component of an electronic device, and is preferably used for a digitizer, a smart phone, a tablet personal computer portable electronic devices such as a personal computer, a personal computer, a portable multimedia player (PMP), or a wearable electronic device such as a VR (Virtual Reality) and a smart watch.

Hereinafter, the present invention will be described in more detail with reference to the following examples. However, the scope of the present invention is not limited to the examples illustrated by the following examples.

[ Example ]

Preparation Example  1-1: Type 1 Of thermal solution  Fabrication of the second electromagnetic wave shielding layer

265.2 parts by weight of a carboxylate nitrile elastomer (weight average molecular weight: 235,500 to 236,500) as a polymeric binder, 100 parts by weight of a silane coupling agent (manufactured by US D Co., Ltd.) per 100 parts by weight of bisphenol A epoxy resin as a thermosetting epoxy resin 2.05 parts by weight of a fluorine-based surfactant (trade name of FC series surfactant manufactured by M Company, USA), 978 parts by weight of an Fe-Si-Al sandstock powder having an average particle size of 42 to 44 μm, , 9.7 parts by weight of 4,4'-diaminodiphenlysulfone (4,4'-diaminodiphenlysulfone), and 10.5 parts by weight of a moisture-proofing agent (Japan S, KP 392) were added to methyl ethyl ketone as an organic solvent Next, the viscosity was adjusted to 1,050 to 1,080 cps and the solid content was adjusted to 53% by weight, and the resulting mixture was applied to a mold release substrate and then aged at 60 DEG C for 24 hours to prepare a semi-cured metal sheet.

Preparation Example  1-2 ~ Preparation Example  1-3 and Example of comparison preparation  1-1-2

A metal sheet as a second electromagnetic wave shielding layer was prepared in the same manner as in Preparation Example 1-1, except that a metal sheet having the composition shown in Table 1 was prepared.

division
(Parts by weight) Preparation Example
1-1 Preparation Example
1-2 Preparation Example
1-3. Example of comparison preparation
1-1 Example of comparison preparation
1-2 Thermosetting epoxy resin 100 100 100 100 100 Rubber binder 265.2 300 200 120 265.2 Silane coupling agent 8.5 6.0 8.5 8.5 8.5 Fluorine
Surfactants 2.05 1.87 1.98 2.05 2.05 Soft magnetic powder 978 978 1,290 978 1,585 Hardener 9.7 9.7 8.6 9.7 9.7 Humidifier 10.5 10.5 13.0 10.5 10.5

Preparation Example  2-1: Adhesive ( The first adhesive layer  And The thickness of the second adhesive layer  Adhesive component)

Based on 100 parts by weight of a thermosetting epoxy resin containing bisphenol A epoxy resin (K Chemicals, trade name YD series resin) and novolak epoxy resin (KODO CHEMICAL, YDCN series resin) 1: 0.25 weight ratio, (3M, trade name: FC series surfactant), 0.15 part by weight of a silane coupling agent (Dow Corning, trade name Z6106), 4,4'-diamino di A mixture of 15 parts by weight of phenylsulfone, 3.2 parts by weight of a curing accelerator (manufactured by Shikoku), 5.2 parts by weight of a moisture-proofing agent (Japan S Company, KP series) and 42 parts by weight of a flame retardant (OP series of Swiss C Company) Ethyl ketone and stirred to prepare an adhesive.

Preparation Example  2-2 to 2-3 and Example of comparison preparation  2-1 to 2-2

An adhesive having the composition shown in Table 2 below was prepared in the same manner as in Preparation Example 2-1 to prepare Preparations 2-2 to 2-3 and Comparative Preparations 2-1 to 2-2 Respectively.

division
(Parts by weight) Preparation Example 2-1 Preparation Example 2-2 Preparation Example 2-3 Comparative Preparation Example 2-1 Comparative Preparation Example 2-2 Thermosetting resin Bisphenol A epoxy resin and
Novolac epoxy resin
Mixed resin 1: 0.25
Weight ratio 1: 0.25
Weight ratio Bisphenol A epoxy resin
Exclusive 1: 0.25
Weight ratio 1: 0.25
Weight ratio Total (parts by weight) 100 100 100 100 100 Rubber binder 65 78 65 10 120 Silane coupling agent 1.7 3.9 1.7 1.7 1.7 Fluoric surfactant 0.15 0.35 0.15 0.15 0.15 Hardener 15 9 15 15 15 Hardening accelerator 3.2 1.6 3.2 3.2 3.2 Flame retardant 42 38 42 42 42 Humidifier 5.2 2.7 5.2 5.2 5.2

Preparation Example  3-1: Through hole  Equipped Graphite  Manufacture of sheet

A plurality of circular through holes 11 were formed in a graphite sheet (T company, TGS17) having an average thickness of 17 mu m (see a schematic view of Fig. 4A).

The perforated hole 1 had an average diameter of 3 mm. The major axis distance between the centers of the through holes was 10 mm. The minor axis distance was 12 mm. The total area of the through holes was the entire 11.8% of the area, and the deformation degree of the through hole was 1.256 based on the following formula (2).

&Quot; (2) "

Deformation degree = (inside width of shape / circumference length of shape) ^1/2 .

Preparation Example  3-2 ~ Preparation Example  3-8 and Example of comparison preparation  3-1 ~ Example of comparison preparation  3-2

Graphite sheets each having a through-hole having a cross-sectional shape as shown in Table 3 below were prepared on the same graphite sheet as the graphite sheet of Preparation Example 3-1, and the characteristics of these graphite sheets are shown in Table 3 below.

In Table 3, through holes are formed by adjusting the number and spacing of the through holes so as to satisfy the entire area of the through holes.

division Through hole cross-sectional shape Heterogeneity Through hole center
Interspacing L value The total area of the top of the seat
Overall area of through hole Preparation Example 3-1 circle
(Diameter 3 mm) 0.866 d = 0.633L 12 mm 11.8% Preparation Example 3-2 circle 0.866 d = 0.67L 12 mm 13.8% Preparation Example 3-3 circle 0.866 d = 0.3L 12 mm 15.5% Preparation Example 3-4 circle 0.866 d = 0.371L 10.5 mm 15.1% Preparation Example 3-5 + Type
(Width 1 mm) 0.678 d = 0.8L 13 mm 12.2% Preparation Example 3-6 + Type
(Width 1 mm) 0.678 d = 0.646L 13 mm 13.5% Preparation Example 3-7 + Type
(Width 1.5 mm) 0.812 d = 0.8L 13 mm 12.4% Preparation Example 3-8 + Type
(Width 1.5 mm) 0.812 d = 0.646L 13 mm 13.3% Preparation Example 3-9 ┏ type
(Width 1 mm) 0.678 d = 0.646L 13 mm 11.1% Comparative Preparation Example 3-1 circle
(Diameter 9mm) 1.500 d = 0.633L 12 mm 23.4% Comparative preparation example 3-2 circle
(Diameter 0.94 mm) 0.485 d = 0.633L 12 mm 6.3% d is the distance between the center axis of the through hole formed in the x axis direction (column direction) and the adjacent through hole, and L is the distance between the center axis (x axis) of the through hole existing in each of the odd column and the even column.

Example of comparison preparation  3-3

A graphite sheet without preparation of through hole (Preparation T-3, TGS series product) of Preparative Example 3-1 itself was prepared as Comparative Preparation Example 3-5.

Example  1-1: Type 1 Heat dissipation solution  Produce

The adhesive prepared in Preparation Example 2-1 was coated on one surface of a copper foil (first electromagnetic wave shielding layer), and then semi-cured to form an adhesive layer.

The graphite sheet of Preparation Example 3-1 and the second electromagnetic wave shielding layer of Preparation Example 1-1 were bonded and laminated, and then a graphite sheet was laminated on the adhesive layer.

Next, a hot press equipment was put into a sheet laminated with the first electromagnetic wave shielding layer-adhesive layer-thermal diffusion layer-second electromagnetic wave shielding layer.

Next, the hot press was heated from 70 ° C to 150 ° C at a rate of 4 ° C / minute, and thermocompression was performed for 60 minutes under the conditions of 150 and 50 kgf / cm 2 pressure.

Next, after cooling at a rate of 4.5 deg. C / min up to 60 deg. C, the thermocompression-bonded sheet was taken out from the hot press and adhered to the through hole of the thermal diffusion layer as shown in Fig. 1 and the adhesive component derived from the second electromagnetic wave shielding layer Layer type first type heat dissipation solution with electromagnetic wave shielding and heat dissipating function.

The thickness of the first electromagnetic wave shielding layer 40 was 12 占 퐉, the thickness of the adhesive layer 30 was 5 占 퐉, the thickness of the thermal diffusion layer 10 was 17 占 퐉, And the second electromagnetic wave shielding layer 30 was 50 m.

Example  1-2 ~ Example  1-14: First type Heat dissipation solution  Produce

In the same manner as in Example 1, the integrated composite sheets of the combination as shown in Table 4 below were respectively prepared, and Examples 1-2 to 1-14 were respectively conducted.

Comparative Example  1-1

The adhesive prepared in Preparation Example 2-1 was coated on one surface of a copper foil (first electromagnetic wave shielding layer), and then semi-cured to form a first adhesive layer.

Next, after the graphite sheet of Comparative Preparation Example 3-1 was laminated on the other surface of the adhesive layer, the adhesive of Preparation Example 2-1 was applied to form a second adhesive layer.

Next, after the second electromagnetic wave shielding layer of Preparation Example 1-1 was laminated on the other surface of the second heat-insulating adhesive layer, a 5-layer type sheet was hot-pressed.

Next, the hot press was heated from 70 ° C to 150 ° C at a rate of 4 ° C / minute, and thermocompression was performed for 60 minutes under the conditions of 150 and 50 kgf / cm 2 pressure.

Next, after cooling at a rate of 4.5 deg. C / minute to 60 deg. C, the thermocompressed sheet was taken out from the hot press to prepare a composite sheet.

The total thickness of the composite sheet thus produced was 90 탆, the thickness of the first electromagnetic wave shielding layer was 12 탆, the first adhesive layer was 4.9 탆, the thermal diffusion layer was 17 탆, the second adhesive layer was 5.2 탆, Was 50.5 mu m.

Comparative Example  1-2

In the same manner as in Example 1, the composite composite sheets of the combinations as shown in Table 5 below were respectively prepared and Comparative Example 2 was carried out.

division The first electromagnetic wave
Shielding layer Adhesive layer Thermal diffusion layer The second electromagnetic wave
Shielding layer Interlayer thickness (탆) ⁽¹⁾ Example 1-1 Copper foil Preparation Example
2-1 Preparation Example
3-1 Preparation Example
1-1 12/5/17/50 Examples 1-2 Copper foil Preparation Example
2-1 Preparation Example
3-1 Preparation Example
1-2 12/5/17/50 Example 1-3 Copper foil Preparation Example
2-1 Preparation Example
3-1 Preparation Example
1-3 12/5/17/50 Examples 1-4 Copper foil Preparation Example
2-2 Preparation Example
3-1 Preparation Example
1-1 12/5/17/50 Examples 1-5 Copper foil Preparation Example
2-3 Preparation Example
3-1 Preparation Example
1-1 12/5/17/50 Examples 1-6 Copper foil Preparation Example
2-1 Preparation Example
3-1 Preparation Example
1-1 15/8/25/65 Examples 1-7 Copper foil Preparation Example
2-1 Preparation Example
3-2 Preparation Example
1-1 12/5/17/50 Examples 1-8 Copper foil Preparation Example
2-1 Preparation Example
3-3 Preparation Example
1-1 12/5/17/50 Examples 1-9 Copper foil Preparation Example
2-1 Preparation Example
3-4 Preparation Example
1-1 12/5/17/50 Example 1-10 Copper foil Preparation Example
2-1 Preparation Example
3-5 Preparation Example
1-1 12/5/17/50 Example 1-11 Copper foil Preparation Example
2-1 Preparation Example
3-6 Preparation Example
1-1 12/5/17/50 Examples 1-12 Copper foil Preparation Example
2-1 Preparation Example
3-7 Preparation Example
1-1 12/5/17/50 Examples 1-13 Copper foil Preparation Example
2-1 Preparation Example
3-8 Preparation Example
1-1 12/5/17/50 Examples 1-14 Copper foil Preparation Example
2-1 Preparation Example
3-9 Preparation Example
1-1 12/5/17/50 Comparative Example 1-1 Copper foil Preparation Example
2-1 Comparative Preparation Example 3-1 Preparation Example
1-1 12/5/17/50 Comparative Example 1-2 Copper foil Preparation Example
2-1 Comparative preparation example 3-2 Preparation Example
1-1 12/5/17/50 Comparative Example 1-3 Copper foil Preparation Example
2-1 Comparative Preparation Example 3-3 Preparation Example
1-1 12/5/17/50 (1) The order of interlayer thickness is in the order of the first electromagnetic wave shielding layer, the adhesive layer, the graphite sheet layer, and the second electromagnetic wave shielding layer.

Example  2-1: second type Heat dissipation solution  Produce

The adhesive prepared in Preparation Example 1-1 was coated on one surface of a copper foil (first electromagnetic wave shielding layer) having an average thickness of 9 탆 and then semi-cured to form a first adhesive layer.

Separately, the adhesive prepared in Preparation Example 1-1 was coated on one side of a copper foil (second electromagnetic wave shielding layer) having an average thickness of 12 μm, and then semi-cured to form a second adhesive layer.

Next, the first electromagnetic wave shielding layer was bonded and laminated, and then the graphite sheet of Preparation Example 3-1 was laminated on the adhesive layer. At this time, the graphite sheet is not formed with a passivation film.

Next, the second electromagnetic wave shielding layer was laminated on the top of the graphite sheet so that the second adhesive layer and the graphite sheet were laminated.

Next, hot-press equipment was put into a sheet laminated with the first electromagnetic wave shielding layer-first adhesive layer-graphite layer-second adhesive layer-second electromagnetic wave shielding layer.

Next, hot-press equipment was put into a sheet laminated with the first electromagnetic wave shielding layer-first adhesive layer-graphite layer-second adhesive layer-second electromagnetic wave shielding layer.

Next, the hot press was heated from 70 ° C to 150 ° C at a rate of 4 ° C / minute, and thermocompression was performed for 60 minutes under the conditions of 150 and 50 kgf / cm 2 pressure.

Next, the sheet was cooled to 60 deg. C at a rate of 4.5 deg. C / minute, and then the thermally compressed sheet was taken out from the hot press to form a first adhesive layer and a second adhesive layer in the through holes of the graphite layer as shown in Fig. And a filled second type of heat dissipation solution were prepared.

The total thickness of the manufactured heat dissipation solution 100 was 48 μm, the average thickness of the first electromagnetic wave shielding layer 40 was 9 μm, the average thickness of the first adhesive layer was 5 μm, the average thickness of the thermal diffusion layer was 17 μm, The average thickness of the adhesive layer was 5 占 퐉, and the average thickness of the second electromagnetic wave shielding layer was 12 占 퐉.

Example  2-2 ~ Example  2-9

In the same manner as in Example 2-1, monolithic multilayer composite sheets of combinations as shown in Table 5 below were prepared, and Examples 2-2 to 2-9 were respectively conducted.

Example  2-10: The metal sheet layer  The second type formed Heat dissipation solution  Produce

Layered composite sheet was produced in the same manner as in Example 2-1 except that the sheet having the first electromagnetic wave shielding layer-first adhesive layer-graphite layer-second adhesive layer-second electromagnetic wave shielding layer The metal sheets prepared in Preparative Example 1-1 were laminated on the second electromagnetic wave shielding layer and then put into a hot press machine to perform a hot press process in the same manner as in Example 1. [

The total thickness of the manufactured integrated multilayer composite sheet 100 was 98 m, the average thickness of the first electromagnetic wave shielding layer 40 was 9 m, the average thickness of the first adhesive layer was 5 m, the average thickness of the thermal diffusion layer was 17 m, The average thickness of the second adhesive layer was 5 mu m, the average thickness of the second electromagnetic wave shielding layer was 12 mu m, and the average thickness of the metal sheet layer was 50 mu m.

Comparative Example  2-1 ~ Comparative Example  2-3

Layer composite sheets were prepared in the same manner as in Example 2-1, and Comparative Examples 2-1 to 2-3 were carried out, respectively.

division The first and second electromagnetic waves
Shielding layer The first and second adhesive layers Thermal diffusion layer The metal sheet layer Interlayer thickness (탆) ⁽¹⁾ Example 2-1 Copper foil Preparation Example
2-1 Preparation Example
3-1 - 9/5/17/5/12 Example 2-2 Copper foil Preparation Example
2-1 Preparation Example
3-2 - 9/5/17/5/12 Example 2-3 Copper foil Preparation Example
2-1 Preparation Example
3-3 - 9/5/17/5/12 Examples 2-4 Copper foil Preparation Example
2-1 Preparation Example
3-4 - 9/5/17/5/12 Example 2-5 Copper foil Preparation Example
2-1 Preparation Example
3-5 - 9/5/17/5/12 Examples 2-6 Copper foil Preparation Example
2-1 Preparation Example
3-6 - 9/5/17/5/12 Examples 2-7 Copper foil Preparation Example
2-1 Preparation Example
3-7 - 9/5/17/5/12 Examples 2-8 Copper foil Preparation Example
2-1 Preparation Example
3-8 - 9/5/17/5/12 Examples 2-9 Copper foil Preparation Example
2-1 Preparation Example
3-9 - 9/5/17/5/12 Examples 2-10 Copper foil Preparation Example
2-1 Preparation Example
3-9 Preparation Example 1-1 9/5/17/5/12/50 Comparative Example 2-1 Copper foil Preparation Example
2-1 Comparative Preparation Example 3-1 - 9/5/17/5/12 Comparative Example 2-2 Copper foil Preparation Example
2-1 Comparative preparation example 3-2 - 9/5/17/5/12 Comparative Example 2-3 Copper foil Preparation Example
2-1 Comparative Preparation Example 3-3 - 9/5/17/5/12 (1) The order of interlayer thickness is the order of the first electromagnetic wave shielding layer, the first adhesive layer, the graphite sheet layer, the second adhesive layer, the second electromagnetic wave shielding layer and the metal sheet.

Experimental Example  : Peel strength and Thermal diffusivity  Measure

(One) Thermal diffusion layer  Total Peel Strength ( gf / cm ² ) And Perforated hall  Peel strength gf / Hole)

The integrated composite sheet prepared in each of the Examples and Comparative Examples was prepared in accordance with JIS C 6741, and the peel strength of the entire thermal diffusion layer was measured by a 180 ° peel test (180 ° peel test) Are shown in Table 6 below.

Further, the peel strength per through hole was measured by performing 90 占 peel test (90 占 Peel Test).

(2) Measurement of thermal diffusivity

The integrated composite sheet produced in each of the Examples and Comparative Examples was cut into a size of 100 mm x 10 m (width, length), and a double-sided tape was attached to one surface of the copper foil (Cu).

Next, the prepared sample is attached onto the heating block and the temperature of the heating block is raised to 80 ° C (the temperature is raised to 80 ° C, which is the temperature of the AP chip in the Smart Phone).

Next, the heating block was sealed in a box and stabilized for 10 minutes. Then, the temperature was measured using an IR camera to determine the highest temperature (hot spot) and the lowest temperature (cold spot) of the composite sheet , And the temperature difference between these was measured to determine the thermal diffusivity of the composite sheet. At this time, the smaller the difference between the two temperatures, the better the horizontal thermal conductivity and the heat radiation performance.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

1: through hole 10: thermal diffusion layer composed of a graphite sheet provided with a through hole
20: adhesive layer or first adhesive layer
20 ': a resin derived from the second electromagnetic wave shielding layer (adhesive component) or a second adhesive layer
30: second electromagnetic wave shielding layer 30 ": metal sheet layer
40: first electromagnetic wave shielding layer
100: Integrated composite sheet with electromagnetic wave shielding and heat dissipation function

Claims (20)

Wherein the total area of the through holes of the graphite sheet is 11% to 18% of the total area of the graphite on the upper surface or the lower surface of the graphite sheet. 2. The graphite sheet for a heat dissipation solution according to claim 1, .
The graphite sheet for a heat dissipation solution according to claim 1, wherein the distance between the through holes of the graphite sheet satisfies the following formula (1):
[Equation 1]
d = (0.3 to 1.2) L
In Equation (1), L is the distance between the center axis of the through hole formed in the x axis direction (column direction) and the neighboring through hole, and d is the distance between the center axis (x axis) of the through hole existing in each of the odd column and the even column.
2. The liquid crystal display device according to claim 1, wherein a plurality of through holes formed repeatedly at regular intervals in a row formed in the x-axis direction in the xy coordinate system are divided into an odd number column and an even number column,
Wherein the center axis of the first through hole in the even-numbered row is positioned between the center axis of the odd-numbered first through-hole and the center axis of the second through-hole on one side of the graphite sheet.
The graphite sheet for a heat dissipation solution according to claim 1, wherein the through holes are formed in a cross-sectional shape having a profile of the following formula (2).
&Quot; (2) "
0.500 ≤
In the formula (2), the stereogram is ^1/2 of the inner width of the shape / the peripheral length of the shape.
A composite sheet in which electromagnetic wave shielding and heat radiation functions are integrated,
A graphite sheet according to any one of claims 1 to 4 as a thermal diffusion layer,
Wherein the heat dissipation solution has a relative thermal degradation rate satisfying the following equation (1): 0% to 30%;
[Equation 1]

In the above equation 1,? T ₁ And ΔT ₂ is when heat is applied and the 80 ℃ to one end of the thermal solution, as a difference of heat measured at opposite ends of said end, ΔT ₁ is ΔT ₂ is a train value of a heat dissipation solution in which a graphite sheet having through holes is introduced into a thermal diffusion layer, and ΔT ₂ is a train heat value of a heat dissipation solution obtained by introducing a graphite sheet having no through holes into a thermal diffusion layer
6. The composite sheet according to claim 5, wherein the integrated composite sheet
A first electromagnetic wave shielding layer; An adhesive layer; A thermal diffusion layer comprising the graphite sheet; And a second electromagnetic wave shielding layer are stacked in this order,
Wherein the second electromagnetic wave shielding layer comprises a cured sheet formed of a resin containing an electromagnetic wave shielding component,
Wherein the inside of the through hole of the graphite sheet is filled with the resin derived from the second electromagnetic wave shielding layer.
7. The electromagnetic wave shielding film according to claim 6, characterized in that a resin derived from the second electromagnetic wave shielding layer and an adhesive derived from the adhesive layer are filled, and a separate adhesive layer is not provided between the thermal diffusion layer and the second electromagnetic wave shielding layer Heat dissipation solution.
The method according to claim 6, wherein the first electromagnetic wave shielding layer has an average thickness of 5 탆 to 70 탆, the adhesive layer has an average thickness of 2 탆 to 25 탆, the thermal diffusion layer has an average thickness of 10 탆 to 40 탆, Wherein the electromagnetic shielding and heat-radiating composite sheet has a thickness of 30 to 300 mu m.
[6] The integrated composite sheet of claim 5, wherein the integrated composite sheet comprises: an electromagnetic wave shielding layer, a first adhesive layer, a thermal diffusion layer including the graphite sheet, a second adhesive layer and a second electromagnetic wave shielding layer,
Wherein the inside of the through hole of the graphite sheet is filled with an adhesive derived from the first adhesive layer and the second adhesive layer.
The heat dissipation solution according to claim 9, wherein the first adhesive layer, the thermal diffusion layer, and the second heat-dissipative adhesive layer satisfy the following equation (2).
[Equation 2]
(d2 + d3)? d1? 4 (d2 + d3)
In Equation 2, d1 is the average thickness of the thermal diffusion layer, d2 is the average thickness of the first adhesive layer, and d3 is the average thickness of the second adhesive layer.
The heat dissipation solution according to claim 9, wherein a metal sheet layer is further laminated on the second electromagnetic wave shielding layer.
The heat dissipation solution according to claim 6 or 9, wherein no passivation film is provided on the top and bottom of the graphite sheet.
The heat dissipation solution according to claim 6 or 9, wherein, when measured according to JIS C 6741, the peel strength of the through hole in the thermal diffusion layer satisfies the following equation (4).
[Equation 4]
(Maximum peel strength-minimum peel strength)? 300 gf / hole
The heat dissipation solution according to claim 13, wherein the maximum peel strength of the equation (4) is 400 to 1,500 gf / hole.
The heat dissipation solution according to claim 6 or 9, wherein the horizontal thermal conductivity is 250 to 1,000 W / m · k and the vertical thermal conductivity is 3 to 20 W / m · k.
A first step of putting a laminate in which a first electromagnetic wave shielding layer, an adhesive layer, a thermal diffusion layer including a graphite sheet of any one of claims 1 to 4 and a second electromagnetic wave shielding layer are laminated, into a hot press equipment;
A second step of heating and pressing the laminate under a pressure of 145 to 160 占 폚 and 45 to 60 kgf / cm2 to perform a hot press process; And
And a third step of cooling the hot press and then separating the composite sheet integrated from the hot press.
The laminate obtained by sequentially laminating the first electromagnetic wave shielding layer, the first adhesive layer, the thermal diffusion layer including the graphite sheet of any one of items 1 to 4, the second adhesive layer and the second electromagnetic wave shielding layer in this order is hot Step 1 into press equipment;
Two steps of heating and pressing the laminate under a pressure of 145 to 160 DEG C and 45 to 60 kgf / cm < 2 > for 50 to 70 minutes; And
And a third step of cooling the hot press and then separating the composite sheet integrated from the hot press.
A coverlay film comprising the thermal solution of claim 6 or 9.
A flexible circuit board comprising the heat dissipation solution of claim 6 or 9.
A portable electronic device comprising the heat dissipation solution of claim 6 or 9.

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