KR102001719B1 - Metal composite sheet - Google Patents

Abstract

The present invention relates to a metal composite sheet having a heat dissipating function, comprising: a first metal thin film; A heat dissipation layer formed on one surface or both surfaces of the first metal thin film; An adhesive layer disposed on the heat dissipation layer; And a second metal thin film disposed on the adhesive layer, and a coverlay integrated metal complex film comprising the metal composite sheet.

Description

{METAL COMPOSITE SHEET}

The present invention relates to a metal composite sheet having a heat dissipating function, and provides a metal composite sheet that efficiently dissipates heat generated in a display device.

2. Description of the Related Art In recent years, various electronic products such as a notebook computer and a mobile phone have progressed at a remarkably high speed and miniaturization. BACKGROUND ART [0002] Along with high performance and miniaturization of electronic products, electronic components incorporated therein have been increasing in capacity and high integration, and accordingly, a lot of heat is generated in electronic products. Heat generated may shorten the life of the product, cause it to malfunction, and, in extreme cases, cause explosion or fire. Particularly, in plasma display panels (PDP) and LCD monitors, sharpness, color tone, and the like are deteriorated to lower the reliability and stability of products. Therefore, the heat generated inside the product must be discharged to the outside or self-cooled.

Accordingly, a graphite sheet is mainly used as a base material for heat dissipation. The graphite sheet is lightweight and slim, and most of all, its thermal conductivity is very high, such as copper (Cu) or more, and is thus usefully used for a substrate and a substrate constituting an electronic circuit, a PDP constituting a plasma television or the like.

However, when the graphite sheet is attached to a heat generating component using a point contact adhesive, there is a problem that the graphite sheet is easily peeled off from the point of contact with the carbon crystal. In addition, the conventional heat-radiating sheet using a graphite sheet has a problem that delamination occurs.

The present invention aims to develop a sheet having an excellent thermal conductivity and heat emission efficiency as well as improving the interlayer peeling phenomenon by forming a heat dissipation layer on a metal thin film by a vapor deposition method.

To this end, it is an object of the present invention to provide a metal composite sheet capable of simultaneously achieving an improvement in delamination phenomenon and a remarkable reduction in thickness, by constituting a metal thin film having a heat dissipation layer formed by evaporation method without using an adhesive as a base substrate .

Another object of the present invention is to provide a cover-and -layer-type metal composite film which can simultaneously perform a heat radiation function and a cover-lay function, and can be easily applied by a roll-to-roll method .

In order to achieve the above object, the present invention provides a metal composite sheet and a coverlay integrated metal complex film comprising the same.

One embodiment of the present invention is a thin film transistor comprising: a first metal thin film; A heat dissipation layer formed on one surface or both surfaces of the first metal thin film; An adhesive layer disposed on the heat dissipation layer; And a second metal thin film disposed on the adhesive layer.

According to an embodiment of the present invention, the metal composite sheet may have a heat dissipation layer formed on one surface of the first metal thin film, and a structure integrally formed to be in contact with one surface of the second metal thin film.

According to an embodiment of the present invention, the metal composite sheet may further include a heat dissipation layer formed on one side or both sides of the second metal thin film.

According to an embodiment of the present invention, the metal composite sheet may have a structure in which the heat dissipation layer formed on one side of the first metal thin film and the heat dissipation layer formed on one side of the second metal thin film are integrated with each other so as to be in contact with the adhesive layer .

According to an embodiment of the present invention, the metal composite sheet may have a structure in which a heat dissipation layer formed on one surface of the first metal thin film and an adhesive layer formed on one surface of the second metal thin film are in contact with each other.

According to an embodiment of the present invention, the heat dissipation layer may be formed by depositing a thermally conductive carbon structure. Here, the thermally conductive carbon structure may be a carbon nanotube (CNT), a graphite, a graphene, a diamond, a fullerene, a carbon black, or a combination thereof It is preferable to include one selected from the group consisting of

According to an embodiment of the present invention, the heat dissipation layer may have a thickness in the range of 0.1 to 1 μm.

According to an embodiment of the present invention, the metal composite sheet may have a thickness in the range of 0.1 to 1 mu m and a thermal conductivity in the range of 400 to 1000 W / mK.

According to an embodiment of the present invention, the adhesive layer may be a heat dissipation adhesive layer including a thermally conductive filler.

Another embodiment of the present invention is a method of manufacturing a semiconductor device comprising a polyimide (PI) layer; An adhesive layer formed on the polyimide layer; And a release layer, wherein the cover layer includes a magnetic layer (Polymer Magnetic Sheet Layer) coated on the lower part of the polyimide layer, and a coverlay integrated metal composite film in which the metal composite sheet is integrated do.

According to another embodiment of the present invention, the metal composite film may have a structure in which the magnetic layer of the coverlay and the second metal thin film of the metal composite sheet are brought into contact with each other and integrated.

According to another embodiment of the present invention, the metal composite film may have a structure in which one surface of the magnetic layer of the cover layer and the heat dissipation layer formed on one surface of the second metal thin film are in contact with each other and integrated.

According to another embodiment of the present invention, the metal composite film may include one insulating layer in which the polyimide layer and the adhesive layer are integrated.

According to another embodiment of the present invention, the cover-lay type metal composite film is attachable in a roll-to-roll manner.

In the present invention, the first metal thin film; A heat dissipation layer formed by vapor deposition; By forming the metal composite sheet including the adhesive layer and the second metal thin film, it is possible to reduce the cost by preventing the delamination phenomenon and reduce the thickness by removing the adhesive layer.

In addition, by forming a cover-and -layer-type metal composite film in which a metal composite sheet and a coverlay are integrated, it is possible to easily apply the film to a display device in a roll-to-roll manner.

Accordingly, the metal composite sheet according to the present invention and the cover-lay type composite film comprising the metal complex sheet can be used in a display device to simultaneously provide a slimming effect and an effect of heat resistance.

1 to 5 are views schematically showing a metal composite sheet according to the present invention.
6 and 7 are views schematically showing a coverlay according to the present invention.
8 and 9 are views schematically showing a cover-lay type metal composite film according to the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that the present invention is not limited thereto and that the present invention is only defined by the scope of the following claims.

In an embodiment of the present invention, a metal thin film includes a first metal thin film, a heat dissipation layer formed on one or both surfaces of the first metal thin film, an adhesive layer disposed on the heat dissipation layer, and a second metal thin film disposed on the adhesive layer. Thereby providing a composite sheet.

The metal composite sheet according to the present invention includes a structure in which specific layers are laminated and secures the thermal conductivity, thermal diffusibility and adhesion stability of the interior of each layer, thereby achieving a slimming effect and heat resistance The effect of durability can be simultaneously given.

1 schematically shows a structure of a metal composite sheet 100 according to an embodiment of the present invention.

Referring to FIG. 1, the metal composite sheet 100 may include a first metal thin film 10, a heat dissipation layer 21, an adhesive layer 30, and a second metal thin film 40, The first metal thin film 10, the heat dissipation layer 21, the adhesive layer 30, and the second metal thin film 40 are sequentially stacked.

The first metal thin film 10 and the second metal thin film 40 are formed on the heat dissipation layer 21 and the first metal thin film 10 and the second metal thin film 40, As shown in FIG.

The metal thin films 10 and 40 may have isotropic thermal conductivity. The metal thin films 10 and 40 have isotropic thermal conductivity means that their thermal conductivities do not differ according to the direction, so that the metal thin films 10 and 40 can have uniform thermal conductivity in all directions.

The metal thin films 10 and 40 may include at least one selected from the group consisting of Cu, Al, Au, Ag, Ni, Sn, Zn, Mg, (W), iron (Fe), and a combination thereof, and may preferably be a thin film of aluminum (Al) or copper (Cu).

The heat-radiating layer 21 is a layer formed by vapor-depositing a thermally conductive carbon structure, and can have a characteristic of excellent thermal conductivity in the horizontal direction.

The thermally conductive carbon structure of the heat-radiating layer 21 may be a carbon nanotube (CNT), a graphite, a graphene, a diamond, a fullerene, a carbon black, ≪ / RTI > and combinations thereof.

For example, the heat-radiating layer 21 may include graphite or graphene, and in this case, it may be advantageous to secure anisotropic thermal conductivity.

Specifically, the heat-radiating layer 21 may be formed by depositing the thermally conductive carbon structure on the surface of the first metal foil 10 by a sputtering process so that the thermally conductive carbon structure is laid horizontally. As a result, 21) can effectively improve the horizontal thermal conductivity.

Since the heat dissipation layer 21 is formed by vapor-depositing the thermally conductive carbon structure, the thickness of the heat dissipation layer 21 can be reduced as compared with the case where the heat dissipation layer 21 is formed by adhering in a sheet form.

For example, in the case where the heat dissipation layer is conventionally formed by adhering in the form of a sheet, the thickness of the heat dissipation layer is about 17 mu m, whereas when the heat dissipation layer is formed by vapor deposition as in the present invention, do.

The adhesive layer 30 may act as an adhesive between the heat dissipation layer 21 and the second metal thin film 40 separately formed. At this time, the adhesive layer 30 may include an epoxy resin.

In addition, the adhesive layer 30 may act as an adhesive, and at the same time, it may play a role of emitting heat generated from the heat-generating object and uniformly transmitted. That is, the adhesive layer 30 may serve to transfer the heat conducted from the heat dissipation layer 21 to the outside, that is, toward the second metal thin film 40.

Specifically, the adhesive layer 30 may include an epoxy-based adhesive resin and a thermally conductive filler, thereby securing adhesiveness and excellent thermal conductivity at the same time.

The epoxy-based adhesive resin of the adhesive layer 30 is not particularly limited as long as it is used as an adhesive component in the art. Non-limiting examples thereof include bissutenole A epoxy resin, bisphenol F epoxy resin, cresol novolak epoxy resin, Dicyclopentadiene type epoxy resins, trisphenylmethane type epoxy resins, naphthalene type epoxy resins, biphenyl type epoxy resins and hydrogenated epoxy resins.

The epoxy-based adhesive resin may further include a rubber-modified epoxy resin in order to secure excellent adhesiveness. Such a rubber-modified epoxy resin is not particularly limited, but examples thereof include, but not limited to, acrylonitrile-butadiene rubber (NBR), carboxy-terminated butadiene- acrylonitrile (CBTN) rubber, epoxy-terminated butadiene- acrylonitrile (ETBN) Terminal butadiene-acrylonitrile (ATBN) rubber, and the like.

The thermally conductive filler of the adhesive layer 30 may be formed of a material selected from the group consisting of nickel, aluminum nitride, boron nitride, carbon nanotube (CNT), graphite, aluminum oxide, magnesium oxide, zinc oxide, silicon carbide, Aluminum, magnesium hydroxide, silicon oxide, and combinations thereof. By using aluminum nitride or boron nitride having excellent thermal conductivity, the adhesive layer can secure both good adhesion and thermal conductivity.

The adhesive layer 30 may include about 30 parts by weight to about 50 parts by weight of the thermally conductive filler per 100 parts by weight of the epoxy adhesive resin. When the content of the thermally conductive filler is less than about 30 parts by weight, the thermal conductivity is lowered. When the adhesive layer 30 is adhered to the second metal thin film 40, heat is difficult to release. When the content of the thermally conductive filler is more than about 50 parts by weight, 2 metal thin film 40, the number of air layers having low thermal conductivity is increased, and the heat radiation effect is lowered.

That is, by including the thermally conductive filler in the above-described range, an appropriate interfacial adhesion with the second metal thin film 40 can be ensured, and at the same time, the air layer with low thermal conductivity can be reduced to adhere to the second metal thin film 40 So that the effect of dissipating heat to the outside can be easily realized.

Further, the thickness of the adhesive layer 30 may be about 5 탆 to 10 탆. By maintaining the thickness of the adhesive layer 30 within the above range, excellent adherence can be maintained when attached to the second metal thin film 40, and at the same time, the effect of dissipating heat through the second metal thin film 40 can be improved.

The metal composite sheet 100 according to the present invention including the first metal thin film 10, the heat dissipation layer 21, the adhesive layer 30 and the second metal thin film 40 described above has a structure in which the heat dissipation layer 21 The metal thin films 10 and 40 may have anisotropic thermal conductivity and have isotropic thermal conductivity.

Preferably, the metal composite sheet 100 according to the present invention may have a thermal conductivity in the range of 400 to 1000 W / mK.

The heat dissipation layer 21 according to the present invention is not only reduced in thickness but also has an adhesive layer between the first metal thin film 10 and the heat dissipation layer 21, It is possible to have a slimming effect due to the thickness reduction due to omission.

Preferably, the metal composite sheet 100 according to the present invention may have a thickness in the range of 25 to 30 mu m.

2 to 5 show examples of the metal composite sheet according to the present invention.

The metal composite sheets 11, 120, 130, and 140 shown in FIGS. 2 to 5 are the same except that a heat dissipation layer is further included compared to the metal composite sheet 100 described above with reference to FIG. 1 . Therefore, redundant description will be omitted for the sake of brevity of description.

2 schematically shows a metal composite sheet 110 further comprising one heat-radiating layer 22 as compared to the metal composite sheet 100 of FIG.

The metal composite sheet 110 includes a first metal thin film 10, heat dissipation layers 21 and 22 formed on both sides of the first metal thin film 10, an adhesive layer 30 and a second metal thin film 40 do. That is, the first metal thin film 10 may further include a heat dissipation layer 22 formed on the upper surface thereof.

The adhesive layer 30 is formed between the first metal thin film 10 and the second metal thin film 40 on which the heat dissipation layers 21 and 22 are formed on both surfaces, Layer 21 and the second metal foil 40. As shown in FIG.

FIG. 3 schematically shows a metal composite sheet 120 further comprising two heat-radiating layers 22 and 23 in comparison with the metal composite sheet 100 of FIG.

The metal composite sheet 120 includes a first metal thin film 10, heat dissipation layers 21 and 22 formed on both sides of the first metal thin film 10, an adhesive layer 30, a second metal thin film 40, And a heat dissipation layer (23) formed on the upper surface of the second metal thin film (40).

The adhesive layer 30 acts as an adhesive between the first metal thin film 10 having the heat dissipation layers 21 and 22 on both sides and the second metal thin film 40 having the heat dissipation layer 23 formed on the upper surface thereof. Specifically, the adhesive layer 30 serves as an adhesive for contacting and integrating the heat dissipation layer 21 formed on the lower surface of the first metal thin film 10 and the heat dissipation layer 23 formed on the upper surface of the second metal thin film 40 can do.

4 schematically shows a metal composite sheet 130 further comprising two heat dissipation layers 22 and 24 as compared to the metal composite sheet 100 of FIG.

The metal composite sheet 130 includes a first metal thin film 10, heat dissipation layers 21 and 22 formed on both sides of the first metal thin film 10, an adhesive layer 30, a second metal thin film 40, And a heat dissipation layer (24) formed on the lower surface of the second metal thin film (40).

The adhesive layer 30 acts as an adhesive between the first metal thin film 10 on which the heat dissipation layers 21 and 22 are formed on both sides and the second metal thin film 40 on which the heat dissipation layer 24 is formed. Specifically, the adhesive layer 30 is positioned between the heat dissipation layer 21 formed on the lower surface of the first metal thin film 10 and the second metal thin film 40, and can act as an adhesive.

5 schematically shows a metal composite sheet 140 further comprising three heat dissipation layers 22, 23 and 24 as compared to the metal composite sheet 100 of FIG.

The metal composite sheet 140 includes a first metal thin film 10, heat dissipation layers 21 and 22 formed on both sides of the first metal thin film 10, an adhesive layer 30, a second metal thin film 40, And heat dissipation layers (23, 24) formed on both sides of the second metal thin film (40).

The adhesive layer 30 acts as an adhesive between the first metal thin film 10 on which the heat dissipation layers 21 and 22 are formed on both sides and the second metal thin film 40 on which the heat dissipation layers 23 and 24 are formed on both sides do. Specifically, the adhesive layer 30 is disposed between the heat dissipation layer 21 formed on the lower surface of the first metal thin film 10 and the heat dissipation layer 23 deposited on the upper surface of the second metal thin film 40, The first metal thin film 40 and the second thin metal film 40 can be integrated with each other.

As described above, the metal composite sheet according to the present invention has a structure (FIG. 1) including a heat radiation layer 21 formed on one surface of a first metal thin film, heat dissipation layers 21 and 22 formed on both surfaces of the first metal thin film, (Fig. 2), a structure including heat dissipation layers 21 and 22 formed on both sides of the first metal thin film and a heat dissipation layer 23 or 24 formed on one side of the second metal thin film (Figs. 3 and 4 (FIG. 5) including heat dissipation layers 21 and 22 formed on both sides of the first metal thin film and heat dissipation layers 23 and 24 formed on both sides of the second metal thin film.

The metal composite sheet shown in Figs. 1 to 5 has a heat dissipation layer formed by a vapor deposition method, so that the interlayer peeling phenomenon is improved and the thickness is reduced. In addition, if the total thickness is not affected by including the heat dissipation layer between each layer It can have excellent thermal conductivity.

As a result, the metal composite sheet according to the present invention can improve uniformity and distribution of heat conduction in a slim space, and can exert an excellent heat radiation effect and a slimming effect simultaneously in a display device including the same.

Hereinafter, an example in which the metal composite sheet according to the present invention is applied to a display device will be described. However, the application object of the metal composite sheet according to the present invention is not limited to the following embodiments, and can be applied to various positions in a display device or an electronic device.

Another embodiment of the present invention provides a coverlay integrated metal composite film in which the coverlay and the metal composite sheet described above are integrated.

At this time, the coverlay refers to a composite film in which a polyimide film is coated with an adhesive or a release film in addition to this, and it mainly protects the exposed surface of the etched FPCB (flexible printed circuit board) It is used for the purpose.

6 to 9, a cover-lay type metal composite film according to another embodiment of the present invention will be described in more detail.

FIGS. 6 and 7 are cross-sectional views schematically showing a cross section of a coverlay according to the present invention, and FIGS. 8 and 9 schematically show cross-sectional views of a cover-lay type metal composite film according to another embodiment of the present invention.

Referring to FIG. 8 together with FIGS. 1 and 6, a cover-integrated metal composite film 300 according to the present invention includes the metal composite sheet 100 of FIG. 1 and the coverlay 200 of FIG. 6 .

Specifically, the cover layered composite metal composite film 300 according to the present invention includes a first metal thin film 10, a heat dissipation layer 21, an adhesive layer 30, a second metal thin film 40, a magnetic layer 50, The intermediate layer 60, the adhesive layer 70, and the release layer 80 may be sequentially stacked.

The polyimide layer 60 serves as a base film of the coverlay and serves as a support for coating the magnetic layer 50.

The magnetic layer 50 may be formed on the polyimide layer 60 to have a predetermined thickness. For example, a liquid composition containing magnetic particles is prepared, and the liquid composition thus prepared is applied to the lower portion of the polyimide layer 60 to form the magnetic layer 50.

The magnetic layer 50 may be made of Fe-Si-Al alloy Sendust, Fe-Si-Cr alloy, Highflux, Permalloy alloy, Ni-Zn ferrite, Mn-Zn ferrite Ferrite) and is selected from the group consisting of epoxy, phenoxy, acrylic, melamine, silicon, fluorine, polyamide, polyester, polyethylene, polypropylene, and polyvinyl chloride resins At least one component may be included as a binder.

As described above, the magnetic layer 50 formed by using the polymer component as a binder and including magnetic particles is also referred to as a PMS layer (Polymer Magnetic Sheet Layer).

The adhesive layer 70 may be formed to a predetermined thickness below the polyimide layer 60. For example, a liquid composition having an insulating property is prepared, and the liquid composition is coated to a predetermined thickness below the polyimide layer 60 to form an adhesive layer 70.

The releasing layer 80 may be formed under the adhesive layer 70 by laminating, and may be a release paper or a polyethylene terephthalate (PET) film.

The cover layer 200 composed of the magnetic layer 50, the polyimide layer 60 having the insulating property, the adhesive layer 70 and the release layer 80 and the second metal thin film 40 of the metal composite sheet 100 So that the cover-integrated metal composite film 300 can be formed.

Meanwhile, the polyimide layer 60 and the adhesive layer 70 may be integrated with each other to form a single insulating layer in the cover-integrated metal composite film 300 described above. In addition, the polyimide layer 60 may be omitted, and the adhesive layer 70 may serve as an insulating layer.

FIG. 7 schematically shows a cross section of a coverlay 210 having a structure in which a polyimide layer 60 is omitted in the coverlay 200 according to the present invention shown in FIG.

Referring to FIG. 9 together with FIGS. 1 and 7, the cover-integrated metal film 310 according to the present invention may include the metal composite sheet 100 of FIG. 1 and the coverlay 210 of FIG.

Specifically, the cover layered composite metal composite film 310 according to the present invention includes a first metal thin film 10, a heat dissipation layer 21, an adhesive layer 30, a second metal thin film 40, a magnetic layer 50, (70) and a release layer (80) are sequentially stacked.

The cover-integrated metal film 310 according to the present invention shown in Fig. 9 has the same constitution as the cover-integrated metal film 300 shown in Fig. 8 except that the polyimide layer 60 is omitted So redundant description is omitted for brevity of description.

The cover laminated type metal composite film according to the present invention can simultaneously impart a slimming effect and a heat resistance durability effect to a display device having a film in which the metal composite sheet and the coverlay are integrated, Can be applied in a roll-to-roll manner.

Hereinafter, the present invention will be described in more detail with reference to Examples. However, the following Examples and Experimental Examples are merely illustrative of the present invention, and the scope of the present invention is not limited to the following Examples and Experimental Examples.

[ Example  One]

1-1. Metal composite sheet

First, a first copper (Cu) having a thickness of 12 占 퐉 was prepared, and graphite was vapor-deposited on one surface of the first copper foil under sputtering conditions to obtain a first copper foil having a 1 占 퐉 -thick graphite layer deposited thereon.

A second copper foil (Cu) having a thickness of 9 탆 was prepared, and an adhesive composition 1 having an epoxy composition on one side of the second copper foil was coated to a thickness of 5 탆 and dried to form an adhesive layer.

(12 占 퐉), a graphite layer (1 占 퐉), an adhesive layer (5 占 퐉), and a second copper foil (9 占 퐉) are integrally formed so that the surface of the heat dissipation layer deposited on the first copper foil and the surface of the adhesive layer formed on the second copper foil are in contact with each other. Mu m) were successively laminated to produce a metal composite sheet having a thickness of 27 mu m.

1-2. Cover Ray  Integrated metal composite film

A PMS layer (50 mu m) was coated on one surface of a polyimide layer (12 mu m) and dried, and an adhesive layer (18 mu m) was sequentially coated / dried on the opposite surface to prepare a coverlay having a thickness of 80 mu m.

The surface of the PMS layer of the coverlay and the surface of the second copper foil of the metal composite sheet produced in 1-1 were brought into contact with each other so as to be integrated to produce a coverlay integrated metal composite film having a thickness of 107 mu m.

[ Example  2]

2-1. Metal composite sheet

(1 mu m), a first copper foil (12 mu m), a graphite layer (1 mu m), an adhesive layer (5 mu m) were formed in the same manner as in Example 1 except that graphite was deposited on both surfaces of the first copper foil. And a second copper foil (9 占 퐉) were successively laminated to produce a metal composite sheet having a thickness of 28 占 퐉.

2-2. Cover Ray  Integrated metal composite film

A coverlay integral type metal composite film having a thickness of 108 mu m was produced by integrating the PMS layer of the coverlay produced in the same manner as in Example 1 so that the surface of the second copper foil of the metal composite sheet produced in 2-1 was in contact with the cover layer.

[ Example  3]

3-1. Metal composite sheet

Graphite is deposited on both surfaces of the first copper foil and the second copper foil and then the surface of the heat dissipation layer deposited on one surface of the first copper foil and the surface of the heat dissipation layer deposited on the upper surface of the second copper foil are integrated with an adhesive layer (1 mu m), a first copper foil (12 mu m), a graphite layer (1 mu m), an adhesive layer (5 mu m), a graphite layer (1 mu m) and a second copper foil 9 mu m) were successively laminated on a metal composite sheet having a thickness of 29 mu m.

3-2. Cover Ray  Integrated metal composite film

A coverlay integral type metal composite film having a thickness of 109 mu m was prepared by integrating the surface of the second copper foil of the metal composite sheet produced in 3-1 with the PMS layer of the coverlay produced in the same manner as in Example 1.

[ Example  4]

4-1. Metal composite sheet

Except that graphite was deposited on the both surfaces of the first copper foil and the second copper foil and then the surface of the heat dissipation layer deposited on one surface of the first copper foil and the surface of the adhesive layer formed on the second copper foil were integrated, (1 占 퐉), a first copper foil (12 占 퐉), a graphite layer (1 占 퐉), an adhesive layer (5 占 퐉), a second copper foil (9 占 퐉 and a graphite layer Thereby preparing a metal composite sheet having a thickness of 29 占 퐉.

4-2. Cover Ray  Integrated metal composite film

The PMS layer of the coverlay produced in the same manner as in Example 1 was integrated with the surface of the graphite layer deposited on the lower surface of the second copper foil of the metal composite sheet produced in 4-1 so as to be in contact with each other, To prepare a metal composite film.

[ Example  5]

5-1. Metal composite sheet

Graphite is deposited on both surfaces of the first copper foil and the second copper foil and then the surface of the heat dissipation layer deposited on one surface of the first copper foil and the surface of the heat dissipation layer deposited on the upper surface of the second copper foil are integrated with an adhesive layer (1 占 퐉), a first copper foil (12 占 퐉), a graphite layer (1 占 퐉), an adhesive layer (5 占 퐉), a graphite layer (1 占 퐉) and a second copper foil 9 占 퐉) and a graphite layer (1 占 퐉) were successively laminated to prepare a 30 占 퐉 -thick metal composite sheet.

5-2. Cover Ray  Integrated metal composite film

The PMS layer of the coverlay produced in the same manner as in Example 1 was integrated so that the surface of the graphite layer deposited on the lower surface of the second copper foil of the metal composite sheet produced in 5-1 was in contact with the cover layer to form a 110- To prepare a metal composite film.

[ Example  6]

6-1. Metal composite sheet

A metal composite sheet having a thickness of 27 탆 was prepared in the same manner as in Example 1.

6-2. Cover Ray  Integrated metal composite film

A coverlay having a thickness of 68 占 퐉 in which a PMS layer (50 占 퐉) and an adhesive layer (18 占 퐉) were laminated was prepared.

The surface of the PMS layer of the coverlay and the surface of the second copper foil of the metal composite sheet produced in 6-1 were brought into contact with each other so as to be integrated, thereby producing a coverlay-integrated metal composite film having a thickness of 95 mu m.

[ Example  7]

7-1. Metal composite sheet

A metal composite sheet having a thickness of 28 占 퐉 was produced in the same manner as in Example 2.

7-2. Cover Ray  Integrated metal composite film

A coverlay having a thickness of 68 탆 was prepared in the same manner as in Example 6.

The surface of the PMS layer of the coverlay was integrated with the surface of the second copper foil of the metal composite sheet produced in 7-1 so as to be in contact with each other to prepare a 96 .mu.m thick coverlay integrated metal composite film.

[ Example  8]

8-1. Metal composite sheet

A metal composite sheet having a thickness of 29 탆 was produced in the same manner as in Example 3.

8-2. Cover Ray  Integrated metal composite film

A coverlay having a thickness of 68 탆 was prepared in the same manner as in Example 6.

The surface of the PMS layer of the coverlay and the surface of the second copper foil of the metal composite sheet produced in 8-1 were brought into contact with each other to form a 97 mu m-thick coverlay integrated metal composite film.

[ Example  9]

9-1. Metal composite sheet

A metal composite sheet having a thickness of 29 탆 was produced in the same manner as in Example 4.

9-2. Cover Ray  Integrated metal composite film

A coverlay having a thickness of 68 탆 was prepared in the same manner as in Example 6.

The surface of the PMS layer of the coverlay was integrated with the surface of the graphite layer deposited on the lower surface of the second copper foil of the metal composite sheet produced in 9-1 so as to be in contact with each other to produce a 97 .mu.m thick coverlay integrated metal composite film.

[ Example  10]

10-1. Metal composite sheet

A metal composite sheet having a thickness of 30 탆 was prepared in the same manner as in Example 5.

10-2. Cover Ray  Integrated metal composite film

A coverlay having a thickness of 68 탆 was prepared in the same manner as in Example 6. The surface of the PMS layer of the coverlay was integrated with the surface of the graphite layer deposited on the lower surface of the second copper foil of the metal composite sheet produced in 10-1 so as to be in contact with each other to produce a coverlay integrated metal composite film having a thickness of 98 mu m.

[ Comparative Example  One]

(12 占 퐉) and an adhesive layer (12 占 퐉) were prepared in the same manner as in Example 1, except that a commercially available 17 占 퐉 thick graphite sheet product was purchased and a heat-radiating layer was formed using an adhesive instead of a graphite layer A metal composite sheet having a thickness of 47 占 퐉 in which a graphite layer (17 占 퐉), an adhesive layer (5 占 퐉) and a second copper foil (9 占 퐉) were sequentially laminated.

A metal composite sheet having a thickness of 47 mu m was integrally formed on a coverlay having a thickness of 80 mu m produced in the same manner as in Example 1 to prepare a 128 mu m thick coverlay integrated metal composite film.

[ Comparative Example  2]

A metal complex sheet having a thickness of 47 占 퐉 produced in Comparative Example 1 was integrated with a 68 占 퐉 coverlay prepared in the same manner as in Example 6 to prepare a 116 占 퐉 thick coverlay integrated metal composite film.

[ Experimental Example  One]

The following tests were conducted on the metal composite sheets and metal composite films prepared in Examples 1 to 10 and Comparative Examples 1 and 2, respectively, and the results are shown in Table 1 below.

1) Heat dissipation layer thickness

2) Thickness of metal composite sheet

3) Cover lay thickness

4) Thermal conductivity

The heat-
(탆) Metal composite sheet
(탆) Cover Ray
(탆) Metal composite film ^*
(탆) Thermal conductivity
(W / mK) Example 1 One 27 80 107 500 Example 2 1 * 2 28 80 108 520 Example 3 1 * 3 29 80 109 540 Example 4 1 * 3 29 80 109 540 Example 5 1 * 4 30 80 110 560 Example 6 One 27 68 95 450 Example 7 1 * 2 28 68 96 470 Example 8 1 * 3 29 68 97 490 Example 9 1 * 3 29 68 97 510 Example 10 1 * 4 30 68 98 530 Comparative Example 1 17 48 80 128 950 Comparative Example 2 17 48 68 116 930

*: Thickness of metal composite film excluding thickness of release layer

As a result of the experiment, the metal composite sheet of the present invention improved the interlayer separation phenomenon and maintained the thermal conductivity despite the dramatically reduced thickness, thus exhibiting excellent heat radiation characteristics. Therefore, it is considered to be used as a constituent material capable of imparting a slimming effect and a heat-resistant durability effect to a small-sized and lightweight new display device.

100, 110, 120, 130, 140: metal composite sheet
200, 210: Coverage
300, 310: Cover-lay integral metal composite film
10: first metal thin film 21, 22, 23, 24:
30: adhesive layer 40: second metal thin film
50: magnetic layer 60: polyimide layer
70: adhesive layer 80: release layer

Claims (17)

A first metal thin film;
A heat dissipation layer deposited on one surface or both surfaces of the first metal thin film with a thermally conductive carbon structure;
An adhesive layer disposed on the heat dissipation layer; And
The second metal thin film disposed on the adhesive layer
/ RTI >
The heat dissipation layer has a thickness of 0.1 to 1 占 퐉,
Wherein the adhesive layer comprises an epoxy resin, a rubber-modified epoxy resin, and a thermally conductive filler. The method according to claim 1,
A heat dissipation layer formed on one surface of the first metal thin film; and an adhesive layer formed on one surface of the second metal thin film. The method according to claim 1,
And a heat dissipation layer formed on one side or both sides of the second metal thin film. The method of claim 3,
A heat dissipation layer formed on one surface of the first metal thin film, and a heat dissipation layer formed on one surface of the second metal thin film are integrated with the adhesive layer. The method of claim 3,
A heat dissipation layer formed on one surface of the first metal thin film; and an adhesive layer formed on one surface of the second metal thin film. delete The method according to claim 1,
The thermally conductive carbon structure may include a carbon nanotube (CNT), a graphite, a graphene, a diamond, a fullerene, a carbon black, or a combination thereof. ≪ / RTI > delete The method according to claim 1,
Wherein the metal composite sheet has a thickness in the range of 25 to 30 占 퐉. The method according to claim 1,
Wherein the metal composite sheet has a thermal conductivity in the range of 400 to 1000 W / mK. delete The method according to claim 1,
Wherein the thermally conductive filler comprises at least one selected from the group consisting of silicon oxide, aluminum oxide, aluminum nitride, silicon nitride, boron nitride, and combinations thereof. A polyimide (PI) layer; An adhesive layer formed on the polyimide layer; And a release layer, the coverlay further including a magnetic layer (Polymer Magnetic Sheet Layer) coated on the lower portion of the polyimide layer,
A cover laminated metal composite film in which the metal composite sheet according to any one of claims 1 to 5, 7, 9, 10 and 12 is integrated. 14. The method of claim 13,
Wherein one surface of the magnetic layer of the cover layer and one surface of the second metal thin film are in contact with each other to be integrated with each other. 14. The method of claim 13,
And a heat radiation layer formed on one surface of the second metal thin film are in contact with each other so that the cover layer is integrated with the cover layer. 14. The method of claim 13,
And an insulating layer in which the polyimide layer and the adhesive layer are integrated. 14. The method of claim 13,
Wherein the film is attachable by a roll-to-roll process.

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