KR101831359B1 - composite sheet having a insulation filler, and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a composite sheet on which an insulating filler is disposed and a manufacturing method thereof. More particularly, the present invention relates to a composite sheet on which an insulating filler is disposed for preventing a conductive material for heat radiation and electromagnetic shielding from coming into contact with a circuit board, And a method for producing the composite sheet.
It is preferable that a heat dissipation layer for dissipating heat transmitted from the circuit board, a shield layer disposed under the heat dissipation layer for shielding electromagnetic waves, and a shield layer disposed under the shield layer, And an insulating layer on which a plurality of insulating pillars are disposed.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite sheet having an insulating filler,

The present invention relates to a composite sheet on which an insulating filler is disposed and a manufacturing method thereof. More particularly, the present invention relates to a composite sheet on which an insulating filler is disposed for preventing a conductive material for heat radiation and electromagnetic shielding from coming into contact with a circuit board, And a method for producing the composite sheet.

Generally, electronic devices emit heat by using electrical energy.

In particular, heat generated in IT devices having computing functions such as a computer, a tablet, and a smart phone has a higher calorific value than other electronic devices, and there is a problem in that it causes a performance deterioration or error due to heat generation. Pins, and cooling fans.

However, there has been a problem that it is difficult to use a bulky cooling device such as a cooling fin or a cooling fan in IT devices, which are becoming smaller as the technology develops.

Accordingly, a thermal diffusion sheet capable of cooling and spreading the heat of the heat generating portion over a wider area has been developed, such as Korean Patent No. 10-0698727, entitled " Graphite sheet and manufacturing method thereof ", and the thermal diffusion sheet has an extremely thin thickness, It is possible to reduce the size of the apparatus for dissipating the heat due to the diffusion of heat over a larger surface area.

The thermal diffusion sheet is attached in the form of pressing the thermal diffusion sheet on the circuit board in order to increase the heat transfer efficiency with the circuit board. However, in the process of pressing the thermal diffusion sheet, a circuit or an electronic component protruding from the surface of the circuit board is pierced by the thermal diffusion sheet There is a problem in that a short circuit is generated due to contact with a conductive material for heat dissipation and electromagnetic shielding in the thermal diffusion sheet.

Thus, the insulating layer is disposed on the lower surface of the thermal diffusion sheet to prevent the protruding circuit or the electronic component of the circuit board from penetrating into the thermal diffusion sheet.

On the other hand, when the insulating layer 104A is made of a soft material as shown in (1-I) of FIG. 1, the insulating layer 104A can be easily formed by the circuit 101 or the electronic component 102 There is a problem in that insulation is not effectively performed.

Therefore, the insulating layer 104B is made of a hard material as shown in (1-II) in FIG. 1, so that it is possible to effectively prevent the circuit 101 or the electronic component 102 from diving into the thermal diffusion sheet 104 On the other hand, since the hard insulating layer 104B is insufficient in flexibility, it is difficult to attach the hard insulating layer 104B to a circuit board requiring flexibility such as FPCB (Flexible printed circuit board).

Particularly, in the pressing process, the hard insulating layer 104B is easily cracked or broken due to brittleness, the cracked cut surface may contact the circuit board and the circuit board may be damaged, and the flexibility of the insulating layer is insufficient The insulating layer 104B may not be closely attached to the circuit board 100 and a void A2 may be formed between the insulating layer 104B and the circuit board 100. [

Korean Patent No. 10-0698727 entitled "Graphite sheet and method for manufacturing the same"

An object of the present invention is to solve the above-mentioned problems, and it is an object of the present invention to provide an insulating filler for preventing a short circuit from occurring when a conductive material for heat dissipation and electromagnetic shielding contacts with a circuit or an electronic part of a circuit board And a method for producing the same.

Another object of the present invention is to provide a composite sheet in which a flexible insulating filler is disposed so as to be able to adhere to an FPCB while having a high insulation effect, and a method for manufacturing the composite sheet.

In order to attain the above object, the composite sheet on which the insulating pillars according to the present invention are disposed includes a heat dissipation layer for dissipating heat transmitted from the circuit board, a shield layer disposed under the heat dissipation layer for shielding electromagnetic waves, And an insulating layer disposed at a lower portion of the layer and having a plurality of insulating pillars for preventing the shield layer from contacting the circuit board.

The heat dissipation layer may be formed of at least one metal selected from the group consisting of Fe, Al, and Cu, or an alloy including at least one of the metals.

The heat dissipation layer is characterized in that one or both surfaces are roughly surface-treated to increase the surface area and enhance the heat dissipation effect.

The shielding layer may be made of at least one metal selected from the group consisting of Fe, Si, Al, Cr, Ni, and Mn or an alloy including any one or more of the metals. The shielding layer may be made of silicon, epoxy, urethane, acrylic, , And a second binder including at least one of PP, PS, PU, PET, PEN, and PAN.

In addition, the shielding layer is composed of 80 to 95 wt% shielding metal and 5 to 20 wt% of the second binder.

In addition, the shielding metal is flaked in the form of a plate-like particle and is laterally disposed on the shielding layer.

The heat dissipation layer may further include a thermal diffusion layer disposed between the heat dissipation layer and the shield layer for diffusing heat through the thermal diffusion material.

The thermal diffusing agent may include any one of a single-walled carbon nanotube powder, a multi-walled carbon nanotube powder, an artificial graphite powder, and a natural graphite powder. do.

The thermal diffusion layer may contain 50 to 97 wt% of a first binder containing at least one of silicon, epoxy, urethane, acryl, PC, PE, PI, PP, PS, PU, PET, PEN, To 50 wt%.

Further, in order to prevent the heat dissipation layer and the shielding layer from being peeled off by the thermal diffusion layer, the heat dissipation layer further includes a protruding end protruding downward, and the protruding end is directly adhered to the shielding layer through the protruding end .

The insulating filler is in the form of a spherical particle to prevent breakage of the circuit board when the circuit board is contacted with the circuit board.

The insulating layer may be formed of an insulating filler including at least one of alumina hydroxide, alumina oxide, SiC, AlN, and MgO, and an insulating filler including silicon, epoxy, urethane, acrylic, PC, PE, PI, PP, PS, PU , PET, PEN, and PAN. The third binder includes at least one of PET, PEN, and PAN.

The insulating layer may be composed of 10 to 20 wt% of an insulating filler and 80 to 90 wt% of a third binder.

A method of manufacturing a composite sheet in which an insulating filler according to the present invention is disposed includes a step of manufacturing a heat dissipation layer for manufacturing a heat dissipation layer made of plate-shaped metal for heat dissipation, a step of forming a shielding layer The method of manufacturing a semiconductor device according to any one of claims 1 to 3, wherein the insulating layer is produced by mixing an insulating filler having a hardness and a particle size of at least a predetermined size, And a laminating step of laminating a layer, a shielding layer and an insulating layer to produce a laminated sheet composed of a plurality of layers.

Also, a heat dissipation layer manufacturing step for manufacturing a heat dissipation layer made of a plate-shaped metal for heat dissipation, a thermal diffusion layer manufacturing step for manufacturing a thermal dissipation layer for diffusing heat through a thermal diffusing agent, and a plate shielding layer for shielding electromagnetic waves And a hard insulating filler having a particle size equal to or greater than a predetermined size, the method comprising the steps of: preparing an insulation layer including a heat shielding layer manufacturing step, a thermal diffusion layer manufacturing step, a shielding layer manufacturing step, And a laminating step of laminating the heat dissipation layer, the thermal diffusion layer, the shielding layer, and the insulation layer manufactured through the manufacturing step to produce a laminated sheet composed of a plurality of layers.

In addition, the present invention provides a method of manufacturing a semiconductor device, comprising: a heat dissipation layer manufacturing step of manufacturing a heat dissipation layer formed of a plate-shaped metal for heat dissipation; a shielding layer stacking step of forming a plate-shaped shielding layer for shielding electromagnetic waves on one surface of the heat dissipation layer; And an insulating layer laminating step of laminating an insulating layer mixed with a hard insulating filler having a particle size larger than a set size to produce a laminated sheet composed of a plurality of layers.

In addition, a heat dissipation layer manufacturing step of manufacturing a heat dissipation layer made of plate-shaped metal for heat dissipation, a thermal diffusion layer stacking step of forming a thermal diffusion layer for diffusing heat through a thermal diffusion material on one surface of the heat dissipation layer, An insulating layer in which a hard insulating filler having a particle size of a predetermined size or larger is mixed is formed on one surface of the shielding layer to form an insulating layer composed of a plurality of layers And an insulating layer lamination step of producing a laminated sheet.

The method may further include a pressing step of pressing the laminated sheet to a predetermined thickness.

The pressing step may include a first pressing step of first pressing the laminated sheet in a temperature range of 50 to 120 degrees and a second pressing step of pressing the laminated sheet subjected to the first pressing under a temperature range of 150 to 200 degrees .

The method may further include a protruding step forming step of pressing the laminated sheet from the upper side through a jig having a predetermined pressing surface to project a plurality of protruding ends corresponding to the pressing surface type of the jig downward in the radiating layer, And the heat dissipation layer is attached to the shield layer through the protruding end.

As described above, according to the composite sheet in which the insulating pillars according to the present invention are disposed and the manufacturing method thereof, the conductive material for radiating heat and shielding electromagnetic waves is separated from the circuits or the electronic parts of the circuit board through the insulating pillars, There is an effect that it can be prevented.

Further, according to the composite sheet on which the insulating filler according to the present invention is disposed and the manufacturing method thereof, it is possible to attach the FPCB to the FPCB while having high insulation effect and flexibility.

FIG. 1 or 2 is a flowchart showing a method of manufacturing a composite sheet in which an insulating filler according to the present invention is disposed.
4 or 5 illustrate an embodiment of a method for manufacturing a composite sheet on which an insulating filler according to the present invention is disposed.
6 is a view showing a composite sheet on which an insulating filler according to the present invention is disposed;

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 1 or FIG. 2 is a flowchart showing a method of manufacturing a composite sheet on which an insulating filler according to the present invention is disposed, and FIG. 4 or 5 is a cross- FIG. 6 is a view showing a composite sheet on which an insulating filler according to the present invention is disposed. FIG.

1 shows a first embodiment and a second embodiment of a method for manufacturing a composite sheet in which an insulating filler according to the present invention is disposed. In the method for manufacturing a composite sheet in which the insulating pillars according to the first embodiment are arranged (S10) for manufacturing a heat-radiating layer made of a plate-shaped metal for radiating heat, a shielding layer manufacturing step (S12) for manufacturing a plate-like shielding layer for shielding electromagnetic waves, (S13) for manufacturing an insulating layer in which a hard insulating filler is mixed, a heat insulating layer manufacturing step (S10), a shielding layer manufacturing step (S12), and an insulating layer manufacturing step (S13) And a laminating step (S14) of laminating a heat-radiating layer, a shielding layer and an insulating layer to produce a laminated sheet composed of a plurality of layers.

In addition, the heat radiation layer manufacturing step (S10) may be performed by manufacturing a plate heat radiation layer made of at least one metal selected from the group consisting of Fe, Al, and Cu or an alloy containing any one or more of the metals, Rough surfaces may be treated on one side or on both sides.

The shielding layer manufacturing step S12 may include a shielding metal composed of at least one metal selected from the group consisting of Fe, Si, Al, Cr, Ni, and Mn, or an alloy including any one or more of the metals, and silicon, epoxy, urethane, And a second binder including at least one of PC, PE, PI, PP, PS, PU, PET, PEN and PAN.

In addition, it is preferable that the shielding metal is flaked in the form of a plate-like particle so as to have an efficient shielding efficiency by being disposed transversely to the shielding layer.

It is preferable that the shielding metal and the second binder have higher shielding efficiency than the shielding layer, but they are constructed in consideration of the fixing force of the shielding metal (suppression of peeling off of the shielding metal) according to the ratio of the second binder desirable.

More specifically, when the ratio of the second binder is less than 5 wt%, the shielding metal is not fixed and brittleness is generated (detached and peeled). When the proportion of the second binder is more than 20 wt% It is preferable to mix the shielding metal in a range of 80 to 95 wt% and the second binder in an amount of 5 to 20 wt%.

In addition, the shielding layer production step (S12) may include preparing a second mixture by mixing 80 ~ 95wt% of shielding metal and 5 ~ 20wt% of the second binder, and then preparing a second solvent for dissolving the second binder of the second mixture And the second binder is dissolved by the second solvent, and the second melt is in a liquid state having a predetermined viscosity.

The second solvent may be one selected from the group consisting of MEK, toluene and adonane, a second binder to be used, or a mixture of different solvents depending on the required conditions such as volatilization rate and viscosity. Wherein the second binder comprises at least one of silicon, epoxy, urethane, acrylic, PC, PE, PI, PP, PS, PU, PET, PEN, There is no particular restriction as long as it can be hardened (solidified).

In addition, the second melt is preferably prepared by mixing 71 ~ 98wt% of the second mixture and 2 ~ 29wt% of the first solvent so that the second binder can be sufficiently dissolved.

In addition, although the ratio of the second solvent to be mixed may vary depending on the viscosity of the second melt to be required, when the second solvent is mixed to 2 wt% or less, the second binder, which is not dissolved by the second solvent, And when the second solvent is mixed with 29 wt% or more, the mixing ratio of the second solvent is preferably 2 to 29 wt% as the viscosity is lowered so that formation of the shielding layer is impossible later.

The liquefied second melt may be sprayed, extruded, pasted, spread coated, rolled, knife coated, dip coated, comma coater, lip coater, microgravure, A shielding layer in which a second solvent is mixed is formed through any one of coating methods such as die coating, hole coating, and evaporation, followed by drying by heating to remove the second solvent by volatilization.

Thus, in the shielding layer in which the second solvent is mixed, the second solvent is volatilized and removed, and the production of the shielding layer composed of only the shielding metal and the second binder without the second solvent is completed.

The method may further include a shielding layer rolling step of increasing the density of the shielding layer while arranging the shielding metal laterally by rolling the shielding layer to a predetermined thickness after the shielding layer manufacturing step (S12).

The insulating layer production step (S13) may include an insulating filler including at least one of alumina hydroxide, alumina oxide, SiC, AlN, and MgO, and an insulating filler including silicon, epoxy, urethane, acrylic, PC, A third binder including at least one of PP, PS, PU, PET, PEN, and PAN.

It is preferable that the insulating filler has a spherical particle shape in order to prevent the circuit board from being broken when the circuit board is contacted with the circuit board.

In addition, when the insulating filler performs the function of insulation, the insulating filler may have a low insulating effect when the mixing ratio of the insulating filler is low, and the thickness of the insulating filler may be too thick It is preferable to mix them at least within a range that is not insufficient.

More specifically, when the insulating filler is less than 10 wt%, the insulating effect is insufficient due to excessively large pores between the insulating fillers. If the insulating filler is more than 20 wt%, an increase in the insulating effect can not be expected It is preferable to mix the insulating filler in an amount of 10 to 20 wt% and the third binder in an amount of 80 to 90 wt%.

In addition, the insulating layer production step (S13) may include a step of preparing a third mixture by mixing 10 to 20 wt% of the insulating filler and 80 to 90 wt% of the third binder, and then dissolving the third binder in the third mixture To produce a third melt, the third binder in the third melt is dissolved by the third solvent, and the third melt is in a liquid state having a predetermined viscosity.

The third solvent may be one selected from the group consisting of MEK, toluene and adonane, a third binder used, or a mixture of different solvents depending on the required conditions such as volatilization rate and viscosity. A third binder comprising at least one of silicon, epoxy, urethane, acrylic, PC, PE, PI, PP, PS, PU, PET, PEN and PAN, There is no particular restriction as long as it can be hardened (solidified).

It is preferable that the third melt is prepared by mixing 35-72 wt% of the third mixture and 28-65 wt% of the third solvent so that the third binder can be sufficiently dissolved.

In addition, although the ratio of the third solvent to be mixed may vary depending on the viscosity of the third melt to be required, when the third solvent is mixed to 28 wt% or less, the third binder, which is not dissolved by the third solvent, , And when the third solvent is mixed with 65 wt% or more, the viscosity of the third solvent is lowered to such an extent that formation of an insulating layer is impossible, so that the mixing ratio of the third solvent is preferably 28 to 65 wt%.

The third liquefied liquified as described above may be sprayed, extruded, pasted, spreaded, rolled, knife coated, dip coated, comma coater, lip coater, microgravure, slot An insulating layer in which a third solvent is mixed is formed through any one of coating methods such as die coating, hole coating, and vapor deposition, followed by drying by heating to remove the third solvent by volatilization.

Thus, in the insulating layer in which the third solvent is mixed, the third solvent is volatilized and removed, and the production of the insulating layer composed of the insulating filler and the third binder without the third solvent is completed.

Also, in the drying process, the insulating filler may flow in the insulating layer without completely volatilizing the third solvent, but the third solvent may remain in a range where the shape of the insulating layer does not greatly vary.

More specifically, the drying is performed so that the third solvent remains in the range of 0.01 to 5% of the weight ratio of the third binder.

Further, the method may further include an insulation layer rolling step of rolling the insulation layer to a predetermined thickness after the insulation layer production step (S13) to increase the density of the insulation layer.

In this case, the order of the heat radiation layer production step (S10), the shield layer production step (S12), and the insulation layer production step (S13) may be changed.

More specifically, the heat radiation layer production step (S10), the shield layer production step (S12), the insulation layer production step (S13) for manufacturing the heat radiation layer, the shielding layer and the insulation layer before the laminating step (S14) The order may be irrelevant, and the pressing step S30 may be further performed to press the laminated sheet to a predetermined thickness after the lamination step S14.

Also, the pressing step S30 may be configured to press a plurality of times at the same or different temperatures, pressures, and times.

Preferably, the laminated sheet is first pressurized in a temperature range of 50 to 120 degrees to remove pores (pores) between respective layers (heat-radiating layer, shielding layer, insulating layer) constituting the laminated sheet, A secondary pressurizing step of pressurizing the laminated sheet subjected to the primary pressurization and the secondary pressurization at a temperature range of 150 to 200 degrees to sufficiently bond the layers constituting the laminated sheet to each other, The effect of removing voids between the respective layers constituting the laminated sheet is insufficient and the positional alignment effect is insufficient and the laminated sheet may be broken due to a sudden temperature change upon pressurization at a temperature exceeding 120 degrees from the beginning, Is preferably performed in a temperature range of 50 to 120 degrees.

It is preferable that the secondary pressurization after the primary pressurization is carried out in a temperature range of 150 DEG C or more, which can sufficiently bond the layers constituting the laminated sheet. However, in the temperature range exceeding 200 DEG C, It may be difficult to perform the function later due to physical or chemical deformation of the laminated sheet such as breakage, carbonization or the like, and therefore, it is preferably performed in a temperature range of 150 to 200 degrees.

According to the method of manufacturing a composite sheet in which the insulating pillars according to the second embodiment are disposed, a heat dissipation layer manufacturing step (S10) of manufacturing a heat dissipation layer made of plate-like metal for heat dissipation and a heat dissipation layer (S11) for manufacturing a thermal diffusion layer for producing a thermal diffusion layer for producing a shielding layer (S12) for manufacturing a shielding layer for shielding electromagnetic waves, and a hard insulating filler having a particle size of a predetermined size or larger (S13), the heat radiation layer production step (S10), the thermal diffusion layer production step (S11), the shield layer production step (S12), and the insulation layer production step (S13) A lamination step (S14) of laminating the heat dissipation layer, the thermal diffusion layer, the shielding layer, and the insulation layer to produce a laminated sheet composed of a plurality of layers .

That is, the heat dissipation layer manufacturing step S10, the thermal diffusion layer manufacturing step S11, the shielding layer manufacturing step S12, the insulating layer manufacturing step S13, and the insulating layer manufacturing step S13 for manufacturing the heat dissipation layer, the thermal diffusion layer, The heat dissipation layer, the thermal diffusion layer, the shielding layer, and the insulation layer manufactured through the stacking step S14 are laminated to produce a laminated sheet.

In addition, the thermal diffusion layer fabrication step S11 may include one of a single-walled carbon nanotube powder, a multi-walled carbon nanotube powder, an artificial graphite powder, and a natural graphite powder. Or at least one of a single-walled carbon nanotube powder, a multi-walled carbon nanotube powder, an artificial graphite powder, a natural graphite powder, And a first binder including at least one of silicon, epoxy, urethane, acrylic, PC, PE, PI, PP, PS, PU, PET, PEN and PAN.

The thermal diffusion layer composed of only the thermal diffusion material without the first binder has the highest thermal diffusion efficiency. However, when the thermal diffusion layer is composed only of the thermal diffusion material, the thermal diffusion layer may be brittle and the thermal diffusion agent may be separated and peeled off.

In addition, when the thermal diffusion layer is formed only of the thermal diffusion material without the first binder, the thermal diffusion material is formed into a plate shape through the adhesive to produce the thermal diffusion layer.

In addition, when the first binder is mixed to produce the thermal diffusion layer, the composition ratio of the thermal diffusion agent and the first binder is such that the thermal diffusion efficiency can not be significantly decreased while the separation and peeling of the thermal diffusion agent can be minimized. .

More specifically, if the ratio of the first binder is less than 5 wt%, the effect of suppressing the separation and separation of the thermal diffusing agent is not significant. If the ratio is more than 95 wt%, the thermal diffusion efficiency relative to the thickness is extremely lowered, The first binder is preferably mixed in the range of 5 to 95 wt% and the first binder in the range of 5 to 95 wt%.

In the thermal diffusion layer manufacturing step S11, the first mixture is prepared by mixing 5 to 95 wt% of thermal diffusion with 5 to 95 wt% of the first binder, and then a first solvent for dissolving the first binder of the first mixture And the mixture is mixed to produce a first melt, wherein the first binder in the first melt is dissolved by the first solvent, and the first melt is in a liquid state having a predetermined viscosity.

The first solvent may be one selected from the group consisting of MEK, toluene and adonane, a first binder to be used, or a mixture of different solvents depending on requirements such as volatilization rate and viscosity. Wherein the first binder comprises at least one of silicon, epoxy, urethane, acrylic, PC, PE, PI, PP, PS, PU, PET, PEN, There is no particular restriction as long as it can be hardened (solidified).

In addition, the first melt is preferably prepared by mixing 34-98 wt% of the first mixture and 2-66 wt% of the first solvent so that the first binder can be sufficiently dissolved.

In addition, although the ratio of the first solvent to be mixed may vary depending on the viscosity of the first melt to be required, when the first solvent is mixed to 2 wt% or less, the first binder, which is not dissolved by the first solvent, And when the first solvent is mixed with 66 wt% or more, the viscosity of the first solvent is lowered to such an extent that formation of a thermal diffusion layer is impossible, so that the mixing ratio of the first solvent is preferably 2 to 66 wt%.

The first liquefied liquified as described above may be sprayed, extruded, pasted, spreaded, rolled, knife coated, dip coated, comma coater, lip coater, microgravure, slot A thermal diffusion layer in which a first solvent is mixed is formed through any one of coating methods such as die coating, hole coating, and evaporation, and then heated and dried through drying to volatilize and remove the first solvent.

Thus, in the thermal diffusion layer in which the first solvent is mixed, the first solvent is volatilized and removed, and the preparation of the thermal diffusion layer composed of the thermal diffusion agent and the first binder is completed without the first solvent.

The method may further include a thermal diffusion layer rolling step of increasing the density of the thermal diffusion layer by rolling the thermal diffusion layer to a predetermined thickness after the thermal diffusion layer manufacturing step (S11).

2 shows a third embodiment and a fourth embodiment of the method for manufacturing a composite sheet in which the insulating pillars according to the present invention are arranged. In the method for manufacturing a composite sheet in which the insulating pillars according to the third embodiment are arranged (S10) for manufacturing a heat radiation layer made of a plate-shaped metal for heat radiation, a shield layer stacking step (S22) for forming a plate-like shield layer for shielding electromagnetic waves on one surface of the heat radiation layer, And an insulating layer laminating step (S23) of forming an insulating layer in which a hard insulating filler having a particle size of a predetermined size or larger is formed on one surface of the layer to produce a laminated sheet composed of a plurality of layers.

That is, a laminated sheet is manufactured in such a manner that a shielding layer and an insulating layer are laminated on one surface of a plate-shaped heat dissipation layer in this order.

Further, it may further include a pressing step (S30) after the insulating layer laminating step (S23), or may further include a plurality of pressing steps after each layer is laminated.

For example, either the shielding layer pressing step for pressing the laminated shield layer after the shielding layer manufacturing step (S22) and the insulating layer pressing step for pressing the insulating layer laminated after the insulating layer manufacturing step (S23) Or more.

The method for manufacturing a composite sheet in which the insulating pillars according to the fourth embodiment are disposed includes a heat radiation layer manufacturing step (S10) of manufacturing a heat radiation layer made of plate-like metal for heat radiation, a heat radiation layer (S21) for forming a thermal diffusion layer for diffusing heat through the thermal diffusion layer (S21), a shield layer stacking step (S22) for forming a plate shield layer for shielding electromagnetic waves on one surface of the thermal diffusion layer, And an insulating layer in which a hard insulating filler having a particle size equal to or larger than a predetermined size is mixed to produce a laminated sheet composed of a plurality of layers (S23).

That is, a laminated sheet is manufactured in such a manner that a thermal diffusion layer, a shielding layer, and an insulating layer are laminated on one surface of a plate-like heat radiation layer in this order.

Further, it may further include a pressing step (S30) after the insulating layer laminating step (S23), or may further include a plurality of pressing steps after each layer is laminated.

For example, the thermal diffusion layer stacked after the thermal diffusion layer stacking step (S21) is separated from the thermal diffusion layer pressing step for pressing and the shielding layer pressing step for pressing the laminated shielding layer after the shielding layer manufacturing step (S22) And an insulating layer pressing step for pressing the stacked insulating layers after the layer manufacturing step (S23).

In the first to fourth embodiments, the laminated sheet is pressed from the upper side through a jig having a pressing surface of a predetermined type, and a plurality of protruding ends corresponding to the pressing surface form of the jig are pressed down Wherein the step of forming the protruding step includes the step of forming a protruding end on the heat dissipation layer to attach the heat dissipation layer to the shielding layer through the protruding end, The bonding force between the heat dissipation layer and the shield layer can be further increased.

Particularly, in the second embodiment and the fourth embodiment, which further include the thermal diffusion layer in which the brittleness is high or the peeling can easily occur, the protruding step forming step may further include the protruding step forming step, And the shielding layer can be effectively prevented from being peeled off.

More specifically, the heat dissipation layer is directly coupled to the shielding layer through the protruding end, and the thermal diffusion layer is disposed and fixed between the coupled heat dissipation layer and the shielding layer, thereby releasing the heat dissipation layer The occurrence of the phenomenon can be prevented.

4 or 5 illustrate a fourth embodiment and a fifth embodiment of a method for manufacturing a composite sheet in which an insulating filler according to the present invention is disposed. As shown in FIG. 4, the heat dissipation layer 1, A first dissolver 20 formed by mixing a first mixture in which a thermal diffusing agent and a first binder are mixed and a first solvent is applied through a thermal diffusion layer manufacturing step, To form a thermal diffusion layer (2).

The density of the thermal diffusion layer 2 is increased through the thermal diffusion layer rolling step in which the heat radiation layer 1 and the thermal diffusion layer 2 are pressed through the first roller 62A, The bonding strength between the thermal diffusion layers 2 is also increased.

Thereafter, a second melt 30 formed by mixing a second mixture in which a shielding metal and a second binder are mixed with a second solvent is coated on one surface of the thermal diffusion layer 2 through a shielding layer manufacturing step, And is coated with a predetermined thickness through the knife 61B to form the shielding layer 3.

The density of the shielding layer 3 is increased through a shielding layer rolling step in which the heat releasing layer 1, the thermal diffusion layer 2 and the shielding layer 3 are pressed through a second roller (not shown) , The bonding strength between the heat dissipation layer (1), the thermal diffusion layer (2), and the shield layer (3) also increases.

Thereafter, a third melt 40 formed by mixing a third mixture and a third solvent in which an insulating filler and a third binder are mixed is coated on one surface of the shielding layer 3 through an insulating layer manufacturing step, 3 knife 61C to form the insulating layer 4. [0050]

In addition, through the insulating layer rolling step of pressing the heat dissipating layer 1, the thermal diffusion layer 2, the shielding layer 3, and the insulating layer 4 through a third roller (not shown) The bonding strength between the heat dissipation layer 1, the thermal diffusion layer 2, the shielding layer 3 and the insulation layer 4 is also increased.

Further, at least one of a thermal diffusion layer, a shielding layer, and an insulation layer, which is laminated on one surface of the heat dissipation layer 1, may be laminated by a bonding method after being manufactured in a sheet form.

For example, as shown in Fig. 5, a sheet-like thermal diffusion layer 2 made on the one surface of the heat dissipation layer 1 can be attached with an adhesive.

At this time, it is preferable that the adhesive to be used is constituted so that the thermosetting adhesive is cured by heating and pressing with the first roller 62A using a thermosetting adhesive so that the heat-releasing layer 1 and the thermal diffusion layer 2 are in close contact with each other.

Thereafter, a method of forming the shielding layer 3 and the insulating layer 4 in the form of using the above-described coating, or adhering and laminating the prefabricated sheet such as the thermal diffusion layer 2 may be performed.

FIG. 6 illustrates a composite sheet on which an insulating filler according to the present invention is disposed. In order to prevent a conductive material (such as a thermal diffusing agent and a shielding metal) for heat dissipation and electromagnetic shielding from being in contact with a circuit board, A composite sheet on which an insulating filler is disposed is provided with a heat dissipation layer (1) for dissipating heat transmitted from a circuit board (100) and a shield layer (3) disposed below the heat dissipation layer And an insulating layer (4) arranged below the shielding layer (3) and arranged with a plurality of insulating pillars for preventing the shielding layer (3) from coming into contact with the circuit board, wherein the insulating layer 4 includes a hard insulating filler 41 having a particle size larger than a predetermined size so that the shielding layer 3 is separated from the circuit board 100 by the height of the minimum insulating filler 41 It turns thereby isolated.

More specifically, as shown in (6-I) in FIG. 6, the insulating layer 4 on which the plurality of insulating pillars 41 are disposed is attached to the circuit board 100 as shown in (6-II) The circuit 101 formed by protruding from the circuit board 100 and the upper side of the electronic component are separated from the shielding layer 3 by the insulating filler 41 so that the shielding layer 3 and the circuit 101, Thereby preventing a short circuit due to the contact of the contact portion.

The insulating layer 4 may be formed to have a fluidity so that the insulating filler 41 can easily flow and the insulating layer 4 and the circuit board 100 can be closely contacted with each other without generating an empty space. .

That is, it is preferable that the third binder constituting the insulating layer 4 has some fluidity so as to fill the empty space between the circuit and the electronic parts when attached to the circuit board 100 by the pressing.

In addition, since the insulating layer 4 is divided into a plurality of spherical insulator pillars 41, the insulator layer 4 can be made flexible.

That is, the insulating layer 4 has a plurality of insulating pillars 41 for insulation to hardly separate the shielding layer 3, and the insulating pillars 41 are integrally formed in a plate shape And is arranged in the insulating layer 4 in a separated state, so that flexibility can be obtained.

This makes it possible to attach to circuit boards such as FPCB which require flexibility.

Further, when the heat dissipation layer 1 and the shielding layer 3 further include a thermal diffusion layer 2 for diffusing heat through a thermal diffusing agent, a higher heat dissipation effect can be obtained.

In order to prevent the heat dissipation layer 1 and the shield layer 3 from being peeled off by the thermal diffusion layer 2, the heat dissipation layer 1 further includes a protruding end 8 projecting downwardly And the heating layer 1 is directly adhered to the shielding layer 3 through the protruding end 8.

The insulating filler 41 is filled in the insulating filler 41 to form one layer or a plurality of layers so that each insulating filler 41 is closely adhered so that a circuit or an electronic component can not penetrate like the portion A3, ) Or the contact of the electronic component is prevented, which may vary depending on the mixing ratio of the insulating filler 41 mixed with the third binder to constitute the insulating layer.

In addition, when the shielding metal 31 has a larger cross-sectional area than the insulating filler 41 as shown in FIG. 7, the insulating effect can be sufficiently generated even if it is not filled without void space.

That is, a plurality of insulating pillars 41, such as legs, perform the function of a support so that the shielding metal 31 is separated from the circuit 101 by the diameter of the minimum insulating filler 41.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art without departing from the scope of the present invention. The scope of the invention should therefore be construed in light of the claims set forth to cover many of such variations.

1: heat-radiating layer
2: thermal diffusion layer
3: Shielding layer
4: Isolation layer
5: Adhesive layer
6: release paper
7: Laminated sheet
8: protruding end
20: 1st melt
21: Thermal agent
22: first binder
30: Second melt
31: Shielding metal
32: second binder
40: Third melt
41: Insulating filler
42: Third binder
61A: First knife
62B: the second roller
100: circuit board
101: Circuit
102: Electronic parts
103: conductive material

Claims (21)

A heat dissipation layer for dissipating heat transmitted from the circuit board;
A shield layer disposed under the heat dissipation layer to shield electromagnetic waves;
And an insulating layer disposed at a lower portion of the shielding layer and having a plurality of insulating pillars for preventing the shielding layer from contacting the circuit board,
Wherein the insulating filler has a spherical particle shape to prevent breakage of the circuit board when the circuit board is contacted with the circuit board
A composite sheet in which an insulating filler is disposed.
The method according to claim 1,
The heat-
Fe, Al, and Cu, or an alloy containing at least one of the metals.
A composite sheet in which an insulating filler is disposed.
The method according to claim 1,
The heat-
Characterized in that one surface or both surfaces are roughly surface-treated to increase the surface area and enhance the heat radiation effect
A composite sheet in which an insulating filler is disposed.
The method according to claim 1,
The shielding layer
A shielding metal composed of at least one of Fe, Si, Al, Cr, Ni, and Mn, or an alloy containing any one or more of the metals;
And a second binder including at least one of silicon, epoxy, urethane, acrylic, PC, PE, PI, PP, PS, PU, PET, PEN,
A composite sheet in which an insulating filler is disposed.
5. The method of claim 4,
The shielding layer
A shielding metal of 80 to 95 wt%, and a second binder of 5 to 20 wt%.
A composite sheet in which an insulating filler is disposed.
5. The method of claim 4,
Characterized in that the shielding metal is flaked in the form of plate-like particles and laterally disposed on the shielding layer
A composite sheet in which an insulating filler is disposed.
The method according to claim 1,
And disposed between the heat-radiating layer and the shielding layer
Further comprising a thermal diffusion layer for diffusing heat through the thermal diffusing agent
A composite sheet in which an insulating filler is disposed.
8. The method of claim 7,
The heat-
Characterized in that it comprises any one of a single-walled carbon nanotube powder, a multi-walled carbon nanotube powder, an artificial graphite powder, and a natural graphite powder.
A composite sheet in which an insulating filler is disposed.
8. The method of claim 7,
The thermal diffusion layer
50 to 97 wt% of a first binder containing at least one of silicon, epoxy, urethane, acrylic, PC, PE, PI, PP, PS, PU, PET, PEN,
And 3 to 50 wt% of thermal diffusion.
A composite sheet in which an insulating filler is disposed.
8. The method of claim 7,
The heat dissipation layer further includes a protruding end protruding downward to prevent the heat dissipation layer and the shielding layer from being peeled off by the thermal diffusion layer, and the heat dissipation layer is directly adhered to the shielding layer through the protruding end To
A composite sheet in which an insulating filler is disposed.
delete The method according to claim 1,
The insulating layer
An insulating filler comprising at least one of alumina hydroxide, alumina oxide, SiC, AlN, and MgO;
And a third binder including at least one of silicon, epoxy, urethane, acrylic, PC, PE, PI, PP, PS, PU, PET, PEN,
A composite sheet in which an insulating filler is disposed.
13. The method of claim 12,
The insulating layer
And 10 to 20 wt% of an insulating filler and 80 to 90 wt% of a third binder.
A composite sheet in which an insulating filler is disposed.
A heat radiation layer manufacturing step of manufacturing a heat radiation layer made of a plate-like metal for heat radiation;
A shield layer manufacturing step of fabricating a plate-like shield layer for shielding electromagnetic waves;
An insulating layer manufacturing step of manufacturing an insulating layer in which a hard insulating filler having a particle size of a predetermined size or larger is mixed;
And a laminating step of laminating the heat dissipation layer, the shielding layer, and the insulation layer, which are manufactured through the heat radiation layer production step, the shield layer production step, and the insulation layer production step, to form a laminated sheet composed of a plurality of layers,
The insulation filler mixed in the insulation layer production step has a spherical particle shape in order to prevent the circuit board from being damaged when the insulation filler is brought into contact with the circuit board.
A method for manufacturing a composite sheet in which an insulating filler is disposed.
A heat radiation layer manufacturing step of manufacturing a heat radiation layer made of a plate-like metal for heat radiation;
A thermal diffusion layer manufacturing step of manufacturing a thermal diffusion layer for diffusing heat through a thermal diffusing agent;
A shield layer manufacturing step of fabricating a plate-like shield layer for shielding electromagnetic waves;
An insulating layer manufacturing step of manufacturing an insulating layer in which a hard insulating filler having a particle size of a predetermined size or larger is mixed;
The laminate is formed by laminating the heat dissipation layer, the thermal diffusion layer, the shield layer, and the insulation layer manufactured through the heat dissipation layer production step, the thermal diffusion layer production step, the shield layer production step, and the insulation layer production step, ≪ RTI ID = 0.0 >
A method for manufacturing a composite sheet in which an insulating filler is disposed.
A heat radiation layer manufacturing step of manufacturing a heat radiation layer made of a plate-like metal for heat radiation;
A shield layer stacking step of forming a plate shield layer for shielding electromagnetic waves on one surface of the heat dissipation layer;
And an insulating layer lamination step of forming an insulating layer in which a hard insulating filler having a particle size of a predetermined size or larger is formed on one surface of the shielding layer to produce a laminated sheet composed of a plurality of layers,
The insulating filler mixed in the insulating layer in the insulating layer laminating step has a spherical particle shape in order to prevent the circuit board from being broken when the insulating filler is brought into contact with the circuit board
A method for manufacturing a composite sheet in which an insulating filler is disposed.
A heat radiation layer manufacturing step of manufacturing a heat radiation layer made of a plate-like metal for heat radiation;
Forming a thermal diffusion layer on one surface of the heat dissipation layer to diffuse heat through a thermal diffusion material;
A shielding layer stacking step of forming a plate-shaped shielding layer for shielding electromagnetic waves on one surface of the thermal diffusion layer;
And an insulating layer lamination step of forming an insulating layer in which a hard insulating filler having a particle size of a predetermined size or larger is mixed on one surface of the shielding layer to produce a laminated sheet composed of a plurality of layers
A method for manufacturing a composite sheet in which an insulating filler is disposed.
18. The method according to any one of claims 14 to 17,
Characterized by further comprising a pressing step for pressing the laminated sheet to a predetermined thickness
A method for manufacturing a composite sheet in which an insulating filler is disposed.
19. The method of claim 18,
The pressing step
A first pressing step of first pressing the laminated sheet in a temperature range of 50 to 120 degrees;
And a secondary pressing step of secondary pressing the first pressed laminated sheet in a temperature range of 150 to 200 degrees.
A method for manufacturing a composite sheet in which an insulating filler is disposed.
18. The method according to any one of claims 14 to 17,
Further comprising a protruding step forming step of pressing the laminated sheet from the upper side through a jig having a predetermined pressing surface to project a plurality of protruding ends corresponding to the pressing surface form of the jig downward in the radiating layer,
Wherein the heat dissipation layer is attached to the shielding layer through a protruding end
A method for manufacturing a composite sheet in which an insulating filler is disposed.
A method for producing a composite sheet according to any one of claims 14 to 17,
A composite sheet in which an insulating filler is disposed.

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