TW201713179A - Method for producing printed-wiring boards, and printed-wiring board protective film and sheet-like laminate used in method - Google Patents

Abstract

Provided is a method for producing printed-wiring boards, which has markedly superior production efficiency. The method for producing printed-wiring boards according to an embodiment of the present invention comprises: a step for placing a sheet-like laminate having an adhesive layer (A) and a releasable film disposed on one side of the adhesive layer (A), on a printed-wiring board via the adhesive layer (A); a step for preparing an intermediate laminate by placing a printed-wiring board protective film having an adhesive layer (B1), on the surface of the releasable film via the adhesive layer (B1); a step for pressing the intermediate laminate; a step for adhering the adhesive layer (A) of the sheet-like laminate with the printed-wiring board; and a step for adhering the printed-wiring board protective film and the releasable film via the adhesive layer (B1).

Description

Printed circuit board manufacturing method, printed circuit board protective film used in the method, and sheet laminate

The present invention relates to a method of manufacturing a printed circuit board, a printed circuit board protective film used in the method, and a sheet-like laminated body.

BACKGROUND ART As a method of adhering a sheet-like laminated body to a printed circuit board, it is known to heat-press a printed circuit board and a sheet-like laminated body with a cushioning printed circuit board protective film by a pressurizing plate. Method (for example, Patent Document 1 or 2). Examples of the sheet-like laminate include an electromagnetic wave shielding film and a conductive adhesive film. In the sheet-like laminated body, an insulating protective layer for protecting the sheet-like laminated body is provided on the first main surface side to avoid mechanical or electrical damage, and is used on the second main surface side. To follow the adhesive layer of the printed circuit board. A peeling film is adhered to the outer surface of the insulating protective layer to prevent foreign matter from adhering to the insulating protective layer or injuring the insulating protective layer when the product is shipped and/or adhered to the printed circuit board. As the release film, a resin film such as a polyester film having a release treatment on its surface is generally used. The peelable film is peeled off by a manual operation after the sheet-like laminated body is adhered to the printed circuit board by the above-described hot pressing.

Further, in recent years, electronic devices have been demanding small size and light weight, and printed circuit boards used in electronic devices and sheet-like laminated bodies adhered to the printed circuit boards have been pursued to be suitable for small sizes. However, once the size of the sheet-like laminated body is reduced, since the number of sheets (single sheets) of the sheet-like laminated body supplied to one batch of the hot pressing step is increased, the peeling film is laminated from the sheet-like layer after the hot pressing. The problem that the work load of the body peeling becomes large becomes obvious.

For example, Japanese Patent Laid-Open No. Hei 10-272700 Patent Document 2: International Publication No. 2005/002850

SUMMARY OF THE INVENTION Problems to be Solved by the Invention The present invention has been made to solve the above problems, and an object thereof is to provide a method of manufacturing a printed circuit board having excellent manufacturing efficiency, and a printed circuit board protective film which can be used in the manufacturing method, and Sheet laminate.

Solution to Problem A method of manufacturing a printed wiring board according to an embodiment of the present invention includes a sheet having a release layer (A) and a release film provided on one side of the adhesive layer (A) a layered body placed on the printed circuit board via the adhesive layer (A); a printed circuit board protective film having an adhesive layer (B1) is placed on the surface of the peelable film via the adhesive layer (B1) a step of producing an intermediate laminate; a step of pressurizing the intermediate laminate; a step of subsequently bonding the adhesive layer (A) of the laminate to the printed circuit board; and passing the adhesive layer (B1) The step of adhering the printed circuit board protective film to the release film. A method of manufacturing a printed wiring board according to another embodiment of the present invention includes: a sheet-like laminate having a release layer (A) and a release film provided on one side of the adhesive layer (A), a step of placing the agent layer (A) on the printed circuit board; a step of placing a printed circuit board protective film having a viscosity in a specific temperature region on the surface of the release film to form an intermediate laminate; a step of pressurizing the body; a step of adhering the adhesive layer (A) of the sheet-like laminate to the printed circuit board; and protecting the film by the adhesiveness of the printed circuit board The release film is followed by a step. A method of manufacturing a printed wiring board according to still another embodiment of the present invention, comprising: a sheet-like layered body having an adhesive layer (A), a release film, and an adhesive layer (B2) in this order, via the adhesive layer ( A) a step of mounting on a printed circuit board; a step of placing a printed circuit board protective film on the surface of the adhesive layer (B2) to form an intermediate laminated body; and a step of pressurizing the intermediate laminated body; a step of adhering the adhesive layer (A) of the laminate to the printed circuit board; and a step of adhering the printed circuit board protective film to the release film via the adhesive layer (B2). A method of manufacturing a printed wiring board according to still another embodiment of the present invention, comprising: a sheet-like laminate having a release layer (A) and a release film provided on one side of the adhesive layer (A); a step of placing the agent layer (A) on the printed circuit board; placing the adhesive film on the surface of the release film; placing a printed circuit board protective film on the surface of the adhesive film to form an intermediate laminate a step of pressurizing the intermediate laminate; a step of subsequently adhering the adhesive layer (A) of the laminate to the printed circuit board; and the protective film of the printed circuit board via the adhesive film The release film is followed by a step. In one embodiment, the manufacturing method further includes the step of removing the peelable film from the sheet-like laminated body by removing the printed circuit board protective film. In one embodiment, the pressurization is hot pressing. In one embodiment, the sheet-like laminated body further has a functional portion adjacent to the adhesive layer (A). According to another aspect of the present invention, a printed circuit board protective film is provided. The printed circuit board protective film is used in the above-described method for manufacturing a printed circuit board, and has an adhesive layer (B1) on the surface of the peelable film side, and the adhesive layer (B1) can be followed by the above-mentioned sheet-like laminated body. The release film and the printed circuit board protect the film. According to still another aspect of the present invention, a sheet laminate is provided. The sheet-like laminated body sequentially has an adhesive layer (A), a peelable film, and an adhesive layer (B2), and the adhesive layer (A) is a conductive adhesive layer. Another sheet-like laminate of the present invention has an adhesive layer (A), a functional portion, a release film, and an adhesive layer (B2) in this order. In one embodiment, the functional portion has an electromagnetic wave shielding layer and a protective layer in this order from the side of the adhesive layer (A). In one embodiment, the adhesive layer (A) is a conductive adhesive layer, and the functional portion is a protective layer.

Advantageous Effects of Invention According to an embodiment of the present invention, in a method of manufacturing a sheet-like laminate which is adhered to a printed circuit board by pressurization (typically hot pressing), peeling property of the sheet-like laminate is caused by pressurization. The film is transferred to the protective film of the printed circuit board, and the work of peeling off the peeling film by manual work from the sheet-like laminated body after the pressurization can be omitted. As a result, a method of manufacturing a printed circuit board having excellent manufacturing efficiency can be realized. In particular, when the number of sheets (single sheets) of the printed circuit board and the sheet-like laminated body supplied in one batch of the pressurizing step is large, the effect is remarkable.

MODE FOR CARRYING OUT THE INVENTION Hereinafter, specific embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the embodiments. Further, in all of the drawings, the functional portion is provided in the sheet-like laminated body, but the functional portion is an arbitrary component and may be omitted for the purpose. For example, when the sheet-like laminated body is a circuit connecting member, the functional portion can be omitted.

<First Embodiment> Fig. 1 (a) to Fig. 1 (d) are schematic cross-sectional views each showing a procedure of a method of manufacturing a printed wiring board according to an embodiment of the present invention. First, as shown in FIG. 1(a), the printed circuit board 10 is placed on the release sheet 40. Preferably, a plurality of printed circuit boards 10 are placed on the release sheet 40 as shown in the drawings. The release sheet 40 can also be omitted. At this time, the printed circuit board 10 is directly placed on the lower side pressing plate 52 which will be described later with reference to Fig. 1 (c).

Further, the sheet-like laminated body 20 is placed on the printed circuit board 10. The sheet-like laminate is typically a functional portion 21, a release film 22 provided on one side of the functional portion 21, and an adhesive layer (A) provided on the other side of the functional portion 21. The sheet-like laminated body 20 is typically placed on a cover film (not shown) of the printed circuit board 10 via the adhesive layer (A). Examples of the sheet-like laminated body include an electromagnetic wave shielding film and a circuit connecting member. When the sheet-like laminate is an electromagnetic wave shielding film, the functional portion 21 has an electromagnetic wave shielding layer and a protective layer in this order from the adhesive layer (A) side. In this case, the adhesive layer (A) may be a conductive adhesive layer, or may be either an anisotropic conductive adhesive layer or an isotropic conductive adhesive layer. When the subsequent agent layer (A) is an isotropic conductive adhesive layer, the electromagnetic wave shielding layer can be omitted from the functional portion, and the conductive adhesive layer can also serve as an electromagnetic wave shielding layer. When the sheet-like laminated body is a circuit connecting member, the adhesive layer (A) is typically formed as a conductive adhesive, and the functional portion can be omitted as described above (that is, the circuit connecting member includes the conductive adhesive layer (A) and the peeling property. film). A typical example of the circuit connecting member is a conductive adhesive film having a thermosetting resin or a photocurable resin and a conductive filler. Further, practically, other peelable film is temporarily adhered to the surface of the adhesive layer (A) of the sheet-like laminate before being supplied for use, thereby preventing foreign matter from adhering to the adhesive layer and/or the adhesive layer. .

Next, as shown in FIG. 1(b), the printed circuit board protective film 30 is placed on the sheet-like laminated body 20. The printed circuit board protective film 30 has a body portion 31 and an adhesive layer (B1). The printed circuit board protective film 30 is placed on the sheet-like laminated body 20 via the adhesive layer (B1). Preferably, the printed circuit board protective film 30 is placed in such a manner that a large printed circuit board protective film covers all of the plurality of sheet-like laminated bodies as shown in the figure. With this configuration, the peelable film 22 can be transferred together to the printed circuit board protective film in all of the plurality of sheet-like laminated bodies 20, and the peeling film can be peeled off from all the sheet-like laminated bodies. Remove. Hereinafter, for the sake of convenience, the laminated body of the release sheet 40 (when present), the printed circuit board 10, the sheet-like laminated body 20, and the printed circuit board protective film 30 may be referred to as an intermediate laminated body.

Next, the intermediate laminate obtained by the process of Fig. 1(b) is pressurized. The printed circuit board protective film 30 and the peelable film 22 are bonded via the adhesive layer (B1) by pressurizing the intermediate laminate. In addition, when the sheet-like laminated body 20 and the printed circuit board 10 are next (hereinafter referred to as time point (1)), the printed circuit board protective film 30 and the peelable film 22 can be connected to each other (hereinafter, the time point (2) At the same time, the time point (2) may be performed after the time point (1), but it is preferable that the time point (1) coincides with the time point (2). When the time point (2) is performed after the time point (1), the protective film is peeled off by the known method (heating and pressing through the protective film of the printed circuit board having no adhesion) from the state of FIG. 1(a). After the sheet-like laminated body and the printed circuit board are attached to the printed circuit board via the adhesive layer (A) of the sheet-like laminated body, an intermediate laminated body is produced, and the printed circuit board protective film is pressed by pressurizing the intermediate laminated body. 30 and the peelable film 22 are then passed through the adhesive layer (B1). At the same time as the time point (1) and the time point (2), the functional portion 21 of the sheet-like laminated body 20 can be made while the printed circuit board protective film 30 and the peelable film 22 are passed through the adhesive layer (B1). When present, it is followed by the printed circuit board 10 via the adhesive layer (A). By the same step, the step of adhering the sheet-like laminated body to the printed circuit board and the step of adhering the printed circuit board protective film and the peeling film can be performed simultaneously, so that the type according to the sheet-like laminated body can be efficiently manufactured. A printed circuit board that imparts functions (such as electromagnetic wave shielding and electrical conductivity).

The situation at the same time point (1) and time point (2) will be explained in more detail. By pressing the intermediate laminated body in the pattern shown in Fig. 1(c), the sheet-like laminated body 20 and the printed circuit board 10 can be simultaneously attached to the printed circuit board protective film 30 and the peelable film 22. The representative of the pressurization is hot pressing. Specifically, the hot pressing is performed by sandwiching the intermediate laminated body with the upper pressing plate 51 and the lower pressing plate 52 heated to a specific temperature, and applying a specific pressure for a specific time. The temperature of the hot pressing (substantially the temperature of the upper pressing plate 51 and the lower pressing plate 52), the pressure and the time, depending on the type, material and characteristics of the adhesive layers (A) and (B1), and the printed circuit Material and surface characteristics of the main portion of the sheet protective film, functional parts of the sheet-like laminated body (when present), and material and surface characteristics of the peelable film, adhesion of the adhesive layer (A) to the printed circuit board, and adhesive layer (B1) The adhesion of the peelable film and/or the adhesive force of the peelable film and the functional portion of the sheet-like laminate or the adhesive layer (A) are appropriately set. The temperature of the hot pressing is, for example, 150 ° C to 200 ° C. The pressure of hot pressing is, for example, 2 MPa to 5 MPa. The hot pressing time is, for example, 1 minute to 5 minutes.

The functional portion 21 of the sheet-like laminated body 20 and the printed circuit board 10 are then passed through the adhesive layer (A) by hot pressing of the intermediate laminated body. When the functional portion 21 is omitted, the adhesive layer (A) of the sheet-like laminated body 20 is brought into contact with the printed circuit board 10 by hot pressing of the intermediate laminated body. Thereby, a printed circuit board which imparts a function (for example, electromagnetic wave shielding property and conductive adhesiveness) according to the type of the sheet-like laminated body can be obtained. At the same time, the printed circuit board protective film 30 and the peelable film 22 are bonded via the adhesive layer (B1) by hot pressing. As a result, as soon as the pressure of the hot pressing is released, the peelable film 22 is transferred from the sheet-like laminated body 20 to the printed circuit board protective film 30 as shown in Fig. 1(d). Such transfer can be carried out by appropriately adjusting the type, material and characteristics of the adhesive layers (A) and (B1), the material and surface characteristics of the body portion of the printed circuit board protective film, and the functional portion of the sheet-like laminated body (when present And the material and surface characteristics of the release film, the adhesion between the adhesive layer (A) and the printed circuit board, the adhesion between the adhesive layer (B1) and the release film, and the functional portions of the release film and the sheet laminate It is achieved by the adhesion of the adhesive layer (A), and/or the conditions of hot pressing, and the like. For example, the adhesive force of the side surface of the printed circuit board protective film 30 and the adhesive layer (B1) of the peelable film 22 is made larger than the opposite side surface (substantially the peeling treatment surface) of the peelable film 22 and the functional portion 21 ( The above-described transfer can be achieved by the adhesion of the adhesive layer (A) when omitted.

Hereinafter, a printed circuit board, a film, a sheet, an adhesive, and the like used in the present embodiment will be briefly described. Furthermore, since such configurations are well known to those skilled in the art, detailed descriptions are omitted. Regarding the portions of the specification that are omitted from the description, configurations well known to those skilled in the art may be employed.

The printed circuit board 10 can be a flexible printed circuit board, a rigid printed circuit board, or a hard and flexible printed circuit board.

As an adhesive (adhesive composition) of the adhesive layer (A) constituting the sheet-like laminated body, any suitable one can be used as long as the sheet-like laminated body can be satisfactorily adhered to the printed circuit board and the above-described transfer can be realized. Adhesive. Specifically, the adhesive may be a hot-melt adhesive, a thermosetting resin-based adhesive, a thermoplastic resin-based adhesive, an active energy ray-curable adhesive, or a pressure-sensitive adhesive. Follow-up agent. Examples of the base resin of the hot-melt adhesive include a urethane resin, a polyamide resin, a polyester resin, a polyolefin resin, a styrene resin, an ethylene-vinyl acetate resin, and a thermoplastic elastomer. . Examples of the base resin of the thermosetting resin-based adhesive include an epoxy resin, a phenol resin, a (meth)acrylic resin, a urethane resin, a polyolefin resin, and an isocyanate resin. Examples of the base resin of the thermoplastic resin-based adhesive include (meth)acrylic resin, polyvinyl acetal resin, styrene resin, polyimine resin, polyamide resin, and polyamidimide. Resin. Examples of the base resin of the active energy ray-curable adhesive include a (meth)acrylic resin and an epoxy resin. The adhesive layer (A) having desired characteristics can be formed by appropriately adjusting the composition ratio of the monomer components of the base resin, and the kind, amount, blending amount, and combination of the additives. The adhesive constituting the adhesive layer (A) is preferably a thermosetting resin adhesive or an active energy ray-curable adhesive, and more preferably a thermosetting resin adhesive. Since such an adhesive can achieve a desired adhesive force between the sheet-like laminated body and the printed circuit board, the sheet-like laminated body and the printed circuit board can be favorably adhered, and the peelable film can be favorably transferred to the printed circuit. Board protection film. The thickness of the layer (A) is preferably 0.5 μm to 20 μm. When the thickness of the adhesive layer (A) is 0.5 μm or more, it is easy to follow the step of the printed circuit board, and if it is 20 μm or less, the entire thickness of the laminated body can be reduced, and the flexibility is improved.

When the sheet-like laminated body 20 is an electromagnetic wave shielding film, the electromagnetic wave shielding layer is typically a layer formed of a metal thin film or a layer having a conductive filler. When the electromagnetic wave shielding layer is a layer formed of a metal thin film, examples of the metal material constituting the thin film include aluminum, silver, copper, gold, nickel, tin, palladium, chromium, titanium, and zinc, or the like. More than one alloy. The metal material can be appropriately selected depending on the desired shielding properties. When the electromagnetic wave shielding layer is a layer having a conductive filler, it can be used for a conductive filler used for a conductive adhesive film to be described later. The thickness of the electromagnetic wave shielding layer is preferably from 0.1 μm to 10 μm, more preferably from 0.3 μm to 7 μm, still more preferably from 1 μm to 6 μm. The representative layer of the protective layer is composed of any suitable resin film having electrical insulating properties and/or scratch resistance. The resin constituting the resin film may be a thermosetting resin, a thermoplastic resin, or an electron beam (for example, visible light or ultraviolet ray) curable resin. Specific examples of the resin include an epoxy resin, a phenol resin, an amine resin, an alkyd resin, a urethane resin, a (meth)acrylic resin, a polyimine resin, and a polyamidimide. Resin. The thickness of the protective layer is, for example, 1 μm to 10 μm.

When the sheet-like laminated body 20 is an electromagnetic wave shielding film, the adhesive layer (A) can be an anisotropic conductive adhesive layer or an isotropic conductive adhesive layer by adding a conductive filler to the above-mentioned adhesive. In the case of the anisotropic conductive adhesive layer, by adding 10 parts by mass to 150 parts by mass of the conductive filler to 100 parts by mass of the base resin of the above-mentioned adhesive, an anisotropic conductive adhesive layer can be obtained. Further, in the case of the isotropic conductive adhesive layer, the conductive resin can be added to the base resin of the above-mentioned adhesive to form an isotropic conductive adhesive layer by adding 150 parts by mass to 500 parts by mass of the conductive filler. As such a conductive filler, a conductive filler used for a conductive adhesive film to be described later can be used.

When the sheet-like laminate 20 is a conductive adhesive film, the conductive adhesive is typically a conductive filler formulated in any appropriate adhesive composition (for example, an adhesive composition constituting the adhesive layer (A)). Made. As the conductive filler, any appropriate conductive filler can be used. Specific examples of the conductive filler include carbon, silver, copper, nickel, solder, aluminum, a silver-plated copper filler for silver plating of copper powder, and a filler for metal plating such as a resin ball or a glass bead. Silver-plated copper filler or nickel is preferred. The reason is relatively low cost, excellent electrical conductivity, and high reliability. The conductive filler may be used singly or in combination of two or more. As the shape of the conductive filler, any appropriate shape can be used as the purpose. Specific examples include a true spherical shape, a small plate shape, a flaky shape, a plate shape, a dendritic shape, an elliptical spherical shape, a rod shape, a needle shape, and an amorphous shape. The amount of the conductive filler in the conductive adhesive is preferably from 10 parts by weight to 150 parts by weight based on 100 parts by weight of the base resin.

The peelable film 22 is typically a film which is subjected to a release treatment on the surface. Examples of the film include a polyester film (for example, a polyethylene terephthalate film), a polyolefin film (for example, a polyethylene film, a polypropylene film, a polymethylpentene film), a polyvinyl chloride film, and the like. Resin film such as cellulose film (such as cellulose acetate butyrate film, cellulose triacetate film), polystyrene film, polycarbonate film, and polyfluorene film; cellophane, coated paper, kraft paper, glossy paper, synthetic paper Paper; various non-woven fabrics; metal foils; and composite films that combine them. Among them, a polyethylene terephthalate (PET) film is preferred from the viewpoint of availability and cost. As the release treatment, for example, a release agent is applied to one side or both sides of the film, and an uneven shape is formed on the surface of the film. Examples of the release agent include hydrocarbon resins such as polyethylene and polypropylene, higher fatty acids and metal salts thereof, higher fatty acid soaps, waxes, animal and vegetable fats and oils, mica, talc, polyfluorene-based surfactants, and polyoxyl Oil, polyoxymethylene resin, melamine resin, fluorine-based surfactant, fluororesin, fluorine-containing polyoxyl resin. Examples of the coating method of the release agent include gravure coating, contact coating, die coating, lip coating, comma coating, blade coating, roll coating, knife coating, and the like. Spray coating, bar coating, spin coating, dip coating. Examples of the method for forming the uneven shape include embossing, mixing of fine particles into the film, roughening of the surface of the film by spraying with dry ice, and the like, and curing of the thermosetting resin in a mold having an uneven shape.

The body portion 31 of the printed circuit board protective film 30 may have a property of protecting the printed circuit board from damage due to contact with the pressure plate. As the main body portion 31 having such a property, a representative of a buffer film made of any appropriate resin film is exemplified. Typical examples of the resin constituting the resin film include a polyolefin resin (for example, polyethylene, polypropylene, polymethylpentene), and a polyester resin (for example, polyethylene terephthalate or polyparaphenylene). (butylene dicarboxylate), (meth)acrylic resin (for example, ethylene-ethyl acrylate copolymer resin (EEA), ethylene-methyl acrylate copolymer resin (EMA), ethylene-methyl methacrylate copolymer resin (EMMA)), polyvinyl chloride resin. The thickness of the body portion is, for example, 10 μm to 250 μm.

As the adhesive (adhesive composition) constituting the adhesive layer (B1), any suitable adhesive can be used as long as the release film can be transferred from the sheet-like laminate to the printed circuit board protective film. Specifically, the adhesive may be a hot-melt adhesive, a thermosetting resin-based adhesive, a thermoplastic resin-based adhesive, or an active energy ray-curable adhesive. Examples of the base resin of the hot-melt adhesive include a urethane resin, a polyamide resin, a polyester resin, a polyolefin resin, a styrene resin, an ethylene-vinyl acetate resin, and a thermoplastic elastomer. . Examples of the base resin of the thermosetting resin-based adhesive include an epoxy resin, a phenol resin, a (meth)acrylic resin, a urethane resin, a polyolefin resin, and an isocyanate resin. Examples of the base resin of the thermoplastic resin-based adhesive include (meth)acrylic resin, polyvinyl acetal resin, styrene resin, polyimine resin, polyamide resin, and polyamidimide. Resin. Examples of the base resin of the active energy ray-curable adhesive include a (meth)acrylic resin and an epoxy resin. By appropriately adjusting the composition ratio of the monomer components of the base resin, and the kind, amount, blending amount, and combination of the additives, an adhesive layer having desired characteristics can be formed. The adhesive constituting the adhesive layer (B1) is preferably a hot melt adhesive, and more preferably a hot melt adhesive using a styrene resin as a base resin. Since such an adhesive can achieve a desired adhesive force between the sheet-like laminated body and the printed circuit board, the sheet-like laminated body and the printed circuit board can be favorably adhered, and the peelable film can be favorably transferred to the printed circuit. Board protection film. The thickness of the layer (B1) is preferably 1 μm to 15 μm, more preferably 3 μm to 10 μm. When the thickness is 1 μm or more, the peelable film can be favorably transferred to the printed circuit board protective film. When the thickness is 15 μm or less, the adhesive layer (B1) can be prevented from overflowing when the laminate is thermally pressed.

<Second Embodiment> Figs. 2(a) to 2(d) are schematic cross-sectional views each showing a procedure in a method of manufacturing a printed wiring board according to another embodiment of the present invention. Only the features of the embodiment will be described below. The printed circuit board, the film, the sheet, the adhesive, and the like which are the same as those of the user in the first embodiment are denoted by the same reference numerals and will not be described. In addition, when the operation conditions and the like are not specifically described, the description of the first embodiment can be applied.

In the present embodiment, instead of the printed circuit board protective film 30 having the main body portion 31 and the adhesive layer (B1), as shown in FIG. 2(b), a specific temperature region (a representative temperature range of hot pressing) is used. A printed circuit board protective film formed by the viscous body portion 32. According to the present embodiment, in the hot pressing of the intermediate laminated body shown in Fig. 2(c), the adhesiveness of the printed circuit board protective film 32 is adhered to the printed circuit board protective film 32 and the peelable film 22. As a result, when the pressure of the hot pressing is released, the peelable film 22 is transferred from the sheet-like laminated body 20 to the printed circuit board protective film 32 as shown in FIG. 2(d). The constituent material of the printed circuit board protective film 32 which is viscous in the temperature range of the hot press is, for example, a polyester resin, an acrylic resin, a urethane resin, and an epoxy resin. The printed circuit board protective film is described, for example, in Japanese Laid-Open Patent Publication No. 2009-191099, the disclosure of which is incorporated herein by reference. Further, the printed circuit board protective film according to the present embodiment may be formed of a single material having a viscous body portion 32, or may be formed of a plurality of layers having at least one surface of the surface having adhesiveness.

<Third Embodiment> Figs. 3(a) to 3(d) are schematic cross-sectional views each showing a step in a method of manufacturing a printed wiring board according to still another embodiment of the present invention. As in the second embodiment, only the characteristic portions will be described in the present embodiment.

In the present embodiment, as shown in Fig. 3 (a), the sheet-like laminated body 20' having the adhesive layer (B2) is further provided on the surface of the peelable film 22 (on the side of the printed circuit board protective film). In connection with this, in the present embodiment, the printed circuit board protective film 30 having the main body portion 31 and the adhesive layer (B1) in the first embodiment is used, and the main body portion 31 is used as shown in Fig. 3(b). A printed circuit board protective film is formed. That is, the printed circuit board protective film of the present embodiment may not have an adhesive layer on the surface facing the side of the adhesive layer (B2). According to the present invention, in the hot pressing of the intermediate laminate shown in Fig. 3(c), the printed circuit board protective film 31 and the peelable film 22 are bonded via the adhesive layer (B2). As a result, when the pressure of the hot pressing is released, as shown in Fig. 3 (d), the adhesive layer (B2) and the peelable film 22 are transferred from the sheet-like laminated body 20' to the printed circuit board protective film 31. The subsequent agent layer (B2) may be composed of the same adhesive as the adhesive layer (B1).

<Fourth Embodiment> Figs. 4(a) to 4(e) are schematic cross-sectional views each showing a procedure of a method of manufacturing a printed wiring board according to still another embodiment of the present invention. As in the second and third embodiments, only the features will be described in the present embodiment.

In the present embodiment, as shown in FIG. 4(b), the adhesive film 60 is placed on the surface of the peelable film 22, and then, as shown in FIG. 4(c), the adhesive film is used. A printed circuit board protective film formed of the body portion 31 is placed on the surface. According to the present invention, in the hot pressing of the intermediate laminated body shown in FIG. 4(d), the printed circuit board protective film 31 and the peelable film 22 are bonded via the adhesive film 60. As a result, when the pressure of the hot pressing is released, as shown in FIG. 4(e), the peelable film 22 is transferred from the sheet-like laminated body 20 to the printed circuit board protective film 31. Examples of the adhesive film 60 include a film comprising a hot-melt adhesive, a thermosetting resin-based adhesive, a thermoplastic resin-based adhesive, and an active energy ray-curable adhesive.

EXAMPLES Hereinafter, the present invention will be specifically described by examples, but the present invention is not limited to the examples.

<Example 1> A commercially available electromagnetic wave shielding film (manufactured by TATSUTA Wire, trade name: SF-PC5600) was used as a sheet-like laminate. The electromagnetic wave shielding film has a structure in which a peelable PET film (thickness: 60 μm) provided with a melamine release layer on one side surface, a protective layer (thickness: 5 μm) formed of a thermosetting epoxy resin, and a silver vapor-deposited layer are formed. Electromagnetic wave shielding layer (thickness: 0.1 μm) / anisotropic conductive adhesive layer (containing 13 parts by mass of dendritic silver-plated copper powder: thickness: 5 μm with respect to 100 parts by mass of the thermosetting epoxy resin). A surface of the peeling film of the electromagnetic wave shielding film on the opposite side to the protective layer is coated with a styrene-based thermoplastic resin (manufactured by Toagos Corporation, Japan, trade name: ARONMELT PPET-2000S). A solution (concentration: 30% by weight) in a mixed solvent of ketone (MEK)/toluene (50/50: vol%) was dried at 80 ° C for 3 minutes to form a hot melt on the peeling film of the electromagnetic wave shielding film. Agent layer (thickness 5 μm). Next, the electromagnetic wave shielding film on which the hot-melt adhesive layer was formed was cut into a size of 10 cm in length × 5 cm in width to obtain a film sheet. Eight film sheets were placed on a polyimide film (25 cm in length × 25 cm in width) at intervals of 1 cm. At this time, the conductive adhesive layer was placed on the side of the polyimide film. Next, the polyimine film on which the film sheet was placed was placed on the lower side pressure plate of a hot press apparatus (manufactured by Derry Machinery Co., Ltd., model AHC007-014). Further, a printed circuit board protective film (polyolefin film, manufactured by Mitsui Chemicals Co., Ltd., trade name "OPULAN (transliteration) CR1012MT4", thickness: 0.15 mm, vertical length: 28 cm × width: 30 cm) was placed on the thermal fusion bonding so as to cover all the film sheets. On the agent layer. The upper pressure plate (rubber rubber) was lowered from above the printed circuit board protective film, and hot pressed at 3 MPa for 3 minutes at 170 ° C, and the electromagnetic wave shielding film and the polyimide film were passed through the conductive adhesive layer, and then passed through the heat. The adhesive layer is followed by a release film and a printed circuit board protective film. After the hot pressing was completed, the film sheets were cooled to 25 ° C, after which the printed circuit board protective film was removed, and all of the peel films of the eight film sheets were transferred to a printed circuit board protective film. Thus, it was confirmed that the peelable film can be favorably removed from the film sheet (electromagnetic wave shielding film) by removing the printed circuit board protective film.

Industrial Applicability The manufacturing method of the embodiment of the present invention can be applied to the production of a printed circuit board.

10‧‧‧Printed circuit board
20‧‧‧Face laminar body
20'‧‧‧Face laminar body
21‧‧‧ Function Department
22‧‧‧Release film
30‧‧‧Printed circuit board protective film
31‧‧‧ Body part (printed circuit board protective film)
32‧‧‧Printed circuit board protective film (body part)
40‧‧‧away film
51‧‧‧Upper compression plate
52‧‧‧Bottom compression plate
60‧‧‧Adhesive film
(A) ‧ ‧ adhesive layer
(B1) ‧ ‧ adhesive layer
(B2) ‧ ‧ adhesive layer

1(a) to 1(d) are schematic cross-sectional views each showing a step in a method of manufacturing a printed wiring board according to an embodiment of the present invention. 2(a) to 2(d) are schematic cross-sectional views each showing a step in a method of manufacturing a printed wiring board according to another embodiment of the present invention. 3(a) to 3(d) are schematic cross-sectional views each illustrating steps in a method of manufacturing a printed wiring board according to still another embodiment of the present invention. 4(a) to 4(e) are schematic cross-sectional views each showing a step in a method of manufacturing a printed wiring board according to still another embodiment of the present invention.

10‧‧‧Printed circuit board

20‧‧‧Face laminar body

21‧‧‧ Function Department

22‧‧‧Release film

30‧‧‧Printed circuit board protective film

31‧‧‧ Body part (printed circuit board protective film)

40‧‧‧away film

51‧‧‧Upper compression plate

52‧‧‧Bottom compression plate

(A) ‧ ‧ adhesive layer

(B1) ‧ ‧ adhesive layer

Claims (12)

A method of manufacturing a printed circuit board, comprising: laminating a laminate having an adhesive layer (A) and a release film provided on one side of the adhesive layer (A), via the adhesive layer (A) a step of placing a printed circuit board protective film having an adhesive layer (B1) on the surface of the release film via the adhesive layer (B1) to form an intermediate laminate; a step of pressurizing the body; a step of adhering the adhesive layer (A) of the sheet-like laminate to the printed circuit board; and passing the printed circuit board protective film and the peelable film via the adhesive layer (B1) The next step. A method of manufacturing a printed circuit board, comprising: laminating a laminate having an adhesive layer (A) and a release film provided on one side of the adhesive layer (A), via the adhesive layer (A) a step of placing on a printed circuit board; a step of placing a printed circuit board protective film having a viscosity in a specific temperature region on the surface of the release film to form an intermediate laminate; and pressing the intermediate laminate; a step of adhering the adhesive layer (A) of the sheet-like laminate to the printed circuit board; and a step of protecting the printed circuit board protective film and the release film by the adhesiveness of the printed circuit board. A method of manufacturing a printed circuit board comprising: a sheet-like laminated body having an adhesive layer (A), a release film, and an adhesive layer (B2) in this order, and is placed on a printed circuit via the adhesive layer (A) a step of placing a printed circuit board protective film on the surface of the adhesive layer (B2) to form an intermediate laminated body; a step of pressurizing the intermediate laminated body; and an adhesive layer of the laminated laminated body (A) a step subsequent to the printed circuit board; and a step of subsequently adhering the printed circuit board protective film to the release film via the adhesive layer (B2). A method of manufacturing a printed circuit board, comprising: laminating a laminate having an adhesive layer (A) and a release film provided on one side of the adhesive layer (A), via the adhesive layer (A) a step of placing a printed circuit board; a step of placing an adhesive film on the surface of the peelable film; a step of mounting a printed circuit board protective film on the surface of the adhesive film to form an intermediate laminated body; a step of pressurizing; a step of subsequently adhering the adhesive layer (A) of the sheet-like laminate to the printed circuit board; and a step of subsequently adhering the printed circuit board protective film to the release film via the adhesive film. The method of manufacturing a printed circuit board according to any one of claims 1 to 4, further comprising the step of removing the peeling film from the sheet-like laminated body by removing the printed circuit board protective film . The method of manufacturing a printed circuit board according to any one of claims 1 to 5, wherein the pressurization is hot pressing. The method of manufacturing a printed circuit board according to any one of claims 1 to 6, wherein the sheet-like laminated body further has a functional portion adjacent to the adhesive layer (A). A printed circuit board protective film for use in the method of manufacturing the printed circuit board of claim 1, and having an adhesive layer (B1) on the surface of the peelable film side, the adhesive layer (B1) being able to follow the aforementioned sheet The peelable film of the laminate and the protective film of the printed circuit board. A sheet-like laminate having an adhesive layer (A), a release film, and an adhesive layer (B2) in this order, and the adhesive layer (A) is a conductive adhesive layer. A sheet-like laminate having a layer of an adhesive layer (A), a functional portion, a release film, and an adhesive layer (B2) in this order. The sheet-like laminate according to claim 10, wherein the functional portion has an electromagnetic wave shielding layer and a protective layer in this order from the side of the adhesive layer (A). The sheet-like laminate according to claim 10, wherein the adhesive layer (A) is a conductive adhesive layer, and the functional portion is a protective layer.