JP6449111B2 - Shielding material, electronic parts and adhesive sheet - Google Patents

Description

  The present invention relates to a shield material, an electronic component, and an adhesive sheet.

  In order to enhance noise resistance, an electromagnetic shield may be provided on a wiring board such as a circuit board. It has also been proposed that a flexible printed wiring board (FPC) be provided with a flexible shield layer using an adhesive containing a conductive filler (see JP-A-7-122882). Such a shield layer is often laid in an overlapping manner so as to be electrically connected to a ground circuit provided on the wiring board. In general, an insulating resin layer is provided outside the shield layer in order to prevent a short circuit between the shield layer and other circuits.

Japanese Patent Laid-Open No. 7-122882

  However, in the conventional shield layer, since the adhesive layer adhered to the flexible printed wiring board contains the entire conductive filler, the adhesion with the flexible printed wiring board may be insufficient. Further, the conventional shield layer has a disadvantage that the parasitic capacitance increases due to the conductive filler, resulting in an increase in transmission loss.

  The present invention has been made based on the above-described circumstances, and can improve the adhesive strength while ensuring the conductivity of the conductive region, and can reduce the transmission loss, and the shielding material and the adhesive sheet. It aims at providing an electronic component provided with this shielding material.

  In order to solve the above problems, a shielding material according to one embodiment of the present invention includes an insulating layer mainly composed of a synthetic resin, a conductor layer laminated on the back surface of the insulating layer, and a back surface of the conductor layer. And a conductive adhesive layer to be laminated, wherein the conductive adhesive layer is disposed on at least a part of the conductive region of the back surface of the conductor layer, and is conductive in the thickness direction. One or a plurality of bumps to be developed and an adhesive layer filled in a region including at least the back surface of the periphery of the one or the plurality of bumps.

  An electronic component according to another aspect of the present invention, which has been made to solve the above problems, is laminated on one or a plurality of shield regions of a flexible printed wiring board having a conductive pattern and the surface of the flexible printed wiring board. The shield material is used as the shield material, and the shield material is one or a plurality of conductive materials in which a part of the conductive pattern is exposed in the shield region of the flexible printed wiring board. The bumps are arranged in the region.

  An adhesive sheet according to another aspect of the present invention made to solve the above problems is an adhesive sheet used for joining a shield material to one or a plurality of shield regions of the surface of a flexible printed wiring board, One or a plurality of bumps including a release film and a conductive adhesive layer laminated on a plurality of regions on the surface of the release film, wherein the conductive adhesive layer exhibits conductivity in the thickness direction. And an adhesive layer filled at least on the surface of the release film among the periphery of the one or the plurality of bumps.

  The shield material and the adhesive sheet of the present invention and the electronic component including the shield material can improve the adhesive strength and reduce the transmission loss while ensuring the conductivity of the conductive region.

It is a typical top view showing the shield material concerning one embodiment of the present invention. It is the sectional view on the AA line of the shield material of FIG. It is a typical top view which shows the alternative shape of the bump of the shielding material of FIG. It is a typical top view which shows the alternative shape different from FIG. 3A of the bump of the shielding material of FIG. FIG. 3 is a schematic plan view showing an alternative shape different from that of FIGS. 3A and 3B of the bump of the shield material of FIG. 1. FIG. 3 is a schematic plan view showing an alternative shape of the bump of the shield material of FIG. 1 different from that of FIGS. 3A to 3C. FIG. 3 is a schematic plan view showing an alternative shape different from that of FIGS. 3A to 3D of the bump of the shield material of FIG. It is typical sectional drawing which shows the manufacturing process of the shielding material of FIG. FIG. 4B is a schematic cross-sectional view showing the next step of FIG. 4A in the manufacturing process of the shield material of FIG. 1. FIG. 4B is a schematic cross-sectional view showing the next step of FIG. 4B in the manufacturing process of the shield material of FIG. 1. It is typical sectional drawing which shows the process following FIG. 4C in the manufacturing process of the shielding material of FIG. FIG. 4D is a schematic cross-sectional view showing the next step of FIG. 4D in the manufacturing process of the shield material of FIG. 1. It is a typical fragmentary sectional view which shows an electronic component provided with the shielding material of FIG. It is typical sectional drawing which shows the shielding material which concerns on embodiment different from the shielding material of FIG. It is a typical fragmentary sectional view which shows an electronic component provided with the shielding material of FIG. It is a typical top view which shows the shielding material which concerns on embodiment different from the shielding material of FIG. It is typical sectional drawing which shows the shielding material of FIG. It is typical sectional drawing which shows the adhesive sheet which concerns on one Embodiment of this invention. It is typical sectional drawing which shows the adhesive sheet of FIG.

[Description of Embodiment of the Present Invention]
First, embodiments of the present invention will be listed and described.

  A shielding material according to one embodiment of the present invention includes an insulating layer mainly composed of a synthetic resin, a conductor layer laminated on the back surface of the insulating layer, and a conductive adhesive layer laminated on the back surface of the conductor layer. 1 or a plurality of bumps, wherein the conductive adhesive layer is disposed on at least a part of the conductive region of the back surface of the conductor layer, and exhibits conductivity in the thickness direction, An adhesive layer filled in a region including at least the back surface of the periphery of the one or the plurality of bumps.

  In the shielding material, since the conductive adhesive layer has one or a plurality of bumps that exhibit conductivity in the thickness direction on at least a part of the conductive region on the back surface of the conductor layer, the conduction in the thickness direction of the conductive region is provided. Sex can be secured. In addition, the shield material has an adhesive layer in which the conductive adhesive layer is filled in a region including at least the back surface of one or a plurality of bumps, thereby increasing the adhesive force in the non-existing region of the bump. The mechanical adhesive strength can be improved, parasitic capacitance can be suppressed, and transmission loss can be reduced.

  The conductivity of the adhesive layer is preferably lower than the conductivity of the one or more bumps. Thus, when the conductivity of the adhesive layer is lower than the conductivity of the one or more bumps, the parasitic capacitance suppressing function can be promoted and the transmission loss can be further reduced.

  The adhesive layer may be filled in the entire thickness direction around the one or more bumps. As described above, the adhesive layer is filled in the entire thickness direction around one or a plurality of bumps, so that the mechanical adhesive strength can be easily and reliably improved. Moreover, according to this structure, it becomes easy to make an adhesive surface follow the surface shape of the adhesion | attachment object by the softness | flexibility of an adhesive bond layer, and, thereby, adhesiveness can further be improved.

  It is good to further comprise the film which is laminated | stacked around the said 1 or several bump among the back surfaces of the said conductor layer, and has a synthetic resin as a main component. Thus, by having a film mainly composed of synthetic resin around one or more bumps of the back surface of the conductor layer, flexible printing is achieved by this film and an adhesive layer laminated on the back surface side of the film. A cover lay of the wiring board can be formed, and the insulating properties other than the conductive region can be further enhanced.

  It further includes a release film laminated on the back surface of the conductive adhesive layer, and has a laminate including a conductive adhesive layer, a conductor layer, and an insulating layer in a plurality of regions on the surface of the release film. Good. Thus, by having the said laminated body in the several area | region of the surface of a release film, the said several laminated body can be laminated | stacked simultaneously on a flexible printed wiring board.

  The electronic component which concerns on 1 aspect of this invention is an electronic component provided with the flexible printed wiring board which has a conductive pattern, and the shielding material laminated | stacked on the 1 or several shield area | region among the surfaces of this flexible printed wiring board, The shield material is used as the shield material, and the shield material is arranged such that the bump is located in one or a plurality of conductive regions where a part of the conductive pattern is exposed in the shield region of the flexible printed wiring board. ing.

  Since the electronic component includes the shield material, the mechanical adhesive strength of the shield material and the flexible printed wiring board is improved and transmission loss is reduced while ensuring the conductivity in the thickness direction of the conductive region. Can do.

  The conductive pattern exposed in the conductive region of the flexible printed wiring board may be a ground wiring. As described above, since the conductive pattern exposed in the conductive region of the flexible printed wiring board is the ground wiring, electromagnetic noise can be easily and reliably blocked.

  The adhesive sheet which concerns on 1 aspect of this invention is an adhesive sheet used for joining of the shielding material to one or several shield area | regions among the surfaces of a flexible printed wiring board, Comprising: The release film and the surface of this release film A conductive adhesive layer laminated in a plurality of regions, wherein the conductive adhesive layer has one or more bumps that exhibit conductivity in a thickness direction, and a periphery of the one or more bumps. Of these, at least an adhesive layer filled on the surface of the release film.

  The adhesive sheet can improve the mechanical adhesive strength and reduce the transmission loss while ensuring the conductivity of the conductive region as described above.

  In the present invention, the “main component” means a component having the largest content, for example, a component having a content of 50% by mass or more, preferably 80% by mass or more, more preferably 90% by mass or more. Ingredients. “Back” means the adhesion target side of the shield material, and “front” means the opposite side. The “conductive region” refers to a region where the conductive pattern of the printed wiring board is exposed. “Bump” refers to a bump or protrusion.

[Details of the embodiment of the present invention]
Hereinafter, a shielding material, an adhesive sheet, and an electronic component according to an embodiment of the present invention will be described with reference to the drawings as appropriate.

[First embodiment]
<Shield material>
The shield material 1 shown in FIGS. 1 and 2 has flexibility. The shield material 1 is laminated on the shield region of the flexible printed wiring board in order to increase noise resistance. The shield material 1 has a planar shape corresponding to the shield region. The shield material 1 includes an insulating layer 2, a conductor layer 3, and a conductive adhesive layer 4.

(Insulating layer)
The insulating layer 2 contains a synthetic resin as a main component. Although it does not specifically limit as said synthetic resin, For example, a thermoplastic resin, a thermosetting resin, an ultraviolet curable resin etc. are mentioned. Examples of the thermoplastic resin include polypropylene, crosslinked polyethylene, polyester, polybenzimidazole, aramid resin, polyimide, polyimide amide, polyether imide, polyphenylene sulfide (PPS), polyethylene naphthalate (PEN), and the like. Examples of the thermosetting resin include phenol resin, acrylic resin, epoxy resin, melamine resin, silicone resin, and acrylic modified silicone resin. Examples of the ultraviolet curable resin include epoxy acrylate resins, polyester acrylates, and methacrylate-modified products thereof. The insulating layer 2 may have a multilayer structure in which a plurality of layers mainly composed of different synthetic resins are stacked.

  The lower limit of the average thickness of the insulating layer 2 is preferably 0.1 μm, and more preferably 0.5 μm. On the other hand, the upper limit of the average thickness of the insulating layer 2 is preferably 200 μm, and more preferably 100 μm. If the average thickness of the insulating layer 2 is less than the lower limit, the strength of the shielding material 1 may be insufficient. Conversely, if the average thickness of the insulating layer 2 exceeds the upper limit, the shield material 1 may become unnecessarily thick or the flexibility may be insufficient. The “average thickness” means an average value of measured values at arbitrary 10 points.

  The lower limit of the tensile strength of the insulating layer 2 is preferably 0.5 MPa, and more preferably 1 MPa. On the other hand, the upper limit of the tensile strength of the insulating layer 2 is preferably 30 MPa, and more preferably 20 MPa. If the tensile strength of the insulating layer 2 is less than the lower limit, the strength of the shield material 1 may be insufficient. Conversely, if the tensile strength of the insulating layer 2 exceeds the upper limit, the flexibility of the shield material 1 may be insufficient. The tensile strength of the insulating layer 2 is measured in accordance with JIS-K7127 (1999) “Plastics—Test method for tensile properties—Part 3: Test conditions for films and sheets”.

(Conductor layer)
The conductor layer 3 is laminated on the back surface of the insulating layer 2. The conductor layer 3 is a layer mainly composed of a metal or a metal compound. Examples of the metal forming the conductor layer 3 include nickel, copper, silver, aluminum, and gold. Moreover, as a metal compound which forms the conductor layer 3, electroconductive metal compounds like ITO are mentioned. The conductor layer 3 may be laminated on the back surface of the insulating layer 2 by using a known film forming technique such as vapor deposition, and a metal foil is used as the conductor layer 3 and coating or the like is applied to the surface of the conductor layer 3. The insulating layer 3 may be formed using the resin molding technique. Among these, the conductor layer 3 preferably includes a sintered layer of metal particles. Moreover, as an average particle diameter of this metal, it is 1 nm or more and 500 nm or less, for example. Furthermore, the conductor layer 3 may be filled with a plating metal in the gap of the sintered layer. In this way, by filling the voids in the sintered layer with the plating metal, it is possible to prevent the conductor layer 3 from peeling off due to the void portions in the sintered layer as a starting point of fracture. The conductor layer 3 is preferably elastically deformed when the shield material 1 is bent. However, in reality, when the bend radius of the shield material 1 is reduced, the conductor layer 3 causes composition deformation and minute cracks, The shield material 1 is provided with flexibility. The “average particle diameter” refers to the average particle diameter represented by the volume center diameter D50 of the particle size distribution of the copper particles in the dispersion.

  The lower limit of the average thickness of the conductor layer 3 is preferably 0.01 μm, more preferably 0.1 μm. On the other hand, as an upper limit of the average thickness of the conductor layer 3, 100 micrometers is preferable and 20 micrometers is more preferable. If the average thickness of the conductor layer 3 is less than the lower limit, it is relatively difficult to form a continuous layer in a plan view, and the conductor layer 3 may be easily broken. Conversely, when the average thickness of the conductor layer 3 exceeds the upper limit, the flexibility of the shield material 1 may be insufficient.

(Conductive adhesive layer)
The conductive adhesive layer 4 is laminated on the back surface of the conductor layer 3. The conductive adhesive layer 4 is bonded to the shield region of the flexible printed wiring board, and develops conductivity in the thickness direction in the conductive region X where a part of the conductive pattern is exposed in the shield region. The conductive adhesive layer 4 is disposed on at least a part of the conductive region X on the back surface of the conductor layer 3 and has one or more bumps 5 and one or more bumps 5 that exhibit conductivity in the thickness direction. , And an adhesive layer 6 filled in a region including at least the back surface. In the first embodiment, the adhesive layer 6 is filled in the entire thickness direction around the one or more bumps 5. That is, the conductive adhesive layer 4 includes one or a plurality of bumps 5 extending from the front surface to the back surface, and an adhesive layer 6 that fills a region other than the bumps 5. The shield material 1 can easily and reliably improve the mechanical adhesive strength by filling the adhesive layer 6 in the entire thickness direction around one or a plurality of bumps 5 in this way. Moreover, according to this structure, it becomes easy to make an adhesive surface follow the surface shape of the adhesion | attachment object by the softness | flexibility of the adhesive bond layer 6, and, thereby, the adhesiveness of the said shield material 1 can further be improved.

(bump)
The bump 5 contains conductive particles (hereinafter also referred to as “conductive particles”) and a binder thereof. The bump 5 is disposed only in the conductive adhesive layer 4 at a portion corresponding to the conductive region X of the flexible printed wiring board indicated by a one-dot chain line in FIG.

  The shape of the bump 5 in plan view is not particularly limited, and may be a polygonal shape, a cross shape, a star shape, or the like in addition to the circular shape shown in FIG. Also, the number of bumps 5 is not limited to four as shown in FIG. 1, but may be one as shown in FIG. 3A, for example. Furthermore, the arrangement pattern of the bumps 5 in a plan view can be appropriately designed according to the area and shape of the conductive region X, for example, a stripe shape in which a plurality of linear bumps 5 shown in FIG. A grid in which a plurality of linear bumps 5 shown in FIG. 3C intersect, a concentric circle consisting of a plurality of annular bumps 5 shown in FIG. 3D, and a dot-like bump 5 shown in FIG. 3E arranged in a grid. Although not shown, the dotted bumps 5 can be arranged in a zigzag pattern, etc., or these may be combined. Each of the above shapes has a region where the bump 5 is not formed in the conductive region X in plan view.

  The total area ratio of the bumps 5 in the conductive adhesive layer 4 is not particularly limited, but the lower limit of the total area ratio of the bumps 5 relative to the area of the conductive adhesive layer 4 is preferably 0.01%, 0.05% is more preferable. On the other hand, the upper limit of the total area ratio of the bumps 5 with respect to the area of the conductive adhesive layer 4 is preferably 2%, and more preferably 1.5%. If the total area ratio of the bumps 5 with respect to the area of the conductive adhesive layer 4 is less than the lower limit, the conductivity in the conductive region X may be insufficient. On the contrary, when the total area ratio of the bumps 5 with respect to the area of the conductive adhesive layer 4 exceeds the upper limit, the ratio of the adhesive layer 6 decreases and the mechanical adhesive strength of the conductive adhesive layer 4 may be reduced. There is. The total area ratio of the bumps 5 relative to the area of the conductive adhesive layer 4 is the sum of the exposed areas of the bumps 5 on the surface obtained by cutting the conductive adhesive layer 4 at the approximate center in the thickness direction. It is a numerical value divided by the planar view area of the agent layer 4 (including the bump 5).

  The total area ratio of the bumps 5 in the conductive region X is not particularly limited, but the lower limit of the total area ratio of the bumps 5 relative to the area of the conductive region X is preferably 0.1% and more preferably 1%. On the other hand, the upper limit of the total area ratio of the bumps 5 relative to the area of the conductive region X is preferably 80%, and more preferably 60%. If the total area ratio of the bumps 5 with respect to the area of the conductive region X is less than the lower limit, the conductivity in the conductive region X may be insufficient. On the contrary, if the total area ratio of the bumps 5 with respect to the area of the conductive region X exceeds the upper limit, the ratio of the adhesive layer 6 is decreased, and the mechanical adhesive strength of the conductive adhesive layer 4 may be reduced. The total area ratio of the bumps 5 in the conductive region X is the sum of the exposed areas of the bumps 5 on the surface obtained by cutting the conductive adhesive layer 4 at the approximate center in the thickness direction. It is a numerical value divided by (including bump 5).

  The central cross-sectional shape in the thickness direction of the conductive adhesive layer 4 of the bump 5 is a trapezoid. Specifically, the central vertical cross-sectional shape of the bump 5 has a bottom side that forms the back surface of the shield material 1 and a top side that contacts the conductor layer 3, and is reduced in width from the bottom side toward the top side. Yes. In other words, the top side is shorter than the bottom side, and the side connecting the top and the bottom is inclined. An adhesive layer 6 is laminated on the inclined side. Since the shield member 1 has a small length on the top side in contact with the conductor layer 3 in this way, the mechanical adhesive strength between the conductive adhesive layer 4 and the conductor layer 3 can be easily and reliably increased, It is possible to easily and reliably prevent delamination of the shield material 1.

  In the central longitudinal section, the lower limit of the ratio of the average length of the top to the average length of the bottom of the bump 5 is preferably 0.2, and more preferably 0.4. On the other hand, the upper limit of the ratio of the average length of the top side to the average length of the bottom side of the bump 5 is preferably 0.95, and more preferably 0.8. If the ratio of the average length of the top side to the average length of the bottom side is less than the lower limit, the average length of the bottom side becomes too large, and the filling amount of the adhesive filled around the bumps 5 is reduced. There is a possibility that the mechanical adhesive strength is lowered, or the average length of the top side is too small, and the conductivity with the conductor layer 3 is lowered. On the contrary, if the ratio of the average length of the top to the average length of the base exceeds the upper limit, the effect of preventing the bumps 5 from falling off may not be sufficiently obtained.

  In the central vertical cross-sectional shape, the average length of the bottom side of the bump 5 can be appropriately designed according to the adhesion area with the flexible printed wiring board, and can be set to 50 μm or more and 2000 μm or less, for example. On the other hand, the average length of the top sides of the bumps 5 can be appropriately designed in accordance with the adhesion area with the conductor layer 3 and the like, and can be, for example, 10 μm or more and 1900 μm or less. In addition, when there are a plurality of bumps 5, the average distance between the bumps 5 (the distance between the bottoms) can be, for example, 50 μm or more and 2000 μm or less. The average length of the bottom and top sides of the bump 5 means the average value of the base length and the top side length in the central vertical cross-sectional shape in which the bottom length of each bump 5 is minimum. The interval means an average value of minimum distances between adjacent bumps 5.

  As a minimum of the average height of bump 5, 10 micrometers is preferred and 15 micrometers is more preferred. On the other hand, the upper limit of the average height of the bumps 5 is preferably 80 μm, more preferably 60 μm, and even more preferably 45 μm. If the average height of the bumps 5 is less than the lower limit, it may be difficult to form the bumps 5. For example, when laminated on a flexible printed wiring board, the average height of the bumps 5 may be smaller than the thickness of the coverlay, and the conductive pattern and the conductor layer 3 may not be electrically connected. Conversely, if the average height of the bumps 5 exceeds the above upper limit, the thickness of the conductive adhesive layer 4 may become unnecessarily large.

(Conductive particles)
Examples of the material of the conductive particles contained in the bump 5 include silver, platinum, gold, copper, nickel, palladium, solder, and the like. These can be used alone or in combination of two or more. . Among these, silver powder, silver-coated copper powder, solder powder and the like exhibiting excellent conductivity are preferable.

  As a minimum of the content rate of electroconductive particle in bump 5, 20 volume% is preferred and 30 volume% is more preferred. On the other hand, as an upper limit of the content rate of the electroconductive particle in the bump 5, 70 volume% is preferable and 60 volume% is more preferable. If the content rate of electroconductive particle is less than the said minimum, there exists a possibility that the electroconductivity with a flexible printed wiring board and the conductor layer 3 may become inadequate. On the contrary, if the content of the conductive particles in the bump 5 exceeds the above upper limit, the binder is reduced, so that the formation of the bump 5 may be difficult, or the bump 5 may be broken during use to impair the conductivity. is there.

(binder)
Examples of the binder include an epoxy resin, a phenol resin, a polyester, a polyurethane, an acrylic resin, a melamine resin, a polyimide, and a polyamideimide, and one or more of these can be used. Among these, a thermosetting resin that can improve the heat resistance of the bump 5 is preferable, and an epoxy resin is particularly preferable.

  Examples of the epoxy resin used as the binder include bisphenol A type, F type, S type, AD type, copolymerized type of bisphenol A type and bisphenol F type, naphthalene type, novolac type, biphenyl type, dicyclopentadiene type, and the like. And phenoxy resin which is a polymer epoxy resin.

  The binder can be used by dissolving in a solvent. Examples of the solvent include ester-based, ether-based, ketone-based, ether-ester-based, alcohol-based, hydrocarbon-based, and amine-based organic solvents, and one or more of these are used. be able to. As will be described later, when the bump 5 is formed by printing a conductive slurry, it is preferable to use a high boiling point solvent excellent in printability, and specifically, carbitol acetate, butyl carbitol acetate or the like is used. Is preferred.

(Adhesive layer)
The adhesive that forms the adhesive layer 6 is not particularly limited as long as it has adhesiveness, and examples thereof include epoxy resins, polyimides, polyesters, phenol resins, polyurethanes, acrylic resins, melamine resins, and polyamideimides. From the viewpoint of heat resistance, a thermosetting resin is preferable, and from the viewpoint of adhesiveness with a flexible printed wiring board, an epoxy resin or an acrylic resin excellent in flexibility in addition to heat resistance is more preferable, and the bump 5 is formed. It is particularly preferable to use the same type of adhesive as the conductive slurry.

  The conductivity of the adhesive layer 6 is preferably lower than the conductivity of one or a plurality of bumps 5. The upper limit of the ratio of the conductivity of the adhesive layer 6 to the conductivity of one or a plurality of bumps 5 is preferably 1/10, and more preferably 1/100. Among these, it is particularly preferable that the adhesive layer 6 has an insulating property. Thus, by making the electrical conductivity of the adhesive layer 6 lower than the electrical conductivity of one or the plurality of bumps 5, the function of suppressing parasitic capacitance can be promoted, and the transmission loss can be further reduced. Moreover, according to this structure, the mechanical adhesive strength of the adhesive bond layer 6 can further be improved. The “conductivity of the adhesive layer” and the “conductivity of the bump” refer to the conductivity in the thickness direction of the adhesive layer and the bump. The “conductivity” is a value measured according to JIS-H0505: 1975.

  In order to make the electrical conductivity of the adhesive layer 6 lower than the electrical conductivity of one or a plurality of bumps 5, for example, the content of the conductive particles contained in the adhesive layer 6 is changed to the content of the conductive particles contained in the bumps 5. It may be lower than the rate. Moreover, as an upper limit of the content rate of the electroconductive particle contained in the adhesive bond layer 6 in this case, 10 volume% is preferable and 5 volume% is more preferable. Especially, it is preferable that the adhesive bond layer 6 does not contain electroconductive particle substantially. Since the adhesive layer 6 does not substantially contain conductive particles, the effect of reducing transmission loss and the effect of improving the mechanical adhesive strength of the adhesive layer 6 can be further promoted. “Substantially not contained” means that it is not actively added unless it is inevitably contained. For example, the content is 1% by mass or less, preferably 0.1% by mass. Hereinafter, it is more preferably 0.01% by mass or less. Moreover, the solvent, hardening | curing agent, adjuvant, etc. which were mentioned above can be added to the adhesive bond layer 6 suitably.

  The lower limit of the average thickness of the adhesive layer 6 is preferably 10 μm, and more preferably 15 μm. On the other hand, the upper limit of the average thickness of the adhesive layer 6 is preferably 80 μm, more preferably 50 μm, and even more preferably 30 μm. If the average thickness of the adhesive layer 6 is less than the above lower limit, the conductive adhesive layer 4 may not exhibit sufficient mechanical adhesive strength and electrical conductivity. Conversely, if the average thickness of the adhesive layer 6 exceeds the upper limit, the shield material 1 may be unnecessarily thick. The average thickness of the adhesive layer 6 means the average thickness of the adhesive layer 6 in a region where the bumps 5 do not exist in the thickness direction. Further, the average height of the bumps 5 may be larger than the average thickness of the adhesive layer 6. By making the average height of the bump 5 larger than the average thickness of the adhesive layer 6 and causing the bump 5 to protrude from the back surface of the adhesive layer 6, the conductivity of the conductive adhesive layer 4 can be improved. However, if the protruding length of the bump 5 is too large, the bonding area between the adhesive layer 6 and the flexible printed wiring board may be reduced and the mechanical adhesive strength may be reduced. The upper limit of the average height of 5 minus the average thickness of the adhesive layer 6 is preferably 20 μm, and more preferably 10 μm.

<Manufacturing method of shield material>
Next, a method for manufacturing the shield material 1 will be described with reference to FIGS. The manufacturing method of the shielding material 1 includes (a) a step of forming a first laminate 9 having a release film 7 and a conductive adhesive layer 4, and (b) a second having an insulating layer 2 and a conductor layer 3. A step of forming the laminated body 10; (c) a step of bonding the laminated body 9 and the laminated body 10; and (d) release from the laminated body 8 formed by bonding the laminated body 9 and the laminated body 10. And a step of peeling the film 7.

  In addition, as the first laminate forming step (a), a step of laminating a conductive slurry on a portion corresponding to at least a part of the conductive region X on one surface of the release film 7 by printing, The step of forming one or a plurality of bumps 5 by curing the conductive slurry and the step of forming the adhesive layer 6 so as to surround the bumps 5 in plan view. Hereinafter, each process is explained in full detail.

(Conductive slurry lamination process)
In the conductive slurry laminating step, as shown in FIG. 4A, a conductive slurry containing conductive particles and a binder thereof is laminated on one surface of the release film 7 so as to have a desired three-dimensional shape by printing. . The conductive slurry printing method is not particularly limited, and for example, screen printing, gravure printing, offset printing, flexographic printing, inkjet printing, dispenser printing, and the like can be used.

(Release film)
Examples of the material constituting the release film 7 include synthetic resin films such as polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, polyethylene terephthalate, rubber sheet, paper, cloth, non-woven fabric, and net. A suitable film-like body comprising a foamed sheet, a metal foil, a laminate of these, or the like can be used. Moreover, it is preferable to perform peeling treatment, such as a silicone treatment, a long-chain alkyl treatment, and a fluorine treatment, on one surface of the release film 7 as necessary in order to improve the peelability. The releasability of the release film 7 can be controlled by adjusting the type of chemical used in the release treatment or the coating amount thereof.

(Conductive slurry)
The conductive slurry for forming the bump 5 is a composition having conductivity by including conductive particles constituting the bump 5 and a binder, and the binder is not cured, and a pattern can be formed by a printing technique. What is necessary is just to have moderate fluidity and harden | cure in the bump formation process mentioned later. Therefore, as the conductive slurry, for example, those commercially available under names such as conductive paste, conductive ink, conductive paint, and conductive adhesive may be used.

  Further, a curing agent can be added to the conductive slurry. Examples of the curing agent include amine-based curing agents, polyaminoamide-based curing agents, acid and acid anhydride-based curing agents, basic active hydrogen compounds, tertiary aminos, and imidazoles.

  Furthermore, in addition to the component mentioned above, the electroconductive slurry may be added with auxiliary agents such as thickeners and leveling agents. The conductive slurry can be obtained by mixing each of the above components with, for example, a three-roller or a rotary stirring deaerator.

(Bump formation process)
In the bump forming step, the conductive slurry is made conductive by an appropriate method according to the type of binder of the conductive slurry laminated on one surface of the release film 7, for example, when the binder is a thermosetting resin, by heating. The bumps 5 are formed by curing the slurry. When the conductive slurry contains a solvent, the solvent is evaporated in this bump forming step.

(Adhesive layer forming process)
In the adhesive layer forming step, as shown in FIG. 4B, an adhesive is filled on one surface of the release film 7 on which the bumps 5 are formed, and an adhesive layer 6 that covers the periphery of the bumps 5 in plan view is formed. To do. Examples of the adhesive filling method in the adhesive layer forming step include a printing method and a coating method. The printing method is not particularly limited, and examples thereof include screen printing, gravure printing, offset printing, flexographic printing, inkjet printing, dispenser printing, and the like. Moreover, it does not specifically limit as said coating method, For example, a knife coat, a die coat, a roll coat etc. are mentioned. By this adhesive layer forming step, a first laminated body 9 having a two-layer structure in which the conductive adhesive layer 4 is laminated on one surface of the release film 7 is obtained.

(Second laminated body forming step)
In the second laminated body forming step, the insulating layer 2 and the conductor layer 3 are laminated as shown in FIG. 4C. As a method of laminating the insulating layer 2 and the conductor layer 3, for example, an ink containing metal particles is applied to the other surface of the insulating layer 2 and dried, followed by baking, or insulation on one surface of the metal foil. The method of apply | coating and hardening the resin composition which comprises the layer 3 is mentioned. By this second laminated body forming step, a second laminated body 10 having a two-layer structure in which the conductor layer 3 is laminated on the other surface of the insulating layer 2 is obtained.

(Lamination process)
In the bonding step, as shown in FIG. 4D, the first stacked body 9 and the second stacked body 10 are bonded together. In the bonding step, these laminates 9 and 10 are bonded so that one surface of the conductive adhesive layer 4 and the other surface of the conductor layer 3 face each other. By this bonding step, a laminate 8 in which the release film 7, the conductive adhesive layer 4, the conductor layer 3, and the insulating layer 2 are laminated in this order is obtained.

(Peeling process)
In the said peeling process, as shown to FIG. 4E, the release film 7 is peeled from the laminated body 8 obtained by the said bonding process. By this peeling process, the shielding material 1 shown in FIGS. 1 and 2 is obtained.

<Advantages>
In the shielding material 1, the conductive adhesive layer 4 has one or a plurality of bumps 5 that develop conductivity in the thickness direction on at least a part of the conductive region X on the back surface of the conductor layer 3. It is possible to ensure conductivity in the thickness direction. Further, the shield material 1 has the adhesive layer 6 in which the conductive adhesive layer 4 is filled in a region including at least the back surface of the periphery of one or a plurality of bumps 5. Adhesive strength can be increased to improve mechanical adhesive strength, parasitic capacitance can be suppressed, and transmission loss can be reduced. Furthermore, since the shield material 1 is formed in advance in a shape corresponding to the shield region of the flexible printed wiring board, unnecessary portions such as a shield material using an adhesive containing a conductive filler are cut off. There is no need to use it. Therefore, the said shielding material 1 can improve production efficiency and can suppress manufacturing cost.

<Electronic parts>
The electronic component 11 of FIG. 5 includes a flexible printed wiring board 12 having a conductive pattern 14, the shield material 1 laminated in one or a plurality of shield regions of the surface of the flexible printed wiring board 12, and the flexible printed wiring. It mainly includes semiconductor elements such as LEDs and elements (not shown) such as ICs and switches mounted on the board 12.

(Flexible printed wiring board)
The flexible printed wiring board 12 includes a base film 13, a conductive pattern 14 that is laminated on the surface of the base film 13, and a coverlay 15 that is laminated on the surfaces of the base film 13 and the conductive pattern 14. The flexible printed wiring board 12 has one or a plurality of conductive regions X in which a part of the conductive pattern 14 is exposed when the cover lay 15 is opened. FIG. 5 illustrates a region where the elements of the flexible printed wiring board 12 are not mounted, but the flexible printed wiring board 12 is provided on the surface side in a region where the elements outside the figure are mounted. And a land to which the element is connected, and a through hole for connecting the land to the conductive pattern on the back surface side.

  The base film 13 is composed of a sheet-like member having flexibility and insulation. Specifically, a resin film can be adopted as the base film 13. As a material for this resin film, for example, polyimide, polyethylene terephthalate or the like is preferably used.

  As a minimum of average thickness of base film 13, 5 micrometers is preferred and 10 micrometers is more preferred. On the other hand, the upper limit of the average thickness of the base film 13 is preferably 150 μm, and more preferably 50 μm. If the average thickness of the base film 13 is less than the lower limit, the strength of the base film 13 may be insufficient. Conversely, if the average thickness of the base film 13 exceeds the upper limit, the electronic component 11 may be unnecessarily thick.

  The conductive pattern 14 is formed in a desired planar shape (pattern) by etching the metal layer laminated on the base film 13. The conductive pattern 14 can be formed of a conductive material, but is generally formed of copper, for example.

  The method for laminating the metal layer on the base film 13 is not particularly limited. For example, an adhesion method in which a metal foil is bonded with an adhesive, a casting method in which a resin composition that is a material of the base film 13 is applied on the metal foil, A sputtering / plating method in which a metal layer is formed by electrolytic plating on a thin conductive layer (seed layer) having a thickness of several nanometers formed on the base film 10 by sputtering or vapor deposition, and a laminating method in which a metal foil is attached by hot pressing. Etc. can be used.

  As a minimum of average thickness of conductive pattern 14, 2 micrometers is preferred and 5 micrometers is more preferred. On the other hand, the upper limit of the average thickness of the conductive pattern 14 is preferably 50 μm and more preferably 20 μm. If the average thickness of the conductive pattern 14 is less than the above lower limit, the conductivity may be insufficient. Conversely, if the average thickness of the conductive pattern 14 exceeds the upper limit, the electronic component 11 may be unnecessarily thick.

  The coverlay 15 has an insulating function and an adhesive function. The coverlay 15 has a two-layer structure of an adhesive layer 15a laminated on the surfaces of the base film 13 and the conductive pattern 14 and an insulating layer 15b laminated on the surface of the adhesive layer 15a.

  Although it does not specifically limit as an adhesive agent which comprises the adhesive bond layer 15a, The thing excellent in the softness | flexibility and heat resistance is preferable, for example, various resins, such as a nylon resin, an epoxy resin, a butyral resin, an acrylic resin System adhesives. Although it does not specifically limit as average thickness of the adhesive bond layer 15a, 20 micrometers or more and 30 micrometers or less are preferable. If the average thickness of the adhesive layer 15a is less than the lower limit, the adhesiveness may be insufficient. Conversely, if the average thickness of the adhesive layer 15a exceeds the above upper limit, the flexibility of the flexible printed wiring board 12 may be insufficient.

  The insulating layer 15b is composed mainly of synthetic resin. The main component of the insulating layer 15b is not particularly limited, and can be the same as the main component of the base film 13. As a minimum of average thickness of insulating layer 15b, 5 micrometers is preferred and 10 micrometers is more preferred. On the other hand, the upper limit of the average thickness of the insulating layer 15b is preferably 60 μm, and more preferably 40 μm. If the average thickness of the insulating layer 15b is less than the lower limit, the insulating property may be insufficient. Conversely, if the average thickness of the insulating layer 15b exceeds the above upper limit, the flexibility of the flexible printed wiring board 12 may be insufficient.

  The conductive pattern 14 exposed in the conductive region X of the flexible printed wiring board 12 is preferably a ground wiring. Thus, when the conductive pattern 14 exposed in the conductive region X of the flexible printed wiring board 12 is a ground wiring, electromagnetic noise can be easily and reliably blocked by the shield material 1.

  The opening may be formed before the cover lay 15 is laminated on the base film 13 and the conductive pattern 14, or may be formed by a laser or the like after the cover lay 15 is laminated on the base film 13 and the conductive pattern 14. Good. Moreover, the planar shape and size of the opening are not particularly limited as long as the openings can be mechanically and electrically connected by the conductive adhesive layer 4, and can be, for example, circular or rectangular.

(Shield material)
The shield material 1 is arranged such that the bumps 5 are located in one or a plurality of conductive regions X where a part of the conductive pattern 14 is exposed in the shield region of the flexible printed wiring board 12.

<Method for manufacturing electronic parts>
In the manufacturing method of the electronic component 11, the shield material 1 is disposed so that the bump 5 is located in one or a plurality of conductive regions X where a part of the conductive pattern 14 is exposed in the shield region of the flexible printed wiring board 12. A step of thermocompression bonding the shield material 1 and the flexible printed wiring board 12 after the arrangement step, and a step of connecting the element to the conductive pattern exposed in a region other than the shield region.

  The heating temperature in the thermocompression bonding step is preferably 120 ° C. or higher and 200 ° C. or lower, and the heating time is preferably 5 seconds or longer and 120 minutes or shorter. By setting the heating temperature and the heating time in the above ranges, the adhesiveness can be effectively exhibited and the deterioration of the base film 13 and the like can be suppressed. It does not specifically limit as a heating method, For example, it can heat using heating means, such as oven and a hotplate.

<Advantages>
Since the electronic component 11 includes the shield material 1, the adhesive strength between the shield material 1 and the flexible printed wiring board 12 is improved and transmission loss is reduced while ensuring the conductivity in the thickness direction of the conductive region X. Can be small. Moreover, since the said shielding material 1 is previously formed so that the said electronic component 11 may be located in the electroconductive area X where a part of conductive pattern 14 exposes, the adhesive agent containing the conventional electroconductive filler Since there is no need to cut off unnecessary portions of the shield material as in the case of using a shield material having the above, production efficiency can be improved and manufacturing cost can be suppressed.

[Second Embodiment]
The shield material 21 in FIG. 6 has flexibility. The shield material 21 is laminated on the shield region of the flexible printed wiring board in order to increase noise resistance. The shield material 21 has a planar shape corresponding to the shield region. The shield material 21 includes an insulating layer 2, a conductor layer 3, and a conductive adhesive layer 22. The shield material 21 is the same as the shield material 1 of FIGS. 1 and 2 except for the configuration of the conductive adhesive layer 22. Therefore, only the conductive adhesive layer 22 will be described below. The bumps 5 constituting the conductive adhesive layer 22 are the same as the shield material 1 in FIGS.

(Conductive adhesive layer)
The conductive adhesive layer 22 is laminated around one or a plurality of bumps 5 in the conductor layer 3, and includes a film 22 a having a synthetic resin as a main component and a back surface among the one or a plurality of bumps 5. And an adhesive layer 22b filled therein. That is, the non-existence region of the bump 5 in the conductive adhesive layer 22 has a two-layer structure of a film 22a laminated on the conductor layer 3 side and an adhesive layer 22b laminated on the back surface of the film 22a. . The film 22a and the adhesive layer 22b constitute a cover lay of the flexible printed wiring board in a state where the shield material 22 is laminated on the flexible printed wiring board.

(the film)
The film 22a has an insulating property. The main component of the film 22a is not particularly limited as long as it has insulating properties. For example, the same resin as the insulating layer 15b constituting the cover lay 15 of FIG. As a minimum of average thickness of film 22a, 5 micrometers is preferred and 10 micrometers is more preferred. On the other hand, the upper limit of the average thickness of the film 22a is preferably 60 μm, and more preferably 40 μm. If the average thickness of the film 22a is less than the above lower limit, the insulation may be insufficient. On the contrary, when the average thickness of the film 22a exceeds the above upper limit, the flexibility may be insufficient.

(Adhesive layer)
As a main component of the adhesive layer 22b, for example, epoxy resin, polyimide, polyester, phenol resin, polyurethane, acrylic resin, melamine resin, polyamideimide and the like can be mentioned, and a thermosetting resin is preferable from the viewpoint of heat resistance, From the viewpoint of adhesion to the flexible printed wiring board, an epoxy resin or an acrylic resin that is excellent in flexibility in addition to heat resistance is more preferable, and it is particularly preferable to use the same type of adhesive as the conductive slurry forming the bumps 5.

  Although it does not specifically limit as average thickness of the adhesive bond layer 22b, 20 micrometers or more and 30 micrometers or less are preferable. If the average thickness of the adhesive layer 22b is less than the lower limit, the adhesiveness may be insufficient. Conversely, if the average thickness of the adhesive layer 22b exceeds the above upper limit, the flexibility may be insufficient.

  As a minimum of total average thickness of film 22a and adhesive layer 22b, 25 micrometers is preferred and 40 micrometers is more preferred. On the other hand, the upper limit of the total average thickness is preferably 80 μm, and more preferably 60 μm. If the total average thickness is less than the lower limit, the thickness of the cover lay of the flexible printed wiring board becomes insufficient, and the protective function of the flexible printed wiring board may not be sufficiently obtained. Conversely, if the total average thickness exceeds the upper limit, the shield material 21 may be unnecessarily thick.

  As a manufacturing method of the conductive adhesive layer 22, for example, a step of laminating a conductive slurry on a portion corresponding to at least a part of the conductive region X on one side of the release film by printing, and a laminated conductive slurry The step of forming one or a plurality of bumps 5, the step of forming an adhesive layer 22 b on one surface of the release film so as to surround the bumps 5 in plan view, and the adhesive layer 22 b And laminating the film 22a on one surface.

<Advantages>
As described above for the shield material 1 in FIGS. 1 and 2, the shield material 21 can improve the mechanical adhesion strength and reduce the transmission loss while ensuring the conductivity of the conductive region X. . Further, since the shield material 21 is formed by laminating a film 22a mainly composed of a synthetic resin around one or a plurality of bumps 5 on the back surface of the conductor layer 3, the film 22a and the back surface of the film 22a The cover layer of the flexible printed wiring board can be constituted by the laminated adhesive layer 22b, and the insulating properties other than the conductive region X can be further enhanced.

<Electronic parts>
Next, an electronic component 31 including the shield material 21 will be described with reference to FIG. The electronic component 31 includes a base film 13, a conductive pattern 14 laminated on the surface of the base film, and the shield material 21 laminated on the surfaces of the base film 13 and the conductive pattern 14. In the electronic component 31, the conductive adhesive layer 22 of the shield material 21 is laminated on the surfaces of the base film 13 and the conductive pattern 14. Thereby, the film 22a of the shield material 21 functions in the same manner as the insulating layer 15b of the electronic component 11 of FIG. 5, and the adhesive layer 22b of the shield material 21 and the adhesive layer 15a of the electronic component 11 of FIG. Works in the same way. In addition, the electronic component 31 is arranged such that the bump 5 is located in one or a plurality of conductive regions X where a part of the conductive pattern 14 is exposed in the shield region of the flexible printed wiring board. The base film 13 and the conductive pattern 14 in the electronic component 21 are the same as those of the electronic component 11 in FIG.

<Advantages>
In addition to the above-described effects described for the electronic component 11, the electronic component 31 includes the film 22 a and the adhesive layer 22 b of the shield material 21 that form a cover lay of a flexible printed wiring board. Simplification of the process can be promoted to reduce manufacturing costs, and thinning can be promoted.

[Third embodiment]
<Shield material>
The shield material 41 of FIGS. 8 and 9 is laminated on the back surface of the plurality of laminated bodies 43 including the conductive adhesive layer 4, the conductor layer 3 and the insulating layer 2, and the conductive adhesive layer 4 of the plurality of laminated bodies 43. The release film 42 is provided. That is, the shield material 41 in FIGS. 8 and 9 has a laminate 43 including the conductive adhesive layer 4, the conductor layer 3, and the insulating layer 2 in a plurality of regions on the surface of the release film 42. 8 and 9 is used for laminating two laminated bodies 43 on a plurality of flexible printed wiring boards each having a shape P indicated by a two-dot chain line. The conductive adhesive layer 4, the conductor layer 3, and the insulating layer 2 are the same as those of the shield material 1 in FIGS. Moreover, as a material which comprises the release film 42, it can be made to be the same as that of the material which comprises the release film 7 of the shielding material 8 of FIG. 4D.

<Advantages>
Since the shield material 41 has the laminate 43 in a plurality of regions on the surface of the release film 42, the plurality of laminates 43 can be laminated on the flexible printed wiring board at the same time. In addition, the shield material 41 is formed by previously forming a plurality of laminated bodies 43 in accordance with the shape of the object to be bonded, so that it is not necessary to cut out unnecessary areas, so that production efficiency can be increased and manufacturing costs can be reduced. Can do.

[Fourth embodiment]
<Adhesive sheet>
The adhesive sheet 51 of FIGS. 10 and 11 is used for joining a shield material to one or a plurality of shield regions on the surface of the flexible printed wiring board. The adhesive sheet 51 includes a release film 42 and a conductive adhesive layer 4 laminated in a plurality of regions on the surface of the release film 42. In addition, the conductive adhesive layer 4 is an adhesive that fills at least the surface of the release film 71 out of the periphery of the one or more bumps 5 that express conductivity in the thickness direction and the one or more bumps 5. Layer 6. That is, the adhesive sheet 51 has a shape obtained by removing the insulating layer 2 and the conductor layer 3 from the shield material 41 of FIGS.

<Advantages>
The adhesive sheet 51 can easily manufacture the shield material 41 of FIGS. 8 and 9 by laminating a conductive layer and an insulating layer in this order on the surface of the conductive adhesive layer 4. Therefore, the adhesive sheet 51 is used for joining the conductive layer and the insulating layer to the flexible printed wiring board, thereby improving the mechanical adhesive strength while ensuring the conductivity of the conductive region X and reducing transmission loss. Can be small. Moreover, since the said adhesive sheet 51 can obtain the shield material 41 of FIG.8 and FIG.9 easily, the several laminated body which has the conductive adhesive layer 4, a conductive layer, and an insulating layer is laminated | stacked on a flexible printed wiring board simultaneously. In addition, the production efficiency of electronic parts can be increased and the manufacturing cost can be reduced.

[Other Embodiments]
The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is not limited to the configuration of the embodiment described above, but is defined by the scope of the claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of the claims. The

  For example, the shield material does not necessarily have flexibility. Moreover, the said shielding material may have one laminated body containing a conductive adhesive layer, a conductor layer, and an insulating layer on the surface of a release film. That is, for example, the laminate 8 illustrated in FIG. 4D is also included in the shield material.

  When the shield material has a plurality of laminates on the surface of the release film, the plurality of laminates may be composed of, for example, the conductive adhesive layer 22, the conductor layer 3, and the insulating layer 2 of FIG. Moreover, a some laminated body may be comprised from a different material and shape.

  The planar shape of the shield material is not limited to that of the above embodiment, and can be any shape depending on the shape of the printed wiring board to be bonded. Moreover, the said shielding material may be used with the printed wiring board which does not have flexibility.

  The conductive adhesive layer does not necessarily have a single-layer structure composed of only an adhesive layer or a two-layer structure composed of an adhesive layer and a film, and the surface of the adhesive layer filled in a region including the back surface. You may have another resin layer etc. in the side.

  The bump may have a shape in which the width on the side in contact with the release film is small and the width on the side in contact with the conductor layer is large. Furthermore, the bump may be a laminate of a plurality of bumps in the thickness direction of the shield material.

  The central cross-sectional shape in the thickness direction of the conductive adhesive layer of the bump is not limited to a strict trapezoid as in the above embodiment.For example, the trapezoidal shape in which the top of the trapezoid is an arc, or the bottom and the top are A trapezoidal shape that is non-parallel may be used. It is also possible to adopt semicircular shapes other than trapezoids, triangles, rectangles, constricted shapes whose width decreases toward the central portion in the height direction, barrel shapes whose width increases toward the central portion in the height direction, etc. It is.

  Further, in the conductive adhesive layer, it is possible to adopt a shape in which the bump does not appear on the back surface. For example, even if there is an adhesive layer on the back surface of the bump, the adhesive on the back surface of the bump is pushed out by the pressure contact force when the shield material is bonded to the flexible printed circuit board, and the bump is The conductive pattern can be contacted.

  As described above, the shield material and the adhesive sheet of the present invention can improve the mechanical adhesive strength and reduce the transmission loss while ensuring the conductivity of the conductive region. Suitable for being stacked in a region. Further, the electronic component of the present invention is suitable as a component of an electronic device that is required to be thin, for example.

1, 2, 41 Shield material 2 Insulating layer 3 Conductive layer 4 Conductive adhesive layer 5 Bump 6 Adhesive layer 7, 42 Release film 8, 9, 10, 43 Laminate 11, 31 Electronic component 12 Flexible printed wiring board 13 Base film 14 Conductive pattern 15 Coverlay 15a Adhesive layer 15b Insulating layer 22 Conductive adhesive layer 22a Film 22b Adhesive layer 51 Adhesive sheet X Conductive region P Shape of flexible printed wiring board

Claims (7)

An insulating layer mainly composed of synthetic resin;
A conductor layer laminated on the back surface of the insulating layer;
A conductive adhesive layer laminated on the back surface of the conductor layer,
The conductive adhesive layer is
One or a plurality of bumps disposed on at least a part of the conductive region of the back surface of the conductor layer and exhibiting conductivity in the thickness direction;
Possess an adhesive layer which is filled in a region including at least the back surface of the periphery of the one or more bumps,
The stacked around the one or more bumps of the rear surface of the conductive layer, shielding material Ru further comprising a film of a synthetic resin as a main component.   The shield material according to claim 1, wherein the adhesive layer has a conductivity lower than that of the one or the plurality of bumps.   The shielding material according to claim 1 or 2, wherein the adhesive layer is filled in the entire thickness direction around the one or the plurality of bumps. Further comprising a release film laminated on the back surface of the conductive adhesive layer,
The shield material according to claim 1 , wherein the shield material has a laminate including a conductive adhesive layer, a conductor layer, and an insulating layer in a plurality of regions on the surface of the release film. A flexible printed wiring board having a conductive pattern;
An electronic component comprising: a shield material laminated on one or a plurality of shield regions of the surface of the flexible printed wiring board;
The shield material according to any one of claims 1 to 3 is used as the shield material.
An electronic component in which the shield material is disposed so that the bump is located in one or a plurality of conductive regions where a part of the conductive pattern is exposed in a shield region of the flexible printed wiring board. The electronic component according to claim 5 , wherein the conductive pattern exposed in the conductive region of the flexible printed wiring board is a ground wiring. An adhesive sheet used for joining a shield material to one or a plurality of shield regions of the surface of a flexible printed wiring board,
A release film,
A conductive adhesive layer laminated on a plurality of regions on the surface of the release film,
The conductive adhesive layer is
One or more bumps that develop conductivity in the thickness direction;
Possess an adhesive layer which is filled at least on the surface of the release film of the periphery of the one or more bumps,
Stacked around the one or more bumps in the surface of the adhesive layer, further adhesive sheet Ru with a film of a synthetic resin as a main component.

Images