TWI782213B - Electromagnetic wave shielding film, manufacturing method of shielding printed wiring board, and shielding printed wiring board - Google Patents
Electromagnetic wave shielding film, manufacturing method of shielding printed wiring board, and shielding printed wiring board Download PDFInfo
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- TWI782213B TWI782213B TW108121497A TW108121497A TWI782213B TW I782213 B TWI782213 B TW I782213B TW 108121497 A TW108121497 A TW 108121497A TW 108121497 A TW108121497 A TW 108121497A TW I782213 B TWI782213 B TW I782213B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
本發明之課題係提供一種用以製造接地電路-屏蔽層間之連接電阻非常小之屏蔽印刷配線板之電磁波屏蔽膜。 一種電磁波屏蔽膜,特徵在於:其係由保護層、積層於上述保護層之屏蔽層及積層於上述屏蔽層之接著劑層構成;於上述屏蔽層之上述接著劑層側形成有導電性凸塊,上述導電性凸塊之體積為30000~400000μm3 。The object of the present invention is to provide an electromagnetic wave shielding film for manufacturing a shielded printed wiring board in which the connection resistance between the ground circuit and the shielding layer is very small. An electromagnetic wave shielding film, characterized in that: it is composed of a protective layer, a shielding layer laminated on the protective layer, and an adhesive layer laminated on the shielding layer; a conductive bump is formed on the adhesive layer side of the shielding layer , the volume of the above-mentioned conductive bump is 30,000~400,000 μm 3 .
Description
本發明係關於電磁波屏蔽膜、屏蔽印刷配線板之製造方法、及屏蔽印刷配線板。The present invention relates to an electromagnetic wave shielding film, a manufacturing method of a shielded printed wiring board, and a shielded printed wiring board.
背景技術 可撓性印刷配線板在小型化、高功能化急速進展之行動電話、照相機、筆記型電腦等電子設備中,經常被使用來於複雜的機構中建立電路。進而,活用其優異之可撓性,亦被利用於印表機打印頭等可動部與控制部之連接上。於此等電子設備中需要電磁波屏蔽對策,就連在裝置內使用之可撓性印刷配線板,也是採用已黏貼電磁波屏蔽膜等已施行電磁波屏蔽對策之可撓性印刷配線板(以下亦記載為「屏蔽印刷配線板」)。Background technique Flexible printed wiring boards are often used to build circuits in complex mechanisms in electronic devices such as mobile phones, cameras, and notebook computers that are rapidly progressing in miniaturization and high functionality. Furthermore, by taking advantage of its excellent flexibility, it is also used in the connection of movable parts such as print heads and control parts of printers. Electromagnetic wave shielding countermeasures are required in these electronic devices, and even the flexible printed wiring board used in the device is a flexible printed wiring board (hereinafter also described as "shielded printed wiring board").
一般而言,電磁波屏蔽膜係由最外層之絕緣層(保護層)、用以屏蔽電磁波之屏蔽層、及用以黏貼於印刷配線板之接著劑層構成。 於製造屏蔽印刷配線板時,以電磁波屏蔽膜之接著劑層接觸可撓性印刷配線板之方式,將電磁波屏蔽膜黏貼於可撓性印刷配線板。Generally speaking, the electromagnetic wave shielding film is composed of the outermost insulating layer (protective layer), the shielding layer for shielding electromagnetic waves, and the adhesive layer for sticking to the printed wiring board. When manufacturing the shielded printed wiring board, the electromagnetic wave shielding film is pasted on the flexible printed wiring board in such a way that the adhesive layer of the electromagnetic wave shielding film contacts the flexible printed wiring board.
又,可撓性印刷配線板之接地電路會與殼體等的外部接地電性連接,但亦可經由黏貼於可撓性印刷配線板之電磁波屏蔽膜而將印刷配線板之接地電路與外部接地電性連接。In addition, the grounding circuit of the flexible printed wiring board is electrically connected to the external grounding of the casing, etc., but it is also possible to connect the grounding circuit of the printed wiring board to the external grounding through the electromagnetic wave shielding film pasted on the flexible printed wiring board electrical connection.
例如於專利文獻1中,將電磁波屏蔽膜之接著劑層設為導電性接著劑,使該導電性接著劑與可撓性印刷配線板之接地電路接觸,進而使接著劑層與外部接地連接,藉此將可撓性印刷配線板之接地電路與外部接地電性連接。For example, in
先行技術文獻 專利文獻 專利文獻1:日本特開2004-095566號公報Prior art literature patent documents Patent Document 1: Japanese Patent Laid-Open No. 2004-095566
發明概要
發明欲解決之課題
專利文獻1所記載之電磁波屏蔽膜之導電性接著劑層係由接著性樹脂與導電性填料構成,導電性接著劑層之導電性係得自於導電性填料。
即,導電性接著劑層與接地電路之電性接觸係藉由導電性填料與接地電路之接觸而獲得。於導電性接著劑與接地電路之接觸面亦有不存在導電性填料之部分。正因有如此部分,故有接地電路-屏蔽層間之連接電阻變高之問題。Summary of the invention
The problem to be solved by the invention
The conductive adhesive layer of the electromagnetic wave shielding film described in
本發明係鑑於上述問題而完成者,本發明之目的在於提供一種用以製造接地電路-屏蔽層間之連接電阻非常小之屏蔽印刷配線板之電磁波屏蔽膜。The present invention was made in view of the above problems, and an object of the present invention is to provide an electromagnetic wave shielding film for manufacturing a shielded printed wiring board with a very small connection resistance between a ground circuit and a shielding layer.
用以解決課題之手段 本發明之電磁波屏蔽膜,特徵在於:其係由保護層、積層於上述保護層之屏蔽層及積層於上述屏蔽層之接著劑層構成;於上述屏蔽層之上述接著劑層側形成有導電性凸塊,上述導電性凸塊之體積為30000~400000μm3 。Means for Solving the Problems The electromagnetic wave shielding film of the present invention is characterized in that it is composed of a protective layer, a shielding layer laminated on the protective layer, and an adhesive layer laminated on the shielding layer; the adhesive layer on the shielding layer Conductive bumps are formed on the layer side, and the volume of the conductive bumps is 30,000 to 400,000 μm 3 .
本發明之電磁波屏蔽膜係黏貼於印刷配線板,該印刷配線板具備基底膜、包含形成於基底膜上之接地電路之印刷電路、及覆蓋印刷電路之覆蓋膜,且於覆蓋膜形成有使接地電路露出之開口部。The electromagnetic wave shielding film of the present invention is bonded to a printed wiring board. The printed wiring board has a base film, a printed circuit including a ground circuit formed on the base film, and a cover film covering the printed circuit. The opening where the circuit is exposed.
此時,導電性凸塊貫穿接著劑層而與接地電路接觸。 於此,本發明之電磁波屏蔽膜中,上述導電性凸塊之體積為30000~400000μm3 。 若導電性凸塊之體積在上述範圍內,導電性凸塊牢固地接觸接地電路,接地電路-屏蔽層間之連接電阻變小。 若導電性凸塊之體積小於30000μm3 ,導電性凸塊難以接觸接地電路,接地電路-屏蔽層間之連接電阻容易變大。 若導電性凸塊之體積超過400000μm3 ,導電性凸塊於接著劑層中所占之比率變大。 因為具有接著劑層之區域整體的相對介電常數及介電損耗正切容易變高,故傳送特性會惡化。At this time, the conductive bump penetrates the adhesive layer and contacts the ground circuit. Here, in the electromagnetic wave shielding film of the present invention, the volume of the conductive bumps is 30,000 to 400,000 μm 3 . If the volume of the conductive bump is within the above range, the conductive bump will firmly contact the ground circuit, and the connection resistance between the ground circuit and the shielding layer will be reduced. If the volume of the conductive bump is less than 30000 μm 3 , it is difficult for the conductive bump to contact the grounding circuit, and the connection resistance between the grounding circuit and the shielding layer tends to increase. When the volume of the conductive bump exceeds 400,000 μm 3 , the ratio of the conductive bump to the adhesive layer increases. Since the relative permittivity and dielectric loss tangent of the entire region having the adhesive layer tend to become high, transmission characteristics deteriorate.
於本發明之電磁波屏蔽膜中,上述導電性凸塊之形狀宜為錐體狀。 若導電性凸塊之形狀為錐體狀,則導電性凸塊容易貫穿接著劑層而容易與接地電路接觸。 因此,接地電路-屏蔽層間之連接電阻會充分變小。In the electromagnetic wave shielding film of the present invention, the shape of the above-mentioned conductive bump is preferably a cone shape. If the shape of the conductive bump is tapered, the conductive bump can easily penetrate through the adhesive layer and be in contact with the ground circuit. Therefore, the connection resistance between the ground circuit and the shield layer can be sufficiently reduced.
於本發明之電磁波屏蔽膜中,宜形成有複數個上述導電性凸塊。 進而,複數個上述導電性凸塊之高度宜大致相同。 若複數個導電性凸塊之高度大致相同,則複數個導電性凸塊容易均等地貫穿接著劑層而容易與接地電路接觸。 因此,可減低接地電路-屏蔽層間之連接電阻。In the electromagnetic wave shielding film of the present invention, a plurality of the above-mentioned conductive bumps are preferably formed. Furthermore, the heights of the plurality of conductive bumps are preferably approximately the same. If the heights of the plurality of conductive bumps are substantially the same, the plurality of conductive bumps can easily penetrate the adhesive layer evenly and be in contact with the ground circuit. Therefore, the connection resistance between the ground circuit and the shielding layer can be reduced.
於本發明之電磁波屏蔽膜中,上述導電性凸塊亦可由樹脂組成物與導電性填料構成。 即,導電性凸塊亦可由導電性糊料構成。 藉由使用導電性糊料,可於任意位置以任意形狀輕易地形成導電性凸塊。In the electromagnetic wave shielding film of the present invention, the above-mentioned conductive bumps may also be composed of a resin composition and a conductive filler. That is, the electroconductive bump may also consist of electroconductive paste. By using the conductive paste, conductive bumps can be easily formed in arbitrary positions and in arbitrary shapes.
於本發明之電磁波屏蔽膜中,構成上述接著劑層之樹脂在頻率1GHz、23℃下之相對介電常數宜為1~5,介電損耗正切宜為0.0001~0.03。 若為上述範圍,可使得利用本發明之電磁波屏蔽膜製造之屏蔽印刷配線板之傳送特性提高。In the electromagnetic wave shielding film of the present invention, the relative permittivity of the resin constituting the above-mentioned adhesive layer at a frequency of 1 GHz and 23°C is preferably 1-5, and the dielectric loss tangent is preferably 0.0001-0.03. If it is the said range, the transmission characteristic of the shielded printed wiring board manufactured using the electromagnetic wave shielding film of this invention can be improved.
於本發明之電磁波屏蔽膜中,上述接著劑層宜為絕緣性接著劑層。 又,本發明之電磁波屏蔽膜藉由接著劑層接著於印刷配線板。 上述接著劑層為絕緣性接著劑層時,絕緣性接著劑層由於不含導電性填料等導電性物質,故相對介電常數及介電損耗正切會充分變小。 因此,使用本發明之電磁波屏蔽膜製成之屏蔽印刷配線板,傳送特性會變良好。In the electromagnetic shielding film of the present invention, the above-mentioned adhesive layer is preferably an insulating adhesive layer. Moreover, the electromagnetic wave shielding film of this invention is adhere|attached to a printed wiring board via an adhesive agent layer. When the above-mentioned adhesive layer is an insulating adhesive layer, since the insulating adhesive layer does not contain conductive substances such as conductive fillers, the relative permittivity and dielectric loss tangent are sufficiently small. Therefore, the shielded printed wiring board manufactured using the electromagnetic wave shielding film of this invention becomes favorable in transmission characteristics.
本發明之屏蔽印刷配線板之製造方法,其特徵在於包含:電磁波屏蔽膜準備步驟,係準備上述本發明之電磁波屏蔽膜;印刷配線板準備步驟,係準備印刷配線板,該印刷配線板具備基底膜、包含形成於上述基底膜上之接地電路之印刷電路、及覆蓋上述印刷電路之覆蓋膜,且於上述覆蓋膜形成有使上述接地電路露出之開口部;電磁波屏蔽膜配置步驟,係以上述電磁波屏蔽膜之接著劑層與上述印刷配線板之覆蓋膜接觸之方式,於上述印刷配線板配置上述電磁波屏蔽膜;及加壓步驟,係進行加壓以使上述電磁波屏蔽膜之導電性凸塊貫穿上述電磁波屏蔽膜之接著劑層而與上述印刷配線板之接地電路接觸。The manufacturing method of the shielded printed wiring board of the present invention is characterized in that it comprises: an electromagnetic wave shielding film preparation step, which is to prepare the above electromagnetic wave shielding film of the present invention; a printed wiring board preparation step, which is to prepare a printed wiring board, and the printed wiring board has a substrate film, a printed circuit including a ground circuit formed on the above-mentioned base film, and a cover film covering the above-mentioned printed circuit, and an opening for exposing the above-mentioned ground circuit is formed on the above-mentioned cover film; the step of arranging the electromagnetic wave shielding film is as follows The adhesive layer of the electromagnetic wave shielding film is in contact with the cover film of the above-mentioned printed wiring board, and the above-mentioned electromagnetic wave shielding film is arranged on the above-mentioned printed wiring board; It penetrates through the adhesive layer of the electromagnetic wave shielding film and is in contact with the ground circuit of the above-mentioned printed wiring board.
本發明之屏蔽印刷配線板之製造方法係使用上述本發明之電磁波屏蔽膜之屏蔽印刷配線板之製造方法。 因此,製得之屏蔽印刷配線板,接地電路-屏蔽層間之連接電阻變低。The manufacturing method of the shielded printed wiring board of this invention is the manufacturing method of the shielded printed wiring board which uses the electromagnetic wave shielding film of this invention mentioned above. Therefore, the obtained shielded printed wiring board has a lower connection resistance between the ground circuit and the shielding layer.
本發明之屏蔽印刷配線板,特徵在於:其係由印刷配線板及上述本發明之電磁波屏蔽膜構成,該印刷配線板具備基底膜、包含形成於上述基底膜上之接地電路之印刷電路、及覆蓋上述印刷電路之覆蓋膜,且於上述覆蓋膜形成有使上述接地電路露出之開口部。上述電磁波屏蔽膜之導電性凸塊貫穿上述接著劑層而與上述印刷配線板之接地電路連接。The shielded printed wiring board of the present invention is characterized in that it is composed of a printed wiring board and the above-mentioned electromagnetic wave shielding film of the present invention, the printed wiring board includes a base film, a printed circuit including a ground circuit formed on the base film, and A cover film covering the printed circuit, and an opening for exposing the ground circuit is formed in the cover film. The conductive bump of the electromagnetic shielding film penetrates the adhesive layer and is connected to the ground circuit of the printed wiring board.
於本發明之屏蔽印刷配線板中,上述本發明之電磁波屏蔽膜之導電性凸塊貫穿接著劑層而與印刷配線板之接地電路連接。 因此,電磁波屏蔽膜之導電性凸塊會牢固地接觸印刷配線板之接地電路,接地電路-屏蔽層間之連接電阻會變小。In the shielded printed wiring board of the present invention, the conductive bump of the electromagnetic wave shielding film of the present invention penetrates through the adhesive layer and is connected to the ground circuit of the printed wiring board. Therefore, the conductive bump of the electromagnetic wave shielding film will firmly contact the grounding circuit of the printed wiring board, and the connection resistance between the grounding circuit and the shielding layer will be reduced.
發明效果 本發明之電磁波屏蔽膜係黏貼於印刷配線板,該印刷配線板具備基底膜、包含形成於基底膜上之接地電路之印刷電路、及覆蓋印刷電路之覆蓋膜,且於覆蓋膜形成有使接地電路露出之開口部。Invention effect The electromagnetic wave shielding film of the present invention is bonded to a printed wiring board. The printed wiring board has a base film, a printed circuit including a ground circuit formed on the base film, and a cover film covering the printed circuit. The opening where the circuit is exposed.
此時,導電性凸塊貫穿接著劑層而與接地電路接觸。 於此,本發明之電磁波屏蔽膜中,上述導電性凸塊之體積為30000~400000μm3 。 若導電性凸塊之體積為上述範圍內,導電性凸塊會牢固地接觸接地電路,接地電路-屏蔽層間之連接電阻會變小。At this time, the conductive bump penetrates the adhesive layer and contacts the ground circuit. Here, in the electromagnetic wave shielding film of the present invention, the volume of the conductive bumps is 30,000 to 400,000 μm 3 . If the volume of the conductive bump is within the above range, the conductive bump will firmly contact the ground circuit, and the connection resistance between the ground circuit and the shielding layer will be reduced.
用以實施發明之形態 以下,就本發明之電磁波屏蔽膜進行具體地說明。然而,本發明不限定於以下實施形態,可於不變更本發明主旨之範圍內進行適當變更並應用。form for carrying out the invention Hereinafter, the electromagnetic wave shielding film of this invention is demonstrated concretely. However, this invention is not limited to the following embodiment, In the range which does not change the gist of this invention, it can change suitably and apply.
本發明之電磁波屏蔽膜,特徵在於:其係由保護層、積層於上述保護層之屏蔽層及積層於上述屏蔽層之接著劑層構成;於上述接著劑層側之上述屏蔽層形成有導電性凸塊。The electromagnetic wave shielding film of the present invention is characterized in that it is composed of a protective layer, a shielding layer laminated on the protective layer, and an adhesive layer laminated on the shielding layer; the shielding layer on the side of the adhesive layer is formed with a conductive bump.
以下,使用圖式說明本發明之電磁波屏蔽膜之各構造。 圖1係示意性顯示本發明之電磁波屏蔽膜之一例的剖面圖。 圖2係示意性顯示使用本發明之電磁波屏蔽膜之屏蔽印刷配線板之一例的剖面圖。Hereinafter, each structure of the electromagnetic wave shielding film of this invention is demonstrated using drawing. Fig. 1 is a cross-sectional view schematically showing an example of the electromagnetic wave shielding film of the present invention. Fig. 2 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the electromagnetic wave shielding film of the present invention.
如圖1所示,電磁波屏蔽膜10係由保護層11、積層於保護層11之屏蔽層12及積層於屏蔽層12之接著劑層13構成。
又,於屏蔽層12之接著劑層13側形成有複數個導電性凸塊14。As shown in FIG. 1 , the
再者,如圖2所示,電磁波屏蔽膜10係黏貼於印刷配線板20,用以製造屏蔽印刷配線板30,該印刷配線板20具備基底膜21、包含形成於基底膜21上之複數個接地電路22a之印刷電路22及覆蓋印刷電路22之覆蓋膜23,且於覆蓋膜23形成有使接地電路22a露出之開口部23a。Moreover, as shown in FIG. 2 , the electromagnetic
(保護層)
保護層11之材料並無特別限定,但宜由熱塑性樹脂組成物、熱硬化性樹脂組成物、活性能量線硬化性組成物等構成。(The protective layer)
The material of the
關於上述熱塑性樹脂組成物,並無特別限定,可列舉:苯乙烯系樹脂組成物、乙酸乙烯酯系樹脂組成物、聚酯系樹脂組成物、聚乙烯系樹脂組成物、聚丙烯系樹脂組成物、醯亞胺系樹脂組成物、丙烯酸系樹脂組成物等。The above-mentioned thermoplastic resin composition is not particularly limited, and examples thereof include styrene-based resin compositions, vinyl acetate-based resin compositions, polyester-based resin compositions, polyethylene-based resin compositions, and polypropylene-based resin compositions. , imide resin composition, acrylic resin composition, etc.
關於上述熱硬化性樹脂組成物,並無特別限定,可列舉選自於由環氧系樹脂組成物、胺基甲酸酯系樹脂組成物、胺基甲酸酯脲系樹脂組成物、苯乙烯系樹脂組成物、酚系樹脂組成物、三聚氰胺系樹脂組成物、丙烯酸系樹脂組成物及醇酸系樹脂組成物所構成群組中之至少1種樹脂組成物。The above-mentioned thermosetting resin composition is not particularly limited, and may be selected from epoxy resin compositions, urethane resin compositions, urethane urea resin compositions, styrene At least one resin composition selected from the group consisting of resin-based compositions, phenol-based resin compositions, melamine-based resin compositions, acrylic-based resin compositions, and alkyd-based resin compositions.
關於上述活性能量線硬化性組成物,並無特別限定,可舉例如分子中具有至少2個(甲基)丙烯醯氧基之聚合性化合物等。The active energy ray-curable composition is not particularly limited, and examples thereof include polymerizable compounds having at least two (meth)acryloyloxy groups in the molecule.
保護層11可由單獨1種材料構成,亦可由2種以上材料構成。The
於保護層11中,亦可視需要包含硬化促進劑、黏著性賦予劑、抗氧化劑、顏料、染料、塑化劑、紫外線吸收劑、消泡劑、調平劑、填充劑、阻燃劑、黏度調節劑、抗結塊劑等。In the
保護層11之厚度並無特別限定,可視需要適當設定,但宜為1~15μm、較佳為3~10μm。
若保護層厚度小於1μm,因為過薄,故難以充分地保護屏蔽層及接著劑層。
若保護層厚度超過15μm,因為過厚,故保護層難以彎曲,且保護層本身容易破損。因此,難以應用於要求耐彎曲性之構件。The thickness of the
(屏蔽層)
屏蔽層12只要可屏蔽電磁波,其材料並無限定,例如可由金屬構成,亦可由導電性樹脂構成。(Shield)
The material of the
屏蔽層12由金屬構成時,關於金屬可列舉金、銀、銅、鋁、鎳、錫、鈀、鉻、鈦、鋅等。該等之中,較佳為銅。由導電性及經濟性之觀點,銅為對屏蔽層來說較為適合之材料。When the
再者,屏蔽層12亦可由上述金屬之合金構成。
又,屏蔽層12可為金屬箔,亦可為以濺鍍或無電鍍敷、電鍍等方法形成之金屬膜。Furthermore, the
屏蔽層12由導電性樹脂構成時,屏蔽層12亦可由導電性粒子與樹脂構成。When the
關於導電性粒子並無特別限定,可為金屬微粒子、奈米碳管、碳纖維、金屬纖維等。The conductive particles are not particularly limited, and may be metal fine particles, carbon nanotubes, carbon fibers, metal fibers, and the like.
導電性粒子為金屬微粒子時,關於金屬微粒子並無特別限定,可為銀粉、銅粉、鎳粉、焊粉、鋁粉、對銅粉施以鍍銀之銀包銅粉、以金屬被覆高分子微粒子或以金屬被覆玻璃珠等之微粒子等。 此等之中,由經濟性之觀點,宜為可低價取得之銅粉或銀包銅粉。When the conductive particles are metal fine particles, there are no special restrictions on the metal fine particles, and they can be silver powder, copper powder, nickel powder, solder powder, aluminum powder, silver-coated copper powder with silver plating on copper powder, or metal-coated polymer. Microparticles or microparticles such as metal-coated glass beads, etc. Among them, copper powder or silver-coated copper powder, which can be obtained at a low price, is preferable from the viewpoint of economy.
導電性粒子之平均粒徑D50 並無特別限定,宜為0.5~15.0μm。若導電性粒子之平均粒徑為0.5μm以上,導電性樹脂之導電性為良好。若導電性粒子之平均粒徑為15.0μm以下,則可薄化導電性樹脂。The average particle diameter D 50 of the conductive particles is not particularly limited, and is preferably 0.5-15.0 μm. If the average particle diameter of the conductive particles is 0.5 μm or more, the conductivity of the conductive resin is good. When the average particle diameter of electroconductive particle is 15.0 micrometers or less, electroconductive resin can be thinned.
導電性粒子之形狀並無特別限定,可從球狀、扁平狀、鱗片狀、樹突狀、棒狀、纖維狀等中適當選擇。The shape of the conductive particles is not particularly limited, and can be appropriately selected from spherical, flat, scaly, dendritic, rod, and fibrous shapes.
導電性粒子之調配量並無特別限定,宜為15~80質量%、較佳為15~60質量%。The compounding quantity of conductive particle is not specifically limited, It is preferably 15-80 mass %, More preferably, it is 15-60 mass %.
關於樹脂並無特別限定,可列舉:苯乙烯系樹脂組成物、乙酸乙烯酯系樹脂組成物、聚酯系樹脂組成物、聚乙烯系樹脂組成物、聚丙烯系樹脂組成物、醯亞胺系樹脂組成物、醯胺系樹脂組成物、丙烯酸系樹脂組成物等熱塑性樹脂組成物;或酚系樹脂組成物、環氧系樹脂組成物、胺基甲酸酯系樹脂組成物、三聚氰胺系樹脂組成物、醇酸系樹脂組成物等熱硬化性樹脂組成物等。The resin is not particularly limited, and examples thereof include styrene-based resin compositions, vinyl acetate-based resin compositions, polyester-based resin compositions, polyethylene-based resin compositions, polypropylene-based resin compositions, and imide-based resin compositions. Thermoplastic resin compositions such as resin compositions, amide-based resin compositions, and acrylic resin compositions; or phenol-based resin compositions, epoxy-based resin compositions, urethane-based resin compositions, and melamine-based resin compositions Thermosetting resin compositions such as materials, alkyd resin compositions, etc.
(導電性凸塊)
導電性凸塊14貫穿接著劑層13而與接地電路22a接觸。藉由設計成使導電性凸塊14與接地電路22a確實地接觸,可減低接地電路22a-導電性凸塊14間之連接電阻。(conductive bump)
The
導電性凸塊14之形狀並無特別限定,可為圓柱、三角柱、四角柱等柱體狀,亦可為圓錐、三角錐、四角錐等錐體狀。
該等之中,較佳為錐體狀。
若導電性凸塊14之形狀為錐體狀,則導電性凸塊14容易貫穿接著劑層13而容易與接地電路22a接觸。
因此,接地電路22a-導電性凸塊14間之連接電阻會充分變小。The shape of the
每1個導電性凸塊14之體積宜為30000~400000μm3
、較佳為50000~400000μm3
。
若每1個導電性凸塊14之體積為上述範圍內,導電性凸塊14可牢固地接觸接地電路22a,接地電路22a-導電性凸塊14間之連接電阻會變小。
若每1個導電性凸塊之體積小於30000μm3
,導電性凸塊難以與接地電路接觸,接地電路-屏蔽層間之連接電阻容易變大。
若每1個導電性凸塊之體積超過400000μm3
,則導電性凸塊於接著劑層中所占之比率會變大。
因此,具有接著劑層之區域整體的相對介電常數及介電損耗正切容易變高,故傳送特性容易惡化。The volume of each
複數個導電性凸塊14之高度(圖1中以符號「H」表示之高度)宜為大致相同。
若複數個導電性凸塊14之高度大致相同,複數個導電性凸塊14容易均等地貫穿接著劑層13而容易與接地電路22a接觸。
因此,可減少接地電路22a-導電性凸塊14間之連接電阻。The heights of the plurality of conductive bumps 14 (height represented by symbol "H" in FIG. 1 ) are preferably approximately the same.
If the heights of the plurality of
導電性凸塊14之高度宜為1~50μm、較佳為5~30μm。The height of the
再者,導電性凸塊之形狀、高度、體積可使用共聚焦顯微鏡(Lasertec公司製、OPTELICS HYBRID、物鏡20倍)測定形成有凸塊之屏蔽層表面之任意5處後,使用資料分析軟體(LMeye7)進行解析。二值化之參數為高度,自動臨界值演算法則採用Kittler法。Furthermore, the shape, height, and volume of the conductive bump can be measured using a confocal microscope (manufactured by Lasertec, OPTELICS HYBRID,
導電性凸塊14之配置位置並無特別限定,可僅配置於與接地電路22a接觸之位置,亦可等間隔地排列。The location where the
導電性凸塊14宜由樹脂組成物與導電性填料構成。
即,導電性凸塊14亦可由導電性糊料構成。
藉由使用導電性糊料,可於任意位置以任意形狀輕易地形成導電性凸塊14。
又,導電性凸塊14亦可藉由網版印刷形成。
使用導電性糊料並利用網版印刷來形成導電性凸塊14時,可於任意位置以任意形狀輕易且有效率地形成導電性凸塊14。The
導電性凸塊14由樹脂組成物與導電性填料構成時,關於樹脂組成物並無特別限定,可使用:苯乙烯系樹脂組成物、乙酸乙烯酯系樹脂組成物、聚酯系樹脂組成物、聚乙烯系樹脂組成物、聚丙烯系樹脂組成物、醯亞胺系樹脂組成物、醯胺系樹脂組成物、丙烯酸系樹脂組成物等熱塑性樹脂組成物;或酚系樹脂組成物、環氧系樹脂組成物、胺基甲酸酯系樹脂組成物、三聚氰胺系樹脂組成物、醇酸系樹脂組成物等熱硬化性樹脂組成物等。
樹脂組成物之材料可為其等中之單獨1種,亦可為2種以上之組合。When the
導電性凸塊14由樹脂組成物與導電性填料構成時,關於導電性填料並無特別限定,可為金屬微粒子、奈米碳管、碳纖維、金屬纖維等。When the
導電性填料為金屬微粒子時,關於金屬微粒子並無特別限定,可為銀粉、銅粉、鎳粉、焊粉、鋁粉、對銅粉施以鍍銀之銀包銅粉、以金屬被覆高分子微粒子或以金屬被覆玻璃珠等之微粒子等。 此等之中,由經濟性之觀點,宜為可低價取得之銅粉或銀包銅粉。When the conductive filler is metal fine particles, there are no special restrictions on the metal fine particles, and they can be silver powder, copper powder, nickel powder, solder powder, aluminum powder, silver-coated copper powder with silver plating on copper powder, metal-coated polymer Microparticles or microparticles such as metal-coated glass beads, etc. Among them, copper powder or silver-coated copper powder, which can be obtained at a low price, is preferable from the viewpoint of economy.
導電性填料之平均粒徑D50 並無特別限定,宜為0.5~15.0μm。The average particle size D 50 of the conductive filler is not particularly limited, and is preferably 0.5-15.0 μm.
導電性填料之形狀並無特別限定,可從球狀、扁平狀、鱗片狀、樹突狀、棒狀、纖維狀等中適當選擇。The shape of the conductive filler is not particularly limited, and may be appropriately selected from spherical, flat, scaly, dendritic, rod, and fibrous shapes.
導電性凸塊14由樹脂組成物與導電性填料構成時,導電性填料之重量比率宜為30~99%、較佳為50~99%。When the
又,導電性凸塊亦可由利用鍍敷法或蒸鍍法等形成之金屬構成。 此時,導電性凸塊宜由包含銅、銀、錫、金、鈀、鋁、鉻、鈦、鋅及其等中之一種以上之合金構成。 鍍敷法或蒸鍍法可使用先前之方法。In addition, the conductive bump may be formed of a metal formed by a plating method, a vapor deposition method, or the like. In this case, the conductive bump is preferably composed of an alloy including one or more of copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc and the like. As the plating method or vapor deposition method, the previous method can be used.
(接著劑層)
如上所述,電磁波屏蔽膜10藉由接著劑層13接著於印刷配線板20。(adhesive layer)
As described above, the electromagnetic
於電磁波屏蔽膜10中,接著劑層13之與屏蔽層12相反側之面宜為平坦。
若此面為平坦,複數個導電性凸塊14會均等地貫穿接著劑層13。
於是,複數個導電性凸塊14會均等地接觸複數個接地電路22a。因此,可減少接地電路-屏蔽層間之連接電阻。In the
於電磁波屏蔽膜10,接著劑層13之厚度宜為5~30μm、較佳為8~20μm。
若接著劑層之厚度小於5μm,則由於構成接著劑層之樹脂之量較少,故難以獲得足夠的接著性能。且,變得容易破損。
若接著劑層之厚度超過30μm,則整體會變厚,而容易失去柔軟性。且,導電性凸塊將會變得難以貫穿接著劑層。In the electromagnetic
於電磁波屏蔽膜10中,構成接著劑層13之樹脂在頻率1GHz、23℃下之相對介電常數宜為1~5、較佳為2~4。
又,構成接著劑層13之樹脂在頻率1GHz、23℃下之介電損耗正切宜為0.0001~0.03、較佳為0.001~0.002。
若為上述範圍,可使得利用電磁波屏蔽膜10製造之屏蔽印刷配線板30之傳送特性提高。In the electromagnetic
再者,電磁波屏蔽膜10中,接著劑層13可為導電性絕著劑層、亦可為絕緣性接著劑層,由降低相對介電常數及介電損耗正切之觀點,接著劑層13宜為絕緣性接著劑層。
如上所述,電磁波屏蔽膜10藉由接著劑層13而接著於印刷配線板30。
上述接著劑層13為絕緣性接著劑層時,接著劑層13由於不含導電性填料等導電性物質,故相對介電常數及介電損耗正切會充分變小。此時,使用電磁波屏蔽膜10製成之屏蔽印刷配線板30,傳送特性會變得良好。Furthermore, in the electromagnetic
再者,接著劑層13具有導電性時,接著劑層13會包含導電性填料等導電性物質。接著劑層13若包含許多此種導電性物質,則接著劑層13整體的相對介電常數及介電損耗正切會容易變高。
另一方面,為使所製造之屏蔽印刷配線板30之傳送特性良好,接著劑層13整體之相對介電常數及介電損耗正切宜越低越好。
因此,即使是接著劑層13包含導電性物質的情況下,為使接著劑層13整體之相對介電常數及介電損耗正切變低,其含量也是越少越好。Furthermore, when the
接著劑層13可由熱硬化性樹脂構成、亦可由熱塑性樹脂構成。The
關於熱硬化性樹脂例如可列舉:酚系樹脂、環氧系樹脂、胺基甲酸酯系樹脂、三聚氰胺系樹脂、聚醯胺系樹脂及醇酸系樹脂等。 又,關於熱塑性樹脂,例如可列舉:苯乙烯系樹脂、乙酸乙烯酯系樹脂、聚酯系樹脂、聚乙烯系樹脂、聚丙烯系樹脂、醯亞胺系樹脂及丙烯酸系樹脂。 又,關於環氧樹脂,較佳為醯胺改質環氧樹脂。 此等樹脂適合作為構成接著劑層之樹脂。 接著劑層之材料可為其等中之單獨1種,亦可為2種以上之組合。As a thermosetting resin, a phenol resin, an epoxy resin, a urethane resin, a melamine resin, a polyamide resin, an alkyd resin, etc. are mentioned, for example. Furthermore, examples of thermoplastic resins include styrene-based resins, vinyl acetate-based resins, polyester-based resins, polyethylene-based resins, polypropylene-based resins, imide-based resins, and acrylic resins. Also, as for the epoxy resin, an amide-modified epoxy resin is preferable. These resins are suitable as the resin constituting the adhesive layer. The material of the adhesive layer may be a single type among them, or a combination of two or more types.
(印刷配線板)
以下說明黏貼有電磁波屏蔽膜10之印刷配線板20。(printed wiring board)
The printed
(基底膜及覆蓋膜)
基底膜21及覆蓋膜23之材料並無特別限定,不過宜由工程塑膠構成。作為上述工程塑膠,例如可舉例:聚對苯二甲酸乙二酯、聚丙烯、交聯聚乙烯、聚酯、聚苯并咪唑、聚醯亞胺、聚醯亞胺醯胺、聚醚醯亞胺、聚伸苯硫醚等樹脂。
又,於此等工程塑膠中,在要求阻燃性時以聚伸苯硫醚膜為佳,而要求耐熱性時則以聚醯亞胺膜為佳。再者,基底膜21之厚度宜為10~40μm,覆蓋膜23之厚度宜為10~30μm。(basement membrane and cover membrane)
The materials of the
開口部23a之大小並無特別限定,宜為0.1mm2
以上、較佳為0.3mm2
以上。
又,開口部23a之形狀並無特別限定,可為圓形、橢圓形、四邊形、三角形等。The size of the
(印刷電路)
印刷電路22及接地電路22a之材料並無特別限定,可為銅箔、導電性糊料之硬化物等。(printed circuit)
The materials of the printed
將電磁波屏蔽膜10黏貼於印刷配線板20而製成之屏蔽印刷配線板30為本發明之屏蔽印刷配線板之一態樣。The shielded printed
如圖2所示,屏蔽印刷配線板30係由印刷配線板20及電磁波屏蔽膜10構成,該印刷配線板20具備基底膜21、包含形成於基底膜21上之複數個接地電路22a之印刷電路22及覆蓋印刷電路22之覆蓋膜23,且於覆蓋膜23形成有使接地電路22a露出之開口部;該電磁波屏蔽膜10係由保護層11、積層於保護層11之屏蔽層12及積層於屏蔽層12之接著劑層13構成,於接著劑層13側之屏蔽層12上形成有複數個導電性凸塊14;電磁波屏蔽膜10之複數個導電性凸塊14貫穿接著劑層13而與印刷配線板20之複數個接地電路22a連接。As shown in FIG. 2, the shielded printed
於屏蔽印刷配線板30中,電磁波屏蔽膜10之複數個導電性凸塊14貫穿接著劑層13而與印刷配線板20之複數個接地電路22a連接。
藉由設計成使導電性凸塊14與接地電路22a確實地接觸,可減低接地電路22a-導電性凸塊14間之連接電阻。In the shielded printed
接下來,一面使用圖式一面就本發明之屏蔽印刷配線板之製造方法之一例進行說明。 圖3(a)~(d)係按照步驟順序顯示本發明之屏蔽印刷配線板之製造方法之一例的步驟圖。Next, an example of the manufacturing method of the shielded printed wiring board of this invention is demonstrated using drawing. 3( a ) to ( d ) are process diagrams showing an example of the manufacturing method of the shielded printed wiring board of the present invention in order of steps.
(電磁波屏蔽膜準備步驟)
於本步驟中,如圖3(a)所示,準備上述電磁波屏蔽膜10。
電磁波屏蔽膜10之較佳構成等因為已經說明,故於此省略說明。(Electromagnetic wave shielding film preparation procedure)
In this step, as shown in FIG. 3( a ), the above-mentioned electromagnetic
(印刷配線板準備步驟)
於本步驟中,如圖3(b)所示,準備印刷配線板20。
印刷配線板20之較佳構成等因為已經說明,故於此省略說明。(Printed wiring board preparation procedure)
In this step, as shown in FIG.3(b), the printed
(電磁波屏蔽膜配置步驟)
於本步驟中,如圖3(c)所示,以電磁波屏蔽膜10之接著劑層面接觸印刷配線板20之覆蓋膜23之方式,於印刷配線板20配置電磁波屏蔽膜10。
此時,導電性凸塊14位於接地電路22a之上。(Electromagnetic wave shielding film configuration steps)
In this step, as shown in FIG. 3( c ), the electromagnetic
(加壓步驟)
於本步驟中,如圖3(d)所示,進行加壓以使得電磁波屏蔽膜10之複數個導電性凸塊14貫穿電磁波屏蔽膜10之接著劑層13而與印刷配線板20之複數個接地電路22a接觸。(pressurization step)
In this step, as shown in FIG. 3( d), pressure is applied so that the plurality of
關於加壓條件,可舉例1~5Pa、1~60min之條件。Regarding the pressurized conditions, the conditions of 1~5Pa and 1~60min can be exemplified.
於本發明之屏蔽印刷配線板之製造方法中,可於加壓步驟後、或與加壓步驟同時進行加熱,使電磁波屏蔽膜10之接著劑層13硬化。In the manufacturing method of the shielded printed wiring board of the present invention, the
通過以上步驟,可製造屏蔽印刷配線板30。Through the above steps, the shielded printed
[實施例] 以下示例更具體地說明本發明之實施例,但本發明並不限定於此等實施例。[Example] The following examples illustrate the embodiments of the present invention more specifically, but the present invention is not limited to these embodiments.
(實施例1) 首先,準備已於單面實施剝離處理之聚對苯二甲酸乙二酯膜作為第1剝離膜。(Example 1) First, a polyethylene terephthalate film subjected to release treatment on one side was prepared as a first release film.
接著,於第1剝離膜之剝離處理面塗覆環氧樹脂,使用電烤箱於100℃下加熱2分鐘,製作厚度7μm之保護層。 之後,藉由無電鍍敷於保護層上形成2μm銅層。該銅層成為屏蔽層。Next, epoxy resin was coated on the peeling-treated surface of the first peeling film, and heated at 100° C. for 2 minutes using an electric oven to prepare a protective layer with a thickness of 7 μm. After that, a 2 μm copper layer was formed on the protective layer by electroless plating. This copper layer becomes the shielding layer.
接著,將甲酚酚醛型環氧樹脂與異氰酸酯之混合物10重量份、導電性填料(平均粒徑5μm之球狀銀包銅粉)90重量份混合,製作導電性糊料。
再者,甲酚酚醛型環氧樹脂與異氰酸酯之混合物之重量比為甲酚酚醛型環氧樹脂:異氰酸酯=100:0.2。
然後,於銅層網版印刷導電性糊料,藉此形成導電性凸塊。
導電性凸塊之形狀為圓錐狀、高度23μm、體積120000μm3
。再者,導電性凸塊之形狀、高度、體積係使用共聚焦顯微鏡(Lasertec公司製、OPTELICS HYBRID、物鏡20倍)測定形成有凸塊之屏蔽層表面之任意5處後,使用資料分析軟體(LMeye7)進行解析。二值化之參數為高度,自動臨界值演算法則採用Kittler法。Next, 10 parts by weight of a mixture of cresol novolac epoxy resin and isocyanate, and 90 parts by weight of a conductive filler (spherical silver-coated copper powder with an average particle diameter of 5 μm) were mixed to prepare a conductive paste. Furthermore, the weight ratio of the mixture of cresol novolac epoxy resin and isocyanate is cresol novolac epoxy resin:isocyanate=100:0.2. Then, conductive paste is screen-printed on the copper layer, thereby forming conductive bumps. The shape of the conductive bump is conical, the height is 23 μm, and the volume is 120000 μm 3 . Furthermore, the shape, height, and volume of the conductive bumps were measured at any five places on the surface of the shielding layer where the bumps were formed using a confocal microscope (manufactured by Lasertec, OPTELICS HYBRID,
接著,將環氧樹脂100.0份、及有機磷系阻燃劑49.6份混合,製作成接著劑層用組成物。Next, 100.0 parts of epoxy resins and 49.6 parts of organophosphorus-based flame retardants were mixed to prepare an adhesive layer composition.
準備已於單面實施剝離處理之聚對苯二甲酸乙二酯膜作為第2剝離膜。 然後,於第2剝離膜之剝離處理面塗覆接著劑層用組成物,使用電烤箱於100℃下加熱2分鐘,製作成厚度9μm之接著劑層。A polyethylene terephthalate film subjected to release treatment on one side was prepared as a second release film. Then, the adhesive layer composition was coated on the release-treated surface of the second release film, and heated at 100° C. for 2 minutes using an electric oven to form an adhesive layer with a thickness of 9 μm.
接著,將形成於第1剝離膜之保護層、形成於第2剝離膜之接著劑層貼合,將第2剝離膜剝離,藉此而製造實施例1之電磁波屏蔽膜。Next, the protective layer formed on the first release film and the adhesive layer formed on the second release film were bonded together, and the second release film was peeled off to manufacture the electromagnetic shielding film of Example 1.
圖4係實施例1之電磁波屏蔽膜之剖面照片。
如圖4所示,實施例1之電磁波屏蔽膜10係由保護層11、積層於保護層11之屏蔽層12及積層於屏蔽層12之接著劑層13構成,於接著劑層13側之屏蔽層12形成有圓錐狀之導電性凸塊14。Fig. 4 is a cross-sectional photograph of the electromagnetic wave shielding film of
(實施例2)及(比較例1) 如表1所示,除了變更導電性凸塊之高度及體積以外,與實施例1相同方法製造實施例2及比較例1之電磁波屏蔽膜。(Example 2) and (Comparative Example 1) As shown in Table 1, the electromagnetic wave shielding films of Example 2 and Comparative Example 1 were manufactured in the same manner as in Example 1 except that the height and volume of the conductive bumps were changed.
[表1]
(比較例2) 首先,準備已於單面實施剝離處理之聚對苯二甲酸乙二酯膜作為第1剝離膜。(comparative example 2) First, a polyethylene terephthalate film subjected to release treatment on one side was prepared as a first release film.
接著,於第1剝離膜之剝離處理面塗覆環氧樹脂,使用電烤箱於100℃下加熱2分鐘,製作厚度7μm之保護層。 之後,藉由無電鍍敷於保護層上形成2μm銅層。該銅層成為屏蔽層。Next, epoxy resin was coated on the peeling-treated surface of the first peeling film, and heated at 100° C. for 2 minutes using an electric oven to prepare a protective layer with a thickness of 7 μm. After that, a 2 μm copper layer was formed on the protective layer by electroless plating. This copper layer becomes the shielding layer.
然後,將醯胺改質環氧樹脂100.0份、銀包銅粉(平均粒徑D50 :13μm)49.6份、及有機磷系阻燃劑49.6份混合,製作導電性接著劑層用組成物。Then, 100.0 parts of amide-modified epoxy resin, 49.6 parts of silver-coated copper powder (average particle diameter D 50 : 13 μm), and 49.6 parts of organic phosphorus-based flame retardant were mixed to prepare a composition for a conductive adhesive layer.
準備已於單面實施剝離處理之聚對苯二甲酸乙二酯膜作為第2剝離膜。 然後,於第2剝離膜之剝離處理面塗覆導電性接著劑層用組成物,使用電烤箱於100℃下加熱2分鐘,製作厚度9μm之導電性接著劑層。A polyethylene terephthalate film subjected to release treatment on one side was prepared as a second release film. Then, the composition for the conductive adhesive layer was coated on the release-treated surface of the second release film, and heated at 100° C. for 2 minutes using an electric oven to prepare a conductive adhesive layer with a thickness of 9 μm.
接著,將形成於第1剝離膜之保護層、形成於第2剝離膜之接著劑層貼合,將第2剝離膜剝離,藉此而製造比較例2之電磁波屏蔽膜。Next, the protective layer formed on the 1st release film and the adhesive layer formed on the 2nd release film were bonded together, and the 2nd release film was peeled off, and the electromagnetic wave shielding film of the comparative example 2 was manufactured.
(傳送損失測定試驗)
圖5係示意性顯示傳送損失測定試驗中之電磁波屏蔽膜之傳送損失測定方法的示意圖。
關於電磁波屏蔽膜之傳送損失測定,使用圖5所示之網路分析儀41進行評價。
網路分析儀41係使用Rohde & Schwarz公司製的ZVL6。網路分析儀41具有輸入端子與輸出端子,其等分別與連接用基板42連接。使測定對象之屏蔽印刷配線板30連接於該1對連接用基板42之間且受該1對連接用基板42支撐而呈懸在空中之直線狀態後,進行測定。屏蔽印刷配線板30使用長度100mm者。又,在100kHz~20GHz之頻率範圍內進行測定。又,於溫度25℃、相對溼度30~50%之氣體環境下進行測定。網路分析儀41在頻率10GHz下測定輸入信號相對於輸出信號衰減了多少。將測出之衰減量作為傳輸損失顯示於表1。衰減量越接近零,表示傳輸損失越少。(Transmission loss measurement test)
Fig. 5 is a schematic diagram schematically showing a method of measuring transmission loss of an electromagnetic wave shielding film in a transmission loss measurement test.
The transmission loss measurement of the electromagnetic shielding film was evaluated using the
(連接電阻測定試驗)
圖6係示意性顯示連接電阻測定試驗中電磁波屏蔽膜之電阻值測定方法的示意圖。
圖6中之電磁波屏蔽膜110係示意性顯示實施例1及實施例2之電磁波屏蔽膜。
電磁波屏蔽膜110係由保護層111、積層於保護層111之屏蔽層112及積層於屏蔽層112之接著劑層113構成,且於接著劑層113側之屏蔽層112形成有複數個導電性凸塊114。
又,於連接電阻測定試驗中,準備模型基板120,該模型基板120具備基底膜121、形成於基底膜121上之複數個測定用印刷電路125、覆蓋測定用印刷電路125之覆蓋膜123,且於覆蓋膜123形成有使測定用印刷電路125露出之開口部123a。
又,開口部123a為直徑1mm之圓形。(Connection resistance measurement test)
Fig. 6 is a schematic diagram schematically showing a method of measuring the resistance value of the electromagnetic wave shielding film in the connection resistance measurement test.
The electromagnetic
於連接電阻測定試驗中,如圖6所示,以電磁波屏蔽膜110之導電性凸塊114與測定用印刷電路125接觸之方式將電磁波屏蔽膜110配置於模型基板120,在170℃、3Pa、3分鐘之條件下進行加壓/加熱後,進行150℃、1小時後硬化,藉此將電磁波屏蔽膜110黏貼於模型基板120。
然後,以電阻計150測定測定用印刷電路125間之電阻值。In the connection resistance measurement test, as shown in FIG. 6 , the electromagnetic
再者,比較例1之電磁波屏蔽膜除了無導電性凸塊、接著劑層為導電性接著劑層以外,與電磁波屏蔽膜110為相同構成。
針對比較例1之電磁波屏蔽膜,亦在與上述方法相同之條件下,黏貼於模型基板120,以電阻計150測定測定用印刷電路125間之電阻值。Furthermore, the electromagnetic wave shielding film of Comparative Example 1 has the same configuration as the electromagnetic
於表1顯示各實施例及比較例之電磁波屏蔽膜之連接電阻試驗之結果。Table 1 shows the results of the connection resistance test of the electromagnetic wave shielding films of the respective examples and comparative examples.
如表1所示,實施例1及實施例2之電磁波屏蔽膜,其傳送損失測定試驗中之傳送損失較小、連接電阻測定試驗中之電阻值較小。As shown in Table 1, the electromagnetic wave shielding films of Example 1 and Example 2 had small transmission loss in the transmission loss measurement test and small resistance values in the connection resistance measurement test.
10:電磁波屏蔽膜
11:保護層
12:屏蔽層
13:接著劑層
14:導電性凸塊
20:印刷配線板
21:基底膜
22:印刷電路
22a:接地電路
23:覆蓋膜
23a:開口部
30:屏蔽印刷配線板
41:網路分析儀
42:連接用基板
110:電磁波屏蔽膜
111:保護層
112:屏蔽層
113:接著劑層
114:導電性凸塊
120:模型基板
121:基底膜
123:覆蓋膜
123a:開口部
125:測定用印刷電路
150:電阻計
H:導電性凸塊之高度10: Electromagnetic wave shielding film
11: Protective layer
12: shielding layer
13: Adhesive layer
14: Conductive bump
20:Printed Wiring Board
21: Basement Membrane
22: Printed
圖1係示意性顯示本發明之電磁波屏蔽膜之一例的剖面圖。
圖2係示意性顯示使用本發明之電磁波屏蔽膜之屏蔽印刷配線板之一例的剖面圖。
圖3(a)~(d)係按照步驟順序顯示本發明之屏蔽印刷配線板之製造方法之一例的步驟圖。
圖4係實施例1之電磁波屏蔽膜之剖面照片。
圖5係示意性顯示傳送損失測定試驗中電磁波屏蔽膜之傳送損失測定方法的示意圖。
圖6係示意性顯示連接電阻測定試驗中電磁波屏蔽膜之電阻值測定方法的示意圖。Fig. 1 is a cross-sectional view schematically showing an example of the electromagnetic wave shielding film of the present invention.
Fig. 2 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the electromagnetic wave shielding film of the present invention.
3( a ) to ( d ) are process diagrams showing an example of the manufacturing method of the shielded printed wiring board of the present invention in order of steps.
Fig. 4 is a cross-sectional photograph of the electromagnetic wave shielding film of
10:電磁波屏蔽膜 10: Electromagnetic wave shielding film
11:保護層 11: Protective layer
12:屏蔽層 12: shielding layer
13:接著劑層 13: Adhesive layer
14:導電性凸塊 14: Conductive bump
H:導電性凸塊之高度 H: height of conductive bump
Claims (8)
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JP2018202933 | 2018-10-29 | ||
JP2018-202933 | 2018-10-29 |
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TW108121497A TWI782213B (en) | 2018-10-29 | 2019-06-20 | Electromagnetic wave shielding film, manufacturing method of shielding printed wiring board, and shielding printed wiring board |
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JP (1) | JP7244535B2 (en) |
KR (1) | KR102530877B1 (en) |
CN (1) | CN112534974B (en) |
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WO (1) | WO2020090727A1 (en) |
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CN112004310B (en) * | 2020-08-24 | 2023-09-01 | 大连吉星电子股份有限公司 | Flexible circuit board for enabling 5G signals to be stably transmitted |
TW202241251A (en) | 2021-03-31 | 2022-10-16 | 日商拓自達電線股份有限公司 | Electromagnetic wave shield film |
TW202241250A (en) | 2021-03-31 | 2022-10-16 | 日商拓自達電線股份有限公司 | Electromagnetic wave shield film |
CN117395977B (en) * | 2023-11-20 | 2024-03-22 | 广州方邦电子股份有限公司 | Electromagnetic shielding film and application thereof |
Citations (1)
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JP2017010995A (en) * | 2015-06-17 | 2017-01-12 | 住友電工プリントサーキット株式会社 | Shield material, electronic component and adhesive sheet |
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JP4201548B2 (en) | 2002-07-08 | 2008-12-24 | タツタ電線株式会社 | SHIELD FILM, SHIELD FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR PRODUCING THEM |
JP2009200113A (en) * | 2008-02-19 | 2009-09-03 | Nitto Denko Corp | Shield wiring circuit board |
JP5308465B2 (en) * | 2011-01-28 | 2013-10-09 | タツタ電線株式会社 | Shield printed wiring board |
JP2013193253A (en) * | 2012-03-16 | 2013-09-30 | Yamaichi Electronics Co Ltd | Electromagnetic shielding coverlay film, flexible wiring board and method for manufacturing the same |
JP2015015304A (en) * | 2013-07-03 | 2015-01-22 | 信越ポリマー株式会社 | Electromagnetic wave shield film, flexible printed wiring board with electromagnetic wave shield film, electronic equipment, and method for manufacturing the same |
CN104332217B (en) * | 2014-10-08 | 2018-04-10 | 广州方邦电子股份有限公司 | Free ground film and preparation method thereof, shielded line plate and earthing method comprising free ground film |
CN107079611A (en) * | 2014-12-05 | 2017-08-18 | 拓自达电线株式会社 | Electromagnetic shielding film |
JP5871098B1 (en) * | 2015-07-16 | 2016-03-01 | 東洋インキScホールディングス株式会社 | Conductive adhesive layer, conductive adhesive sheet and printed wiring board |
JP2016157920A (en) * | 2015-12-18 | 2016-09-01 | 東洋インキScホールディングス株式会社 | Electromagnetic wave shielding sheet, electromagnetic wave shielding wiring circuit board, and electronic device |
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- 2019-10-28 KR KR1020207038058A patent/KR102530877B1/en active IP Right Grant
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JP2017010995A (en) * | 2015-06-17 | 2017-01-12 | 住友電工プリントサーキット株式会社 | Shield material, electronic component and adhesive sheet |
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KR20210083211A (en) | 2021-07-06 |
WO2020090727A1 (en) | 2020-05-07 |
CN112534974A (en) | 2021-03-19 |
TW202016237A (en) | 2020-05-01 |
JPWO2020090727A1 (en) | 2021-10-21 |
KR102530877B1 (en) | 2023-05-09 |
JP7244535B2 (en) | 2023-03-22 |
CN112534974B (en) | 2024-07-09 |
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