CN107079611A - Electromagnetic shielding film - Google Patents
Electromagnetic shielding film Download PDFInfo
- Publication number
- CN107079611A CN107079611A CN201580063071.9A CN201580063071A CN107079611A CN 107079611 A CN107079611 A CN 107079611A CN 201580063071 A CN201580063071 A CN 201580063071A CN 107079611 A CN107079611 A CN 107079611A
- Authority
- CN
- China
- Prior art keywords
- shielding film
- electromagnetic shielding
- protective layer
- cement layers
- convex
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000004568 cement Substances 0.000 claims abstract description 117
- 230000001788 irregular Effects 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 208
- 239000011241 protective layer Substances 0.000 claims description 86
- 239000000470 constituent Substances 0.000 claims description 56
- 239000002245 particle Substances 0.000 claims description 53
- 238000000034 method Methods 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 50
- 229920005989 resin Polymers 0.000 claims description 49
- 239000011347 resin Substances 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 36
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 230000004888 barrier function Effects 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 48
- 239000000377 silicon dioxide Substances 0.000 description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 239000011342 resin composition Substances 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000007800 oxidant agent Substances 0.000 description 5
- 230000001590 oxidative effect Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 150000003949 imides Chemical class 0.000 description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical class CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 229920000180 alkyd Polymers 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000013530 defoamer Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000004049 embossing Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920005673 polypropylene based resin Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 235000009854 Cucurbita moschata Nutrition 0.000 description 2
- 240000001980 Cucurbita pepo Species 0.000 description 2
- 235000009852 Cucurbita pepo Nutrition 0.000 description 2
- 241000555268 Dendroides Species 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 238000003556 assay Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000007607 die coating method Methods 0.000 description 2
- -1 dimethyl formyl Amine Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 235000020354 squash Nutrition 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229940117958 vinyl acetate Drugs 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
Abstract
Electromagnetic shielding film contains：The concavo-convex cement layers 120 of irregular conductive shield 110, covering.The value of concavo-convex maximum peak height is more than the thickness of cement layers 120.
Description
Technical field
The present invention relates to a kind of electromagnetic shielding film and its manufacture method, shielding printed substrate.
Background technology
In recent years, the requirement to smart phone and this performance of flat board category information terminal high-speed transmission of large capacity data is got over
Come more notable.High-speed transfer Large Volume Data is wanted to use high-frequency signal.However, if using high-frequency signal, located at printing
Signal circuit on wiring board can produce electromagnetic wave noise, and ancillary equipment is easy to job error occur.To prevent this operation
Mistake, it is important that a little aiming at printed substrate shield electromagnetic wave.
On shield printed substrate method, someone expect use the electricity containing screen layer and electric conductivity cement layers
Magnetic wave screened film（For example, see patent document 1 ~ 3）.
These above-mentioned electromagnetic shielding films can by electric conductivity cement layers with cover printed substrate earth-return circuit it is exhausted
The opening portion that edge layer is provided with is overlapped, heating pressurization, electric conductivity cement is filled into opening portion.With this screen layer and printing
The earth-return circuit of wiring board is connected by electric conductivity cement, and printed substrate is shielded.
Prior art literature
Patent document
Patent document 1：Japanese patent gazette JP 2004-095566
Patent document 2：WO2006/088127 handbooks
Patent document 3：WO2009/019963 handbooks.
The content of the invention
The invention problem to be solved
However, when the conductance of the electroconductive particle contained by electric conductivity cement layers is very low, between screen layer and earth-return circuit
Connection resistance increase, this can turn into reduction shielding character principal element.Therefore, the electric conductivity engagement of screened film all the time
Oxidant layer uses the high electroconductive particle of the conductances such as silver powder or silver-coated copper powder, but there is using caused by silver etc.
The problem of cost of raw material increase.In addition, being improved with the packing density of printed substrate, on the insulating barrier for covering earth-return circuit
The diameter for the opening portion being provided with can also diminish.If opening portion diameter diminishes, leading containing a large amount of electroconductive particles can be brought
The problem of electrical cement layers are difficult to be filled into opening portion.
In addition, people increase increasingly to intelligent telephone and the light-weighted requirement of flat type information terminal slimming, this is just
It is required that electromagnetic shielding film is thinner.However, being difficult to make electromagnetic shielding film thinner in the case of conductive cement layers.
It is an object of the present invention to provide a kind of remain to obtain good in the case where cement layers are without using electroconductive particle
The electromagnetic shielding film and its manufacture method and shielding printed substrate of good shielding character.
The means solved the problems, such as
A kind of electromagnetic shielding film of the invention under technical scheme contains：Irregular conductive shield and covering are recessed
Convex cement layers, concavo-convex maximum peak high level is more than the thickness of cement layers.
In electromagnetic shielding film under a kind of technical scheme of the present invention, concavo-convex maximum peak height can be below 20 μm.
In electromagnetic shielding film under a kind of technical scheme of the present invention, concavo-convex maximum peak height can be more than 4 μm.
In electromagnetic shielding film under a kind of technical scheme of the present invention, the face of the opposite side of the cement layers in screen layer
On can also contain matcoveredn.
In electromagnetic shielding film under a kind of technical scheme of the present invention, the maximum peak height in the face of screen layer side in protective layer
Value can be more than the thickness of cement layers and below 20 μm.
Under a kind of technical scheme of electromagnetic shielding film, protective layer can contain the grain below more than 1 μm 20 μm of particle diameter
Son.
Under a kind of technical scheme of electromagnetic shielding film, cement layers can also be insulating properties.
The manufacture method of electromagnetic shielding film under a kind of technical scheme of the present invention comprises the steps：Prepare protective layer
Step；The step of irregular conductive shield being formed on protective layer；Form the maximum peak high level of thickness ratio screen layer
The step of cement layers of thin, covering bumps.
In the manufacture method of electromagnetic shielding film under a kind of technical scheme of the present invention, the step of preparing protective layer can be
Forming surface has maximum peak height more than 4 μm the step of less than 20 μm of concavo-convex protective layer.
In the manufacture method of electromagnetic shielding film under a kind of technical scheme of the present invention, the step of preparing protective layer can be
The protective layer used constituent containing resin combination and particle is coated with supporting base material and makes the step of it solidifies, the grain of particle
Footpath can be less than more than 1 μm 20 μm.
In the manufacture method of electromagnetic shielding film under a kind of technical scheme of the present invention, the step of preparing protective layer can wrap
Include the step of resin bed is formed on supporting base material and form the step of bumps in resin bed.
In the manufacture method of electromagnetic shielding film under a kind of technical scheme of the present invention, forming concavo-convex step can include
The step of working process is embossed to resin bed.
In the manufacture method of electromagnetic shielding film under a kind of technical scheme of the present invention, forming concavo-convex step can include
The step of spray treatment is carried out to resin bed.
In the manufacture method of electromagnetic shielding film under a kind of technical scheme of the present invention, the step of preparing protective layer can wrap
Include the step of forming resin bed on the irregular supporting base material in surface.
In the manufacture method of electromagnetic shielding film under a kind of technical scheme of the present invention, the step of forming cement layers can be with
It is the step of being coated with cement constituent on screen layer.
The shielding printed substrate of the present invention contains：The electromagnetic shielding film and printed substrate of the present invention, the printing
Wiring board contains：Basalis provided with signal circuit and earth-return circuit and provided with least exposing opening for a part of earth-return circuit
The insulating barrier of oral area；Wherein, electromagnetic shielding film and printed substrate make cement layers be engaged, screen layer in opposite directions with insulating barrier
Convex portion connect through cement layers with the earth-return circuit exposed from opening portion.
Invention effect
According to the electromagnetic shielding film of the present invention, the electromagnetic wave shielding in the case that cement layers are without using electroconductive particle
Film still has good shielding character.
Brief description of the drawings
Fig. 1 is the sectional view for the electromagnetic shielding film that an embodiment is related to；
Fig. 2（a）~ (c) be an embodiment be related to electromagnetic wave shielding film manufacturing method the step of order sectional view；
Fig. 3 is the sectional view for the shielding printed substrate that an embodiment is related to.
Embodiment
（Electromagnetic shielding film）
As shown in figure 1, the electromagnetic shielding film 100 in an embodiment contains：Have what is be made up of convex portion 110a and recess 110b
Concavo-convex conductive shield 110 and the cement layers 120 set in contact with the first face of screen layer 110.Screen layer
110 convex portion 110a is engaged oxidant layer 120 and covered.Shield after electromagnetic shielding film 100 to be attached to printed substrate by pressurizeing
At least a portion for covering the convex portion 110a of layer 110 passes through cement layers 120.
Under such structure, screen layer 110 can be made when electromagnetic shielding film 100 being attached into printed substrate by pressurizeing
Convex portion 110a at least a portion is connected with the earth-return circuit of printed substrate.Electromagnetic shielding film 100 is being attached to track
Before the plate of road, the convex portion 110a of screen layer 110 does not highlight from cement layers 120, therefore is easy to electromagnetic shielding film 100
Interim patch is on a printed-wiring board.It can also prevent from producing bubble between cement layers 120 and printed substrate.In addition, being attached to
Before printed substrate, the convex portion 110a of screen layer 110 is engaged oxidant layer 120 and is covered with, therefore convex portion 110a surfaces are difficult oxygen
Change, electric conductivity is difficult to decline.
Cause the convex portion 110a of screen layer 110 after electromagnetic shielding film 100 is pasted on a printed-wiring board by pressurizeing
At least a portion pass through cement layers 120, as long as making the concavo-convex maximum peak height of screen layer（Rp）Value be more than cement layers
120 thickness（t）.Make t<Rp, convex portion 110a are with regard to that can substantially pass cement layers 120, and convex portion 110a and earth-return circuit are just
Can good connection.With this, the resistance value between screened film and earth-return circuit reduces, and can obtain good shielding properties.
Maximum peak height（Rp）As long as thickness of the value than cement layers 120（t）It is big, but preferably more than 4 μm.Rp values
More than 4 μm are located at, then convex portion 110a facilitates penetration of cement layers 120 when screened film being attached into printed substrate by pressurizeing.With
This, the resistance value that can be reduced between electromagnetic shielding film 100 and earth-return circuit obtains good shielding character.Moreover it is possible to
The cement layers 120 of adequate thickness are set to carry out good engagement with printed substrate.
Rp is not particularly limited, but is advisable with less than 20 μm.Rp can make the thickness of electromagnetic shielding film 100 more below 20 μm
It is thin.It is also easy to ensure the flatness on the surface of cement layers 120, electromagnetic shielding film 100 is attached to printed substrate by pressurizeing
When, the engaging force between electromagnetic shielding film 100 and printed substrate is good.In addition, the maximum peak height in the present invention（Rp）Value
It is the JISB0651 according to embodiment:Value measured by 2001.
The thickness of cement layers 120 is preferably as thin as possible on the premise of it can cover the convex portion 110a of screen layer 110, with 3 μ
More than m is advisable, and more than 4 μm more preferably, and is advisable with less than 10 μm, and less than 7 μm more preferably.The thickness of cement layers 120 3 μm with
If upper, even if the concavo-convex Rp values of screen layer 110 are larger, can also prevent electromagnetic shielding film 100 be attached to printed substrate it
The convex portion 110a of preceding screen layer 110 highlights from cement layers 120.Thus, it is possible to prevent cement layers 120 and printed wire
Air is mixed between plate, good engaging force is resulted in.In addition, size can make electromagnetic shielding film 100 more below 10 μm
It is thin, and the convex portion 110a of screen layer 110 can be allowed to be connected conscientiously with the earth-return circuit of printed substrate.
Screen layer 110 on the second face of the opposite side of cement layers 120 with that can be arranged as required to protective layer 130.Protect
Sheath 130 can be formed by resin material of insulating properties etc..In the case that protective layer 130 is set, pass through the screen in protective layer 130
Cover and set bumps just can easily form convex portion 110a on the first face of screen layer 110 on the face of the side of layer 110.In protective layer
It is following to set in the case that 130 surface sets bumps：Make protective layer 130 surface Rp cement layers thickness
More than, more than 4 μm more preferably, while below 20 μm.This structure can easily make the Rp in the first face of screen layer 110 exist
Less than more than 4 μm 20 μm.
（Screen layer）
Screen layer 110 can be metal film or the conducting film being made up of electroconductive particle etc..Metal films such as can be by following things
Matter is formed：Nickel, copper, silver, tin, gold, palladium, aluminium, chromium, titanium or zinc contain alloy more than any one in above-mentioned substance etc..
Rolling process, electro deposition method, electroless plating method, sputtering method, electron beam evaporation plating can for example be used by forming the method for metal film
Method, Vacuum Coating method, CVD or the organic method of metal etc..
Electroconductive particle for example can be carbon, silver, copper, nickel, brazing metal or the silver coating copper to copper powder obtained by silver-plated
Particle etc..In addition the particle obtained by plating metal on the insulating properties particle such as resin balls or glass microballoon can also be used.
Above-mentioned electroconductive particle can be used alone, and mixed above can also use two kinds.
The shape of electroconductive particle can be any one in spherical, needle-like, threadiness, flake or dendroid, from
Flake is preferably used for the angle for forming stratiform.
The particle diameter of electroconductive particle is not particularly limited, and for the angle for reducing the thickness of screen layer 110, can be located at 0.1 μ
Below 10 μm of more than m.
When the thickness of screen layer 110 can bend and slide according to desired obtained electromagnetic wave shielding characteristic and repeatedly
Patience is suitably selected, and can use less than more than 0.1 μm 10 μm of thickness.
（Cement layers）
Cement layers 120 both can be that insulating properties can also be electric conductivity.In view of being filled to the less opening portion of diameter
When fillable, cement layers 120 be preferably insulating properties.Cement layers 120 are fabricated to and filled out without electric conductivity such as metallics
The layer of material also has another advantage, and cement layers 120 can be made thinner.
Cement layers 120 are not particularly limited, and can use styrene resin composition, vinyl acetate esters resin composition
Thing, polyester resin constituent, polythylene resin constituent, polypropylene-based resin constituent, acid imide resin combination,
The thermoplastic resin composition such as acid amides resin composition or acrylic resin constituent or phenolic resinoid constituent, ring
The heat such as oxygen resin composition, polyurethane based resin constituent, melamine resin composition or alkyd based resin constituent
Curable resin constituent etc..Above-mentioned substance be can be used alone, and more than two kinds can be also used simultaneously.
As needed, in cement layers 120 can also containing curing accelerator, tackifier, antioxidant, pigment, dyestuff,
At least one of plasticizer, ultra-violet absorber, defoamer, leveling agent, filler, fire retardant and viscosity-controlling agent etc..
The thickness of cement layers 120 is not particularly limited, and can suitably be set as needed, but can be set to more than 3 μm, 4 μm
Above more preferably, less than 10 μm can be set to, less than 7 μm more preferably.The thickness of cement layers 120 is located at if more than 3 μm, can be with
Avoid electromagnetic shielding film 100 be attached to printed substrate before the convex portion 110a of screen layer 110 protruded out from cement layers 120
Come, air can be prevented to be mixed into it between printed substrate.In addition, the thickness of cement layers 120 is located at into less than 10 μm just
Screened film can be made thinner, and the convex portion of screen layer can be made to be connected conscientiously with the earth-return circuit of printed substrate.
(protective layer)
The electromagnetic shielding film of present embodiment can be with matcoveredn 130.As long as protective layer 130 possesses guard shield layer 110
Required certain mechanical strength, chemical resistance and heat resistance etc..As long as protective layer 130 has sufficient insulating properties and energy
Cement layers 120 and screen layer 110 are protected, is not particularly limited, for example, can use thermoplastic resin composition, heat cure
Resin combination or active energy ray-curable constituent etc..
Thermoplastic resin composition is not particularly limited, and can use styrene resin composition, vinyl acetate esters tree
Fat composition, polyester resin constituent, polythylene resin constituent, polypropylene-based resin constituent, acid imide resin
Constituent or acrylic resin constituent etc..Heat-curing resin constituent is not particularly limited, and can use phenolic resinoid
Constituent, epoxylite constituent, polyurethane based resin constituent, melamine resin composition or alkyd based resin group
Into thing etc..Active energy ray-curable constituent is not particularly limited, it is, for example, possible to use at least two methyl-props in molecule
Polymerizable compound of alkene acyloxy etc..Protective layer 130 can be formed by single material, can also be by more than two kinds materials
Formed.
As needed, can be containing curing accelerator, tackifier, antioxidant, pigment, dyestuff, plastic in protective layer 130
At least one in agent, ultra-violet absorber, defoamer, leveling agent, filler, fire retardant, viscosity-controlling agent and anti-blocking agent etc.
Kind.
Protective layer 130 can also be more than two layers different of stacking of the physical properties such as material or hardness or modulus of elasticity
Body.If the layered product constituted for example with the high internal layer of the low outer layer of hardness and hardness, outer layer has the effect of cushion pad, therefore
Electromagnetic shielding film 100 is heated pressurization printed substrate the step in can relax and be added in the pressure of screen layer 110
Power.Therefore, it is possible to prevent partial destruction screen layer 110 that the height set on printed substrate is different.
The thickness of protective layer 130 is not particularly limited, and can suitably be set as needed, can be set to more than 1 μm, be set to 4 μ
More than m more preferably, can be located at less than 20 μm, less than 10 μm more preferably, and less than 5 μm more preferably.The thickness of protective layer 130 is set in 1 μ
More than m is with regard to cement layers 120 and the screen layer 110 of adequately protecting.The thickness of protective layer 130 is set in into less than 20 μm just can be really
Protect the bending of electromagnetic shielding film 100, it is easier to which electromagnetic shielding film 100 is applicable to the part of bending property.
Set concavo-convex part just can be easily in screen layer 110 on the surface of the side of screen layer 110 of protective layer 130
Surface forms convex portion 110a.Now, the Rp on the surface of the side of screen layer 110 of protective layer 130 preferably cement layers thickness with
On, more than 4 μm more preferably, and preferably below 20 μm.
In the case of setting jog on the surface of protective layer 130, protective layer 130 can be the layer containing particle.Add
Plus just easily can form jog on the surface of protective layer 130 if particle.
The particle for being added to protective layer 130 is not particularly limited, and can use well-known particle.Two can such as be used
The inorganic particulate such as silica or aluminum oxide or resin particle etc..
The average grain diameter of the particle added in protective layer 130 can determine according to the concavo-convex size formed on surface,
Can be more than 1 μm, more than 4 μm are more preferably, and can be below 20 μm, and less than 15 μm are more preferably, can be more preferable below 10 μm.Particle
Average grain diameter can increase the bumps on the surface of protective layer 130 more than 1 μm, screen layer 110 in applying heat
Cement layers 120 can be easily passed through.The average grain diameter of particle has its advantage below 20 μm, i.e., can make protective layer
130 thickness are thinner.
The amount added in the particulate of protective layer 130 can be concavo-convex according to what is formed on the thickness of protective layer 130, surface
Size etc. determines that for the resin combination and the summation of particulate that form protective layer 130, its amount can be in 1 matter
More than % is measured, and its amount can be in below 30 mass %, in below 20 mass % more preferably in more than 5 mass % more preferably.Particulate is 1
More than quality % just can form sufficient amount of convex portion on the surface of protective layer 130.Particulate, can if below 30 mass %
Prevent convex portion without stop and cause jog to become gentle.
The particulate form added in protective layer 130 is not particularly limited, can be spherical, needle-like, threadiness, flake and
Any one in dendroid, but if wanting to be easily formed the irregular screen layer 110 in surface of protective layer 130, preferably
It is spherical.
It can be injection processing, plasma irradiating, electron beam photograph that the method for jog is set on the surface of protective layer 130
Penetrate, chemical reagent handles or be embossed processing etc..
(manufacture method of electromagnetic shielding film)
One of manufacture method of electromagnetic shielding film 100 is illustrated below.The electromagnetic shielding film 100 of present embodiment
Manufacture method be not limited to following methods.
（Form protective layer）
First, such as Fig. 2（a）Shown, the coat protective layer constituent in supporting base material 140 forms protective layer 130.Protective layer
It can be prepared with constituent by adding particle 133, solvent and other compounding ingredients in right amount in resin combination 132.Particle
133 are not particularly limited, and can use well-known particulate.Such a particle is such as can use silica or aluminum oxide
Inorganic particulate or be resin microparticle etc..The average grain diameter of particle 133 can more than 1 μm, more than 4 μm more preferably, and its
Can be below 20 μm, below 15 μm more preferably, can be more preferable below 10 μm.Relative to resin combination 132 and particle 133
For summation, the addition of particle 133 can in more than 1 mass %, in more than 5 mass % more preferably, and its can 30 mass % with
Under, in below 20 mass % more preferably.Solvent for example can be toluene, acetone, methyl ethyl ketone, methanol, ethanol, propyl alcohol and diformazan
Base formamide etc..Crosslinking agent, catalyst for polymerization, curing accelerator and colouring agent etc. can be added and be used as other compounding ingredients.Its
He is added as needed on compounding ingredient, can also be without.
Then, the protective layer used constituent of above-mentioned preparation is coated with the one side of supporting base material 140.In supporting base material 140
The method of the protective layer used constituent of one side coating be not particularly limited, can using lip die coating cloth, comma coating, intaglio plate coating,
The widely-known techniques such as slit-type squash type coating.
Supporting base material 140 for example can be membranaceous.Supporting base material 140 is not particularly limited, such as can be by TPO, poly-
The materials such as esters, polyimide, polyphenylene sulfide ethers are formed.It can also be set between supporting base material 140 and protective layer used constituent
Put parting agent layer.
In supporting base material 140 after coat protective layer constituent, heat drying removes solvent, and to form surface with this have
The protective layer 130 of concaveconvex shape.Supporting base material 140 can be peeled off from protective layer 130.The overburden operation of supporting base material 140 can be with
Carried out after electromagnetic shielding film 100 to be attached to printed substrate.So just it can protect electromagnetic shielding film with supporting base material 140
100。
Above method can also be replaced, i.e. supporting base material formation surface of the surface in even shape can also be used
Again in protective layer formation concaveconvex shape after flat protective layer.Concaveconvex shape can be carried out by following processing：Injection
At the wet etchings of realization such as dry etch process, the chemical reagent processing of the realizations such as processing, plasma irradiating or electron beam irradiation
Reason or embossing processing etc..
Such as, in spray treatment, it can dry up ice etc. to form concaveconvex shape to the surface of supporting base material.Add in embossing
In work, there can be the mould of concaveconvex shape to form concaveconvex shape in the surface pressing of supporting base material.
Alternatively, it is also possible to replace the above method with other method, i.e., by there is the supporting base material table of concaveconvex shape on surface
Face coat protective layer is with constituent and is dried and has the protective layer of concaveconvex shape to form surface.
(form screen layer）
Next such as Fig. 2（b）There is convex portion 110a screen layer 110 on the shown surface that formed.By there is the protection of concaveconvex shape
130 surface of layer form the metal film that thickness is 0.1 μm ~ 10 μm has convex portion 110a screen layer 110 with regard to that can be readily formed surface.
Electro deposition method, electroless plating method, sputtering method, e-beam evaporation, vacuum coating can be used by forming the method for metal film
Method, CVD or the organic method of metal etc..
In addition, when forming metal film by electro deposition method and electroless plating method, can be set in metallic film surface formation
Dendritic minute asperities.Therefore, it is possible to make the connection between screen layer 110 and the earth-return circuit of printed substrate more sturdy.
Shielding can also be formed by the way that the conductive paste containing electroconductive particle is coated in into irregular protective layer
Layer.At this point it is possible to fire coating etc. as needed.
It can also be formed on flat protective layer after metal film by making metallic film surface become coarse recessed to be formed with
Convex screen layer.Further, it is also possible to which copper foil is processed into concaveconvex shape by embossing processing and irregular screen is consequently formed
Cover layer.It now can also form unprotected electromagnetic shielding film.
(form cement layers）
Then, such as Fig. 2（c）It is shown, cement layers constituent is coated with screen layer 110, cement layers 120 are formed.Engagement
Oxidant layer includes resin combination and solvent with constituent.Resin combination is not particularly limited, and can select styrene resin group
Into thing, vinylacetate resin composition, polyester resin constituent, polythylene resin constituent, polypropylene-based resin
The thermoplastic resin groups such as constituent, acid imide resin combination, acid amides resin composition or acrylic resin constituent
Into thing or phenolic resinoid constituent, epoxylite constituent, polyurethane based resin constituent, melamine resinoid group
Into heat-curing resin constituent such as thing or alkyd based resin constituent etc..Above-mentioned substance can be used alone, can also be simultaneously
Use more than two kinds.Solvent can for example use toluene, acetone, methyl ethyl ketone, methanol, ethanol, propyl alcohol and dimethyl formyl
Amine etc..As needed, curing accelerator, tackifier, antioxidant, pigment, dye can also be included in cement layers constituent
At least one of material, plasticizer, ultra-violet absorber, defoamer, leveling agent, filler, fire retardant and viscosity modifier etc..
The ratio of resin combination in cement layers constituent can suitably be set according to thickness of cement layers 120 etc..
Next step, is coated with cement layers constituent on screen layer 110.Cement layers are coated with screen layer 110 to use
The method of constituent is not particularly limited, can be using lip die coating cloth, comma coating, intaglio plate coating or the coating of slit-type squash type
Etc. technology.
It is coated with screen layer 110 after cement layers constituent, heat drying removes solvent, forms cement layers
120.Furthermore it is also possible to stick mould release membrance on the surface of cement layers 120 as needed.
The manufacture method of electromagnetic shielding film is not limited to the above method.Such as, the first supporting base material and second can be prepared
Supporting base material, on the surface of the first supporting base material with method coat protective layer constituent similar to the above, forms protective layer
Afterwards, screen layer is re-formed.In addition, being coated with cement layers group on the surface of the second supporting base material by method similar to the above
Into thing, cement layers 120 are formed.Then, the screen layer that is formed in the first supporting base material and the shape in the second supporting base material are made
Into cement layers it is relative and stick together both, with this with regard to electromagnetic shielding film can be made.
Cement layers 120 can be set to insulating properties by the electromagnetic shielding film 100 of present embodiment.It can not now connect
Mixture layer is with adding electroconductive stuffing in constituent.But cement layers 120 can also be electric conductivity, at this point it is possible in engagement
Oxidant layer is with adding electroconductive stuffing in constituent.In the case where adding electroconductive stuffing, similarly, screen layer 110 can be direct
It is connected with earth-return circuit, therefore shielding character is still better than conventional electromagnetic shielding film.Moreover, of the invention and conventional electric conductivity
Cement layers are compared to that can reduce the amount of electroconductive stuffing, therefore, it is possible to reduce cost.Even if in addition, covering earth-return circuit is exhausted
The diameter of the opening portion set in edge layer is smaller, and earth-return circuit can be also connected well with screen layer.
（Shield printed substrate）
The electromagnetic shielding film 100 of present embodiment can be used for shielding printed substrate as described below.As shown in figure 3, shielding
Printed substrate 300 contains printed substrate 200 and electromagnetic shielding film 100.
Printed substrate 200 contains：Basalis 210, it is included in the signal circuit 220A formed on basalis 210 and ground connection
Printing loop 220 including the 220B of loop and covering basalis 210 and at least expose earth-return circuit 220B a part it is exhausted
Edge layer 230.
Basalis 210 and insulating barrier 230 can select arbitrary substance, such as can use resin film etc..Now, it can be with
It is made by following substances：Polypropylene, crosslinked polyethylene, polyester, polybenzimidazoles, polyimides, polyamidoimide, polyethers
The resin such as acid imide or polyphenylene sulfide.Printing loop 220 such as can be copper wire pattern for being formed on basalis 210 etc..
Electromagnetic shielding film 100 is engaged with printed substrate 200 and cement layers 120 is located at the side of insulating barrier 230.
The convex portion 110a of screen layer 110 part passes through cement layers 120 and the earth-return circuit 220B with exposing from insulating barrier 230 connects
Touch.Therefore, electroconductive stuffing is not contained even if cement layers 120 can also make screen layer 110 and earth-return circuit 220B realizations be electrically connected
It is logical, play excellent shielding character.When cement layers 120 are free of electroconductive stuffing, between earth-return circuit 220B and screen layer 110
There is no electroconductive stuffing, therefore the resistance that electroconductive stuffing is produced need not be considered.Therefore, earth-return circuit 220B and screen layer 110
Between resistance value will not significantly decline, so as to show good shielding character.In addition, cement layers 120 are without conduction
During property filler, cement layers 120 can be thinner, so as to make the thickness of shielding printed substrate 300 thinner than ever.
Just the manufacture method of shielding printed substrate 300 is illustrated below.Electromagnetic wave is placed on printed substrate 200
Screened film 100, is heated and pressurizeed with press.A part for the cement layers 120 softened after heating flows into insulation because of pressurization
The opening portion of layer 230.In addition, by pressurization, the convex portion 110a of screen layer 110 at least a portion passes through cement layers 120.With
This connection screen layer 110 and earth-return circuit 220B.Between the recess of screen layer 110, screen layer 110 and printed substrate 200
There are the cement layers 120 of sufficient amount, therefore electromagnetic shielding film 100 is bonded on one with printed substrate 200 with enough intensity
Rise.
Embodiment
（Form electromagnetic shielding film）
Supporting base material uses thick 60 μm and surface has carried out the PET film of release processing.Coating is containing certain in supporting base material
The protective layer used constituent of the silicon dioxide granule of particle diameter, bisphenol type epoxy resinoid and methyl ethyl ketone（The amount of solid composition
30 mass %）, heat drying formation protective layer.Form thick 0.5 μm silver by Vacuum Coating method in protective layer again, thus
Form screen layer.Then, the cement being made up of in shielding layer surface coating epoxylite, forms certain thickness cement
Layer.
(assay method of cement layers thickness)
The protective layer and screen layer to be formed before cement layers are subtracted from the thickness for forming the electromagnetic shielding film after cement layers
Layered product thickness obtained by value be cement layers thickness.Here, each thickness uses micrometer（Mitutoyo companies
System, MDH-25）It is standard test with JIS C 2151.
(assay method of maximum peak height)
The maximum peak height (Rp) of shielding layer surface is the Laser Scanning Confocal Microscope produced with Lasertec companies, according to JIS B0651：
2001 are determined.
(internuncial to evaluate)
Electromagnetic shielding film is sticked temporarily on the surface of printed substrate（120 DEG C, 0.5Mpa, 5 seconds）Afterwards, heating pressurization（170
DEG C, 3Mpa, 30 minutes）, form shielding printed substrate.The printed substrate used, which has, to be had certain intervals mutually and parallel prolongs
The insulating barrier that two copper clad patterns and the polyimides of 25 μm of the thickness of covering copper clad patterns stretched are constituted.Insulating barrier is provided with
Make the opening portion that copper clad patterns are exposed respectively.A diameter of 1mm of opening portion.The electricity between two copper clad patterns is measured with resistance meter
Resistance, the connectivity between copper clad patterns and electromagnetic shielding film is evaluated with this.Resistance is judged as connectivity when being less than 0.4 Ω
Well.
（Embodiment 1）
The particle added in protective layer used constituent is from the silica that particle diameter is 4 μm（It is electrochemically industrial（Strain）System, FB-
5SDC）, the content of silica is 15 mass % for the summation of resin combination and silica.The guarantor obtained
Covering thickness is 6 μm.Shield a height of 4.5 μm of the maximum peak of layer surface.The thickness of cement layers is 3 μm.Resistance value is 0.1 Ω.
（Embodiment 2）
The particle added in protective layer used constituent is from the silica that particle diameter is 9 μm（It is electrochemically industrial（Strain）System, FB-
12D）, dioxide-containing silica is 5 mass % for the summation of resin combination and silica.The protective layer obtained
Thickness be 7 μm.Shield a height of 5.2 μm of the maximum peak of layer surface.The thickness of cement layers is 3 μm.Resistance value is 0.2 Ω.
（Embodiment 3）
In addition to the thickness of cement layers is 5 μm, other are same as Example 2.Resistance value is 0.2 Ω.
（Embodiment 4）
The particle added in protective layer used constituent is from the silica that particle diameter is 9 μm（It is electrochemically industrial（Strain）System, FB-
12D）, dioxide-containing silica is 15 mass % for the summation of resin combination and silica.The protective layer obtained
Thickness is 11 μm.Shield a height of 9.1 μm of the maximum peak of layer surface.Cement layers thickness is 3 μm.Resistance value is 0.1 Ω.
（Embodiment 5）
In addition to cement layers thickness is 5 μm, other are same as Example 4.Resistance value is 0.1 Ω.
（Embodiment 6）
In addition to cement layers thickness is 8 μm, other are same as Example 4.Resistance value is 0.1 Ω.
（Embodiment 7）
The particle added in protective layer used constituent is from the silica that particle diameter is 14 μm（It is electrochemically industrial（Strain）System, FB-
940）, dioxide-containing silica is 5 mass % for the summation of resin combination and silica.Resulting protective layer
Thickness is 16 μm.Shield a height of 8.7 μm of the maximum peak of layer surface.Cement layers thickness is 3 μm.Resistance value is 0.2 Ω.
（Embodiment 8）
In addition to cement layers thickness is 5 μm, other are same as Example 7.Resistance value is 0.2 Ω.
（Embodiment 9）
In addition to cement layers thickness is 8 μm, other are same as Example 7.Resistance value is 0.1 Ω.
（Embodiment 10）
The particle added in protective layer used constituent is from the silica that particle diameter is 14 μm（It is electrochemically industrial（Strain）System, FB-
940）, dioxide-containing silica is 15 mass % for the summation of resin combination and silica.Resulting protective layer
Thickness is 20 μm.Shield a height of 16.3 μm of the maximum peak of layer surface.Cement layers thickness is 3 μm.Resistance value is 0.1 Ω.
（Embodiment 11）
In addition to cement layers thickness is 5 μm, other are same as in Example 10.Resistance value is 0.1 Ω.
（Embodiment 12）
In addition to cement layers thickness is 8 μm, other are same as in Example 10.Resistance value is 0.1 Ω.
（Embodiment 13）
The particle added in protective layer used constituent is from the silica that particle diameter is 14 μm（It is electrochemically industrial（Strain）System, FB-
940）, dioxide-containing silica is 25 mass % for the summation of resin combination and silica.Resulting protective layer
Thickness is 20 μm.Shield a height of 14.6 μm of the maximum peak of layer surface.Cement layers thickness is 3 μm.Resistance value is 0.2 Ω.
（Embodiment 14）
In addition to cement layers thickness is 5 μm, other are identical with embodiment 13.Resistance value is 0.2 Ω.
（Embodiment 15）
In addition to cement layers thickness is 8 μm, other are identical with embodiment 13.Resistance value is 0.2 Ω.
(comparative example 1)
The particle added in protective layer used constituent is from the silica that particle diameter is 4 μm（It is electrochemically industrial（Strain）System, FB-
5SDC）, dioxide-containing silica is 5 mass % for the summation of resin combination and silica.Resulting protective layer
Thickness is 5 μm.Shield a height of 2.2 μm of the maximum peak of layer surface.Cement layers thickness is 3 μm.Resistance value is 0.6 Ω.
(comparative example 2)
In addition to cement layers thickness is 5 μm, other are identical with comparative example 1.Resistance value is 1.4 Ω.
(comparative example 3)
In addition to cement layers thickness is 8 μm, other are identical with comparative example 1.Resistance value is 1.8 Ω.
(comparative example 4)
In addition to cement layers thickness is 5 μm, other are same as Example 1.Resistance value is 0.5 Ω.
(comparative example 5)
In addition to cement layers thickness is 8 μm, other are same as Example 1.Resistance value is 1.3 Ω.
(comparative example 6)
In addition to cement layers thickness is 8 μm, other are same as Example 2.Resistance value is 0.5 Ω.
Centralized displaying each embodiment and comparative example in table 1.
[table 1]
The present invention is not limited to above-mentioned embodiment, can carry out suitably changing in the range of present inventive concept is not changed, answer
With.
Practicality
The high-frequency transmission efficiency of the electromagnetic shielding film of the present invention is not easy to decline, and it is used as the electromagnetism for printed substrate etc.
Ripple screened film etc. is highly useful.
Number explanation
100 electromagnetic shielding films
110 screen layers
110a convex portions
120 cement layers
130 protective layers
132 resin combinations
133 particles
140 supporting base materials
200 printed substrates
210 basalises
220 printing loops
220A signal circuits
220B earth-return circuits
230 insulating barriers
300 shielding printed substrates
Claims (16)
1. a kind of electromagnetic shielding film, it contains：
Irregular conductive shield and
Cover the concavo-convex cement layers；
Wherein, the concavo-convex maximum peak high level is more than the thickness of the cement layers.
2. the electromagnetic shielding film described in claim 1, it is characterised in that：
The concavo-convex maximum peak height is below 20 μm.
3. the electromagnetic shielding film described in claim 1 or 2, it is characterised in that：
The concavo-convex maximum peak height is more than 4 μm.
4. the electromagnetic shielding film described in Claim 1-3 wherein any one, it is characterised in that：
Contain matcoveredn on the face of the opposite side of the cement layers in the screen layer.
5. the electromagnetic shielding film described in claim 4, it is characterised in that：
The maximum peak high level in the face of screen layer side described in the protective layer is more than the thickness of the cement layers and in 20 μ
Below m.
6. the electromagnetic shielding film described in claim 4 or 5, it is characterised in that：
The protective layer contains the particle below more than 1 μm 20 μm of particle diameter.
7. the electromagnetic shielding film described in claim 1 ~ 6 any one, it is characterised in that：
The cement layers are insulating properties.
8. a kind of manufacture method of electromagnetic shielding film, it comprises the steps：
The step of preparing protective layer；
The step of irregular conductive shield being formed on the protective layer；
Formed screen layer described in thickness ratio maximum peak high level is thin and the step of the covering concavo-convex cement layers.
9. the manufacture method of the electromagnetic shielding film described in claim 8, it is characterised in that：
Described is to form surface to have maximum peak height less than 20 μm of concavo-convex protective layer more than 4 μm the step of prepare protective layer
The step of.
10. the manufacture method of the electromagnetic shielding film described in claim 8 or 9, it is characterised in that：
The step of preparation protective layer is that the protective layer used composition containing resin combination and particle is coated with supporting base material
Thing simultaneously makes the step of it solidifies,
The particle diameter of the particle is less than more than 1 μm 20 μm.
11. the manufacture method of the electromagnetic shielding film described in claim 8 or 9, it is characterised in that：
The step of preparation protective layer, is included on supporting base material the step of forming resin bed and in the resin bed shape
Into concavo-convex step.
12. the manufacture method of the electromagnetic shielding film described in claim 11, it is characterised in that：
It is described to form the step of concavo-convex step includes being embossed working process to the resin bed.
13. the manufacture method of the electromagnetic shielding film described in claim 11, it is characterised in that：
It is described to form the step of concavo-convex step includes carrying out spray treatment to the resin bed.
14. the manufacture method of the electromagnetic shielding film described in claim 8 or 9, it is characterised in that：
The step of preparation protective layer, is included in the step of forming resin bed on the irregular supporting base material in surface.
15. the manufacture method of the electromagnetic shielding film described in claim 8 ~ 14 wherein any one, it is characterised in that：
The step of formation cement layers is the step of being coated with cement constituent on the screen layer.
16. one kind shielding printed substrate, it contains：
Electromagnetic shielding film described in claim 1 ~ 7 any one and
Printed substrate, the printed substrate contains：Basalis provided with signal circuit and earth-return circuit and provided with least revealing
Go out the insulating barrier of the opening portion of a part for the earth-return circuit；
Wherein, the electromagnetic shielding film and the printed substrate are engaged and make the cement layers and the insulating barrier phase
To,
The convex portion of the screen layer connects through the cement layers with the earth-return circuit exposed from the opening portion.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-246778 | 2014-12-05 | ||
| JP2014246778 | 2014-12-05 | ||
| PCT/JP2015/006013 WO2016088381A1 (en) | 2014-12-05 | 2015-12-03 | Electromagnetic wave shielding film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107079611A true CN107079611A (en) | 2017-08-18 |
Family
ID=56091343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580063071.9A Pending CN107079611A (en) | 2014-12-05 | 2015-12-03 | Electromagnetic shielding film |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6511473B2 (en) |
| KR (1) | KR101956091B1 (en) |
| CN (1) | CN107079611A (en) |
| TW (1) | TW201640998A (en) |
| WO (1) | WO2016088381A1 (en) |
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| CN108323145A (en) * | 2018-03-14 | 2018-07-24 | 广州方邦电子股份有限公司 | The preparation method of electromagnetic shielding film, wiring board and electromagnetic shielding film |
| CN109819583A (en) * | 2017-11-21 | 2019-05-28 | 拓自达电线株式会社 | Electromagnetic shielding film |
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| CN115486215A (en) * | 2021-02-24 | 2022-12-16 | 拓自达电线株式会社 | Electromagnetic wave shielding film |
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| JP2019046871A (en) * | 2017-08-30 | 2019-03-22 | タツタ電線株式会社 | Electromagnetic wave shield film, shield printed wiring board, and method for manufacturing shield printed wiring board |
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| CN110022640B (en) * | 2018-01-10 | 2022-08-12 | 拓自达电线株式会社 | Electromagnetic wave shielding film |
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| CN108323143A (en) * | 2018-03-14 | 2018-07-24 | 广州方邦电子股份有限公司 | The preparation method of electromagnetic shielding film, wiring board and electromagnetic shielding film |
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| CN111741595A (en) * | 2019-08-01 | 2020-10-02 | 东洋油墨Sc控股株式会社 | Electromagnetic wave shielding sheet and electromagnetic wave shielding printed circuit board |
| CN110519980B (en) * | 2019-09-16 | 2020-12-22 | 深圳市丰正昌精密科技有限公司 | Electromagnetic shielding conductive foam and preparation method thereof |
| CN110519980A (en) * | 2019-09-16 | 2019-11-29 | 苏州盛达飞智能科技股份有限公司 | A kind of electromagnetic shielding conductive foam and preparation method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201640998A (en) | 2016-11-16 |
| KR20170091576A (en) | 2017-08-09 |
| JP6511473B2 (en) | 2019-05-15 |
| WO2016088381A1 (en) | 2016-06-09 |
| JPWO2016088381A1 (en) | 2017-09-14 |
| KR101956091B1 (en) | 2019-03-08 |
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Application publication date: 20170818 |