WO2016088381A1 - Electromagnetic wave shielding film - Google Patents

Electromagnetic wave shielding film Download PDF

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Publication number
WO2016088381A1
WO2016088381A1 PCT/JP2015/006013 JP2015006013W WO2016088381A1 WO 2016088381 A1 WO2016088381 A1 WO 2016088381A1 JP 2015006013 W JP2015006013 W JP 2015006013W WO 2016088381 A1 WO2016088381 A1 WO 2016088381A1
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WO
WIPO (PCT)
Prior art keywords
layer
electromagnetic wave
shielding film
wave shielding
protective layer
Prior art date
Application number
PCT/JP2015/006013
Other languages
French (fr)
Japanese (ja)
Inventor
岩井　靖
善治 柳
茂樹 竹下
Original Assignee
タツタ電線株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by タツタ電線株式会社 filed Critical タツタ電線株式会社
Priority to JP2016562314A priority Critical patent/JP6511473B2/en
Priority to KR1020177004356A priority patent/KR101956091B1/en
Priority to CN201580063071.9A priority patent/CN107079611A/en
Publication of WO2016088381A1 publication Critical patent/WO2016088381A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer

Definitions

  • the present disclosure relates to an electromagnetic wave shielding film, a manufacturing method thereof, and a shield printed wiring board.
  • the conductive adhesive layer is overlapped with the opening provided in the insulating layer covering the ground circuit of the printed wiring board, heated and pressed, and the opening is filled with the conductive adhesive.
  • the shield layer and the ground circuit of the printed wiring board are connected via the conductive adhesive, and the printed wiring board is shielded.
  • This disclosure is intended to realize an electromagnetic wave shielding film having good shielding characteristics, a method for manufacturing the same, and a shield printed wiring board even when conductive particles are not used in the adhesive layer.
  • An aspect of the electromagnetic wave shielding film of the present disclosure includes a conductive shield layer having unevenness and an adhesive layer that covers the unevenness, and the maximum peak height of the unevenness is larger than the thickness of the adhesive layer.
  • the maximum peak height of the unevenness may be 20 ⁇ m or less.
  • the maximum peak height of the unevenness may be 4 ⁇ m or more.
  • One aspect of the electromagnetic wave shielding film may include a protective layer on the surface of the shielding layer opposite to the adhesive layer.
  • the protective layer may have a maximum peak height value on the surface on the shield layer side that is not less than the thickness of the adhesive layer and not more than 20 ⁇ m.
  • the protective layer may contain particles having a particle size of 1 ⁇ m or more and 20 ⁇ m or less.
  • the adhesive layer may be insulative.
  • One aspect of the method for producing an electromagnetic wave shielding film includes a step of preparing a protective layer, a step of forming a conductive shield layer having irregularities on the protective layer, and a thickness higher than the maximum peak height of the shield layer. And a step of forming an adhesive layer covering the unevenness.
  • the step of preparing the protective layer can be a step of forming a protective layer having irregularities having a maximum peak height of 4 ⁇ m or more and 20 ⁇ m or less on the surface.
  • the step of preparing a protective layer is a step of applying and curing a protective layer composition containing a resin composition and particles on a supporting substrate, and particles 1 ⁇ m or more and 20 ⁇ m or less may be used.
  • the step of preparing the protective layer may include a step of forming a resin layer on the support substrate and a step of forming irregularities on the resin layer.
  • the step of forming the unevenness may include a step of embossing the resin layer.
  • the step of forming the unevenness may include a step of blasting the resin layer.
  • the step of preparing the protective layer may include a step of forming a resin layer on a support substrate having irregularities on the surface.
  • the step of forming the adhesive layer may be a step of applying an adhesive composition on the shield layer.
  • a shield printed wiring board of the present disclosure includes the electromagnetic wave shielding film of the present disclosure, a base layer provided with a signal circuit and a ground circuit, and an insulating layer provided with an opening exposing at least a part of the ground circuit.
  • the electromagnetic wave shielding film and the printed wiring board are bonded with the adhesive layer and the insulating layer facing each other, and the convex portion of the shielding layer penetrates the adhesive layer and is exposed from the opening. It is in contact with the ground circuit.
  • the electromagnetic wave shielding film of the present disclosure it is possible to provide an electromagnetic wave shielding film with good shielding characteristics even when conductive particles are not used in the adhesive layer.
  • the electromagnetic wave shielding film 100 As shown in FIG. 1, the electromagnetic wave shielding film 100 according to one embodiment is provided in contact with a conductive shield layer 110 having projections and depressions 110 a and depressions 110 b and a first surface of the shield layer 110. And an adhesive layer 120. The convex portion 110 a of the shield layer 110 is covered with the adhesive layer 120. At least a part of the convex portion 110a of the shield layer 110 penetrates the adhesive layer 120 when the electromagnetic wave shielding film 100 is pressed and attached to the printed wiring board.
  • the maximum peak height of the unevenness of the shield layer may be larger than the thickness (t) of the adhesive layer 120.
  • the value of the maximum peak height (Rp) may be larger than the thickness (t) of the adhesive layer 120, but is preferably 4 ⁇ m or more.
  • the convex portion 110a can easily penetrate the adhesive layer 120 when the shield film is pressed and attached to the printed wiring board. Thereby, the resistance value between the electromagnetic wave shielding film 100 and the ground circuit can be reduced, and good shielding characteristics can be obtained. Further, it is possible to provide an adhesive layer 120 having a sufficient thickness for good adhesion to the printed wiring board.
  • Rp is not particularly limited, but is preferably 20 ⁇ m or less. By setting Rp to 20 ⁇ m or less, the thickness of the electromagnetic wave shielding film 100 can be reduced. Moreover, it becomes easy to ensure the flatness of the surface of the adhesive layer 120, and when the electromagnetic wave shielding film 100 is pressed and attached to the printed wiring board, the adhesive force between the electromagnetic wave shielding film 100 and the printed wiring board is good. Become.
  • the value of the maximum peak height (Rp) in the present invention is a value measured according to JIS B0651: 2001 shown in the examples.
  • the thickness of the adhesive layer 120 is preferably as thin as possible as long as the projection 110a of the shield layer 110 can be covered, but is preferably 3 ⁇ m or more, more preferably 4 ⁇ m or more, and preferably 10 ⁇ m or less, more preferably 7 ⁇ m or less.
  • the thickness of the adhesive layer 120 is 3 ⁇ m or more, even if the Rp value of the unevenness of the shield layer 110 is large, before the electromagnetic wave shielding film 100 is attached to the printed wiring board, the convex portion of the shield layer 110 110a may not protrude from the adhesive layer 120. For this reason, it can suppress that air mixes between the adhesive bond layer 120 and a printed wiring board, and favorable adhesive force is obtained.
  • the thickness is 10 ⁇ m or less, the electromagnetic wave shielding film 100 can be thinned, and the convex portion 110a of the shield layer 110 can be reliably connected to the ground circuit of the printed wiring board.
  • a protective layer 130 can be provided on the second surface of the shield layer 110 opposite to the adhesive layer 120 as necessary.
  • the protective layer 130 can be formed of an insulating resin material or the like.
  • the convex portion 110 a can be easily formed on the first surface of the shield layer 110 by providing irregularities on the surface of the protective layer 130 on the shield layer 110 side.
  • the Rp on the surface of the protective layer 130 may be equal to or greater than the thickness of the adhesive layer, preferably 4 ⁇ m to 20 ⁇ m. By setting it as such a structure, Rp of the 1st surface of the shield layer 110 can be easily 4 micrometers or more and 20 micrometers or less.
  • the shield layer 110 can be a metal film or a conductive film made of conductive particles.
  • the metal film can be formed of, for example, nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, or an alloy containing any one or more of these.
  • a method for forming the metal film for example, a rolling method, an electrolytic plating method, an electroless plating method, a sputtering method, an electron beam evaporation method, a vacuum evaporation method, a CVD method, a metal organic method, or the like can be used.
  • the conductive particles can be, for example, carbon, silver, copper, nickel, solder, or silver-coated copper particles obtained by performing silver plating on copper powder.
  • particles obtained by performing metal plating on insulating particles such as resin balls or glass beads can be used. These conductive particles can be used alone or in combination of two or more.
  • the shape of the conductive particles may be spherical, needle-like, fibrous, flaky, or dendritic, and is preferably flaky from the viewpoint of layering.
  • the particle diameter of the conductive particles is not particularly limited, but can be 0.1 ⁇ m or more and 10 ⁇ m or less from the viewpoint of thinning the shield layer 110.
  • the thickness of the shield layer 110 may be appropriately selected according to the required electromagnetic shielding characteristics and repeated bending / sliding resistance, but may be about 0.1 ⁇ m or more and 10 ⁇ m or less.
  • the adhesive layer 120 may be insulative or conductive. From the viewpoint of filling into a small-diameter opening, it is preferable to make the adhesive layer 120 insulative. By making the adhesive layer 120 a layer that does not contain conductive fillers such as metal particles, there is also an advantage that the thickness of the adhesive layer 120 can be made thinner.
  • the adhesive layer 120 is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, an amide resin.
  • Thermoplastic resin compositions such as resin compositions or acrylic resin compositions, or phenolic resin compositions, epoxy resin compositions, urethane resin compositions, melamine resin compositions, alkyd resin compositions, etc.
  • a thermosetting resin composition or the like can be used. These may be used alone or in combination of two or more.
  • a curing accelerator In the adhesive layer 120, a curing accelerator, tackifier, antioxidant, pigment, dye, plasticizer, ultraviolet absorber, antifoaming agent, leveling agent, filler, flame retardant, and At least one of a viscosity modifier and the like may be included.
  • the thickness of the adhesive layer 120 is not particularly limited and may be appropriately set as necessary, but may be 3 ⁇ m or more, preferably 4 ⁇ m or more, 10 ⁇ m or less, preferably 7 ⁇ m or less.
  • the thickness of the adhesive layer 120 is not particularly limited and may be appropriately set as necessary, but may be 3 ⁇ m or more, preferably 4 ⁇ m or more, 10 ⁇ m or less, preferably 7 ⁇ m or less.
  • the electromagnetic wave shielding film of this embodiment may have a protective layer 130.
  • the protective layer 130 only needs to satisfy predetermined mechanical strength, chemical resistance, heat resistance, and the like that can protect the shield layer 110.
  • the protective layer 130 is not particularly limited as long as it has sufficient insulating properties and can protect the adhesive layer 120 and the shield layer 110.
  • the protective layer 130 is a thermoplastic resin composition, a thermosetting resin composition, or an active energy ray curable. A composition or the like can be used.
  • the thermoplastic resin composition is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, Alternatively, an acrylic resin composition or the like can be used.
  • a thermosetting resin composition A phenol-type resin composition, an epoxy-type resin composition, a urethane-type resin composition, a melamine-type resin composition, or an alkyd-type resin composition etc. can be used.
  • an active energy ray curable composition For example, the polymeric compound etc. which have at least 2 (meth) acryloyloxy group in a molecule
  • the protective layer 130 may be formed of a single material or may be formed of two or more kinds of materials.
  • a curing accelerator for the protective layer 130, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, and a viscosity adjuster as necessary. At least one of an agent, an anti-blocking agent and the like may be included.
  • the protective layer 130 may be a laminate of two or more layers having different materials, physical properties such as hardness or elastic modulus. For example, if a laminate of an outer layer having a low hardness and an inner layer having a high hardness is used, the outer layer has a cushioning effect, so that the pressure applied to the shield layer 110 is reduced in the process of heating and pressing the electromagnetic wave shielding film 100 to the printed wiring board. it can. For this reason, it can suppress that the shield layer 110 is destroyed by the level
  • the thickness of the protective layer 130 is not particularly limited and can be appropriately set as necessary. However, the thickness is 1 ⁇ m or more, preferably 4 ⁇ m or more, and 20 ⁇ m or less, preferably 10 ⁇ m or less, more preferably 5 ⁇ m or less. Can do. By setting the thickness of the protective layer 130 to 1 ⁇ m or more, the adhesive layer 120 and the shield layer 110 can be sufficiently protected. By setting the thickness of the protective layer 130 to 20 ⁇ m or less, the flexibility of the electromagnetic wave shielding film 100 can be ensured, and it becomes easy to apply the electromagnetic wave shielding film 100 to a member that requires flexibility.
  • Rp on the surface of the protective layer 130 on the shield layer 110 side is preferably not less than the thickness of the adhesive layer, preferably not less than 4 ⁇ m and not more than 20 ⁇ m.
  • the protective layer 130 can be a layer containing particles. Unevenness can be easily formed on the surface of the protective layer 130 by adding particles.
  • the particles added to the protective layer 130 are not particularly limited, and known particles can be used.
  • inorganic particles such as silica or alumina, or resin particles can be used.
  • the average particle diameter of the particles added to the protective layer 130 can be determined according to the size of the irregularities formed on the surface, but is 1 ⁇ m or more, preferably 4 ⁇ m or more, and 20 ⁇ m or less, preferably 15 ⁇ m or less, more preferably Can be 10 ⁇ m or less.
  • the average particle diameter of the particles can be 1 ⁇ m or more, unevenness on the surface of the protective layer 130 can be increased, and the shield layer 110 can easily penetrate the adhesive layer 120 in the heating and pressing step.
  • By setting the average particle size of the particles to 20 ⁇ m or less there is an advantage that the thickness of the protective layer 130 can be reduced.
  • the amount of the fine particles added to the protective layer 130 can be determined according to the thickness of the protective layer 130, the size of the irregularities formed on the surface, etc., but the resin composition forming the protective layer 130 and the fine particles
  • the total content can be 1% by mass or more, preferably 5% by mass or more, and 30% by mass or less, preferably 20% by mass or less.
  • the shape of the fine particles added to the protective layer 130 is not particularly limited, and may be any of a spherical shape, a needle shape, a fiber shape, a flake shape, and a dendritic shape, but the shield layer 110 having irregularities on the surface of the protective layer 130. From the viewpoint of easily forming the film, it is preferably spherical.
  • blasting As a method of providing irregularities on the surface of the protective layer 130, blasting, plasma irradiation, electron beam irradiation, chemical treatment, embossing, or the like can be used.
  • a protective layer composition is formed by applying a protective layer composition on a support substrate 140.
  • the protective layer composition can be prepared by adding appropriate amounts of particles 133, a solvent, and other compounding agents to the resin composition 132.
  • the particles 133 are not particularly limited, and known fine particles can be used. Examples of such particles include inorganic particles such as silica or alumina, or resin fine particles.
  • the average particle diameter of the particles 133 can be 1 ⁇ m or more, preferably 4 ⁇ m or more, and 20 ⁇ m or less, preferably 15 ⁇ m or less, more preferably 10 ⁇ m or less.
  • the blending amount of the particles 133 can be 1% by mass or more, preferably 5% by mass or more, and 30% by mass or less, preferably 20% by mass or less with respect to the total of the resin composition 132 and the particles 133.
  • the solvent can be, for example, toluene, acetone, methyl ethyl ketone, methanol, ethanol, propanol, dimethylformamide, and the like.
  • a crosslinking agent, a polymerization catalyst, a curing accelerator, a colorant, and the like can be added. Other compounding agents may be added if necessary, and may not be added.
  • the protective layer composition prepared above is applied to one side of the support substrate 140.
  • the method for applying the protective layer composition to one side of the support substrate 140 is not particularly limited, and known techniques such as lip coating, comma coating, gravure coating, and slot die coating can be employed.
  • the support substrate 140 can be formed into a film, for example.
  • the support substrate 140 is not particularly limited, and can be formed of, for example, a polyolefin-based material, a polyester-based material, a polyimide-based material, a polyphenylene sulfide-based material, or the like.
  • a release agent layer may be provided between the support substrate 140 and the protective layer composition.
  • the solvent is removed by heating and drying, whereby the protective layer 130 having an uneven shape on the surface is formed.
  • the support substrate 140 can be peeled from the protective layer 130.
  • the support substrate 140 can be peeled after the electromagnetic wave shielding film 100 is attached to the printed wiring board. In this way, the electromagnetic shielding film 100 can be protected by the support substrate 140.
  • an uneven shape may be formed on the surface of the protective layer after forming a protective layer having a flat surface using a support base having a flat surface.
  • the concavo-convex shape can be formed by blasting, dry etching by plasma irradiation or electron beam irradiation, wet etching by chemical treatment, embossing, or the like.
  • an uneven shape by spraying dry ice or the like on the surface of the support substrate.
  • an uneven shape can be imparted by pressing a mold having an uneven shape onto the surface of the support substrate.
  • a protective layer having a concavo-convex shape on the surface may be formed by applying and drying the composition for the protective layer on the surface of the support substrate having the concavo-convex shape on the surface.
  • a shield layer 110 having a convex portion 110a on the surface is formed.
  • the shield layer 110 having the convex portions 110a on the surface can be easily formed by forming a metal film having a thickness of about 0.1 ⁇ m to 10 ⁇ m on the surface of the protective layer 130 having an uneven shape.
  • the metal film can be formed by an electrolytic plating method, an electroless plating method, a sputtering method, an electron beam evaporation method, a vacuum evaporation method, a CVD method, a metal organic method, or the like.
  • the shield layer may be formed by coating a conductive paste containing conductive particles on the surface of the protective layer having irregularities. In this case, the coating layer can be baked as necessary.
  • the shield layer having irregularities can be formed by roughening the surface of the metal film.
  • corrugation can also be formed by processing a copper foil into an uneven
  • the composition for an adhesive layer includes a resin composition and a solvent.
  • the resin composition is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, an amide resin.
  • Compositions, or thermoplastic resin compositions such as acrylic resin compositions, or phenolic resin compositions, epoxy resin compositions, urethane resin compositions, melamine resin compositions, alkyd resin compositions, etc. It can be set as a thermosetting resin composition or the like.
  • the solvent can be, for example, toluene, acetone, methyl ethyl ketone, methanol, ethanol, propanol, dimethylformamide, and the like.
  • the composition for the adhesive layer is cured accelerator, tackifier, antioxidant, pigment, dye, plasticizer, ultraviolet absorber, antifoaming agent, leveling agent, filler, flame retardant, and At least one of a viscosity modifier and the like may be included. What is necessary is just to set the ratio of the resin composition in the composition for adhesive bond layers suitably according to the thickness etc. of the adhesive bond layer 120.
  • an adhesive layer composition is applied on the shield layer 110.
  • the method for applying the adhesive layer composition on the shield layer 110 is not particularly limited, and lip coating, comma coating, gravure coating, slot die coating, or the like can be used.
  • the solvent is removed by heating and drying to form the adhesive layer 120.
  • the manufacturing method of the electromagnetic wave shielding film is not limited to the above method. For example, after preparing a first support base and a second support base, applying a protective layer composition on the surface of the first support base in the same manner as described above to form a protective layer, Further, a shield layer is formed. Further, the adhesive layer 120 is formed on the surface of the second support substrate by applying the adhesive layer composition in the same manner as described above. Subsequently, an electromagnetic wave shielding film can also be produced by bonding the shield layer formed on the first support substrate and the adhesive layer formed on the second support substrate while facing each other.
  • the electromagnetic wave shielding film 100 of the present embodiment can make the adhesive layer 120 insulative.
  • the adhesive layer 120 may be conductive, and in this case, a conductive filler can be added to the adhesive layer composition.
  • a conductive filler can be added to the adhesive layer composition.
  • the shield layer 110 is directly connected to the ground circuit, the shielding characteristics are improved as compared with the conventional electromagnetic wave shielding film.
  • the amount of the conductive filler can be reduced as compared with the conventional conductive adhesive layer, and the cost can be reduced. Furthermore, even if the diameter of the opening formed in the insulating layer covering the ground circuit is small, the connection between the ground circuit and the shield layer is good.
  • the electromagnetic wave shielding film 100 of this embodiment can be used for the following shield printed wiring boards.
  • the shield printed wiring board 300 includes a printed wiring board 200 and an electromagnetic wave shielding film 100.
  • the printed wiring board 200 covers the base layer 210, the printed circuit 220 including the signal circuit 220A and the ground circuit 220B formed on the base layer 210, and the base layer 210 so as to expose at least part of the ground circuit 220B. And an insulating layer 230.
  • the base layer 210 and the insulating layer 230 may be any material, but may be a resin film, for example. In this case, it can be formed of a resin such as polypropylene, cross-linked polyethylene, polyester, polybenzimidazole, polyimide, polyimide amide, polyether imide, or polyphenylene sulfide.
  • the printed circuit 220 may be a copper wiring pattern formed on the base layer 210, for example.
  • the electromagnetic wave shielding film 100 is bonded to the printed wiring board 200 with the adhesive layer 120 on the insulating layer 230 side.
  • a part of the projection 110 a of the shield layer 110 penetrates the adhesive layer 120 and is in contact with the ground circuit 220 ⁇ / b> B exposed from the insulating layer 230.
  • the shield layer 110 and the ground circuit 220 ⁇ / b> B can be electrically connected to exhibit excellent shielding characteristics.
  • the adhesive layer 120 does not include a conductive filler, there is no conductive filler between the ground circuit 220B and the shield layer 110, and thus there is no need to consider resistance due to the conductive filler.
  • the resistance value between the ground circuit 220B and the shield layer 110 is not significantly reduced, and thus excellent shield characteristics are exhibited. Furthermore, when the adhesive layer 120 does not contain a conductive filler, the adhesive layer 120 can be made thinner, and the thickness of the shield printed wiring board 300 can be made thinner than before.
  • the electromagnetic wave shielding film 100 is placed on the printed wiring board 200 and pressed while being heated by a press. A part of the adhesive layer 120 softened by heating flows into the opening of the insulating layer 230 by pressurization. Further, at least a part of the convex portion 110 a of the shield layer 110 penetrates the adhesive layer 120 by pressurization. Thereby, the shield layer 110 and the ground circuit 220B are connected. Since there is a sufficient amount of adhesive layer 120 between the shield layer 110 and the printed wiring board 200 in the concave portion of the shield layer 110, the electromagnetic wave shielding film 100 and the printed wiring board 200 have sufficient strength. Glued with.
  • a PET film having a thickness of 60 ⁇ m and a surface subjected to a release treatment was used as a supporting substrate.
  • a protective layer is formed by applying a composition for a protective layer (solid content 30% by mass) containing silica particles having a predetermined particle size, bisphenol A type epoxy resin and methyl ethyl ketone on a support substrate and drying by heating. did.
  • a shield layer was formed by depositing silver having a thickness of 0.5 ⁇ m on the surface of the protective layer.
  • an adhesive made of an epoxy resin was applied to the surface of the shield layer to form an adhesive layer having a predetermined thickness.
  • ⁇ Method for measuring thickness of adhesive layer The value obtained by subtracting the thickness of the laminate of the protective layer and the shield layer before forming the adhesive layer from the thickness of the electromagnetic wave shielding film after forming the adhesive layer was taken as the thickness of the adhesive layer. Each thickness was measured according to JIS C 2151 using a micrometer (MDH-25 manufactured by Mitutoyo Corporation).
  • the maximum peak height (Rp) of the shield layer surface was measured according to JIS B0651: 2001 using a confocal microscope manufactured by Lasertec.
  • An electromagnetic wave shielding film was temporarily attached to the surface of the printed wiring board (120 ° C., 0.5 MPa, 5 seconds), and then heated and pressurized (170 ° C., 3 MPa, 30 minutes) to form a shield printed wiring board.
  • the printed wiring board one having two copper foil patterns extending in parallel at an interval and an insulating layer made of polyimide having a thickness of 25 ⁇ m covering the copper foil pattern was used.
  • the insulating layer was provided with an opening for exposing each copper foil pattern. The diameter of the opening was 1 mm.
  • the connectivity between the copper foil pattern and the electromagnetic wave shielding film was evaluated by measuring the electrical resistance value between the two copper foil patterns with a resistance meter. When the electrical resistance is less than 0.4 ⁇ , the connectivity is considered good.
  • Example 1 Particles added to the protective layer composition were silica having a particle diameter of 4 ⁇ m (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-5SDC), and the silica content was 15% by mass with respect to the total of the resin composition and silica. .
  • the thickness of the obtained protective layer was 6 ⁇ m.
  • the maximum peak height on the shield layer surface was 4.5 ⁇ m.
  • the thickness of the adhesive layer was 3 ⁇ m.
  • the resistance value was 0.1 ⁇ .
  • Example 2 The particles added to the protective layer composition were silica having a particle size of 9 ⁇ m (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-12D), and the silica content was 5% by mass with respect to the total of the resin composition and silica. .
  • the thickness of the obtained protective layer was 7 ⁇ m.
  • the maximum peak height on the shield layer surface was 5.2 ⁇ m.
  • the thickness of the adhesive layer was 3 ⁇ m.
  • the resistance value was 0.2 ⁇ .
  • Example 3 The procedure was the same as Example 2 except that the thickness of the adhesive layer was 5 ⁇ m. The resistance value was 0.2 ⁇ .
  • Example 4 The particles added to the protective layer composition were silica having a particle size of 9 ⁇ m (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-12D), and the silica content was 15% by mass with respect to the total of the resin composition and silica. .
  • the thickness of the obtained protective layer was 11 ⁇ m.
  • the maximum peak height on the shield layer surface was 9.1 ⁇ m.
  • the thickness of the adhesive layer was 3 ⁇ m.
  • the resistance value was 0.1 ⁇ .
  • Example 5 The same operation as in Example 4 was conducted except that the thickness of the adhesive layer was changed to 5 ⁇ m. The resistance value was 0.1 ⁇ .
  • Example 6 The same operation as in Example 4 was conducted except that the thickness of the adhesive layer was 8 ⁇ m. The resistance value was 0.1 ⁇ .
  • Example 7 The particles added to the protective layer composition were silica having a particle diameter of 14 ⁇ m (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-940), and the silica content was 5% by mass with respect to the total of the resin composition and silica. .
  • the thickness of the protective layer obtained was 16 ⁇ m.
  • the maximum peak height on the shield layer surface was 8.7 ⁇ m.
  • the thickness of the adhesive layer was 3 ⁇ m.
  • the resistance value was 0.2 ⁇ .
  • Example 7 Example 7 was repeated except that the thickness of the adhesive layer was 5 ⁇ m. The resistance value was 0.2 ⁇ .
  • Example 9 The procedure was the same as Example 7 except that the thickness of the adhesive layer was 8 ⁇ m. The resistance value was 0.1 ⁇ .
  • Example 10 Particles added to the protective layer composition were silica having a particle size of 14 ⁇ m (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-940), and the content of silica was 15% by mass with respect to the total of the resin composition and silica. .
  • the thickness of the obtained protective layer was 20 ⁇ m.
  • the maximum peak height on the shield layer surface was 16.3 ⁇ m.
  • the thickness of the adhesive layer was 3 ⁇ m.
  • the resistance value was 0.1 ⁇ .
  • Example 11 Example 10 was repeated except that the thickness of the adhesive layer was 5 ⁇ m. The resistance value was 0.1 ⁇ .
  • Example 12 The procedure was the same as Example 10 except that the thickness of the adhesive layer was 8 ⁇ m. The resistance value was 0.1 ⁇ .
  • the particles added to the protective layer composition were silica having a particle size of 14 ⁇ m (FB-940, manufactured by Denki Kagaku Kogyo Co., Ltd.), and the silica content was 25% by mass with respect to the total of the resin composition and silica. did.
  • the thickness of the obtained protective layer was 20 ⁇ m.
  • the maximum peak height on the shield layer surface was 14.6 ⁇ m.
  • the thickness of the adhesive layer was 3 ⁇ m.
  • the resistance value was 0.2 ⁇ .
  • Example 14 Example 13 was repeated except that the thickness of the adhesive layer was 5 ⁇ m. The resistance value was 0.2 ⁇ .
  • Example 15 Example 13 was repeated except that the thickness of the adhesive layer was 8 ⁇ m. The resistance value was 0.2 ⁇ .
  • Particles added to the protective layer composition were silica having a particle size of 4 ⁇ m (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-5SDC), and the silica content was 5% by mass with respect to the total of the resin composition and silica. .
  • the thickness of the obtained protective layer was 5 ⁇ m.
  • the maximum peak height on the shield layer surface was 2.2 ⁇ m.
  • the thickness of the adhesive layer was 3 ⁇ m.
  • the resistance value was 0.6 ⁇ .
  • Comparative Example 2 Comparative Example 1 was performed except that the thickness of the adhesive layer was changed to 5 ⁇ m. The resistance value was 1.4 ⁇ .
  • Comparative Example 3 Comparative Example 1 was performed except that the thickness of the adhesive layer was 8 ⁇ m. The resistance value was 1.8 ⁇ .
  • Example 4 The procedure was the same as Example 1 except that the thickness of the adhesive layer was 5 ⁇ m. The resistance value was 0.5 ⁇ .
  • Example 5 The procedure was the same as Example 1 except that the thickness of the adhesive layer was 8 ⁇ m. The resistance value was 1.3 ⁇ .
  • Example 6 The procedure was the same as Example 2 except that the thickness of the adhesive layer was 8 ⁇ m. The resistance value was 0.5 ⁇ .
  • Table 1 summarizes each example and comparative example.
  • the present invention is not limited to the above-described embodiment, and can be applied with appropriate modifications within a range that does not change the gist of the present invention.
  • the electromagnetic shielding film of the present disclosure is useful as an electromagnetic shielding film used for a printed wiring board and the like because the high-frequency transmission efficiency is unlikely to decrease.
  • Electromagnetic wave shield film 110 Shield layer 110a Protrusion part 120 Adhesive layer 130 Protective layer 132 Resin composition 133 Particle 140 Support base material 200 Printed wiring board 210 Base layer 220 Printed circuit 220A Signal circuit 220B Ground circuit 230 Insulating layer 300 Shield printed wiring Board

Abstract

An electromagnetic wave shielding film is provided with an electroconductive shield layer 110 having protrusions and recesses, and an adhesive layer 120 for coating the protrusions and recesses. The maximum peak height of the protrusions and recesses is greater than the thickness of the adhesive layer 120.

Description

電磁波シールドフィルムElectromagnetic shielding film
　本開示は、電磁波シールドフィルム及びその製造方法、シールドプリント配線板に関する。 The present disclosure relates to an electromagnetic wave shielding film, a manufacturing method thereof, and a shield printed wiring board.
　近年、スマートフォンやタブレット型情報端末には、大容量のデータを高速に伝送する性能が求められている。大容量のデータを高速伝送するためには高周波信号を用いる必要がある。しかし、高周波信号を用いると、プリント配線板に設けられた信号回路から電磁波ノイズが発生し、周辺機器が誤動作しやすくなる。このような誤動作を防止するために、プリント配線板を電磁波からシールドすることが重要となる。 In recent years, smartphones and tablet-type information terminals are required to have a capability of transmitting a large amount of data at high speed. In order to transmit a large amount of data at high speed, it is necessary to use a high-frequency signal. However, when a high-frequency signal is used, electromagnetic noise is generated from the signal circuit provided on the printed wiring board, and peripheral devices are liable to malfunction. In order to prevent such a malfunction, it is important to shield the printed wiring board from electromagnetic waves.
　プリント配線板をシールドする方法として、シールド層と導電性接着剤層とを有する電磁波シールドフィルムを使用することが検討されている（例えば、特許文献１～３を参照。）。 As a method for shielding a printed wiring board, use of an electromagnetic wave shielding film having a shield layer and a conductive adhesive layer has been studied (see, for example, Patent Documents 1 to 3).
　これら電磁波シールドフィルムは、導電性接着剤層を、プリント配線板のグランド回路を被覆する絶縁層に設けられた開口部と重ねあわせて、加熱加圧し、開口部に導電性接着剤を充填する。これにより、シールド層とプリント配線板のグランド回路とが、導電性接着剤を介して接続され、プリント配線板がシールドされる。 In these electromagnetic wave shielding films, the conductive adhesive layer is overlapped with the opening provided in the insulating layer covering the ground circuit of the printed wiring board, heated and pressed, and the opening is filled with the conductive adhesive. Thereby, the shield layer and the ground circuit of the printed wiring board are connected via the conductive adhesive, and the printed wiring board is shielded.
特開２００４－０９５５６６号公報JP 2004-095566 A ＷＯ２００６／０８８１２７号パンフレットWO2006 / 088127 pamphlet ＷＯ２００９／０１９９６３号パンフレットWO2009 / 019963 pamphlet
　しかしながら、導電性接着剤層に含まれる導電性粒子の導電率が低い場合には、シールド層とグランド回路との間の接続抵抗が増大し、シールド特性を低下させる要因になる。そのため、シールドフィルムの導電性接着剤層には、銀粉や銀コート銅粉等の導電率の高い導電性粒子が使用されているが、銀等を使用するため原材料コストが増加するという問題を有する。また、プリント配線板の実装密度が高まるにつれて、グランド回路を被覆する絶縁層に設けられた開口部の径も小さくなる傾向にある。開口部の径が小さくなると、導電性粒子が大量に含まれた導電性接着剤層が開口部に充填されにくくなるという問題も有する。 However, when the conductivity of the conductive particles contained in the conductive adhesive layer is low, the connection resistance between the shield layer and the ground circuit increases, which causes a decrease in shield characteristics. Therefore, conductive particles with high conductivity such as silver powder or silver-coated copper powder are used for the conductive adhesive layer of the shield film. However, since silver or the like is used, there is a problem that raw material costs increase. . Further, as the mounting density of the printed wiring board increases, the diameter of the opening provided in the insulating layer covering the ground circuit tends to decrease. When the diameter of the opening is reduced, there is also a problem that it is difficult to fill the opening with a conductive adhesive layer containing a large amount of conductive particles.
　また、スマートフォンやタブレット型情報端末には薄型化軽量化の要求が高まっており、電磁波シールドフィルムをさらに薄くすることが求められている。しかしながら、導電性接着剤層を有する場合には、電磁波シールドフィルムをさらに薄くすることが困難である。 In addition, there is an increasing demand for thinner and lighter smartphones and tablet-type information terminals, and it is required to make the electromagnetic shielding film thinner. However, when it has a conductive adhesive layer, it is difficult to make the electromagnetic wave shielding film thinner.
　本開示は、接着剤層に導電性粒子を使用しない場合であってもシールド特性が良好な電磁波シールドフィルム及びその製造方法並びにシールドプリント配線板を実現できるようにすることを目的とする。 This disclosure is intended to realize an electromagnetic wave shielding film having good shielding characteristics, a method for manufacturing the same, and a shield printed wiring board even when conductive particles are not used in the adhesive layer.
　本開示の電磁波シールドフィルムの一態様は、凹凸を有する導電性のシールド層と、凹凸を被覆する接着剤層とを備え、凹凸の最大山高さの値は、接着剤層の厚さよりも大きい。 An aspect of the electromagnetic wave shielding film of the present disclosure includes a conductive shield layer having unevenness and an adhesive layer that covers the unevenness, and the maximum peak height of the unevenness is larger than the thickness of the adhesive layer.
　電磁波シールドフィルムの一態様において、凹凸の最大山高さは、２０μｍ以下としてもよい。 In one aspect of the electromagnetic wave shielding film, the maximum peak height of the unevenness may be 20 μm or less.
　電磁波シールドフィルムの一態様において、凹凸の最大山高さは、４μｍ以上としてもよい。 In one aspect of the electromagnetic wave shielding film, the maximum peak height of the unevenness may be 4 μm or more.
　電磁波シールドフィルムの一態様は、シールド層における接着剤層と反対側の面に保護層を備えていてもよい。 One aspect of the electromagnetic wave shielding film may include a protective layer on the surface of the shielding layer opposite to the adhesive layer.
　電磁波シールドフィルムの一態様において、保護層は、シールド層側の面の最大山高さの値が、接着剤層の厚さ以上、２０μｍ以下であってもよい。 In one aspect of the electromagnetic wave shielding film, the protective layer may have a maximum peak height value on the surface on the shield layer side that is not less than the thickness of the adhesive layer and not more than 20 μm.
　電磁波シールドフィルムの一態様において保護層は、粒径が１μｍ以上、２０μｍ以下の粒子を含有していてもよい。 In one embodiment of the electromagnetic wave shielding film, the protective layer may contain particles having a particle size of 1 μm or more and 20 μm or less.
　電磁波シールドフィルムの一態様において、接着剤層は絶縁性であってもよい。 In one embodiment of the electromagnetic wave shielding film, the adhesive layer may be insulative.
　電磁波シールドフィルムの製造方法の一態様は、保護層を準備する工程と、保護層の上に凹凸を有する導電性のシールド層を形成する工程と、シールド層の最大山高さの値よりも厚さが薄く、且つ、凹凸を被覆する接着剤層を形成する工程とを備えている。 One aspect of the method for producing an electromagnetic wave shielding film includes a step of preparing a protective layer, a step of forming a conductive shield layer having irregularities on the protective layer, and a thickness higher than the maximum peak height of the shield layer. And a step of forming an adhesive layer covering the unevenness.
　電磁波シールドフィルムの製造方法の一態様において、保護層を準備する工程は、最大山高さが４μｍ以上、２０μｍ以下の凹凸を表面に有する保護層を形成する工程とすることができる。 In one embodiment of the method for producing an electromagnetic wave shielding film, the step of preparing the protective layer can be a step of forming a protective layer having irregularities having a maximum peak height of 4 μm or more and 20 μm or less on the surface.
　電磁波シールドフィルムの製造方法の一態様において、保護層を準備する工程は、支持基材の上に、樹脂組成物と粒子とを含む保護層用組成物を塗布して硬化させる工程であり、粒子の粒径は、１μｍ以上、２０μｍ以下であってもよい。 In one embodiment of the method for producing an electromagnetic wave shielding film, the step of preparing a protective layer is a step of applying and curing a protective layer composition containing a resin composition and particles on a supporting substrate, and particles 1 μm or more and 20 μm or less may be used.
　電磁波シールドフィルムの製造方法の一態様において、保護層を準備する工程は、支持基材の上に樹脂層を形成する工程と、樹脂層に凹凸を形成する工程とを含んでいてもよい。 In one aspect of the method for producing an electromagnetic wave shielding film, the step of preparing the protective layer may include a step of forming a resin layer on the support substrate and a step of forming irregularities on the resin layer.
　電磁波シールドフィルムの製造方法の一態様において、凹凸を形成する工程は、樹脂層をエンボス加工処理する工程を含んでいてもよい。 In one aspect of the method for producing an electromagnetic wave shielding film, the step of forming the unevenness may include a step of embossing the resin layer.
　電磁波シールドフィルムの製造方法の一態様において、凹凸を形成する工程は、樹脂層をブラスト処理する工程を含んでいてもよい。 In one aspect of the method for producing an electromagnetic wave shielding film, the step of forming the unevenness may include a step of blasting the resin layer.
　電磁波シールドフィルムの製造方法の一態様において、保護層を準備する工程は、表面に凹凸を有する支持基材の上に樹脂層を形成する工程を含んでいてもよい。 In one aspect of the method for producing an electromagnetic wave shielding film, the step of preparing the protective layer may include a step of forming a resin layer on a support substrate having irregularities on the surface.
　電磁波シールドフィルムの製造方法の一態様において、接着剤層を形成する工程は、シールド層の上に、接着剤用組成物を塗布する工程であってもよい。 In one aspect of the method for producing an electromagnetic wave shielding film, the step of forming the adhesive layer may be a step of applying an adhesive composition on the shield layer.
　本開示のシールドプリント配線板は、本開示の電磁波シールドフィルムと、信号回路及びグランド回路が設けられたベース層と、グランド回路の少なくとも一部を露出する開口部が設けられた絶縁層とを有するプリント配線板とを備え、電磁波シールドフィルムと、プリント配線板とは、接着剤層と絶縁層とを対向させて接着され、シールド層の凸部は、接着剤層を突き抜けて、開口部から露出したグランド回路と接している。 A shield printed wiring board of the present disclosure includes the electromagnetic wave shielding film of the present disclosure, a base layer provided with a signal circuit and a ground circuit, and an insulating layer provided with an opening exposing at least a part of the ground circuit. The electromagnetic wave shielding film and the printed wiring board are bonded with the adhesive layer and the insulating layer facing each other, and the convex portion of the shielding layer penetrates the adhesive layer and is exposed from the opening. It is in contact with the ground circuit.
　本開示の電磁波シールドフィルムによれば、接着剤層に導電性粒子を使用しない場合であってもシールド特性が良好な電磁波シールドフィルムを提供することができる。 According to the electromagnetic wave shielding film of the present disclosure, it is possible to provide an electromagnetic wave shielding film with good shielding characteristics even when conductive particles are not used in the adhesive layer.
一実施形態に係る電磁波シールドフィルムを示す断面図である。It is sectional drawing which shows the electromagnetic wave shielding film which concerns on one Embodiment. （ａ）～（ｃ）は、一実施形態に係る電磁波シールドフィルムの製造方法を工程順に示す断面図である。(A)-(c) is sectional drawing which shows the manufacturing method of the electromagnetic wave shielding film which concerns on one Embodiment to process order. 一実施形態に係るシールドプリント配線板を示す断面図である。It is sectional drawing which shows the shield printed wiring board concerning one Embodiment.
　（電磁波シールドフィルム）
　図１に示すように、一実施形態の電磁波シールドフィルム１００は、凸部１１０ａ及び凹部１１０ｂからなる凹凸を有する導電性のシールド層１１０と、シールド層１１０の第１の面に接して設けられた接着剤層１２０とを備えている。シールド層１１０の凸部１１０ａは、接着剤層１２０により被覆されている。シールド層１１０の凸部１１０ａの少なくとも一部は、電磁波シールドフィルム１００をプリント配線板に加圧して貼り付けた際に、接着剤層１２０を突き抜ける。 (Electromagnetic wave shielding film)
As shown in FIG. 1, the electromagnetic wave shielding film 100 according to one embodiment is provided in contact with a conductive shield layer 110 having projections and depressions 110 a and depressions 110 b and a first surface of the shield layer 110. And an adhesive layer 120. The convex portion 110 a of the shield layer 110 is covered with the adhesive layer 120. At least a part of the convex portion 110a of the shield layer 110 penetrates the adhesive layer 120 when the electromagnetic wave shielding film 100 is pressed and attached to the printed wiring board.
　このような構成とすることにより、電磁波シールドフィルム１００をプリント配線板に加圧して貼り付けることにより、シールド層１１０の凸部１１０ａの少なくとも一部とプリント配線板のグランド回路とを接続することができる。電磁波シールドフィルム１００をプリント配線板に貼り付ける前には、シールド層１１０の凸部１１０ａが接着剤層１２０から突出していないため、電磁波シールドフィルム１００をプリント配線板に容易に仮貼りすることができる。また、接着剤層１２０とプリント配線板との間に気泡が発生することを抑えることもできる。さらに、プリント配線板に貼り付ける前には、シールド層１１０の凸部１１０ａが接着剤層１２０に被覆されているため、凸部１１０ａの表面は酸化されにくく、導電性が低下しにくい。 With such a configuration, it is possible to connect at least a part of the convex portion 110a of the shield layer 110 and the ground circuit of the printed wiring board by applying the electromagnetic wave shielding film 100 to the printed wiring board by applying pressure. it can. Before the electromagnetic wave shielding film 100 is attached to the printed wiring board, since the convex portion 110a of the shielding layer 110 does not protrude from the adhesive layer 120, the electromagnetic wave shielding film 100 can be easily temporarily attached to the printed wiring board. . It is also possible to suppress the generation of bubbles between the adhesive layer 120 and the printed wiring board. Further, since the convex portion 110a of the shield layer 110 is covered with the adhesive layer 120 before being attached to the printed wiring board, the surface of the convex portion 110a is hardly oxidized and the conductivity is not easily lowered.
　電磁波シールドフィルム１００をプリント配線板に加圧して貼り付けた際に、シールド層１１０の凸部１１０ａの少なくとも一部が接着剤層１２０を突き抜けるようにするには、シールド層の凹凸の最大山高さ（Ｒｐ）の値を接着剤層１２０の厚さ（ｔ）よりも大きくすればよい。ｔ＜Ｒｐとすることにより、凸部１１０ａが接着剤層１２０を十分に突き抜け、凸部１１０ａとグランド回路とを良好に接続することが可能となる。これによりシールドフィルムとグランド回路との間の抵抗値が小さくなり、良好なシールド性が得られる。 In order that at least a part of the convex portion 110a of the shield layer 110 penetrates the adhesive layer 120 when the electromagnetic wave shielding film 100 is pressed and applied to the printed wiring board, the maximum peak height of the unevenness of the shield layer The value of (Rp) may be larger than the thickness (t) of the adhesive layer 120. By setting t <Rp, the convex portion 110a can sufficiently penetrate the adhesive layer 120, and the convex portion 110a and the ground circuit can be satisfactorily connected. Thereby, the resistance value between a shield film and a ground circuit becomes small, and favorable shielding property is obtained.
　最大山高さ（Ｒｐ）の値は、接着剤層１２０の厚さ（ｔ）よりも大きければよいが、４μｍ以上とすることが好ましい。Ｒｐの値を４μｍ以上とすることにより、シールドフィルムをプリント配線板に加圧して貼り付けた際に、凸部１１０ａが接着剤層１２０突き抜けやすくすることができる。これにより、電磁波シールドフィルム１００とグランド回路との間の抵抗値を小さくし、良好なシールド特性を得ることができる。また、プリント配線板との良好な接着を行うために十分な厚さの接着剤層１２０を設けることが可能となる。 The value of the maximum peak height (Rp) may be larger than the thickness (t) of the adhesive layer 120, but is preferably 4 μm or more. By setting the value of Rp to 4 μm or more, the convex portion 110a can easily penetrate the adhesive layer 120 when the shield film is pressed and attached to the printed wiring board. Thereby, the resistance value between the electromagnetic wave shielding film 100 and the ground circuit can be reduced, and good shielding characteristics can be obtained. Further, it is possible to provide an adhesive layer 120 having a sufficient thickness for good adhesion to the printed wiring board.
　Ｒｐは特に限定されないが、２０μｍ以下であることが好ましい。Ｒｐを２０μｍ以下とすることにより、電磁波シールドフィルム１００の厚さを薄くすることができる。また、接着剤層１２０の表面の平坦性を確保しやすくなり、電磁波シールドフィルム１００をプリント配線板に加圧して貼り付けた際に、電磁波シールドフィルム１００とプリント配線板との接着力が良好となる。なお、本発明における最大山高さ（Ｒｐ）の値は、実施例に示すJIS B0651:2001に準拠して測定した値である。 Rp is not particularly limited, but is preferably 20 μm or less. By setting Rp to 20 μm or less, the thickness of the electromagnetic wave shielding film 100 can be reduced. Moreover, it becomes easy to ensure the flatness of the surface of the adhesive layer 120, and when the electromagnetic wave shielding film 100 is pressed and attached to the printed wiring board, the adhesive force between the electromagnetic wave shielding film 100 and the printed wiring board is good. Become. In addition, the value of the maximum peak height (Rp) in the present invention is a value measured according to JIS B0651: 2001 shown in the examples.
　接着剤層１２０の厚さは、シールド層１１０の凸部１１０ａを被覆できる限りにおいて、できるだけ薄くすることが好ましいが、好ましくは３μｍ以上、より好ましくは４μｍ以上、そして好ましくは１０μｍ以下、より好ましくは７μｍ以下である。接着剤層１２０の厚みが３μｍ以上であると、シールド層１１０の凹凸のＲｐの値が大きい場合であっても、電磁波シールドフィルム１００をプリント配線板に貼り付ける前に、シールド層１１０の凸部１１０ａが接着剤層１２０から突出しないようにすることができる。このため、接着剤層１２０とプリント配線板との間に空気が混入することを抑えることができ、良好な接着力が得られる。また、１０μｍ以下であると電磁波シールドフィルム１００を薄くできるとともに、シールド層１１０の凸部１１０ａを確実にプリント配線板のグランド回路と接続させることができる。 The thickness of the adhesive layer 120 is preferably as thin as possible as long as the projection 110a of the shield layer 110 can be covered, but is preferably 3 μm or more, more preferably 4 μm or more, and preferably 10 μm or less, more preferably 7 μm or less. When the thickness of the adhesive layer 120 is 3 μm or more, even if the Rp value of the unevenness of the shield layer 110 is large, before the electromagnetic wave shielding film 100 is attached to the printed wiring board, the convex portion of the shield layer 110 110a may not protrude from the adhesive layer 120. For this reason, it can suppress that air mixes between the adhesive bond layer 120 and a printed wiring board, and favorable adhesive force is obtained. In addition, when the thickness is 10 μm or less, the electromagnetic wave shielding film 100 can be thinned, and the convex portion 110a of the shield layer 110 can be reliably connected to the ground circuit of the printed wiring board.
　シールド層１１０の接着剤層１２０と反対側の第２の面には、必要に応じて保護層１３０を設けることができる。保護層１３０は絶縁性の樹脂材料等により形成することができる。保護層１３０を設ける場合には、保護層１３０のシールド層１１０側の面に凹凸を設けることにより、シールド層１１０の第１の面に容易に凸部１１０ａを形成することができる。保護層１３０の表面に凹凸を設ける場合には、保護層１３０の表面のＲｐを接着剤層の厚さ以上、好ましくは４μｍ以上、そして２０μｍ以下とすればよい。このような構成とすることにより、シールド層１１０の第１の面のＲｐを容易に４μｍ以上、２０μｍ以下とすることができる。 A protective layer 130 can be provided on the second surface of the shield layer 110 opposite to the adhesive layer 120 as necessary. The protective layer 130 can be formed of an insulating resin material or the like. When the protective layer 130 is provided, the convex portion 110 a can be easily formed on the first surface of the shield layer 110 by providing irregularities on the surface of the protective layer 130 on the shield layer 110 side. When unevenness is provided on the surface of the protective layer 130, the Rp on the surface of the protective layer 130 may be equal to or greater than the thickness of the adhesive layer, preferably 4 μm to 20 μm. By setting it as such a structure, Rp of the 1st surface of the shield layer 110 can be easily 4 micrometers or more and 20 micrometers or less.
　＜シールド層＞
　シールド層１１０は、金属膜又は導電性粒子からなる導電膜等とすることができる。金属膜は、例えば、ニッケル、銅、銀、錫、金、パラジウム、アルミニウム、クロム、チタン若しくは亜鉛又はこれらのいずれか１つ以上を含む合金等により形成することができる。金属膜を形成する方法としては、例えば、圧延法、電解めっき法、無電解めっき法、スパッタリング法、電子ビーム蒸着法、真空蒸着法、ＣＶＤ法、又はメタルオーガニック法等を用いることができる。 <Shield layer>
The shield layer 110 can be a metal film or a conductive film made of conductive particles. The metal film can be formed of, for example, nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, or an alloy containing any one or more of these. As a method for forming the metal film, for example, a rolling method, an electrolytic plating method, an electroless plating method, a sputtering method, an electron beam evaporation method, a vacuum evaporation method, a CVD method, a metal organic method, or the like can be used.
　導電性粒子は、例えば、カーボン、銀、銅、ニッケル、ハンダ、又は銅粉に銀めっきを施した銀コート銅粒子等とすることができる。また、樹脂ボール若しくはガラスビーズ等の絶縁性の粒子に金属めっきを施した粒子を用いることもできる。これらの導電性粒子は単独で用いることも、２つ以上を混合して用いることもできる。 The conductive particles can be, for example, carbon, silver, copper, nickel, solder, or silver-coated copper particles obtained by performing silver plating on copper powder. Alternatively, particles obtained by performing metal plating on insulating particles such as resin balls or glass beads can be used. These conductive particles can be used alone or in combination of two or more.
　導電性粒子の形状は、球状、針状、繊維状、フレーク状、又は樹枝状のいずれであってもよく、層状とする観点からはフレーク状が好ましい。 The shape of the conductive particles may be spherical, needle-like, fibrous, flaky, or dendritic, and is preferably flaky from the viewpoint of layering.
　導電性粒子の粒径は特に限定されないが、シールド層１１０を薄くする観点から、０．１μｍ以上、１０μｍ以下とすることができる。 The particle diameter of the conductive particles is not particularly limited, but can be 0.1 μm or more and 10 μm or less from the viewpoint of thinning the shield layer 110.
　シールド層１１０の厚さは、求められる電磁波シールド特性及び繰り返し屈曲・摺動耐性に応じて適宜選択すればよいが、０．１μｍ以上、１０μｍ以下程度の厚さとすることができる。 The thickness of the shield layer 110 may be appropriately selected according to the required electromagnetic shielding characteristics and repeated bending / sliding resistance, but may be about 0.1 μm or more and 10 μm or less.
　＜接着剤層＞
　接着剤層１２０は、絶縁性としても導電性としてもよい。小径の開口部への充填性の観点からは、接着剤層１２０を絶縁性とすることが好ましい。接着剤層１２０を金属粒子等の導電性フィラーを含まない層とすることにより、接着剤層１２０の厚さをより薄くすることが可能となるという利点も得られる。 <Adhesive layer>
The adhesive layer 120 may be insulative or conductive. From the viewpoint of filling into a small-diameter opening, it is preferable to make the adhesive layer 120 insulative. By making the adhesive layer 120 a layer that does not contain conductive fillers such as metal particles, there is also an advantage that the thickness of the adhesive layer 120 can be made thinner.
　接着剤層１２０は、特に限定されないが、スチレン系樹脂組成物、酢酸ビニル系樹脂組成物、ポリエステル系樹脂組成物、ポリエチレン系樹脂組成物、ポリプロピレン系樹脂組成物、イミド系樹脂組成物、アミド系樹脂組成物、若しくはアクリル系樹脂組成物等の熱可塑性樹脂組成物、又はフェノール系樹脂組成物、エポキシ系樹脂組成物、ウレタン系樹脂組成物、メラミン系樹脂組成物、若しくはアルキッド系樹脂組成物等の熱硬化性樹脂組成物等を用いることができる。これらは単独で用いてもよく、２種以上を併用してもよい。 The adhesive layer 120 is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, an amide resin. Thermoplastic resin compositions such as resin compositions or acrylic resin compositions, or phenolic resin compositions, epoxy resin compositions, urethane resin compositions, melamine resin compositions, alkyd resin compositions, etc. A thermosetting resin composition or the like can be used. These may be used alone or in combination of two or more.
　接着剤層１２０には、必要に応じて、硬化促進剤、粘着性付与剤、酸化防止剤、顔料、染料、可塑剤、紫外線吸収剤、消泡剤、レベリング剤、充填剤、難燃剤、及び粘度調節剤等の少なくとも１つが含まれていてもよい。 In the adhesive layer 120, a curing accelerator, tackifier, antioxidant, pigment, dye, plasticizer, ultraviolet absorber, antifoaming agent, leveling agent, filler, flame retardant, and At least one of a viscosity modifier and the like may be included.
　接着剤層１２０の厚さは、特に限定されず、必要に応じて適宜設定することができるが、３μｍ以上、好ましくは４μｍ以上、１０μｍ以下、好ましくは７μｍ以下とすることができる。接着剤層１２０の厚さを３μｍ以上とすることにより、電磁波シールドフィルム１００をプリント配線板に貼り付ける前に、シールド層１１０の凸部１１０ａが接着剤層１２０から突出しないようにすることができ、プリント配線板との間に空気が混入することを抑えることができる。また、接着剤層１２０の厚さを１０μｍ以下とすることにより、シールドフィルムを薄くできるとともにシールド層の凸部を確実にプリント配線板のグランド回路と接続させることができる。 The thickness of the adhesive layer 120 is not particularly limited and may be appropriately set as necessary, but may be 3 μm or more, preferably 4 μm or more, 10 μm or less, preferably 7 μm or less. By setting the thickness of the adhesive layer 120 to 3 μm or more, it is possible to prevent the protrusion 110a of the shield layer 110 from protruding from the adhesive layer 120 before the electromagnetic wave shielding film 100 is attached to the printed wiring board. The air can be prevented from being mixed with the printed wiring board. Further, by setting the thickness of the adhesive layer 120 to 10 μm or less, the shield film can be thinned and the convex portion of the shield layer can be reliably connected to the ground circuit of the printed wiring board.
　＜保護層＞
　本実施形態の電磁波シールドフィルムは、保護層１３０を有していてもよい。保護層１３０は、シールド層１１０を保護できる所定の機械的強度、耐薬品性及び耐熱性等を満たしていればよい。保護層１３０は、充分な絶縁性を有し、接着剤層１２０及びシールド層１１０を保護できれば特に限定されないが、例えば、熱可塑性樹脂組成物、熱硬化性樹脂組成物、又は活性エネルギー線硬化性組成物等を用いることができる。 <Protective layer>
The electromagnetic wave shielding film of this embodiment may have a protective layer 130. The protective layer 130 only needs to satisfy predetermined mechanical strength, chemical resistance, heat resistance, and the like that can protect the shield layer 110. The protective layer 130 is not particularly limited as long as it has sufficient insulating properties and can protect the adhesive layer 120 and the shield layer 110. For example, the protective layer 130 is a thermoplastic resin composition, a thermosetting resin composition, or an active energy ray curable. A composition or the like can be used.
　熱可塑性樹脂組成物としては、特に限定されないが、スチレン系樹脂組成物、酢酸ビニル系樹脂組成物、ポリエステル系樹脂組成物、ポリエチレン系樹脂組成物、ポリプロピレン系樹脂組成物、イミド系樹脂組成物、又はアクリル系樹脂組成物等を用いることができる。熱硬化性樹脂組成物としては、特に限定されないが、フェノール系樹脂組成物、エポキシ系樹脂組成物、ウレタン系樹脂組成物、メラミン系樹脂組成物、又はアルキッド系樹脂組成物等を用いることができる。活性エネルギー線硬化性組成物としては、特に限定されないが、例えば、分子中に少なくとも２個の（メタ）アクリロイルオキシ基を有する重合性化合物等を用いることができる。保護層１３０は、単独の材料により形成されていても、２種以上の材料から形成されていてもよい。 The thermoplastic resin composition is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, Alternatively, an acrylic resin composition or the like can be used. Although it does not specifically limit as a thermosetting resin composition, A phenol-type resin composition, an epoxy-type resin composition, a urethane-type resin composition, a melamine-type resin composition, or an alkyd-type resin composition etc. can be used. . Although it does not specifically limit as an active energy ray curable composition, For example, the polymeric compound etc. which have at least 2 (meth) acryloyloxy group in a molecule | numerator can be used. The protective layer 130 may be formed of a single material or may be formed of two or more kinds of materials.
　保護層１３０には、必要に応じて、硬化促進剤、粘着性付与剤、酸化防止剤、顔料、染料、可塑剤、紫外線吸収剤、消泡剤、レベリング剤、充填剤、難燃剤、粘度調節剤、及びブロッキング防止剤等の少なくとも１つが含まれていてもよい。 For the protective layer 130, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, and a viscosity adjuster as necessary. At least one of an agent, an anti-blocking agent and the like may be included.
　保護層１３０は、材質又は硬度若しくは弾性率等の物性が異なる２層以上の積層体であってもよい。例えば、硬度が低い外層と、硬度が高い内層との積層体とすれば、外層がクッション効果を有するため、電磁波シールドフィルム１００をプリント配線板に加熱加圧する工程においてシールド層１１０に加わる圧力を緩和できる。このため、プリント配線板に設けられた段差によってシールド層１１０が破壊されることを抑えることができる。 The protective layer 130 may be a laminate of two or more layers having different materials, physical properties such as hardness or elastic modulus. For example, if a laminate of an outer layer having a low hardness and an inner layer having a high hardness is used, the outer layer has a cushioning effect, so that the pressure applied to the shield layer 110 is reduced in the process of heating and pressing the electromagnetic wave shielding film 100 to the printed wiring board. it can. For this reason, it can suppress that the shield layer 110 is destroyed by the level | step difference provided in the printed wiring board.
　保護層１３０の厚さは、特に限定されず、必要に応じて適宜設定することができるが、１μｍ以上、好ましくは４μｍ以上、そして２０μｍ以下、好ましくは１０μｍ以下、より好ましくは５μｍ以下とすることができる。保護層１３０の厚さを１μｍ以上とすることにより接着剤層１２０及びシールド層１１０を充分に保護することができる。保護層１３０の厚さを２０μｍ以下とすることにより、電磁波シールドフィルム１００の屈曲性を確保することができ、屈曲性が要求される部材へ電磁波シールドフィルム１００を適用することが容易となる。 The thickness of the protective layer 130 is not particularly limited and can be appropriately set as necessary. However, the thickness is 1 μm or more, preferably 4 μm or more, and 20 μm or less, preferably 10 μm or less, more preferably 5 μm or less. Can do. By setting the thickness of the protective layer 130 to 1 μm or more, the adhesive layer 120 and the shield layer 110 can be sufficiently protected. By setting the thickness of the protective layer 130 to 20 μm or less, the flexibility of the electromagnetic wave shielding film 100 can be ensured, and it becomes easy to apply the electromagnetic wave shielding film 100 to a member that requires flexibility.
　保護層１３０のシールド層１１０側の表面に凹凸を設けることにより、シールド層１１０の表面に容易に凸部１１０ａを形成することができる。この場合、保護層１３０のシールド層１１０側の表面のＲｐは、接着剤層の厚さ以上、好ましくは４μｍ以上、そして２０μｍ以下とすることが好ましい。 By providing irregularities on the surface of the protective layer 130 on the shield layer 110 side, the convex portions 110 a can be easily formed on the surface of the shield layer 110. In this case, Rp on the surface of the protective layer 130 on the shield layer 110 side is preferably not less than the thickness of the adhesive layer, preferably not less than 4 μm and not more than 20 μm.
　保護層１３０の表面に凹凸を設ける場合には、保護層１３０を、粒子を含む層とすることができる。粒子を添加することにより保護層１３０の表面に凹凸を容易に形成することができる。 When unevenness is provided on the surface of the protective layer 130, the protective layer 130 can be a layer containing particles. Unevenness can be easily formed on the surface of the protective layer 130 by adding particles.
　保護層１３０に添加する粒子は特に限定されず、公知の粒子を用いることができる。例えば、シリカ若しくはアルミナ等の無機粒子、又は樹脂粒子等を用いることができる。 The particles added to the protective layer 130 are not particularly limited, and known particles can be used. For example, inorganic particles such as silica or alumina, or resin particles can be used.
　保護層１３０に添加する粒子の平均粒径は、表面に形成する凹凸の大きさに応じて決定することができるが、１μｍ以上、好ましくは４μｍ以上、そして２０μｍ以下、好ましくは１５μｍ以下、より好ましくは１０μｍ以下とすることができる。粒子の平均粒径を１μｍ以上とすることにより、保護層１３０の表面の凹凸を大きくし、加熱加圧工程においてシールド層１１０が接着剤層１２０を容易に突き抜けるようにできる。粒子の平均粒径を２０μｍ以下とすることにより、保護層１３０の厚みを薄くできるという利点が得られる。 The average particle diameter of the particles added to the protective layer 130 can be determined according to the size of the irregularities formed on the surface, but is 1 μm or more, preferably 4 μm or more, and 20 μm or less, preferably 15 μm or less, more preferably Can be 10 μm or less. By setting the average particle diameter of the particles to 1 μm or more, unevenness on the surface of the protective layer 130 can be increased, and the shield layer 110 can easily penetrate the adhesive layer 120 in the heating and pressing step. By setting the average particle size of the particles to 20 μm or less, there is an advantage that the thickness of the protective layer 130 can be reduced.
　保護層１３０に添加する微粒子の量は、保護層１３０の厚さ、表面に形成する凹凸の大きさ等に応じて決定することができるが、保護層１３０を形成する樹脂組成物と微粒子との合計に対して１質量％以上、好ましくは５質量％以上、そして３０質量％以下、好ましくは２０質量％以下とすることができる。微粒子を１質量％以上とすることにより、保護層１３０の表面に十分な数の凸部を形成することができる。微粒子を３０質量％以下とすることにより、凸部同士が連なって凹凸がなだらかになることを抑えることができる。 The amount of the fine particles added to the protective layer 130 can be determined according to the thickness of the protective layer 130, the size of the irregularities formed on the surface, etc., but the resin composition forming the protective layer 130 and the fine particles The total content can be 1% by mass or more, preferably 5% by mass or more, and 30% by mass or less, preferably 20% by mass or less. By setting the fine particles to 1% by mass or more, a sufficient number of convex portions can be formed on the surface of the protective layer 130. By setting the fine particles to 30% by mass or less, it is possible to prevent the convex portions from being connected to each other so that the irregularities become gentle.
　保護層１３０に添加する微粒子の形状は特に限定されず、球状、針状、繊維状、フレーク状、及び樹枝状のいずれであってもよいが、保護層１３０の表面に凹凸を有するシールド層１１０を容易に形成する観点からは、球状であることが好ましい。 The shape of the fine particles added to the protective layer 130 is not particularly limited, and may be any of a spherical shape, a needle shape, a fiber shape, a flake shape, and a dendritic shape, but the shield layer 110 having irregularities on the surface of the protective layer 130. From the viewpoint of easily forming the film, it is preferably spherical.
　保護層１３０の表面に凹凸を設ける方法として、ブラスト加工、プラズマ照射、電子線照射、薬剤処理又はエンボス加工等を用いることもできる。 As a method of providing irregularities on the surface of the protective layer 130, blasting, plasma irradiation, electron beam irradiation, chemical treatment, embossing, or the like can be used.
　（電磁波シールドフィルムの製造方法）
　以下に、電磁波シールドフィルム１００の製造方法の一例について説明する。本実施形態の電磁波シールドフィルム１００の製造方法は以下の方法に限定されない。 (Method for producing electromagnetic shielding film)
Below, an example of the manufacturing method of the electromagnetic wave shielding film 100 is demonstrated. The manufacturing method of the electromagnetic wave shielding film 100 of this embodiment is not limited to the following method.
　＜保護層の形成＞
　まず、図２（ａ）に示すように、支持基材１４０の上に保護層用組成物を塗布して保護層１３０を形成する。保護層用組成物は、樹脂組成物１３２に粒子１３３、溶剤及びその他の配合剤を適量加えて調製することができる。粒子１３３は、特に限定されず、公知の微粒子を用いることができる。このような粒子としては、例えば、シリカ若しくはアルミナ等の無機粒子、又は樹脂微粒子等とすることができる。粒子１３３の平均粒径は、１μｍ以上、好ましくは４μｍ以上、そして２０μｍ以下、好ましくは１５μｍ以下、より好ましくは１０μｍ以下とすることができる。粒子１３３の配合量は、樹脂組成物１３２と粒子１３３との合計に対して１質量％以上、好ましくは５質量％以上、そして３０質量％以下、好ましくは２０質量％以下とすることができる。溶剤は、例えば、トルエン、アセトン、メチルエチルケトン、メタノール、エタノール、プロパノール及びジメチルホルムアミド等とすることができる。その他の配合剤としては、架橋剤や重合用触媒、硬化促進
剤、及び着色剤等を加えることができる。その他の配合剤は必要に応じて加えればよく、加えなくてもよい。 <Formation of protective layer>
First, as shown in FIG. 2A, a protective layer composition is formed by applying a protective layer composition on a support substrate 140. The protective layer composition can be prepared by adding appropriate amounts of particles 133, a solvent, and other compounding agents to the resin composition 132. The particles 133 are not particularly limited, and known fine particles can be used. Examples of such particles include inorganic particles such as silica or alumina, or resin fine particles. The average particle diameter of the particles 133 can be 1 μm or more, preferably 4 μm or more, and 20 μm or less, preferably 15 μm or less, more preferably 10 μm or less. The blending amount of the particles 133 can be 1% by mass or more, preferably 5% by mass or more, and 30% by mass or less, preferably 20% by mass or less with respect to the total of the resin composition 132 and the particles 133. The solvent can be, for example, toluene, acetone, methyl ethyl ketone, methanol, ethanol, propanol, dimethylformamide, and the like. As other compounding agents, a crosslinking agent, a polymerization catalyst, a curing accelerator, a colorant, and the like can be added. Other compounding agents may be added if necessary, and may not be added.
　次に、支持基材１４０の片面に、上記で調製した保護層用組成物を塗布する。支持基材１４０の片面に保護層用組成物を塗布する方法としては、特に限定されず、リップコーティング、コンマコーティング、グラビアコーティング、スロットダイコーティング等、公知の技術を採用することができる。 Next, the protective layer composition prepared above is applied to one side of the support substrate 140. The method for applying the protective layer composition to one side of the support substrate 140 is not particularly limited, and known techniques such as lip coating, comma coating, gravure coating, and slot die coating can be employed.
　支持基材１４０は例えばフィルム状とすることができる。支持基材１４０は、特に限定されず、例えばポリオレフィン系、ポリエステル系、ポリイミド系、ポリフェニレンサルファイド系等の材料により形成することができる。
支持基材１４０と保護層用組成物との間に、離型剤層を設けてもよい。 The support substrate 140 can be formed into a film, for example. The support substrate 140 is not particularly limited, and can be formed of, for example, a polyolefin-based material, a polyester-based material, a polyimide-based material, a polyphenylene sulfide-based material, or the like.
A release agent layer may be provided between the support substrate 140 and the protective layer composition.
　支持基材１４０に保護層用組成物を塗布した後、加熱乾燥して溶剤を除去することにより、表面に凹凸形状を有する保護層１３０が形成される。支持基材１４０は、保護層１３０から剥離することができる。支持基材１４０の剥離は、電磁波シールドフィルム１００をプリント配線板に貼り付けた後に行うことができる。このようにすれば、支持基材１４０により電磁波シールドフィルム１００を保護することができる。 After the protective layer composition is applied to the support substrate 140, the solvent is removed by heating and drying, whereby the protective layer 130 having an uneven shape on the surface is formed. The support substrate 140 can be peeled from the protective layer 130. The support substrate 140 can be peeled after the electromagnetic wave shielding film 100 is attached to the printed wiring board. In this way, the electromagnetic shielding film 100 can be protected by the support substrate 140.
　以上の方法に代えて、表面が平坦な形状の支持基材を用いて、表面が平坦な保護層を形成した後、保護層の表面に凹凸形状を形成してもよい。凹凸形状は、ブラスト処理、プラズマ照射若しくは電子線照射等によるドライエッチング処理、薬剤処理等によるウエットエッチング処理又はエンボス加工等により行うことができる。 Instead of the above method, an uneven shape may be formed on the surface of the protective layer after forming a protective layer having a flat surface using a support base having a flat surface. The concavo-convex shape can be formed by blasting, dry etching by plasma irradiation or electron beam irradiation, wet etching by chemical treatment, embossing, or the like.
　例えば、ブラスト処理では、支持基材の表面にドライアイス等を吹き付けて凹凸形状を付与することができる。エンボス加工では、支持基材の表面に、凹凸形状を有する鋳型を押し付けて凹凸形状を付与することができる。 For example, in the blast treatment, it is possible to impart an uneven shape by spraying dry ice or the like on the surface of the support substrate. In the embossing, an uneven shape can be imparted by pressing a mold having an uneven shape onto the surface of the support substrate.
　また、以上の方法に代えて、表面に凹凸形状を有する支持基材の表面に保護層用組成物を塗布、乾燥することで、表面に凹凸形状を有する保護層を形成してもよい。 Further, instead of the above method, a protective layer having a concavo-convex shape on the surface may be formed by applying and drying the composition for the protective layer on the surface of the support substrate having the concavo-convex shape on the surface.
　＜シールド層の形成＞
　次に、図２（ｂ）に示すように、表面に凸部１１０ａを有するシールド層１１０を形成する。表面に凸部１１０ａを有するシールド層１１０は、凹凸形状を有する保護層１３０の表面に、厚さが０．１μｍ～１０μｍ程度の金属膜を形成することにより容易に形成できる。金属膜の形成は、電解めっき法、無電解めっき法、スパッタリング法、電子ビーム蒸着法、真空蒸着法、ＣＶＤ法、又はメタルオーガニック法等により行うことができる。 <Formation of shield layer>
Next, as shown in FIG. 2B, a shield layer 110 having a convex portion 110a on the surface is formed. The shield layer 110 having the convex portions 110a on the surface can be easily formed by forming a metal film having a thickness of about 0.1 μm to 10 μm on the surface of the protective layer 130 having an uneven shape. The metal film can be formed by an electrolytic plating method, an electroless plating method, a sputtering method, an electron beam evaporation method, a vacuum evaporation method, a CVD method, a metal organic method, or the like.
　なお、電解めっき法や無電解めっき法により金属膜を形成した場合には、金属膜の表面に、樹枝状の微小な凹凸を形成することができる。このため、シールド層１１０とプリント配線板のグランド回路との接続をより確実にすることができる。 In addition, when a metal film is formed by an electrolytic plating method or an electroless plating method, dendritic minute irregularities can be formed on the surface of the metal film. For this reason, the connection between the shield layer 110 and the ground circuit of the printed wiring board can be made more reliable.
　シールド層は、導電性粒子を含む導電性ペーストを、凹凸を有する保護層の表面にコーティングすることにより形成してもよい。この場合、必要に応じて、コーティング層の焼成等を行うことができる。 The shield layer may be formed by coating a conductive paste containing conductive particles on the surface of the protective layer having irregularities. In this case, the coating layer can be baked as necessary.
　平坦な保護層の上に、金属膜を形成した後、金属膜の表面を荒らすことにより、凹凸を有するシールド層を形成することもできる。また、エンボス加工により銅箔を凹凸形状に加工することにより、凹凸を有するシールド層を形成することもできる。この場合、保護層がない電磁波シールドフィルムを形成することも可能である。 After forming a metal film on the flat protective layer, the shield layer having irregularities can be formed by roughening the surface of the metal film. Moreover, the shield layer which has an unevenness | corrugation can also be formed by processing a copper foil into an uneven | corrugated shape by embossing. In this case, it is also possible to form an electromagnetic wave shielding film without a protective layer.
　＜接着剤層の形成＞
　次に、図２（ｃ）に示すように、シールド層１１０の上に接着剤層用組成物を塗布して、接着剤層１２０を形成する。接着剤層用組成物は、樹脂組成物と溶剤とを含む。樹脂組成物は、特に限定されないが、スチレン系樹脂組成物、酢酸ビニル系樹脂組成物、ポリエステル系樹脂組成物、ポリエチレン系樹脂組成物、ポリプロピレン系樹脂組成物、イミド系樹脂組成物、アミド系樹脂組成物、若しくはアクリル系樹脂組成物等の熱可塑性樹脂組成物、又はフェノール系樹脂組成物、エポキシ系樹脂組成物、ウレタン系樹脂組成物、メラミン系樹脂組成物、若しくはアルキッド系樹脂組成物等の熱硬化性樹脂組成物等とすることができる。これらは単独で用いてもよく、２種以上を併用してもよい。溶剤は、例えば、トルエン、アセトン、メチルエチルケトン、メタノール、エタノール、プロパノール及びジメチルホルムアミド等とすることができる。必要に応じて、接着剤層用組成物に硬化促進剤、粘着性付与剤、酸化防止剤、顔料、染料、可塑剤、紫外線吸収剤、消泡剤、レベリング剤、充填剤、難燃剤、及び粘度調節剤等の少なくとも１つが含まれていてもよい。接着剤層用組成物中における樹脂組成物の比率は、接着剤層１２０の厚さ等に応じて適宜設定すればよい。 <Formation of adhesive layer>
Next, as shown in FIG. 2C, the adhesive layer composition is applied on the shield layer 110 to form the adhesive layer 120. The composition for an adhesive layer includes a resin composition and a solvent. The resin composition is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, an amide resin. Compositions, or thermoplastic resin compositions such as acrylic resin compositions, or phenolic resin compositions, epoxy resin compositions, urethane resin compositions, melamine resin compositions, alkyd resin compositions, etc. It can be set as a thermosetting resin composition or the like. These may be used alone or in combination of two or more. The solvent can be, for example, toluene, acetone, methyl ethyl ketone, methanol, ethanol, propanol, dimethylformamide, and the like. If necessary, the composition for the adhesive layer is cured accelerator, tackifier, antioxidant, pigment, dye, plasticizer, ultraviolet absorber, antifoaming agent, leveling agent, filler, flame retardant, and At least one of a viscosity modifier and the like may be included. What is necessary is just to set the ratio of the resin composition in the composition for adhesive bond layers suitably according to the thickness etc. of the adhesive bond layer 120. FIG.
　次に、シールド層１１０の上に、接着剤層用組成物を塗布する。シールド層１１０の上に接着剤層用組成物を塗布する方法としては、特に限定されず、リップコーティング、コンマコーティング、グラビアコーティング、又はスロットダイコーティング等を用いることができる。 Next, an adhesive layer composition is applied on the shield layer 110. The method for applying the adhesive layer composition on the shield layer 110 is not particularly limited, and lip coating, comma coating, gravure coating, slot die coating, or the like can be used.
　シールド層１１０の上に接着剤層用組成物を塗布した後、加熱乾燥して溶剤を除去し、接着剤層１２０を形成する。なお、必要に応じて、接着剤層１２０の表面に離型フィルムを貼りあわせてもよい。 After applying the adhesive layer composition on the shield layer 110, the solvent is removed by heating and drying to form the adhesive layer 120. In addition, you may stick a release film on the surface of the adhesive bond layer 120 as needed.
　電磁波シールドフィルムの製造方法は上述の方法に限られない。例えば、第一支持基材と第二支持基材とを準備し、第一支持基材の表面に、上述の方法と同様にして保護層用組成物を塗布して保護層を形成した後、さらにシールド層を形成する。また、第二支持基材の表面に、上述の方法と同様にして接着剤層用組成物を塗布して接着剤層１２０を形成する。次いで、第一支持基材上に形成されたシールド層と第二支持基材上に形成された接着剤層とを対向させつつ貼り合わせることで、電磁波シールドフィルムを作製することもできる。 The manufacturing method of the electromagnetic wave shielding film is not limited to the above method. For example, after preparing a first support base and a second support base, applying a protective layer composition on the surface of the first support base in the same manner as described above to form a protective layer, Further, a shield layer is formed. Further, the adhesive layer 120 is formed on the surface of the second support substrate by applying the adhesive layer composition in the same manner as described above. Subsequently, an electromagnetic wave shielding film can also be produced by bonding the shield layer formed on the first support substrate and the adhesive layer formed on the second support substrate while facing each other.
　本実施形態の電磁波シールドフィルム１００は、接着剤層１２０を絶縁性とすることができる。この場合には、接着剤層用組成物に導電性フィラーを加えなくてよい。但し、接着剤層１２０は導電性であってもよく、この場合には接着剤層用組成物に導電性フィラーを加えることができる。導電性フィラーを加える場合においても、シールド層１１０がグランド回路と直接接続されるため、従来の電磁波シールドフィルムと比べてシールド特性が良好になる。また、従来の導電性接着剤層よりも導電性フィラーの量を低減することができ、コストを低減することもできる。さらに、グランド回路を被覆する絶縁層に形成された開口部の径が小さくても、グランド回路とシールド層との接続が良好になる。 The electromagnetic wave shielding film 100 of the present embodiment can make the adhesive layer 120 insulative. In this case, it is not necessary to add a conductive filler to the adhesive layer composition. However, the adhesive layer 120 may be conductive, and in this case, a conductive filler can be added to the adhesive layer composition. Even when a conductive filler is added, since the shield layer 110 is directly connected to the ground circuit, the shielding characteristics are improved as compared with the conventional electromagnetic wave shielding film. Further, the amount of the conductive filler can be reduced as compared with the conventional conductive adhesive layer, and the cost can be reduced. Furthermore, even if the diameter of the opening formed in the insulating layer covering the ground circuit is small, the connection between the ground circuit and the shield layer is good.
　（シールドプリント配線板）
　本実施形態の電磁波シールドフィルム１００は、以下のようなシールドプリント配線板に用いることができる。図３に示すように、シールドプリント配線板３００は、プリント配線板２００と、電磁波シールドフィルム１００とを有している。 (Shield printed wiring board)
The electromagnetic wave shielding film 100 of this embodiment can be used for the following shield printed wiring boards. As shown in FIG. 3, the shield printed wiring board 300 includes a printed wiring board 200 and an electromagnetic wave shielding film 100.
　プリント配線板２００は、ベース層２１０と、ベース層２１０上に形成された信号回路２２０Ａ及びグランド回路２２０Ｂを含むプリント回路２２０と、グランド回路２２０Ｂの少なくとも一部を露出するようにベース層２１０を覆う絶縁層２３０とを有している。 The printed wiring board 200 covers the base layer 210, the printed circuit 220 including the signal circuit 220A and the ground circuit 220B formed on the base layer 210, and the base layer 210 so as to expose at least part of the ground circuit 220B. And an insulating layer 230.
　ベース層２１０及び絶縁層２３０は、どのようなものであってもよいが、例えば樹脂フィルム等とすることができる。この場合、ポリプロピレン、架橋ポリエチレン、ポリエステル、ポリベンゾイミダゾール、ポリイミド、ポリイミドアミド、ポリエーテルイミド、又はポリフェニレンサルファイド等の樹脂により形成することができる。プリント回路２２０は、例えばベース層２１０の上に形成された銅配線パターン等とすることができる。 The base layer 210 and the insulating layer 230 may be any material, but may be a resin film, for example. In this case, it can be formed of a resin such as polypropylene, cross-linked polyethylene, polyester, polybenzimidazole, polyimide, polyimide amide, polyether imide, or polyphenylene sulfide. The printed circuit 220 may be a copper wiring pattern formed on the base layer 210, for example.
　電磁波シールドフィルム１００は、接着剤層１２０を絶縁層２３０側にしてプリント配線板２００と接着されている。シールド層１１０の凸部１１０ａの一部は、接着剤層１２０を突き抜け、絶縁層２３０から露出したグランド回路２２０Ｂと接している。このため、接着剤層１２０が導電性フィラーを含んでいなくても、シールド層１１０とグランド回路２２０Ｂとを導通させ、優れたシールド特性を発揮させることができる。接着剤層１２０に導電性フィラーが含まれていない場合には、グランド回路２２０Ｂとシールド層１１０との間に導電性フィラーが存在しないため、導電性フィラーによる抵抗を考慮する必要がない。したがって、グランド回路２２０Ｂとシールド層１１０との間の抵抗値が大幅に低下しないため、良好なシールド特性を示す。さらに、接着剤層１２０が導電性フィラーを含まない場合には、接着剤層１２０を薄くすることができ、シールドプリント配線板３００の厚さを従来よりも薄くすることができる。 The electromagnetic wave shielding film 100 is bonded to the printed wiring board 200 with the adhesive layer 120 on the insulating layer 230 side. A part of the projection 110 a of the shield layer 110 penetrates the adhesive layer 120 and is in contact with the ground circuit 220 </ b> B exposed from the insulating layer 230. For this reason, even if the adhesive layer 120 does not contain a conductive filler, the shield layer 110 and the ground circuit 220 </ b> B can be electrically connected to exhibit excellent shielding characteristics. When the adhesive layer 120 does not include a conductive filler, there is no conductive filler between the ground circuit 220B and the shield layer 110, and thus there is no need to consider resistance due to the conductive filler. Accordingly, the resistance value between the ground circuit 220B and the shield layer 110 is not significantly reduced, and thus excellent shield characteristics are exhibited. Furthermore, when the adhesive layer 120 does not contain a conductive filler, the adhesive layer 120 can be made thinner, and the thickness of the shield printed wiring board 300 can be made thinner than before.
　次に、シールドプリント配線板３００の製造方法について説明する。プリント配線板２００の上に、電磁波シールドフィルム１００を載置し、プレス機で加熱しつつ加圧する。加熱により柔らかくなった接着剤層１２０の一部は加圧により絶縁層２３０の開口部に流れ込む。また、加圧により、シールド層１１０の凸部１１０ａの少なくとも一部が、接着剤層１２０を突き抜ける。これにより、シールド層１１０とグランド回路２２０Ｂとが接続される。シールド層１１０の凹部においては、シールド層１１０とプリント配線板２００との間に十分な量の接着剤層１２０が存在しているため、電磁波シールドフィルム１００とプリント配線板２００とは、十分な強度で接着される。 Next, a method for manufacturing the shield printed wiring board 300 will be described. The electromagnetic wave shielding film 100 is placed on the printed wiring board 200 and pressed while being heated by a press. A part of the adhesive layer 120 softened by heating flows into the opening of the insulating layer 230 by pressurization. Further, at least a part of the convex portion 110 a of the shield layer 110 penetrates the adhesive layer 120 by pressurization. Thereby, the shield layer 110 and the ground circuit 220B are connected. Since there is a sufficient amount of adhesive layer 120 between the shield layer 110 and the printed wiring board 200 in the concave portion of the shield layer 110, the electromagnetic wave shielding film 100 and the printed wiring board 200 have sufficient strength. Glued with.
　＜電磁波シールドフィルムの形成＞
　支持基材として、厚さが６０μｍで、表面に離型処理を施したＰＥＴフィルムを用いた。支持基材の上に、所定の粒径のシリカ粒子、ビスフェノールＡ型エポキシ系樹脂及びメチルエチルケトンを含む保護層用組成物（固形分量３０質量％）を塗布し、加熱乾燥することにより保護層を形成した。次いで、保護層の表面に厚さが０．５μｍの銀を蒸着することにより、シールド層を形成した。次いで、シールド層の表面にエポキシ系樹脂からなる接着剤を塗布して所定の厚さの接着剤層を形成した。 <Formation of electromagnetic shielding film>
As a supporting substrate, a PET film having a thickness of 60 μm and a surface subjected to a release treatment was used. A protective layer is formed by applying a composition for a protective layer (solid content 30% by mass) containing silica particles having a predetermined particle size, bisphenol A type epoxy resin and methyl ethyl ketone on a support substrate and drying by heating. did. Next, a shield layer was formed by depositing silver having a thickness of 0.5 μm on the surface of the protective layer. Next, an adhesive made of an epoxy resin was applied to the surface of the shield layer to form an adhesive layer having a predetermined thickness.
　＜接着剤層の厚みの測定方法＞
　接着剤層を形成した後の電磁波シールドフィルムの厚みから接着剤層を形成する前の保護層とシールド層との積層体の厚みを引いた値を、接着剤層の厚みとした。なお、それぞれの厚みは、マイクロメーター（（株）ミツトヨ製、ＭＤＨ－２５）を用い、ＪＩＳ　Ｃ　２１５１に準拠して測定した。 <Method for measuring thickness of adhesive layer>
The value obtained by subtracting the thickness of the laminate of the protective layer and the shield layer before forming the adhesive layer from the thickness of the electromagnetic wave shielding film after forming the adhesive layer was taken as the thickness of the adhesive layer. Each thickness was measured according to JIS C 2151 using a micrometer (MDH-25 manufactured by Mitutoyo Corporation).
　＜最大山高さの測定方法＞
　シールド層表面の最大山高さ（Ｒｐ）は、Lasertec社製の共焦点顕微鏡を用い、JIS B0651:2001に準拠して測定した。 <Measurement method of maximum peak height>
The maximum peak height (Rp) of the shield layer surface was measured according to JIS B0651: 2001 using a confocal microscope manufactured by Lasertec.
　＜接続性の評価＞
　プリント配線板の表面に電磁波シールドフィルムを仮貼り（１２０℃、０．５ＭＰａ、５秒）した後、加熱加圧（１７０℃、３ＭＰａ、３０分）してシールドプリント配線板を形成した。プリント配線板には、互いに間隔をおいて平行に延びる２本の銅箔パターンと、銅箔パターンを覆う厚さが２５μｍのポリイミドからなる絶縁層を有するものを用いた。絶縁層には、それぞれの銅箔パターンを露出する開口部を設けた。開口部の直径は１ｍｍとした。２本の銅箔パターンの間の電気抵抗値を抵抗計により測定することにより、銅箔パターンと電磁波シールドフィルムとの接続性を評価した。電気抵抗が０．４Ω未満の場合を接続性が良好であるとした。 <Evaluation of connectivity>
An electromagnetic wave shielding film was temporarily attached to the surface of the printed wiring board (120 ° C., 0.5 MPa, 5 seconds), and then heated and pressurized (170 ° C., 3 MPa, 30 minutes) to form a shield printed wiring board. As the printed wiring board, one having two copper foil patterns extending in parallel at an interval and an insulating layer made of polyimide having a thickness of 25 μm covering the copper foil pattern was used. The insulating layer was provided with an opening for exposing each copper foil pattern. The diameter of the opening was 1 mm. The connectivity between the copper foil pattern and the electromagnetic wave shielding film was evaluated by measuring the electrical resistance value between the two copper foil patterns with a resistance meter. When the electrical resistance is less than 0.4Ω, the connectivity is considered good.
　（実施例１）
　保護層用組成物に加える粒子を粒径４μｍのシリカ（電気化学工業（株）製、ＦＢ－５ＳＤＣ）とし、シリカの含有量は樹脂組成物とシリカとの合計に対して１５質量％とした。得られた保護層の厚さは６μｍであった。シールド層表面の最大山高さは４．５μｍであった。接着剤層の厚さは３μｍとした。抵抗値は０．１Ωであった。 (Example 1)
Particles added to the protective layer composition were silica having a particle diameter of 4 μm (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-5SDC), and the silica content was 15% by mass with respect to the total of the resin composition and silica. . The thickness of the obtained protective layer was 6 μm. The maximum peak height on the shield layer surface was 4.5 μm. The thickness of the adhesive layer was 3 μm. The resistance value was 0.1Ω.
　（実施例２）
　保護層用組成物に加える粒子を粒径９μｍのシリカ（電気化学工業（株）製、ＦＢ－１２Ｄ）とし、シリカの含有量は樹脂組成物とシリカとの合計に対して５質量％とした。得られた保護層の厚さは７μｍであった。シールド層表面の最大山高さは５．２μｍであった。接着剤層の厚さは３μｍとした。抵抗値は０．２Ωであった。 (Example 2)
The particles added to the protective layer composition were silica having a particle size of 9 μm (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-12D), and the silica content was 5% by mass with respect to the total of the resin composition and silica. . The thickness of the obtained protective layer was 7 μm. The maximum peak height on the shield layer surface was 5.2 μm. The thickness of the adhesive layer was 3 μm. The resistance value was 0.2Ω.
　（実施例３）
　接着剤層の厚さを５μｍとした以外は実施例２と同様にした。抵抗値は０．２Ωであった。 (Example 3)
The procedure was the same as Example 2 except that the thickness of the adhesive layer was 5 μm. The resistance value was 0.2Ω.
　（実施例４）
　保護層用組成物に加える粒子を粒径９μｍのシリカ（電気化学工業(株)製、FB-12D）とし、シリカの含有量は樹脂組成物とシリカとの合計に対して１５質量％とした。得られた保護層の厚さは１１μｍであった。シールド層表面の最大山高さは９．１μｍであった。接着剤層の厚さは３μｍとした。抵抗値は０．１Ωであった。 Example 4
The particles added to the protective layer composition were silica having a particle size of 9 μm (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-12D), and the silica content was 15% by mass with respect to the total of the resin composition and silica. . The thickness of the obtained protective layer was 11 μm. The maximum peak height on the shield layer surface was 9.1 μm. The thickness of the adhesive layer was 3 μm. The resistance value was 0.1Ω.
　（実施例５）
　接着剤層の厚さを５μｍとした以外は実施例４と同様にした。抵抗値は０．１Ωであった。 (Example 5)
The same operation as in Example 4 was conducted except that the thickness of the adhesive layer was changed to 5 μm. The resistance value was 0.1Ω.
　（実施例６）
　接着剤層の厚さを８μｍとした以外は実施例４と同様にした。抵抗値は０．１Ωであった。 (Example 6)
The same operation as in Example 4 was conducted except that the thickness of the adhesive layer was 8 μm. The resistance value was 0.1Ω.
　（実施例７）
　保護層用組成物に加える粒子を粒径１４μｍのシリカ（電気化学工業（株）製、ＦＢ－９４０）とし、シリカの含有量は樹脂組成物とシリカとの合計に対して５質量％とした。得られた保護層の厚さは１６μｍであった。シールド層表面の最大山高さは８．７μｍであった。接着剤層の厚さは３μｍとした。抵抗値は０．２Ωであった。 (Example 7)
The particles added to the protective layer composition were silica having a particle diameter of 14 μm (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-940), and the silica content was 5% by mass with respect to the total of the resin composition and silica. . The thickness of the protective layer obtained was 16 μm. The maximum peak height on the shield layer surface was 8.7 μm. The thickness of the adhesive layer was 3 μm. The resistance value was 0.2Ω.
　（実施例８）
　接着剤層の厚さを５μｍとした以外は実施例７と同様にした。抵抗値は０．２Ωであった。 (Example 8)
Example 7 was repeated except that the thickness of the adhesive layer was 5 μm. The resistance value was 0.2Ω.
　（実施例９）
　接着剤層の厚さを８μｍとした以外は実施例７と同様にした。抵抗値は０．１Ωであった。 Example 9
The procedure was the same as Example 7 except that the thickness of the adhesive layer was 8 μm. The resistance value was 0.1Ω.
　（実施例１０）
　保護層用組成物に加える粒子を粒径１４μｍのシリカ（電気化学工業（株）製、ＦＢ－９４０）とし、シリカの含有量は樹脂組成物とシリカとの合計に対して１５質量％とした。得られた保護層の厚さは２０μｍであった。シールド層表面の最大山高さは１６．３μｍであった。接着剤層の厚さは３μｍとした。抵抗値は０．１Ωであった。 (Example 10)
Particles added to the protective layer composition were silica having a particle size of 14 μm (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-940), and the content of silica was 15% by mass with respect to the total of the resin composition and silica. . The thickness of the obtained protective layer was 20 μm. The maximum peak height on the shield layer surface was 16.3 μm. The thickness of the adhesive layer was 3 μm. The resistance value was 0.1Ω.
　（実施例１１）
　接着剤層の厚さを５μｍとした以外は実施例１０と同様にした。抵抗値は０．１Ωであった。 (Example 11)
Example 10 was repeated except that the thickness of the adhesive layer was 5 μm. The resistance value was 0.1Ω.
　（実施例１２）
　接着剤層の厚さを８μｍとした以外は実施例１０と同様にした。抵抗値は０．１Ωであった。 Example 12
The procedure was the same as Example 10 except that the thickness of the adhesive layer was 8 μm. The resistance value was 0.1Ω.
　（実施例１３）
　保護層用組成物に加える粒子を粒径１４μｍのシリカ（電気化学工業（株）社製、ＦＢ－９４０）とし、シリカの含有量は樹脂組成物とシリカとの合計に対して２５質量％とした。得られた保護層の厚さは２０μｍであった。シールド層表面の最大山高さは１４．６μｍであった。接着剤層の厚さは３μｍとした。抵抗値は０．２Ωであった。 (Example 13)
The particles added to the protective layer composition were silica having a particle size of 14 μm (FB-940, manufactured by Denki Kagaku Kogyo Co., Ltd.), and the silica content was 25% by mass with respect to the total of the resin composition and silica. did. The thickness of the obtained protective layer was 20 μm. The maximum peak height on the shield layer surface was 14.6 μm. The thickness of the adhesive layer was 3 μm. The resistance value was 0.2Ω.
　（実施例１４）
　接着剤層の厚さを５μｍとした以外は実施例１３と同様にした。抵抗値は０．２Ωであった。 (Example 14)
Example 13 was repeated except that the thickness of the adhesive layer was 5 μm. The resistance value was 0.2Ω.
　（実施例１５）
　接着剤層の厚さを８μｍとした以外は実施例１３と同様にした。抵抗値は０．２Ωであった。 (Example 15)
Example 13 was repeated except that the thickness of the adhesive layer was 8 μm. The resistance value was 0.2Ω.
　（比較例１）
　保護層用組成物に加える粒子を粒径４μｍのシリカ（電気化学工業（株）製、ＦＢ－５ＳＤＣ）とし、シリカの含有量は樹脂組成物とシリカとの合計に対して５質量％とした。得られた保護層の厚さは５μｍであった。シールド層表面の最大山高さは２．２μｍであった。接着剤層の厚さは３μｍとした。抵抗値は０．６Ωであった。 (Comparative Example 1)
Particles added to the protective layer composition were silica having a particle size of 4 μm (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-5SDC), and the silica content was 5% by mass with respect to the total of the resin composition and silica. . The thickness of the obtained protective layer was 5 μm. The maximum peak height on the shield layer surface was 2.2 μm. The thickness of the adhesive layer was 3 μm. The resistance value was 0.6Ω.
　（比較例２）
　接着剤層の厚さを５μｍとした以外は比較例１と同様にした。抵抗値は１．４Ωであった。 (Comparative Example 2)
Comparative Example 1 was performed except that the thickness of the adhesive layer was changed to 5 μm. The resistance value was 1.4Ω.
　（比較例３）
　接着剤層の厚さを８μｍとした以外は比較例１と同様にした。抵抗値は１．８Ωであった。 (Comparative Example 3)
Comparative Example 1 was performed except that the thickness of the adhesive layer was 8 μm. The resistance value was 1.8Ω.
　（比較例４）
　接着剤層の厚さを５μｍとした以外は実施例１と同様にした。抵抗値は０．５Ωであった。 (Comparative Example 4)
The procedure was the same as Example 1 except that the thickness of the adhesive layer was 5 μm. The resistance value was 0.5Ω.
　（比較例５）
　接着剤層の厚さを８μｍとした以外は実施例１と同様にした。抵抗値は１．３Ωであった。 (Comparative Example 5)
The procedure was the same as Example 1 except that the thickness of the adhesive layer was 8 μm. The resistance value was 1.3Ω.
　（比較例６）
　接着剤層の厚さを８μｍとした以外は実施例２と同様にした。抵抗値は０．５Ωであった。 (Comparative Example 6)
The procedure was the same as Example 2 except that the thickness of the adhesive layer was 8 μm. The resistance value was 0.5Ω.
　表１に各実施例及び比較例についてまとめて示す。 Table 1 summarizes each example and comparative example.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　本発明は、以上の実施形態に限定されるものではなく、本発明の要旨を変更しない範囲において適宜変更して適用することができる。 The present invention is not limited to the above-described embodiment, and can be applied with appropriate modifications within a range that does not change the gist of the present invention.
　本開示の電磁波シールドフィルムは、高周波伝送効率が低下しにくく、プリント配線板等に用いる電磁波シールドフィルム等として有用である。 The electromagnetic shielding film of the present disclosure is useful as an electromagnetic shielding film used for a printed wiring board and the like because the high-frequency transmission efficiency is unlikely to decrease.
１００　　　電磁波シールドフィルム
１１０　　　シールド層
１１０ａ　　凸部
１２０　　　接着剤層
１３０　　　保護層
１３２　　　樹脂組成物
１３３　　　粒子
１４０　　　支持基材
２００　　　プリント配線板
２１０　　　ベース層
２２０　　　プリント回路
２２０Ａ　　信号回路
２２０Ｂ　　グランド回路
２３０　　　絶縁層
３００　　　シールドプリント配線板 DESCRIPTION OF SYMBOLS 100 Electromagnetic wave shield film 110 Shield layer 110a Protrusion part 120 Adhesive layer 130 Protective layer 132 Resin composition 133 Particle 140 Support base material 200 Printed wiring board 210 Base layer 220 Printed circuit 220A Signal circuit 220B Ground circuit 230 Insulating layer 300 Shield printed wiring Board

Claims (16)

  1. 　凹凸を有する導電性のシールド層と、
    　前記凹凸を被覆する接着剤層とを備え、
    　前記凹凸の最大山高さの値は、前記接着剤層の厚さよりも大きい、電磁波シールドフィルム。     A conductive shield layer having irregularities;
    An adhesive layer covering the unevenness,
    The electromagnetic wave shielding film, wherein the maximum peak height of the unevenness is larger than the thickness of the adhesive layer.
  2. 　前記凹凸の最大山高さは、２０μｍ以下である、請求項１に記載の電磁波シールドフィルム。 The electromagnetic wave shielding film according to claim 1, wherein the maximum peak height of the unevenness is 20 μm or less.
  3. 　前記凹凸の最大山高さは、４μｍ以上である、請求項１又は２に記載の電磁波シールドフィルム。 The electromagnetic wave shielding film according to claim 1 or 2, wherein a maximum peak height of the unevenness is 4 µm or more.
  4. 　前記シールド層の前記接着剤層と反対側の面に保護層を備えている、
    請求項１～３のいずれか１項に記載の電磁波シールドフィルム。     A protective layer is provided on the surface of the shield layer opposite to the adhesive layer,
    The electromagnetic wave shielding film according to any one of claims 1 to 3.
  5. 　前記保護層は、前記シールド層側の面の最大山高さの値が、前記接着剤層の厚さ以上、２０μｍ以下である、請求項４に記載の電磁波シールドフィルム。 5. The electromagnetic wave shielding film according to claim 4, wherein the protective layer has a maximum peak height value on the surface on the shield layer side which is not less than the thickness of the adhesive layer and not more than 20 μm.
  6. 　前記保護層は、粒径が１μｍ以上、２０μｍ以下の粒子を含有する、請求項４又は５に記載の電磁波シールドフィルム。 The electromagnetic wave shielding film according to claim 4 or 5, wherein the protective layer contains particles having a particle size of 1 µm or more and 20 µm or less.
  7. 　前記接着剤層は絶縁性である、請求項１～６のいずれか１項に記載の電磁波シールドフィルム。 The electromagnetic wave shielding film according to any one of claims 1 to 6, wherein the adhesive layer is insulative.
  8. 　保護層を準備する工程と、
    　前記保護層の上に凹凸を有する導電性のシールド層を形成する工程と、
    　前記シールド層の最大山高さの値よりも厚さが薄く、且つ、前記凹凸を被覆する接着剤層を形成する工程とを備えている、電磁波シールドフィルムの製造方法。     Preparing a protective layer;
    Forming a conductive shield layer having irregularities on the protective layer;
    And a step of forming an adhesive layer covering the unevenness, wherein the thickness is smaller than the maximum peak height value of the shield layer.
  9. 　前記保護層を準備する工程は、最大山高さが４μｍ以上、２０μｍ以下の凹凸を表面に有する保護層を形成する工程である、請求項８に記載の電磁波シールドフィルムの製造方法。 The method for producing an electromagnetic wave shielding film according to claim 8, wherein the step of preparing the protective layer is a step of forming a protective layer having irregularities having a maximum peak height of 4 μm or more and 20 μm or less on the surface.
  10. 　前記保護層を準備する工程は、支持基材の上に、樹脂組成物と粒子とを含む保護層用組成物を塗布して硬化させる工程であり、
    　前記粒子の粒径は、１μｍ以上、２０μｍ以下である、請求項８又は９に記載の電磁波シールドフィルムの製造方法。     The step of preparing the protective layer is a step of applying and curing a protective layer composition containing a resin composition and particles on a supporting substrate,
    The method for producing an electromagnetic wave shielding film according to claim 8 or 9, wherein a particle diameter of the particles is 1 µm or more and 20 µm or less.
  11. 　前記保護層を準備する工程は、支持基材の上に樹脂層を形成する工程と、前記樹脂層に凹凸を形成する工程とを含む、請求項８又は９に記載の電磁波シールドフィルムの製造方法。 The method for producing an electromagnetic wave shielding film according to claim 8 or 9, wherein the step of preparing the protective layer includes a step of forming a resin layer on a support substrate and a step of forming irregularities on the resin layer. .
  12. 　前記凹凸を形成する工程は、前記樹脂層をエンボス加工処理する工程を含む、請求項１１に記載の電磁波シールドフィルムの製造方法。 The method for producing an electromagnetic wave shielding film according to claim 11, wherein the step of forming the unevenness includes a step of embossing the resin layer.
  13. 　前記凹凸を形成する工程は、前記樹脂層をブラスト処理する工程を含む、請求項１１に記載の電磁波シールドフィルムの製造方法。 The method for producing an electromagnetic wave shielding film according to claim 11, wherein the step of forming the unevenness includes a step of blasting the resin layer.
  14. 　前記保護層を準備する工程は、表面に凹凸を有する支持基材の上に樹脂層を形成する工程を含む、請求項８又は９に記載の電磁波シールドフィルムの製造方法。 The method for producing an electromagnetic wave shielding film according to claim 8 or 9, wherein the step of preparing the protective layer includes a step of forming a resin layer on a support substrate having an uneven surface.
  15. 　前記接着剤層を形成する工程は、前記シールド層の上に、接着剤用組成物を塗布する工程である、請求項８～１４のいずれか１項に記載の電磁波シールドフィルムの製造方法。 The method for producing an electromagnetic wave shielding film according to any one of claims 8 to 14, wherein the step of forming the adhesive layer is a step of applying an adhesive composition on the shield layer.
  16. 　請求項１～７のいずれか１項に記載の電磁波シールドフィルムと、
    　信号回路及びグランド回路が設けられたベース層と、前記グランド回路の少なくとも一部を露出する開口部が設けられた絶縁層とを有するプリント配線板とを備え、
    　前記電磁波シールドフィルムと、前記プリント配線板とは、前記接着剤層と前記絶縁層とを対向させて接着され、
    　前記シールド層の凸部は、前記接着剤層を突き抜けて前記開口部から露出した前記グランド回路と接している、シールドプリント配線板。
          The electromagnetic wave shielding film according to any one of claims 1 to 7,
    A printed wiring board having a base layer provided with a signal circuit and a ground circuit, and an insulating layer provided with an opening exposing at least a part of the ground circuit;
    The electromagnetic wave shielding film and the printed wiring board are bonded with the adhesive layer and the insulating layer facing each other,
    The convex part of the said shield layer is a shield printed wiring board which has penetrated the said adhesive bond layer and is in contact with the said ground circuit exposed from the said opening part.
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JP2019046871A (en) * 2017-08-30 2019-03-22 タツタ電線株式会社 Electromagnetic wave shield film, shield printed wiring board, and method for manufacturing shield printed wiring board
JP2019121731A (en) * 2018-01-10 2019-07-22 タツタ電線株式会社 Electromagnetic wave shielding film
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JP2020516052A (en) * 2018-03-14 2020-05-28 グアンジョウ ファン バン エレクトロニクス カンパニー，リミテッドＧｕａｎｇｚｈｏｕ Ｆａｎｇ Ｂａｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．， Ｌｔｄ． Electromagnetic shield film, circuit board, and method for manufacturing electromagnetic shield film
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