CN110769665B - Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film - Google Patents
Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film Download PDFInfo
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- CN110769665B CN110769665B CN201810846187.5A CN201810846187A CN110769665B CN 110769665 B CN110769665 B CN 110769665B CN 201810846187 A CN201810846187 A CN 201810846187A CN 110769665 B CN110769665 B CN 110769665B
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- 238000002360 preparation method Methods 0.000 title abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 133
- 229920005989 resin Polymers 0.000 claims abstract description 133
- 239000003292 glue Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 352
- 239000002313 adhesive film Substances 0.000 claims description 58
- 239000002245 particle Substances 0.000 claims description 50
- 239000004020 conductor Substances 0.000 claims description 25
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 8
- 239000011651 chromium Substances 0.000 claims description 8
- 229910017052 cobalt Inorganic materials 0.000 claims description 8
- 239000010941 cobalt Substances 0.000 claims description 8
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 239000002041 carbon nanotube Substances 0.000 claims description 5
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000007711 solidification Methods 0.000 claims description 5
- 230000008023 solidification Effects 0.000 claims description 5
- 229910000859 α-Fe Inorganic materials 0.000 claims description 5
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 3
- 238000007772 electroless plating Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000005240 physical vapour deposition Methods 0.000 claims description 3
- 238000007788 roughening Methods 0.000 claims description 3
- 239000012528 membrane Substances 0.000 abstract 3
- 230000006872 improvement Effects 0.000 description 10
- 239000002923 metal particle Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 238000009795 derivation Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000003252 repetitive effect Effects 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920006269 PPS film Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Abstract
The embodiment of the invention provides an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film, wherein the electromagnetic shielding film comprises a first shielding layer, a second shielding layer and a glue film layer, a first through hole is formed in the first shielding layer, a resin bulge is formed at the first through hole, and the resin bulge is formed by solidifying resin after flowing from one side to the other side of the first through hole; the second shielding layer is arranged on one side of the first shielding layer, which is close to the resin bulge, and covers the resin bulge, so that a bulge part is formed on the outer surface of the second shielding layer at a position corresponding to the resin bulge; the glued membrane layer is located one side that the first shielding layer was kept away from to the second shielding layer, and the bellying stretches into the glued membrane layer for the bellying guarantees that the glued membrane layer can be impaled smoothly to the second shielding layer at the in-process of pressfitting, contacts with the circuit board stratum, guarantees that the interference charge is normally derived, realizes the shielding function.
Description
Technical Field
The invention relates to the field of electronics, in particular to an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film.
Background
With the rapid development of the electronic industry, electronic products further develop toward miniaturization, light weight and high-density assembly, and the development of flexible circuit boards is greatly promoted, so that the integration of element devices and wire connection is realized. The flexible circuit board can be widely applied to industries such as mobile phones, liquid crystal displays, communication, aerospace and the like.
Under the push of international markets, a functional flexible circuit board is dominant in the flexible circuit board market, and an important index for evaluating the performance of the functional flexible circuit board is electromagnetic Shielding (Electromagnetic Interference Shielding, abbreviated as EMI Shielding).
At present, the shielding film commonly used by the existing circuit board comprises a shielding layer and a conductive adhesive layer, wherein the shielding layer is connected with the circuit board stratum through the conductive adhesive layer, so that interference charges are led into the circuit board stratum to realize shielding. However, at high temperature, the conductive particles originally contacting with each other in the conductive adhesive layer are pulled apart or the conductive particles originally contacting with the stratum of the circuit board are pulled apart due to expansion of the conductive adhesive layer, so that the grounding is invalid, the interference charge cannot be rapidly led out, and the shielding function cannot be realized.
Disclosure of Invention
The embodiment of the invention aims to provide an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film, which can realize reliable connection of the shielding film and a circuit board stratum and further realize a high-reliability shielding function.
In order to achieve the above object, an embodiment of the present invention provides an electromagnetic shielding film, including a first shielding layer, a second shielding layer, and a film layer, where a first through hole penetrating through an upper surface and a lower surface of the first shielding layer is provided on the first shielding layer, the first through hole is provided with a resin protrusion, and the resin protrusion is formed by solidifying resin after flowing from one side to the other side of the first through hole; the second shielding layer is arranged on one side, close to the resin protrusion, of the first shielding layer and covers the resin protrusion, so that a protrusion part is formed on the outer surface of the second shielding layer at a position corresponding to the resin protrusion; the adhesive film layer is arranged on one side, far away from the first shielding layer, of the second shielding layer, and the protruding portion extends into the adhesive film layer.
As an improvement of the above-mentioned scheme, the resin protrusion is formed by solidifying the resin at the solidifying temperature after flowing from one side to the other side of the first through hole at normal temperature; or alternatively, the first and second heat exchangers may be,
the resin protrusion is formed by instantaneous cooling after resin flows from one side to the other side of the first through hole at a melting temperature.
As an improvement of the above-mentioned scheme, the surface of the protruding portion is provided with convex conductor particles; the conductor particles have a height of 0.1 μm to 30 μm.
As an improvement of the above, the adhesive film layer includes an adhesive layer containing conductive particles; or, the adhesive film layer comprises an adhesive layer without conductive particles.
As an improvement of the above solution, the first shielding layer and the second shielding layer include one or more of a metal shielding layer, a carbon nanotube shielding layer, a ferrite shielding layer, and a graphene shielding layer, respectively.
As an improvement of the above, the metal shielding layer comprises a single metal shielding layer and/or an alloy shielding layer; wherein the single metal shielding layer is made of any one material of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy shielding layer is made of any two or more materials of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
As an improvement of the scheme, every 1cm 2 The number of the first through holes in the first shielding layer is 10-1000; and/or the cross-sectional area of the first through hole is 0.1 μm 2 -1mm 2 。
As an improvement of the above scheme, the electromagnetic shielding film further comprises a protective film layer, and the protective film layer is arranged on one side of the first shielding layer away from the second shielding layer.
Compared with the prior art, the embodiment of the invention discloses an electromagnetic shielding film, wherein the first through hole is formed in the first shielding layer, the resin bulge formed by solidifying resin after flowing from one side to the other side of the first through hole is formed in the first through hole, the second shielding layer is arranged on one side of the first shielding layer, which is close to the resin bulge, and covers the resin bulge, so that the bulge part is formed on the outer surface of the second shielding layer, which corresponds to the resin bulge, and the adhesive film layer is arranged on one side of the second shielding layer, which is far away from the first shielding layer, so that the bulge part can ensure that the second shielding layer can smoothly pierce the adhesive film layer in the pressing process, thereby realizing reliable grounding, and further ensuring normal export of interference charges under the cooperation of the first shielding layer and the second shielding layer, and realizing high shielding performance.
The embodiment of the invention also correspondingly provides a circuit board, which comprises a printed circuit board and any electromagnetic shielding film, wherein the electromagnetic shielding film is pressed with the printed circuit board through a film layer of the electromagnetic shielding film; the protruding portion pierces the adhesive film layer and extends to the stratum of the printed circuit board.
Compared with the prior art, the embodiment of the invention discloses a circuit board, which comprises a printed circuit board and any electromagnetic shielding film, wherein the electromagnetic shielding film is pressed with the printed circuit board through a film layer of the electromagnetic shielding film, and the bulge part pierces the film layer and is connected with a stratum of the printed circuit board, so that smooth derivation of interference charges and high shielding performance are realized.
The embodiment of the invention also correspondingly provides a preparation method of the electromagnetic shielding film, which is suitable for preparing any electromagnetic shielding film, and comprises the following steps:
s1, forming a first shielding layer; the first shielding layer is provided with a first through hole penetrating through the upper surface and the lower surface of the first shielding layer;
s2, forming a resin protrusion at the first through hole; wherein the resin protrusion protrudes out of the first through hole;
s3, forming a second shielding layer on one side of the first shielding layer, on which the resin protrusion is formed, and enabling the second shielding layer to cover the resin protrusion, so that a protrusion part is formed on the outer surface of the second shielding layer at a position corresponding to the resin protrusion;
s4, forming a glue film layer on one side of the second shielding layer far away from the first shielding layer.
As an improvement of the above solution, in step S2, the forming a resin bump at the first through hole is specifically:
providing resin at the first through hole, and allowing the resin to flow from one side to the other side of the first through hole at normal temperature and then solidifying at a solidifying temperature, thereby forming a resin protrusion at the first through hole; or alternatively, the first and second heat exchangers may be,
and providing resin at the first through hole, and enabling the resin to flow from one side of the first through hole to the other side at the melting temperature, and then performing instantaneous cooling, so as to form a resin protrusion at the first through hole.
As an improvement of the above solution, before forming the adhesive film layer on the side of the second shielding layer away from the first shielding layer, the method further includes the following steps:
conductor particles are formed on the outer surface of the raised portion by one or more of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporative plating, sputter plating, electroplating, and hybrid plating.
As an improvement of the above solution, in step S4, the forming a glue film layer on a side of the second shielding layer away from the first shielding layer specifically includes:
coating a glue film layer on a release film, and then pressing and transferring the glue film layer to one side of a second shielding layer far away from the first shielding layer, so as to form the glue film layer on one side of the second shielding layer far away from the first shielding layer; or (b)
And directly coating a glue film layer on one side of the second shielding layer far away from the first shielding layer, so that the glue film layer is formed on one side of the second shielding layer far away from the first shielding layer.
Compared with the prior art, the preparation method of the electromagnetic shielding film provided by the embodiment of the invention has the advantages that the second shielding layer is formed on the side, on which the resin protrusion is formed, of the first shielding layer, and meanwhile, the second shielding layer covers the resin protrusion, so that the protruding part is formed on the outer surface of the second shielding layer corresponding to the resin protrusion, and the adhesive film layer is formed on the side of the second shielding layer, so that the formed protruding part can ensure that the second shielding layer can successfully pierce the adhesive film layer in the pressing process, reliable grounding is realized, and the practicability is strong.
Drawings
Fig. 1 is a schematic view showing the structure of an electromagnetic shielding film according to an angle in embodiment 1 of the present invention;
fig. 2 is a schematic view showing the structure of an electromagnetic shielding film in embodiment 1 of the present invention at another angle;
fig. 3 is a schematic structural view of an electromagnetic shielding film in embodiment 2 of the present invention;
fig. 4 is a schematic structural view of a circuit board in embodiment 3 of the present invention;
fig. 5 is a flow chart showing a method for producing an electromagnetic shielding film in example 4 of the present invention.
1, a first shielding layer; 11. a first through hole; 12. resin protrusion; 13. a first surface; 14. a second surface; 2. a second shielding layer; 21. a boss; 22. conductor particles; 3. an adhesive film layer; 4. a protective film layer; 5. and a printed wiring board.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, a schematic view of an angle of an electromagnetic shielding film according to embodiment 1 of the present invention is shown;
referring to fig. 2, there is shown a schematic view of another angle of the electromagnetic shielding film according to embodiment 1 of the present invention;
referring to fig. 1 and 2, the electromagnetic shielding film comprises a first shielding layer 1, a second shielding layer 2 and a glue film layer 3, wherein a first through hole 11 penetrating through the upper surface and the lower surface of the first shielding layer 1 is formed in the first shielding layer 1, a resin protrusion 12 is formed at the first through hole 11, and the resin protrusion 12 is formed by solidifying resin after flowing from one side to the other side of the first through hole 11; the second shielding layer 2 is arranged on one side of the first shielding layer close to the resin protrusion 12 and covers the resin protrusion 12, so that a protrusion 21 is formed on the outer surface of the second shielding layer 2 at a position corresponding to the resin protrusion 12; the adhesive film layer 3 is disposed on a side of the second shielding layer 2 away from the first shielding layer 1, and the protruding portion 21 extends into the adhesive film layer 3.
In the embodiment of the invention, the first through hole 11 is arranged on the first shielding layer 1, the resin protrusion 12 formed by solidifying resin after flowing from one side to the other side of the first through hole 11 is arranged at the first through hole 11, meanwhile, the second shielding layer 2 is arranged at one side of the first shielding layer 1 close to the resin protrusion 12 and covers the resin protrusion 12, so that the protruding part 21 is formed at the position, corresponding to the resin protrusion 12, of the outer surface of the second shielding layer 2, and the adhesive film layer 3 is arranged at one side, away from the first shielding layer 1, of the second shielding layer 2, so that the protruding part 21 ensures that the second shielding layer 2 can smoothly pierce the adhesive film layer 3 in the pressing process, thereby realizing reliable grounding, ensuring normal export of interference charges under the cooperation of the first shielding layer 1 and the second shielding layer 2, and realizing high shielding performance. The electromagnetic shielding film of the embodiment does not need to be provided with the conductive adhesive layer, so that the problem of grounding failure caused by expansion of the conductive adhesive layer at high temperature is effectively avoided.
Wherein, the process of forming the resin protrusion 12 is embodied as: in one preferred embodiment, the resin protrusion 12 is formed by instantaneous cooling after resin flows from one side to the other side of the first through hole 11 at a melting temperature. In yet another preferred embodiment, the resin is a cured paste, and the formation of the resin projections 12 is embodied as follows: at normal temperature, the liquefied resin is solidified at the solidification temperature after flowing from one side to the other side of the first through hole 11.
In the embodiment of the present invention, it is to be noted that the structure of the resin protrusion 12 shown in the drawings is merely exemplary. Since the resin protrusion 12 is formed by solidification after resin flows from one side to the other side of the first through hole 11, in one of the cases, resin flows out almost entirely from the first through hole 11, there is no residue in the first through hole 11, and thus the resin protrusion 12 formed may be formed at the boundary of the first through hole 11 and the second shielding layer 2 as shown in the drawings; in another case, the resin remains in the first through hole 11, the first through hole 11 is even filled with the resin, and thus one end of the resin protrusion 12 formed is located in the first through hole 11, and the other end of the resin protrusion 12 protrudes out of the first through hole 11; in still another case, resin remains on a side surface of the first shielding layer 1 away from the second shielding layer 2, and thus, the resin protrusion 12 may be formed to penetrate the first through hole 11. The resin protrusion 12 of the present invention is not limited to the shape shown in the drawings and described above, and any resin protrusion having a piercing ability is within the scope of the present invention.
In the embodiment of the present invention, in order to ensure that the resin protrusion 12 can be formed at the first through hole 11, it is preferable that the cross-sectional area of the first through hole 11 in the embodiment is 0.1 μm 2 -1mm 2 。
Furthermore, every 1cm in the present embodiment 2 The number of the first through holes 11 in the first shielding layer 1 is 10-1000. Correspondingly, every 1cm 2 The number of the resin bulges 12 in the first shielding layer 1 is 10-1000; since the second shielding layer 2 covers the resin protrusion 12, and thus the protruding portions 21 are formed at positions corresponding to the resin protrusion 12 on the outer surface of the second shielding layer 2, the number of the protruding portions 21 corresponds to the number of the resin protrusions 12, thereby ensuring that the second shielding layer 2 can smoothly pierce the adhesive film layer 3.
In the embodiment of the present invention, the first through holes 11 may be regularly or irregularly distributed on the first shielding layer 1; wherein, the first through holes 11 are regularly distributed on the first shielding layer 1, which means that the shapes of the first through holes 11 are the same and are uniformly distributed on the first shielding layer 1; the first through holes 11 being irregularly distributed on the first shielding layer 1 means that the respective first through holes 11 are different in shape and are randomly distributed on the first shielding layer 1. Preferably, the shapes of the first through holes 11 are the same, and the first through holes 11 are uniformly distributed on the first shielding layer 1. In addition, the first through hole 11 may be a circular through hole, or may be any other through hole, and the present invention is illustrated only in the case that the first through hole 11 is a circular through hole, but any other shape of the first through hole 11 is within the scope of the present invention.
In the embodiment of the present invention, the shape of the protruding portion 21 may be the same as the shape of the resin protrusion 12 or may be different from the shape of the resin protrusion 12, and the shape of the protruding portion 21 shown in the drawings is merely exemplary.
In the embodiment of the invention, the thickness of the first shielding layer 1 is 0.1 μm-45 μm; the thickness of the second shielding layer 2 is 0.1 μm-45 μm. In order to ensure that the first shielding layer 1 and the second shielding layer 2 have good electrical conductivity, the first shielding layer 1 includes one or more of a metal shielding layer, a carbon nanotube shielding layer, a ferrite shielding layer, and a graphene shielding layer; the second shielding layer 2 includes one or more of a metal shielding layer, a carbon nanotube shielding layer, a ferrite shielding layer, and a graphene shielding layer. Further, the metal shielding layer includes a single metal shielding layer and/or an alloy shielding layer; wherein the single metal shielding layer is made of any one material of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy shielding layer is made of any two or more materials of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
In the embodiment of the present invention, the first shielding layer 1 includes a first surface 13 and a second surface 14 that are disposed opposite to each other, and the first surface 13 is in contact with the second shielding layer 2; the second surface 14 is in contact with the protective film layer 4. It should be noted that the first surface 13 and the second surface 14 may be any shape, for example, may be a flat surface as shown in fig. 1, a non-flat surface with a wavy shape, or other rough surfaces; further, the first surface 13 and the second surface 14 may be regular surfaces or irregular surfaces. The figures of the present invention are only illustrated with the first surface 13 and the second surface 14 being flat surfaces, and any other shape of the first surface 13 and the second surface 14 is within the scope of the present invention.
In the embodiment of the present invention, it should be noted that, in the drawings of the present embodiment, the first shielding layer 1 and the second shielding layer 2 may have a single-layer structure or a multi-layer structure. In addition, the first and second shielding layers 1 and 2 of the drawings of the present embodiment may be provided in a mesh shape, a foam shape, or the like, according to the actual production and application requirements.
In the embodiment of the present invention, one of the structures of the adhesive film layer 3 is specifically shown as follows: the adhesive film layer 3 includes an adhesive layer containing conductive particles. By making the adhesive film layer 3 include an adhesive layer containing conductive particles, the adhesive film layer 3 has an adhesive function to tightly adhere the wiring board and the electromagnetic shielding film, and at the same time, the adhesive film layer 3 has a conductive function, which is matched with the second shielding layer 2 and the first shielding layer 1 to rapidly introduce interference electrons into the ground layer of the wiring board. The conductive particles can be mutually separated conductive particles or large-particle conductive particles formed by agglomeration; when the conductive particles are mutually separated conductive particles, the area of the electrical contact can be further increased, and the uniformity of the electrical contact is improved; and when the conductive particles are large-particle conductive particles formed by agglomeration, the piercing strength can be increased.
In the embodiment of the present invention, the other structure of the adhesive film layer 3 is specifically: the adhesive film layer 3 includes an adhesive layer containing no conductive particles. The adhesive film layer 3 comprises an adhesive layer without conductive particles, so that the adhesive film layer 3 has an adhesive effect, so that the wiring board and the electromagnetic shielding film are tightly adhered, and meanwhile, the adhesive film layer 3 comprises the adhesive layer without conductive particles, so that the insertion loss of the circuit board in the use process is reduced, the shielding efficiency is improved, and the bending property of the circuit board is improved.
In the embodiment of the invention, the thickness of the adhesive film layer 3 is 1 μm-80 μm. The adhesive film layer 3 is made of the following materials: modified epoxy resins, acrylic, modified rubbers, and modified thermoplastic polyimides. In addition, the outer surface of the adhesive film layer 3 may be a flat surface without undulation, or may be a non-flat surface with gentle undulation.
As shown in fig. 1, in order to protect the first shielding layer 1, the electromagnetic shielding film further includes a protective film layer 4 in this embodiment, where the protective film layer 4 is disposed on a side of the first shielding layer 1 away from the second shielding layer 2. The protective film layer 4 plays a role in protection, so that the first shielding layer 1 is prevented from being scratched and damaged in the use process, and the high shielding effectiveness of the first shielding layer 1 is maintained. The protective film layer 4 comprises a PPS film layer, a PEN film layer, a polyester film layer, a polyimide film layer, a film layer formed by curing epoxy resin ink, a film layer formed by curing polyurethane ink, a film layer formed by curing modified acrylic resin or a film layer formed by curing polyimide resin.
In the embodiment of the present invention, it should be noted that the electromagnetic shielding film may be a repetitive multilayer structure. Specifically, the electromagnetic shielding film may include a plurality of first shielding layers 1 stacked in sequence, and one side of an integral body formed by the plurality of first shielding layers 1 is sequentially provided with the second shielding layer 2 and the adhesive film layer 3, and the other side is provided with the protective film layer 4; a resin protrusion 12 is provided at a first through hole 11 on the first shielding layer 1 contacting with the second shielding layer 2, the second shielding layer 2 covers the resin protrusion 12, so that a protrusion 21 is formed on the outer surface of the second shielding layer 2 at a position corresponding to the resin protrusion 12, and the protrusion 21 extends into the adhesive film layer 3.
Referring to fig. 3, a schematic structural diagram of an electromagnetic shielding film according to embodiment 2 of the present invention is shown;
as shown in fig. 3, the electromagnetic shielding film in the present embodiment is different from embodiment 1 in that the surface of the convex portion 21 is provided with convex conductor particles 22. By disposing the conductor particles 22 on the surface of the protruding portion 21, the protruding portion 21 is easier to pierce through the adhesive film layer 3, thereby realizing grounding and improving the quality of electromagnetic shielding.
Preferably, the conductor particles 22 are intensively distributed at the outwardly convex positions of the surface of the convex portion 21, so that the adhesive film layer 3 is more easily pierced. Of course, the non-convex portions of the surface of the convex portion 21 may be distributed with the conductor particles 22. In addition, the conductor particles 22 may be distributed at other positions of the second shielding layer 2 near the surface of the adhesive film layer 3, not only on the surface of the protruding portion 21, as shown in fig. 3. Of course, the conductor particles 22 may also be distributed only in the protruding portion 21.
In an implementation, as shown in fig. 3, the second shielding layer 2 may be formed first, and then the conductor particles 22 may be formed on a side of the second shielding layer 2 away from the first shielding layer 1 through other processes. Of course, the second shielding layer 2 and the conductor particles 22 may be an integral structure formed by a one-shot molding process. The conductor particles 22 are concentrated on the protruding portion 21.
In this embodiment of the present invention, the conductor particles 22 may have a certain distance from the outer surface of the adhesive film layer 3, or may contact with the outer surface of the adhesive film layer 3 or extend out of the outer surface of the adhesive film layer 3.
In the embodiment of the present invention, in order to further ensure that the protruding portion 21 can smoothly pierce the adhesive film layer 3, it is preferable that the height of the conductor particles 22 is 0.1 μm to 30 μm.
In an embodiment of the present invention, the conductor particles 22 include one or more of metal particles, carbon nanotube particles, and ferrite particles. Further, the metal particles include single metal particles and/or alloy particles; wherein the single metal particles are made of any one material of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy particles are made of any two or more materials of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold. In addition, the conductive particles 22 may be the same as or different from the material of the second shielding layer 2.
In the embodiment of the present invention, it should be noted that the shape of the conductor particles 22 shown in fig. 3 is merely exemplary, and the conductor particles 22 may be in other shapes such as clusters, ice-hanging shapes, stalactites, dendrites, etc. due to differences in process means and parameters. The conductor particles 22 in the present invention are not limited to the shape shown in the drawings and described above, and any conductor particles having piercing and conducting functions are within the scope of the present invention.
In the embodiment of the present invention, it should be noted that the electromagnetic shielding film may be a repetitive multilayer structure; specifically, the electromagnetic shielding film may include a plurality of first shielding layers 1 stacked in sequence, and one side of an integral body formed by the plurality of first shielding layers 1 is sequentially provided with the second shielding layer 2 and the adhesive film layer 3, and the other side is provided with the protective film layer 4; the first through hole 11 on the first shielding layer 1, which is in contact with the second shielding layer 2, is provided with a resin protrusion 12, the second shielding layer 2 covers the resin protrusion 12, so that a protrusion 21 is formed on the outer surface of the second shielding layer 2 at a position corresponding to the resin protrusion 12, the protrusion 21 extends into the adhesive film layer 3, and the surface of the protrusion 21 is provided with the conductor particles 22. In addition, other structures and working principles of the electromagnetic shielding film of the present embodiment are the same as those of embodiment 1, and no further description is given here.
Referring to fig. 4, a schematic structural diagram of a circuit board according to embodiment 3 of the present invention is shown;
as shown in fig. 4, the embodiment of the present invention further provides a circuit board including a printed circuit board 5 and the electromagnetic shielding film of embodiment 1, where the electromagnetic shielding film is pressed together with the printed circuit board 5 through the adhesive film layer 3 thereof; the protruding portion 21 pierces the adhesive film layer 3 and extends to the ground layer of the printed wiring board 5.
In this embodiment, reference may be made to the description of embodiment 1 above for implementation of the electromagnetic shielding film, and the description is omitted here.
Preferably, the printed circuit board 5 is one of flexible single-sided, flexible double-sided, flexible multi-layer board and rigid-flex board.
In the embodiment of the present invention, through the above structure, in the lamination process, the adhesive film layer 3 is pierced by using the protruding portion 21 on the second shielding layer 2, so that at least a portion of the outer surface of the second shielding layer 2 is connected with the stratum of the printed circuit board 5, and thus, under the cooperation of the first shielding layer 1 and the second shielding layer 2, the interference charge is led into the stratum of the circuit board, and the interference source formed by the accumulation of the interference charge is avoided, thereby affecting the normal operation of the circuit board. In addition, it should be noted that, the circuit board of the present embodiment may replace the electromagnetic shielding film of embodiment 1 adopted in the structure of the circuit board with the electromagnetic shielding film of embodiment 2, and no further description is given here.
Referring to fig. 5, a schematic flow chart of a method for preparing an electromagnetic shielding film according to embodiment 4 of the present invention is shown;
as shown in fig. 5, the method is suitable for the preparation of the electromagnetic shielding film described in example 1, and includes the steps of:
s1, forming a first shielding layer; the first shielding layer is provided with a first through hole penetrating through the upper surface and the lower surface of the first shielding layer;
wherein the first shielding layer is formed in step S1 by:
forming a protective film layer on a carrier film, and forming the first shielding layer on one side of the protective film layer; or alternatively, the first and second heat exchangers may be,
and forming a peelable layer on the carrier film, forming the first shielding layer on the surface of the peelable layer, and peeling the carrier film after forming a protective film layer on the side of the first shielding layer away from the peelable layer.
In an embodiment of the present invention, the cross-sectional area of the first via hole is 0.1 μm 2 -1mm 2 The method comprises the steps of carrying out a first treatment on the surface of the Every 1cm 2 The number of the first through holes in the first shielding layer is 10-1000.
S2, forming a resin protrusion at the first through hole; wherein the resin protrusion protrudes out of the first through hole;
wherein, the forming the resin protrusion at the first through hole specifically comprises: and setting resin at the first through hole, and solidifying the resin after flowing from one side to the other side of the first through hole, thereby forming a resin protrusion at the first through hole. Specifically, in one of the preferred modes, a resin is provided at the first through hole, and after the resin is caused to flow from one side to the other side of the first through hole at normal temperature, the resin is solidified at a solidification temperature, thereby forming a resin protrusion at the first through hole; in yet another preferred embodiment, a resin is provided at the first through hole, and after the resin is flowed from one side to the other side of the first through hole at a melting temperature, the resin is instantaneously cooled, thereby forming a resin protrusion at the first through hole.
S3, forming a second shielding layer on one side of the first shielding layer, on which the resin protrusion is formed, and enabling the second shielding layer to cover the resin protrusion, so that a protrusion part is formed on the outer surface of the second shielding layer at a position corresponding to the resin protrusion;
s4, forming a glue film layer on one side of the second shielding layer far away from the first shielding layer.
Specifically, a film layer is coated on a release film, and then the film layer is transferred to one side of the second shielding layer far away from the first shielding layer in a pressing way, so that the film layer is formed on one side of the second shielding layer far away from the first shielding layer; or (b)
And directly coating a glue film layer on one side of the second shielding layer far away from the first shielding layer, so that the glue film layer is formed on one side of the second shielding layer far away from the first shielding layer.
In another preferred embodiment suitable for preparing the electromagnetic shielding film described in embodiment 2, the method further comprises, before step S4:
conductor particles are formed on the outer surface of the raised portion by one or more of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporative plating, sputter plating, electroplating, and hybrid plating.
In the preparation method of the electromagnetic shielding film, the second shielding layer is formed on the side, where the resin protrusion is formed, of the first shielding layer, and meanwhile, the second shielding layer covers the resin protrusion, so that a protruding part is formed on the outer surface of the second shielding layer at a position corresponding to the resin protrusion, and the adhesive film layer is formed on the side of the second shielding layer, and therefore the formed protruding part can ensure that the second shielding layer can smoothly pierce through the adhesive film layer in the pressing process, reliable grounding is achieved, and the practicability is high.
In summary, the embodiment of the invention provides an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film, wherein the electromagnetic shielding film comprises a first shielding layer 1, a second shielding layer 2 and an adhesive film layer 3, a first through hole 11 penetrating through the upper surface and the lower surface of the first shielding layer 1 is arranged on the first shielding layer 1, a resin bulge 12 is arranged at the first through hole 11, and the resin bulge 12 is formed by solidifying resin after flowing from one side to the other side of the first through hole 11; the second shielding layer 2 is arranged on one side of the first shielding layer 1 close to the resin protrusion 12 and covers the resin protrusion 12, so that a protrusion 21 is formed on the outer surface of the second shielding layer 2 at a position corresponding to the resin protrusion 12; the adhesive film layer 3 is disposed on a side of the second shielding layer 2 away from the first shielding layer 1, and the protruding portion 21 extends into the adhesive film layer 3. The first through hole 11 is formed in the first shielding layer 1, the resin protrusion 12 formed by solidifying resin after flowing from one side to the other side of the first through hole 11 is formed at the first through hole 11, meanwhile, the second shielding layer 2 is arranged at one side of the first shielding layer 1 close to the resin protrusion 12 and covers the resin protrusion 12, so that the protruding part 21 is formed at the position, corresponding to the resin protrusion 12, of the outer surface of the second shielding layer 2, and the adhesive film layer 3 is arranged at one side, away from the first shielding layer 1, of the second shielding layer 2, and the protruding part 21 ensures that the second shielding layer 2 can smoothly pierce the adhesive film layer 3 in the pressing process, so that reliable grounding is realized, normal derivation of interference charges is ensured, and high shielding performance is realized.
While the foregoing is directed to the preferred embodiments of the present invention, it will be appreciated by those skilled in the art that changes and modifications may be made without departing from the principles of the invention, such changes and modifications are also intended to be within the scope of the invention.
Claims (13)
1. The electromagnetic shielding film is characterized by comprising a first shielding layer, a second shielding layer and an adhesive film layer, wherein a first through hole penetrating through the upper surface and the lower surface of the first shielding layer is formed in the first shielding layer, resin bulges are arranged at the first through hole, and the resin bulges are formed by solidifying resin after flowing from one side to the other side of the first through hole; the second shielding layer is arranged on one side, close to the resin protrusion, of the first shielding layer and covers the resin protrusion, so that a protrusion part is formed on the outer surface of the second shielding layer at a position corresponding to the resin protrusion; the adhesive film layer is arranged on one side, far away from the first shielding layer, of the second shielding layer, and the protruding part extends into the adhesive film layer; the protruding portion enables the second shielding layer to pierce through the adhesive film layer in the pressing process.
2. The electromagnetic shielding film according to claim 1, wherein the resin protrusion is formed by solidification of resin at a solidification temperature after flowing from one side to the other side of the first through hole at normal temperature; or alternatively, the first and second heat exchangers may be,
the resin protrusion is formed by instantaneous cooling after resin flows from one side to the other side of the first through hole at a melting temperature.
3. The electromagnetic shielding film according to claim 1, wherein the surface of the protruding portion is provided with convex conductor particles; the conductor particles have a height of 0.1 μm to 30 μm.
4. The electromagnetic shielding film of claim 1, wherein the adhesive film layer comprises an adhesive layer comprising conductive particles; or alternatively, the first and second heat exchangers may be,
the adhesive film layer comprises an adhesive layer without conductive particles.
5. The electromagnetic shielding film of any one of claims 1-4, wherein the first and second shielding layers each comprise one or more of a metal shielding layer, a carbon nanotube shielding layer, a ferrite shielding layer, and a graphene shielding layer.
6. The electromagnetic shielding film of claim 5, wherein the metallic shielding layer comprises a single metallic shielding layer and/or an alloy shielding layer; wherein the single metal shielding layer is made of any one material of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy shielding layer is made of any two or more materials of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
7. The electromagnetic shielding film of any one of claims 1-4, wherein eachThe number of the first through holes in the first shielding layer is 10-1000; and/or the cross-sectional area of the first through hole is 0.1 μm 2 -1mm 2 。
8. The electromagnetic shielding film of any one of claims 1-4, further comprising a protective film layer disposed on a side of the first shielding layer remote from the second shielding layer.
9. A circuit board, characterized by comprising a printed circuit board and the electromagnetic shielding film according to any one of claims 1-8, wherein the electromagnetic shielding film is pressed with the printed circuit board through a glue film layer thereof; the protruding part pierces the adhesive film layer and extends to the stratum of the printed circuit board; the printed circuit board is one of a flexible single-sided, a flexible double-sided, a flexible multi-layer board and a rigid-flex printed circuit board.
10. A method for producing an electromagnetic shielding film, characterized by being suitable for producing the electromagnetic shielding film according to any one of claims 1 to 8, comprising the steps of:
s1, forming a first shielding layer; the first shielding layer is provided with a first through hole penetrating through the upper surface and the lower surface of the first shielding layer;
s2, forming a resin protrusion at the first through hole; wherein the resin protrusion protrudes out of the first through hole;
s3, forming a second shielding layer on one side of the first shielding layer, on which the resin protrusion is formed, and enabling the second shielding layer to cover the resin protrusion, so that a protrusion part is formed on the outer surface of the second shielding layer at a position corresponding to the resin protrusion;
s4, forming a glue film layer on one side of the second shielding layer far away from the first shielding layer.
11. The method of manufacturing an electromagnetic shielding film according to claim 10, wherein in step S2, the resin bump is formed at the first through hole, specifically:
providing resin at the first through hole, and allowing the resin to flow from one side to the other side of the first through hole at normal temperature and then solidifying at a solidifying temperature, thereby forming a resin protrusion at the first through hole; or alternatively, the first and second heat exchangers may be,
and providing resin at the first through hole, and enabling the resin to flow from one side of the first through hole to the other side at the melting temperature, and then performing instantaneous cooling, so as to form a resin protrusion at the first through hole.
12. The method of manufacturing an electromagnetic shielding film according to claim 10, further comprising the steps of, before forming the adhesive film layer on a side of the second shielding layer away from the first shielding layer:
conductor particles are formed on the outer surface of the raised portion by one or more of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporative plating, sputter plating, electroplating, and hybrid plating.
13. The method for preparing an electromagnetic shielding film according to claim 10, wherein in step S4, a glue film layer is formed on a side of the second shielding layer away from the first shielding layer, specifically:
coating a glue film layer on a release film, and then pressing and transferring the glue film layer to one side of a second shielding layer far away from the first shielding layer, so as to form the glue film layer on one side of the second shielding layer far away from the first shielding layer; or (b)
And directly coating a glue film layer on one side of the second shielding layer far away from the first shielding layer, so that the glue film layer is formed on one side of the second shielding layer far away from the first shielding layer.
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