CN107914435A - A kind of multilayer Anisotropically conductive glued membrane and preparation method thereof - Google Patents
A kind of multilayer Anisotropically conductive glued membrane and preparation method thereof Download PDFInfo
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- CN107914435A CN107914435A CN201610882327.5A CN201610882327A CN107914435A CN 107914435 A CN107914435 A CN 107914435A CN 201610882327 A CN201610882327 A CN 201610882327A CN 107914435 A CN107914435 A CN 107914435A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/16—Layered products comprising a layer of metal next to a particulate layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/025—Particulate layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of multilayer Anisotropically conductive glued membrane, including upper conductive adhesive layer, thin metal layer, lower conductive adhesive layer, thin metal layer is formed between conductive adhesive layer and lower conductive adhesive layer, the thickness of thin metal layer is 50 3000nm, lower conductive adhesive layer release film layer formed below or carrier layer, the multilayer Anisotropically conductive glued membrane have the function of high conduction and high electromagnetic wave shielding.The metal conductive particles that upper conductive adhesive layer and lower conductive adhesive layer contain are various shapes, and the thickness of thin metal layer is nanoscale, when conductive adhesive film turns on, metal conductive particles tend to multi-direction flowing, comprehensive it can turn on, while metal conductive particles can pierce through thin metal layer, it is same to turn on the quantity that metal conductive particles are reduced under power, metal dust pollution is reduced, reduces production cost.
Description
Technical field
The invention belongs to printed wiring board conducting resinl technical field, more particularly to a kind of multilayer Anisotropically conductive glued membrane.
Background technology
The development trend of electronics and communication product requires circuit substrate component to be passed towards light and short and highly integrated development
Defeated signal frequency band is more and more wider, causes electromagnetic interference increasingly severe；At the same time in view of the safe to use of electric circuitry packages
Property, new demand is had also been proposed to circuit unit ground connection reliability in electronic product, more universal conducting resinl is used in existing market
Although product can be connected with the ground hole reserved in general printed wiring board, also occur at the same time because conducting resinl is by ground hole
Filling completely influences very much the design and installation of other assemblies, or filling is discontented causes coupling part during Reflow Soldering to make shielding there are gap
The defects of ineffective, be all directly to be dispersed in conduction particle additionally, due to the conductive adhesive film product to circulate in existing market
In conducting resinl, conductive adhesive layer is generally thicker, if curing is insufficient, pressing condition is uneven, and product can be caused to conform to printing
Occur powder skewness during wiring board, and then influence conduction property etc.；In addition, contained metallic conduction in current conductive adhesive layer
Shape of particle is mostly spheroidal, and shape is single, and incorgruous turn-on effect is bad.
The content of the invention
The invention mainly solves the technical problem of providing a kind of multilayer Anisotropically conductive glued membrane, mobility when there is pressing
It is good, that conduction is good, Bonding strength is good, electromagnetic wave shielding performance is high, transmission loss is few, transmission quality is high and reliability is good etc. is special
Property, there is more preferable turn-on effect, Bonding strength and earthing effect compared to general conductive adhesive film.
In order to solve the above technical problems, one aspect of the present invention is：A kind of multilayer anisotropic conductive adhesive is provided
Film, including upper conductive adhesive layer, thin metal layer and lower conductive adhesive layer, the thin metal layer be formed at the upper conductive adhesive layer with it is described
Between lower conductive adhesive layer, the release film layer or carrier layer formed below of the lower conductive adhesive layer；The upper conductive adhesive layer
Thickness is 5-20 μm, and the thickness of the lower conductive adhesive layer is 15-40 μm, and the thickness of the thin metal layer is 50-3000nm；It is described
Upper conductive adhesive layer and the lower conductive adhesive layer all include metal conductive particles, and the metal conductive particles are dendritic metal powder
At least two in end, needle-like metal powder, flaky metal powder and ball-type metal powder, the particle diameter of the metal conductive particles
For 2-22 μm.
In order to solve the above technical problems, the further technical solution that the present invention uses is：
Further say, the upper conductive adhesive layer and the lower conductive adhesive layer are all the thermosetting cement including adhesive resin
Layer, the ratio of the adhesive resin is 20-80% (weight ratio), and the ratio of the metal conductive particles is 30-80% (weight
Than), the metal conductive particles and the adhesive resin ratio are 1:1-5:1 (weight ratio).
Further say, the thickness of the lower conductive adhesive layer is more than or equal to the cover layer of be bonded print circuit board surface
Thickness, the thickness of the lower conductive adhesive layer is 0-5 μm with the thickness difference for the cover layer of print circuit board surface being bonded.
Further say, the particle diameter of the metal conductive particles is 10-18 μm.
Further say, the metal conductive particles are dendritic metal powder, needle-like metal powder and flake metal powder
Three kinds of mixing at end, wherein the ratio of the dendritic metal powder and the needle-like metal powder is 1:5-5:1 (weight ratio),
The ratio of the needle-like metal powder and the flaky metal powder is 1:4-4:1 (weight ratio).
Further say, the metal conductive particles include alloy conductive particle.
Further say, the adhesive resin is epoxy resin, acrylic resin, amido formate system resin, silicon
Rubber series resin, gather to ring diformazan benzene series resin, bismaleimide amine system resin, phenol resin, melmac and polyamides Asia
At least one of polyimide resin.
Further say, the thin metal layer for peel off carrier after carrier metal layer, the thin metal layer for copper foil layer,
One kind in silver foil layer and nickel metal layer.
Further say, the thickness of the release film layer or carrier layer is 25-100 μm；The release film layer is PET fluorine
Mould release film layer, PET silicate-containing oils release film layer, PET matts release film layer, PE release film layers or PE lamination ply of papers；It is described release
Film layer is two-sided release film layer or single-sided parting film layer.
A kind of production method of above-mentioned multilayer Anisotropically conductive glued membrane, includes the following steps：
Step 1：, will by the powder of the metal conductive particles of each shape respectively after particle diameter needed for screening screening obtains
The metal conductive particles of each shape are uniformly mixed to obtain metallic mixture；
Step 2：Metal conductive particles and the adhesive resin are added in proportion, it is sufficiently mixed uniformly；
Step 3：Specified in release film layer or carrier layer and descend conducting resinl from mixture made from shape face application step two
Layer；
Step 4：Fit in the metal of carrier metal layer is laminated lower conductive adhesive layer and cure, remove carrier afterwards, i.e.,
Thin metal layer is formed on lower conductive adhesive layer；
Step 5：Thin metal layer remove mixture made from the side application step two of carrier i.e. on conductive adhesive layer；
Step 6：Cure, winding, get product.
The beneficial effects of the invention are as follows：A kind of multilayer Anisotropically conductive glued membrane of the present invention at least has the following advantages：
First, upper conductive adhesive layer and lower conductive adhesive layer of the invention include the metal conductive particles of at least two shapes, by
There are various shapes in metal conductive particles, therefore be subject to hot pressing to tend to multi-direction flowing when producing deformation, after making pressing
Distribution of the metal conductive particles in conductive adhesive layer has multidirectional and polymolecularity, and then is formed with the ground hole on soft board
Turning circuit so that upper conductive adhesive layer and lower conductive adhesive layer have good incorgruous conduction, and conduction property is substantially improved, can
Reduce the impedance ground value of soft board；
2nd, thin metal layer thinner thickness of the invention, is nanoscale, and the particle diameter of part metals conducting particles is more than thin gold
Belong to the thickness of layer, during pressing, the metal conductive particles of various shapes can pierce through thin metal layer, directly conducting, and conducting is substantially improved
Performance, can reduce the impedance ground value of soft board；Simultaneously because containing thin metal layer, in the case of equally conducting power, above lead
The metal conductive particles ratio added in electric glue-line and lower conductive adhesive layer can be reduced accordingly, can reduce dust pollution, reduce cost.
3rd, after pressing, through a period of time high-temperature maturing, the metal conductive particles of multidirectional can lift adhesive resin and reach
Electrical resistance and mechanical properties after to fully crosslinked curing；
4th, conductive adhesive layer of the invention with steel disc when metal parts formation strengthening part is posted to printed wiring board,
Because of the purpose that there is good ground connection stability can realize effectively shielding extraneous electromagnetic wave interference；
5th, when the metallic of the present invention includes alloy conductive particle, there is splendid inoxidizability and conductibility, just
Store and carry in product, and do not interfere with the physical property of product, make product stabilization, reliability higher；
6th, lower conductive adhesive layer thickness of the invention is more than or equal to the thickness of the cover layer of be bonded print circuit board surface
Degree, and thickness difference is suitable, in addition the metal conductive particles of various shapes being evenly distributed in glue-line and when pressing to all directions
Mobility it is good, allow conducting resinl just right filling ground hole in pressing, not only lift shield effectiveness, be more conducive to it
The design and installation of his element, and avoid security risk.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of specification, below with presently preferred embodiments of the present invention and coordinate attached drawing describe in detail as after.
Brief description of the drawings
Fig. 1 is the structure diagram of the present invention；
Fig. 2 is that the present invention fits over the structure diagram after film；
Description of reference numerals：
100-multilayer Anisotropically conductive glued membrane；
101-go up conductive adhesive layer；
1011-metal conductive particles；
1012-adhesive resin；
102-thin metal layer；
103-lower conductive adhesive layer；
104-release film layer or carrier layer；
200-cover layer.
Embodiment
Illustrate the embodiment of the present invention below by way of particular specific embodiment, those skilled in the art can be by this
The revealed content of specification understands advantages of the present invention and effect easily.The present invention can also other different modes give
Implement, i.e., can be in different modification and change under the scope of revealed without departing substantially from this present invention.
Embodiment：A kind of multilayer Anisotropically conductive glued membrane 100, as shown in Figure 1, including upper conductive adhesive layer 101, thin metal layer
102 and lower conductive adhesive layer 103, the thin metal layer 102 be formed at the upper conductive adhesive layer 101 and the lower conductive adhesive layer 103
Between, the release film layer or carrier layer 104 formed below of the lower conductive adhesive layer 103；The thickness of the upper conductive adhesive layer 101
Spend for 5-20 μm, the thickness of the lower conductive adhesive layer 103 is 15-40 μm, and the thickness of the thin metal layer 102 is 50-3000nm；
The upper conductive adhesive layer 101 and the lower conductive adhesive layer 103 all include metal conductive particles 1011, the metal conductive particles
1011 be at least two in dendritic metal powder, needle-like metal powder, flaky metal powder and ball-type metal powder, described
The particle diameter of metal conductive particles 1011 is 2-22 μm.
The traditionally only conducting particles of single shape in conductive adhesive layer and lower conductive adhesive layer, scattered and when pressing flowing
All tend to same direction movement and arrangement, conductive adhesive layer can be made to tend to same direction in conduction, cause conductive adhesive layer overall
Conduction is bad, and then causes the shield effectiveness of conductive adhesive layer bad, the metal conductive particles for the various shapes that the present invention uses
When being dispersed to glue-line and it is subject to hot pressing to tend to multi-direction flowing and arrangement after producing deformation, makes metal conductive particles after pressing
Branch in conductive adhesive layer has multidirectional and polymolecularity, so that conductive adhesive layer has preferable incorgruous conduction,
Lift shielding properties.
102 thickness of thin metal layer is 50-3000nm, too thick that filling perforation can be caused bad, too thin to be unfavorable for producing, greatly
Amplitude increases production cost, and thin metal layer has splendid conductibility, can improve reliability and shielding properties.The present invention exists
In use, because thin metal layer is relatively thin, when conductive adhesive film is pressed through downstream pressure programming, wherein metal conductive particles can be by thin metal
Layer pierces through, and greatly strengthen material entirety turn-on effect, compared with current existing conductive adhesive film, can also effectively reduce conduction up and down
Metal conductive particles content in glue-line and reach identical turn-on effect.
The upper conductive adhesive layer 101 and the lower conductive adhesive layer 103 are all the thermosetting cement for including adhesive resin 1012
Layer, the ratio of the adhesive resin 1012 is 20-80% (weight ratio), and the ratio of the metal conductive particles 1011 is 30-
80% (weight ratio), the metal conductive particles and the adhesive resin ratio are 1:1-5:1 (weight ratio).The present invention's is upper
Some auxiliary materials (such as curing agent or adhesion agent etc.) and radio frequency grain may also be contained in conductive adhesive layer and lower conductive adhesive layer
Sub (such as graphite or conductive compound etc.).
Preferably, the adding proportion of the adhesive resin is 30-60%.Viscosity is too low very little for adhesive resin, unfavorable
In production of reaching the standard grade, the product viscosity produced too much is stronger, and the reduction of metal conductive particles relative amount can cause conduction not
It is good.
Preferably, the mixed proportion of metal conductive particles is 35-75% (weight ratio).Metal conductive particles content too much can
Cause powder excessive, disperse problem of non-uniform, probably turn-on effect is bad very little.
The thickness of the lower conductive adhesive layer 103 is more than or equal to the thickness of the cover layer 200 of be bonded print circuit board surface
Degree, the thickness of the lower conductive adhesive layer are 0-5 μm with the thickness difference of the cover layer 200 for the print circuit board surface being bonded.
The thickness of the lower conductive adhesive layer 103 can select thick according to the thickness for the cover layer being bonded with printed wiring board
Spend scope, it is ensured that the thickness of lower conductive adhesive layer is more than or equal to the thickness of cover layer, avoids segment difference to upper and lower conductive adhesive layer filling perforation
Impact, so that conduction is bad.As shown in Fig. 2, citing：If the thickness of cover layer 200 is 37 μm, the thickness of lower conductive adhesive layer
Degree may be selected to be 40 μm, if the thickness of cover layer is 27 μm, the thickness of lower conductive adhesive layer may be selected 27 μm, to ensure that filling perforation is excellent
It is different.
The particle diameter of the metal conductive particles 1011 is 10-18 μm；The metal conductive particles are dendritic metal powder
Three kinds of mixing at end, needle-like metal powder and flaky metal powder, wherein the dendritic metal powder and the needle-like metal
The ratio of powder is 1:5-5:The ratio of 1 (weight ratio), the needle-like metal powder and the flaky metal powder is 1:4-4:1
(weight ratio).Metal conductive particles particle diameter too it is small can cause in tellite fill via hole it is ineffective, particle diameter is too
Conference increase coating production difficulty, is unfavorable for smoothly producing.
The metal conductive particles 1011 are at least one of monometallic conducting particles and alloy conductive particle.It is preferred that
, the metal conductive particles include alloy conductive particle.
Wherein, the monometallic conducting particles can be at least one in gold particle, silver particles, copper particle and nickel particles
Kind, but not limited to this；The alloy conductive particle can be silver plated copper particles, silver-plated gold particle, silver-plated nickel particles, gold-plated copper particle
At least one of son and gold-plated nickel particle, but not limited to this.
The inoxidizability and conductibility of alloying metal conducting particles are preferable, and product is carried easy to storage, and do not interfere with
The physical property of product, stablizes product, and reliability is high.
The adhesive resin 1012 is epoxy resin, acrylic resin, amido formate system resin, silicon rubber system tree
Fat, gather in ring diformazan benzene series resin, bismaleimide amine system resin, phenol resin, melmac and polyimide resin
At least one.It is preferred that acrylic resin.
The thin metal layer 102 for peel off carrier after thin metal layer, the thin metal layer for copper foil layer, silver foil layer and
One kind in nickel metal layer.
The thickness of the release film layer or carrier layer 104 is 25-100 μm；The release film layer moulds release film for PET fluorine
Layer, PET silicate-containing oils release film layer, PET matts release film layer, PE release film layers or PE lamination ply of papers.
The release film layer can two-sided or single side it is release, with it is two-sided it is release be preferred, thickness is preferred with 25-100 μm, too thin
Or the too thick following process that is unfavorable for is punched.
The release film layer color is pure white, milky or Transparent color.It is preferential to select pure white or milky.Numerical control is certainly
When dynamicization equipment carves circuit, infrared induction, white areflexia optical issue, can be positioned with fast accurate, process operation, and people
During work handwork, white has recognition reaction, prevents that artificially leakage is torn.
A kind of production method of multilayer Anisotropically conductive glued membrane, includes the following steps：
Step 1：, will by the powder of the metal conductive particles of each shape respectively after particle diameter needed for screening screening obtains
The metal conductive particles of each shape are uniformly mixed, when mixing can take ball milling (rotational speed of ball-mill be not easy it is excessive, otherwise can be by clipped wire
The laminated layer gold of sublist is destroyed, prioritizing selection 200-300r/min) or agitating mode (rotating speed 700-2000r/min, rotating speed are higher mixed
Closing uniformity can be preferable), metallic mixture is obtained after mixing；
Step 2：Metal conductive particles and the adhesive resin are added in proportion, it is sufficiently mixed uniformly, are needed side to add
Metallic side is added to mix, mixing condition is similar with step 1；
Step 3：Specified in release film layer or carrier layer and descend conducting resinl from mixture made from shape face application step two
Layer；
Step 4：Fit in the metal of carrier metal layer is laminated lower conductive adhesive layer and precuring (precuring temperature is not
Preferably exceed the solidification temperature of adhesive resin in itself, precuring temperature selection is 80-100 DEG C of centre in the present invention, easy to follow-up
Production) remove carrier afterwards, i.e., form thin metal layer on lower conductive adhesive layer；
Step 5：Thin metal layer remove mixture made from the side application step two of carrier i.e. on conductive adhesive layer；
Step 6：Cure with reference to step 4 precuring condition, winding, get product.
Conduction analysis test is carried out to the multilayer Anisotropically conductive glued membrane after the two-sided release film of stripping：With high bridge tester into
Row conduction analyzes test, after upper conductive adhesive layer and the false patch nickel plating steel disc of lower conductive adhesive layer surface difference and printed wiring board,
Pressing cures test sample respectively and crosses conduction resistance value data before and after Reflow Soldering, will make test to the present invention and be used as embodiment,
The conduction property of common product is in kind tested as comparative example, the conduction result measured is reported in Table 1 below.
Peeling force analysis test is equally carried out to the multilayer Anisotropically conductive glued membrane after the two-sided release film of stripping：Use universal tensile
Machine carries out peeling force analysis test, in upper conductive adhesive layer and the false patch nickel plating steel disc of lower conductive adhesive layer surface difference and single-side coated copper plate
Afterwards, pressing, which cures, takes out test stripping force value, will make test to the present invention and be used as embodiment, in kind test is general produces
The peel force results measured are recorded in table 1 by the peeling force of product as comparative example.
Table 1
A kind of multilayer Anisotropically conductive glued membrane of the present invention, has good puncture effect, turn-on effect and electromagnetic wave shielding
Property effect and mechanical strength.
The foregoing is merely the embodiment of the present invention, is not intended to limit the scope of the invention, every to utilize this hair
The equivalent structure that bright specification and accompanying drawing content are made, is directly or indirectly used in other related technical areas, similarly
It is included within the scope of the present invention.
Claims (10)
- A kind of 1. multilayer Anisotropically conductive glued membrane, it is characterised in that：Including upper conductive adhesive layer, thin metal layer and lower conductive adhesive layer, institute Thin metal layer is stated to be formed between the upper conductive adhesive layer and the lower conductive adhesive layer, the lower conductive adhesive layer it is formed below Release film layer or carrier layer；The thickness of the upper conductive adhesive layer is 5-20 μm, and the thickness of the lower conductive adhesive layer is 15-40 μ M, the thickness of the thin metal layer is 50-3000nm；The upper conductive adhesive layer and the lower conductive adhesive layer all include metallic conduction Particle, the metal conductive particles are dendritic metal powder, needle-like metal powder, flaky metal powder and ball-type metal powder In at least two, the particle diameters of the metal conductive particles is 2-22 μm.
- A kind of 2. multilayer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：The upper conductive adhesive layer and described Lower conductive adhesive layer is all the thermosetting property glue-line including adhesive resin, and the ratio of the adhesive resin is 20-80% (weight Than), the ratio of the metal conductive particles is 30-80% (weight ratio), the metal conductive particles and the adhesive resin Ratio is 1:1-5:1 (weight ratio).
- A kind of 3. multilayer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：The thickness of the lower conductive adhesive layer More than or equal to the thickness of the cover layer for the print circuit board surface being bonded, the thickness of the lower conductive adhesive layer and the print being bonded The thickness difference of the cover layer of brush PCB surface is 0-5 μm.
- A kind of 4. multilayer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：The grain of the metal conductive particles Footpath is 10-18 μm.
- A kind of 5. multilayer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：The metal conductive particles are tree Three kinds of mixing of dendrite metallic powder, needle-like metal powder and flaky metal powder, wherein the dendritic metal powder and institute The ratio for stating needle-like metal powder is 1:5-5:1 (weight ratio), the ratio of the needle-like metal powder and the flaky metal powder Example is 1:4-4:1 (weight ratio).
- A kind of 6. multilayer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：The metal conductive particles include Alloy conductive particle.
- A kind of 7. multilayer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：The adhesive resin is epoxy It is resin, acrylic resin, amido formate system resin, silicon rubber system resin, poly- to ring diformazan benzene series resin, bismaleimide At least one of amine system resin, phenol resin, melmac and polyimide resin.
- A kind of 8. multilayer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：The thin metal layer carries to peel off Carrier metal layer after body, the thin metal layer are one kind in copper foil layer, silver foil layer and nickel metal layer.
- A kind of 9. multilayer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：The release film layer or carrier film The thickness of layer is 25-100 μm；The release film layer for PET fluorine mould release film layer, PET silicate-containing oils release film layer, PET matts from Type film layer, PE release film layers or PE lamination ply of papers；The release film layer is two-sided release film layer or single-sided parting film layer.
- A kind of 10. production method of multilayer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：Including as follows Step：Step 1：By the powder of the metal conductive particles of each shape respectively after particle diameter needed for screening screening obtains, by each shape The metal conductive particles of shape are uniformly mixed, and obtain metallic mixture；Step 2：Metal conductive particles and the adhesive resin are added in proportion, it is sufficiently mixed uniformly；Step 3：Specified in release film layer or carrier layer and descend conductive adhesive layer from mixture made from shape face application step two；Step 4：Fit in the metal of carrier metal layer is laminated lower conductive adhesive layer and cure, remove carrier afterwards, i.e., under Thin metal layer is formed on conductive adhesive layer；Step 5：Thin metal layer remove mixture made from the side application step two of carrier i.e. on conductive adhesive layer；Step 6：Cure, winding, get product.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610882327.5A CN107914435B (en) | 2016-10-10 | 2016-10-10 | A kind of multilayer Anisotropically conductive glue film and preparation method thereof |
| TW106130453A TWI645975B (en) | 2016-10-10 | 2017-09-06 | Multilayer anisotropic conductive film and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610882327.5A CN107914435B (en) | 2016-10-10 | 2016-10-10 | A kind of multilayer Anisotropically conductive glue film and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN107914435A true CN107914435A (en) | 2018-04-17 |
| CN107914435B CN107914435B (en) | 2019-10-29 |
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| CN201610882327.5A Active CN107914435B (en) | 2016-10-10 | 2016-10-10 | A kind of multilayer Anisotropically conductive glue film and preparation method thereof |
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| CN (1) | CN107914435B (en) |
| TW (1) | TWI645975B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180273809A1 (en) * | 2017-03-27 | 2018-09-27 | Asia Electronic Material Co., Ltd. | Multi-layered anisotropic conductive adhesive having conductive fabric and preparation thereof |
| CN110769665A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110783014A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Conductive adhesive film, circuit board and preparation method of conductive adhesive film |
| CN111409326A (en) * | 2020-04-29 | 2020-07-14 | 京东方科技集团股份有限公司 | Conductive adhesive structure and display device |
| CN114702914A (en) * | 2021-08-09 | 2022-07-05 | 常州威斯双联科技有限公司 | All-dimensional conductive adhesive film with XYZ axes and preparation method thereof |
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| TWI746005B (en) * | 2020-06-11 | 2021-11-11 | 瑋鋒科技股份有限公司 | Manufacturing method of continuous anisotropic conductive adhesive |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20180273809A1 (en) * | 2017-03-27 | 2018-09-27 | Asia Electronic Material Co., Ltd. | Multi-layered anisotropic conductive adhesive having conductive fabric and preparation thereof |
| US10822529B2 (en) * | 2017-03-27 | 2020-11-03 | Asia Electronic Material Co., Ltd. | Multi-layered anisotropic conductive adhesive having conductive fabric and preparation thereof |
| US11634612B2 (en) | 2017-03-27 | 2023-04-25 | Asia Electronic Material Co., Ltd. | Multi-layered anisotropic conductive adhesive having conductive fabric and preparation thereof |
| CN110769665A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110769665B (en) * | 2018-07-27 | 2023-12-05 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110783014A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Conductive adhesive film, circuit board and preparation method of conductive adhesive film |
| CN111409326A (en) * | 2020-04-29 | 2020-07-14 | 京东方科技集团股份有限公司 | Conductive adhesive structure and display device |
| CN114702914A (en) * | 2021-08-09 | 2022-07-05 | 常州威斯双联科技有限公司 | All-dimensional conductive adhesive film with XYZ axes and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107914435B (en) | 2019-10-29 |
| TW201813813A (en) | 2018-04-16 |
| TWI645975B (en) | 2019-01-01 |
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