CN206077830U - A kind of novel multi-layer Anisotropically conductive glued membrane - Google Patents
A kind of novel multi-layer Anisotropically conductive glued membrane Download PDFInfo
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- CN206077830U CN206077830U CN201621109822.4U CN201621109822U CN206077830U CN 206077830 U CN206077830 U CN 206077830U CN 201621109822 U CN201621109822 U CN 201621109822U CN 206077830 U CN206077830 U CN 206077830U
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Abstract
The utility model discloses a kind of novel multi-layer Anisotropically conductive glued membrane, including upper conductive adhesive layer, thin metal layer and lower conductive adhesive layer, wherein go up conductive adhesive layer and lower conductive adhesive layer all contains metal conductive particles, because the metal conductive particles are various shapes, and the thickness of thin metal layer is nanoscale, so metal conductive particles can realize incorgruous conducting because adhesive resin material is subject to hot pressing to produce deformation flowing even pierces through thin metal layer.Traditional not good defect of type conducting resinl turn-on effect in the same direction can be prevented effectively from, the product conduction can be made excellent.It is overall that there is the characteristics such as conduction is good, shielding propertiess are high, Bonding strength is good, transmission loss is few and transmission quality is high, to compare general conductive adhesive film and there is more preferable earthing effect, shield effectiveness, Bonding strength are good, and market application foreground is extensive.The folded structure of product of the present utility model is simple, with good processability.
Description
Technical field
This utility model belongs to Copper Powder Fiued Conductive Coating Used in Printed Circut Board technical field, more particularly to a kind of novel multi-layer Anisotropically conductive
Glued membrane.
Background technology
The development trend of electronics and communication product requires that circuit substrate component, towards compact and highly integrated development, is passed
Defeated signal frequency band is more and more wider, causes electromagnetic interference increasingly severe；That considers electric circuitry packages simultaneously uses safety
Property, new demand is had also been proposed to circuit unit ground connection reliability in electronic product, more universal conducting resinl used in existing market
Although product can be connected with the ground hole reserved in general printed circuit board (PCB), while also occurring because conducting resinl is by ground hole
Filling completely affects very much the design and installation of other assemblies, or filling to be discontented with coupling part when causing Reflow Soldering and there is space and make shielding
The defects such as effect on driving birds is not good, are all directly to be dispersed in conduction granule additionally, due to the conductive adhesive film product circulated in existing market
In conducting resinl, conductive adhesive layer is typically thicker, if solidification is insufficient, pressing condition is uneven, and product can be caused to conform to printing
Occur powder body skewness during circuit board, and then affect conduction property etc.；Additionally, contained metallic conduction in current conductive adhesive layer
Shape of particle mostly is spheroidal, and shape is single, and incorgruous turn-on effect is not good.
Utility model content
This utility model mainly solving the technical problems that provide a kind of novel multi-layer Anisotropically conductive glued membrane, with during pressing
The characteristic such as mobility is good, conduction is good, Bonding strength is good, electromagnetic wave shielding performance is high, transmission loss is few and transmission quality is high, phase
There is more preferable turn-on effect, Bonding strength and earthing effect than general conductive adhesive film.
To solve above-mentioned technical problem, the technical scheme that this utility model is adopted is：There is provided a kind of novel multi-layer different
To conductive adhesive film, including upper conductive adhesive layer, thin metal layer and lower conductive adhesive layer, the thin metal layer is formed at the upper conducting resinl
Between layer and the lower conductive adhesive layer, release film layer or carrier layer below conductive adhesive layer, are fitted with；
The thickness of the upper conductive adhesive layer is 5-20 μm；
The thickness of the lower conductive adhesive layer is 15-40 μm；
The thickness of the thin metal layer is 50-3000nm；
The upper conductive adhesive layer and the lower conductive adhesive layer all include adhesive resin and are embedded in the adhesive resin
Some metal conductive particles of layer, the shape of the metal conductive particles include dendroid, needle-like, lamellar and spherical and for above-mentioned
In shape at least two.
Further say, the particle diameter of the metal conductive particles is 2-22 μm.
Further say, the particle diameter of the metal conductive particles is 10-18 μm.
Further say, the thickness of the lower conductive adhesive layer is more than or equal to the coverlay of fitted print circuit board surface
Thickness, the thickness of the lower conductive adhesive layer and the thickness difference of the coverlay of the print circuit board surface fitted are 0-5 μm.
Further say, the metal conductive particles include alloy conductive particle.
Preferably, the metal conductive particles are shaped as dendroid, needle-like and lamellar.
Further say, the upper conductive adhesive layer and the lower conductive adhesive layer are all thermosetting glue-line.
Further say, the adhesive resin is epoxy resin layer, acrylic resin layer, amido formate system tree
It is lipid layer, silicone rubber resin, poly- to ring dimethylbenzene resin, BMI resin, phenol resin layer, melamine
Amine resin layer or polyimide resin layer.
Further say, the thin metal layer is the carrier metal layer after peeling off carrier；The thin metal layer be copper foil layer,
Native silver layer or nickel metal layer.
Further say, the thickness of the release film layer or carrier layer is 25-100 μm；The release film layer is PET fluorine
Modeling release film layer, PET silicate-containing oil release film layers, PET Asias light release film layer, PE release film layers or PE film ply of papers；It is described release
Film layer is two-sided release film layer or single-sided parting film layer.
The beneficial effects of the utility model are：This utility model at least has advantages below：
First, upper conductive adhesive layer of the present utility model and lower conductive adhesive layer include the metallic conduction grain of at least two shapes
Son, as metal conductive particles have various shapes, therefore can tend to multi-direction flowing when deformation is produced by hot pressing, make pressure
Distribution of the metal conductive particles in conductive adhesive layer after conjunction has multidirectional and a polymolecularity, so with soft board on ground hole
Form turning circuit so that upper conductive adhesive layer and lower conductive adhesive layer have good incorgruous conduction, and conduction property is substantially improved,
The impedance ground value of soft board can be reduced；
2nd, thin metal layer thinner thickness of the present utility model, is nanoscale, and the particle diameter of part metals conducting particles is more than
The thickness of thin metal layer, during pressing, the metal conductive particles of various shapes can pierce through thin metal layer, directly turn on, be substantially improved
Conduction property, can reduce the impedance ground value of soft board；Simultaneously because contain thin metal layer, in the case of same conducting power,
The metal conductive particles ratio added in upper conductive adhesive layer and lower conductive adhesive layer accordingly can be reduced, it is possible to decrease dust pollution, reduce
Cost.
3rd, after pressing, Jing high-temperature maturings for a period of time, the metal conductive particles of multidirectional can lift adhesive resin and reach
Electrical resistance and mechanical properties to after fully crosslinked solidification；
4th, the metal parts such as conductive adhesive layer of the present utility model and steel disc forms strengthening part and posts to printed circuit board (PCB)
When, the purpose because effectively shielding extraneous electromagnetic wave interference is capable of achieving with good ground connection stability；
5th, when metallic of the present utility model includes alloy conductive particle, with splendid non-oxidizability and conduction
Property, it is easy to product storage to carry, does not interfere with the physical property of product again, makes that product is stable, reliability is higher；
6th, lower conductive adhesive layer thickness of the present utility model is more than or equal to the coverlay of fitted printed circuit board surface
Thickness, and thickness difference is suitable, in addition the metal conductive particles of various shapes being evenly distributed in glue-line and when pressing to each side
To mobility it is good, allow conducting resinl just right filling ground hole in pressing, not only lift shield effectiveness, more conducively
The design and installation of other elements, and avoid potential safety hazard.
Described above is only the general introduction of technical solutions of the utility model, in order to better understand skill of the present utility model
Art means, and being practiced according to the content of description, with preferred embodiment of the present utility model and coordinate accompanying drawing detailed below
Describe in detail bright as after.
Description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the structural representation after this utility model fits over film；
Description of reference numerals：
100-multilamellar Anisotropically conductive glued membrane；
101-upper conductive adhesive layer；
1011-metal conductive particles；
1012-adhesive resin；
102-thin metal layer；
103-lower conductive adhesive layer；
104-release film layer or carrier layer；
200-coverlay.
Specific embodiment
Specific embodiment of the present utility model is illustrated below by way of particular specific embodiment, those skilled in the art can
Advantage of the present utility model and effect are understood easily by content disclosed in the present specification.This utility model can also other not
Same mode is practiced, i.e. under the scope of without departing substantially from disclosed in this this utility model, can be in different modifications and change.
Embodiment：A kind of novel multi-layer Anisotropically conductive glued membrane 100, as shown in figure 1, including upper conductive adhesive layer 101, thin metal
Layer 102 and lower conductive adhesive layer 103, the thin metal layer 102 are formed at the upper conductive adhesive layer 101 with the lower conductive adhesive layer
Between 103, release film layer or carrier layer 104 below the lower conductive adhesive layer, are fitted with；
The thickness of the upper conductive adhesive layer 101 is 5-20 μm；
The thickness of the lower conductive adhesive layer 103 is 15-40 μm；
The thickness of the thin metal layer 102 is 50-3000nm；
The upper conductive adhesive layer 101 and the lower conductive adhesive layer 103 all include adhesive resin 1012 and are embedded in described
Some metal conductive particles 1011 of adhesive resin, the shape of the metal conductive particles 1011 include dendroid, needle-like,
Lamellar and spherical and at least two in above-mentioned shape.Preferably, the metal conductive particles are shaped as dendroid, pin
Three kinds of shape and lamellar.
102 thickness of the thin metal layer is 50-3000nm, too thick that filling perforation can be caused not good, too thin to be unfavorable for production, greatly
Amplitude increases production cost, and thin metal layer has splendid conductivity, can improve reliability and shielding propertiess.This practicality is new
When in use, because thin metal layer is relatively thin, metal conductive particles are various shapes to type, and conductive adhesive film is in Jing downstreams pressure programming pressure
Close, during conducting, not only with piercing through effect, and have the direction of motion mixed and disorderly, can comprehensive conducting effect, greatly strengthen
Material entirety turn-on effect, compared with current existing conductive adhesive film, the metallic conduction being also effectively reduced in upper and lower conductive adhesive layer
Particle content and reach identical turn-on effect.
The particle diameter of the metal conductive particles 1011 is 2-22 μm.Preferably, the particle diameter of the metal conductive particles 1011
For 10-18 μm.The particle diameter of metal conductive particles is too little to be caused via effect on driving birds is not good, particle diameter are filled in tellite
Too conference increase coating production difficulty, is unfavorable for smoothly production.
Thickness of the thickness of the lower conductive adhesive layer 103 more than or equal to the coverlay 200 of fitted print circuit board surface
Degree, the thickness of the lower conductive adhesive layer 103 are 0-5 μm with the thickness difference of the coverlay of the print circuit board surface fitted.
The thickness of the lower conductive adhesive layer 103 can be selected according to the thickness with the coverlay 200 fitted in printed substrate
Select thickness range, it is ensured that thickness of the thickness of lower conductive adhesive layer more than or equal to coverlay, it is to avoid segment difference is filled out to upper and lower conductive adhesive layer
Permeability is impacted, so that conducting resistance is not good.As shown in Fig. 2 citing：If the thickness of coverlay 200 is 37 μm, lower conducting resinl
The thickness of layer may be selected to be 40 μm, if the thickness of coverlay is 27 μm, the thickness of lower conductive adhesive layer may be selected 27 μm, to guarantee to fill out
Permeability is excellent.
The metal conductive particles 1011 are at least one in monometallic conducting particles and alloy conductive particle.It is preferred that
, the metal conductive particles include alloy conductive particle.
Wherein, the monometallic conducting particles can be at least in gold particle, silver particles, copper particle and nickel particles
Kind, but not limited to this；The alloy conductive particle can be silver plated copper particles, silver-plated gold particle, silver-plated nickel particles, gold-plated copper particle
At least one in son and gold-plated nickel particle, but not limited to this.
The non-oxidizability and conductivity of alloy conductive particle is preferable, and product is easy to storage to carry, and does not interfere with product again
Physical property, makes that product is stable, reliability is high.
The upper conductive adhesive layer 101 and the lower conductive adhesive layer 103 are all thermosetting glue-line.
The adhesive resin 1012 is epoxy resin layer, acrylic resin layer, amido formate resin, silicon
It is rubber resin, poly- to ring dimethylbenzene resin, BMI resin, phenol resin layer, melmac
Layer or polyimide resin layer.The preferred acrylic resin layer of the present embodiment.
The thin metal layer 102 is the thin metal layer after stripping carrier；The thin metal layer is copper foil layer, native silver layer or nickel
Metal level.Preferably copper foil layer and native silver layer.
The thickness of the release film layer or carrier layer 104 is 25-100 μm；The release film layer is that PET fluorine moulds mould release membrance
Layer, PET silicate-containing oil release film layers, PET Asia light release film layer, PE release film layers or PE film ply of papers；The release film layer is double
Face release film layer or single-sided parting film layer.
Preferably, the release film layer is two-sided release film layer.
The release film layer color is pure white, milky or transparent color.Pure white or milky are selected preferentially.Numerical control is certainly
During dynamicization equipment engraving circuit, infrared induction, white areflexia optical issue can be positioned with fast accurate, process operation, and people
During work manual work, white has recognition reaction, prevents artificial leakage from tearing.
Conduction analysis test is carried out to peeling off the novel multi-layer Anisotropically conductive glued membrane after two-sided mould release membrance：Tested with high bridge
Instrument carries out conduction analysis test, in upper conductive adhesive layer and the false patch nickel plating steel disc of lower conductive adhesive layer surface difference and flexible PCB
Afterwards, test sample crosses conduction resistance data before and after Reflow Soldering respectively for pressing solidification, will test conduct made to this utility model
Embodiment, in kind tests the conduction property of common product as comparative example, the conduction result for measuring is recorded in table 1
In.
It is same to carry out peeling force analysis test to peeling off the novel multi-layer Anisotropically conductive glued membrane after two-sided mould release membrance：With omnipotent
Puller system carries out peeling force analysis test, and on upper conductive adhesive layer and lower conductive adhesive layer surface, false patch nickel plating steel disc is covered with one side respectively
After copper coin, pressing solidification is taken out test and peels off force value, made to this utility model will test as embodiment, in kind surveys
The peel force results for measuring are reported in Table 1 below by the peeling force of examination common product as comparative example.
Table 1
A kind of novel multi-layer Anisotropically conductive glued membrane of the present utility model, with good puncture effect, turn-on effect and electricity
Magnetic wave shielding effect and mechanical strength.
Embodiment of the present utility model is the foregoing is only, the scope of the claims of the present utility model is not thereby limited, it is every
The equivalent structure made using this utility model description and accompanying drawing content, or directly or indirectly it is used in other related technologies
Field, is included in scope of patent protection of the present utility model in the same manner.
Claims (10)
1. a kind of novel multi-layer Anisotropically conductive glued membrane, it is characterised in that：Including upper conductive adhesive layer, thin metal layer and lower conducting resinl
Layer, the thin metal layer are formed between the upper conductive adhesive layer and the lower conductive adhesive layer, the lower section of the lower conductive adhesive layer
It is fitted with release film layer or carrier layer；
The thickness of the upper conductive adhesive layer is 5-20 μm；
The thickness of the lower conductive adhesive layer is 15-40 μm；
The thickness of the thin metal layer is 50-3000nm；
The upper conductive adhesive layer and the lower conductive adhesive layer all include adhesive resin and are embedded in the adhesive resin
Some metal conductive particles, the shape of the metal conductive particles include dendroid, needle-like, lamellar and spherical and for above-mentioned shape
In at least two.
2. a kind of novel multi-layer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：The metal conductive particles
Particle diameter be 2-22 μm.
3. a kind of novel multi-layer Anisotropically conductive glued membrane according to claim 2, it is characterised in that：The metal conductive particles
Particle diameter be 10-18 μm.
4. a kind of novel multi-layer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：The lower conductive adhesive layer
Thickness more than or equal to fitted print circuit board surface coverlay thickness, the thickness of the lower conductive adhesive layer with fitted
Print circuit board surface coverlay thickness difference be 0-5 μm.
5. a kind of novel multi-layer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：The metal conductive particles
Including alloy conductive particle.
6. a kind of novel multi-layer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：The metal conductive particles
Be shaped as dendroid, needle-like and lamellar.
7. a kind of novel multi-layer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：The upper conductive adhesive layer and
The lower conductive adhesive layer is all thermosetting glue-line.
8. a kind of novel multi-layer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：The adhesive resin
For epoxy resin layer, acrylic resin layer, amido formate resin, silicone rubber resin, poly- to ring diformazan benzene series
Resin bed, BMI resin, phenol resin layer, melmac layer or polyimide resin layer.
9. a kind of novel multi-layer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：The thin metal layer is stripping
Carrier metal layer after carrier；The thin metal layer is copper foil layer, native silver layer or nickel metal layer.
10. a kind of novel multi-layer Anisotropically conductive glued membrane according to claim 1, it is characterised in that：The release film layer or
The thickness of carrier layer is 25-100 μm；The release film layer is PET fluorine modeling release film layer, PET silicate-containing oil release film layers, PET
Sub- light release film layer, PE release film layers or PE film ply of papers；The release film layer is two-sided release film layer or single-sided parting film layer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621109822.4U CN206077830U (en) | 2016-10-10 | 2016-10-10 | A kind of novel multi-layer Anisotropically conductive glued membrane |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201621109822.4U CN206077830U (en) | 2016-10-10 | 2016-10-10 | A kind of novel multi-layer Anisotropically conductive glued membrane |
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| CN206077830U true CN206077830U (en) | 2017-04-05 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108481839A (en) * | 2017-05-19 | 2018-09-04 | 上海浦健科技有限公司 | A kind of device for absorbing negative polarity particle |
| CN108531092A (en) * | 2018-03-13 | 2018-09-14 | 昆山翰辉电子科技有限公司 | Composite conducting glued membrane and preparation method thereof |
| CN109880540A (en) * | 2017-12-06 | 2019-06-14 | 广东中晨电子科技有限公司 | Conductive adhesive film |
| CN110769667A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
-
2016
- 2016-10-10 CN CN201621109822.4U patent/CN206077830U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108481839A (en) * | 2017-05-19 | 2018-09-04 | 上海浦健科技有限公司 | A kind of device for absorbing negative polarity particle |
| CN109880540A (en) * | 2017-12-06 | 2019-06-14 | 广东中晨电子科技有限公司 | Conductive adhesive film |
| CN108531092A (en) * | 2018-03-13 | 2018-09-14 | 昆山翰辉电子科技有限公司 | Composite conducting glued membrane and preparation method thereof |
| CN108531092B (en) * | 2018-03-13 | 2020-12-11 | 昆山翰辉电子科技有限公司 | Composite conductive adhesive film and manufacturing method thereof |
| CN110769667A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110769667B (en) * | 2018-07-27 | 2023-12-05 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
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