CN102305880A - Switching plate for preventing puncture in printed circuit board electroplate soft metal electric property test - Google Patents
Switching plate for preventing puncture in printed circuit board electroplate soft metal electric property test Download PDFInfo
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- CN102305880A CN102305880A CN201110265229A CN201110265229A CN102305880A CN 102305880 A CN102305880 A CN 102305880A CN 201110265229 A CN201110265229 A CN 201110265229A CN 201110265229 A CN201110265229 A CN 201110265229A CN 102305880 A CN102305880 A CN 102305880A
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- circuit board
- printed circuit
- substrate
- switching plate
- electric property
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a switching plate for preventing puncture in an electroplate soft metal electric property test of a printed circuit board pad surface treatment, and relates to the electronic technology field. The switching plate comprises a substrate, a vertical through hole, a blind hole, a copper plating layer and a metal melting layer. According to an electroplating soft metal plate positioning hole in an electric property test, a position of the vertical through hole is determined and punctured on the substrate. The blind hole is on the substrate. The substrate is plated with the copper plating layer, and is plated with the metal melting layer after etching. According to the invention, a polyimide soft copper foil base is used as a carrier, production of the switching plate is directly carried out on the polyimide soft copper foil base, thus material of a printed circuit board is common and production flow needs no special production device, and the switching plate for preventing puncture in a printed circuit board electroplate soft metal electric property test has the characteristics of simple production technology, low cost, no pollution and a long service life.
Description
Technical field
The present invention relates to a kind of electroplating mild alloy testing electrical property that prevents that printed circuit board (PCB) copper packing upper surface from handling and stab card extender; Be mainly used in to the soft gold of the plating surface treatment on the printed circuit board (PCB) copper packing carries out testing electrical property protection is provided; Preventing that electroplating mild alloy on the copper packing from causing when carrying out testing electrical property stabs, and belongs to electronic technology field.
Background technology
Before the present invention makes; The soft golden testing electrical property of plating surface treatment on the printed circuit board (PCB) copper packing can't use the common test tool; Need to adopt the line needle therapeutical apparatus; Line needle therapeutical apparatus price is about 2 times of common test tool price; And can not 100% avoid electroplating mild alloy to stab, exist and stab bad leakage.
Summary of the invention
The objective of the invention is to overcome above-mentioned deficiency, provide a kind of ability to be fit to the printed circuit board (PCB) flow process, prevent that the electroplating mild alloy testing electrical property of printed circuit board (PCB) copper packing upper surface processing from stabbing card extender.
Technical scheme of the present invention: prevent that the soft golden testing electrical property of electroplating printed circuit board from stabbing card extender, comprise substrate, characteristic is: also comprise copper plate and change the gold layer; Said substrate is provided with perpendicular positioning through hole and conducting blind hole, is coated with one deck copper plate on the substrate, on copper plate after the etching, crosses stratification gold layer again.
Said substrate adopts the polyimides flexible copper clad laminate.
Said blind hole is radium-shine drilling blind hole, and the pros and cons conducting.
Compared with the prior art the present invention has the following advantages:
The present invention uses polyimides flexible Copper Foil basic unit to be carrier; Directly on polyimides flexible Copper Foil basal plate, carry out the making of card extender; Use the common material of printed circuit board (PCB) and make flow process; Need not special facture equipment; And said to prevent that the soft golden testing electrical property of electroplating printed circuit board from stabbing the card extender manufacture craft simple; Cost is low, and is pollution-free, long service life.
Description of drawings
Fig. 1 is a structural front view of the present invention.
Fig. 2 is a structure vertical view of the present invention.
Fig. 3 is a dry film egative film synoptic diagram.
Fig. 4 is for covering the semi-manufacture synoptic diagram that sticks dry film.
Fig. 5 uses synoptic diagram for the present invention.
Embodiment
Following the present invention will combine the embodiment in the accompanying drawing to be further described:
Shown in Fig. 1-2, prevent that the soft golden testing electrical property of electroplating printed circuit board from stabbing card extender, comprise substrate 1, also comprise copper plate 4 and change gold layer 5; Said substrate 1 is provided with vertical through hole 2 and blind hole 3.
Prevent that the soft golden testing electrical property of electroplating printed circuit board from stabbing the preparation of card extender, step is following:
1, the conventional raw making materials polyimides flexible copper-clad base plate material that adopts printed circuit board (PCB) is as substrate 1,
2, foundation needs the electroplating mild alloy plate pilot hole of testing electrical property to confirm the position of vertical through hole 2 on said substrate 1; Carry out mechanical vertical drilling with drill point, get out the perpendicular positioning through hole 2 of requirement, the drill point aperture of use is confirmed according to actual needs; Bore radium-shine blind hole 3 according to said through hole 2 location, remove glue slag unnecessary on the boring metacoxal plate and carry out chemical copper;
3, shown in Fig. 3-4, copper plate 4 on gained substrate 1, and tow sides all press dry film 6, and make public and the development operation copper face after the front and back of substrate 1 exposes development with disposable dry film egative film 7;
4, the copper face that exposes on the substrate is etched away, make blind hole 3 conductings, remove dry film 6;
5, after etching, keep crossing gold layer 5 on the substrate 1 of radium-shine institute drilling blind hole 3 conductings; Sky is dragged in the zone of not crossing gold layer, promptly get product and prevent that the soft golden testing electrical property of electroplating printed circuit board from stabbing card extender.
As shown in Figure 5, substrate can directly not carry out testing electrical property in the electroplating mild alloy place.Directly will saidly prevent during testing electrical property that the soft golden testing electrical property of electroplating printed circuit board from stabbing card extender and covering on the electroplating mild alloy plate 10 of required test by the position of vertical through hole 2, and fix that use chaining pin 9 is directly tested and got final product with Fixed latches 8.
Claims (3)
1. prevent that the soft golden testing electrical property of electroplating printed circuit board from stabbing card extender, comprise substrate (1), it is characterized in that: also comprise copper plate (4) and change gold layer (5); Said substrate (1) is provided with vertical through hole (2) and blind hole (3), is coated with one deck copper plate (4) on the substrate (1), crosses stratification gold layer (5) on the copper plate after the said etching (4) again.
2. stab card extender according to the said soft golden testing electrical property of electroplating printed circuit board that prevents of claim 1, it is characterized in that: said substrate (1) adopts the polyimides flexible copper clad laminate.
3. stab card extender according to the said soft golden testing electrical property of electroplating printed circuit board that prevents of claim 1, it is characterized in that: said blind hole (3) is radium-shine drilling blind hole, and the pros and cons conducting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110265229A CN102305880A (en) | 2011-09-08 | 2011-09-08 | Switching plate for preventing puncture in printed circuit board electroplate soft metal electric property test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110265229A CN102305880A (en) | 2011-09-08 | 2011-09-08 | Switching plate for preventing puncture in printed circuit board electroplate soft metal electric property test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102305880A true CN102305880A (en) | 2012-01-04 |
Family
ID=45379758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110265229A Pending CN102305880A (en) | 2011-09-08 | 2011-09-08 | Switching plate for preventing puncture in printed circuit board electroplate soft metal electric property test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102305880A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102628878A (en) * | 2012-04-24 | 2012-08-08 | 景旺电子科技(龙川)有限公司 | PCB test tool and manufacture method thereof |
| CN103267908A (en) * | 2013-04-22 | 2013-08-28 | 高德（无锡）电子有限公司 | Testing technology of double-typesetting printed circuit boards |
| CN106132116A (en) * | 2016-07-05 | 2016-11-16 | 广州美维电子有限公司 | A kind of wiring board blind hole fills out process for copper |
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|---|---|---|---|---|
| CN2314383Y (en) * | 1998-02-13 | 1999-04-14 | 春升电子股份有限公司 | Switching board for testing instruments of printed board circuits |
| CN1226802A (en) * | 1998-01-14 | 1999-08-25 | 三井金属鈜业株式会社 | Method for producing multi-layer printed wiring boards having blind vias |
| CN1495870A (en) * | 1994-11-15 | 2004-05-12 | ��ķ�����عɷ�����˾ | Composite intermediate connection element of microelectronic component and its making method |
| CN2684207Y (en) * | 2004-01-08 | 2005-03-09 | 昆翌电子（深圳）有限公司 | Prick mark proof testing device |
| CN1774839A (en) * | 2003-04-11 | 2006-05-17 | 内奥科尼克斯公司 | Electrical connector and method for making |
| CN1838868A (en) * | 2005-03-25 | 2006-09-27 | 华为技术有限公司 | Printed circuit board assembly and its processing method |
| CN101533887A (en) * | 2009-04-13 | 2009-09-16 | 瀚宇博德科技（江阴）有限公司 | Method for manufacturing thermoelectric cell of bottom board of printed circuit board and structure thereof |
| CN101631434A (en) * | 2009-07-24 | 2010-01-20 | 瀚宇博德科技（江阴）有限公司 | Method of interlamination conduction of printed circuit boards |
| CN202231951U (en) * | 2011-09-08 | 2012-05-23 | 高德（无锡）电子有限公司 | Pinboard capable of preventing electroplated soft gold on PCB from being punctured in electric test |
-
2011
- 2011-09-08 CN CN201110265229A patent/CN102305880A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1495870A (en) * | 1994-11-15 | 2004-05-12 | ��ķ�����عɷ�����˾ | Composite intermediate connection element of microelectronic component and its making method |
| CN1226802A (en) * | 1998-01-14 | 1999-08-25 | 三井金属鈜业株式会社 | Method for producing multi-layer printed wiring boards having blind vias |
| CN2314383Y (en) * | 1998-02-13 | 1999-04-14 | 春升电子股份有限公司 | Switching board for testing instruments of printed board circuits |
| CN1774839A (en) * | 2003-04-11 | 2006-05-17 | 内奥科尼克斯公司 | Electrical connector and method for making |
| CN2684207Y (en) * | 2004-01-08 | 2005-03-09 | 昆翌电子（深圳）有限公司 | Prick mark proof testing device |
| CN1838868A (en) * | 2005-03-25 | 2006-09-27 | 华为技术有限公司 | Printed circuit board assembly and its processing method |
| CN101533887A (en) * | 2009-04-13 | 2009-09-16 | 瀚宇博德科技（江阴）有限公司 | Method for manufacturing thermoelectric cell of bottom board of printed circuit board and structure thereof |
| CN101631434A (en) * | 2009-07-24 | 2010-01-20 | 瀚宇博德科技（江阴）有限公司 | Method of interlamination conduction of printed circuit boards |
| CN202231951U (en) * | 2011-09-08 | 2012-05-23 | 高德（无锡）电子有限公司 | Pinboard capable of preventing electroplated soft gold on PCB from being punctured in electric test |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102628878A (en) * | 2012-04-24 | 2012-08-08 | 景旺电子科技(龙川)有限公司 | PCB test tool and manufacture method thereof |
| CN103267908A (en) * | 2013-04-22 | 2013-08-28 | 高德（无锡）电子有限公司 | Testing technology of double-typesetting printed circuit boards |
| CN106132116A (en) * | 2016-07-05 | 2016-11-16 | 广州美维电子有限公司 | A kind of wiring board blind hole fills out process for copper |
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| C12 | Rejection of a patent application after its publication | ||
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Application publication date: 20120104 |