CN104284520B - A kind of PCB surface processing method - Google Patents
A kind of PCB surface processing method Download PDFInfo
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- CN104284520B CN104284520B CN201410522453.0A CN201410522453A CN104284520B CN 104284520 B CN104284520 B CN 104284520B CN 201410522453 A CN201410522453 A CN 201410522453A CN 104284520 B CN104284520 B CN 104284520B
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Abstract
The present invention relates to board production technical field, specially a kind of PCB surface processing method, carry out heavy nickel gold processing simultaneously first on golden finger position and welding position, blue glue is then pressed on PCB, then carries out electric thick gold processing on golden finger position again.The present invention can reduce technological process, and can save in existing procedure and paste dry film or the process for applying anti-electric bronze ink, so as to avoid dry film from polluting golden face, move back that film is not clean, development is not clean, fall the appearance of phenomena such as anti-electric bronze ink and gets rid of golden problem.Pass through the content of phosphorus in liquid medicine used in the heavy nickel gold processing procedure of control, and the electroplate liquid in control electric thick gold processing, it is ensured that in 142 more than HVN, grafting still stands intact for more than 20,000 times the hardness of golden finger.The temperature of blue glue is pressed by controlling, blue glue can be made to be brought into close contact with the turmeric layer in welding position, gold on electricity is prevented on turmeric layer, ensures that turmeric layer by blue glue stain, does not keep good solderability.
Description
Technical field
The present invention relates to PCB production technical fields, more particularly to a kind of PCB surface processing method.
Background technology
PCB is the supporter of electronic component, the carrier of electrical connection, is one of important component of electronics industry, application
It is small to electronic watch, calculator in almost every kind of electronic equipment, greatly to computer, communication electronic device, military issue weapons system
Deng.In PCB production, surface treatment is last procedure in PCB manufacturing processes, for protecting PCB copper faces, to ensure
Solderability excellent PCB.Existing surface treatment method generally has hot blast spray tin, chemical nickel and gold, chemical silver, chemical tin etc., with
And golden finger is plated on golden finger position.In existing PCB production technologies, require gold-plated simultaneously on a production unit (PNL)
Finger and welding position sink nickel golden two kinds of different process of surface treatment when, it is separately to enter that the making of golden finger and welding position, which sink nickel gold,
It is capable, i.e., first make completely after golden finger and to sink nickel gold in welding position again, or first started from again after welding position sinks nickel gold
Golden finger, existing flow have following four：1st, silk-screen welding resistance (character) → make outer graphics → heavy nickel gold → with dry film is moved back
Film → electric golden finger → shaping；2nd, silk-screen welding resistance (character) → silk-screen anti-ization bronze ink → heavy nickel gold → move back film → electric golden finger →
Shaping；3rd, silk-screen welding resistance (character) → electric golden finger → silk-screen anti-ization bronze ink → heavy nickel gold → moves back film → shaping；4. silk-screen hinders
Weldering (character) → outer graphics → electric golden finger → move back film → make outer graphics → heavy nickel gold → with dry film and move back film → shaping.With
There is dry film and pollute golden face, double layer nickel gold occur and get rid of gold in upper four kinds of flows, move back film not to the utmost, development is not net, falls anti-ization bronze ink
Etc. quality problem, and the spacing between welding position and golden finger position need to can just prevent electric golden finger or heavy nickel gold more than 0.3mm
When influence to welding position or golden finger position.In addition, technological process is grown, production cost is high.
The content of the invention
During the present invention makes for existing PCB, electric golden finger and the golden two kinds of surface treatments of heavy nickel need to be completely independent progress,
So as to cause to fall dry film to pollute golden face, development be not net, and technological process is long the problems such as, there is provided one kind can improve PCB qualities and technique
The short PCB surface processing method of flow.
To achieve the above object, the present invention uses following technical scheme, a kind of PCB surface processing method, including following step
Suddenly：
S1, heavy nickel gold processing is carried out simultaneously to the golden finger position on PCB and welding position.
Preferably, during the nickel gold that sinks is handled, the Ni in heavy nickel liquid medicine2+Concentration be 4.6-5.2g/L, NaH2PO2Concentration be
21-27g/L, pH=4.1-4.5；In turmeric liquid medicine, Au concentration is 0.5-0.8g/L, Ni2+Concentration ＜ 1000ppm, Cu2+
Concentration ＜ 5ppm, pH=5.5-6.5.
Preferably, by the thickness control of heavy nickel dam at 4-6 μm, the thickness control of turmeric layer is more than or equal to 0.05 μm.
S2, blue glue is pressed on PCB, and opened a window in golden finger position, exposed golden finger position and come.
Preferably, when pressing blue glue on PCB, the temperature for pressing blue glue is 10-30 DEG C；Transfer rate is 0.8-0.9m/min,
Air pressure is 0.5-0.8MPa.
S3, electric thick gold processing is carried out to the golden finger position on PCB.
Preferably, in electric thick gold processing, Au concentration is 2.0-6g/L, Ni in electroplate liquid2+Concentration≤200ppm, Cu2+
Concentration≤20ppm, pH 4.6-4.8, temperature be 33-37 DEG C.
Preferably, by the layer gold thickness control on golden finger position more than or equal to 0.76 μm.
S4, tear blue glue on PCB.
Also include before the step S1：Solder mask is made on PCB, and is opened a window respectively in golden finger position and welding position, is made
Golden finger position and welding position, which expose, to be come.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention in golden finger position and welding position by entering simultaneously
The heavy nickel gold processing of row, then continue electric thick gold on golden finger position, technological process can be reduced, and can save and dry film is pasted in existing procedure
Or the process for applying anti-electric bronze ink, so as to avoid dry film from polluting golden face, move back that film is not clean, development is not clean, falls anti-electricity gold
The appearance of phenomena such as ink and get rid of golden problem.By controlling the content of phosphorus in liquid medicine used in heavy nickel gold processing procedure, and control
Electroplate liquid in electric thick gold processing, it is ensured that in more than 142HVN, grafting still stands intact for more than 20,000 times the hardness of golden finger.
The temperature of blue glue is pressed by controlling, blue glue can be made to be brought into close contact with the turmeric layer in welding position, prevent the turmeric layer in welding position
The upper upper gold of electricity, ensures that the turmeric layer of welding position not by blue glue stain, keeps good solderability.Existed by the inventive method
Electric golden finger and the gold processing of heavy nickel are carried out on same PCB, the spacing between golden finger position and welding position can be equal to or less than
0.3mm。
Embodiment
In order to more fully understand the technology contents of the present invention, technical scheme is made with reference to specific embodiment
It is further described and illustrates.
Embodiment 1
A kind of PCB surface processing method that the present embodiment provides, at the golden and electric two kinds of surfaces of golden finger of heavy nickel
Reason, this method specifically include following steps：
(1) according to existing PCB production technologies, before this to sheet material sawing sheet, then to every PCB production units (PNL) according to
It is secondary to carry out painting wet film, exposure, development, etch and move back film process, so as to make each inner plating.Pressing each inner plating makes to form multilayer
Plate, outer-layer circuit is then made on multilayer boards, form PCB half-finished product plates.It is specific as follows：
Sawing sheet：Core plate, core thickness 0.5mm H/H are outputed by jigsaw size 520mm*620mm.
Internal layer：Produced with vertical application machine, 8 μm of film thickness monitoring, using Full-automatic exposure machine, with 5-6 lattice exposure guide rule (21 lattice
Exposure guide rule) internal layer circuit exposure is completed, line pattern is etched after development, it is 3miL that internal layer line width, which measures,.
Internal layer AOI：The defects of short circuit, line are with breach, circuit pin hole of opening of internal layer is checked, it is defective to scrap processing, it is intact
Sunken product enters downstream.
Pressing：Brown speed carries out brown according to copper thickness HOZ bottoms copper, after brown lamination, according to plate Tg from appropriate
Lamination is pressed, and thickness is 1.47mm after pressing.
Outer layer drills：Drilling operation is carried out using borehole data.
Outer layer sinks copper：Make hole metallization, backlight tests 10 grades.
Electric plating of whole board (negative film technique)：With 10ASF current density electric plating of whole board 150min, more than hole copper thickness 25um.
Outer graphics：Using Full-automatic exposure machine, outer-layer circuit exposure is completed with 5-7 lattice exposure guide rule (21 lattice exposure guide rule),
And developed.Outer graphics include the figure of golden finger position and the figure of welding position.
Outer layer etches：Acid etching, etching speed are etched by 1OZ bottom copper, and wire width measuring is after the completion of etching
4.0miL, obtain outer-layer circuit；Outer-layer circuit includes golden finger position and welding position；Form PCB half-finished product plates.
Outer layer AOI：The defects of short circuit, line are with breach, circuit pin hole of opening of internal layer is checked, it is defective to scrap processing, it is intact
Sunken product enters downstream.
(2) according to existing solder mask manufacturing technology, solder mask is made on PCB half-finished product plates, and gold is made by windowing
Finger position and welding position expose completely to be come, and treats subsequently to be surface-treated on golden finger position and welding position.
Using white wire mark brush TOP faces solder mask, TOP faces character addition " UL " mark.
(3) according to the operation of existing heavy nickel gold, heavy nickel gold processing is carried out to golden finger position and welding position；Wherein, in nickel cylinder
Heavy nickel liquid medicine：Ni2+4.6-5.2g/L, NaH2PO221-27g/L, pH=4.1-4.5；Heavy nickel temperature is 78-84 DEG C.
Turmeric liquid medicine in golden cylinder：Au0.5-0.8g/L, Ni2+≤ 1000ppm, Cu2+≤ 5ppm, pH=5.5-6.5, sink
Golden temperature is 76-86 DEG C.
In the gold processing of heavy nickel, by controlling the time of heavy nickel gold, the thickness of heavy nickel dam and turmeric layer is controlled, makes heavy nickel dam
Thickness be 4-6 μm, thickness >=0.05 μm of turmeric layer；Measured respectively with X-Ray in golden finger position and welding position sink nickel dam and
The thickness of turmeric layer.
(4) by pressing blue glue machine that blue glue is fitted tightly on PCB, and opened a window in golden finger position, make golden finger position exposed
Out；
Press blue adhesive process parameter：Transfer rate is 0.8-0.9m/min, and temperature is 25 DEG C, air pressure 0.5-0.8MPa.
(5) electric thick gold processing is carried out to the golden finger position on PCB；Electroplate liquid in golden cylinder：Au=2-6g/L, Ni2+≤
200ppm, Cu2+≤ 20ppm, pH=4.6-4.8, temperature are 33-37 DEG C.Circuit：0.6-1.2Adm2。
In electric thick gold processing, by controlling electroplating time, the layer gold thickness on golden finger position is controlled, is made on golden finger position
Layer gold thickness >=0.76 μm.
(6) the blue glue on PCB is torn by hand, then, the rear processes such as excision forming, quality testing is carried out to PCB, it is obtained
Program communication block mask is P1.Specially：
External form：Gong external form, the +/- 0.05mm of external form tolerance.
Electrical testing：The electric property of test-based examination production board.
Inspection eventually：Check that the aesthetic appearance of production board is bad.
FQA：Outward appearance, measured hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness etc. are taken a sample test again.
Embodiment 2
The present embodiment provides a kind of PCB surface processing method, and including the golden and electric golden finger of heavy nickel, two kinds are surface-treated,
This method is essentially identical with embodiment 1, and difference is：The temperature in blue adhesive process parameter will be pressed to be changed to 30 DEG C.
Obtained program communication block mask is P2.
Comparative example 1
This comparative example provides a kind of PCB surface processing method, and including the golden and electric golden finger of heavy nickel, two kinds are surface-treated,
This method is essentially identical with embodiment 1, and difference is：In the heavy nickel gold processing of step (3), by the heavy nickel medicine in nickel cylinder
NaH in water2PO2Concentration be adjusted to 29-32g/L.
Obtained program communication block mask is P3.
In other embodiments, by pressing blue glue machine when pressing blue glue on PCB, temperature in blue adhesive process parameter is pressed also
It can be set between 10-30 DEG C.
Comparative example 2
This comparative example provides a kind of PCB surface processing method, and including the golden and electric golden finger of heavy nickel, two kinds are surface-treated,
This method is essentially identical with embodiment 1, and difference is：In the heavy nickel gold processing of step (3), by the heavy nickel medicine in nickel cylinder
NaH in water2PO2Concentration be adjusted to 18-21g/L.
Obtained program communication block mask is P4.
Comparative example 3
This comparative example provides a kind of PCB surface processing method, and including the golden and electric golden finger of heavy nickel, two kinds are surface-treated,
This method is essentially identical with embodiment 1, and difference is：The temperature in blue adhesive process parameter will be pressed to be changed to 35 DEG C.
Obtained program communication block mask is P5.
According to standard《J-STD-003B》It is required that by the way of simulation is welded, (pb-free solder technique-edge immersed solder is surveyed
Examination) solderability of welding position on test PCB obtained above；And according to engineering with golden electrodeposited coating specification《ASTM-B-488》Will
Ask, detect the golden hardness of golden finger and golden purity.Test result is as shown in the table.
The technology contents described above that the present invention is only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (7)
- A kind of 1. PCB surface processing method, it is characterised in that：Comprise the following steps：S1, heavy nickel gold processing is carried out simultaneously to the golden finger position on PCB and welding position；In the heavy nickel gold processing, in heavy nickel liquid medicine, Ni2+Concentration be 4.6-5.2g/L, NaH2PO2Concentration be 21-27g/L, PH=4.1-4.5；In turmeric liquid medicine, Au concentration is 0.5-0.8g/L, Ni2+Concentration≤1000ppm, Cu2+Concentration≤ 5ppm, pH=5.5-6.5；S2, blue glue is pressed on PCB, and opened a window in golden finger position, exposed golden finger position and come；S3, electric thick gold processing is carried out to the golden finger position on PCB；In the electric thick gold processing, Au concentration is 2.0-6g/L, Ni in electroplate liquid2+Concentration≤200ppm, Cu2+Concentration≤ 20ppm, pH 4.6-4.8.
- A kind of 2. PCB surface processing method according to claim 1, it is characterised in that：The step S2, pressed on PCB blue During glue, the temperature for pressing blue glue is 10-30 DEG C.
- A kind of 3. PCB surface processing method according to claim 2, it is characterised in that：The step S2, pressed on PCB blue During glue, transfer rate 0.8-0.9m/min, air pressure 0.5-0.8MPa.
- 4. according to a kind of any one of claim 1-3 PCB surface processing methods, it is characterised in that：Wrapped before the step S1 Include：Solder mask is made on PCB, and is opened a window respectively in golden finger position and welding position, golden finger position and welding position is exposed and.
- 5. according to a kind of claim 4 PCB surface processing method, it is characterised in that：Include after the step S3：Tear Blue glue on PCB.
- 6. according to a kind of any one of claim 1-3 PCB surface processing methods, it is characterised in that：The step S1's is heavy In nickel gold processing, the thickness control of heavy nickel dam is at 4-6 μm, and the thickness control of turmeric layer is more than or equal to 0.05 μm.
- 7. according to a kind of any one of claim 1-3 PCB surface processing methods, it is characterised in that：The electricity of the step S3 In thick gold processing, the thickness control of electric layer gold is more than or equal to 0.76 μm.
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| CN201410522453.0A CN104284520B (en) | 2014-09-29 | 2014-09-29 | A kind of PCB surface processing method |
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| CN104284520B true CN104284520B (en) | 2017-11-28 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105848423B (en) * | 2016-05-20 | 2018-11-06 | 江门崇达电路技术有限公司 | A kind of production method of the PCB with electroplating gold and chemical two kinds of surface treatments of turmeric |
| CN107241873A (en) * | 2017-07-17 | 2017-10-10 | 胜宏科技（惠州）股份有限公司 | A kind of improved golden finger gold plating method |
| CN107241874B (en) * | 2017-08-09 | 2021-07-20 | 博敏电子股份有限公司 | Manufacturing method of printed circuit board adopting inner lead gold immersion and gold plating composite process |
| CN107734876A (en) * | 2017-09-29 | 2018-02-23 | 广东兴达鸿业电子有限公司 | The method that pcb board plates golden finger |
| CN110290647A (en) * | 2019-06-24 | 2019-09-27 | 大连崇达电路有限公司 | A kind of repair method of immersion Ni/Au plating leakage plate |
| CN111093334B (en) * | 2019-12-30 | 2023-09-01 | 惠州市永隆电路有限公司 | Surface treatment method for long and short golden fingers on PCB |
| CN112235961A (en) * | 2020-10-14 | 2021-01-15 | 大连崇达电路有限公司 | Manufacturing method for improving tin coating on gold surface of blue rubber plate |
| CN114900970A (en) * | 2022-06-01 | 2022-08-12 | 深圳市深联电路有限公司 | Manufacturing method of blood gas analysis and test medical board, PCB and terminal equipment |
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