CN102843863A - High precision electric testing and positioning method - Google Patents
High precision electric testing and positioning method Download PDFInfo
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- CN102843863A CN102843863A CN2011101678719A CN201110167871A CN102843863A CN 102843863 A CN102843863 A CN 102843863A CN 2011101678719 A CN2011101678719 A CN 2011101678719A CN 201110167871 A CN201110167871 A CN 201110167871A CN 102843863 A CN102843863 A CN 102843863A
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Abstract
The invention discloses a high precision electric testing and positioning method. The method is characterized by comprising the following steps: step 1, firstly designing an electric testing and positioning hole target mark on a film before a PCB (printed circuit board) is manufactured; step 2, manufacturing the PCB circuit board; and step 3, identifying and targeting the target mark by using an X-ray machine or a CCD (charge coupled device) target drone, and representing an electric testing and positioning hole on the PCB circuit board after the targeting is accomplished. The high precision electric testing and positioning method is not only simple but also solves the problems that a bonding pad cannot be tested electrically and the flying probe test goes out caused by the line shift are solved; and with the adoption of the high precision electric testing and positioning method, the electric testing cost is reduced, the electric testing efficiency is increased, and the profit space of a PCB product is increased.
Description
Technical field
The present invention relates to a kind of high accuracy electrometric determination method for position.
Background technology
Present common PCB wiring board in order to reduce testing cost and to improve testing efficiency, can use the tailored version test machine to carry out electrical measurement when test usually.The test philosophy of this test machine is to produce measurement jig according to the design data of PCB wiring board earlier; According to the pad locations of PCB wiring board a plurality of testing needles that on tool, distribute; This pin be with the pad of PCB wiring board one to one; When promptly testing plate is fixed on the tool, that pad that whenever contacts correspondence on the PCB wiring board of tool with testing needle, test machine comes the electric property of PCB wiring board is tested through applying electric current.Existing P CB wiring board is on the PCB wiring board, to get out corresponding hole in the locate mode on the tool, and when making tool, increases pilot pin accordingly in order to fixing PCB wiring board according to the position in this hole.Make principle according to the PCB wiring board so; Also be to carry out contraposition during the circuit contraposition with the hole that gets out; With present circuit processing procedure ability, also be in the stage of aligning accuracy >=0.05mm, the power of test of present test machine is minimum testing weld pad size >=0.2mm.When the PCB wiring board pad＜0.2mm of test, often because circuit contraposition skew causes the situation of test less than pad.
Summary of the invention
In order to overcome above-mentioned defective; The invention provides a kind of high accuracy electrometric determination method for position; This high accuracy electrometric determination method for position is not only simple, and can solve the electrical measurement test that causes because of stitch seam leans out line and send out the problem of flying probe outward less than pad, and this suitable type patent can reduce the electrical measurement cost; Improve electrical measurement efficient, increase PCB product profit space.
The present invention for the technical scheme that solves its technical problem and adopt is: a kind of high accuracy electrometric determination method for position may further comprise the steps: 1. before the PCB wiring board is made, on its film, design electrical measurement location hole target earlier; 2. carrying out the PCB wiring board makes; 3. through X-ray machine or CCD target-shooting machine above-mentioned target is discerned and practiced shooting, practicing shooting demonstrates the electrical measurement location hole on the PCB wiring board after accomplishing.
As further improvement of the present invention, said electrical measurement location hole target is to design its size according to the PCB wiring board edges of boards space at its place.
As further improvement of the present invention, select the target practice of respective diameters to bore according to the diameter of pilot pin on the measurement jig during target practice and chew.
The invention has the beneficial effects as follows: this high accuracy electrometric determination method for position; Be that a kind of being utilized on the outer-layer circuit film designed target; This target can be discerned through X-ray machine or CCD target-shooting machine after the etching; Mode through practicing shooting is got the electrical measurement location hole, and this location hole and circuit relativity shift can not occur, thereby improves the precision and the power of test of electrical measurement machine.It is that the pad of 0.1mm is tested that this localization method can be realized minimum dimension; Significantly reduced because the pad test leakage situation that the circuit off normal causes; Avoid increasing after the electrical measurement process of flying probe, reduced the electrical measurement cost, and then improved PCB production efficient and profit.This high accuracy electrometric determination method for position is simple, only needs behind circuit, to increase X-ray target practice link and gets final product, and can not increase new equipment and extra producing cost, uses when being fit to very much the test of special fixture type electrical measurement machine.
Embodiment
A kind of high accuracy electrometric determination method for position, it may further comprise the steps: 1. before the PCB wiring board is made, on its film, design electrical measurement location hole target earlier; 2. carrying out the PCB wiring board makes; 3. through X-ray machine or CCD target-shooting machine above-mentioned target is discerned and practiced shooting, practicing shooting demonstrates the electrical measurement location hole on the PCB wiring board after accomplishing.
Above-mentioned steps 1. in, said electrical measurement location hole target be according to the PCB wiring board edges of boards space at its place design its size.
Above-mentioned steps 3. in, select the target practice of respective diameters to bore according to the diameter of pilot pin on the measurement jig during target practice and chew.
Claims (3)
1. a high accuracy electrometric determination method for position is characterized in that it may further comprise the steps: 1. before the PCB wiring board is made, on its film, design electrical measurement location hole target earlier; 2. carrying out the PCB wiring board makes; 3. through X-ray machine or CCD target-shooting machine above-mentioned target is discerned and practiced shooting, practicing shooting demonstrates the electrical measurement location hole on the PCB wiring board after accomplishing.
2. high accuracy electrometric determination method for position according to claim 1 is characterized in that: said step 1. in, said electrical measurement location hole target be according to the PCB wiring board edges of boards space at its place design its size.
3. high accuracy electrometric determination method for position according to claim 2 is characterized in that: said step 3. in, select the target practice of respective diameters to bore according to the diameter of pilot pin on the measurement jig during target practice and chew.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101678719A CN102843863A (en) | 2011-06-21 | 2011-06-21 | High precision electric testing and positioning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101678719A CN102843863A (en) | 2011-06-21 | 2011-06-21 | High precision electric testing and positioning method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102843863A true CN102843863A (en) | 2012-12-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101678719A Pending CN102843863A (en) | 2011-06-21 | 2011-06-21 | High precision electric testing and positioning method |
Country Status (1)
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| CN (1) | CN102843863A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103635024A (en) * | 2013-11-25 | 2014-03-12 | 东莞美维电路有限公司 | Automatic partitioning board dividing method after lamination of printed wiring board |
| CN104111047A (en) * | 2013-04-22 | 2014-10-22 | 北大方正集团有限公司 | Calibration assisting device, correction method, inspection method and verification method |
| CN105376941A (en) * | 2015-11-02 | 2016-03-02 | 深圳市五株科技股份有限公司 | Printed circuit board processing method |
| CN105430869A (en) * | 2015-11-20 | 2016-03-23 | 广州兴森快捷电路科技有限公司 | IC test board high hole site precision processing method and production method |
| CN105934099A (en) * | 2016-05-24 | 2016-09-07 | 深圳市联得自动化装备股份有限公司 | FOP double-sided binding method, FOP double-sided binding alignment method and FOP double-sided binding alignment mechanism |
| CN104023486B (en) * | 2014-06-11 | 2017-01-25 | 深圳华麟电路技术有限公司 | Soft and hard multiple-layer circuit board and method for forming electrical testing locating hole thereof |
| US9646205B2 (en) | 2015-05-26 | 2017-05-09 | HCL Technologies, Ltd. | System and a method for facilitating testing of plurality of devices using a drone |
| CN106771979A (en) * | 2016-12-30 | 2017-05-31 | 南京协辰电子科技有限公司 | A kind of pair of calibration method of probe flying probe device |
| CN107356857A (en) * | 2017-05-23 | 2017-11-17 | 惠州市金百泽电路科技有限公司 | Minimum widith is the quick determination method of 1mil PCB mini-pads functional defects |
| CN111836482A (en) * | 2020-06-19 | 2020-10-27 | 珠海市鼎协电子有限公司 | Method for improving test alignment of circuit board and circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO1999001772A1 (en) * | 1997-07-03 | 1999-01-14 | Luther & Maelzer Gmbh | Printed circuit board testing device |
| CN1337845A (en) * | 2000-08-07 | 2002-02-27 | 联星科技股份有限公司 | Printed circuit board forming and hole drilling process |
| CN101316483A (en) * | 2007-06-01 | 2008-12-03 | 欣竑科技有限公司 | Hole drilling calibration method for printed circuit board |
| CN101640978A (en) * | 2009-08-29 | 2010-02-03 | 深圳市深联电路有限公司 | Method and device for manufacturing single-side nickel-plated sheet |
-
2011
- 2011-06-21 CN CN2011101678719A patent/CN102843863A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999001772A1 (en) * | 1997-07-03 | 1999-01-14 | Luther & Maelzer Gmbh | Printed circuit board testing device |
| CN1337845A (en) * | 2000-08-07 | 2002-02-27 | 联星科技股份有限公司 | Printed circuit board forming and hole drilling process |
| CN101316483A (en) * | 2007-06-01 | 2008-12-03 | 欣竑科技有限公司 | Hole drilling calibration method for printed circuit board |
| CN101640978A (en) * | 2009-08-29 | 2010-02-03 | 深圳市深联电路有限公司 | Method and device for manufacturing single-side nickel-plated sheet |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104111047A (en) * | 2013-04-22 | 2014-10-22 | 北大方正集团有限公司 | Calibration assisting device, correction method, inspection method and verification method |
| CN104111047B (en) * | 2013-04-22 | 2017-02-08 | 北大方正集团有限公司 | Calibration assisting device, correction method, inspection method and verification method |
| CN103635024A (en) * | 2013-11-25 | 2014-03-12 | 东莞美维电路有限公司 | Automatic partitioning board dividing method after lamination of printed wiring board |
| CN104023486B (en) * | 2014-06-11 | 2017-01-25 | 深圳华麟电路技术有限公司 | Soft and hard multiple-layer circuit board and method for forming electrical testing locating hole thereof |
| US9646205B2 (en) | 2015-05-26 | 2017-05-09 | HCL Technologies, Ltd. | System and a method for facilitating testing of plurality of devices using a drone |
| CN105376941A (en) * | 2015-11-02 | 2016-03-02 | 深圳市五株科技股份有限公司 | Printed circuit board processing method |
| CN105376941B (en) * | 2015-11-02 | 2018-08-07 | 深圳市五株科技股份有限公司 | The processing method of printed circuit board |
| CN105430869A (en) * | 2015-11-20 | 2016-03-23 | 广州兴森快捷电路科技有限公司 | IC test board high hole site precision processing method and production method |
| CN105430869B (en) * | 2015-11-20 | 2018-06-22 | 广州兴森快捷电路科技有限公司 | The high hole position precision processing method of IC test boards and production method |
| CN105934099A (en) * | 2016-05-24 | 2016-09-07 | 深圳市联得自动化装备股份有限公司 | FOP double-sided binding method, FOP double-sided binding alignment method and FOP double-sided binding alignment mechanism |
| CN105934099B (en) * | 2016-05-24 | 2018-11-06 | 深圳市联得自动化装备股份有限公司 | The alignment method and its positioning mechanism of the two-sided bonding methods of FOP, the two-sided bondings of FOP |
| CN106771979A (en) * | 2016-12-30 | 2017-05-31 | 南京协辰电子科技有限公司 | A kind of pair of calibration method of probe flying probe device |
| CN107356857A (en) * | 2017-05-23 | 2017-11-17 | 惠州市金百泽电路科技有限公司 | Minimum widith is the quick determination method of 1mil PCB mini-pads functional defects |
| CN111836482A (en) * | 2020-06-19 | 2020-10-27 | 珠海市鼎协电子有限公司 | Method for improving test alignment of circuit board and circuit board |
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Application publication date: 20121226 |