CN105376941A - Printed circuit board processing method - Google Patents
Printed circuit board processing method Download PDFInfo
- Publication number
- CN105376941A CN105376941A CN201510731551.XA CN201510731551A CN105376941A CN 105376941 A CN105376941 A CN 105376941A CN 201510731551 A CN201510731551 A CN 201510731551A CN 105376941 A CN105376941 A CN 105376941A
- Authority
- CN
- China
- Prior art keywords
- pcb
- circuit board
- printed circuit
- processed
- target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a printed circuit board (PCB) processing method, comprising the steps of: exposure, development, copper facing and boring. The PCB processing method has a high secondary boring qualified rate. Compared with the prior art, the PCB processing method performs light blocking arrangement on the plated through hole film at the target hole area position of a PCB; exposes A target hole area after exposure and development steps; and uniformly plates a copper layer on the target hole area, thereby improving positioning precision in X ray machine light penetration, reducing off-position between primary boring and secondary boring, and increasing the qualified rate of the PCB.
Description
Technical field
The present invention relates to printed circuit board (PCB) processing technique field, particularly relate to a kind of processing method of printed circuit board (PCB).
Background technology
At printed circuit board (PCB) (PrintedCircuitBoard; PCB) in manufacture process; need through hole to realize the electrical connection of inner layer circuit board interlayer; through hole is drilled with by rig usually; its requirement on machining accuracy is higher, after rig is drilled to through hole, needs the through hole forming electrical connection; this through hole becomes conductive layer through electro-coppering and realizes electrical connection, more described through hole is done consent protection.But when carrying out electro-coppering to needing the through hole forming electrical connection, there is sputtering phenomenon, the target hole that need insulate is caused to be sputtered the copper of one deck became uneven, affect circuit reliability, therefore secondary drilling need be carried out to described pcb board needing the target hole of insulating, to remove sputtered layers of copper, improve the qualification rate in the pcb board course of processing.
But, because need the sputtered layers of copper thickness in the described target hole of insulation to differ, there is shade in the picture that during boring, X-ray production apparatus produces in printing opacity process again, make X-ray production apparatus cannot capture the center in target hole accurately, cause twice boring in front and back to there is displacement difference, have impact on the qualification rate of pcb board further.
Therefore, be necessary to provide a kind of processing method of new printed circuit board (PCB) to solve the problems of the technologies described above.
Summary of the invention
The object of the invention is to overcome above-mentioned technical problem, the processing method of the printed circuit board (PCB) that a kind of secondary drilling qualification rate is high is provided.
The invention provides a kind of processing method of printed circuit board (PCB), comprising:
Printed circuit board (PCB) to be processed is provided, comprises and be attached at its two-sided photosensitive dry film and the target hole after process of once holing in advance; X-ray production apparatus, the boring for described printed circuit board (PCB) to be processed is located; The plated hole film, for carrying out double window to described printed circuit board (PCB) to be processed; Electroplating device, for described printed circuit board (PCB) copper facing to be processed;
Exposure: the described photosensitive dry film described plated hole film being attached at described printed circuit board (PCB) to be processed, and to target porose area be in the light process after to described plated hole film exposure-processed;
Development: described printed circuit board (PCB) to be processed is carried out development treatment, until the described target hole of described printed circuit board (PCB) to be processed is exposed;
Copper facing: by described electroplating device to the even copper facing of described target porose area;
Boring: the described target porose area after copper coating step process is carried out to printing opacity location and carries out secondary drilling by described X-ray production apparatus.
Preferred described target porose area is centered by described target hole, and the length of side is the rectangular area of 3 ~ 9mm.
Preferably, described dry film composition comprises: binding agent, monomer, initiator and photosensitive resin.
Compared with correlation technique, the processing method of printed circuit board (PCB) provided by the invention, to be in the light setting by the plated hole film of the target porose area position to printed circuit board (PCB), after overexposure and development step, make described target porose area exposed, more evenly layers of copper is plated to described target porose area, improve positioning precision during X-ray production apparatus printing opacity, decrease once boring and the off normal of secondary drilling, improve the qualification rate of printed circuit board (PCB).
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the processing method of printed circuit board (PCB) of the present invention;
Fig. 2 is the structural representation of printed circuit board (PCB) in Fig. 1.
Embodiment
Below in conjunction with drawings and embodiments, the invention will be further described.
Please refer to Fig. 1 and Fig. 2, wherein, Fig. 1 is the schematic flow sheet of the processing method of printed circuit board (PCB) of the present invention; Fig. 2 is the structural representation of printed circuit board (PCB) in Fig. 1.The invention provides a kind of processing method of printed circuit board (PCB), comprising:
Step S1:
Printed circuit board (PCB) 1 to be processed is provided, comprises and be attached at its two-sided photosensitive dry film 13 and the target hole 11 after process of once holing in advance;
X-ray production apparatus, the boring for described printed circuit board (PCB) 1 to be processed is located;
The plated hole film, for carrying out double window to described printed circuit board (PCB) 1 to be processed;
Electroplating device, for the copper facing of described printed circuit board (PCB) 1 to be processed;
Step S2: exposure
The described plated hole film is attached at the described photosensitive dry film 13 of described printed circuit board (PCB) to be processed 1, and to target porose area 12 be in the light process after to described plated hole film exposure-processed; Described step of exposure S2 is penetrated down by the illumination of special spectrum; the be not in the light described dry film 13 in region of the described film darkens and then hardens; tightly protect the Copper Foil on described printed circuit board (PCB) to be processed 1 surface, described Copper Foil is imprinted on described printed circuit board (PCB) to be processed 1.Described dry film 13 is optical polymerism dry film.In the present embodiment, the light of special spectrum is ultraviolet.
Step S3: development
Described printed circuit board (PCB) 1 to be processed is carried out development treatment, until the described target hole 11 of described printed circuit board (PCB) to be processed 1 is exposed; Described development step S3 washes away described unhardened described dry film 13 by sodium carbonate liquor; the described Copper Foil not having described dry film 13 to protect is come out; utilize copper etching liquor to etch described printed circuit board (PCB) 1 afterwards, the described Copper Foil corrosion protected not having described dry film 13 is clean.Described Copper Foil under described dry film 13 protection just defines the circuit diagram on described printed circuit board (PCB) 1.
Step S4: copper facing
By described electroplating device for the evenly copper facing of described target porose area 12;
Step S5: boring
By described X-ray production apparatus, the described target porose area 12 after copper coating step process is carried out to printing opacity location and carries out secondary drilling.
Described target porose area 12 is in the light because achieved by the described film in described step of exposure S2, in described development step S3 by described copper etching liquor by described Copper Foil corrosion totally, thus after described copper coating step S4 completes, described target porose area 12 meets that uniform copper is thick and X-ray production apparatus printing opacity picture is clear, realizes precisely capturing target position center.
Copper facing, after first time gets out, is carried out to described target hole 11, the electrical connection realized between multilayer circuit board by the conductive layer formed in described target hole 11 in the target hole 11 of described printed circuit board (PCB) to be processed 1.The region of being in the light of mating with described target porose area 12 that described target porose area 12 and the described film are arranged is centered by described target hole 11, and the length of side is the rectangular area of 3 ~ 9mm.
Compared with correlation technique, the processing method of printed circuit board (PCB) provided by the invention, to be in the light setting by the plated hole film of the target porose area position to printed circuit board (PCB), after overexposure and development step, make described target porose area exposed, more evenly layers of copper is plated to described target porose area, improve positioning precision during X-ray production apparatus printing opacity, decrease once boring and the off normal of secondary drilling, improve the qualification rate of printed circuit board (PCB).
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (3)
1. a processing method for printed circuit board (PCB), is characterized in that, comprising:
Printed circuit board (PCB) to be processed, X-ray production apparatus, the plated hole film and electroplating device are provided, wherein said printed circuit board (PCB) to be processed comprise be attached in advance its two-sided photosensitive dry film and through once hole process after target hole, described X-ray production apparatus is located for the boring of described printed circuit board (PCB) to be processed, the described plated hole film is used for carrying out double window to described printed circuit board (PCB) to be processed, and described electroplating device is used for described printed circuit board (PCB) copper facing to be processed;
Exposure: the described plated hole film is attached on the described photosensitive dry film of described printed circuit board (PCB) to be processed, and to target porose area be in the light process after to described plated hole film exposure-processed;
Development: described printed circuit board (PCB) to be processed is carried out development treatment, until the described target hole of described printed circuit board (PCB) to be processed is exposed;
Copper facing: by described electroplating device to the even copper facing of described target porose area;
Boring: the described target porose area after copper coating step process is carried out to printing opacity location and carries out secondary drilling by described X-ray production apparatus.
2. the processing method of printed circuit board (PCB) according to claim 1, is characterized in that: described target porose area be centered by described target hole, the length of side is the rectangular area of 3 ~ 9mm.
3. the processing method of printed circuit board (PCB) according to claim 1, is characterized in that: described dry film composition comprises binding agent, monomer, initiator and photosensitive resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510731551.XA CN105376941B (en) | 2015-11-02 | 2015-11-02 | The processing method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510731551.XA CN105376941B (en) | 2015-11-02 | 2015-11-02 | The processing method of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105376941A true CN105376941A (en) | 2016-03-02 |
| CN105376941B CN105376941B (en) | 2018-08-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510731551.XA Active CN105376941B (en) | 2015-11-02 | 2015-11-02 | The processing method of printed circuit board |
Country Status (1)
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| CN (1) | CN105376941B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106170181A (en) * | 2016-08-31 | 2016-11-30 | 博敏电子股份有限公司 | Hole docking calculation is folded in a kind of wiring board production high-precision laser hole |
| CN110831331A (en) * | 2019-10-09 | 2020-02-21 | 广州兴森快捷电路科技有限公司 | Optimization method of automatic hole plating process |
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| CN103442530A (en) * | 2013-09-18 | 2013-12-11 | 胜华电子（惠阳）有限公司 | Manufacturing method for PCB unilateral annular ring |
| CN103813657A (en) * | 2012-10-05 | 2014-05-21 | Si弗莱克斯有限公司 | The printed circuit board manufacturing method |
| CN104333979A (en) * | 2014-10-21 | 2015-02-04 | 深圳崇达多层线路板有限公司 | Method of carrying out secondary hole drilling in multi-layer board |
| CN104812157A (en) * | 2014-01-23 | 2015-07-29 | 深圳崇达多层线路板有限公司 | Power supply printed circuit board and processing method thereof |
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2015
- 2015-11-02 CN CN201510731551.XA patent/CN105376941B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6211485B1 (en) * | 1996-06-05 | 2001-04-03 | Larry W. Burgess | Blind via laser drilling system |
| WO2006089255A2 (en) * | 2005-02-17 | 2006-08-24 | Sanmina-Sci Corporation | High aspect ratio plated through holes in a printed circuit board |
| CN1761378A (en) * | 2005-09-20 | 2006-04-19 | 沪士电子股份有限公司 | Method of drilling a hole through Co2 laser directly |
| CN101472405A (en) * | 2007-12-26 | 2009-07-01 | 富葵精密组件(深圳)有限公司 | Multi-layer circuit board and manufacturing method thereof |
| CN101959373A (en) * | 2009-07-17 | 2011-01-26 | 北大方正集团有限公司 | Method for improving blind hole alignment of printed circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106170181A (en) * | 2016-08-31 | 2016-11-30 | 博敏电子股份有限公司 | Hole docking calculation is folded in a kind of wiring board production high-precision laser hole |
| CN106170181B (en) * | 2016-08-31 | 2018-12-21 | 博敏电子股份有限公司 | A kind of wiring board production folded hole interconnection method in high-precision laser hole |
| CN110831331A (en) * | 2019-10-09 | 2020-02-21 | 广州兴森快捷电路科技有限公司 | Optimization method of automatic hole plating process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105376941B (en) | 2018-08-07 |
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