CN105376941B - The processing method of printed circuit board - Google Patents
The processing method of printed circuit board Download PDFInfo
- Publication number
- CN105376941B CN105376941B CN201510731551.XA CN201510731551A CN105376941B CN 105376941 B CN105376941 B CN 105376941B CN 201510731551 A CN201510731551 A CN 201510731551A CN 105376941 B CN105376941 B CN 105376941B
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- China
- Prior art keywords
- circuit board
- printed circuit
- target
- processed
- hole
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention discloses a kind of processing method of printed circuit board, includes the following steps：Exposure, development, copper facing and drilling, provide a kind of processing method for the printed circuit board that secondary drilling qualification rate is high.Compared with the relevant technologies, the processing method of printed circuit board provided by the invention, setting of being in the light is carried out by the plated hole film of the target hole zone position to printed circuit board, after exposed and developed step, keep the target porose area exposed, then layers of copper is uniformly plated to the target porose area, improves positioning accuracy when X-ray production apparatus light transmission, the deviation for reducing primary drilling and secondary drilling, improves the qualification rate of printed circuit board.
Description
Technical field
The present invention relates to printed circuit board processing technique field more particularly to a kind of processing methods of printed circuit board.
Background technology
In the manufacturing process of printed circuit board (Printed Circuit Board, PCB), it is interior to realize to need through-hole
The electrical connection of layer circuit board interlayer, through-hole are usually drilled with by drilling machine, and requirement on machining accuracy is higher, after drilling machine is drilled to through-hole,
The through-hole of electrical connection is needed to form, the electroplated copper of the through-hole realizes electrical connection at conductive layer, then the through-hole is consent guarantor
Shield.But when the through-hole to needing to form electrical connection carries out electro-coppering, there are sputtering phenomenon, the target hole that need to be insulated is caused to be sputtered
The copper of one thickness unevenness influences circuit reliability, therefore need to carry out secondary brill to the target hole for needing to insulate on the pcb board
Hole, the layers of copper being sputtered to remove improve the qualification rate in pcb board process.
However, since it is desired that the layers of copper thickness that the target hole of insulation is sputtered differs, X-ray production apparatus exists when drilling again
There are shades for the picture generated during light transmission so that X-ray production apparatus can not accurately capture the center in target hole, lead to front and back two
There are displacement differences for secondary drilling, further affect the qualification rate of pcb board.
Therefore, it is necessary to provide a kind of processing method solution above-mentioned technical problem of new printed circuit board.
Invention content
The purpose of the present invention is overcoming above-mentioned technical problem, a kind of printed circuit board that secondary drilling qualification rate is high is provided
Processing method.
The present invention provides a kind of processing methods of printed circuit board, including：
Printed circuit board to be processed is provided, including is attached at its two-sided photosensitive dry film in advance and is handled by primary drilling
Target hole afterwards；X-ray production apparatus is used for the boring positioning of the printed circuit board to be processed；The plated hole film, for described to be added
Work printed circuit board carries out double window；Electroplating device, for the printed circuit board copper facing to be processed；
Exposure：The plated hole film is attached to the photosensitive dry film of the printed circuit board to be processed, and to target
Porose area be in the light after processing to the plated hole film exposure-processed；
Development：The printed circuit board to be processed is subjected to development treatment, until the institute of the printed circuit board to be processed
It is exposed to state target hole；
Copper facing：By the electroplating device to the uniform copper facing of target porose area；
Drilling：By the X-ray production apparatus, to copper coating step, treated that the target porose area carries out light transmission positioning and carries out
Secondary drilling.
The preferred target porose area is centered on the target hole, and the length of side is the square area of 3~9mm.
Preferably, the dry film ingredient includes：Binder, monomer, initiator and photosensitive resin.
Compared with the relevant technologies, the processing method of printed circuit board provided by the invention passes through the target to printed circuit board
The plated hole film of mark hole zone position carries out setting of being in the light, and after exposed and developed step, makes the target porose area exposed, then
Layers of copper is uniformly plated to the target porose area, improves positioning accuracy when X-ray production apparatus light transmission, reduces primary drilling and secondary brill
The deviation in hole improves the qualification rate of printed circuit board.
Description of the drawings
Fig. 1 is the flow diagram of the processing method of printed circuit board of the present invention；
Fig. 2 is the structural schematic diagram of printed circuit board in Fig. 1.
Specific implementation mode
Below in conjunction with drawings and embodiments, the invention will be further described.
Please refer to Fig. 1 and Fig. 2, wherein Fig. 1 is the flow diagram of the processing method of printed circuit board of the present invention；
Fig. 2 is the structural schematic diagram of printed circuit board in Fig. 1.The present invention provides a kind of processing method of printed circuit board, including：
Step S1：
Printed circuit board 1 to be processed is provided, including is attached at its two-sided photosensitive dry film 13 in advance and drills by primary
Treated target hole 11；
X-ray production apparatus is used for the boring positioning of the printed circuit board 1 to be processed；
The plated hole film, for carrying out double window to the printed circuit board 1 to be processed；
Electroplating device, for 1 copper facing of printed circuit board to be processed；
Step S2：Exposure
The plated hole film is attached to the photosensitive dry film 13 of the printed circuit board to be processed 1, and to target hole
Area 12 be in the light after processing to the plated hole film exposure-processed；The step of exposure S2 is irradiated by the light of special spectrum
Under, then the dry film 13 of the non-light blocking region of the film, which darkens, to harden, tightly protect the printing electricity to be processed
The copper foil is imprinted on the printed circuit board to be processed 1 by the copper foil on 1 surface of road plate.The dry film 13 is dry for optical polymerism
Film.In the present embodiment, the light of special spectrum is ultraviolet light.
Step S3：Development
The printed circuit board 1 to be processed is subjected to development treatment, until the target of the printed circuit board 1 to be processed
It is exposed to mark hole 11；The development step S3 washes away the unhardened dry film 13 by sodium carbonate liquor, without described
The copper foil that dry film 13 is protected is exposed, and is etched later to the printed circuit board 1 using copper etching liquor, will not have institute
The copper foil corrosion for stating the protection of dry film 13 is clean.The copper foil under the dry film 13 is protected is formed the printed circuit
Circuit diagram on plate 1.
Step S4：Copper facing
It is directed to 12 uniform copper facing of the target porose area by the electroplating device；
Step S5：Drilling
By the X-ray production apparatus, to copper coating step, treated that the target porose area 12 carries out light transmission positioning and carries out secondary
Drilling.
The target porose area 12 is in the light because being realized by the film in the step of exposure S2, in the development
The copper foil is corroded totally by the copper etching liquor in step S3, thus after the completion of the copper coating step S4, the target hole
Area 12 meets uniform copper thickness and X-ray production apparatus light transmission picture is clear, realizes precisely crawl target position center.
What the target porose area 12 and the film were arranged is with institute with 12 matched light blocking region of the target porose area
Centered on stating target hole 11, the length of side is the square area of 3~9mm.
Compared with the relevant technologies, the processing method of printed circuit board provided by the invention passes through the target to printed circuit board
The plated hole film of mark hole zone position carries out setting of being in the light, and after exposed and developed step, makes the target porose area exposed, then
Layers of copper is uniformly plated to the target porose area, improves positioning accuracy when X-ray production apparatus light transmission, reduces primary drilling and secondary brill
The deviation in hole improves the qualification rate of printed circuit board.
Example the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (3)
1. a kind of processing method of printed circuit board, which is characterized in that including：
Printed circuit board, X-ray production apparatus, the plated hole film and electroplating device to be processed are provided, wherein the printed circuit board to be processed
Including being attached at its two-sided photosensitive dry film in advance and by primary drilling treated target hole, the X-ray production apparatus is used for institute
The boring positioning of printed circuit board to be processed is stated, the plated hole film is used to carry out double open to the printed circuit board to be processed
Window, the electroplating device are used for the printed circuit board copper facing to be processed；
Exposure：The plated hole film is attached on the photosensitive dry film of the printed circuit board to be processed, and to target hole
Area be in the light after processing to the plated hole film exposure-processed；
Development：The printed circuit board to be processed is subjected to development treatment, until the target of the printed circuit board to be processed
It is exposed to mark hole；
Copper facing：By the electroplating device to the uniform copper facing of target porose area；
Drilling：By the X-ray production apparatus, to copper coating step, treated that the target porose area carries out light transmission positioning and carries out secondary
Drilling.
2. the processing method of printed circuit board according to claim 1, it is characterised in that：The target porose area is with described
Centered on target hole, the length of side be 3~9mm square area.
3. the processing method of printed circuit board according to claim 1, it is characterised in that：The dry film ingredient includes bonding
Agent, monomer, initiator and photosensitive resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510731551.XA CN105376941B (en) | 2015-11-02 | 2015-11-02 | The processing method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510731551.XA CN105376941B (en) | 2015-11-02 | 2015-11-02 | The processing method of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105376941A CN105376941A (en) | 2016-03-02 |
| CN105376941B true CN105376941B (en) | 2018-08-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510731551.XA Active CN105376941B (en) | 2015-11-02 | 2015-11-02 | The processing method of printed circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN105376941B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106170181B (en) * | 2016-08-31 | 2018-12-21 | 博敏电子股份有限公司 | A kind of wiring board production folded hole interconnection method in high-precision laser hole |
| CN110831331B (en) * | 2019-10-09 | 2021-08-24 | 广州兴森快捷电路科技有限公司 | Optimization method of automatic hole plating process |
| CN114429935B (en) * | 2020-10-29 | 2024-10-25 | 矽磐微电子(重庆)有限公司 | Manufacturing method of metal interconnection structure |
| CN114423164A (en) * | 2022-01-29 | 2022-04-29 | 沪士电子股份有限公司 | PCB capable of preventing electronic migration failure and manufacturing method thereof |
| CN117979561B (en) * | 2024-03-29 | 2024-07-23 | 淄博芯材集成电路有限责任公司 | Printed circuit board manufacturing method capable of improving exposure target reading rate |
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| WO2006089255A2 (en) * | 2005-02-17 | 2006-08-24 | Sanmina-Sci Corporation | High aspect ratio plated through holes in a printed circuit board |
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| TW201339570A (en) * | 2012-03-30 | 2013-10-01 | Chime Ball Technology Co Ltd | System and method for determining assembly errors of printed circuit board substrate |
| CN103442530A (en) * | 2013-09-18 | 2013-12-11 | 胜华电子（惠阳）有限公司 | Manufacturing method for PCB unilateral annular ring |
| CN103813657A (en) * | 2012-10-05 | 2014-05-21 | Si弗莱克斯有限公司 | The printed circuit board manufacturing method |
| CN104333979A (en) * | 2014-10-21 | 2015-02-04 | 深圳崇达多层线路板有限公司 | Method of carrying out secondary hole drilling in multi-layer board |
| CN104812157A (en) * | 2014-01-23 | 2015-07-29 | 深圳崇达多层线路板有限公司 | Power supply printed circuit board and processing method thereof |
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2015
- 2015-11-02 CN CN201510731551.XA patent/CN105376941B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6211485B1 (en) * | 1996-06-05 | 2001-04-03 | Larry W. Burgess | Blind via laser drilling system |
| WO2006089255A2 (en) * | 2005-02-17 | 2006-08-24 | Sanmina-Sci Corporation | High aspect ratio plated through holes in a printed circuit board |
| CN1761378A (en) * | 2005-09-20 | 2006-04-19 | 沪士电子股份有限公司 | Method of drilling a hole through Co2 laser directly |
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| Publication number | Publication date |
|---|---|
| CN105376941A (en) | 2016-03-02 |
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