CN102438413A - Second-order ladder groove bottom graphical printed board and processing method thereof - Google Patents

Second-order ladder groove bottom graphical printed board and processing method thereof Download PDF

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Publication number
CN102438413A
CN102438413A CN201110314227XA CN201110314227A CN102438413A CN 102438413 A CN102438413 A CN 102438413A CN 201110314227X A CN201110314227X A CN 201110314227XA CN 201110314227 A CN201110314227 A CN 201110314227A CN 102438413 A CN102438413 A CN 102438413A
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China
Prior art keywords
daughter board
board
motherboard
trough
order
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CN201110314227XA
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Chinese (zh)
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CN102438413B (en
Inventor
杨泽华
任代学
关志峰
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广州杰赛科技股份有限公司
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Priority to CN201110314227.XA priority Critical patent/CN102438413B/en
Publication of CN102438413A publication Critical patent/CN102438413A/en
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Publication of CN102438413B publication Critical patent/CN102438413B/en

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Abstract

The invention relates to the printed circuit board technology field, especially relating to a processing method of a second-order ladder groove bottom graphical printed board. The method comprises the following steps: carrying out a pretreatment on a first daughter board which reserves a plug-in hole, a second daughter board provided with a circuit graph and a third daughter board provided with a circuit graph; pressing the first daughter board and the second daughter board to obtain a first motherboard; carrying out distressing, hole drilling, copper deposition, internal layer figure transfer, and etching resistance metal protective layer plating treatments on the first motherboard to obtain a second motherboard; pressing the third daughter board and the second motherboard to obtain a third motherboard; carrying out distressing, hole drilling, copper deposition, external layer figure transfer treatments on the third motherboard to obtain a finished second-order ladder groove bottom graphical printed board. According to the second-order ladder groove bottom graphical printed board prepared by the method, each ladder can be subjected to wiring and plug-in installation, and a usage scope of a plate is expanded. The invention also relates to the second-order ladder groove bottom graphical printed board.

Description

Graphical printed board in a kind of second order step trough bottom and processing method thereof

Technical field

The present invention relates to the printed circuit board technology field, relate to graphical printed board in a kind of second order step trough bottom and processing method thereof especially.

Background technology

At present; Prior art is carried out the graphical printed board processing in step trough bottom; General adopt printing ink that the bottom land through hole is filled up or make, attacked this regional line pattern by liquid medicine entering bottom land graph area in copper, plating, the etching process sink through through hole to avoid motherboard through the mode that special adhesive tape single face is sealed the through hole of step trough bottom.

But; The processing method of the graphical printed board in this step trough bottom is not really lived printed board step trough bottom figure route protection; If all filling up method with the bottom land through hole, employing make the graphical circuit in step trough bottom that the plug-in unit device can't be installed; And can only the paster device be installed at bottom land, the scope of application of plate is restricted.If the through hole mode that adopts special adhesive tape single face to seal the step trough bottom is produced; Because ladder bottom metalization hole and figure really are not protected; When doing for the second time ladder, can cause and to produce the printed board of second order ladder because etching liquid medicine infilter second ladder bottom metalization hole internal corrosion figure and plated-through hole; And the through hole mode that adopts special adhesive tape single face to seal step trough bottom produces adhesive tape and in heavy copper process, comes off easily, and liquid medicine infilters that figure zonal corrosion figure circuit causes printed board to be scrapped bottom the step trough; The position of taping can only be carried out figure in advance, if adopt existing method to make the graphical printed board in second order step trough bottom, prior art can't be made the line pattern of adhesive tape protective position.

Summary of the invention

The invention provides the graphical printed board in a kind of second order step trough bottom, through protective layer being set not under fire, make each ladder can connect up and install plug-in unit, thereby expanded the scope of application of plate with the protection circuit figure at the circuit patterned surface.

The present invention also provides the processing method of the graphical printed board in a kind of second order step trough bottom, and each ladder of the graphical printed board in second order step trough bottom of its processing can connect up and install plug-in unit, has expanded the scope of application of plate.

For solving the problems of the technologies described above, the technical scheme that the present invention adopts is:

The processing method of the graphical printed board in a kind of second order step trough bottom is characterized in that, may further comprise the steps:

(1) preliminary treatment be reserved with insert hole first daughter board, be provided with line pattern second daughter board, be provided with the 3rd daughter board of line pattern;

(2) said second daughter board is pressed together on first daughter board, obtains first motherboard;

(3) said first motherboard is handled through destressing, boring, heavy copper, internal layer figure transfer, the anti-etching coat of metal of plating, obtained second motherboard;

(4) said the 3rd daughter board is pressed together on second motherboard, obtains the 3rd motherboard;

(5) said the 3rd motherboard is shifted through destressing, boring, heavy copper, outer graphics, obtain the graphical printed board in finished product second order step trough bottom.

Electroless copper is commonly called as heavy copper, is a kind of autocatalysis redox reaction; Can on non-conductive matrix, deposit, the effect of electroless copper is to realize hole metallization, thereby makes double sided board, multi-layer sheet realize the interconnection between layer and the layer; Develop rapidly along with electronics industry; Tired more high more to the manufacturing requirement of wiring board, the level of wiring board is more and more, and the hole count of same block of plate is more and more; The aperture is more and more littler, and the metallization quality in these holes directly has influence on electric Performance And Reliability.

The present invention handles said first motherboard through destressing, boring, heavy copper, internal layer figure transfer, the anti-etching coat of metal of plating, be provided with anti-etching coat of metal at the circuit patterned surface, and protection figure circuit does not receive etching.This anti-etching coat of metal can sink copper, electric plating of whole board on the surface, and through desmearing, little erosion, electroplate liquid medicine, etching liquid medicine, take off film liquid medicine, brown liquid medicine corrosion and discoloration problem can not occur after soaking.

Because the rotating speed of boring procedure bit is very high, can reach 16-18 ten thousand rpm, and the expoxy glass base material is a non-conductor; Can produce high temperature at short notice during boring, high temperature can stay many gum residues on hole wall, bores dirty thereby form the thin epoxy resin of one deck; Because it is not firm that this resin bores dirty adhesion with hole wall, when directly sinking copper, will influence the adhesion of chemical copper and hole wall; Multi-layer sheet particularly; Can influence the conducting of chemical copper layer and internal layer copper, and desmearing is removed these residues exactly, improves hole wall structure.

Alternatively, preliminary treatment is reserved with first daughter board, second daughter board, the 3rd daughter board of insert hole, comprises following operation: first daughter board is carried out interior photoimaging, the detection of internal layer automated optical successively, plates anti-etching coat of metal, punching; Second daughter board is carried out internal layer figure transfer, punching, the detection of internal layer automated optical, hole milling successively; The 3rd daughter board is carried out internal layer figure transfer, punching, the detection of internal layer automated optical, hole milling successively.

Alternatively, first motherboard is obtained second motherboard through handling, comprise following operation successively: destressing, boring, heavy copper, electric plating of whole board, interior photoimaging, internal layer figure transfer, internal layer automated optical detect, plate anti-etching coat of metal, punching.

Alternatively; The 3rd motherboard obtained the graphical printed board in finished product second order step trough bottom through handling, comprise following operation successively: destressing, boring, heavy copper, outer photoimaging, outer graphics transfers, outer automated optical detection, surface treatment, to choose lead, the non-heavy copper of brill hole, mill profile.Heavy copper hole is PTH, and hole wall has copper, generally is electric hole and component hole; Non-heavy copper hole is NPTH, and hole wall does not have copper, generally is location hole and gong silk hole, available dry film sealing of hole or micelle plug or plating back secondary drilling before plating.

As improvement, said first daughter board, second daughter board form first groove during through the cured sheets pressing, in said first groove, place silicagel pad, and after pressing, take out, and obtain first motherboard; Said the 3rd daughter board, second motherboard form second groove during through the cured sheets pressing, in said second groove, place silicagel pad, and after pressing, take out, and obtain the 3rd motherboard.Silicagel pad has certain pliability, good insulating properties, compressibility, the natural viscosity in surface, can blind, accomplish the heat transmission of heating position and radiating part interdigit, and also play effects such as insulation, damping, sealing simultaneously.This programme all is provided with silicagel pad in said first groove, second groove, the further perfect pressing working procedure of substrate.

Preferably, in said first groove, second groove, pad is set all.Pad can be selected the FR-4 pad for use, guarantees that pad pasting is smooth, occurs ill-exposed when preventing figure transfer.

Do further to improve, be provided with lead between said line pattern and the insert hole, the plating folder point conducting of said lead and daughter board edges of boards.Through between line pattern and insert hole, lead being set, guarantee the plating folder point conducting of line pattern, insert hole and daughter board edges of boards, help the work of graphical printed board.

The graphical printed board in a kind of second order step trough bottom; Comprise that pressing and second order step trough bottom is patterned into the daughter board set that is provided with insert hole of type; Said daughter board set comprises through the first bonding successively daughter board of prepreg, second daughter board and the 3rd daughter board; Be provided with line pattern between first daughter board and second daughter board, second daughter board and the 3rd daughter board, it is characterized in that: said line pattern surface is provided with anti-etching coat of metal.

Said line pattern surface is provided with anti-etching coat of metal, and protection figure circuit does not receive etching.This anti-etching coat of metal can sink copper, electric plating of whole board on the surface, and through desmearing, little erosion, electroplate liquid medicine, etching liquid medicine, take off film liquid medicine, brown liquid medicine corrosion and discoloration problem can not occur after soaking.

Compared with prior art, the invention has the beneficial effects as follows:

The graphical printed board in second order step trough of the present invention bottom is provided with protective layer at the circuit patterned surface; Complete preservation line pattern and hole do not receive desmearing, little erosion, electroplate liquid medicine, etching liquid medicine; Take off the attack of film liquid medicine, brown liquid medicine etc.; Make each ladder of second order ladder can connect up and install plug-in unit, thereby expanded the scope of application of plate.

The processing method of the graphical printed board in second order step trough of the present invention bottom, each ladder of the graphical printed board in second order step trough bottom of its processing can connect up and install plug-in unit, has expanded the scope of application of plate.

Description of drawings

Fig. 1 is phase I printed board sketch map in the processing method of the graphical printed board in second order step trough of the present invention bottom;

Fig. 2 is second stage printed board sketch map in the processing method of the graphical printed board in second order step trough of the present invention bottom;

Fig. 3 is phase III printed board sketch map in the processing method of the graphical printed board in second order step trough of the present invention bottom;

Fig. 4 is stage printed board sketch map in the processing method of the graphical printed board in second order step trough of the present invention bottom;

Fig. 5 is five-stage printed board sketch map in the processing method of the graphical printed board in second order step trough of the present invention bottom.

Embodiment

Below in conjunction with embodiment the present invention is further described.

Like the embodiment of Fig. 1 to Fig. 5, may further comprise the steps for the processing method of the graphical printed board in second order step trough of the present invention bottom:

(1) prepare to make the substrate of required daughter board set 10, promptly be reserved with insert hole 16 first daughter board 11, be provided with line pattern 14 second daughter board 12, be provided with the 3rd daughter board 13 of line pattern 14;

(2) preliminary treatment be reserved with insert hole 16 first daughter board 11, be provided with line pattern 14 second daughter board 12, be provided with the 3rd daughter board 13 of line pattern 14;

Wherein, preliminary treatment is reserved with first daughter board 11, second daughter board 12, the 3rd daughter board 13 of insert hole 16, comprises following operation: first daughter board 11 is carried out interior photoimaging, internal layer automated optical successively detect the anti-etching coat of metal of (AOI), plating 15, punching; Second daughter board 12 is carried out internal layer figure transfer, punching, the detection of internal layer automated optical, hole milling successively; The 3rd daughter board 13 is carried out internal layer figure transfer, punching, the detection of internal layer automated optical, hole milling successively.

(3) pressing first daughter board 11, second daughter board 12 are pressed together on second daughter board 12 on first daughter board 11, obtain first motherboard 31;

Wherein, first daughter board 11, second daughter board 12 are bonding through prepreg 20.Prepreg 20 is between first daughter board 11 and second daughter board 12 through closing-up in daughter board set 10 for through the high frequency prepreg behind the hole milling simultaneously.

First daughter board 11, second daughter board 12 form first groove during through the cured sheets pressing, in first groove, place silicagel pad 40, and after pressing, take out, and obtain first motherboard 31.Silicagel pad has certain pliability, good insulating properties, compressibility, the natural viscosity in surface, can blind, accomplish the heat transmission of heating position and radiating part interdigit, and also play effects such as insulation, damping, sealing simultaneously.This programme is provided with silicagel pad 40 in first groove, the further perfect pressing working procedure of substrate.As improvement, in first groove, also pad can be set.Pad can be selected the FR-4 pad for use, guarantees that pad pasting is smooth, occurs ill-exposed when preventing figure transfer.

(4) first motherboard 31 is obtained second motherboard 32 through handling, comprise following operation successively: destressing, boring, heavy copper, electric plating of whole board, interior photoimaging, internal layer figure transfer, internal layer automated optical detect, the anti-etching coat of metal of plating 15, punching.Second motherboard 32 that obtains in this step comprises insert hole 16, line pattern 14 and anti-etching coat of metal 15.

(5) pressing the 3rd daughter board 13, second motherboard 32 are pressed together on the 3rd daughter board 13 on second motherboard 32, obtain the 3rd motherboard 33;

Wherein, the 3rd daughter board 13, second motherboard 32 are bonding through prepreg 20.Prepreg 20 is between the 3rd daughter board 13 and second motherboard 32 through closing-up in daughter board set 10 for through the high frequency prepreg behind the hole milling simultaneously.

The 3rd daughter board 13, second motherboard 32 form second groove during through the cured sheets pressing, in second groove, place silicagel pad 40, and after pressing, take out, and obtain the 3rd motherboard 33.

(6) the 3rd motherboard 33 is obtained the graphical printed board 50 in finished product second order step trough bottom through handling, comprise following operation successively: destressing, boring, heavy copper, outer photoimaging, outer graphics transfers, outer automated optical detection, surface treatment, choose lead, the non-heavy copper of brill hole, mill profile.

Wherein, heavy copper hole is PTH, and hole wall has copper, generally is electric hole and component hole; Non-heavy copper hole is NPTH, and hole wall does not have copper, generally is location hole and gong silk hole, available dry film sealing of hole or micelle plug or plating back secondary drilling before plating.

Present embodiment is handled first motherboard 31 through destressing, boring, heavy copper, internal layer figure transfer, the anti-etching coat of metal 15 of plating, be provided with anti-etching coat of metal 15 on line pattern 14 surfaces, and protection figure circuit does not receive etching.This anti-etching coat of metal 15 can sink copper, electric plating of whole board on the surface, and through desmearing, little erosion, electroplate liquid medicine, etching liquid medicine, take off film liquid medicine, brown liquid medicine corrosion and discoloration problem can not occur after soaking.

As improvement, be provided with lead between line pattern 14 and the insert hole 16, the plating folder point conducting of lead and daughter board edges of boards to present embodiment.Through between line pattern 14 and insert hole 16, lead being set, guarantee the plating folder point conducting of line pattern 14, insert hole 16 and daughter board edges of boards, help the work of graphical printed board.

The processing method of the graphical printed board in second order step trough of the present invention bottom, each ladder of the graphical printed board 50 in second order step trough bottom of its processing can connect up and install plug-in unit, has expanded the scope of application of plate.

Process the graphical printed board 50 in second order step trough bottom that obtains by the processing method of the graphical printed board in present embodiment second order step trough bottom; Comprise that pressing and second order step trough bottom is patterned into the daughter board set 10 that is provided with insert hole 16 of type; Daughter board set 10 comprises through prepreg 20 bonding successively first daughter board 11, second daughter board 12 and the 3rd daughter board 13; Be provided with line pattern 14 between first daughter board 11 and second daughter board 12, second daughter board 12 and the 3rd daughter board 13, line pattern 14 surfaces are provided with anti-etching coat of metal 15.Line pattern 14 surfaces are provided with anti-etching coat of metal 15, and protection figure circuit does not receive etching.This anti-etching coat of metal 15 can sink copper, electric plating of whole board on the surface, and through desmearing, little erosion, electroplate liquid medicine, etching liquid medicine, take off film liquid medicine, brown liquid medicine corrosion and discoloration problem can not occur after soaking.

This graphical printed board 50 in second order step trough bottom is provided with protective layer on line pattern 14 surfaces; Complete preservation line pattern 14 does not receive desmearing, little erosion with the hole, electroplates liquid medicine, etching liquid medicine; Take off the attack of film liquid medicine, brown liquid medicine etc.; Make each ladder of second order ladder can connect up and install plug-in unit, thereby expanded the scope of application of plate.

Claims (9)

1. the processing method of the graphical printed board in second order step trough bottom is characterized in that, may further comprise the steps:
Preliminary treatment be reserved with insert hole (16) first daughter board (11), be provided with line pattern (14) second daughter board (12), be provided with the 3rd daughter board (13) of line pattern (14);
Said second daughter board is pressed together on first daughter board, obtains first motherboard (31);
Said first motherboard is handled through destressing, boring, heavy copper, internal layer figure transfer, the anti-etching coat of metal of plating, obtained second motherboard (32);
Said the 3rd daughter board is pressed together on second motherboard, obtains the 3rd motherboard (33);
Said the 3rd motherboard is shifted through destressing, boring, heavy copper, outer graphics, obtain the graphical printed board (50) in finished product second order step trough bottom.
2. the processing method of the graphical printed board in second order step trough according to claim 1 bottom is characterized in that preliminary treatment is reserved with first daughter board, second daughter board, the 3rd daughter board of insert hole, comprises following operation:
First daughter board is carried out interior photoimaging, the detection of internal layer automated optical successively, plates anti-etching coat of metal, punching;
Second daughter board is carried out internal layer figure transfer, punching, the detection of internal layer automated optical, hole milling successively;
The 3rd daughter board is carried out internal layer figure transfer, punching, the detection of internal layer automated optical, hole milling successively.
3. the processing method of the graphical printed board in second order step trough according to claim 1 bottom is characterized in that, first motherboard is obtained second motherboard through handling, and comprises following operation successively:
Destressing, boring, heavy copper, electric plating of whole board, interior photoimaging, internal layer figure transfer, internal layer automated optical detect, plate anti-etching coat of metal, punching.
4. the processing method of the graphical printed board in second order step trough according to claim 1 bottom is characterized in that, the 3rd motherboard is obtained the graphical printed board in finished product second order step trough bottom through handling, and comprises following operation successively:
Destressing, boring, heavy copper, outer photoimaging, outer graphics transfers, outer automated optical detection, surface treatment, choose lead, the non-heavy copper of brill hole, mill profile.
5. according to the processing method of the claim 1-4 graphical printed board in arbitrary described second order step trough bottom, it is characterized in that:
Said first daughter board, second daughter board form first groove during through the cured sheets pressing, in said first groove, place silicagel pad (40), and after pressing, take out, and obtain first motherboard.
6. the processing method of the graphical printed board in second order step trough according to claim 5 bottom is characterized in that:
Said the 3rd daughter board, second motherboard form second groove during through the cured sheets pressing, in said second groove, place silicagel pad (40), and after pressing, take out, and obtain the 3rd motherboard.
7. the processing method of the graphical printed board in second order step trough according to claim 6 bottom is characterized in that: in said first groove, second groove, pad is set all.
8. according to the graphical printed board in the arbitrary described second order step trough of claim 1-4 bottom, it is characterized in that: be provided with lead between said line pattern and the insert hole, the plating folder point conducting of said lead and daughter board edges of boards.
9. graphical printed board in second order step trough bottom; Comprise that pressing and second order step trough bottom is patterned into the daughter board set (10) that is provided with insert hole (16) of type; Said daughter board set comprises through bonding successively first daughter board (11) of prepreg (20), second daughter board (12) and the 3rd daughter board (13); Be provided with line pattern (14) between first daughter board and second daughter board, second daughter board and the 3rd daughter board, it is characterized in that: said line pattern surface is provided with anti-etching coat of metal (15).
CN201110314227.XA 2011-10-17 2011-10-17 Second-order ladder groove bottom graphical printed board and processing method thereof CN102438413B (en)

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* Cited by examiner, † Cited by third party
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CN103517560A (en) * 2012-06-27 2014-01-15 深南电路有限公司 Processing method of PCB stepped groove
CN103811303A (en) * 2014-02-24 2014-05-21 无锡江南计算技术研究所 Manufacturing method of step leveling cushion of stepped packaging substrate
CN104284532A (en) * 2014-09-30 2015-01-14 台山市精诚达电路有限公司 Processing method for multilayer flexible printed circuit board
CN104519677A (en) * 2013-09-30 2015-04-15 北大方正集团有限公司 Printed circuit board and method for manufacturing same
CN104602464A (en) * 2015-01-23 2015-05-06 江门崇达电路技术有限公司 Manufacturing method of copper-cladded ladder hole of circuit board ladder surface and application of manufacturing method
CN104735912A (en) * 2015-03-10 2015-06-24 广州杰赛科技股份有限公司 Step plate manufacturing method
CN104902683A (en) * 2014-03-06 2015-09-09 深南电路有限公司 Step-groove circuit board and processing method thereof
CN105246275A (en) * 2015-11-13 2016-01-13 中国电子科技集团公司第二十九研究所 Multilayer microwave printed circuit board blind slot machining method and used spacers thereof
CN105282980A (en) * 2015-10-20 2016-01-27 深圳市景旺电子股份有限公司 Fabrication method for metallic stepped hole of printed circuit board (PCB)
CN105323983A (en) * 2015-09-22 2016-02-10 东莞市诚志电子有限公司 Method for preparing blue gel particles by PCB
CN105451468A (en) * 2014-08-29 2016-03-30 深南电路有限公司 Method of manufacturing a circuit board
CN105472909A (en) * 2014-09-09 2016-04-06 深南电路有限公司 Processing method of step groove circuit board
CN105722326A (en) * 2016-03-25 2016-06-29 东莞美维电路有限公司 PCB resin plugging technology
CN105764238A (en) * 2015-06-25 2016-07-13 东莞生益电子有限公司 Manufacturing method of step groove PCB, and PCB
CN105764237A (en) * 2015-06-25 2016-07-13 东莞生益电子有限公司 Manufacturing method of step groove PCB, and PCB
CN107960011A (en) * 2017-11-20 2018-04-24 生益电子股份有限公司 The preparation method and high heat conduction PCB of a kind of high heat conduction PCB
CN108012404A (en) * 2017-11-29 2018-05-08 生益电子股份有限公司 A kind of PCB equipped with step groove
CN110785025A (en) * 2019-11-08 2020-02-11 生益电子股份有限公司 PCB manufacturing method and PCB

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020145208A1 (en) * 2001-04-05 2002-10-10 Larry Kinsman Transfer mold semiconductor packaging processes, circuit substrates, semiconductor packages, and ball grid arrays
CN101697660A (en) * 2009-10-28 2010-04-21 深南电路有限公司 Method for processing stepped groove bottom patterned circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020145208A1 (en) * 2001-04-05 2002-10-10 Larry Kinsman Transfer mold semiconductor packaging processes, circuit substrates, semiconductor packages, and ball grid arrays
CN101697660A (en) * 2009-10-28 2010-04-21 深南电路有限公司 Method for processing stepped groove bottom patterned circuit board

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CN103517560B (en) * 2012-06-27 2017-02-15 深南电路有限公司 Processing method of PCB stepped groove
CN103517560A (en) * 2012-06-27 2014-01-15 深南电路有限公司 Processing method of PCB stepped groove
CN104519677B (en) * 2013-09-30 2018-03-16 北大方正集团有限公司 The preparation method and printed circuit board (PCB) of printed circuit board (PCB)
CN104519677A (en) * 2013-09-30 2015-04-15 北大方正集团有限公司 Printed circuit board and method for manufacturing same
CN103811303A (en) * 2014-02-24 2014-05-21 无锡江南计算技术研究所 Manufacturing method of step leveling cushion of stepped packaging substrate
CN103811303B (en) * 2014-02-24 2016-06-22 无锡江南计算技术研究所 Manufacture method is leveled up at a kind of step base plate for packaging step place
CN104902683A (en) * 2014-03-06 2015-09-09 深南电路有限公司 Step-groove circuit board and processing method thereof
CN104902683B (en) * 2014-03-06 2018-08-07 深南电路有限公司 Step groove circuit board and its processing method
CN105451468A (en) * 2014-08-29 2016-03-30 深南电路有限公司 Method of manufacturing a circuit board
CN105472909A (en) * 2014-09-09 2016-04-06 深南电路有限公司 Processing method of step groove circuit board
CN105472909B (en) * 2014-09-09 2018-04-20 深南电路有限公司 A kind of processing method of stepped groove circuit board
CN104284532A (en) * 2014-09-30 2015-01-14 台山市精诚达电路有限公司 Processing method for multilayer flexible printed circuit board
CN104602464A (en) * 2015-01-23 2015-05-06 江门崇达电路技术有限公司 Manufacturing method of copper-cladded ladder hole of circuit board ladder surface and application of manufacturing method
CN104735912A (en) * 2015-03-10 2015-06-24 广州杰赛科技股份有限公司 Step plate manufacturing method
CN104735912B (en) * 2015-03-10 2018-07-06 广州杰赛科技股份有限公司 A kind of production method of stepped plate
CN105764237B (en) * 2015-06-25 2019-03-05 生益电子股份有限公司 A kind of production method and PCB of stepped groove PCB
CN105764238B (en) * 2015-06-25 2019-03-05 生益电子股份有限公司 A kind of production method and PCB of stepped groove PCB
CN105764237A (en) * 2015-06-25 2016-07-13 东莞生益电子有限公司 Manufacturing method of step groove PCB, and PCB
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CN105282980A (en) * 2015-10-20 2016-01-27 深圳市景旺电子股份有限公司 Fabrication method for metallic stepped hole of printed circuit board (PCB)
CN105282980B (en) * 2015-10-20 2018-09-07 深圳市景旺电子股份有限公司 A kind of production method of PCB metallization stepped hole
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CN105722326A (en) * 2016-03-25 2016-06-29 东莞美维电路有限公司 PCB resin plugging technology
CN105722326B (en) * 2016-03-25 2018-11-13 东莞美维电路有限公司 PCB filling holes with resin techniques
CN107960011A (en) * 2017-11-20 2018-04-24 生益电子股份有限公司 The preparation method and high heat conduction PCB of a kind of high heat conduction PCB
CN108012404A (en) * 2017-11-29 2018-05-08 生益电子股份有限公司 A kind of PCB equipped with step groove
CN110785025A (en) * 2019-11-08 2020-02-11 生益电子股份有限公司 PCB manufacturing method and PCB

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