CN103052267B - The processing method of blind buried via hole wiring board - Google Patents
The processing method of blind buried via hole wiring board Download PDFInfo
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- CN103052267B CN103052267B CN201210586492.8A CN201210586492A CN103052267B CN 103052267 B CN103052267 B CN 103052267B CN 201210586492 A CN201210586492 A CN 201210586492A CN 103052267 B CN103052267 B CN 103052267B
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Abstract
The invention discloses a kind of processing method of blind buried via hole wiring board, comprising: on the first central layer, superpose layer protective layer; Described first central layer has end face layers of copper and bottom surface layers of copper, and layers of copper etching in described bottom surface has internal layer circuit; Described protective layer covers described bottom surface layers of copper; Described first central layer is holed, and described first central layer and described protective layer are run through in described hole; On the hole wall in described hole, heavy copper, carries out electric plating of whole board Copper treatment; By silk-screen mode, use resin that described stopple is full; The end face layers of copper of dry film to described first central layer is used to carry out covering protection; Use the method for acid etching, remove the layers of copper on described protective layer; By described first central layer and the second central layer pressing, make blind buried via hole wiring board.Adopt the embodiment of the present invention, internal layer circuit can be protected to etch not to be affected by blind buried via hole is copper-plated, improves the qualification rate that wiring board is produced.
Description
Technical field
The present invention relates to printed substrate (Printed Circuit Board is called for short PCB) manufacturing process technology field, particularly relate to a kind of processing method of blind buried via hole wiring board.
Background technology
Adopt in the technique of lamination method production blind hole (or buried via hole) pcb board, need to carry out repeatedly copper plating treatment to blind hole, to ensure the conducting of blind hole.But copper-plated to blind hole while, pcb board part surface also can be coated with copper, causes the layers of copper in pcb board face blocked up, is unfavorable for the making on plate upper thread road simultaneously.Especially the layers of copper that copper facing can thicken core material is carried out to blind hole, and the defect of concave point, salient point, pin hole and uneven coating can be there is in copper electroplating layer, easily produce the problems such as circuit breach, open circuit, short circuit when inner figure makes.Particularly for the wiring board that internal layer circuit is intensive, the qualification rate that common process is produced is lower.
Summary of the invention
The embodiment of the present invention proposes a kind of processing method of blind buried via hole wiring board, and internal layer circuit can be protected to etch not to be affected by blind buried via hole is copper-plated, improves the qualification rate that wiring board is produced.
The embodiment of the present invention provides a kind of processing method of blind buried via hole wiring board, comprising:
S1, the first central layer superposes layer protective layer; Described first central layer has end face layers of copper and bottom surface layers of copper, and layers of copper etching in described bottom surface has internal layer circuit; Described protective layer covers described bottom surface layers of copper;
S2, described first central layer is holed, and described first central layer and described protective layer are run through in described hole;
S3, on the hole wall in described hole, heavy copper, carries out electric plating of whole board Copper treatment;
S4, by silk-screen mode, uses resin that described stopple is full;
S5, uses the end face layers of copper of dry film to described first central layer to carry out covering protection;
S6, uses the method for acid etching, removes the layers of copper on described protective layer;
S7, by described first central layer and the second central layer pressing, makes blind buried via hole wiring board.
Wherein, described protective layer comprises the first prepreg dielectric layer and copper foil layer.
In described step S1, the bottom surface layers of copper of described first central layer is integrated by described first prepreg dielectric layer and described copper foil layer pressing.
In described step S6, use the method for acid etching, remove the layers of copper on described protective layer, comprising: remove the electro-coppering covered on described protective layer, and remove the copper foil layer on described protective layer.
In described step S7, during by described first central layer and the second central layer pressing, described second central layer is integrated by the first prepreg dielectric layer pressing on the second prepreg dielectric layer and described protective layer.
Described protective layer is formed by stacking by a 106A prepreg and a Copper Foil.
Described first central layer is the epoxy plate of double-sided copper-clad, or has the multi-layer coreboard of internal layer circuit.
Described second central layer is the dielectric-slab of individual layer, or has the multi-layer coreboard of internal layer circuit.
The processing method of the blind buried via hole wiring board that the embodiment of the present invention provides; have in the etching of central layer in the bottom surface layers of copper of internal layer circuit and cover layer protective layer; then hole on central layer; after completing hole copper plating and filling holes with resin; by the end face layers of copper of lid dry film protection central layer; adopt the mode of one side etching to be etched away completely by protective layer table copper, more described central layer and another central layer are carried out pressing, complete the making of blind buried via hole wiring board.Adopt the embodiment of the present invention, internal layer circuit can be protected to etch not to be affected by blind buried via hole is copper-plated, improves the qualification rate that wiring board is produced.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of an embodiment of the processing method of blind buried via hole wiring board provided by the invention;
Fig. 2 is the schematic diagram of the step S1 of the processing method of blind buried via hole wiring board provided by the invention;
Fig. 3 is the schematic diagram of the step S2 of the processing method of blind buried via hole wiring board provided by the invention;
Fig. 4 is the schematic diagram of the step S3 of the processing method of blind buried via hole wiring board provided by the invention;
Fig. 5 is the step S4 of processing method and the schematic diagram of S5 of blind buried via hole wiring board provided by the invention;
Fig. 6 is the schematic diagram of the step S6 of the processing method of blind buried via hole wiring board provided by the invention;
Fig. 7 is the schematic diagram of the step S7 of the processing method of blind buried via hole wiring board provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
See Fig. 1, it is the schematic flow sheet of an embodiment of the processing method of blind buried via hole wiring board provided by the invention.
The embodiment of the present invention provides a kind of processing method of blind buried via hole wiring board, comprises step S1 ~ S7, as follows:
S1, the first central layer superposes layer protective layer.
As shown in Figure 2, the first central layer 1 has end face layers of copper (CS layer) and bottom surface layers of copper (Ln layer), and described bottom surface layers of copper (Ln layer) etching has internal layer circuit; Described protective layer 2 covers described bottom surface layers of copper (Ln layer).During concrete enforcement, the first central layer 1 is the epoxy plate of double-sided copper-clad, or has the multi-layer coreboard of internal layer circuit.
Described protective layer 2 can be formed by stacking by a 106A prepreg and a Copper Foil.As shown in Figure 2, protective layer 2 comprises the first prepreg dielectric layer 21 and copper foil layer 22.In step sl, the bottom surface layers of copper (Ln layer) of the first central layer 1 is integrated with the pressing of described copper foil layer 22 by described first prepreg dielectric layer 21.
S2, described first central layer is holed, and described first central layer and described protective layer are run through in described hole.
As shown in Figure 3, drilling bore hole 100 on the first central layer 1, for making blind hole or buried via hole.Hole 100 extends to the copper foil layer 22 of protective layer 2 from the end face layers of copper (CS layer) of the first central layer 1.
S3, on the hole wall in described hole, heavy copper, carries out electric plating of whole board Copper treatment.
As shown in Figure 4, on the hole wall in hole 100, heavy copper, carries out electric plating of whole board copper.The layers of copper 3 of plating is superimposed upon on the surface of end face layers of copper (CS layer), the hole wall in hole 100 and the copper foil layer 22 of protective layer 2.
S4, by silk-screen mode, uses resin that described stopple is full.
As shown in Figure 5, in hole 100, fill up resin 101, make in the follow-up process that protective layer 2 is etched, can the copper facing in protective hole 100 do not etched away by etching solution.
S5, uses the end face layers of copper of dry film to described first central layer to carry out covering protection.
As shown in Figure 5, dry film 4 covers end face layers of copper (CS layer) top of the first central layer 1, in the follow-up process etched the layers of copper of protective layer 2, end face layers of copper (CS layer) can be protected not etched away by etching solution.
S6, uses the method for acid etching, removes the layers of copper on described protective layer.
As shown in Figure 6, in step s 6, use the method for acid etching, remove the layers of copper on described protective layer 2, comprising: remove the electro-coppering covered on described protective layer 2, and remove the copper foil layer 22 on described protective layer 2.
The present embodiment protects the end face layers of copper (CS layer) of the first central layer 1 by lid dry film, and adopt the mode of one side etching the layers of copper on described protective layer 2 to be etched away completely, internal layer circuit is etched not to be affected by blind buried via hole is copper-plated.
S7, by described first central layer and the second central layer pressing, makes blind buried via hole wiring board.
Wherein, described second central layer is the epoxy plate of double-sided copper-clad, or has the multi-layer coreboard of internal layer circuit.Such as, as shown in Figure 7, the second central layer 6 is the epoxy plate of double-sided copper-clad, has Ln+1 layers of copper and SS layers of copper.
In the step s 7, during by the first central layer 1 and the second central layer 6 pressing, described second central layer 6 is integrated with the first prepreg dielectric layer 21 pressing on described protective layer 2 by the second prepreg dielectric layer 5, makes blind buried via hole wiring board.
The processing method of the blind buried via hole wiring board that the embodiment of the present invention provides; have in the etching of central layer in the bottom surface layers of copper of internal layer circuit and cover layer protective layer; then hole on central layer; after completing hole copper plating and filling holes with resin; by the end face layers of copper of lid dry film protection central layer; adopt the mode of one side etching to be etched away completely by protective layer table copper, more described central layer and another central layer are carried out pressing, complete the making of blind buried via hole wiring board.Adopt the embodiment of the present invention, internal layer circuit can be protected to etch not to be affected by blind buried via hole is copper-plated, improves the qualification rate that wiring board is produced.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (5)
1. a processing method for blind buried via hole wiring board, is characterized in that, comprising:
S1, the first central layer superposes layer protective layer; Described first central layer has end face layers of copper and bottom surface layers of copper, and layers of copper etching in described bottom surface has internal layer circuit; Described protective layer covers described bottom surface layers of copper;
S2, described first central layer is holed, and described first central layer and described protective layer are run through in described hole;
S3, on the hole wall in described hole, heavy copper, carries out electric plating of whole board Copper treatment;
S4, by silk-screen mode, uses resin that described stopple is full;
S5, uses the end face layers of copper of dry film to described first central layer to carry out covering protection;
S6, uses the method for acid etching, removes the layers of copper on described protective layer;
S7, by described first central layer and the second central layer pressing, makes blind buried via hole wiring board;
Wherein, described protective layer comprises the first prepreg dielectric layer and copper foil layer;
In described step S1, the bottom surface layers of copper of described first central layer is integrated by described first prepreg dielectric layer and described copper foil layer pressing.
2. the processing method of blind buried via hole wiring board as claimed in claim 1, is characterized in that, in described step S6, uses the method for acid etching, removes the layers of copper on described protective layer, comprising:
Remove the electro-coppering covered on described protective layer, and remove the copper foil layer on described protective layer.
3. the processing method of blind buried via hole wiring board as claimed in claim 2; it is characterized in that; in described step S7, during by described first central layer and the second central layer pressing, described second central layer is integrated by the first prepreg dielectric layer pressing on the second prepreg dielectric layer and described protective layer.
4. the processing method of the blind buried via hole wiring board as described in any one of claims 1 to 3, is characterized in that, described first central layer is the epoxy plate of double-sided copper-clad, or has the multi-layer coreboard of internal layer circuit.
5. the processing method of blind buried via hole wiring board as claimed in claim 4, is characterized in that, described second central layer is the epoxy plate of double-sided copper-clad, or has the multi-layer coreboard of internal layer circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210586492.8A CN103052267B (en) | 2012-12-31 | 2012-12-31 | The processing method of blind buried via hole wiring board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210586492.8A CN103052267B (en) | 2012-12-31 | 2012-12-31 | The processing method of blind buried via hole wiring board |
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| Publication Number | Publication Date |
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| CN103052267A CN103052267A (en) | 2013-04-17 |
| CN103052267B true CN103052267B (en) | 2015-07-29 |
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| CN201210586492.8A Active CN103052267B (en) | 2012-12-31 | 2012-12-31 | The processing method of blind buried via hole wiring board |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104185355B (en) * | 2013-05-22 | 2018-01-26 | 深南电路有限公司 | The preparation method and circuit board of a kind of circuit board |
| CN110519915B (en) * | 2019-08-12 | 2024-03-19 | 珠海杰赛科技有限公司 | Blind buried hole printed circuit board and manufacturing method thereof |
| CN110740578B (en) * | 2019-11-13 | 2021-03-23 | 惠州市永盛隆电子科技有限公司 | Circuit board taphole screen printing solder mask process |
| CN111683463B (en) * | 2020-07-08 | 2022-10-14 | 沪士电子股份有限公司 | Processing method of thick copper circuit board containing anti-bonding pad |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427673A (en) * | 2011-09-01 | 2012-04-25 | 广州杰赛科技股份有限公司 | Machining method of blind hole PCB (Printed Circuit Board) |
| CN102625604A (en) * | 2012-03-20 | 2012-08-01 | 柏承科技(昆山)股份有限公司 | Manufacturing method for high-density interconnection printed board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007129180A (en) * | 2005-10-03 | 2007-05-24 | Cmk Corp | Printed wiring board, multilayer printed wiring board, and method of manufacturing same |
| TWI304313B (en) * | 2006-05-25 | 2008-12-11 | Advanced Semiconductor Eng | Method for manufacturing a circuit board without incoming line |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427673A (en) * | 2011-09-01 | 2012-04-25 | 广州杰赛科技股份有限公司 | Machining method of blind hole PCB (Printed Circuit Board) |
| CN102625604A (en) * | 2012-03-20 | 2012-08-01 | 柏承科技(昆山)股份有限公司 | Manufacturing method for high-density interconnection printed board |
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