CN103052267A - Processing method of buried/blind hole circuit board - Google Patents
Processing method of buried/blind hole circuit board Download PDFInfo
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- CN103052267A CN103052267A CN2012105864928A CN201210586492A CN103052267A CN 103052267 A CN103052267 A CN 103052267A CN 2012105864928 A CN2012105864928 A CN 2012105864928A CN 201210586492 A CN201210586492 A CN 201210586492A CN 103052267 A CN103052267 A CN 103052267A
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Abstract
The invention discloses a processing method of a buried/blind hole circuit board. The processing method of the buried/blind hole circuit board comprises the following steps that a protective layer is overlaid on a first core plate; the first core plate is provided with a top face copper layer and a bottom face copper layer, and an inner layer circuit is etched in the bottom face copper layer; the protective layer covers the bottom face copper layer; a hole is drilled in the first core plate, and the hole penetrates through the first core plate and the protective layer; copper is settled on the hole wall, and the whole board undergoes electrocoppering processing; through a silk-screen printing way, the hole is fully filled with resin; the top face copper layer of the first core plate is covered and protected through the utilization of a dry film; a copper layer on the protective layer is removed by an acid etching method; and the first core plate and a second core plate are pressed together for the formation of the buried/blind hole circuit board. With the adoption of the processing method of the buried/blind hole circuit board, the etching in the inner layer circuit can be protected from influence from copper-plating on the buried/blind hole; and therefore, the qualification rate of the produced circuit board is improved.
Description
Technical field
The present invention relates to printed substrate (Printed Circuit Board is called for short PCB) manufacturing process technology field, relate in particular to a kind of processing method of blind buried via hole wiring board.
Background technology
Adopt in the technique of lamination method production blind hole (perhaps buried via hole) pcb board, need to carry out repeatedly copper plating treatment to blind hole, to guarantee the conducting of blind hole.But to the copper-plated while of blind hole, pcb board spare surface also can be coated with copper simultaneously, causes the copper layer of pcb board face blocked up, is unfavorable for the making on plate upper thread road.Especially blind hole is carried out the copper layer of copper facing meeting thickening core material, and can there be the defective of concave point, salient point, pin hole and uneven coating in copper electroplating layer, the easy problems such as circuit breach, open circuit, short circuit that produce when inner figure is made.Particularly for the intensive wiring board of internal layer circuit, the qualification rate that common process is produced is lower.
Summary of the invention
The embodiment of the invention proposes a kind of processing method of blind buried via hole wiring board, can protect the internal layer circuit etching not to be subjected to that blind buried via hole is copper-plated to be affected, and improves the qualification rate that wiring board is produced.
The embodiment of the invention provides a kind of processing method of blind buried via hole wiring board, comprising:
S1 is at the first central layer layer protective layer that superposes; Described the first central layer has end face copper layer and bottom surface copper layer, and the copper layer etching of described bottom surface has internal layer circuit; Described protective layer covers described bottom surface copper layer;
S2 holes at described the first central layer, and described the first central layer and described protective layer are run through in described hole;
S3, the heavy copper of the hole wall in described hole carries out electric plating of whole board copper and processes;
S4 by the silk-screen mode, uses resin that described stopple is full;
S5 uses dry film that the end face copper layer of described the first central layer is carried out covering protection;
S6, the method for use acid etching is removed the copper layer on the described protective layer;
S7 with described the first central layer and the second central layer pressing, makes blind buried via hole wiring board.
Wherein, described protective layer comprises the first prepreg dielectric layer and copper foil layer.
In described step S1, the bottom surface copper layer of described the first central layer is integrated by described the first prepreg dielectric layer and described copper foil layer pressing.
In described step S6, use the method for acid etching, remove the copper layer on the described protective layer, comprising: remove the electro-coppering that covers on the described protective layer, and remove the copper foil layer on the described protective layer.
In described step S7, during with described the first central layer and the second central layer pressing, described the second central layer is integrated by the first prepreg dielectric layer pressing on the second prepreg dielectric layer and the described protective layer.
Described protective layer is formed by stacking by a 106A prepreg and a Copper Foil.
Described the first central layer is the epoxy plate of double-sided copper-clad, or has the multi-layer coreboard of internal layer circuit.
Described the second central layer is the dielectric-slab of individual layer, or has the multi-layer coreboard of internal layer circuit.
The processing method of the blind buried via hole wiring board that the embodiment of the invention provides; etching at central layer has the bottom surface copper layer of internal layer circuit to cover layer protective layer; then hole at central layer; after finishing hole copper plating and filling holes with resin; end face copper layer by lid dry film protection central layer; adopt the etched mode of single face that protective layer table copper is etched away fully, more described central layer and another central layer are carried out pressing, finish the making of blind buried via hole wiring board.Adopt the embodiment of the invention, can protect the internal layer circuit etching not to be subjected to that blind buried via hole is copper-plated to be affected, improve the qualification rate that wiring board is produced.
Description of drawings
Fig. 1 is the schematic flow sheet of an embodiment of the processing method of blind buried via hole wiring board provided by the invention;
Fig. 2 is the schematic diagram of step S1 of the processing method of blind buried via hole wiring board provided by the invention;
Fig. 3 is the schematic diagram of step S2 of the processing method of blind buried via hole wiring board provided by the invention;
Fig. 4 is the schematic diagram of step S3 of the processing method of blind buried via hole wiring board provided by the invention;
Fig. 5 is the step S4 of processing method of blind buried via hole wiring board provided by the invention and the schematic diagram of S5;
Fig. 6 is the schematic diagram of step S6 of the processing method of blind buried via hole wiring board provided by the invention;
Fig. 7 is the schematic diagram of step S7 of the processing method of blind buried via hole wiring board provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
Referring to Fig. 1, it is the schematic flow sheet of an embodiment of the processing method of blind buried via hole wiring board provided by the invention.
The embodiment of the invention provides a kind of processing method of blind buried via hole wiring board, comprises step S1 ~ S7, and is as follows:
S1 is at the first central layer layer protective layer that superposes.
As shown in Figure 2, the first central layer 1 has end face copper layer (CS layer) and bottom surface copper layer (Ln layer), and described bottom surface copper layer (Ln layer) etching has internal layer circuit; Described protective layer 2 covers described bottom surface copper layer (Ln layer).During implementation, the first central layer 1 is the epoxy plate of double-sided copper-clad, or has the multi-layer coreboard of internal layer circuit.
Described protective layer 2 can be formed by stacking by a 106A prepreg and a Copper Foil.As shown in Figure 2, protective layer 2 comprises the first prepreg dielectric layer 21 and copper foil layer 22.In step S1, the bottom surface copper layer (Ln layer) of the first central layer 1 is integrated with described copper foil layer 22 pressings by described the first prepreg dielectric layer 21.
S2 holes at described the first central layer, and described the first central layer and described protective layer are run through in described hole.
As shown in Figure 3, drilling bore hole 100 on the first central layer 1 is used for making blind hole or buried via hole.Hole 100 extends to the copper foil layer 22 of protective layer 2 from the end face copper layer (CS layer) of the first central layer 1.
S3, the heavy copper of the hole wall in described hole carries out electric plating of whole board copper and processes.
As shown in Figure 4, the heavy copper of 100 hole wall carries out electric plating of whole board copper in the hole.The copper layer 3 of electroplating is superimposed upon on the surface of copper foil layer 22 of the hole wall in end face copper layer (CS layer), hole 100 and protective layer 2.
S4 by the silk-screen mode, uses resin that described stopple is full.
As shown in Figure 5, in hole 100, fill up resin 101, so that follow-up protective layer 2 is carried out in the etched process, can protect the not etched liquid medicine of copper facing in the hole 100 to etch away.
S5 uses dry film that the end face copper layer of described the first central layer is carried out covering protection.
As shown in Figure 5, dry film 4 covers end face copper layer (CS layer) top of the first central layer 1, carries out in the etched process at follow-up copper layer to protective layer 2, can protect the not etched liquid medicine of end face copper layer (CS layer) to etch away.
S6, the method for use acid etching is removed the copper layer on the described protective layer.
As shown in Figure 6, in step S6, use the method for acid etching, remove the copper layer on the described protective layer 2, comprising: remove the electro-coppering that covers on the described protective layer 2, and remove the copper foil layer 22 on the described protective layer 2.
The present embodiment is protected the end face copper layer (CS layer) of the first central layer 1 by the lid dry film, adopt the etched mode of single face that the copper layer on the described protective layer 2 is etched away fully, and blind buried via hole is copper-plated to be affected so that the internal layer circuit etching is not subjected to.
S7 with described the first central layer and the second central layer pressing, makes blind buried via hole wiring board.
Wherein, described the second central layer is the epoxy plate of double-sided copper-clad, or has the multi-layer coreboard of internal layer circuit.For example, as shown in Figure 7, the second central layer 6 is the epoxy plate of double-sided copper-clad, has Ln+1 copper layer and SS copper layer.
In step S7, during with the first central layer 1 and 6 pressing of the second central layer, described the second central layer 6 is integrated by the first prepreg dielectric layer 21 pressings on the second prepreg dielectric layer 5 and the described protective layer 2, makes blind buried via hole wiring board.
The processing method of the blind buried via hole wiring board that the embodiment of the invention provides; etching at central layer has the bottom surface copper layer of internal layer circuit to cover layer protective layer; then hole at central layer; after finishing hole copper plating and filling holes with resin; end face copper layer by lid dry film protection central layer; adopt the etched mode of single face that protective layer table copper is etched away fully, more described central layer and another central layer are carried out pressing, finish the making of blind buried via hole wiring board.Adopt the embodiment of the invention, can protect the internal layer circuit etching not to be subjected to that blind buried via hole is copper-plated to be affected, improve the qualification rate that wiring board is produced.
The above is preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also are considered as protection scope of the present invention.
Claims (6)
1. the processing method of a blind buried via hole wiring board is characterized in that, comprising:
S1 is at the first central layer layer protective layer that superposes; Described the first central layer has end face copper layer and bottom surface copper layer, and the copper layer etching of described bottom surface has internal layer circuit; Described protective layer covers described bottom surface copper layer;
S2 holes at described the first central layer, and described the first central layer and described protective layer are run through in described hole;
S3, the heavy copper of the hole wall in described hole carries out electric plating of whole board copper and processes;
S4 by the silk-screen mode, uses resin that described stopple is full;
S5 uses dry film that the end face copper layer of described the first central layer is carried out covering protection;
S6, the method for use acid etching is removed the copper layer on the described protective layer;
S7 with described the first central layer and the second central layer pressing, makes blind buried via hole wiring board.
2. the processing method of blind buried via hole wiring board as claimed in claim 1 is characterized in that, described protective layer comprises the first prepreg dielectric layer and copper foil layer;
In described step S1, the bottom surface copper layer of described the first central layer is integrated by described the first prepreg dielectric layer and described copper foil layer pressing.
3. the processing method of blind buried via hole wiring board as claimed in claim 2 is characterized in that, in described step S6, uses the method for acid etching, removes the copper layer on the described protective layer, comprising:
Removal covers the electro-coppering on the described protective layer, and removes the copper foil layer on the described protective layer.
4. the processing method of blind buried via hole wiring board as claimed in claim 3; it is characterized in that; in described step S7, during with described the first central layer and the second central layer pressing, described the second central layer is integrated by the first prepreg dielectric layer pressing on the second prepreg dielectric layer and the described protective layer.
5. such as the processing method of each described blind buried via hole wiring board of claim 1 ~ 4, it is characterized in that, described the first central layer is the epoxy plate of double-sided copper-clad, or has the multi-layer coreboard of internal layer circuit.
6. the processing method of blind buried via hole wiring board as claimed in claim 5 is characterized in that, described the second central layer is the epoxy plate of double-sided copper-clad, or has the multi-layer coreboard of internal layer circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210586492.8A CN103052267B (en) | 2012-12-31 | 2012-12-31 | The processing method of blind buried via hole wiring board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210586492.8A CN103052267B (en) | 2012-12-31 | 2012-12-31 | The processing method of blind buried via hole wiring board |
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| CN103052267A true CN103052267A (en) | 2013-04-17 |
| CN103052267B CN103052267B (en) | 2015-07-29 |
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| CN201210586492.8A Active CN103052267B (en) | 2012-12-31 | 2012-12-31 | The processing method of blind buried via hole wiring board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104185355A (en) * | 2013-05-22 | 2014-12-03 | 深南电路有限公司 | Manufacturing method for circuit board and circuit board |
| CN110519915A (en) * | 2019-08-12 | 2019-11-29 | 珠海杰赛科技有限公司 | A kind of blind buried via hole printed circuit board and preparation method thereof |
| CN110740578A (en) * | 2019-11-13 | 2020-01-31 | 惠州市永盛隆电子科技有限公司 | Circuit board taphole screen printing solder mask process |
| CN111683463A (en) * | 2020-07-08 | 2020-09-18 | 沪士电子股份有限公司 | Processing method of thick copper circuit board containing anti-bonding pad |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070074902A1 (en) * | 2005-10-03 | 2007-04-05 | Cmk Corporation | Printed-wiring board, multilayer printed-wiring board and manufacturing process therefor |
| US20070272654A1 (en) * | 2006-05-25 | 2007-11-29 | Advanced Semiconductor Engineering Inc. | Method for Manufacturing Circuit Board |
| CN102427673A (en) * | 2011-09-01 | 2012-04-25 | 广州杰赛科技股份有限公司 | Machining method of blind hole PCB (Printed Circuit Board) |
| CN102625604A (en) * | 2012-03-20 | 2012-08-01 | 柏承科技(昆山)股份有限公司 | Manufacturing method for high-density interconnection printed board |
-
2012
- 2012-12-31 CN CN201210586492.8A patent/CN103052267B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070074902A1 (en) * | 2005-10-03 | 2007-04-05 | Cmk Corporation | Printed-wiring board, multilayer printed-wiring board and manufacturing process therefor |
| US20070272654A1 (en) * | 2006-05-25 | 2007-11-29 | Advanced Semiconductor Engineering Inc. | Method for Manufacturing Circuit Board |
| CN102427673A (en) * | 2011-09-01 | 2012-04-25 | 广州杰赛科技股份有限公司 | Machining method of blind hole PCB (Printed Circuit Board) |
| CN102625604A (en) * | 2012-03-20 | 2012-08-01 | 柏承科技(昆山)股份有限公司 | Manufacturing method for high-density interconnection printed board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104185355A (en) * | 2013-05-22 | 2014-12-03 | 深南电路有限公司 | Manufacturing method for circuit board and circuit board |
| CN104185355B (en) * | 2013-05-22 | 2018-01-26 | 深南电路有限公司 | The preparation method and circuit board of a kind of circuit board |
| CN110519915A (en) * | 2019-08-12 | 2019-11-29 | 珠海杰赛科技有限公司 | A kind of blind buried via hole printed circuit board and preparation method thereof |
| CN110519915B (en) * | 2019-08-12 | 2024-03-19 | 珠海杰赛科技有限公司 | Blind buried hole printed circuit board and manufacturing method thereof |
| CN110740578A (en) * | 2019-11-13 | 2020-01-31 | 惠州市永盛隆电子科技有限公司 | Circuit board taphole screen printing solder mask process |
| CN111683463A (en) * | 2020-07-08 | 2020-09-18 | 沪士电子股份有限公司 | Processing method of thick copper circuit board containing anti-bonding pad |
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| CN103052267B (en) | 2015-07-29 |
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