CN104902696A - Method of manufacturing copper column on printed circuit board based on wire embedding structure - Google Patents
Method of manufacturing copper column on printed circuit board based on wire embedding structure Download PDFInfo
- Publication number
- CN104902696A CN104902696A CN201510353137.XA CN201510353137A CN104902696A CN 104902696 A CN104902696 A CN 104902696A CN 201510353137 A CN201510353137 A CN 201510353137A CN 104902696 A CN104902696 A CN 104902696A
- Authority
- CN
- China
- Prior art keywords
- copper
- circuit board
- printed circuit
- copper foil
- copper post
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 218
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 128
- 239000010949 copper Substances 0.000 title claims abstract description 128
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 74
- 239000011889 copper foil Substances 0.000 claims abstract description 70
- 239000000463 material Substances 0.000 claims abstract description 24
- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- 238000005530 etching Methods 0.000 claims abstract description 11
- 230000003064 anti-oxidating effect Effects 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 50
- 229920005989 resin Polymers 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 40
- -1 polytetrafluoroethylene Polymers 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- 238000013461 design Methods 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 12
- 239000011241 protective layer Substances 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 11
- 239000003814 drug Substances 0.000 claims description 10
- 238000005516 engineering process Methods 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 8
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 239000011135 tin Substances 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 241000784732 Lycaena phlaeas Species 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000004643 cyanate ester Substances 0.000 claims description 6
- 239000004744 fabric Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229920001568 phenolic resin Polymers 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 238000005234 chemical deposition Methods 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 4
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 239000011133 lead Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- 238000003032 molecular docking Methods 0.000 claims description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 2
- 229920002799 BoPET Polymers 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 2
- 229910001074 Lay pewter Inorganic materials 0.000 claims description 2
- 239000005041 Mylar™ Substances 0.000 claims description 2
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 2
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000002322 conducting polymer Substances 0.000 claims description 2
- 229920001940 conductive polymer Polymers 0.000 claims description 2
- YJFHTKQOASXZIF-UHFFFAOYSA-N cyanic acid;pyrrole-2,5-dione Chemical compound OC#N.O=C1NC(=O)C=C1 YJFHTKQOASXZIF-UHFFFAOYSA-N 0.000 claims description 2
- 239000010408 film Substances 0.000 claims description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 2
- 239000004615 ingredient Substances 0.000 claims description 2
- KFZAUHNPPZCSCR-UHFFFAOYSA-N iron zinc Chemical compound [Fe].[Zn] KFZAUHNPPZCSCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- 229910052755 nonmetal Inorganic materials 0.000 claims description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 229920001290 polyvinyl ester Polymers 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 abstract description 6
- 238000000151 deposition Methods 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract 2
- 238000004140 cleaning Methods 0.000 abstract 1
- 210000001503 joint Anatomy 0.000 abstract 1
- 239000000047 product Substances 0.000 description 14
- 230000003628 erosive effect Effects 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 108010074506 Transfer Factor Proteins 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention provides a method of manufacturing a copper column on a printed circuit board based on a wire embedding structure. The method comprises the steps of: 1) pasting copper foil forming the copper column to the surface of a supporting plate; 2) manufacturing a copper circuit pattern through a pattern electroplating method on one face of the copper foil forming the copper column; 3) laminating a dielectric layer material on the copper circuit pattern to form the wire embedding structure; 4) finishing the manufacturing of a multi-layer structure by means of the laminating and copper circuit pattern manufacturing processes; 5) removing the supporting plate; 6) manufacturing the copper column by carrying out pattern electroplating on the surface of the copper foil forming the copper column, or firstly cleaning the copper foil on the side pre-forming the copper column in an etching manner, then depositing one conducting layer, and manufacturing the copper column through the pattern electroplating method; 7) pasting a protection layer to the side surface, forming on copper column, of the circuit board; 8) removing the conducting layer on the side, providing the copper column, of the circuit board by etching to obtain the copper column; 9) removing the protection layer; and 10) manufacturing a solder mask on the surface of the circuit board, and manufacturing an anti-oxidation layer on the surface of the copper column. And in this way, the printed circuit board provided with the copper column structure used for chip interconnection and butt joint is obtained.
Description
Technical field
The present invention relates to the manufacturing technology of printed circuit board or semiconductor integrated circuit package substrate, particularly a kind of method making copper post based on structure of sunkening cord on a printed circuit board.
Background technology
Flourish along with electronic industry, electronic product is entered function, intelligentized development, for meeting electronic product high integration, miniaturization, microminiaturized development need, printed circuit board or semiconductor integrated circuit package substrate, under the prerequisite meeting the good electricity of electronic product, hot property, also develop towards light, thin, short, little designer trends.Meanwhile, the design requirement for electronic system also becomes increasingly complex, and towards different future developments.But have two kinds of primary demands for electronic product of new generation, along with progressively diminishing of design size, the interconnection density of all products on design level constantly increases.That is, in more and more limited surface area, need to design more input/output signal circuit.Meanwhile, because components and parts operate under high speed signal, performance must be improved.
Based on above demand, be developed flip chip and cover brilliant interconnection technique.There is chip and circuit board access path is short because flip chip covers brilliant connection, impedance is low, the loss of signal is little, the advantages such as signal of telecommunication parasitics is low, therefore, in many high-end product designs, flip chip chip package mode progressively instead of the wire bonding encapsulation connected mode that connection is relatively grown, and becomes generally.
It is the mode adopting tin ball that traditional flip chip chip package connects, and the mode that chip node and circuit board node are welded by high temperature reflux is welded together.But along with the continuous increase of product circuit design density, the spacing (pitch) between chip and circuit board tie point is also more and more less.On the one hand, due to docking solder joint design density increasing time, the electric current in application process and thermal effect increase thereupon, and because of the impact of tin ball electron transfer factor, product reliability potential problems also increase thereupon; On the other hand, particularly as nodal pitch (b μm of p pitch) <130 μm, traditional employing tin ball, by the connected mode of high temperature reflow oven because easily producing short circuit, the problems such as cost of manufacture, have not been suitable for large volume production.Based on such background, adopt Copper column structure to arise at the historic moment as the design of connected mode, and progressively accepted to be applied to actual product design by many companies.
Copper post can be produced on chip, also can make on a printed circuit board.
When chip makes copper post, the wafer area due to chip place is relatively little (diameter is about 200mm), and adopts senior electroplating device and liquid medicine, and the ability of plating is stronger; Therefore, present design is many to be designed copper post on the chip of wafer side, but its cost of manufacture is higher.Recently, existing dealer explores and makes copper post on a printed circuit board, to replace the Copper column structure of chip side.
Prior art adopts subtractive process to make copper post on a printed circuit board, but because subtractive process adopts etching solution to etch Copper Foil, obtain in the process of copper post, there will be " lateral erosion " phenomenon, that is: etching solution not only attacks Copper Foil downwards, and to side attack copper, causes the copper post formed to be " cone ", this not only bad for the making of more closely spaced copper post, and has obvious impact to the integrality of signal.Therefore need a kind of new method to make copper post, make the copper post of formation for " cylinder ", the spacing between copper post can be made like this to reduce, improve wiring density.
Summary of the invention
The object of the present invention is to provide a kind of method making copper post based on structure of sunkening cord on a printed circuit board, line pattern and dielectric layer are structure of sunkening cord, and adhesion is good, and can realize the making of Small Distance Copper column structure, and the exterior quality of product is good.
For achieving the above object, technical scheme of the present invention is:
Make a method for copper post based on structure of sunkening cord on a printed circuit board, comprise the steps:
1) formation copper post Copper Foil is attached to supporting bracket surface, wherein, the one side towards supporting bracket is the first surface forming copper post Copper Foil; One side back to supporting bracket is second that forms copper post Copper Foil;
2) in second method by graphic plating forming copper post Copper Foil, copper wire figure is made at copper foil surface;
3) press a dielectric layer material in the copper wire graphic design of copper foil surface, form structure of sunkening cord;
4) the tradition stratum compression technology of printed circuit board and the manufacture craft of copper wire figure is adopted to complete the making of sandwich construction;
5) supporting bracket is removed;
6) copper post is made by the method for graphic plating at copper foil surface at the first surface forming copper post Copper Foil; Or first by clean for the etching of the Copper Foil of pre-formed copper post side, then deposit one deck conductive layer, then by the method for graphic plating, make copper post;
7) printed circuit board one side surface forming copper post is not being needed to stick the protective layer preventing liquid medicine from permeating;
8) by quick-etch process, the conductive layer of printed circuit board copper post side is removed in etching, obtains copper post;
9) protective layer preventing liquid medicine from permeating is removed;
10) make solder mask on printed circuit board surface, make antioxidation coating on copper post surface, namely obtain the printed circuit board with chip interconnects docking Copper column structure.
Further, step 1) described in formation copper post copper thickness be 0.1 μm ~ 100 μm.
Again, step 1) described in formation copper post Copper Foil adopt thickness 1 ~ 3 μm of extra thin copper foil or the common Copper Foil that adopts thickness to be greater than 5 μm to reach extra thin copper foil thickness by thinning process for copper.
Preferably, step 1) in, by the method that formation copper post Copper Foil is attached to supporting bracket surface be: adopt between the common Copper Foil of carrier-free Copper Foil and the fringe region of supporting bracket and bond with stickum.
Correspondingly, step 5) in, by the method that supporting bracket is removed, adopt and the fringe region adhesive segment of common Copper Foil and supporting bracket is cut, thus supporting bracket is removed.
Preferably, step 1) in, by the method that formation copper post Copper Foil is attached to supporting bracket surface be: adopt the extra thin copper foil containing carrier copper foil, bond with stickum between carrier copper foil and the whole plate region of supporting bracket.
Correspondingly, step 5) in, by the method that supporting bracket is removed be: be separated between carrier copper foil with the extra thin copper foil containing carrier copper foil, because carrier copper foil and supporting bracket whole plate region stickum bond, thus supporting bracket be removed together with carrier copper foil.
Again, stickum of the present invention is prepreg or resin, resin comprises phenolic resins, Corvic, mylar, epoxy resin, polyurethane, polyvinylesters, poly-fluororesin, poly-fluorocarbon resin, bismaleimide resins, poly-Malaysian amine cyanate resin, polyimide resin, poly-cyanate ester resin or epoxy radicals polyphenylene oxide.
Preferably, step 3) described in dielectric layer material be pure resin material or containing the resin material of glass fabric.
Preferably, described pure resin material comprises epoxy resin, polyimides, poly maleimide cyanate resin, polyphenylene oxide or polytetrafluoroethylene; Resin material containing glass fabric comprises FR-4 or FR-5.
Further, described conductive layer be metal conducting layer, radio frequency layer or by metal, the nonmetal conducting resinl formed.
Preferably, described conductive layer is formed by the technique of chemical deposition or sputtering.
Preferably, the material of described metal conduction layer is the one in gold, silver, copper, tin, lead, aluminium, iron, nickel, cobalt, zinc, chromium, titanium, or leypewter, Kufil, ormolu, corronil, iron-nickel alloy, iron cobalt nickel alloy, one in iron-zinc alloy.
Preferably, the material of described radio frequency layer is the one in carbon, conducting polymer polymeric membrane.
Preferably, in described conducting resinl, metal ingredient is: gold, silver, copper, tin, lead, aluminium, iron, nickel, cobalt, zinc, chromium or titanium; Non-metallic components is: epoxy resin, phenolic resins, polybismaleimide cyanate resin, poly-cyanate ester resin, epoxy radicals polyphenylene oxide, polyimides, polytetrafluoroethylene or polybutylene terephthalate resin.
Preferably, step 7) described in the protective layer preventing liquid medicine from permeating be one in dry film, wet film, polyimides, epoxy resin, phenolic resins, polybismaleimide cyanate resin, poly-cyanate ester resin, epoxy radicals polyphenylene oxide, polyimides, polytetrafluoroethylene, polybutylene terephthalate resin.
Preferably, step 10) described in antioxidation coating adopt organic anti-welding diaphragm, chemical deposition or electronickelling gold, NiPdAu, chemistry or electrotinning, Xi Yin, SAC, chemistry silver.
The invention has the advantages that:
1. prior art be line pattern on dielectric layer (resin+glass fibre), the combination of line pattern and dielectric layer only has one side; And the present invention is for sunkening cord structure, namely on Copper Foil, carrying out graphic plating, after growing line pattern, being pressed in by line pattern in the middle of dielectric layer, three of line pattern all have resin, and adhesion is good.
See Figure 23, prior art be line pattern A on dielectric layer B (resin+glass fibre), the combination of line pattern A and dielectric layer B only has one side.
See Figure 24, the present invention is structure of sunkening cord, and after Copper Foil carries out graphic plating formation line pattern A, be pressed in by line pattern A in the middle of dielectric layer B, three of line pattern A all have resin.
2. prior art makes circuit and adopts subtractive process, circuit and copper post are carry out DES etching after panel plating, owing to there being lateral erosion effect, the circuit formed and the gap ratio of copper post larger, line style is bad, and easily form trapezoidal (as shown in figure 21), this integrality for impedance Control and signal all has negative impact, especially, on fine rule road makes, have and obviously limit to.
And the present invention adopts semi-additive process manufacture craft, the Copper column structure of minor node spacing can be processed, and Copper column structure/size evenly (as shown in figure 22).
As can be seen from Figure 21,22 and table 1 in, the copper post (Figure 21) that prior art adopts subtractive process to make, due to the existence of lateral erosion, cause the etching of the copper bottom circuit clean, minimum spacing can only be fabricated into 120 μm.
And the present invention adopts half additive process to make copper post (Figure 22), only need owing to dodging in erosion step the copper etching away 1-3 μm, so there is no lateral erosion effect, therefore minimum spacing can be fabricated into 60 μm.
Table 1
3, prior art makes Copper column structure on a printed circuit board, is generally after solder mask completes, by surface deposition chemical copper as conductive layer, and electro-coppering post; This method has certain damage to solder mask surface, causes rough surface dim.This is because: the main component of solder mask is containing acid composition, and containing alkaline degreasing liquid medicine in chemical copper processing procedure, therefore solder mask can be subject to the attack of alkaline medicinal liquid, finally causes rough surface.
And Copper column structure of the present invention makes before solder mask completes, so can not cause damage to solder mask, solder mask keeps smooth, and the exterior quality of product is good.
Accompanying drawing explanation
Fig. 1 ~ 11 are Making programme figure of the inventive method embodiment one.
Figure 12 ~ 19 are Making programme figure of the inventive method embodiment two.
Figure 20 is the structural representation adopting the inventive method to obtain printed circuit board.
Figure 21 is a subtractive to the schematic cross-section that legal system makes copper post.
Figure 22 is that the present invention adopts half addition method to make the schematic cross-section of copper post.
Figure 23 is the structural representation that in prior art, line pattern is combined with dielectric layer.
Figure 24 is the structural representation that line pattern of the present invention is combined with dielectric layer.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the present invention will be further described.
Embodiment one
See Fig. 1 ~ Figure 11 and Figure 20, the present invention is based on the method making copper post on a printed circuit board of structure of sunkening cord, comprise the steps:
1) extra thin copper foil 101 of a thickness 3 μm is attached to supporting bracket 100 surface, wherein, the one side towards supporting bracket 100 is first surface 1011; One side back to supporting bracket 100 is the second face 1012, as shown in Figure 1;
2) on the second face 1012 of extra thin copper foil 101 by the method for graphic plating, make ground floor copper wire figure 102 required by actual product, as shown in Figure 2;
3) lamination first dielectric layer material 103 (the resin material FR-4 containing glass fabric) on extra thin copper foil 101 surperficial ground floor copper wire figure 102, forms structure of sunkening cord, as shown in Figure 3;
4) adopt the tradition stratum compression technology of printed circuit board and the manufacture craft of copper wire figure to complete sandwich construction to make, as shown in Figure 4; Wherein, 104 is second layer extra thin copper foil, 105 be Graphic transitions method make second layer copper wire figure, 106 is the second layer dielectric layer material of lamination, and 107 is the third layer copper wire figure made, and 108 is ground floor blind hole, 109 is second layer blind hole, as shown in Figure 4;
5) supporting bracket 100 is removed, as shown in Figure 5;
6) dry film is sticked in the circuit board both sides after removing supporting bracket 100, makes the dry film 110 of copper post side, opposite side dry film 111, as shown in Figure 6;
7) windowed corresponding copper post position in dry film 110 side by exposure, developing process, and by electroplating technology at copper foil surface electro-coppering rod structure 112, as shown in Figure 7;
8) dry film 110,111 is peeled off, as shown in Figure 8;
9) protective layer 113 of anti-liquid medicine infiltration is sticked in the side not forming copper post at circuit board, as shown in Figure 9;
10) by quick-etch process, the Copper Foil of the thin end 101 in the first dielectric layer material 103 being etched totally, exposes structure of sunkening cord--ground floor copper wire figure 102, forms complete Copper column structure 112, as shown in Figure 10;
11) protective layer 113 is peeled off, as shown in figure 11;
12) by aftertreatment technology, at circuit board surface coating solder mask 119, and conservation treatment is carried out to the copper post revealed and circuit pack, copper post sealer OSP120, circuit pack protective layer OSP121; So far, obtain based on the printed circuit board of structure with Copper column structure of sunkening cord, as shown in figure 20.
Embodiment two
See Fig. 1 ~ Fig. 4, Figure 12 ~ Figure 20, the present invention is based on the method making copper post on a printed circuit board of structure of sunkening cord, its manufacture craft comprises the steps:
1) extra thin copper foil 101 of a thickness 3 μm is attached to supporting bracket 100 surface, wherein, the one side towards supporting bracket 100 is first surface 1011; One side back to supporting bracket 100 is the second face 1012, as shown in Figure 1;
2) on the second face 1012 of extra thin copper foil 101 by the method for graphic plating, make ground floor copper wire figure 102 required by actual product, as shown in Figure 2;
3) lamination first dielectric layer material 103 (the resin material FR-4 containing glass fabric) and second layer Copper Foil 104 on ground floor copper wire figure 102, forms structure of sunkening cord, as shown in Figure 3;
4) adopt the tradition stratum compression technology of printed circuit board and the manufacture craft of copper wire figure to complete sandwich construction to make, as shown in Figure 4; Wherein, 105 is the second layer copper wire figure that the method for Graphic transitions makes, and 106 be the second layer dielectric layer material of lamination, and 107 is the third layer copper wire figure of making, and 108 is ground floor blind hole, and 109 is second layer blind hole, as shown in Figure 4;
5) stick in third layer copper wire figure 107 side the protective layer 114 preventing liquid medicine from permeating, as shown in figure 12;
6) supporting bracket 100 is removed, as shown in figure 13;
7) by etch process, extra thin copper foil 101 is removed, exposes structure of sunkening cord---ground floor copper wire figure 102, as shown in figure 14;
8) peel off protective layer 114, and in the method for circuit board surface by chemical deposition, make one deck chemical copper conductting layer, the conductting layer of structure of sunkening cord side is 115, and the conductting layer of opposite side is 116, as shown in figure 15;
9) dry film is sticked in the circuit board both sides after sedimentation chemistry copper, and the dry film making copper post side is 117, and the dry film of opposite side is 118, as shown in figure 16;
10) windowed corresponding copper post position in dry film 117 side by exposure, developing process, and by electroplating technology, electro-coppering rod structure 112, as shown in figure 17;
11) dry film 117,118 is peeled off, as shown in figure 18;
12) by quick-etch process, will the chemical layers of copper removing of circuit board surface be deposited on, expose structure of sunkening cord--ground floor copper wire figure 102, forms complete Copper column structure 112, as shown in figure 19;
13) by aftertreatment technology, at circuit board surface coating solder mask 119, and carry out conservation treatment to the Copper column structure 112 revealed and circuit pack, Copper column structure 112 sealer OSP is 120, and circuit pack protective layer OSP is 121; So far, obtain based on the printed circuit board of structure with Copper column structure of sunkening cord, as shown in figure 20.
Because current consumer product is just towards the future development of " light, thin, short, little ", therefore, it is possible to the copper post making spacing less has obvious help for the lifting of product and the improvement of performance.The inventive method adopts half addition process, achieves the making of Small Distance Copper column structure.
The foregoing is only preferred embodiment of the present invention, be not used for limiting practical range of the present invention; Namely all equivalents done according to right of the present invention, are the claims in the present invention scope and cover.
Claims (17)
1. make a method for copper post based on structure of sunkening cord on a printed circuit board, comprise the steps:
1) formation copper post Copper Foil is attached to supporting bracket surface, wherein, the one side towards supporting bracket is the first surface forming copper post Copper Foil; One side back to supporting bracket is second that forms copper post Copper Foil;
2) in second method by graphic plating forming copper post Copper Foil, copper wire figure is made at copper foil surface;
3) press a dielectric layer material in the copper wire graphic design of copper foil surface, form structure of sunkening cord;
4) the tradition stratum compression technology of printed circuit board and the manufacture craft of copper wire figure is adopted to complete the making of sandwich construction;
5) supporting bracket is removed;
6) copper post is made by the method for graphic plating at copper foil surface at the first surface forming copper post Copper Foil; Or first by clean for the etching of the Copper Foil of pre-formed copper post side, then deposit one deck conductive layer, then by the method for graphic plating, make copper post;
7) printed circuit board one side surface forming copper post is not being needed to stick the protective layer preventing liquid medicine from permeating;
8) by quick-etch process, the conductive layer of printed circuit board copper post side is removed in etching, obtains copper post;
9) protective layer preventing liquid medicine from permeating is removed;
10) make solder mask on printed circuit board surface, make antioxidation coating on copper post surface, namely obtain the printed circuit board with chip interconnects docking Copper column structure.
2. the as claimed in claim 1 method making copper post based on structure of sunkening cord on a printed circuit board, is characterized in that, step 1) described in formation copper post copper thickness be 0.1 μm ~ 100 μm.
3. the method making copper post based on structure of sunkening cord on a printed circuit board as claimed in claim 1, it is characterized in that, step 1) described in formation copper post Copper Foil adopt thickness 1 ~ 3 μm of extra thin copper foil or the common Copper Foil that adopts thickness to be greater than 5 μm to reach extra thin copper foil thickness by thinning process for copper.
4. the as claimed in claim 1 method making copper post based on structure of sunkening cord on a printed circuit board, is characterized in that, step 3) described in dielectric layer material be pure resin material or the resin material containing glass fabric.
5. the method making copper post based on structure of sunkening cord on a printed circuit board as claimed in claim 4, it is characterized in that, step 3) described in pure resin material comprise epoxy resin, polyimides, poly maleimide cyanate resin, polyphenylene oxide or polytetrafluoroethylene; Resin material containing glass fabric comprises FR-4 or FR-5.
6. the method making copper post based on structure of sunkening cord on a printed circuit board as claimed in claim 1, it is characterized in that, step 1) in, by the method that formation copper post Copper Foil is attached to supporting bracket surface be: adopt between the common Copper Foil of carrier-free Copper Foil and the fringe region of supporting bracket and bond with stickum.
7. the method making copper post based on structure of sunkening cord on a printed circuit board as claimed in claim 6, it is characterized in that, step 5) by the method for supporting bracket removal, adopt and the fringe region adhesive segment of common Copper Foil and supporting bracket is cut, thus supporting bracket is removed.
8. the method making copper post based on structure of sunkening cord on a printed circuit board as claimed in claim 1, it is characterized in that, step 1) in, by the method that formation copper post Copper Foil is attached to supporting bracket surface be: adopt the extra thin copper foil containing carrier copper foil, bond with stickum between carrier copper foil and the whole plate region of supporting bracket.
9. the method making copper post based on structure of sunkening cord on a printed circuit board as claimed in claim 8, it is characterized in that, step 5) by the method that supporting bracket is removed be: be separated between carrier copper foil with the extra thin copper foil containing carrier copper foil, because carrier copper foil and supporting bracket whole plate region stickum bond, thus supporting bracket is removed together with carrier copper foil.
10. the method making copper post based on structure of sunkening cord on a printed circuit board as described in claim 6 or 8, it is characterized in that, described stickum is prepreg or resin, resin comprises phenolic resins, Corvic, mylar, epoxy resin, polyurethane, polyvinylesters, poly-fluororesin, poly-fluorocarbon resin, bismaleimide resins, poly-Malaysian amine cyanate resin, polyimide resin, poly-cyanate ester resin or epoxy radicals polyphenylene oxide.
The 11. as claimed in claim 1 methods making copper post based on structure of sunkening cord on a printed circuit board, is characterized in that, step 6) described in conductive layer be metal conducting layer, radio frequency layer or by metal, the nonmetal conducting resinl formed.
12. methods making copper post based on structure of sunkening cord on a printed circuit board as described in claim 1 or 11, is characterized in that, step 6) described in conductive layer be formed by the technique of chemical deposition or sputtering.
13. methods making copper post based on structure of sunkening cord on a printed circuit board as claimed in claim 11, it is characterized in that, the material of described metal conducting layer is the one in gold, silver, copper, tin, lead, aluminium, iron, nickel, cobalt, zinc, chromium, titanium, or leypewter, Kufil, ormolu, corronil, iron-nickel alloy, iron cobalt nickel alloy, one in iron-zinc alloy.
14. methods making copper post based on structure of sunkening cord on a printed circuit board as claimed in claim 11, it is characterized in that, the material of described radio frequency layer is the one in carbon, conducting polymer polymeric membrane.
15. methods making copper post based on structure of sunkening cord on a printed circuit board as claimed in claim 11, it is characterized in that, in described conducting resinl, metal ingredient is: gold, silver, copper, tin, lead, aluminium, iron, nickel, cobalt, zinc, chromium or titanium; Non-metallic components is: epoxy resin, phenolic resins, polybismaleimide cyanate resin, poly-cyanate ester resin, epoxy radicals polyphenylene oxide, polyimides, polytetrafluoroethylene or polybutylene terephthalate resin.
16. methods making copper post based on structure of sunkening cord on a printed circuit board as claimed in claim 1; it is characterized in that, step 7) described in the protective layer preventing liquid medicine from permeating be one in dry film, wet film, polyimides, epoxy resin, phenolic resins, polybismaleimide cyanate resin, poly-cyanate ester resin, epoxy radicals polyphenylene oxide, polyimides, polytetrafluoroethylene, polybutylene terephthalate resin.
17. methods making copper post based on structure of sunkening cord on a printed circuit board as claimed in claim 1; it is characterized in that, step 10) described in antioxidation coating adopt organic anti-welding diaphragm, chemical deposition or electronickelling gold, NiPdAu; chemistry or electrotinning, Xi Yin, SAC, chemistry silver.
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| CN108712824A (en) * | 2018-06-04 | 2018-10-26 | 南通海舟电子科技有限公司 | The two-sided anti-oxidation PCB circuit board production technology of high-performance |
| CN110719694A (en) * | 2019-09-17 | 2020-01-21 | 沪士电子股份有限公司 | Chemical nickel gold surface treatment method for polyphenylene ether-containing printed circuit board |
| CN111885812A (en) * | 2020-07-14 | 2020-11-03 | 珠海方正科技高密电子有限公司 | Circuit board and circuit board manufacturing method |
| WO2022121555A1 (en) * | 2020-12-07 | 2022-06-16 | 华为技术有限公司 | Circuit board, method for manufacturing circuit board and electronic device |
| CN115579329A (en) * | 2022-10-24 | 2023-01-06 | 深圳市驭鹰者电子有限公司 | Coreless flip substrate structure and manufacturing method |
| CN116507045A (en) * | 2023-06-26 | 2023-07-28 | 四川英创力电子科技股份有限公司 | Printed circuit board copper column processing method and printed circuit board |
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| CN110719694A (en) * | 2019-09-17 | 2020-01-21 | 沪士电子股份有限公司 | Chemical nickel gold surface treatment method for polyphenylene ether-containing printed circuit board |
| CN110719694B (en) * | 2019-09-17 | 2021-07-02 | 沪士电子股份有限公司 | Chemical nickel gold surface treatment method for polyphenylene ether-containing printed circuit board |
| CN111885812A (en) * | 2020-07-14 | 2020-11-03 | 珠海方正科技高密电子有限公司 | Circuit board and circuit board manufacturing method |
| WO2022121555A1 (en) * | 2020-12-07 | 2022-06-16 | 华为技术有限公司 | Circuit board, method for manufacturing circuit board and electronic device |
| CN115579329A (en) * | 2022-10-24 | 2023-01-06 | 深圳市驭鹰者电子有限公司 | Coreless flip substrate structure and manufacturing method |
| CN116507045A (en) * | 2023-06-26 | 2023-07-28 | 四川英创力电子科技股份有限公司 | Printed circuit board copper column processing method and printed circuit board |
| CN116507045B (en) * | 2023-06-26 | 2023-09-12 | 四川英创力电子科技股份有限公司 | Printed circuit board copper column processing method and printed circuit board |
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