CN108712824A - The two-sided anti-oxidation PCB circuit board production technology of high-performance - Google Patents
The two-sided anti-oxidation PCB circuit board production technology of high-performance Download PDFInfo
- Publication number
- CN108712824A CN108712824A CN201810562676.8A CN201810562676A CN108712824A CN 108712824 A CN108712824 A CN 108712824A CN 201810562676 A CN201810562676 A CN 201810562676A CN 108712824 A CN108712824 A CN 108712824A
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- China
- Prior art keywords
- double
- sided
- sided substrate
- carries out
- washing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses the two-sided anti-oxidation PCB circuit board production technologies of high-performance, include the following steps：Trepanning carries out surface acid-washing, surface polish-brush, washing process to two sides and dries；It is coated with photosensitive printing ink layer, and carries out baking drying process；The circuit of double-sided substrate is handled, cleaning removes black liquid, drying Double-sided copper clad laminate；It carries out surface acid-washing, the processing of surface polish-brush and washing process successively to the surface of double-sided substrate again, is coated with solder mask layer on the surface of double-sided substrate, and dry；Development treatment is carried out, corresponding item number in printing carries out baking processing, makes solder mask layer and word ink solidification；Mechanical hole is handled, machining is carried out, double-sided substrate after molding is cleaned；It carries out short circuit current and open circuit detects；It is tin plating on Double-sided copper clad laminate two sides, finished product is obtained, step of the present invention is simple, easy to implement, simple operation, and the end properties of making are good, and oxidation resistance is strong.
Description
Technical field
The present invention relates to a kind of PCB circuit board production technology, more particularly to a kind of two-sided anti-oxidation PCB circuit board of high-performance
Production technology.
Background technology
PCB circuit board, also known as printed circuit board are the suppliers of electronic component electrical connection.Its development has 100
History for many years；Its design is mainly layout design；Major advantage using circuit board is to greatly reduce wiring and assembly
Mistake, improve the gentle productive labor rate of Automated water.
Invention content
The purpose of the present invention is to provide a kind of two-sided anti-oxidation PCB circuit board production technologies of high-performance.
The technical solution adopted by the present invention is：
The two-sided anti-oxidation PCB circuit board production technology of high-performance, it is characterised in that：Include the following steps：
Step 1：Double-sided substrate is cut to required size, location hole is opened up in the marginal position of double-sided substrate, after to two-sided base
The two sides of plate carries out surface acid-washing, surface polish-brush, washing process and dries successively；
Step 2：It is coated with photosensitive printing ink layer on the surface of double-sided substrate using ink coating wheel, and photosensitive printing ink layer is toasted
It is dried；
Step 3：The circuit for handling double-sided substrate, using going black liquid to remove the photosensitive printing ink layer of circuit surface, cleaning removes
Black liquid, drying Double-sided copper clad laminate；
Step 4：It carries out surface acid-washing, the processing of surface polish-brush and washing process successively to the surface of double-sided substrate again, and uses
Ink coating wheel is coated with solder mask layer on the surface of double-sided substrate, and solder mask layer is toasted and is done；
Step 5：Double-sided substrate is placed in developing machine and carries out development treatment, corresponding item number in printing, finally to double-sided substrate
Baking processing is carried out, solder mask layer and word ink solidification are made；
Step 6：The mechanical hole in double-sided substrate is handled, machining is carried out to double-sided substrate, finally to two-sided base after molding
Plate is cleaned, and makees drying and processing after removing remaining aluminium skimmings and plate powder；
Step 7：Short circuit current is carried out to double-sided substrate after molding respectively and open circuit detects；
Step 8：Surface acid-washing, surface polish-brush, washing process are carried out successively to the two sides of double-sided substrate and dried, in two-sided copper foil
Substrate two sides is tin plating, obtains finished product.
Advantages of the present invention：Step is simple, easy to implement, simple operation, and the end properties of making are good, oxidation resistance
By force.
Specific implementation mode
The two-sided anti-oxidation PCB circuit board production technology of high-performance, includes the following steps：
Step 1：Double-sided substrate is cut to required size, location hole is opened up in the marginal position of double-sided substrate, after to two-sided base
The two sides of plate carries out surface acid-washing, surface polish-brush, washing process and dries successively；
Step 2：It is coated with photosensitive printing ink layer on the surface of double-sided substrate using ink coating wheel, and photosensitive printing ink layer is toasted
It is dried；
Step 3：The circuit for handling double-sided substrate, using going black liquid to remove the photosensitive printing ink layer of circuit surface, cleaning removes
Black liquid, drying Double-sided copper clad laminate；
Step 4：It carries out surface acid-washing, the processing of surface polish-brush and washing process successively to the surface of double-sided substrate again, and uses
Ink coating wheel is coated with solder mask layer on the surface of double-sided substrate, and solder mask layer is toasted and is done；
Step 5：Double-sided substrate is placed in developing machine and carries out development treatment, corresponding item number in printing, finally to double-sided substrate
Baking processing is carried out, solder mask layer and word ink solidification are made；
Step 6：The mechanical hole in double-sided substrate is handled, machining is carried out to double-sided substrate, finally to two-sided base after molding
Plate is cleaned, and makees drying and processing after removing remaining aluminium skimmings and plate powder；
Step 7：Short circuit current is carried out to double-sided substrate after molding respectively and open circuit detects；
Step 8：Surface acid-washing, surface polish-brush, washing process are carried out successively to the two sides of double-sided substrate and dried, in two-sided copper foil
Substrate two sides is tin plating, obtains finished product.
Step of the present invention is simple, easy to implement, simple operation, and the end properties of making are good, and oxidation resistance is strong.
Claims (1)
1. the two-sided anti-oxidation PCB circuit board production technology of high-performance, it is characterised in that：Include the following steps：
Step 1：Double-sided substrate is cut to required size, location hole is opened up in the marginal position of double-sided substrate, after to two-sided base
The two sides of plate carries out surface acid-washing, surface polish-brush, washing process and dries successively；
Step 2：It is coated with photosensitive printing ink layer on the surface of double-sided substrate using ink coating wheel, and photosensitive printing ink layer is toasted
It is dried；
Step 3：The circuit for handling double-sided substrate, using going black liquid to remove the photosensitive printing ink layer of circuit surface, cleaning removes
Black liquid, drying Double-sided copper clad laminate；
Step 4：It carries out surface acid-washing, the processing of surface polish-brush and washing process successively to the surface of double-sided substrate again, and uses
Ink coating wheel is coated with solder mask layer on the surface of double-sided substrate, and solder mask layer is toasted and is done；
Step 5：Double-sided substrate is placed in developing machine and carries out development treatment, corresponding item number in printing, finally to double-sided substrate
Baking processing is carried out, solder mask layer and word ink solidification are made；
Step 6：The mechanical hole in double-sided substrate is handled, machining is carried out to double-sided substrate, finally to two-sided base after molding
Plate is cleaned, and makees drying and processing after removing remaining aluminium skimmings and plate powder；
Step 7：Short circuit current is carried out to double-sided substrate after molding respectively and open circuit detects；
Step 8：Surface acid-washing, surface polish-brush, washing process are carried out successively to the two sides of double-sided substrate and dried, in two-sided copper foil
Substrate two sides is tin plating, obtains finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810562676.8A CN108712824A (en) | 2018-06-04 | 2018-06-04 | The two-sided anti-oxidation PCB circuit board production technology of high-performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810562676.8A CN108712824A (en) | 2018-06-04 | 2018-06-04 | The two-sided anti-oxidation PCB circuit board production technology of high-performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108712824A true CN108712824A (en) | 2018-10-26 |
Family
ID=63870308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810562676.8A Withdrawn CN108712824A (en) | 2018-06-04 | 2018-06-04 | The two-sided anti-oxidation PCB circuit board production technology of high-performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108712824A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113365432A (en) * | 2020-03-05 | 2021-09-07 | 竞华电子(深圳)有限公司 | Method for improving character jet printing adhesion and printed circuit board |
| CN114578029A (en) * | 2022-03-02 | 2022-06-03 | 江苏可信电子材料有限公司 | PCB solder mask ink performance testing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1386395A (en) * | 2000-07-18 | 2002-12-18 | 松下电器产业株式会社 | Circuit board and method for manufacturing the same, and electronic apparatus comprising it |
| CN101521991A (en) * | 2009-04-13 | 2009-09-02 | 深圳市源基电子科技有限公司 | Manufacturing method of circuit board with selectively plated copper and tin |
| CN104902696A (en) * | 2015-06-24 | 2015-09-09 | 上海美维科技有限公司 | Method of manufacturing copper column on printed circuit board based on wire embedding structure |
| CN105555046A (en) * | 2015-12-31 | 2016-05-04 | 东莞市优森电子有限公司 | Production technology of double-sided PCB |
| CN105578784A (en) * | 2015-12-31 | 2016-05-11 | 东莞市优森电子有限公司 | Production technology for single-sided PCB |
-
2018
- 2018-06-04 CN CN201810562676.8A patent/CN108712824A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1386395A (en) * | 2000-07-18 | 2002-12-18 | 松下电器产业株式会社 | Circuit board and method for manufacturing the same, and electronic apparatus comprising it |
| CN101521991A (en) * | 2009-04-13 | 2009-09-02 | 深圳市源基电子科技有限公司 | Manufacturing method of circuit board with selectively plated copper and tin |
| CN104902696A (en) * | 2015-06-24 | 2015-09-09 | 上海美维科技有限公司 | Method of manufacturing copper column on printed circuit board based on wire embedding structure |
| CN105555046A (en) * | 2015-12-31 | 2016-05-04 | 东莞市优森电子有限公司 | Production technology of double-sided PCB |
| CN105578784A (en) * | 2015-12-31 | 2016-05-11 | 东莞市优森电子有限公司 | Production technology for single-sided PCB |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113365432A (en) * | 2020-03-05 | 2021-09-07 | 竞华电子(深圳)有限公司 | Method for improving character jet printing adhesion and printed circuit board |
| CN114578029A (en) * | 2022-03-02 | 2022-06-03 | 江苏可信电子材料有限公司 | PCB solder mask ink performance testing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181026 |