CN101835351B - Manufacture process of sectional golden finger - Google Patents

Manufacture process of sectional golden finger Download PDF

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Publication number
CN101835351B
CN101835351B CN2010101420948A CN201010142094A CN101835351B CN 101835351 B CN101835351 B CN 101835351B CN 2010101420948 A CN2010101420948 A CN 2010101420948A CN 201010142094 A CN201010142094 A CN 201010142094A CN 101835351 B CN101835351 B CN 101835351B
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CN
China
Prior art keywords
golden finger
substrate
copper
brown
gold
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Application number
CN2010101420948A
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Chinese (zh)
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CN101835351A (en
Inventor
李叶飞
张育猛
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梅州市志浩电子科技有限公司
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Priority to CN2010101420948A priority Critical patent/CN101835351B/en
Publication of CN101835351A publication Critical patent/CN101835351A/en
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Publication of CN101835351B publication Critical patent/CN101835351B/en

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Abstract

The invention provides a manufacture process of a sectional golden finger, wherein the structure of a golden finger is manufactured on a substrate. The structure of a golden finger comprises a segmented gold finger structure and a continuous gold finger structure. The method for manufacturing the segmented gold finger structure comprises the steps of providing a slab, drilling, copper-clad plate electrofacing, browning, outer-layer pattern converting, pattern plating, secondary film drying, solid gold plating, film removing and etching, exposing and solder mask, writing and piling plates. Therefore, a V-cut and a golden finger bevel are formed. The manufacture process of the sectional golden finger has the advantage of improving the stability of external connection of the golden finger.

Description

The sectional golden finger manufacture method

Technical field

The present invention relates to a kind of manufacture method, relate in particular to a kind of printed circuit board (PCB) (PCB) manufacturing approach that forms sectional golden finger.

Background technology

, numerous advantages such as integrated level high, portability and versatility low along with its cost, printed circuit board (PCB) has occupied numerous products highland in industrialization epoch at present.

Golden finger occupies critical positions in printed circuit board (PCB), because the golden finger front end that electrically connects of printed circuit board (PCB) and exterior electrical components normally, so its electric conductivity and connective stability are all concerning the quality of printed circuit board (PCB).

Common golden finger is to extend continuously, and when this in use possibly exist golden finger and externally connects, its connective stability was good inadequately, such as coming off easily etc., thereby influences the electric property of corresponding product.

Summary of the invention

Golden finger to existing printed circuit board (PCB) possibly cause the connection problem of unstable, and the present invention provides a kind of can form the stable sectional golden finger manufacture method that connects.

A kind of sectional golden finger manufacture method is made the golden finger structure on substrate, said golden finger structure comprises sectional golden finger structure and continous way golden finger structure, may further comprise the steps in order:

Sheet material is provided: provide one wait to make golden finger the PCB substrate, said PCB substrate will be used for making golden finger above that through after opening operations processing such as material, internal layer figure commentaries on classics, acid etching and brown lamination;

Boring: before boring, substrate is carried out specification, visual inspection, next, then the sheet material after the boring is checked in preset position boring;

Heavy copper coin: on the base material of having holed, with deposition thin copper layer in the hole wall of chemical method, the substrate to heavy copper carries out electric plating of whole board then, makes the thick preset standard that reaches of electro-coppering;

Brown: before carrying out skin figure commentaries on classics, substrate is carried out brown handle, so that its surface forms brown oxide layer, inspection central layer brown film has or not dew copper phenomenon after the brown;

Outer figure changes: after boring and electroplating, ectonexine is communicated with, with the copper face clean, carries out press mold then, continue exposure again and develop, thereby the formation outer-layer circuit is electrical complete to reach;

Graphic plating: copper is thick in thickening circuit and the hole, comprises copper facing, nickel plating and gold-plated;

The secondary dry film: clean substrate, and with washing the plate machine substrate is dried, carry out press mold once more, wherein, to change direction behind the press mold and carry out pneumatics once, to increase the adhesion of dry film; Make public then and develop, exposure energy is 7 grades, thereby is windowed in the golden finger position;

The hard gold of electricity: electrogilding makes the copper laminar surface plate the good hard gold of resistance to wear; Wherein in the hard metal working preface of electricity, the not electric nickel of only electric gold, making gold thick is 0.8 micron;

Move back the film etching: remove anti-plate covering rete with moving back coating solution, make logicalnot circuit copper layer expose out; After moving back the film completion, get into etching work procedure, utilize chemical reaction that the copper layer corrosion at logicalnot circuit position removed;

Exposure resistance weldering: the figure transfer of the green oil film is arrived substrate, the effect of tin on the circuit when playing protection circuit and stoping soldering part;

Literal: use printing ink on substrate, to form the mark of being convenient to recognize;

Gong plate: the objective circuit plate is cut down from substrate, go out the needed shape moulding of client through die stamping or numerical control gong machine gong;

Form V-CUT: the V-CUT structure that formation needs on substrate;

Golden finger hypotenuse: use the golden finger bevelling machine, golden finger is made the hypotenuse of preset requirement.

Sectional golden finger manufacture method of the present invention; Can on printed circuit board base board, form the golden finger structure of part segmented; Thereby printed circuit board (PCB) is when externally connecting, and said sectional golden finger structure can form suitable snap-fit relationship in the junction, makes to connect difficult drop-off; Thereby strengthen external connection stability, improve the stability of corresponding product.Therefore, said sectional golden finger manufacture method of the present invention has the advantage that improves the external connective stability of golden finger.

Description of drawings

Accompanying drawing is the structural representation of sectional golden finger involved in the present invention.

Embodiment

Sectional golden finger manufacture method of the present invention is on printed circuit board base board; Form as sectional golden finger structure shown in the drawings; Formed sectional golden finger structure can be when connecting with corresponding electronic component; Form suitable snap-in structure, thereby improve the golden finger connection stability.

The step that said sectional golden finger manufacture method mainly comprises has: sheet material → boring → heavy copper coin electricity → brown → skin figure commentaries on classics → graphic plating → secondary dry film → electricity is provided, and gold → moving back film etching → exposure hinders weldering → literal → gong plate → formation V-CUT → golden finger hypotenuse firmly.Wherein, simply being described below of each step:

Step 1 provides sheet material: provide one wait to make golden finger the PCB substrate, said PCB substrate will be used for making golden finger above that through after opening operations processing such as material, internal layer figure commentaries on classics, acid etching and brown lamination.

Step 2, boring: before boring, need test to substrate; For example its specification etc. reexamines its outward appearance, and whether defectives such as scratch, bending, distortion are arranged; Next in preset position boring; For example hole, then the sheet material after the boring is checked, whether have defectives such as brill is inclined to one side, plug-hole through drilling machine.

Step 3, heavy copper coin: on the base material of having holed, with deposition thin copper layer in the hole wall of chemical method, the substrate to heavy copper carries out electric plating of whole board then, makes the thick preset standard that reaches of electro-coppering.

Step 4, brown: before carrying out skin figure commentaries on classics, substrate is carried out the brown processing,, need after the brown to check that central layer brown film has or not dew copper phenomenon so that its surface forms brown oxide layer.

Step 5, outer figure changes: after boring and electroplating, ectonexine is communicated with, with the copper face clean, carries out press mold then, continue exposure again and develop, thereby the formation outer-layer circuit is electrical complete to reach.Wherein, press mold can manual press mold or machine press mold.

Step 6, graphic plating: copper is thick in thickening circuit and the hole, makes product reach customer requirement, comprises copper facing, nickel plating and gold-plated, and this wherein also comprises conventional washing and acidleach process.

Step 7, the secondary dry film: clean substrate, and with washing the plate machine substrate is dried, carry out press mold once more, wherein, to change direction behind the press mold and carry out pneumatics once, to increase the adhesion of dry film; Make public then and develop, exposure energy is 7 grades, thereby is windowed in the golden finger position.

Step 8, the hard gold of electricity: electrogilding makes the copper laminar surface plate the good hard gold of resistance to wear.Wherein in the hard metal working preface of electricity, the not electric nickel of only electric gold, making gold thick is 0.8 micron (um).

Step 9 is moved back the film etching: remove anti-plate covering rete with moving back coating solution, make logicalnot circuit copper layer expose out, wherein move back coating solution and can select the alkaline solution that contains NaOH (NaOH) for use.After moving back the film completion, get into etching work procedure, utilize chemical reaction that the copper layer corrosion at logicalnot circuit position removed.

Step 10, exposure resistance weldering: the figure transfer of the green oil film is arrived substrate, the effect of tin on the circuit when playing protection circuit and stoping soldering part.Wherein, substrate need be through washing the oven dry of plate machine, and it is roasting in advance to cross the tunnel behind the stamp-pad ink, and exposure energy is 11 grades.

Step 11, literal: use printing ink on substrate, to form the mark of being convenient to recognize.

Step 12; Gong plate: owing to possibly comprise a plurality of objective circuit plates on a PCB substrate; So need the objective circuit plate be cut down from substrate, go out the needed shape moulding of client through die stamping or numerical control gong machine gong, the organic gong of common method, hand gong and hand are cut etc.

Step 13 forms V-CUT: use the manual V-CUT machine V-CUT structure that formation needs on substrate.

Step 14, golden finger hypotenuse: use the golden finger bevelling machine, golden finger is made the hypotenuse of preset requirement.

Adopt sectional golden finger manufacture method of the present invention; Can on printed circuit board base board, form the golden finger structure of part segmented; Thereby printed circuit board (PCB) is when externally connecting, and said sectional golden finger structure can form suitable snap-fit relationship in the junction, makes to connect difficult drop-off; Thereby strengthen external connection stability, improve the stability of corresponding product.

In sum, said sectional golden finger manufacture method of the present invention has the advantage that improves the external connective stability of golden finger.

More than be merely preferred case study on implementation of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various changes and variation.All within spirit of the present invention and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.

Claims (1)

1. a sectional golden finger manufacture method is made the golden finger structure on substrate, and said golden finger structure comprises sectional golden finger structure and continous way golden finger structure, and it may further comprise the steps in order:
Sheet material is provided: provide one wait to make golden finger the PCB substrate, said PCB substrate will be used for making golden finger above that through after opening operations processing such as material, internal layer figure commentaries on classics, acid etching and brown lamination;
Boring: before boring, substrate is carried out specification, visual inspection, next, then the sheet material after the boring is checked in preset position boring;
Heavy copper coin: on the base material of having holed, with deposition thin copper layer in the hole wall of chemical method, the substrate to heavy copper carries out electric plating of whole board then, makes the thick preset standard that reaches of electro-coppering;
Brown: before carrying out skin figure commentaries on classics, substrate is carried out brown handle, so that its surface forms brown oxide layer, inspection central layer brown film has or not dew copper phenomenon after the brown;
Outer figure changes: after boring and electroplating, ectonexine is communicated with, with the copper face clean, carries out press mold then, continue exposure again and develop, thereby the formation outer-layer circuit is electrical complete to reach;
Graphic plating: copper is thick in thickening circuit and the hole, comprises copper facing, nickel plating and gold-plated;
The secondary dry film: clean substrate, and with washing the plate machine substrate is dried, carry out press mold once more, wherein, to change direction behind the press mold and carry out pneumatics once, to increase the adhesion of dry film; Make public then and develop, exposure energy is 7 grades, thereby is windowed in the golden finger position;
The hard gold of electricity: electrogilding makes the copper laminar surface plate the good hard gold of resistance to wear; Wherein in the hard metal working preface of electricity, the not electric nickel of only electric gold, making gold thick is 0.8 micron;
Move back the film etching: remove anti-plate covering rete with moving back coating solution, make logicalnot circuit copper layer expose out; After moving back the film completion, get into etching work procedure, utilize chemical reaction that the copper layer corrosion at logicalnot circuit position removed;
Exposure resistance weldering: the figure transfer of the green oil film is arrived substrate, the effect of tin on the circuit when playing protection circuit and stoping soldering part;
Literal: use printing ink on substrate, to form the mark of being convenient to recognize;
Gong plate: the objective circuit plate is cut down from substrate, go out the needed shape moulding of client through die stamping or numerical control gong machine gong;
Form V-CUT: the V-CUT structure that formation needs on substrate;
Golden finger hypotenuse: use the golden finger bevelling machine, golden finger is made the hypotenuse of preset requirement.
CN2010101420948A 2010-04-08 2010-04-08 Manufacture process of sectional golden finger CN101835351B (en)

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Application Number Priority Date Filing Date Title
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CN101835351B true CN101835351B (en) 2012-09-05

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Families Citing this family (14)

* Cited by examiner, † Cited by third party
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CN102573302A (en) * 2010-12-29 2012-07-11 北大方正集团有限公司 Method, device and system for processing circuit board
CN102958280B (en) * 2011-08-24 2015-06-03 深南电路有限公司 Method for gold-plating sectional gold fingers
CN103108500B (en) * 2011-11-10 2016-03-30 珠海方正科技多层电路板有限公司 A kind of method making sectional golden finger
CN102361535B (en) * 2011-11-11 2013-10-30 厦门爱谱生电子科技有限公司 Flexible circuit board with impending splicing fingers and manufacturing method for flexible circuit board
CN102689872B (en) * 2012-04-27 2015-12-09 深圳光启高等理工研究院 A kind of processing method of Meta Materials
CN103237421B (en) * 2013-04-26 2016-08-10 胜宏科技(惠州)股份有限公司 A kind of PCB segmentation golden finger preparation method
KR101340872B1 (en) * 2013-07-05 2013-12-12 주식회사 에스아이 플렉스 Composite coating shielding method using ink detachment type
CN104175737A (en) * 2014-08-21 2014-12-03 江苏迪飞达电子有限公司 Manufacturing method of characters on PCB (Printed Circuit Board)
CN104202909A (en) * 2014-09-16 2014-12-10 四川海英电子科技有限公司 High-thermal-conductivity metal circuit board production method
CN105764271A (en) * 2016-04-28 2016-07-13 江苏博敏电子有限公司 Manufacturing process for memory bank module circuit board
TWI658759B (en) * 2017-09-25 2019-05-01 健鼎科技股份有限公司 Method of manufacturing gold finger structure
CN108055785A (en) * 2017-11-27 2018-05-18 大连崇达电路有限公司 A kind of figure nickel gold process of optimization
CN108347835A (en) * 2018-03-26 2018-07-31 珠海市金顺电子科技有限公司 A kind of single layer circuit board producing method
CN108391387A (en) * 2018-04-03 2018-08-10 广德今腾电子科技有限公司 A kind of processing technology of printed circuit board electroplating finger

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1468045A (en) * 2002-07-08 2004-01-14 联测科技股份有限公司 Structure of printed circuit board
CN101355856A (en) * 2008-08-13 2009-01-28 东莞生益电子有限公司 Method for preparing hierarchical and grading gold finger plate using method of selecting wet film
CN101521997A (en) * 2008-02-29 2009-09-02 中兴通讯股份有限公司 Method for processing grading connecting finger
CN101643927A (en) * 2008-08-05 2010-02-10 北大方正集团有限公司 Method for manufacturing printed circuit board edge connector

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1468045A (en) * 2002-07-08 2004-01-14 联测科技股份有限公司 Structure of printed circuit board
CN101521997A (en) * 2008-02-29 2009-09-02 中兴通讯股份有限公司 Method for processing grading connecting finger
CN101643927A (en) * 2008-08-05 2010-02-10 北大方正集团有限公司 Method for manufacturing printed circuit board edge connector
CN101355856A (en) * 2008-08-13 2009-01-28 东莞生益电子有限公司 Method for preparing hierarchical and grading gold finger plate using method of selecting wet film

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