CN103945660A - Production technology for multilayer circuit board - Google Patents
Production technology for multilayer circuit board Download PDFInfo
- Publication number
- CN103945660A CN103945660A CN201310545451.9A CN201310545451A CN103945660A CN 103945660 A CN103945660 A CN 103945660A CN 201310545451 A CN201310545451 A CN 201310545451A CN 103945660 A CN103945660 A CN 103945660A
- Authority
- CN
- China
- Prior art keywords
- copper
- plate
- layer
- layer sheet
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a production technology for a multilayer circuit board. The production technology is characterized by comprising the following steps: A. internal layer material cutting; B. internal layer board grinding; C. wet film silk-screening; D. drying; E. exposure; F. development; G. etching; H. film removing; I. AOI inspection; J. brownification; K. typesetting; L. stitching; M. side routing; N. hole drilling; O. board grinding; P. copper sinking; Q. anti-oxidation processing; R. panel electroplating; S. line board grinding; T; film pasting; U. line exposure; V. line development; W. tin electroplating; X. film removing; Y. etching; Z. tin removing; AA. corrosion inspection; BB. green oil board grinding; CC. green oil; DD. white character silk-screening; EE. surface processing; FF. formation processing; GG. test; HH. FQC; and II. packaging. The invention provides the production technology for the multilayer circuit board with the objective of overcoming defects in the prior art, and the production technology is simple in technology, convenient to process and high in product percent of pass.
Description
Technical field
The present invention relates to a kind of production technology of multilayer circuit board.
Background technology
Existing multilayer circuit board production technology is generally relatively complicated, and making is got up cumbersome, in wiring board production process, after heavy copper, arrive next panel plating operation, need be immersed in the dilute sulfuric acid liquid medicine of 0.05-0.1%, prevent oxidation in plate face and hole, prevention product is bad after electroplating; But dilute sulfuric acid is removed power to greasy dirt by force simultaneously can microetch copper, and soak time must be controlled and can not exceed 4 hours, otherwise can cause Kong Wutong after the thin copper microetch of one deck of hole wall on heavy, and the per tour of dilute sulfuric acid liquid medicine need be changed cylinder once.Because the strict time is controlled restriction, bring very big inconvenience to production operation control, and easily produce quality problem.So the production technology of existing multilayer circuit board awaits further perfect.
Summary of the invention
The object of the invention is, in order to overcome weak point of the prior art, provides a kind of technique simple, easy to process, the much higher layer circuit board production technology of conforming product rate.
In order to achieve the above object, the present invention adopts following scheme:
A production technology for multilayer circuit board, is characterized in that comprising the following steps:
A, internal layer sawing sheet:
The size that meets designing requirement will be cut out out for the copper-clad plate of making inner plating;
B: internal layer nog plate:
Adopt the plate face of copper-clad plate in the alligatoring of nog plate equipment, cleaning A;
C, silk-screen wet film
In the copper-clad plate of the method for employing silk-screen in step B, print one deck wet film;
D, oven dry:
The copper-clad plate that is printed on wet film in step C is dried;
E, exposure:
Copper-clad plate in step D is put under ultraviolet light and is exposed;
F, development:
Adopt developer solution to remove the wet film layer that there is no exposure in step e on copper-clad plate plate face;
G, etching:
With etching solution, the copper layer exposed part that there is no wet film layer protection removed, retained the copper layer as circuit;
H, move back film:
Film on copper-clad plate plate face in step G is all returned, exposed the copper layer as circuit;
I, AOI check:
Adopt automated optical inspection to check in step H the whether qualified of circuit in copper-clad plate;
J, brown:
Alligatoring is as each copper face and the circuit of internal layer;
K, typesetting:
Each inside/outside layer layer is all stacked;
L, pressing:
Superimposed good each copper-clad plate in step K is pressed together, become multi-layer sheet;
M, gong limit:
Utilize numerical control plate-milling machine edges of boards mill off unnecessary multi-layer sheet in step L;
N, boring:
Get out respectively the through hole on multi-layer sheet and beat component hole;
O, nog plate:
Adopt the alligatoring of nog plate equipment, clean multiple-plate plate face;
P, heavy copper:
Utilize chemical method, deposit a bronze medal layer at multiple-plate plate face, through hole and in beating component hole;
Q, anti-oxidation processing:
Multi-layer sheet in step P is put into anti-oxidation liquid medicine to be soaked;
R, panel plating:
Monoblock multi-layer sheet is electroplated to thickening plate face, through hole and beat the copper of component hole;
S, circuit nog plate:
Adopt multiple-plate plate face in the alligatoring of nog plate equipment, cleaning R;
T, pad pasting:
In step S, on multi-layer sheet plate face, stick respectively one deck dry film;
U, circuit exposure:
Multi-layer sheet in step T is sent into exposure sources and carry out exposure-processed;
V, circuit develop:
Multi-layer sheet in step U is carried out to development treatment;
W, electrotinning:
To electroplating one deck protection tin on the multi-layer sheet plate face in step V;
X, move back film:
The dry film being attached in step W is all returned, exposed copper face;
Y, etching:
By removing without the copper layer exposed part of tin protection, retain the copper layer as circuit with etching solution;
Z, move back tin:
Adopt tin stripping liquid by the protection tin in step Y;
AA, erosion inspection:
Whether detecting step Z moves back after tin on multi-layer sheet circuit qualified;
BB, green oil nog plate:
Adopt Plate grinder to polish to the multi-layer sheet plate face in steps A A;
CC, green oil:
In step BB, on multi-layer sheet plate face, silk-screen one deck plays the green ink of insulating effect respectively;
DD, silk-screen wrongly written or mispronounced character:
In step CC, on multi-layer sheet panel, silk-screen is identified the word of use when playing element;
EE, surface treatment:
On multi-layer sheet plate face in step DD, paste one deck oxidation-resistant film;
FF, processing and forming:
Multi-layer sheet gong in step e E is gone out to finished product profile;
GG, test:
To the multi-layer sheet in step F F open, short-circuit test;
HH、FQC：
Finished product inspection, has been confirmed whether function and problem of appearance;
II, packaging:
The qualified packing of product will be detected in step HH.
The production technology of a kind of multilayer circuit board as above, is characterized in that the anti-oxidation liquid medicine described in step Q is the sodium carbonate liquor of mass concentration 0.7-0.15%.
The production technology of a kind of multilayer circuit board as above, is characterized in that the UV ink described in step C is composed of the following components by weight percentage:
The production technology of a kind of multilayer circuit board as above, is characterized in that the tin stripping liquid described in step Z is composed of the following components by weight percentage:
The production technology of a kind of multilayer circuit board as above, is characterized in that the green oil described in step CC specifically comprises the following steps:
CC1, silk-screen green oil:
Adopt the mode of silk-screen on copper-clad plate two sides, to print respectively one deck green oil;
CC2, baking sheet:
At 40-60 DEG C, the copper-clad plate of oiling green oil in step S1 is dried;
CC3, green oil exposure:
In copper-clad plate in step S2, stick an exposure film, exposure-processed under ultraviolet light;
CC4, green oil develop
The green oil that is provided with lightproof area during by exposure rinses out, and makes copper face out exposed.
In sum, beneficial effect of the present invention:
Technique of the present invention is simple, easy to make, and conforming product rate is high.The soaking in sodium carbonate solution electroplated plate that uses 0.7-1.5% after heavy copper, it is strong that this liquid medicine is alkaline contamination resistance, can microetch copper, change cylinder frequency and once extended to once in a week by per tour.Soak time is not strict with, and production operation is convenient.Product quality is more stable.After heavy copper, there is following advantage with the soaking in sodium carbonate solution electroplated plate of 0.7-1.5%: 1, contamination resistance is strong, and follow-up electroplating quality is good; 2, soak for a long time quality without impact, production operation is more convenient; 3, change cylinder frequency and once extended to once in a week by per tour, cost-saving, promoted efficiency; 4, can microetch copper, quality is more stable
Embodiment
Below in conjunction with embodiment, the present invention is described further:
Embodiment 1
A production technology for multilayer circuit board, comprises the following steps:
A, internal layer sawing sheet:
The size that meets designing requirement will be cut out out for the copper-clad plate of making inner plating;
B: internal layer nog plate:
Adopt the plate face of copper-clad plate in the alligatoring of nog plate equipment, cleaning A;
C, silk-screen wet film
In the copper-clad plate of the method for employing silk-screen in step B, print one deck wet film;
D, oven dry:
The copper-clad plate that is printed on wet film in step C is dried;
E, exposure:
Copper-clad plate in step D is put under ultraviolet light and is exposed;
F, development:
Adopt developer solution to remove the wet film layer that there is no exposure in step e on copper-clad plate plate face;
G, etching:
With etching solution, the copper layer exposed part that there is no wet film layer protection removed, retained the copper layer as circuit;
H, move back film:
Film on copper-clad plate plate face in step G is all returned, exposed the copper layer as circuit;
I, AOI check:
Adopt automated optical inspection to check in step H the whether qualified of circuit in copper-clad plate;
J, brown:
Alligatoring is as each copper face and the circuit of internal layer;
K, typesetting:
Each inside/outside layer layer is all stacked;
L, pressing:
Superimposed good each copper-clad plate in step K is pressed together, become multi-layer sheet;
M, gong limit:
Utilize numerical control plate-milling machine edges of boards mill off unnecessary multi-layer sheet in step L;
N, boring:
Get out respectively the through hole on multi-layer sheet and beat component hole;
O, nog plate:
Adopt the alligatoring of nog plate equipment, clean multiple-plate plate face;
P, heavy copper:
Utilize chemical method, deposit a bronze medal layer at multiple-plate plate face, through hole and in beating component hole;
Q, anti-oxidation processing:
Multi-layer sheet in step P is put into anti-oxidation liquid medicine to be soaked; Wherein said anti-oxidation liquid medicine is the sodium carbonate liquor of mass concentration 1.5%;
R, panel plating:
Monoblock multi-layer sheet is electroplated to thickening plate face, through hole and beat the copper of component hole;
S, circuit nog plate:
Adopt multiple-plate plate face in the alligatoring of nog plate equipment, cleaning R;
T, pad pasting:
Difference last layer dry film on multi-layer sheet plate face in step S;
U, circuit exposure:
Multi-layer sheet in step T is sent into exposure sources and carry out exposure-processed;
V, circuit develop:
Multi-layer sheet in step U is carried out to development treatment;
W, electrotinning:
To electroplating one deck protection tin on the multi-layer sheet plate face in step V;
X, move back film:
The dry film being attached in step W is all returned, exposed copper face;
Y, etching:
By removing without the copper layer exposed part of tin protection, retain the copper layer as circuit with etching solution;
Z, move back tin:
Adopt tin stripping liquid by the protection tin in step Y; Described tin stripping liquid is composed of the following components by weight percentage:
AA, erosion inspection:
Whether detecting step Z moves back after tin on multi-layer sheet circuit qualified;
BB, green oil nog plate:
Adopt Plate grinder to polish to the multi-layer sheet plate face in steps A A;
CC, green oil:
In step BB, on multi-layer sheet plate face, silk-screen one deck plays the green ink of insulating effect respectively; Wherein said green oil specifically comprises the following steps:
CC1, silk-screen green oil:
Adopt the mode of silk-screen on copper-clad plate two sides, to print respectively one deck green oil;
CC2, baking sheet:
At 40-60 DEG C, the copper-clad plate of oiling green oil in step S1 is dried;
CC3, green oil exposure:
In copper-clad plate in step S2, stick an exposure film, exposure-processed under ultraviolet light;
CC4, green oil develop
The green oil that is provided with lightproof area during by exposure rinses out, and makes copper face out exposed.
DD, silk-screen wrongly written or mispronounced character:
In step CC, on multi-layer sheet panel, silk-screen is identified the word of use when playing element;
EE, surface treatment:
On multi-layer sheet plate face in step DD, paste one deck oxidation-resistant film;
FF, processing and forming:
Multi-layer sheet gong in step e E is gone out to finished product profile;
GG, test:
To the multi-layer sheet in step F F open, short-circuit test;
HH、FQC：
Finished product inspection, has been confirmed whether function and problem of appearance;
II, packaging:
The qualified packing of product will be detected in step HH.
Embodiment 2
A production technology for multilayer circuit board, comprises the following steps:
A, internal layer sawing sheet:
The size that meets designing requirement will be cut out out for the copper-clad plate of making inner plating;
B: internal layer nog plate:
Adopt the plate face of copper-clad plate in the alligatoring of nog plate equipment, cleaning A;
C, silk-screen wet film
In the copper-clad plate of the method for employing silk-screen in step B, print one deck wet film;
D, oven dry:
The copper-clad plate that is printed on wet film in step C is dried;
E, exposure:
Copper-clad plate in step D is put under ultraviolet light and is exposed;
F, development:
Adopt developer solution to remove the wet film layer that there is no exposure in step e on copper-clad plate plate face;
G, etching:
With etching solution, the copper layer exposed part that there is no wet film layer protection removed, retained the copper layer as circuit;
H, move back film:
Film on copper-clad plate plate face in step G is all returned, exposed the copper layer as circuit;
I, AOI check:
Adopt automated optical inspection to check in step H the whether qualified of circuit in copper-clad plate;
J, brown:
Alligatoring is as each copper face and the circuit of internal layer;
K, typesetting:
Each inside/outside layer layer is all stacked;
L, pressing:
Superimposed good each copper-clad plate in step K is pressed together, become multi-layer sheet;
M, gong limit:
Utilize numerical control plate-milling machine edges of boards mill off unnecessary multi-layer sheet in step L;
N, boring:
Get out respectively the through hole on multi-layer sheet and beat component hole;
O, nog plate:
Adopt the alligatoring of nog plate equipment, clean multiple-plate plate face;
P, heavy copper:
Utilize chemical method, deposit a bronze medal layer at multiple-plate plate face, through hole and in beating component hole;
Q, anti-oxidation processing:
Multi-layer sheet in step P is put into anti-oxidation liquid medicine to be soaked; Wherein said anti-oxidation liquid medicine is the sodium carbonate liquor of mass concentration 0.12%;
R, panel plating:
Monoblock multi-layer sheet is electroplated to thickening plate face, through hole and beat the copper of component hole;
S, circuit nog plate:
Adopt multiple-plate plate face in the alligatoring of nog plate equipment, cleaning R;
T, stamp-pad ink solidify pad pasting:
In step S, on multi-layer sheet plate face, stick respectively one deck dry film;
U, circuit exposure:
Multi-layer sheet in step T is sent into exposure sources and carry out exposure-processed;
V, circuit develop:
Multi-layer sheet in step U is carried out to development treatment;
W, electrotinning:
To electroplating one deck protection tin on the multi-layer sheet plate face in step V;
X, move back film:
The dry film being attached in step W is all returned, exposed copper face;
Y, etching:
By removing without the copper layer exposed part of tin protection, retain the copper layer as circuit with etching solution;
Z, move back tin:
Adopt tin stripping liquid by the protection tin in step Y; Described tin stripping liquid is composed of the following components by weight percentage:
AA, erosion inspection:
Whether detecting step Z moves back after tin on multi-layer sheet circuit qualified;
BB, green oil nog plate:
Adopt Plate grinder to polish to the multi-layer sheet plate face in steps A A;
CC, green oil:
In step BB, on multi-layer sheet plate face, silk-screen one deck plays the green ink of insulating effect respectively; Wherein said green oil specifically comprises the following steps:
CC1, silk-screen green oil:
Adopt the mode of silk-screen on copper-clad plate two sides, to print respectively one deck green oil;
CC2, baking sheet:
At 40-60 DEG C, the copper-clad plate of oiling green oil in step S1 is dried;
CC3, green oil exposure:
In copper-clad plate in step S2, stick an exposure film, exposure-processed under ultraviolet light;
CC4, green oil develop
The green oil that is provided with lightproof area during by exposure rinses out, and makes copper face out exposed.
DD, silk-screen wrongly written or mispronounced character:
In step CC, on multi-layer sheet panel, silk-screen is identified the word of use when playing element;
EE, surface treatment:
On multi-layer sheet plate face in step DD, paste one deck oxidation-resistant film;
FF, processing and forming:
Multi-layer sheet gong in step e E is gone out to finished product profile;
GG, test:
To the multi-layer sheet in step F F open, short-circuit test;
HH、FQC：
Finished product inspection, has been confirmed whether function and problem of appearance;
II, packaging:
The qualified packing of product will be detected in step HH.
Embodiment 3
A production technology for multilayer circuit board, comprises the following steps:
A, internal layer sawing sheet:
The size that meets designing requirement will be cut out out for the copper-clad plate of making inner plating;
B: internal layer nog plate:
Adopt the plate face of copper-clad plate in the alligatoring of nog plate equipment, cleaning A;
C, silk-screen wet film
In the copper-clad plate of the method for employing silk-screen in step B, print one deck wet film;
D, oven dry:
The copper-clad plate that is printed on wet film in step C is dried;
E, exposure:
Copper-clad plate in step D is put under ultraviolet light and is exposed;
F, development:
Adopt developer solution to remove the wet film layer that there is no exposure in step e on copper-clad plate plate face;
G, etching:
With etching solution, the copper layer exposed part that there is no wet film layer protection removed, retained the copper layer as circuit;
H, move back film:
Film on copper-clad plate plate face in step G is all returned, exposed the copper layer as circuit;
I, AOI check:
Adopt automated optical inspection to check in step H the whether qualified of circuit in copper-clad plate;
J, brown:
Alligatoring is as each copper face and the circuit of internal layer;
K, typesetting:
Each inside/outside layer layer is all stacked;
L, pressing:
Superimposed good each copper-clad plate in step K is pressed together, become multi-layer sheet;
M, gong limit:
Utilize numerical control plate-milling machine edges of boards mill off unnecessary multi-layer sheet in step L;
N, boring:
Get out respectively the through hole on multi-layer sheet and beat component hole;
O, nog plate:
Adopt the alligatoring of nog plate equipment, clean multiple-plate plate face;
P, heavy copper:
Utilize chemical method, deposit a bronze medal layer at multiple-plate plate face, through hole and in beating component hole;
Q, anti-oxidation processing:
Multi-layer sheet in step P is put into anti-oxidation liquid medicine to be soaked; Wherein said anti-oxidation liquid medicine is the sodium carbonate liquor of mass concentration 0.7%;
R, panel plating:
Monoblock multi-layer sheet is electroplated to thickening plate face, through hole and beat the copper of component hole;
S, circuit nog plate:
Adopt multiple-plate plate face in the alligatoring of nog plate equipment, cleaning R;
T, stamp-pad ink solidify pad pasting:
In step S, on multi-layer sheet plate face, stick respectively one deck dry film;
U, circuit exposure:
Multi-layer sheet in step T is sent into exposure sources and carry out exposure-processed;
V, circuit develop:
Multi-layer sheet in step U is carried out to development treatment;
W, electrotinning:
To electroplating one deck protection tin on the multi-layer sheet plate face in step V;
X, move back film:
The dry film being attached in step W is all returned, exposed copper face;
Y, etching:
By removing without the copper layer exposed part of tin protection, retain the copper layer as circuit with etching solution;
Z, move back tin:
Adopt tin stripping liquid by the protection tin in step Y; Described tin stripping liquid is composed of the following components by weight percentage:
AA, erosion inspection:
Whether detecting step Z moves back after tin on multi-layer sheet circuit qualified;
BB, green oil nog plate:
Adopt Plate grinder to polish to the multi-layer sheet plate face in steps A A;
CC, green oil:
In step BB, on multi-layer sheet plate face, silk-screen one deck plays the green ink of insulating effect respectively; Wherein said green oil specifically comprises the following steps:
CC1, silk-screen green oil:
Adopt the mode of silk-screen on copper-clad plate two sides, to print respectively one deck green oil;
CC2, baking sheet:
At 40-60 DEG C, the copper-clad plate of oiling green oil in step S1 is dried;
CC3, green oil exposure:
In copper-clad plate in step S2, stick an exposure film, exposure-processed under ultraviolet light;
CC4, green oil develop
The green oil that is provided with lightproof area during by exposure rinses out, and makes copper face out exposed.
DD, silk-screen wrongly written or mispronounced character:
In step CC, on multi-layer sheet panel, silk-screen is identified the word of use when playing element;
EE, surface treatment:
On multi-layer sheet plate face in step DD, paste one deck oxidation-resistant film;
FF, processing and forming:
Multi-layer sheet gong in step e E is gone out to finished product profile;
GG, test:
To the multi-layer sheet in step F F open, short-circuit test;
HH、FQC：
Finished product inspection, has been confirmed whether function and problem of appearance;
II, packaging:
The qualified packing of product will be detected in step HH.
Claims (5)
1. a production technology for multilayer circuit board, is characterized in that comprising the following steps:
A, internal layer sawing sheet:
The size that meets designing requirement will be cut out out for the copper-clad plate of making inner plating;
B: internal layer nog plate:
Adopt the plate face of copper-clad plate in the alligatoring of nog plate equipment, cleaning A;
C, silk-screen wet film
In the copper-clad plate of the method for employing silk-screen in step B, print one deck wet film;
D, oven dry:
The copper-clad plate that is printed on wet film in step C is dried;
E, exposure:
Copper-clad plate in step D is put under ultraviolet light and is exposed;
F, development:
Adopt developer solution to remove the wet film layer that there is no exposure in step e on copper-clad plate plate face;
G, etching:
With etching solution, the copper layer exposed part that there is no wet film layer protection removed, retained the copper layer as circuit;
H, move back film:
Film on copper-clad plate plate face in step G is all returned, exposed the copper layer as circuit;
I, AOI check:
Adopt automated optical inspection to check in step H the whether qualified of circuit in copper-clad plate;
J, brown:
Alligatoring is as each copper face and the circuit of internal layer;
K, typesetting:
Each inside/outside layer layer is all stacked;
L, pressing:
Superimposed good each copper-clad plate in step K is pressed together, become multi-layer sheet;
M, gong limit:
Utilize numerical control plate-milling machine edges of boards mill off unnecessary multi-layer sheet in step L;
N, boring:
Get out respectively the through hole on multi-layer sheet and beat component hole;
O, nog plate:
Adopt the alligatoring of nog plate equipment, clean multiple-plate plate face;
P, heavy copper:
Utilize chemical method, deposit a bronze medal layer at multiple-plate plate face, through hole and in beating component hole;
Q, anti-oxidation processing:
Multi-layer sheet in step P is put into anti-oxidation liquid medicine to be soaked;
R, panel plating:
Monoblock multi-layer sheet is electroplated to thickening plate face, through hole and beat the copper of component hole;
S, circuit nog plate:
Adopt multiple-plate plate face in the alligatoring of nog plate equipment, cleaning R;
T, stamp-pad ink solidify pad pasting:
In step S, on multi-layer sheet plate face, print respectively one deck UV ink, then stick one deck dry film;
U, circuit exposure:
Multi-layer sheet in step T is sent into exposure sources and carry out exposure-processed;
V, circuit develop:
Multi-layer sheet in step U is carried out to development treatment;
W, electrotinning:
To electroplating one deck protection tin on the multi-layer sheet plate face in step V;
X, move back film:
The dry film being attached in step W is all returned, exposed copper face;
Y, etching:
By removing without the copper layer exposed part of tin protection, retain the copper layer as circuit with etching solution;
Z, move back tin:
Adopt tin stripping liquid by the protection tin in step Y;
AA, erosion inspection:
Whether detecting step Z moves back after tin on multi-layer sheet circuit qualified;
BB, green oil nog plate:
Adopt Plate grinder to polish to the multi-layer sheet plate face in steps A A;
CC, green oil:
In step BB, on multi-layer sheet plate face, silk-screen one deck plays the green ink of insulating effect respectively;
DD, silk-screen wrongly written or mispronounced character:
In step CC, on multi-layer sheet panel, silk-screen is identified the word of use when playing element;
EE, surface treatment:
On multi-layer sheet plate face in step DD, paste one deck oxidation-resistant film;
FF, processing and forming:
Multi-layer sheet gong in step e E is gone out to finished product profile;
GG, test:
To the multi-layer sheet in step F F open, short-circuit test;
HH、FQC：
Finished product inspection, has been confirmed whether function and problem of appearance;
II, packaging:
The qualified packing of product will be detected in step HH.
2. the production technology of a kind of multilayer circuit board according to claim 1, is characterized in that the anti-oxidation liquid medicine described in step Q is the sodium carbonate liquor of mass concentration 0.7-1.5%.
3. the production technology of a kind of multilayer circuit board according to claim 1, is characterized in that the UV ink described in step C is composed of the following components by weight percentage:
4. the production technology of a kind of multilayer circuit board according to claim 1, is characterized in that the tin stripping liquid described in step Z is composed of the following components by weight percentage:
5. the production technology of a kind of multilayer circuit board according to claim 1, is characterized in that the green oil described in step CC specifically comprises the following steps:
CC1, silk-screen green oil:
Adopt the mode of silk-screen on copper-clad plate two sides, to print respectively one deck green oil;
CC2, baking sheet:
At 40-60 DEG C, the copper-clad plate of oiling green oil in step S1 is dried;
CC3, green oil exposure:
In copper-clad plate in step S2, stick an exposure film, exposure-processed under ultraviolet light;
CC4, green oil develop
The green oil that is provided with lightproof area during by exposure rinses out, and makes copper face out exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310545451.9A CN103945660B (en) | 2013-11-06 | 2013-11-06 | Production technology for multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310545451.9A CN103945660B (en) | 2013-11-06 | 2013-11-06 | Production technology for multilayer circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103945660A true CN103945660A (en) | 2014-07-23 |
| CN103945660B CN103945660B (en) | 2017-02-01 |
Family
ID=51193061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310545451.9A Active CN103945660B (en) | 2013-11-06 | 2013-11-06 | Production technology for multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103945660B (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104202930A (en) * | 2014-09-17 | 2014-12-10 | 四川海英电子科技有限公司 | High-density multilayer circuit board production method |
| CN105263270A (en) * | 2015-11-09 | 2016-01-20 | 四川普瑞森电子有限公司 | Inner plating manufacturing method |
| CN106061139A (en) * | 2016-06-17 | 2016-10-26 | 奥士康精密电路（惠州）有限公司 | Layer-to-layer registration control method for inner layers of HDI (High Density Interconnector) board |
| CN106686901A (en) * | 2017-02-23 | 2017-05-17 | 深圳崇达多层线路板有限公司 | Anti-oxidation manufacturing method of circuit board |
| CN107567196A (en) * | 2017-08-16 | 2018-01-09 | 深圳市迅捷兴科技股份有限公司 | The hard golden plate preparation method of top layer NiPdAu bottom |
| CN108811349A (en) * | 2018-06-29 | 2018-11-13 | 奥士康精密电路（惠州）有限公司 | A method of improving pcb board production efficiency |
| CN109219251A (en) * | 2018-08-30 | 2019-01-15 | 广合科技（广州）有限公司 | A kind of production method of flexible electric circuit board fine-line |
| CN109862706A (en) * | 2019-01-24 | 2019-06-07 | 绍兴市微益电器有限公司 | A kind of circuit board printing process |
| CN109890141A (en) * | 2019-03-22 | 2019-06-14 | 广州江美印刷有限公司 | A kind of manufacture craft of anti-oxidant PCB printed circuit board |
| CN111065203A (en) * | 2020-01-06 | 2020-04-24 | 东莞市五株电子科技有限公司 | High-end LED circuit board with good heat dissipation performance and preparation method thereof |
| CN114025473A (en) * | 2021-11-17 | 2022-02-08 | 博罗县宏瑞兴电子有限公司 | PCB substrate and production method thereof |
| CN114206012A (en) * | 2022-01-06 | 2022-03-18 | 中山市盈利佳电子有限公司 | Manufacturing process of main board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101166392A (en) * | 2006-10-18 | 2008-04-23 | 比亚迪股份有限公司 | A laminated multi-layer flexible printed circuit board and its making method |
| CN101692757A (en) * | 2009-09-07 | 2010-04-07 | 皆利士多层线路版(中山)有限公司 | Process for manufacturing 12OZ thick copper multilayer circuit board |
| US20110168439A1 (en) * | 2010-01-13 | 2011-07-14 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic circuit board and method of manufacturing the same |
| CN102137551A (en) * | 2011-03-16 | 2011-07-27 | 蔡新民 | Production method of high-frequency four-layer circuit board |
| CN102325426A (en) * | 2011-06-30 | 2012-01-18 | 中山市达进电子有限公司 | Circuit board fabrication method for laminating asymmetric light guide panel on outer layer of multilayer panel again |
-
2013
- 2013-11-06 CN CN201310545451.9A patent/CN103945660B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101166392A (en) * | 2006-10-18 | 2008-04-23 | 比亚迪股份有限公司 | A laminated multi-layer flexible printed circuit board and its making method |
| CN101692757A (en) * | 2009-09-07 | 2010-04-07 | 皆利士多层线路版(中山)有限公司 | Process for manufacturing 12OZ thick copper multilayer circuit board |
| US20110168439A1 (en) * | 2010-01-13 | 2011-07-14 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic circuit board and method of manufacturing the same |
| CN102137551A (en) * | 2011-03-16 | 2011-07-27 | 蔡新民 | Production method of high-frequency four-layer circuit board |
| CN102325426A (en) * | 2011-06-30 | 2012-01-18 | 中山市达进电子有限公司 | Circuit board fabrication method for laminating asymmetric light guide panel on outer layer of multilayer panel again |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104202930A (en) * | 2014-09-17 | 2014-12-10 | 四川海英电子科技有限公司 | High-density multilayer circuit board production method |
| CN104202930B (en) * | 2014-09-17 | 2017-06-23 | 四川海英电子科技有限公司 | The production method of high-density multi-layer circuit board |
| CN105263270B (en) * | 2015-11-09 | 2018-08-31 | 四川普瑞森电子有限公司 | Internal layer board manufacturing method |
| CN105263270A (en) * | 2015-11-09 | 2016-01-20 | 四川普瑞森电子有限公司 | Inner plating manufacturing method |
| CN106061139A (en) * | 2016-06-17 | 2016-10-26 | 奥士康精密电路（惠州）有限公司 | Layer-to-layer registration control method for inner layers of HDI (High Density Interconnector) board |
| CN106686901B (en) * | 2017-02-23 | 2019-01-01 | 深圳崇达多层线路板有限公司 | A kind of anti-oxidant production method of wiring board |
| CN106686901A (en) * | 2017-02-23 | 2017-05-17 | 深圳崇达多层线路板有限公司 | Anti-oxidation manufacturing method of circuit board |
| CN107567196A (en) * | 2017-08-16 | 2018-01-09 | 深圳市迅捷兴科技股份有限公司 | The hard golden plate preparation method of top layer NiPdAu bottom |
| CN107567196B (en) * | 2017-08-16 | 2019-12-10 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing top nickel-palladium-gold and bottom hard gold plate |
| CN108811349A (en) * | 2018-06-29 | 2018-11-13 | 奥士康精密电路（惠州）有限公司 | A method of improving pcb board production efficiency |
| CN109219251A (en) * | 2018-08-30 | 2019-01-15 | 广合科技（广州）有限公司 | A kind of production method of flexible electric circuit board fine-line |
| CN109219251B (en) * | 2018-08-30 | 2020-11-13 | 广州广合科技股份有限公司 | Manufacturing method of fine circuit of flexible circuit board |
| CN109862706A (en) * | 2019-01-24 | 2019-06-07 | 绍兴市微益电器有限公司 | A kind of circuit board printing process |
| CN109890141A (en) * | 2019-03-22 | 2019-06-14 | 广州江美印刷有限公司 | A kind of manufacture craft of anti-oxidant PCB printed circuit board |
| CN111065203A (en) * | 2020-01-06 | 2020-04-24 | 东莞市五株电子科技有限公司 | High-end LED circuit board with good heat dissipation performance and preparation method thereof |
| CN111065203B (en) * | 2020-01-06 | 2022-04-26 | 东莞市五株电子科技有限公司 | High-end LED circuit board with good heat dissipation performance and preparation method thereof |
| CN114025473A (en) * | 2021-11-17 | 2022-02-08 | 博罗县宏瑞兴电子有限公司 | PCB substrate and production method thereof |
| CN114206012A (en) * | 2022-01-06 | 2022-03-18 | 中山市盈利佳电子有限公司 | Manufacturing process of main board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103945660B (en) | 2017-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103945660A (en) | Production technology for multilayer circuit board | |
| CN103945648B (en) | A kind of high-frequency circuit board production technology | |
| CN104202930B (en) | The production method of high-density multi-layer circuit board | |
| CN104780711B (en) | A kind of blind hole fills out the rework method of copper plating abnormal circuit plate | |
| CN104363704B (en) | A kind of thick hole copper PCB preparation method | |
| CN107466170B (en) | A kind of printed circuit board processing method for thering is insert hole to design in step groove | |
| KR20180100376A (en) | Method for improving the depression of solder mask plug hole of IC carrier board and manufacturing method of IC carrier board | |
| CN105916302A (en) | PCB manufacturing method capable of preventing green oil hole plugging | |
| CN103140059B (en) | There is the working method of the multilayer circuit board of blind hole | |
| CN105555046A (en) | Production technology of double-sided PCB | |
| CN105764258A (en) | Method of making step groove on PCB | |
| CN104780710B (en) | Printed wiring board and preparation method thereof | |
| CN104202907B (en) | A kind of UV print processes make the technique that heavy copper electroplates via hole double-sided wiring board | |
| CN107148169A (en) | The manufacture craft of multi-layer PCB board | |
| CN104244612A (en) | Method for forming plated-through hole in PTFE circuit board | |
| CN104507257A (en) | Printed circuit board (PCB) molding method | |
| CN104378923A (en) | Printed circuit board etching method | |
| CN104717846A (en) | Method for manufacturing metallization groove holes in PCB | |
| CN106993381A (en) | A kind of preparation method of the intensive the electroplates in hole filling perforations of high-frequency ultrathin PCB | |
| CN105764270A (en) | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing | |
| CN109587968A (en) | One kind preventing consent or the undesirable PCB production method of plated hole | |
| CN108124383A (en) | The production method of printed circuit board | |
| CN107241867B (en) | Occurs the process of plating folder film when a kind of reduction alkali etching | |
| CN106686901B (en) | A kind of anti-oxidant production method of wiring board | |
| CN105120600B (en) | A kind of nickel surface processing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |