CN105263270B - Internal layer board manufacturing method - Google Patents
Internal layer board manufacturing method Download PDFInfo
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- CN105263270B CN105263270B CN201510754401.0A CN201510754401A CN105263270B CN 105263270 B CN105263270 B CN 105263270B CN 201510754401 A CN201510754401 A CN 201510754401A CN 105263270 B CN105263270 B CN 105263270B
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- erosion
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- liquid medicine
- exposure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The present invention relates to internal layer board manufacturing methods, include the following steps：S1, pre-treatment：Substrate is used into Plate grinder nog plate, then excessively middle roughening；S2, erosion is stung：Substrate is placed on to sting in erosion liquid medicine and carries out stinging erosion；S3, coating：Substrate surface after stinging erosion is coated with one layer of ink, is re-fed into baking in drying-plate machine, takes out postcooling to room temperature；S4, exposure：The obtained substrates of step S3 are put into the exposure machine, are exposed, substrate is taken out, are stood；S5, development：The part not exposed development liquid medicine is removed, required circuitous pattern is obtained；S6, etching：Etching solution respectively forms a concentration of：Copper ion is 130~140g/L, and chlorion is 170~180g/L, is etched to wiring board；S7, film is moved back：It carries out the resist layer of the protection copper face of PCB surface to move back film, finally obtains the wiring board of line pattern.The advantage of the invention is that：It is adjusted by using middle roughening, exposure, development and etching parameter, a yield can be promoted to 98% by 90%.
Description
Technical field
The present invention relates to the production technical fields of wiring board, especially internal layer board manufacturing method.
Background technology
Inner plating production is the key that make printed circuit board, and its steps includes mainly pre-treatment, coating, exposure, erosion
Carve, move back film etc., the obtained inner plating yield of processing of existing inner plating is 90% or so, for production printed circuit board
For producer, 90% yield has had reached bottleneck, it is difficult to again further promote the production yield of inner plating.
Invention content
It is an object of the invention to overcome the prior art, a kind of inner plating system promoting inner plating yield is provided
Make method, is adjusted, a yield can be promoted to by 90% by using middle roughening, exposure, development and etching parameter
98%。
The purpose of the present invention is achieved through the following technical solutions：Internal layer board manufacturing method, includes the following steps：
S1, pre-treatment：Substrate is used into Plate grinder nog plate, then excessively middle roughening, speed is between 1.4~1.6m/min；
S2, erosion is stung：Substrate is placed on to sting in erosion liquid medicine and carries out stinging erosion, it is 1.0~1.4 μm/pass to sting erosion rate；
S3, coating：Substrate surface after stinging erosion is coated with the ink that a layer thickness is 10~12 μm, is re-fed into drying-plate machine
It is interior, 9~11min is toasted under 72~78 DEG C of temperature environment, takes out postcooling to room temperature；
S4, exposure：Exposure capability is adjusted to 6~7 lattice, the obtained substrates of step S3 are put into the exposure machine, are exposed
Light exposes 10~15min, takes out substrate, stands 15~30min；
S5, development：The part not exposed development liquid medicine is removed, wherein developing powder：4.0~4.4m/min is shown
26~32 DEG C of the temperature of shadow, development two-way pressure are pressed；1.0~2.0kg/cm2 is controlled, and pressure is washed：1.0~2.0kg/
Cm2 obtains required circuitous pattern；
S6, etching：It is 45~55 DEG C to control temperature in etching groove, and etching solution respectively forms a concentration of：Copper ion be 130~
140g/L, chlorion are 170~180g/L, are etched to wiring board；
S7, film is moved back：It carries out the resist layer of the protection copper face of PCB surface to move back film, it is 1.8~2.2m/ to move back film speed
Min finally obtains the wiring board of line pattern.
In the step S1, it is middle roughening stabilization agent to sting erosion liquid medicine.
In the step S5, development chemical concentration is controlled by 1.0%, and speed is adjusted by development point 55%.
The present invention has the following advantages：
1, it is adjusted, a yield can be promoted by 90% by using middle roughening, exposure, development and etching parameter
To 98%.
Specific implementation mode
With reference to embodiment, the present invention will be further described, but protection scope of the present invention is not limited to following institute
It states.
【Embodiment 1】：
Internal layer board manufacturing method, includes the following steps：
S1, pre-treatment：Substrate is used into Plate grinder nog plate, then excessively middle roughening, speed 1.4m/min；
S2, erosion is stung：Substrate is placed on to sting in erosion liquid medicine and carries out stinging erosion, it is 1.4 μm/pass to sting erosion rate；
S3, coating：Substrate surface after stinging erosion is coated with the ink that a layer thickness is 10 μm, is re-fed into drying-plate machine,
11min is toasted under 72 DEG C of temperature environment, takes out postcooling to room temperature；
S4, exposure：Exposure capability is adjusted to 7 lattice, the obtained substrates of step S3 are put into the exposure machine, are exposed,
15min is exposed, substrate is taken out, stands 30min；
S5, development：The part not exposed development liquid medicine is removed, wherein developing powder：4.4m/min, development
32 DEG C of temperature, development two-way pressure press 1.0kg/cm2It is controlled, washing pressure is 1.0kg/cm2, obtain required circuitous pattern；
S6, etching：It is 45 DEG C to control temperature in etching groove, and etching solution respectively forms a concentration of：Copper ion is 130g/L, chlorine from
Son is 170g/L, is etched to wiring board；
S7, film is moved back：It carries out the resist layer of the protection copper face of PCB surface to move back film, it is 1.8m/min to move back film speed, most
The wiring board of line pattern is obtained eventually.
In the step S1, it is middle roughening stabilization agent to sting erosion liquid medicine.
In the step S5, development chemical concentration is controlled by 1.0%, and speed is adjusted by development point 55%.
【Embodiment 2】：
Internal layer board manufacturing method, includes the following steps：
S1, pre-treatment：Substrate is used into Plate grinder nog plate, then excessively middle roughening, speed 1.5m/min；
S2, erosion is stung：Substrate is placed on to sting in erosion liquid medicine and carries out stinging erosion, it is 1.2 μm/pass to sting erosion rate；
S3, coating：Substrate surface after stinging erosion is coated with the ink that a layer thickness is 11 μm, is re-fed into drying-plate machine,
10min is toasted under 75 DEG C of temperature environment, takes out postcooling to room temperature；
S4, exposure：Exposure capability is adjusted to 7 lattice, the obtained substrates of step S3 are put into the exposure machine, are exposed,
13min is exposed, substrate is taken out, stands 23min；
S5, development：The part not exposed development liquid medicine is removed, wherein developing powder：4.2m/min, development
29 DEG C of temperature, development two-way pressure press 1.5kg/cm2It is controlled, washes pressure：1.5kg/cm2, obtain required circuitous pattern；
S6, etching：It is 50 DEG C to control temperature in etching groove, and etching solution respectively forms a concentration of：Copper ion is 135g/L, chlorine from
Son is 175g/L, is etched to wiring board；
S7, film is moved back：It carries out the resist layer of the protection copper face of PCB surface to move back film, it is 2.0m/min to move back film speed, most
The wiring board of line pattern is obtained eventually.
In the step S1, it is middle roughening stabilization agent to sting erosion liquid medicine.
In the step S5, development chemical concentration is controlled by 1.0%, and speed is adjusted by development point 55%.
【Embodiment 3】：
Internal layer board manufacturing method, includes the following steps：
S1, pre-treatment：Substrate is used into Plate grinder nog plate, then excessively middle roughening, speed 1.46m/min；
S2, erosion is stung：Substrate is placed on to sting in erosion liquid medicine and carries out stinging erosion, it is 1.3 μm/pass to sting erosion rate；
S3, coating：Substrate surface after stinging erosion is coated with the ink that a layer thickness is 11 μm, is re-fed into drying-plate machine,
10.5min is toasted under 76 DEG C of temperature environment, takes out postcooling to room temperature；
S4, exposure：Exposure capability is adjusted to 6 lattice, the obtained substrates of step S3 are put into the exposure machine, are exposed,
12min is exposed, substrate is taken out, stands 20min；
S5, development：The part not exposed development liquid medicine is removed, wherein developing powder：4.3m/min, development
30 DEG C of temperature, development two-way pressure press 1.4kg/cm2It is controlled, washes pressure：1.6kg/cm2, obtain required circuitous pattern；
S6, etching：It is 48 DEG C to control temperature in etching groove, and etching solution respectively forms a concentration of：Copper ion is 136g/L, chlorine from
Son is 178g/L, is etched to wiring board；
S7, film is moved back：It carries out the resist layer of the protection copper face of PCB surface to move back film, it is 1.9m/min to move back film speed, most
The wiring board of line pattern is obtained eventually.
In the step S1, it is middle roughening stabilization agent to sting erosion liquid medicine.
In the step S5, development chemical concentration is controlled by 1.0%, and speed is adjusted by development point 55%.
【Embodiment 4】：
Internal layer board manufacturing method, includes the following steps：
S1, pre-treatment：Substrate is used into Plate grinder nog plate, then excessively middle roughening, speed 1.6m/min；
S2, erosion is stung：Substrate is placed on to sting in erosion liquid medicine and carries out stinging erosion, it is 1.0 μm/pass to sting erosion rate；
S3, coating：Substrate surface after stinging erosion is coated with the ink that a layer thickness is 10~12 μm, is re-fed into drying-plate machine
It is interior, 9min is toasted under 78 DEG C of temperature environment, takes out postcooling to room temperature；
S4, exposure：Exposure capability is adjusted to 6 lattice, the obtained substrates of step S3 are put into the exposure machine, are exposed,
10min is exposed, substrate is taken out, stands 15min；
S5, development：The part not exposed development liquid medicine is removed, wherein developing powder：4.0m/min, development
26 DEG C of temperature, development two-way pressure press 2.0kg/cm2It is controlled, washes pressure：2.0kg/cm2 obtains required circuitous pattern；
S6, etching：It is 45~55 DEG C to control temperature in etching groove, and etching solution respectively forms a concentration of：Copper ion is 140g/L,
Chlorion is 180g/L, is etched to wiring board；
S7, film is moved back：It carries out the resist layer of the protection copper face of PCB surface to move back film, it is 2.2m/min to move back film speed, most
The wiring board of line pattern is obtained eventually.
In the step S1, it is middle roughening stabilization agent to sting erosion liquid medicine.
In the step S5, development chemical concentration is controlled by 1.0%, and speed is adjusted by development point 55%.
Claims (2)
1. internal layer board manufacturing method, it is characterised in that：Include the following steps：
S1, pre-treatment：Substrate is used into Plate grinder nog plate, then excessively middle roughening, speed is between 1.4~1.6m/min；
S2, erosion is stung：Substrate is placed on to sting in erosion liquid medicine and carries out stinging erosion, it is middle roughening stabilization agent to sting erosion liquid medicine, and it is 1.0 to sting erosion rate
~1.4 μm/pass；
S3, coating：Substrate surface after stinging erosion is coated with the ink that a layer thickness is 10~12 μm, is re-fed into drying-plate machine,
9~11min is toasted under 72~78 DEG C of temperature environment, takes out postcooling to room temperature；
S4, exposure：Exposure capability is adjusted to 6~7 lattice, the obtained substrates of step S3 are put into exposure machine, are exposed, is exposed
10~15min takes out substrate, stands 15~30min；
S5, development：The part not exposed development liquid medicine is removed, wherein developing powder：4.0~4.4m/min, development
26~32 DEG C of temperature, development two-way pressure press 1.0~2.0kg/cm2It is controlled, washes pressure：1.0~2.0kg/cm2, obtain
Required circuitous pattern；
S6, etching：It is 45~55 DEG C to control temperature in etching groove, and etching solution respectively forms a concentration of：Copper ion is 130~140g/
L, chlorion are 170~180g/L, are etched to wiring board；
S7, film is moved back：It carries out the resist layer of the protection copper face of PCB surface to move back film, it is 1.8~2.2m/min to move back film speed, most
The wiring board of line pattern is obtained eventually.
2. internal layer board manufacturing method according to claim 1, it is characterised in that：In the step S5, development liquid medicine is dense
Degree is controlled by 1.0%, and speed is adjusted by development point 55%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510754401.0A CN105263270B (en) | 2015-11-09 | 2015-11-09 | Internal layer board manufacturing method |
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|---|---|---|---|
| CN201510754401.0A CN105263270B (en) | 2015-11-09 | 2015-11-09 | Internal layer board manufacturing method |
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| CN105263270A CN105263270A (en) | 2016-01-20 |
| CN105263270B true CN105263270B (en) | 2018-08-31 |
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| CN201510754401.0A Active CN105263270B (en) | 2015-11-09 | 2015-11-09 | Internal layer board manufacturing method |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231805B (en) * | 2016-08-15 | 2019-01-22 | 建业科技电子（惠州）有限公司 | A kind of semi-automatic exposure machine does the manufacture craft of inner plating |
| CN108337825A (en) * | 2018-02-08 | 2018-07-27 | 江西景旺精密电路有限公司 | PCB internal layer circuits making apparatus and production method |
| CN108289379A (en) * | 2018-02-08 | 2018-07-17 | 江西景旺精密电路有限公司 | PCB internal layers development etching and automatic optics inspection connecting line equipment and bus connection method |
| CN110167285A (en) * | 2019-04-18 | 2019-08-23 | 奥士康精密电路（惠州）有限公司 | A kind of management-control method reducing route inner cord open circuit, notch |
| CN111031694A (en) * | 2019-12-31 | 2020-04-17 | 江门市华锐铝基板股份公司 | Film stripping liquid and film stripping method |
| CN111432566A (en) * | 2020-03-02 | 2020-07-17 | 博罗康佳精密科技有限公司 | Preparation process of 3OZ single-side thick copper aluminum substrate precise circuit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005303016A (en) * | 2004-04-13 | 2005-10-27 | Mitsui Chemicals Inc | Manufacturing method of printed wiring substrate and its wiring substrate |
| CN103188879A (en) * | 2011-12-29 | 2013-07-03 | 深圳玛斯兰电路科技实业发展有限公司 | Preparation method of inner layer of thick copper thin circuit board of printed circuit board |
| CN103945660A (en) * | 2013-11-06 | 2014-07-23 | 广东兴达鸿业电子有限公司 | Production technology for multilayer circuit board |
| CN105007691A (en) * | 2015-08-18 | 2015-10-28 | 四川海英电子科技有限公司 | Fine circuit printed board etching process |
-
2015
- 2015-11-09 CN CN201510754401.0A patent/CN105263270B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005303016A (en) * | 2004-04-13 | 2005-10-27 | Mitsui Chemicals Inc | Manufacturing method of printed wiring substrate and its wiring substrate |
| CN103188879A (en) * | 2011-12-29 | 2013-07-03 | 深圳玛斯兰电路科技实业发展有限公司 | Preparation method of inner layer of thick copper thin circuit board of printed circuit board |
| CN103945660A (en) * | 2013-11-06 | 2014-07-23 | 广东兴达鸿业电子有限公司 | Production technology for multilayer circuit board |
| CN105007691A (en) * | 2015-08-18 | 2015-10-28 | 四川海英电子科技有限公司 | Fine circuit printed board etching process |
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