CN110167285A - A kind of management-control method reducing route inner cord open circuit, notch - Google Patents
A kind of management-control method reducing route inner cord open circuit, notch Download PDFInfo
- Publication number
- CN110167285A CN110167285A CN201910314554.1A CN201910314554A CN110167285A CN 110167285 A CN110167285 A CN 110167285A CN 201910314554 A CN201910314554 A CN 201910314554A CN 110167285 A CN110167285 A CN 110167285A
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- China
- Prior art keywords
- open circuit
- notch
- dust
- management
- managed
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Abstract
The present invention provides a kind of management-control method for reducing route inner cord open circuit, notch, which comprises the following steps: when S1. pretreatment roughening plate face, micro-etching speed is managed in 30-60u；S2. increase dust-binding device after pre-treatment drying；S3. coating line maintains weekly once, cleans to interior oven walls, collet, filter screen；S4. it checks coating edges of boards product ink, product ink is handled；S5. plank is handled after stacking using dust catcher after being coated with；S6. increase the manual binding dust of binding dust rumble before increasing dust-binding device or the exposure of semi-automatic exposure machine before Full-automatic exposure machine exposure；S7. the visualization ratio of developing procedure is managed.By the method for the invention, internal layer open circuit, notch can be reduced by 2.5% to 1.5%, product quality yield is highly improved；Internal layer open circuit, notch, which are reduced, can reduce internal layer AOI leakage ratio and repair open circuit, the labour cost that notch needs, and reduce open circuit and scrap.
Description
Technical field
The invention belongs to wiring board processing technique fields, and in particular to a kind of pipe for reducing route inner cord open circuit, notch
Prosecutor method.
Background technique
The world today, development in science and technology is swift and violent, and requirement of the people for wiring board is higher and higher, as wiring board is more and more smart
Close production requirement, either internal layer, outer-layer circuit design are all closer and closer, and the plate on the make about easy production that route is intensive
Raw open circuit, notch etc. are bad, influence pcb board factory production flow velocity, spend human and material resources repairing, and generate and scrap.
Summary of the invention
In view of this, the present invention provides the management-control method of a kind of reduction route inner cord open circuit, notch, the present invention is from internal layer
The reason of generating open circuit, notch depth is dissected, and optimizes production procedure from every side according to reason, to reach less open circuit, lack
The purpose of mouth, raising production yield reduce open circuit and scrap, customer complaint risk and warp caused by reducing because of open a way benefit line or leakage
Ji loss, improves enterprise competitiveness.
The technical solution of the present invention is as follows: a kind of management-control method for reducing route inner cord open circuit, notch, including following step
It is rapid:
S1. when pretreatment roughening plate face, micro-etching speed is managed in 30-60u；Avoid ink and plate face binding force insufficient.
S2. increase dust-binding device after pre-treatment drying, guarantee coating front face cleaning without dust.
S3. coating line maintains weekly once, cleans to interior oven walls, collet, filter screen, can will do on collet
It is removed after ink is soft.
S4. it checks coating edges of boards product ink, product ink is handled；
S5. plank is handled after stacking using dust catcher after being coated with；PP powder, the ink bits that edges of boards are easily fallen edges of boards are clear
It is clean clean.
S6. it is manual to increase binding dust rumble before exposing for the preceding increase dust-binding device of Full-automatic exposure machine exposure or semi-automatic exposure machine
Binding dust；
S7. the visualization ratio of developing procedure is managed.
Further, in step S3, the clean mode of collet is sandwiched in 2H on collet after alcohol can be used to bedew non-dust cloth
It is again that collet is clean afterwards.
Further, in step S5, the suction inlet of the dust catcher need to connect the tool of the suction inlet containing brush.
Further, in step S6, the exposure guide rule of Full-automatic exposure machine is managed more than 5 lattice, because of each model photosensitive property
Different, different ink suitably can be reduced or be improved, and avoid generating ill-exposed
Further, in step S7, visualization ratio is managed 30% ± 10%.
It further, further include that the dust free room transmission area per tour of environment and plank approach process everywhere everywhere need to clean one
It is secondary, it is every primary using primary cleaning to put wooden handcart.It is managed by the 5S to environment and plank approach process items includes cleaning, parameter
Control, can be effectively improved internal layer open circuit, notch it is bad.
Present inventor has found that the reason of internal layer generates open circuit, notch is broadly divided into three by a large amount of creative tests
Kind: 1, it coating before or in coating or coating process foreign matter (by ink cover all or part of foreign matter) 2, coating after exposes
Light time foreign matter (i.e. foreign matter is in ink pellet surface) 3, ink is not against corrosion or insufficient with plate face binding force, the ink in development etching process
Layer is floated off with copper face.In conjunction with this three reasons, the application from pre-treatment to etching after the completion of each process set about, formulate complete improve
Countermeasure improves shortcoming, to achieve the purpose that improve open circuit, notch.
Present invention reduction route inner cord open circuit, the management-control method of notch are simple and effective, and emphasis is managed project and more protruded,
Increased costs caused by can be effectively reduced because of internal layer open circuit, notch.
By the method for the invention, internal layer open circuit, notch can be reduced by 2.5% to 1.5%, product quality yield obtains larger
It is promoted；Internal layer open circuit, notch, which are reduced, can reduce internal layer AOI leakage ratio and repair open circuit, the labour cost that notch needs, and reduce
Open circuit is scrapped.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with embodiment, it is clear that described reality
Applying example is only a part of the embodiment of the present invention, instead of all the embodiments.
Embodiment 1
A kind of management-control method reducing route inner cord open circuit, notch, comprising the following steps:
S1. when pretreatment roughening plate face, micro-etching speed is managed in 30-60u；Avoid ink and plate face binding force insufficient.
S2. increase dust-binding device after pre-treatment drying, guarantee coating front face cleaning without dust.
S3. coating line maintains weekly once, cleans to interior oven walls, collet, filter screen, can will do on collet
It is removed after ink is soft.
S4. it checks coating edges of boards product ink, product ink is handled；
S5. plank is handled after stacking using dust catcher after being coated with；PP powder, the ink bits that edges of boards are easily fallen edges of boards are clear
It is clean clean.
S6. it is manual to increase binding dust rumble before exposing for the preceding increase dust-binding device of Full-automatic exposure machine exposure or semi-automatic exposure machine
Binding dust；
S7. the visualization ratio of developing procedure is managed.
Further, in step S3, the clean mode of collet is sandwiched in 2H on collet after alcohol can be used to bedew non-dust cloth
It is again that collet is clean afterwards.
Further, in step S5, the suction inlet of the dust catcher need to connect the tool of the suction inlet containing brush.
Further, in step S6, the exposure guide rule of Full-automatic exposure machine is managed more than 5 lattice, because of each model photosensitive property
Different, different ink suitably can be reduced or be improved, and avoid generating ill-exposed
Further, in step S7, visualization ratio is managed 30% ± 10%.
It further, further include that the dust free room transmission area per tour of environment and plank approach process everywhere everywhere need to clean one
It is secondary, it is every primary using primary cleaning to put wooden handcart.It is managed by the 5S to environment and plank approach process items includes cleaning, parameter
Control, can be effectively improved internal layer open circuit, notch it is bad.
The reason of present invention generates open circuit, notch from internal layer depth is dissected, and optimizes production procedure from every side according to reason,
To achieve the purpose that less open circuit, notch, production yield is improved, open circuit is reduced and scraps, is reduced because open circuit mends line or leakage is made
At customer complaint risk and economic loss, improve enterprise competitiveness.
Embodiment 2
A kind of management-control method reducing route inner cord open circuit, notch, comprising the following steps:
S1. when pretreatment roughening plate face, micro-etching speed is managed in 30u；Avoid ink and plate face binding force insufficient.
S2. increase dust-binding device after pre-treatment drying, guarantee coating front face cleaning without dust.
S3. coating line maintains weekly once, cleans to interior oven walls, collet, filter screen, can will do on collet
It is removed after ink is soft.
S4. it checks coating edges of boards product ink, product ink is handled；
S5. plank is handled after stacking using dust catcher after being coated with；PP powder, the ink bits that edges of boards are easily fallen edges of boards are clear
It is clean clean.
S6. it is manual to increase binding dust rumble before exposing for the preceding increase dust-binding device of Full-automatic exposure machine exposure or semi-automatic exposure machine
Binding dust；
S7. the visualization ratio of developing procedure is managed.
Further, in step S3, the clean mode of collet is sandwiched in 2H on collet after alcohol can be used to bedew non-dust cloth
It is again that collet is clean afterwards.
Further, in step S5, the suction inlet of the dust catcher need to connect the tool of the suction inlet containing brush.
Further, in step S6, the exposure guide rule of Full-automatic exposure machine is managed in 6 lattice, because each model photosensitive property is different,
Different ink suitably can be reduced or be improved, and avoid generating ill-exposed
Further, in step S7, visualization ratio is managed 30%.
It further, further include that the dust free room transmission area per tour of environment and plank approach process everywhere everywhere need to clean one
It is secondary, it is every primary using primary cleaning to put wooden handcart.It is managed by the 5S to environment and plank approach process items includes cleaning, parameter
Control, can be effectively improved internal layer open circuit, notch it is bad.
Embodiment 3
A kind of management-control method reducing route inner cord open circuit, notch, comprising the following steps:
S1. when pretreatment roughening plate face, micro-etching speed is managed in 60u；Avoid ink and plate face binding force insufficient.
S2. increase dust-binding device after pre-treatment drying, guarantee coating front face cleaning without dust.
S3. coating line maintains weekly once, cleans to interior oven walls, collet, filter screen, can will do on collet
It is removed after ink is soft.
S4. it checks coating edges of boards product ink, product ink is handled；
S5. plank is handled after stacking using dust catcher after being coated with；PP powder, the ink bits that edges of boards are easily fallen edges of boards are clear
It is clean clean.
S6. it is manual to increase binding dust rumble before exposing for the preceding increase dust-binding device of Full-automatic exposure machine exposure or semi-automatic exposure machine
Binding dust；
S7. the visualization ratio of developing procedure is managed.
Further, in step S3, the clean mode of collet is sandwiched in 2H on collet after alcohol can be used to bedew non-dust cloth
It is again that collet is clean afterwards.
Further, in step S5, the suction inlet of the dust catcher need to connect the tool of the suction inlet containing brush.
Further, in step S6, the exposure guide rule of Full-automatic exposure machine is managed in 7 lattice, because each model photosensitive property is different,
Different ink suitably can be reduced or be improved, and avoid generating ill-exposed
Further, in step S7, visualization ratio is managed 40%.
It further, further include that the dust free room transmission area per tour of environment and plank approach process everywhere everywhere need to clean one
It is secondary, it is every primary using primary cleaning to put wooden handcart.It is managed by the 5S to environment and plank approach process items includes cleaning, parameter
Control, can be effectively improved internal layer open circuit, notch it is bad.
Embodiment 4
A kind of management-control method reducing route inner cord open circuit, notch, comprising the following steps:
S1. when pretreatment roughening plate face, micro-etching speed is managed in 45u；Avoid ink and plate face binding force insufficient.
S2. increase dust-binding device after pre-treatment drying, guarantee coating front face cleaning without dust.
S3. coating line maintains weekly once, cleans to interior oven walls, collet, filter screen, can will do on collet
It is removed after ink is soft.
S4. it checks coating edges of boards product ink, product ink is handled；
S5. plank is handled after stacking using dust catcher after being coated with；PP powder, the ink bits that edges of boards are easily fallen edges of boards are clear
It is clean clean.
S6. it is manual to increase binding dust rumble before exposing for the preceding increase dust-binding device of Full-automatic exposure machine exposure or semi-automatic exposure machine
Binding dust；
S7. the visualization ratio of developing procedure is managed.
Further, in step S3, the clean mode of collet is sandwiched in 2H on collet after alcohol can be used to bedew non-dust cloth
It is again that collet is clean afterwards.
Further, in step S5, the suction inlet of the dust catcher need to connect the tool of the suction inlet containing brush.
Further, in step S6, the exposure guide rule of Full-automatic exposure machine is managed in 8 lattice, because each model photosensitive property is different,
Different ink suitably can be reduced or be improved, and avoid generating ill-exposed
Further, in step S7, visualization ratio is managed 20%.
It further, further include that the dust free room transmission area per tour of environment and plank approach process everywhere everywhere need to clean one
It is secondary, it is every primary using primary cleaning to put wooden handcart.It is managed by the 5S to environment and plank approach process items includes cleaning, parameter
Control, can be effectively improved internal layer open circuit, notch it is bad.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.It is noted that the technical characteristic being not described in detail in the present invention, can pass through this
Field any prior art is realized.
Claims (6)
1. a kind of management-control method for reducing route inner cord open circuit, notch, which comprises the following steps:
S1. when pretreatment roughening plate face, micro-etching speed is managed in 30-60u；
S2. increase dust-binding device after pre-treatment drying；
S3. coating line maintains weekly once, cleans to interior oven walls, collet, filter screen；
S4. it checks coating edges of boards product ink, product ink is handled；
S5. plank is handled after stacking using dust catcher after being coated with；
S6. increase the manual binding dust of binding dust rumble before increasing dust-binding device or the exposure of semi-automatic exposure machine before Full-automatic exposure machine exposure；
S7. the visualization ratio of developing procedure is managed.
2. the management-control method according to claim 1 for reducing route inner cord open circuit, notch, which is characterized in that step S3
In, the clean mode of collet is sandwiched in again that collet is clean after 2H on collet after alcohol can be used to bedew non-dust cloth.
3. the management-control method according to claim 1 for reducing route inner cord open circuit, notch, which is characterized in that step S5
In, the suction inlet of the dust catcher need to connect the tool of the suction inlet containing brush.
4. the management-control method according to claim 1 for reducing route inner cord open circuit, notch, which is characterized in that step S6
In, the exposure guide rule of Full-automatic exposure machine is managed more than 5 lattice.
5. the management-control method according to claim 1 for reducing route inner cord open circuit, notch, which is characterized in that step S7
In, visualization ratio is managed 30% ± 10%.
6. the management-control method according to claim 1 for reducing route inner cord open circuit, notch, which is characterized in that further include
The dust free room transmission area per tour of environment and plank approach process everywhere everywhere need to be cleaned once, and it is every using primary cleaning to put wooden handcart
Once.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910314554.1A CN110167285A (en) | 2019-04-18 | 2019-04-18 | A kind of management-control method reducing route inner cord open circuit, notch |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910314554.1A CN110167285A (en) | 2019-04-18 | 2019-04-18 | A kind of management-control method reducing route inner cord open circuit, notch |
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| CN110167285A true CN110167285A (en) | 2019-08-23 |
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| CN201910314554.1A Pending CN110167285A (en) | 2019-04-18 | 2019-04-18 | A kind of management-control method reducing route inner cord open circuit, notch |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114216915A (en) * | 2021-12-15 | 2022-03-22 | 江门市浩远科技有限公司 | Method for detecting and classifying types of stains and defects of circuit board based on class level |
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