CN108495468A - A kind of printed circuit board intelligence manufacture technique - Google Patents
A kind of printed circuit board intelligence manufacture technique Download PDFInfo
- Publication number
- CN108495468A CN108495468A CN201810379257.0A CN201810379257A CN108495468A CN 108495468 A CN108495468 A CN 108495468A CN 201810379257 A CN201810379257 A CN 201810379257A CN 108495468 A CN108495468 A CN 108495468A
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- China
- Prior art keywords
- circuit board
- printed circuit
- plating
- intelligence manufacture
- manufacture technique
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of printed circuit board intelligence manufacture technique, including material number in detail below, S1, the two-sided sawing sheets of pcb board raw material；S2, scrub；S3 bores location hole；S4, resist coating；S5 is exposed, and develop etching and striping；S6, internal layer is roughened deoxidation, and is fully laminated using sub- flat machine；S7, number control drilling；S8 plates thin copper coating inspection and pastes photic resistance to plating dry film or the photic resistance to plating agent face layer bottom plate exposure of coating；Plate is repaiied in S9, development；S10, line pattern plating；S11, tin-lead alloy plating or ni au plating striping and etching；S12, wire mark welding resistance figure or photic welding resistance figure；S13, printed character figure；S14, finished product inspection packaging manufacture.The process that this kind invention uses more is simplified, while the product overall structure processed is more uniform, not easy to crack, ensures production reliability, while having the advantages that thickness is not uniform, easy to crack, and production process is more environmentally friendly, suitable for batch pipelining production.
Description
Technical field
The present invention relates to circuit board processing technique field, especially a kind of printed circuit board intelligence manufacture technique.
Background technology
Before printed circuit board appearance, the interconnection between electronic component is all to be directly connected to and form complete by electric wire
Circuit.In the present age, circuit board is intended only as effective experimental tool and exists, and printed circuit board is in the electronics industry
Through at the status for occupying empery, printed circuit board { PCB circuit board }, also known as printed circuit board, are electronic components
The supplier of electrical connection.Its development has more than 100 years history；Its design is mainly layout design；Using circuit
The major advantage of plate is to greatly reduce the mistake of wiring and assembly, improves the gentle productive labor rate of Automated water.
With the rapid development of electronic technology, in modern enterprise, it be unable to do without electronic technology everywhere.Television set, video recording
The electric appliances such as machine, VCD machines, computer into other front yard, in huge numbers of families, especially industrial enterprise by the relationship between quality of electronic product
Electronic equipment quality with regard to even more important.
Since the quality of electronic component is the basis of whole aircraft reliability, it is therefore necessary to fully understand selected component
Technical indicator, use condition make not only economical rationality further according to requirements and potentialities, but also can meet the product skill of user's needs
Art index.
The process of domestic processing printed circuit board more falls behind at present, and product quality is poor, whole production of intelligent
Change relatively low, just needs to be improved traditional handicraft for these problems, therefore, herein it is proposed that a kind of printed circuit board
Intelligence manufacture technique.
Invention content
The present invention is directed to the deficiency in background technology, provides a kind of printed circuit board intelligence manufacture technique.
The present invention is to solve above-mentioned technical deficiency, using modified technical solution, a kind of printed circuit board intelligence manufacture work
Skill, including material number in detail below,
S1, the two-sided sawing sheet of pcb board raw material；
S2, scrub；
S3 bores location hole；
S4, resist coating；
S5 is exposed, and develop etching and striping；
S6, internal layer is roughened deoxidation, and is fully laminated using sub- flat machine；
S7, number control drilling, hole inspection, hole pre-treatment and the full plate of electroless copper；
S8 plates thin copper coating inspection and pastes photic resistance to plating dry film or the photic resistance to plating agent face layer bottom plate exposure of coating；
Plate is repaiied in S9, development；
S10, line pattern plating；
S11, tin-lead alloy plating or ni au plating striping and etching；
S12, wire mark welding resistance figure or photic welding resistance figure；
S13, printed character figure install electronic component；
Shape, finished product inspection packaging manufacture are washed in S14, numerical control.
As present invention further optimization mode, in step S2, the ethanol solution of a concentration of 75-85% is selected in cleaning,
After cleaning, volatilization drying is carried out by hot wind, temperature control is at 26-47 DEG C, cleaning requirement surface non-oxidation layer, greasy dirt, ash
Dirt, finger mark and other dirts.
As present invention further optimization mode, in step S4, dry film, the dry film are sticked on inner plating material first
Be by polyester book film, photoresist and polyethylene protective film three parts composition, when pad pasting, polyethylene is first peeled from dry film
Protective film, then heat pressurize under conditions of by dry film pasting on copper face.
As present invention further optimization mode, in step S5, exposure：Under the irradiation of ultraviolet light, photoinitiator is inhaled
It has received luminous energy and has resolved into free radical, free radical causes photo polymerization monomer and generate polymerization crosslinking reaction, formed and do not dissolved in after reaction again
The macromolecular structure of dilute alkaline soln, polymerisation continue 15 minutes, with when polymerisation continue, develop before tear off polyester
Film；Development：The active group of unexposed portion reacts production solable matter with dilute alkaline soln and is dissolved down in light-sensitive surface, stays
Under the cured visuals of photosensitive cross-linking.
As present invention further optimization mode, in step S8, the thickness of copper coating should be not less than 0.001cm, copper facing
Solution is set as the solution that pyrophosphate sulfate is mixed with fluorborate solution.
As present invention further optimization mode, in step S12, printed circuit board is preheated first, preheating
Temperature is 60-80 DEG C, to printed circuit board welding flux spraying, is then delivered in wave-soldering hopper and is welded, temperature is up to 240-
245 DEG C, and require tin peak height in copper-clad surface 1.5-2mm, weld interval is 3s or so, is then allowed to stand 5min coolings.
As present invention further optimization mode, in step 13, the installation of the electronic component includes following methods, a
Electronic component is inserted into the via hole of printed circuit board by the plug-in type mounting process of transmission, including simple element plug-in opening,
Element is inserted to be installed with two-sided interconnection hole, simple double-side conduction hole substrate；B, surface are mounted directly with chip, by chip
It is adhered directly on printed circuit board be interconnected to printed circuit with wire bonding method or carrier distillation method upside-down method of hull-section construction beam lead technique encapsulation technology again
On plate, welding surface is just on component side.
The advantageous effect that is reached of the present invention is：The process that this kind invention uses more is simplified, while processing
Product overall structure is more uniform, not easy to crack, ensures production reliability, while having the advantages that thickness is not uniform, easy to crack,
Service life is longer, and processing is completed in integrated artistic method integration, and production process is more environmentally friendly, suitable for batch pipelining life
Production.
Specific implementation mode
Below in conjunction in the embodiment of the present invention, technical solution in the embodiment of the present invention is clearly and completely retouched
It states, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
The present invention provides a kind of technical solution：A kind of printed circuit board intelligence manufacture technique, including material lot in detail below
Number,
S1, the two-sided sawing sheet of pcb board raw material；
S2, scrub；
S3 bores location hole；
S4, resist coating；
S5 is exposed, and develop etching and striping；
S6, internal layer is roughened deoxidation, and is fully laminated using sub- flat machine；
S7, number control drilling, hole inspection, hole pre-treatment and the full plate of electroless copper；
S8 plates thin copper coating inspection and pastes photic resistance to plating dry film or the photic resistance to plating agent face layer bottom plate exposure of coating；
Plate is repaiied in S9, development；
S10, line pattern plating；
S11, tin-lead alloy plating or ni au plating striping and etching；
S12, wire mark welding resistance figure or photic welding resistance figure；
S13, printed character figure install electronic component；
Shape, finished product inspection packaging manufacture are washed in S14, numerical control.
In step S2, the ethanol solution of a concentration of 75-85% is selected in cleaning, and after cleaning, volatilization baking is carried out by hot wind
Dry, temperature control is at 26-47 DEG C, cleaning requirement surface non-oxidation layer, greasy dirt, dust, finger mark and other dirts.
In step S4, dry film is sticked on inner plating material first, the dry film is the photoresist and poly- by polyester book film
Ethylene protective film three parts composition, when pad pasting, polyethylene protective film is first peeled from dry film, then in the condition of heating pressurization
It is lower by dry film pasting on copper face.
In step S5, exposure：Under the irradiation of ultraviolet light, photoinitiator absorbs luminous energy and resolves into free radical, free radical
Cause photo polymerization monomer again and generate polymerization crosslinking reaction, form the macromolecular structure insoluble in dilute alkaline soln after reaction, polymerization is anti-
Should continue 15 minutes, with when polymerisation continue, develop before tear off polyester film；Development：Unexposed portion in light-sensitive surface
Active group reacts production solable matter with dilute alkaline soln and is dissolved down, and leaves the cured visuals of photosensitive cross-linking.
In step S8, the thickness of copper coating should be not less than 0.001cm, and copper plating solution is set as pyrophosphate sulfate and fluorine boron
The solution that acid salt solution is mixed.
In step S12, printed circuit board is preheated first, the temperature of preheating is 60-80 DEG C, is sprayed to printed circuit board
Solder flux is applied, is then delivered in wave-soldering hopper and is welded, temperature requires tin peak height in copper-clad surface up to 240-245 DEG C
1.5-2mm, weld interval are 3s or so, are then allowed to stand 5min coolings.
In step 13, the installation of the electronic component includes following methods, and the plug-in type mounting process of a transmissions is first by electronics
Part is inserted into the via hole of printed circuit board, including simple element plug-in opening, element are inserted with two-sided interconnection hole, merely
The installation of double-side conduction hole substrate；B, surface are mounted directly with chip, and chip is adhered directly to use wire bonding on printed circuit board again
Method or carrier distillation method upside-down method of hull-section construction beam lead technique encapsulation technology are interconnected on printed circuit board, and welding surface is just on component side.
The process that the present invention uses more is simplified, while the product overall structure processed is more uniform, is not easy out
It splits, ensures production reliability, while having the advantages that thickness is not uniform, easy to crack, service life is longer, integrated artistic method one
Bodyization completes processing, and production process is more environmentally friendly, suitable for batch pipelining production.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention, for this field skill
For art personnel, it is clear that invention is not limited to the details of the above exemplary embodiments, and without departing substantially from the present invention spirit or
In the case of essential characteristic, the present invention can be realized in other specific forms.Therefore, in all respects, should all incite somebody to action
Embodiment regards exemplary as, and is non-limiting, the scope of the present invention by appended claims rather than on state
Bright restriction, it is intended that including all changes that come within the meaning and range of equivalency of the claims in the present invention
It is interior.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiment being appreciated that.
Claims (7)
1. a kind of printed circuit board intelligence manufacture technique, which is characterized in that including material number in detail below,
S1, the two-sided sawing sheet of pcb board raw material；
S2, scrub；
S3 bores location hole；
S4, resist coating；
S5 is exposed, and develop etching and striping；
S6, internal layer is roughened deoxidation, and is fully laminated using sub- flat machine；
S7, number control drilling, hole inspection, hole pre-treatment and the full plate of electroless copper；
S8 plates thin copper coating inspection and pastes photic resistance to plating dry film or the photic resistance to plating agent face layer bottom plate exposure of coating；
Plate is repaiied in S9, development；
S10, line pattern plating；
S11, tin-lead alloy plating or ni au plating striping and etching；
S12, wire mark welding resistance figure or photic welding resistance figure；
S13, printed character figure install electronic component；
Shape, finished product inspection packaging manufacture are washed in S14, numerical control.
2. a kind of printed circuit board intelligence manufacture technique according to claim 1, which is characterized in that in step S2, cleaning
After cleaning, volatilization drying is carried out by hot wind for the ethanol solution for selecting a concentration of 75-85%, and temperature is controlled at 26-47 DEG C,
Cleaning requirement surface non-oxidation layer, greasy dirt, dust, finger mark and other dirts.
3. a kind of printed circuit board intelligence manufacture technique according to claim 1, which is characterized in that in step S4, first
Dry film is sticked on inner plating material, the dry film is by polyester book film, photoresist and polyethylene protective film three parts composition
, when pad pasting, polyethylene protective film is first peeled from dry film, then heat pressurize under conditions of by dry film pasting in copper face
On.
4. a kind of printed circuit board intelligence manufacture technique according to claim 1, which is characterized in that in step S5, exposure：
Under the irradiation of ultraviolet light, photoinitiator absorbs luminous energy and resolves into free radical, and it is poly- that free radical causes photo polymerization monomer generation again
Close cross-linking reaction, form macromolecular structure insoluble in dilute alkaline soln after reaction, polymerisation continues 15 minutes, with when polymerization instead
It should continue, polyester film is torn off before developing；Development：The active group of unexposed portion reacts life with dilute alkaline soln in light-sensitive surface
It produces solable matter and is dissolved down, leave the cured visuals of photosensitive cross-linking.
5. a kind of printed circuit board intelligence manufacture technique according to claim 1, which is characterized in that in step S8, copper plating
Layer thickness should be not less than 0.001cm, copper plating solution be set as pyrophosphate sulfate mixed with fluorborate solution it is molten
Liquid.
6. a kind of printed circuit board intelligence manufacture technique according to claim 1, which is characterized in that in step S12, first
Printed circuit board is preheated, the temperature of preheating is 60-80 DEG C, to printed circuit board welding flux spraying, is then delivered to wave-soldering
It is welded in hopper, temperature requires tin peak height in copper-clad surface 1.5-2mm, weld interval 3s up to 240-245 DEG C
Left and right is then allowed to stand 5min coolings.
7. a kind of printed circuit board intelligence manufacture technique according to claim 1, which is characterized in that described in step 13
The installation of electronic component includes following methods, and electronic component is inserted into leading for printed circuit board by the plug-in type mounting process of a transmissions
In through-hole, including the inserting of simple element plug-in opening, element is pacified with two-sided interconnection hole, simple double-side conduction hole substrate
Dress；B, surface are mounted directly with chip, and chip is adhered directly on printed circuit board to use wire bonding method or carrier distillation method upside-down method of hull-section construction beam again
Formula leads method encapsulation technology is interconnected on printed circuit board, and welding surface is just on component side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810379257.0A CN108495468A (en) | 2018-04-25 | 2018-04-25 | A kind of printed circuit board intelligence manufacture technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810379257.0A CN108495468A (en) | 2018-04-25 | 2018-04-25 | A kind of printed circuit board intelligence manufacture technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108495468A true CN108495468A (en) | 2018-09-04 |
Family
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| CN201810379257.0A Withdrawn CN108495468A (en) | 2018-04-25 | 2018-04-25 | A kind of printed circuit board intelligence manufacture technique |
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| CN (1) | CN108495468A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110167285A (en) * | 2019-04-18 | 2019-08-23 | 奥士康精密电路（惠州）有限公司 | A kind of management-control method reducing route inner cord open circuit, notch |
| CN111669894A (en) * | 2020-06-18 | 2020-09-15 | 江西沃格光电股份有限公司 | Microstrip circuit and manufacturing method thereof |
| CN112867254A (en) * | 2020-12-31 | 2021-05-28 | 苏州统硕科技有限公司 | Manufacturing method of printed circuit board |
| CN113225921A (en) * | 2021-05-17 | 2021-08-06 | 惠州中京电子科技有限公司 | Method for manufacturing PCB blind hole |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH04276081A (en) * | 1991-03-01 | 1992-10-01 | C Uyemura & Co Ltd | Method for electroless plating of tin, lead, or alloy |
| CN107817774A (en) * | 2017-11-21 | 2018-03-20 | 吉安市满坤科技有限公司 | A kind of printed circuit board intelligence manufacture technique |
-
2018
- 2018-04-25 CN CN201810379257.0A patent/CN108495468A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04276081A (en) * | 1991-03-01 | 1992-10-01 | C Uyemura & Co Ltd | Method for electroless plating of tin, lead, or alloy |
| CN107817774A (en) * | 2017-11-21 | 2018-03-20 | 吉安市满坤科技有限公司 | A kind of printed circuit board intelligence manufacture technique |
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| 李金田等: "《电工电子技术基本技能实训教程》", 30 September 2012 * |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110167285A (en) * | 2019-04-18 | 2019-08-23 | 奥士康精密电路（惠州）有限公司 | A kind of management-control method reducing route inner cord open circuit, notch |
| CN111669894A (en) * | 2020-06-18 | 2020-09-15 | 江西沃格光电股份有限公司 | Microstrip circuit and manufacturing method thereof |
| CN112867254A (en) * | 2020-12-31 | 2021-05-28 | 苏州统硕科技有限公司 | Manufacturing method of printed circuit board |
| CN113225921A (en) * | 2021-05-17 | 2021-08-06 | 惠州中京电子科技有限公司 | Method for manufacturing PCB blind hole |
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Application publication date: 20180904 |
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