CN110831345A - Printing method of thick copper plate - Google Patents
Printing method of thick copper plate Download PDFInfo
- Publication number
- CN110831345A CN110831345A CN201911159462.7A CN201911159462A CN110831345A CN 110831345 A CN110831345 A CN 110831345A CN 201911159462 A CN201911159462 A CN 201911159462A CN 110831345 A CN110831345 A CN 110831345A
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- printing
- thick copper
- copper plate
- ink
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
Abstract
The invention discloses a printing method of a thick copper plate, which comprises the following steps: preparing a negative film solder mask film and a screen printing plate, cutting and carrying out surface grinding treatment, and then carrying out line etching; and (3) carrying out negative film printing and resistance welding line mask, wherein the UV light solid energy value of the negative film printing and resistance welding line mask is 1700 +/-500 mj/cm2, and the UV light solid energy value of the black matrix resistance welding line mask is as follows: 2200 ± 400mj/cm 2; performing solder mask and single-sided or double-sided character screen printing after the negative solder mask is finished; punching, forming and surface treatment. Compared with the prior art, the printing method of the invention is a thick copper plate printing method with low cost, simple operation and high production efficiency, and can avoid the defects of foaming and oil leakage or solder resistance, rough appearance and the like.
Description
Technical Field
The invention relates to the technical field of PCB manufacturing, in particular to a printing method of a thick copper plate, which is mainly a printing method of a single-panel PCB thick copper plate (2 oz).
Background
Printed circuit boards (PCB boards) are providers of electrical connections for electronic components, consisting essentially of: the circuit and the drawing. The circuit is used as a tool for conducting between elements, and a large copper surface is additionally designed on the design as a grounding and power supply layer. In recent years, thick copper plates are increasingly applied to manufacturing of copper clad plates, and some high-power LED aluminum substrates and power supply substrates tend to use thick copper foil substrates in design and manufacturing. However, for high-speed, high-frequency, large current capacity, miniaturization and high heat dissipation of high-thickness copper, the current is required to pass through the problems of high stability, safety, durability and the like on a thick copper conductive circuit, so that the thick copper plate is complex in manufacturing process, the manufacturing difficulty of the working procedures of drilling, pressing, etching, resistance welding and the like is very high, and the problems of overlarge hole wall roughness, hole opening burrs, high-voltage breakdown, serious side corrosion, green oil bubbling and the like are very easy to occur in the drilling, pressing, etching and resistance welding processes. In the circuit board industry, the thick copper plate is generally defined as the copper plate with the finished copper thickness of more than or equal to 2oz on the outer layer. The thick copper plate is mainly used for power supply products, and is used when the voltage and the current are high. When the outer layer is finished to have the copper thickness of 2oz, the finished product copper thickness is larger than 70um, and at this time, when the solder mask is printed by silk screen printing, the requirement of the ink thickness of a line surface and a corner cannot be met by one-time printing, and the solder mask is generally printed twice. When a thick copper plate (2oz) is printed by a traditional method, the hidden quality troubles of skip printing and no printing oil are often caused. At present, some factories print by adopting a solder resist printing secondary method or an exposure process, but the solder resist printing secondary method wastes ink, easily causes quality hidden troubles such as oil leakage and the like, generates unqualified phenomena to cause higher product reject ratio, and has the disadvantages of complicated procedures of the exposure process flow, low production efficiency and higher cost. Therefore, a printing method of a thick copper plate is developed, which is low in cost, high in efficiency and capable of avoiding defects such as foaming and oil leakage or rough appearance caused by solder resistance.
Disclosure of Invention
The invention aims to provide a printing method of a thick copper plate, which has low cost, simple and convenient operation and high production efficiency, ensures the infiltration amount of selective filling silk-screen printing ink, ensures that the surface of the filling ink is flush with the copper surface of a thick copper PCB, improves the yield, can avoid the defects of rough appearance and the like caused by bubbling and oil leakage or solder resistance, and forms a resist pattern with excellent resolution and heat resistance.
The technical scheme adopted by the invention to achieve the aim is as follows:
a printing method of a thick copper plate comprises the following steps:
firstly, preparing a negative film resistance welding line mask film and a screen printing plate,
secondly, cutting and grinding the surface of the material, and then etching the circuit;
thirdly, carrying out negative film printing and resistance welding line mask, wherein the UV light solid energy value of the negative film printing and resistance welding line mask is 1700 +/-500 mj/cm2, and the UV light solid energy value of the black matrix resistance welding line mask is as follows: 2200 ± 400mj/cm 2;
fourthly, performing solder mask and single-sided or double-sided character screen printing after the negative solder mask is finished;
and sixthly, completing the punching, forming and surface treatment.
Preferably, the first step comprises enlarging the whole circuit by 0.75mm, removing the circuit by 0.15mm, and removing the circuit by the shape and the solder resist block at the discharge needle to form a negative solder resist line mask, wherein the line width of the negative solder resist line mask is changed to 0.24mm, and then the negative solder resist line mask is photoplotted; and (4) solder resist and screen printing are dried according to the negative film solder resist line mask film, and the screen printing is required to be manufactured by a 100T screen printing plate with the tension of 30N.
Preferably, the third step also comprises surface grinding treatment before and after printing, wherein 180#/2.8A +/-0.2A is used for grinding; 180#/2.8A +/-0.2A; 320#/2.8A +/-0.2A; 500#/2.8A +/-0.2A, and the plate with the grinding crack width of 2oZ is 15-25 MM.
Preferably, the surface temperature of the plate in the third step before the negative film solder mask is printed does not exceed 50 ℃.
Preferably, the third step further comprises filling ink in the through hole of the metallized circuit board, and sanding with a belt to remove the resin protruding from the board surface after filling the hole.
Preferably, during silk-screen printing in the third step, the viscosity of the silk-screen filling ink is controlled within a range of more than or equal to 400dpa.s, and the filling ink is prepared from the following components in parts by weight: 35-45 parts of ethoxylated trimethylolpropane triacrylate, 5-10 parts of a photosensitive acid generator tetrafluoroborate group, 5-10 parts of terminated branched polyamide, 15-20 parts of isocyanate ethyl acrylate and 3-8 parts of methyltrimethoxysilane.
Preferably, the fourth step further comprises the steps of pre-curing the solder resist ink by exposure and development by utilizing the principle of photochemical molecular bonding to enable the ink to be cured and attached, and dissolving and cleaning the shading part without chemical reaction by utilizing a sodium carbonate solution.
Preferably, the fourth step further comprises performing text windowing above the test points of the circuit board, and covering the test points with text ink.
Compared with the prior art, the invention has the following beneficial effects:
the printing method of the thick copper plate is simple and convenient to operate, low in cost and high in production efficiency, the filling ink has strong adhesive force, high flexibility and good heat resistance, the gloss of the surface of the ink is ensured, the defect of shading ink caused by impurities such as film is reduced, the infiltration amount of the selective filling silk-screen printing ink is ensured, the surface of the filling ink is flush with the copper surface of the thick copper PCB, the yield is improved, the defects of rough appearance and the like caused by bubbling and oil leakage or resistance welding can be avoided, and a resist pattern with excellent resolution and heat resistance is formed.
The foregoing is a summary of the technical solutions of the present invention, and the present invention is further described below with reference to specific embodiments.
The specific implementation mode is as follows:
in order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments are described in detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1: the printing method of the thick copper plate provided by the embodiment comprises the following steps:
preparing a negative resistance welding line mask film and a screen printing plate, wherein the whole circuit is enlarged by 0.75mm, then the circuit is enlarged by 0.15mm and removed, and finally the appearance and a resistance welding block at a discharge needle are removed to form the negative resistance welding line mask, and the negative resistance welding line mask is changed into a 0.24mm back light drawing film when the line width is less than 0.24 mm; and (4) solder resist and screen printing are dried according to the negative film solder resist line mask film, and the screen printing is required to be manufactured by a 100T screen printing plate with the tension of 30N.
Secondly, cutting and grinding the surface of the material, and then etching the circuit; printing, and performing surface grinding treatment before and after printing, wherein the grinding treatment is 180#/2.8A +/-0.2A; 180#/2.8A +/-0.2A; 320#/2.8A +/-0.2A; 500#/2.8A +/-0.2A, and the plate with the grinding crack width of 2oZ is 15-25 MM.
Thirdly, carrying out negative film printing and resistance welding line mask, wherein the UV light solid energy value of the negative film printing and resistance welding line mask is 1700 +/-500 mj/cm2, and the UV light solid energy value of the black matrix resistance welding line mask is as follows: 2200 ± 400mj/cm 2; the surface temperature of the plate does not exceed 50 ℃ before the negative solder mask is printed.
Fourthly, performing solder mask and single-sided or double-sided character screen printing after the negative solder mask is finished;
and sixthly, completing the punching, forming and surface treatment.
As a further improvement, in the third step, filling ink in the through hole of the metallized circuit board, and performing sand belt polishing to remove the resin protruding from the board surface after hole filling. Soldering resistance in the holes easily causes excessive residual ink accumulated on the screen printing plate, the residual ink is printed into the holes under the pressure of a scraper, proper printing filling ink is selected, the viscosity of the silk-screen filling ink is controlled within the range of more than or equal to 400dpa.s during silk-screen printing, the infiltration amount of the silk-screen printing ink is ensured to be selectively filled, and the surface of the filling ink is ensured to be flush with the copper surface of the thick copper PCB. The filling ink comprises the following components in parts by weight: 35 parts of ethoxylated trimethylolpropane triacrylate, 10 parts of a photosensitive acid generator tetrafluoroborate group, 5 parts of terminally branched polyamide, 20 parts of isocyanate ethyl acrylate and 8 parts of methyltrimethoxysilane.
As a further improvement, the fourth step also comprises the steps of pre-curing the solder resist ink by exposure and development by utilizing the principle of photochemical molecular bonding to enable the ink to be cured and attached, and dissolving and cleaning the shading part by utilizing a sodium carbonate solution without chemical reaction. The printed circuit board has the advantages that air bubbles are generated between lines or the side surfaces of single lines of the printed circuit board after development, and solder resist materials cannot be printed on a base material during screen printing, so that air or moisture exists between the solder resist materials and the base material, the printed circuit board can be completely printed on the side walls of the circuit board and the circuit by utilizing the adhesiveness, heat resistance and the like of filling ink, appearance defects and the like caused by foaming are avoided, meanwhile, character windowing is performed above test points of the circuit board, and the test points are covered by character ink.
Example 2: the printing method of the thick copper plate provided in this example is basically the same as that of example 1, except that: and filling ink in the through hole of the metallized circuit board, and polishing by using an abrasive belt to remove the resin protruding out of the board surface after hole filling. Soldering resistance in the holes easily causes excessive residual ink accumulated on the screen printing plate, the residual ink is printed into the holes under the pressure of a scraper, proper printing filling ink is selected, the viscosity of the silk-screen filling ink is controlled within the range of more than or equal to 400dpa.s during silk-screen printing, the infiltration amount of the silk-screen printing ink is ensured to be selectively filled, and the surface of the filling ink is ensured to be flush with the copper surface of the thick copper PCB. The filling ink comprises the following components in parts by weight: 45 parts of ethoxylated trimethylolpropane triacrylate, 5 parts of a photosensitive acid generator tetrafluoroborate group, 10 parts of terminally branched polyamide, 15 parts of isocyanate ethyl acrylate and 6 parts of methyltrimethoxysilane.
Example 3: the printing method of the thick copper plate provided in this example is basically the same as that of example 1, except that: and filling ink in the through hole of the metallized circuit board, and polishing by using an abrasive belt to remove the resin protruding out of the board surface after hole filling. Soldering resistance in the holes easily causes excessive residual ink accumulated on the screen printing plate, the residual ink is printed into the holes under the pressure of a scraper, proper printing filling ink is selected, the viscosity of the silk-screen filling ink is controlled within the range of more than or equal to 400dpa.s during silk-screen printing, the infiltration amount of the silk-screen printing ink is ensured to be selectively filled, and the surface of the filling ink is ensured to be flush with the copper surface of the thick copper PCB. The filling ink comprises the following components in parts by weight: 40 parts of ethoxylated trimethylolpropane triacrylate, 7 parts of a photosensitive acid generator tetrafluoroborate group, 8 parts of terminally branched polyamide, 18 parts of isocyanate ethyl acrylate and 3 parts of methyltrimethoxysilane.
Example 4: the printing method of the thick copper plate provided in this example is basically the same as that of example 1, except that: and filling ink in the through hole of the metallized circuit board, and polishing by using an abrasive belt to remove the resin protruding out of the board surface after hole filling. Soldering resistance in the holes easily causes excessive residual ink accumulated on the screen printing plate, the residual ink is printed into the holes under the pressure of a scraper, proper printing filling ink is selected, the viscosity of the silk-screen filling ink is controlled within the range of more than or equal to 400dpa.s during silk-screen printing, the infiltration amount of the silk-screen printing ink is ensured to be selectively filled, and the surface of the filling ink is ensured to be flush with the copper surface of the thick copper PCB. The filling ink comprises the following components in parts by weight: 38 parts of ethoxylated trimethylolpropane triacrylate, 7 parts of a photosensitive acid generator tetrafluoroborate group, 9 parts of terminally branched polyamide, 16 parts of isocyanate ethyl acrylate and 4 parts of methyltrimethoxysilane.
Variations and modifications to the above-described embodiments may occur to those skilled in the art, which fall within the scope and spirit of the above description. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and variations of the present invention should fall within the scope of the claims of the present invention.
Claims (8)
1. A method for printing a thick copper plate is characterized by comprising the following steps:
firstly, preparing a negative film resistance welding line mask film and a screen printing plate,
secondly, cutting and grinding the surface of the material, and then etching the circuit;
thirdly, carrying out negative film printing and resistance welding line mask, wherein the UV light solid energy value of the negative film printing and resistance welding line mask is 1700 +/-500 mj/cm2, and the UV light solid energy value of the black matrix resistance welding line mask is as follows: 2200 ± 400mj/cm 2;
fourthly, performing solder mask and single-sided or double-sided character screen printing after the negative solder mask is finished;
and sixthly, completing the punching, forming and surface treatment.
2. The method for printing a thick copper plate as claimed in claim 1, wherein said step one comprises enlarging the entire circuit by 0.75mm, removing the enlarged circuit by 0.15mm, and removing the enlarged circuit by the shape and the solder resist block at the discharge needle to form a negative solder resist line mask, and changing the line width of less than 0.24mm to a 0.24mm post-photo-drawing film; and (4) solder resist and screen printing are dried according to the negative film solder resist line mask film, and the screen printing is required to be manufactured by a 100T screen printing plate with the tension of 30N.
3. The method for printing a thick copper plate as claimed in claim 1, wherein said third step further comprises performing surface grinding treatment before and after printing, wherein the surface grinding treatment is performed by using a grinding brush with a size of 180#/2.8A ± 0.2A; 180#/2.8A +/-0.2A; 320#/2.8A +/-0.2A; 500#/2.8A +/-0.2A, and the plate with the grinding crack width of 2oZ is 15-25 MM.
4. The method for printing a thick copper plate as claimed in claim 1, wherein the surface temperature of the plate before the negative solder resist line mask printing in the third step is not more than 50 ℃.
5. The method for printing a thick copper plate as claimed in claim 1, wherein said third step further comprises filling the through holes of the metallized circuit board with ink, and performing sand belt polishing to remove the resin protruding from the surface of the circuit board after filling the through holes.
6. The printing method of the thick copper plate as claimed in claim 1, wherein the viscosity of the silk-screen filling ink is controlled within a range of more than or equal to 400dpa.s during silk-screen printing in the third step, and the filling ink comprises the following components in parts by weight: 35-45 parts of ethoxylated trimethylolpropane triacrylate, 5-10 parts of a photosensitive acid generator tetrafluoroborate group, 5-10 parts of terminated branched polyamide, 15-20 parts of isocyanate ethyl acrylate and 3-8 parts of methyltrimethoxysilane.
7. The method for printing a thick copper plate as claimed in claim 1, wherein said fourth step further comprises the step of curing and adhering the solder resist ink by pre-curing the ink by exposure and development using a photochemical molecular bonding principle, and the light-shielding portion is subjected to dissolution cleaning without chemical reaction using a sodium carbonate solution.
8. The method of printing a thick copper plate as claimed in claim 1 wherein said step four further comprises text windowing over the circuit board test points, the test points being covered with text ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911159462.7A CN110831345A (en) | 2019-11-22 | 2019-11-22 | Printing method of thick copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911159462.7A CN110831345A (en) | 2019-11-22 | 2019-11-22 | Printing method of thick copper plate |
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| Publication Number | Publication Date |
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| CN110831345A true CN110831345A (en) | 2020-02-21 |
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| CN201911159462.7A Pending CN110831345A (en) | 2019-11-22 | 2019-11-22 | Printing method of thick copper plate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116321781A (en) * | 2023-05-25 | 2023-06-23 | 深圳市龙腾电路科技有限公司 | Method for manufacturing thick copper plate character and application of thick copper plate character in preparation of circuit board |
| CN117769145A (en) * | 2024-02-22 | 2024-03-26 | 深圳市盛鸿运科技有限公司 | Circuit board etching method and circuit board |
| CN117769145B (en) * | 2024-02-22 | 2024-04-19 | 深圳市盛鸿运科技有限公司 | Circuit board etching method and circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11307916A (en) * | 1998-04-23 | 1999-11-05 | Fujifilm Olin Co Ltd | Method for manufacturing printed circuit board |
| CN1695407A (en) * | 2002-09-20 | 2005-11-09 | 艾夫西亚有限公司 | Printing process and solder mask ink composition |
| KR20160001827A (en) * | 2014-06-27 | 2016-01-07 | 대덕전자 주식회사 | Method for manufacturing a circuit board |
| CN108350203A (en) * | 2015-11-06 | 2018-07-31 | 株式会社钟化 | Black-colored resin composition, the polyimides of subsidiary black resin cured film and its manufacturing method and the flexible printed circuit board for having used black resin cured film |
| CN110366324A (en) * | 2019-08-22 | 2019-10-22 | 星河电路（福建）有限公司 | A kind of Gao Houtong pcb board welding resistance green oil silk screen printing process of improvement |
-
2019
- 2019-11-22 CN CN201911159462.7A patent/CN110831345A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11307916A (en) * | 1998-04-23 | 1999-11-05 | Fujifilm Olin Co Ltd | Method for manufacturing printed circuit board |
| CN1695407A (en) * | 2002-09-20 | 2005-11-09 | 艾夫西亚有限公司 | Printing process and solder mask ink composition |
| KR20160001827A (en) * | 2014-06-27 | 2016-01-07 | 대덕전자 주식회사 | Method for manufacturing a circuit board |
| CN108350203A (en) * | 2015-11-06 | 2018-07-31 | 株式会社钟化 | Black-colored resin composition, the polyimides of subsidiary black resin cured film and its manufacturing method and the flexible printed circuit board for having used black resin cured film |
| CN110366324A (en) * | 2019-08-22 | 2019-10-22 | 星河电路（福建）有限公司 | A kind of Gao Houtong pcb board welding resistance green oil silk screen printing process of improvement |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116321781A (en) * | 2023-05-25 | 2023-06-23 | 深圳市龙腾电路科技有限公司 | Method for manufacturing thick copper plate character and application of thick copper plate character in preparation of circuit board |
| CN116321781B (en) * | 2023-05-25 | 2023-08-04 | 深圳市龙腾电路科技有限公司 | Method for manufacturing thick copper plate character and application of thick copper plate character in preparation of circuit board |
| CN117769145A (en) * | 2024-02-22 | 2024-03-26 | 深圳市盛鸿运科技有限公司 | Circuit board etching method and circuit board |
| CN117769145B (en) * | 2024-02-22 | 2024-04-19 | 深圳市盛鸿运科技有限公司 | Circuit board etching method and circuit board |
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