CN116321781B - Method for manufacturing thick copper plate character and application of thick copper plate character in preparation of circuit board - Google Patents
Method for manufacturing thick copper plate character and application of thick copper plate character in preparation of circuit board Download PDFInfo
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- CN116321781B CN116321781B CN202310595326.2A CN202310595326A CN116321781B CN 116321781 B CN116321781 B CN 116321781B CN 202310595326 A CN202310595326 A CN 202310595326A CN 116321781 B CN116321781 B CN 116321781B
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- solder resist
- thick copper
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 79
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 38
- 239000010949 copper Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims abstract description 121
- 238000007650 screen-printing Methods 0.000 claims abstract description 38
- 238000005406 washing Methods 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 4
- 238000005488 sandblasting Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000007639 printing Methods 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 126
- 230000000052 comparative effect Effects 0.000 description 9
- 238000005530 etching Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VVTSZOCINPYFDP-UHFFFAOYSA-N [O].[Ar] Chemical compound [O].[Ar] VVTSZOCINPYFDP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005261 decarburization Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
Abstract
The invention discloses a thick copper plate character manufacturing method and application thereof in circuit board preparation, comprising the following steps: pre-working procedure treatment; manufacturing at least one layer of solder mask layer on the surface of the production plate; silk-screen printing character ink on the solder mask layer, and semi-solidifying the silk-screen printing character ink to form an ink layer; preparing a film with character patterns and attaching the film to the ink layer; and sequentially exposing and developing to remove the ink layer corresponding to the character pattern. Compared with the traditional character manufacturing method, the method reduces the flow of printing the character and the graph by using the silk screen and improves the production efficiency; the alignment precision is higher through the film than that of using the screen plate; the manufactured character patterns are concave-down positions of the ink layer, so that the influence factors of the traditional characters on the thickness of the board are eliminated, and meanwhile, the problems of scratch and blurry character patterns are avoided.
Description
Technical Field
The invention relates to the field of printed circuit board manufacturing, in particular to a thick copper plate character manufacturing method and application thereof in circuit board preparation.
Background
In the production of printed circuit boards, in order to meet the requirements of large current passing and rapid heat dissipation, a thick copper plate with the outer layer circuit thickness more than or equal to 70 mu m is required to be manufactured. The following method is generally adopted for character production aiming at the thick copper plate: manufacturing a solder mask layer, transferring a character pattern onto a screen plate (screen printing), attaching the screen plate to the solder mask layer, printing character ink onto the solder mask layer through the screen plate, and baking.
On the one hand, because the height fall of the outer layer circuit of the thick copper plate and the base material is very large, when silk-screen printing character printing ink is arranged on the thick copper plate according to the character manufacturing method, the printing ink is not printed between the circuits or at the junction of the circuit and the base material, so that characters manufactured at the junction are not clear. However, if the solder mask layer is continuously manufactured at least twice, the height difference at the junction is reduced or eliminated, and then the character is manufactured, which results in a lengthy process.
On the other hand, the character ink is printed on the solder mask layer by using a screen printing method, the alignment accuracy is limited by means of human eyes, the problems of character deviation, bonding pads on the characters and the like are easily caused by improper operation, and in addition, even the defect of limited alignment accuracy is overcome, the character patterns are exposed on the surface of the solder mask layer and are easily scratched and worn.
Disclosure of Invention
In view of the above, it is necessary to provide a method for manufacturing thick copper characters and a circuit board, which solve the problems in the prior art that, on one hand, continuous manufacturing of a solder mask layer at least twice results in a lengthy process, which affects the production efficiency; on the other hand, the screen printing plate has limited alignment precision, and the character and the graph are exposed on the surface of the solder mask layer, so that the screen printing plate is easy to scratch and abrade.
In order to achieve the technical purpose, in one aspect, the technical scheme of the invention provides a thick copper plate character manufacturing method, which comprises the following steps:
s1: pre-working procedure treatment;
s2: manufacturing at least one layer of solder mask layer on the surface of the production plate;
s3: silk-screen printing character ink on the solder mask layer, and semi-solidifying the silk-screen printing character ink to form an ink layer;
s4: preparing a film with character patterns and attaching the film to the ink layer;
s5: and sequentially exposing and developing to remove the ink layer corresponding to the character pattern, thereby obtaining the circuit board with the recessed character pattern.
Further, in step S2, the step of manufacturing a solder mask layer specifically includes:
s21: pretreatment;
s22: silk-screen printing is carried out for the first time, and silk-screen printing is carried out on the plate surface of the production plate to form solder resist ink;
s23: pre-baking for the first time to semi-cure the solder resist ink;
s24: exposing and developing the semi-solidified solder resist ink in sequence to obtain a solder resist layer;
s25: and (3) baking the obtained solder mask layer for curing the solder mask layer after the first baking.
Further, the temperature of the first pre-baking is controlled at 75 ℃, and the pre-baking time is 45+/-5 min.
Further, the exposure energy used for exposure is 300-400mj/cm 2 。
Further, in step S2, the manufacturing of the two solder masks specifically includes:
s21: pretreatment;
s22: performing first silk screen printing, namely silk screen printing a first layer of solder resist ink on the surface of a production plate;
s23: pre-baking for the first time to semi-cure the first layer of solder resist ink;
s24: performing second silk screen printing, namely silk screen printing a second layer of solder resist ink on the first layer of solder resist ink;
s25: a second pre-bake to semi-cure the second layer of solder resist ink;
s26: exposing and developing the semi-solidified second layer of solder resist ink in sequence to obtain a solder resist layer;
s27: and (3) baking the obtained solder mask layer for curing the solder mask layer after the first baking.
Further, the pretreatment includes one or more of grinding, sand blasting, acid washing, water washing, and drying.
Further, the temperature of the first pre-baking is controlled at 75 ℃, and the pre-baking time is 20min; the temperature of the second pre-baking is controlled at 75 ℃, and the pre-baking time is 35+/-5 min.
Further, the exposure energy used for exposure is 450-550mj/cm 2 。
Further, the solder mask layer is different in color from the ink layer.
On the other hand, the technical scheme of the invention also provides application of the thick copper plate character manufacturing method in circuit board preparation.
Compared with the prior art, the invention has the beneficial effects that: at least one layer of solder mask layer is manufactured on the plate surface of the production plate, then the character patterns of the film are attached to the ink layer, and the ink layer which is blocked by the character patterns is downwards recessed after being developed and removed because the character patterns are opaque; the ink layer which is not blocked by the character and the graph is subjected to polymerization reaction after exposure to form a high polymer, and cannot be removed by development, so that the ink layer is kept in the original state. Compared with the traditional character manufacturing method, the method has the advantages that firstly, the flow of printing character patterns by silk screen is reduced, and the production efficiency is improved; secondly, the alignment precision is higher through the film alignment than that of using a screen printing plate; finally, the character patterns manufactured in the scheme are the downward concave positions of the ink layer, so that the influence factors of the traditional characters on the plate thickness are eliminated, and meanwhile, the problems of rubbing and blurring of the character patterns are avoided.
Drawings
Fig. 1 is a schematic structural view of a circuit board prepared by the method of embodiment 5 of the present invention;
fig. 2 is a schematic view of a film after exposure in a process of preparing a circuit board according to the method of embodiment 5 of the present invention;
fig. 3 is a schematic diagram of a second circuit board manufactured by the method of embodiment 5 of the present invention;
fig. 4 is a schematic view of a film after exposure in a second process of preparing a circuit board according to the method of embodiment 5 of the present invention;
fig. 5 is a schematic diagram III of the structure of a circuit board prepared according to the method described in comparative example 1;
fig. 6 is a schematic view of a film after exposure in a three-step process of manufacturing a circuit board according to the method described in comparative example 1.
The figure identifies the description:
a-producing a board; b-a solder mask layer; c-an ink layer; d-character graphics; and e-film.
Detailed Description
Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which form a part hereof, and together with the description serve to explain the principles of the invention, and are not intended to limit the scope of the invention.
Embodiment 1, the invention provides a thick copper plate character manufacturing method, which comprises the following steps:
(1) And (3) pretreatment: sequentially cutting, manufacturing an inner layer circuit and preparing an inner layer AOI (argon oxygen decarburization) to obtain an inner layer plate; and laminating the inner layer plate and the outer layer copper foil through the PP sheet, and then sequentially carrying out drilling, copper deposition, full plate electroplating and outer layer circuit manufacturing to form the production plate a.
It should be noted that the purpose of the pretreatment is only to obtain the production board a with the outer layer circuit, and the production board a is a single-layer board or a multi-layer board, and the manufacturing method of the production board a is not specifically described in the prior art.
(2) At least one solder mask layer b is manufactured on the surface of the production plate a.
It should be noted that, if the thickness of the solder mask layer b is 35-40 μm, and the outer layer line is larger than 70 μm, at least two solder mask layers b are generally manufactured in the industry to ensure that the outer layer line is completely covered. That is, the method is preferably suitable for character production of a thick copper plate on which at least two layers of solder masks b are produced, and particularly suitable for character production of a thick copper plate on which an outer layer circuit is larger than 70 μm.
(3) The solder resist layer b is subjected to a silk-screen printing ink and is semi-cured to form an ink layer c.
It should be noted that the character ink described in this step is actually a solder resist ink, the ink layer c is actually a solder resist layer b, and the character ink and the ink layer c are introduced only for the purpose of distinguishing from the solder resist ink and the solder resist layer b, so that the thickness of the ink layer c is made to be 35-40 μm as well.
(4) A film e having a character pattern is prepared and attached to the ink layer c.
It should be noted that, the conventional film e should have a pattern for making a solder mask window, and the film e in this step is further added with a character pattern d compared with the conventional film e, where the pattern of the solder mask window and the character pattern d are opaque, and the solder mask window refers to a position where the solder mask ink is not covered. (wherein, the solder mask window is generally aligned by a film alignment method, the film alignment is by CCD vision alignment method, the alignment precision is generally + -35 um, and the precision can be + -20 um under strict control)
(5) And sequentially exposing and developing to remove the ink layer c corresponding to the character pattern d, thereby obtaining the circuit board with the concave character pattern d.
In the technical scheme of the embodiment, if the thickness of the outer layer circuit is 70 μm, only one layer of solder mask layer b is needed to be manufactured, then one layer of ink layer c is manufactured, then the character pattern d of the film e is attached to the ink layer c, and the ink layer c blocked by the character pattern d is downwards recessed after being developed and removed because the character pattern d is opaque; the ink layer c which is not blocked by the character pattern d is subjected to polymerization reaction after exposure to form a high molecular polymer, and cannot be removed by development, and the ink layer c is kept as it is, as shown in fig. 2 and 4.
It should be noted that, in the conventional method for manufacturing characters by thick copper plate (the thick copper plate is required to be described, the thickness of the outer layer circuit is 70 μm, and the secondary solder mask is generally set to be required to be manufactured), the character pattern d is always screen-printed on the solder mask b after the solder mask b is manufactured, compared with the conventional method for manufacturing characters by screen printing, the process of screen printing the character pattern is reduced, the thickness is reduced, and meanwhile, the production efficiency is improved (the conventional screen printer is required to be described as a raised character, the thickness of the characters is included in the thickness of the characters, and the characters in the embodiment are recessed in the solder mask, so that the characters do not affect the thickness); secondly, the alignment precision is higher through the film e than that of using a screen printing plate; finally, the character pattern d manufactured in the scheme is the downward concave position of the ink layer c, and the problem that the character pattern d is scratched and blurred is avoided.
In embodiment 2, the present invention provides a method for manufacturing a thick copper plate, which specifically comprises the steps of (1), (3), (4) and (5) being the same as those in embodiment 1, except that in step (2), the specific steps are as follows:
(2) And manufacturing a solder mask layer b on the surface of the production plate a.
(21) Pretreatment: comprises one or more of acid washing, plate grinding and sand blasting, and adopts a cleaning device to synchronously finish the water washing and drying treatment.
(22) First silk screen: and silk-screen printing solder resist ink on the surface of the production plate a.
Among them, the ink viscosity is preferably 80 to 160dpa.s; the scraper pressure is 4+/-1 kg/cm 2 。
(23) Primary pre-baking: the production board a is baked in a tunnel furnace to semi-cure the solder resist ink.
Among them, the first pre-baking temperature is preferably controlled at 75 ℃ for 45+/-5 min.
(24) The semi-cured solder resist ink is sequentially exposed and developed to obtain a solder resist layer b.
The resist ink generates certain side etching during exposure and development, and the larger the side etching amount is, the more easily the outer layer line faults are caused, so that the selection range of exposure energy is optimized in the step, and the result is shown in table 1.
TABLE 1
As is clear from Table 1, the amount of undercut decreases with increasing exposure energy, and the exposure energy reaches 350mj/cm 2 After that, as the lateral erosion change of the exposure energy increases gradually is smaller, the exposure energy is too high and causes poor exposure, and the factors such as production cost and efficiency are comprehensively considered, so the exposure energy is preferably 300-400mj/cm 2 。
(25) Post-baking for the first time: the production board a is baked in a tunnel furnace to thermally cure the solder resist ink.
Wherein, the temperature of the first post-baking is preferably controlled between 150-160 ℃ for 60min.
In the technical scheme of the embodiment, the method is mainly used for manufacturing a layer of solder mask b, and if a plurality of layers of solder mask b are required to be manufactured continuously, the method can be realized only by repeating the steps (21) - (25).
In embodiment 3, the present invention provides a method for manufacturing a thick copper plate, which specifically includes steps (1), (3), (4) and (5) which are the same as those in embodiment 1, except that step (2) is as follows:
(2) And manufacturing two layers of solder masks b on the surface of the production plate a.
(21) Pretreatment: comprises one or more of acid washing, plate grinding and sand blasting, and adopts a cleaning device to synchronously finish water washing and drying treatment so as to improve the binding force between the plate surface and the solder mask layer b.
(22) First silk screen: and silk-screen printing solder resist ink on the surface of the production plate a.
Among them, the ink viscosity is preferably 80 to 160dpa.s; the scraper pressure is 4+/-1 kg/cm 2 。
(23) Primary pre-baking: the production board a is baked in a tunnel furnace to semi-cure the solder resist ink.
Among them, the first pre-baking temperature is preferably controlled at 75 ℃ for 20min + -5 min.
(24) And (3) screen printing for the second time: and silk-screen printing a second layer of solder resist ink on the first layer of solder resist ink.
Among them, the ink viscosity is preferably 80 to 160dpa.s; the scraper pressure is 4+/-1 kg/cm 2 。
(25) Second pre-baking: the production board a is baked in a tunnel furnace to semi-cure the solder resist ink.
Wherein the temperature of the second pre-baking is controlled at 75 ℃ for 35+/-5 min.
(26) The second layer of solder resist ink which is cured in half is sequentially exposed and developed to obtain a solder resist layer b.
The resist ink generates certain side etching during exposure and development, and the larger the side etching amount is, the more easily the outer layer line faults are caused, so that the selection range of exposure energy is optimized in the step, and the result is shown in table 2.
TABLE 2
As is clear from Table 2, the amount of undercut decreases with increasing exposure energy, and the exposure energy reaches 500mj/cm 2 After that, the smaller the side etching change is along with the increment of the exposure energy, the too high exposure energy can cause poor exposure, and the energy is preferably 450-550mj/cm in consideration of factors such as production cost and efficiency 2 。
(28) Post-baking for the first time: the production board a is baked in a tunnel furnace to thermally cure the solder resist ink.
Wherein, the temperature of the first post-baking is preferably controlled between 150-160 ℃ for 60min.
In the technical scheme of the embodiment, the method is mainly used for manufacturing two layers of solder masks b, and if a plurality of layers of solder masks b are required to be continuously manufactured, the steps (21) - (28) are only required to be repeated if the number of the layers of the solder masks b is even; the steps (21) - (28) are repeated for the odd number of layers of the multi-layer solder mask b, and the steps (21) - (25) in example 2 are used to manufacture the outermost solder mask b.
It should be noted that, compared with the even-numbered solder mask layer b manufactured by using the technical scheme of embodiment 3 and the even-numbered solder mask layer b manufactured by using the technical scheme of embodiment 2, the technical scheme of embodiment 3 reduces the steps of pretreatment, exposure, development and post-baking once when manufacturing the two-layered solder mask layer b each time by controlling the exposure energy, pre-baking temperature and time, thereby improving the production efficiency.
In embodiment 4, the present invention provides a method for manufacturing a thick copper plate, which specifically comprises the steps of (1), (2), (4) and (5) being the same as those in embodiment 1, except that the step (3) comprises the following steps:
(3) The character ink was silk-screened on the solder mask layer b, and the production board a was baked in a tunnel oven to semi-cure the character ink.
(31) The solder resist layer b is different in color from the ink layer c.
Among them, the solder resist ink is preferably black oil, and the character ink is white oil.
In the technical scheme of the embodiment, the manufactured character pattern d is a downward concave position of the ink layer c, and the solder mask layer b at the position is not blocked by the ink layer c, namely, the colors of the solder mask layer b and the ink layer c are different, so that the character pattern d can be conveniently identified, and the character pattern d is particularly shown in fig. 1-2.
Embodiment 5 the present invention further provides a circuit board prepared by adopting the technical scheme of any one of the above embodiments, and particularly, reference is made to fig. 1 and 3. The solder resist b is different in color from the ink layer c in fig. 1, and the solder resist b is the same in color as the ink layer c in fig. 3. Further, those not described in detail in the present specification are all well known to those skilled in the art.
In comparative example 1,
the method of example 1 in the technical scheme of the Chinese patent application CN115135009A is adopted for character making.
The obtained circuit board is shown in fig. 5-6, and comprises a production board a, a solder mask layer b arranged on the production board a, and a character pattern d printed on the solder mask layer b.
For convenience of comparison with example 5, a thick copper plate was also prepared in this comparative example 1, and specifically, the solder resist layer b was provided in two layers, and the copper thickness was kept the same as that of the thick copper plate of example 5.
And then, silk-screen printing photosensitive ink on a corresponding character area on the second layer of solder mask layer b by utilizing a screen, exposing a character area (namely a light transmission area corresponding to the character pattern d) by utilizing a film e, and developing and curing to obtain the character pattern d.
Comparative example 1 when the character pattern d was produced using the film e, the position on the film e corresponding to the character pattern d was a light transmitting region, and the photosensitive ink was allowed to cure to obtain a projected character pattern d.
In the embodiment 5 of the invention, when the film e is used for manufacturing the character pattern d, the position corresponding to the character pattern d on the film e is a light blocking area, so that the photosensitive ink can be developed to obtain the concave character pattern d.
As can be seen from comparison of fig. 1-2 and fig. 5-6, in comparative example 1, after a layer of solder mask b is manufactured, a layer of solder mask b is continuously manufactured, so as to meet the requirement of a thick copper plate, then photosensitive ink is printed on the character area in the second layer of solder mask b by using screen printing, and then the photosensitive ink on the character area is cured by a film e, so that the circuit board containing the character pattern d is finally obtained. Comparative example 1 the entire process of preparing a circuit board containing a character pattern d, which requires a total of two solder mask operations and screen printing on the second solder mask layer b, printing a character area (i.e., an area corresponding to the character pattern d) with photosensitive ink; after the film e is exposed and developed, a convex character pattern d is obtained, and the thicknesses of the solder mask layer b and the character pattern d both influence the thickness of the circuit board; meanwhile, the obtained character pattern d is convex, and there may be problems of scratch and blurry.
In the embodiment 5 of the invention, only one solder mask layer b is needed to be manufactured, then one ink layer c is manufactured, then the character pattern d of the film e is attached to the ink layer c, and the ink layer c which is blocked by the character pattern d is removed after development and is downwards recessed because the character pattern d is opaque; the ink layer c which is not blocked by the character pattern d is subjected to exposure and polymerization reaction to form a high polymer, and cannot be removed by development, so that the ink layer c is kept in an original state.
That is, compared with comparative example 1, in example 5 of the present invention, the flow of printing the character pattern d by screen printing is first reduced, the film e with the character pattern d is used for positioning the character pattern d, the thickness of the board is reduced (the character pattern d is concave, and the factors influencing the thickness of the board are the thickness of the body of the board and the thickness of the solder mask b), and the production efficiency is improved; secondly, the alignment precision is higher through the film e than that of using a screen printing plate; and finally, the manufactured character pattern d is the downward concave position of the ink layer c, and the problem that the character pattern d is scratched and blurred is avoided.
It should be emphasized that, because the character pattern d is recessed downward in the invention, in order not to obstruct the circuit communication on the circuit board, a thick copper plate needs to be arranged, that is, the thick copper plate character manufacturing method of the invention is mainly aimed at a thick copper plate containing two or more solder masks b; in the process of preparing the character pattern d, the character area of the second layer of solder mask b is developed and removed, so that the character pattern d is obtained, and only photosensitive ink required by the solder mask b is required to be utilized in the whole preparation method, and no ink is required to be added subsequently, so that the utilization amount of the ink is small; in contrast, in the technical solution of the chinese patent application CN115135009a of comparative example 1, when aiming at a thick copper plate, the required solder mask layer b is required to be subjected to screen printing of photosensitive ink, and then the character pattern d is obtained through exposure and development, that is, the photosensitive ink to be used includes the photosensitive ink required by the solder mask layer b and the ink required by the character pattern d, so that the required ink amount is larger and the cost is higher.
The present invention is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention.
Claims (6)
1. The character manufacturing method of the thick copper plate is characterized by comprising the following steps of:
s1: pre-working procedure treatment;
s2: manufacturing at least one layer of solder mask layer on the surface of the production plate;
s3: silk-screen printing character ink on the solder mask layer, and semi-solidifying the silk-screen printing character ink to form an ink layer;
s4: preparing a film with character patterns and attaching the film to the ink layer;
s5: sequentially exposing and developing to remove the ink layer corresponding to the character pattern, thereby obtaining a circuit board with the recessed character pattern;
the thick copper plate is a thick copper plate with the outer layer circuit thickness of more than 70 mu m;
when a solder mask layer is manufactured in step S2, the method specifically includes:
s21: pretreatment;
s22: silk-screen printing is carried out for the first time, and silk-screen printing is carried out on the plate surface of the production plate to form solder resist ink;
s23: pre-baking for the first time to semi-cure the solder resist ink;
s24: exposing and developing the semi-solidified solder resist ink in sequence to obtain a solder resist layer;
s25: post-baking for the first time to solidify the solder mask layer;
the exposure energy used for exposure is 300-400mj/cm 2 ；
When two layers of solder masks are manufactured in step S2, the method specifically comprises:
s21: pretreatment;
s22: performing first silk screen printing, namely silk screen printing a first layer of solder resist ink on the surface of a production plate;
s23: pre-baking for the first time to semi-cure the first layer of solder resist ink;
s24: performing second silk screen printing, namely silk screen printing a second layer of solder resist ink on the first layer of solder resist ink;
s25: a second pre-bake to semi-cure the second layer of solder resist ink;
s26: exposing and developing the semi-solidified second layer of solder resist ink in sequence to obtain a solder resist layer;
s27: post-baking for the first time to solidify the solder mask layer;
the exposure energy adopted by the exposure is 450-550mj/cm 2 。
2. The method for producing thick copper plate characters according to claim 1, wherein the pretreatment comprises one or more of grinding, sand blasting, acid washing, water washing and drying.
3. The method for producing thick copper plate characters according to claim 1, wherein the solder resist layer is different in color from the ink layer.
4. The method of manufacturing a thick copper plate character according to claim 1, wherein when a solder resist layer is formed in step S2, the first pre-baking temperature is controlled to 75 ℃ and the pre-baking time is 45±5min.
5. The method for producing thick copper plate characters according to claim 1, wherein when two solder resists are produced in step S2, the first pre-baking temperature is controlled at 75 ℃ and the pre-baking time is 20min; the temperature of the second pre-baking is controlled at 75 ℃, and the pre-baking time is 35+/-5 min.
6. Use of the thick copper plate character making method according to any one of claims 1-5 in the manufacture of circuit boards.
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