WO2019214051A1 - Fabrication method for protective layer of printed circuit board - Google Patents

Fabrication method for protective layer of printed circuit board Download PDF

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Publication number
WO2019214051A1
WO2019214051A1 PCT/CN2018/095290 CN2018095290W WO2019214051A1 WO 2019214051 A1 WO2019214051 A1 WO 2019214051A1 CN 2018095290 W CN2018095290 W CN 2018095290W WO 2019214051 A1 WO2019214051 A1 WO 2019214051A1
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WO
WIPO (PCT)
Prior art keywords
ink
layer
protective
protective layer
circuit board
Prior art date
Application number
PCT/CN2018/095290
Other languages
French (fr)
Chinese (zh)
Inventor
胡军辉
王亮亮
郭冉
Original Assignee
深圳市百柔新材料技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 深圳市百柔新材料技术有限公司 filed Critical 深圳市百柔新材料技术有限公司
Priority to DE112018007569.9T priority Critical patent/DE112018007569T5/en
Publication of WO2019214051A1 publication Critical patent/WO2019214051A1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/282Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/288Removal of non-metallic coatings, e.g. for repairing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013Inkjet printing, e.g. for printing insulating material or resist
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1322Encapsulation comprising more than one layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1476Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0026Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032Etching of the substrate by chemical or physical means by laser ablation of organic insulating material

Definitions

  • the present application belongs to the technical field of circuit board manufacturing, and more particularly to a method for manufacturing a printed circuit board protective layer.
  • the printed circuit board is a support for electronic components, referred to as PCB.
  • the PCB usually includes a single layer or a multi-layer circuit.
  • a protective layer needs to be applied on the surface of the PCB, commonly known as "green oil.”
  • the current method for making the protective layer is as follows: silkscreen green oil on the surface of the PCB or a semi-cured green oil is applied to completely cover the PCB, and then the green oil is firmly connected to the surface of the PCB by curing; The excess green oil is then removed by exposure to the wet chemical method used first to form a window.
  • the method is complicated in process and pollutes the water body.
  • the method also requires custom auxiliary materials and equipment, which is costly for small batch production.
  • the purpose of the present application is to provide a method for fabricating a protective layer of a printed wiring board, which aims to solve the technical problem of manufacturing a protective layer by using a wet chemical method of exposure and development in the prior art, which has a complicated process, environmental pollution, and high cost.
  • the application provides a method for manufacturing a protective layer of a printed circuit board, comprising the following steps:
  • step S10 includes:
  • the thickness of the first print layer, the second print layer to the Nth print layer ranges from 3 ⁇ m to 5 ⁇ m.
  • the inkjet printer includes an inkjet head and a radiation source provided on one side of the inkjet head for curing the protective ink.
  • step S10 includes:
  • the ink layer is formed by curing the protective ink using a curing radiator.
  • the curing radiator includes one or both of a light radiator and a heat radiator.
  • the light radiator is an ultraviolet curing furnace
  • the heat radiator is a mesh belt furnace or an oven.
  • the resolution of the preset window is greater than 100 ⁇ m, and the resolution of the window opening is less than 100 ⁇ m.
  • step S20 includes:
  • An identification module of the laser engraving machine identifies an image of the protective layer applied on the circuit board and transmits it to the control module to compare with the size information to calculate a path of the laser engraving;
  • the laser head of the laser engraving machine is moved to the edge of the preset window, and the excess protective ink is removed according to the laser engraving path to form the protective layer.
  • the laser engraving machine includes a control module, an identification module, and a laser head
  • the identification module is electrically connected to the control module
  • the identification module is configured to transmit the acquired information to the control module
  • a control module is used to control the movement of the laser head.
  • the laser engraving machine has a lateral resolution of less than or equal to 5 ⁇ m, and the laser engraving machine has a longitudinal resolution of less than or equal to 5 ⁇ m.
  • step S20 the cleaning ink remaining on the circuit board is further cleaned.
  • the protective ink is composed of a thixotropic agent and an epoxy resin.
  • the thixotropic agent is one or more of a hydrogenated castor oil derivative, a polyamide wax, a polyurea, a fumed silica, a bentonite, and an oxidized polyethylene.
  • the manufacturing method of the printed circuit board protective layer provided by the present application has the beneficial effects that the manufacturing method of the printed circuit board protective layer of the present application is first coated and solidified on the surface of the circuit board to form a preset opening window.
  • the ink layer is then taken out by the laser engraving machine to remove the excess protective ink at the inner edge of the preset window to ensure the precision of the window opening.
  • the method does not need to adopt a process such as exposure and development to make a protective layer, and the process is simple and pollution-free, and the ink is protected.
  • the material utilization rate is high, and the resolution of window opening is high, which is suitable for various volume production such as proofing, small batch, and large batch.
  • FIG. 1 is a flow chart of a method for fabricating a protective layer of a printed circuit board according to an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of a circuit board according to an embodiment of the present application.
  • FIG. 3 is a structural view of an ink coating layer provided by an embodiment of the present application.
  • FIG. 4 is a structural view of an ink coating layer according to another embodiment of the present application.
  • FIG. 5 is a structural diagram of a circuit board coated with a protective layer according to an embodiment of the present application.
  • first, second, and the like are used for the purpose of description only, and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” and “second” may include one or more of the features either explicitly or implicitly.
  • the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.
  • the manufacturing method of the printed circuit board protective layer comprises the following steps:
  • the circuit layer 11 and the insulating layer of the circuit board 1 have been completed, and the protective layer 3 protects the surface of the circuit board 1.
  • the carved window 301 on the protective layer 3 exposes the lines on the surface of the circuit board 1 for subsequent soldering, tin plating, and the like.
  • the manufacturing method of the protective layer of the printed circuit board provided by the present application is compared with the prior art, and the manufacturing method of the protective layer of the printed wiring board of the present application is first coated and solidified on the surface of the circuit board 1 to form the ink having the preset opening window 201.
  • Layer 2 then remove the excess protective ink at the inner edge of the preset window 201 by the laser engraving machine to ensure the precision of window opening.
  • the method does not need to adopt the process of exposure and development to make the protective layer 3, the process is simple, no pollution, and the ink is protected.
  • the material utilization rate is high, and the resolution of window opening is high, which is suitable for various volume production such as proofing, small batch, and large batch.
  • the resolution of the preset window 201 is greater than 100 ⁇ m, and the resolution of the window 301 is less than 100 ⁇ m.
  • the ink layer 2 is directly coated on the circuit board 1. Under the limitation of the printing and silk screen technology, the resolution of the preset window 201 is low.
  • the preset window 201 is carved by a laser engraving machine. The excess protective ink is removed to form a carved window 301 having a resolution of less than 100 ⁇ m, which satisfies the precision requirement of the circuit board 1 for the protective layer 3.
  • the protective ink is composed of a thixotropic agent, an epoxy resin or the like, and a thixotropic network can be formed between the thixotropic molecules, so that the ink has a pseudoplastic or thixotropic substance, and the thixotropic agent can be a hydrogenated castor oil derivative.
  • a polyamide wax, a polyurea, a fumed silica, a modified material thereof, a bentonite, an oxidized polyethylene, and the like After the epoxy resin is cured, its long-term heat resistance temperature is above 180oC, so that the ink layer 2 has better heat resistance.
  • the protective ink has photocuring or heat curing properties, and is rapidly cured under a certain light energy or thermal energy radiation, and the thickness of the protective layer is greater than or equal to 10 ⁇ m.
  • the protective ink has the following properties after being completely cured: the breakdown voltage is greater than 1000 V, and the surface hardness is Above 2H, the adhesion to the substrate is greater than 10N.
  • the organic monomer of the small molecule in the protective ink can be connected during the low-temperature photocuring process, and no waste discharge is generated in the subsequent process.
  • step S10 includes:
  • Printing ink is printed and cured on the circuit board 1 using an inkjet printer to form a first printed layer 21;
  • the thickness of the first printing layer 21, the second printing layer 22 to the Nth printing layer ranges from 3 ⁇ m to 5 ⁇ m.
  • an inkjet printer includes an inkjet head and a radiation source.
  • the ink jet head is smaller in size than the wiring board 1, and it is impossible to print the desired ink layer 2 by one-way motion.
  • the printing path of the inkjet head may specifically be: after the inkjet head is printed in the horizontal positive direction, the inkjet head moves a certain distance toward the vertical direction, and then moves the inkjet in the horizontal reverse direction until the single layer printing layer is printed.
  • the radiation source illuminates the printed protective ink to cure or semi-cure the ink. After the protective ink of each layer is printed, the protective ink of the layer is correspondingly in the radiation source. Cured or semi-cured under effect.
  • the relative positions of the ink jet head and the radiation source are not limited herein. More specifically, the protective ink is semi-cured under conditions of light irradiation, and the protective ink after the semi-curing is kept in a non-flowing state at 250 ° C or less.
  • the radiation source emits light as an initiation source to cure the ink of each layer, and the radiation source can be UV light or light emitted by a fluorescent lamp such as an LED.
  • the ink layer 2 can be completely cured by photocuring or heat curing to have high structural strength and insulating electrical properties.
  • the ink layer 2 is composed of the first print layer 21, the second print layer 22, and the Nth print layer 2, where N is an integer greater than or equal to 3.
  • the ink layer 2 may also be formed by superposing only the first printing layer 21 and the second printing layer 22, in which case, the thickness of the first printing layer 21 and the second printing layer 22 are both 5 ⁇ m, and the thickness of the ink layer 2 is It is 10 ⁇ m.
  • step S10 includes:
  • the ink layer 2 is formed by curing the protective ink using a curing radiator.
  • the protective ink is printed on the surface of the wiring board 1 at a time by a screen printing screen, and then the protective ink is cured by a curing radiator to form the ink layer 2.
  • the screen printing screen is printed, the printing head is unidirectionally printed in the horizontal direction, or unidirectionally printed in the vertical direction, and the ink layer 2 is formed in one printing.
  • the protective ink is cured by the curing radiator, the specific steps are as follows: the circuit board 1 is placed in an optical radiator such as an ultraviolet curing oven, the ink is protected by light, semi-cured, and formed into a non-flowing state, and then the circuit board 1 is placed in the net. In the heat radiator with a furnace or an oven, the protective ink is completely cured.
  • step S20 Referring to FIG. 5, in step S20:
  • the excess protective ink at the inner edge of the preset opening window 201 is removed using a laser engraving machine to form a sculpted opening window 301.
  • the lateral resolution of the laser engraving machine is less than or equal to 5 ⁇ m
  • the longitudinal resolution of the laser engraving machine is less than or equal to 5 ⁇ m, thereby ensuring the precision of laser engraving, so that the precision of the engraving window 301 satisfies the design requirements.
  • Step S20 includes:
  • the identification module of the laser engraving machine identifies the image of the ink layer 2 coated on the circuit board 1, and transmits it to the control module to compare with the size information to calculate the path of the laser engraving;
  • the laser head of the laser engraving machine is moved to the edge of the preset window 201, and the excess protective ink is removed according to the laser engraving path to form the protective layer 3.
  • the laser engraving machine comprises a control module, an identification module and a laser head.
  • the identification module is electrically connected with the control module. After the information acquired by the identification module is transmitted to the control module, the control module can calculate the movement path of the laser head according to the information, and control the laser. The movement of the head.
  • the identification module of the laser engraving machine takes a picture of the image of the circuit board 1 and the ink layer 2, and sends the taken photo to the control module, and after the control module analyzes, Comparing the size information of the circuit board 1 in the photo information with the pre-stored size information of the circuit board 1, and positioning the position of the engraving window 301 by the size information of the pre-stored engraving window 301, and calculating the laser head carving
  • the path is then moved to the top of the preset window 201, and the excess protective ink is removed in accordance with its calculated path motion to form the protective layer 3.
  • the manufacturing method of the printed circuit board protective layer further comprises cleaning the residual protective ink on the circuit board to remove the waste ink remaining after the laser burning, thereby further improving the surface quality of the circuit board.
  • the steps of tin plating, soldering, etc. may be included, which are not limited herein.

Abstract

A fabrication method for a protective layer of a printed circuit board, comprising the following steps: coating a protective ink on a surface of a circuit board (1) and curing same to form an ink layer (2), wherein the ink layer (2) has a preset open window (201), and the thickness of the ink layer (2) is greater than or equal to 10µm; and then, using a laser engraving machine to remove excess protective ink from the inner edges of the preset open window (201) so as to form a protective layer that has a finely engraved open window (301). The fabrication method for a protective layer of a printed circuit board provided in the present application does not require the use of processes such as exposure and development to fabricate a protective layer, and the technique therefor is thus simple and pollution-free; the utilization ratio of protective ink material is high, the resolution of the open window is high, and the present invention is suitable for the production of various dimensions, such as proofing, small-batch and large-batch production.

Description

印刷线路板保护层的制作方法Printed circuit board protective layer manufacturing method 技术领域Technical field
本申请属于线路板制造技术领域,更具体地说,是涉及一种印刷线路板保护层的制作方法。The present application belongs to the technical field of circuit board manufacturing, and more particularly to a method for manufacturing a printed circuit board protective layer.
背景技术Background technique
印刷线路板是电子元器件的支撑体,简称PCB。PCB通常包括单层或多层线路,当PCB上的线路层以及绝缘层制作完毕后,需要在PCB的表面涂覆保护层,俗称“绿油”。目前制作该保护层的方法如下:在PCB的表面丝印绿油或者贴合半固化的绿油,使其完全覆盖于PCB上,然后通过固化的方法将绿油牢固连接于PCB的表面上;然后再通过曝光先用的湿化学方法取出多余的绿油,形成开窗。该方法制程复杂,而且会污染水体,使用该方法还需要定制辅助材料器具,对于小批量生产来说其成本较高。The printed circuit board is a support for electronic components, referred to as PCB. The PCB usually includes a single layer or a multi-layer circuit. When the circuit layer and the insulating layer on the PCB are fabricated, a protective layer needs to be applied on the surface of the PCB, commonly known as "green oil." The current method for making the protective layer is as follows: silkscreen green oil on the surface of the PCB or a semi-cured green oil is applied to completely cover the PCB, and then the green oil is firmly connected to the surface of the PCB by curing; The excess green oil is then removed by exposure to the wet chemical method used first to form a window. The method is complicated in process and pollutes the water body. The method also requires custom auxiliary materials and equipment, which is costly for small batch production.
技术问题technical problem
本申请的目的在于提供一种印刷线路板保护层的制作方法,旨在解决现有技术中,使用曝光显影的湿化学方法制作保护层,其制程复杂、污染环境且成本较高的技术问题。The purpose of the present application is to provide a method for fabricating a protective layer of a printed wiring board, which aims to solve the technical problem of manufacturing a protective layer by using a wet chemical method of exposure and development in the prior art, which has a complicated process, environmental pollution, and high cost.
技术解决方案Technical solution
本申请提供了一种印刷线路板保护层的制作方法,包括如下步骤:The application provides a method for manufacturing a protective layer of a printed circuit board, comprising the following steps:
S10:在线路板的表面涂覆保护油墨,并固化形成油墨层,所述油墨层具有预设开窗,且所述油墨层的厚度大于或者等于10µm;S10: coating a protective ink on the surface of the circuit board, and curing to form an ink layer, the ink layer has a predetermined opening window, and the thickness of the ink layer is greater than or equal to 10 μm;
S20:使用激光雕刻机去除所述预设开窗内边缘处多余的保护油墨,形成具有精雕开窗的保护层。S20: removing excess protective ink at the inner edge of the preset window by using a laser engraving machine to form a protective layer with a carved window.
进一步地,步骤S10包括:Further, step S10 includes:
使用喷墨打印机将保护油墨打印并固化于所述线路板上,形成第一打印层;Printing and curing the protective ink on the circuit board using an inkjet printer to form a first print layer;
使用喷墨打印机将保护油墨打印并固化于第一打印层上,形成第二打印层;Printing and curing the protective ink on the first printing layer using an inkjet printer to form a second printing layer;
重复上述步骤,直至形成所述油墨层;Repeating the above steps until the ink layer is formed;
其中,第一打印层、第二打印层至第N打印层的厚度范围均为3µm至5µm。The thickness of the first print layer, the second print layer to the Nth print layer ranges from 3 μm to 5 μm.
进一步地,所述喷墨打印机包括喷墨头和设于所述喷墨头一侧用于固化保护油墨的辐射光源。Further, the inkjet printer includes an inkjet head and a radiation source provided on one side of the inkjet head for curing the protective ink.
进一步地,步骤S10包括:Further, step S10 includes:
使用丝印网板将保护油墨印刷至线路板上;Printing the protective ink onto the circuit board using a screen printing screen;
使用固化辐射器固化保护油墨形成所述油墨层。The ink layer is formed by curing the protective ink using a curing radiator.
进一步地,所述固化辐射器包括光辐射器、热辐射器中的一种或两种。Further, the curing radiator includes one or both of a light radiator and a heat radiator.
进一步地,所述光辐射器为紫外线固化炉,所述热辐射器为网带炉或者烘箱。Further, the light radiator is an ultraviolet curing furnace, and the heat radiator is a mesh belt furnace or an oven.
进一步地,所述预设开窗的分辨率大于100µm,所述精雕开窗的分辨率均小于100µm。Further, the resolution of the preset window is greater than 100 μm, and the resolution of the window opening is less than 100 μm.
进一步地,步骤S20包括:Further, step S20 includes:
将所述线路板及精雕开窗的尺寸信息发送至激光雕刻机的控制模块;Sending the size information of the circuit board and the carved window to the control module of the laser engraving machine;
激光雕刻机的识别模块识别涂覆于线路板上的保护层的图像,并将其传送至控制模块与所述尺寸信息比对,计算激光雕刻的路径;An identification module of the laser engraving machine identifies an image of the protective layer applied on the circuit board and transmits it to the control module to compare with the size information to calculate a path of the laser engraving;
使激光雕刻机的激光头移动至预设开窗的边缘处,根据激光雕刻的路径去除多余的保护油墨,形成所述保护层。The laser head of the laser engraving machine is moved to the edge of the preset window, and the excess protective ink is removed according to the laser engraving path to form the protective layer.
进一步地,所述激光雕刻机包括控制模块、识别模块以及激光头,所述识别模块与所述控制模块电连接,所述识别模块用于将所获取的信息传送至所述控制模块,所述控制模块用于控制所述激光头的运动。Further, the laser engraving machine includes a control module, an identification module, and a laser head, the identification module is electrically connected to the control module, and the identification module is configured to transmit the acquired information to the control module, A control module is used to control the movement of the laser head.
进一步地,所述激光雕刻机的横向分辨率小于或者等于5µm,所述激光雕刻机的纵向分辨率小于或者等于5µm。Further, the laser engraving machine has a lateral resolution of less than or equal to 5 μm, and the laser engraving machine has a longitudinal resolution of less than or equal to 5 μm.
进一步地,在步骤S20后,还包括清洗所述线路板残留的保护油墨。Further, after the step S20, the cleaning ink remaining on the circuit board is further cleaned.
进一步地,所述保护油墨由触变剂和环氧树脂组成。Further, the protective ink is composed of a thixotropic agent and an epoxy resin.
进一步地,所述触变剂为氢化蓖麻油衍生物、聚酰胺蜡类、聚脲类、气相二氧化硅、膨润土类、氧化聚乙烯类中的一种或多种。Further, the thixotropic agent is one or more of a hydrogenated castor oil derivative, a polyamide wax, a polyurea, a fumed silica, a bentonite, and an oxidized polyethylene.
有益效果Beneficial effect
本申请提供的印刷线路板保护层的制作方法的有益效果在于:与现有技术相比,本申请印刷线路板保护层的制作方法先在线路板的表面涂覆并固化形成具有预设开窗的油墨层,然后通过激光雕刻机取出预设开窗内边缘处多余的保护油墨,保证开窗的精度,该方法无需采用曝光显影等制程制作保护层,工艺简单、无污染,对保护油墨的材料利用率高、且开窗的分辨率高,适合打样、小批量、大批量等各种体量的生产。The manufacturing method of the printed circuit board protective layer provided by the present application has the beneficial effects that the manufacturing method of the printed circuit board protective layer of the present application is first coated and solidified on the surface of the circuit board to form a preset opening window. The ink layer is then taken out by the laser engraving machine to remove the excess protective ink at the inner edge of the preset window to ensure the precision of the window opening. The method does not need to adopt a process such as exposure and development to make a protective layer, and the process is simple and pollution-free, and the ink is protected. The material utilization rate is high, and the resolution of window opening is high, which is suitable for various volume production such as proofing, small batch, and large batch.
附图说明DRAWINGS
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其它的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the embodiments or the prior art description will be briefly described below. Obviously, the drawings in the following description are only the present application. For some embodiments, other drawings may be obtained from those skilled in the art without departing from the drawings.
图1为本申请实施例提供的印刷线路板保护层的制作方法流程图;1 is a flow chart of a method for fabricating a protective layer of a printed circuit board according to an embodiment of the present application;
图2为本申请实施例提供的线路板的结构示意图;2 is a schematic structural diagram of a circuit board according to an embodiment of the present application;
图3为本申请实施例提供的涂覆油墨层时的结构图;3 is a structural view of an ink coating layer provided by an embodiment of the present application;
图4为本申请另一实施例提供的涂覆油墨层时的结构图;4 is a structural view of an ink coating layer according to another embodiment of the present application;
图5为本申请实施例提供的涂覆有保护层的线路板的结构图。FIG. 5 is a structural diagram of a circuit board coated with a protective layer according to an embodiment of the present application.
其中,图中各附图标记:Among them, the various reference numerals in the figure:
1-线路板;11-线路层;2-油墨层;201-预设开窗;21-第一打印层;22-第二打印层;3-保护层;301-精雕开窗。1-circuit board; 11-circuit layer; 2-ink layer; 201-preset window; 21-first print layer; 22-second print layer; 3-protective layer; 301-finished window.
本发明的实施方式Embodiments of the invention
为了使本申请所要解决的技术问题、技术方案及有益效果更加清楚明白,以下结合附图及实施例,对本申请进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本申请,并不用于限定本申请。In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clear, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the application and are not intended to be limiting.
需要说明的是,当元件被称为“固定于”或“设置于”另一个元件,它可以直接在另一个元件上或者间接在该另一个元件上。当一个元件被称为是“连接于”另一个元件,它可以是直接连接到另一个元件或间接连接至该另一个元件上。It is to be noted that when an element is referred to as being "fixed" or "in" another element, it can be directly on the other element or indirectly. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or indirectly connected to the other element.
需要理解的是,术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top" The orientation or positional relationship of the "bottom", "inside", "outside" and the like is based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present application and simplified description, and does not indicate or imply the indicated device. Or the components must have a particular orientation, constructed and operated in a particular orientation, and thus are not to be construed as limiting.
此外,术语“第一”、“第二”等仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。Moreover, the terms "first", "second", and the like are used for the purpose of description only, and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" may include one or more of the features either explicitly or implicitly. In the description of the present application, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.
请一并参阅图1至图5,现对本申请提供的印刷线路板保护层的制作方法进行说明。该印刷线路板保护层的制作方法,包括如下步骤:Referring to FIG. 1 to FIG. 5 together, a method for manufacturing a printed circuit board protective layer provided by the present application will now be described. The manufacturing method of the printed circuit board protective layer comprises the following steps:
S10:在线路板1的表面涂覆保护油墨,并固化形成油墨层2,油墨层2具有预设开窗201,且油墨层2的厚度大于或者等于10µm;S10: coating the surface of the circuit board 1 with protective ink, and curing to form an ink layer 2, the ink layer 2 has a predetermined opening window 201, and the thickness of the ink layer 2 is greater than or equal to 10 μm;
S20:使用激光雕刻机去除预设开窗201内边缘处多余的保护油墨,形成具有精雕开窗301的保护层3。S20: removing excess protective ink at the inner edge of the preset window 201 by using a laser engraving machine to form a protective layer 3 having a carved window 301.
其中线路板1的线路层11和绝缘层已经制作完成,保护层3对线路板1的表面起保护作用。保护层3上的精雕开窗301可使线路板1表面上的线路露出,便于后续焊接、镀锡等。The circuit layer 11 and the insulating layer of the circuit board 1 have been completed, and the protective layer 3 protects the surface of the circuit board 1. The carved window 301 on the protective layer 3 exposes the lines on the surface of the circuit board 1 for subsequent soldering, tin plating, and the like.
本申请提供的印刷线路板保护层的制作方法,与现有技术相比,本申请印刷线路板保护层的制作方法先在线路板1的表面涂覆并固化形成具有预设开窗201的油墨层2,然后通过激光雕刻机取出预设开窗201内边缘处多余的保护油墨,保证开窗的精度,该方法无需采用曝光显影等制程制作保护层3,工艺简单、无污染,对保护油墨的材料利用率高、且开窗的分辨率高,适合打样、小批量、大批量等各种体量的生产。The manufacturing method of the protective layer of the printed circuit board provided by the present application is compared with the prior art, and the manufacturing method of the protective layer of the printed wiring board of the present application is first coated and solidified on the surface of the circuit board 1 to form the ink having the preset opening window 201. Layer 2, then remove the excess protective ink at the inner edge of the preset window 201 by the laser engraving machine to ensure the precision of window opening. The method does not need to adopt the process of exposure and development to make the protective layer 3, the process is simple, no pollution, and the ink is protected. The material utilization rate is high, and the resolution of window opening is high, which is suitable for various volume production such as proofing, small batch, and large batch.
进一步地,预设开窗201的分辨率大于100µm,所述精雕开窗301的分辨率均小于100µm。直接涂覆于线路板1上油墨层2,在打印及丝印技术的限制下,其预设开窗201的分辨率较低,在本实施例中,通过激光雕刻机精雕预设开窗201,去除多余的保护油墨,形成分辨率小于100µm的精雕开窗301,满足线路板1对保护层3的精度需求。Further, the resolution of the preset window 201 is greater than 100 μm, and the resolution of the window 301 is less than 100 μm. The ink layer 2 is directly coated on the circuit board 1. Under the limitation of the printing and silk screen technology, the resolution of the preset window 201 is low. In the embodiment, the preset window 201 is carved by a laser engraving machine. The excess protective ink is removed to form a carved window 301 having a resolution of less than 100 μm, which satisfies the precision requirement of the circuit board 1 for the protective layer 3.
进一步地,保护油墨由触变剂、环氧树脂等材料组成,触变剂分子之间可形成触变网络,使油墨具有假塑性或者触变性的物质,触变剂可为氢化蓖麻油衍生物、聚酰胺蜡类、聚脲类、气相二氧化硅及其改性物质、膨润土类、氧化聚乙烯类等中的一种或多种组合物。环氧树脂固化后,其长期耐热温度在180ºC以上,使油墨层2具有较好的耐热性能。Further, the protective ink is composed of a thixotropic agent, an epoxy resin or the like, and a thixotropic network can be formed between the thixotropic molecules, so that the ink has a pseudoplastic or thixotropic substance, and the thixotropic agent can be a hydrogenated castor oil derivative. One or more of a polyamide wax, a polyurea, a fumed silica, a modified material thereof, a bentonite, an oxidized polyethylene, and the like. After the epoxy resin is cured, its long-term heat resistance temperature is above 180oC, so that the ink layer 2 has better heat resistance.
保护油墨具有光固化或者热固化特性,在一定光能或者热能的辐射下快速固化,且保护层的厚度大于或者等于10µm,保护油墨完全固化后具有如下性能:其击穿电压大于1000V,表面硬度大于2H,与基材之间的附着力大于10N。该保护油墨中小分子两的有机单体可在低温光固化的过程中连接,在后续的工艺中不会产生废弃排放。The protective ink has photocuring or heat curing properties, and is rapidly cured under a certain light energy or thermal energy radiation, and the thickness of the protective layer is greater than or equal to 10 μm. The protective ink has the following properties after being completely cured: the breakdown voltage is greater than 1000 V, and the surface hardness is Above 2H, the adhesion to the substrate is greater than 10N. The organic monomer of the small molecule in the protective ink can be connected during the low-temperature photocuring process, and no waste discharge is generated in the subsequent process.
请参阅图3,在本申请提供的印刷线路板保护层的一种实施方式中,步骤S10包括:Referring to FIG. 3, in an implementation manner of the printed circuit board protection layer provided by the present application, step S10 includes:
使用喷墨打印机将保护油墨打印并固化于线路板1上,形成第一打印层21;Printing ink is printed and cured on the circuit board 1 using an inkjet printer to form a first printed layer 21;
使用喷墨打印机将保护油墨打印并固化于第一打印层21上,形成第二打印层22;Printing and curing the protective ink on the first printing layer 21 using an inkjet printer to form a second printing layer 22;
重复上述步骤,直至形成所述油墨层2;Repeat the above steps until the ink layer 2 is formed;
其中,第一打印层21、第二打印层22至第N打印层的厚度范围均为3µm至5µm。The thickness of the first printing layer 21, the second printing layer 22 to the Nth printing layer ranges from 3 μm to 5 μm.
进一步地,喷墨打印机包括喷墨头和辐射光源。喷墨头与线路板1相比,其尺寸较小,无法通过单向运动打印出所需的油墨层2。喷墨头的打印路径具体可为:喷墨头沿水平正方向打印完成后,喷墨头朝向竖直方向移动一定的距离,然后沿水平反方向移动喷墨,直至单层打印层打印完成。喷墨头在喷墨打印的过程中,辐射光源光辐射打印出的保护油墨,使油墨固化或者半固化,在每一层的保护油墨打印完成后,该层保护油墨也相应地在辐射光源的作用下固化或者半固化完成。喷墨头和辐射光源的相对位置此处不作限定。更具体地,保护油墨在光辐射的条件下半固化,半固化后的保护油墨在250ºC以下一直处于非流动状态。需要说明的是,辐射光源发出光线作为引发光源使每一层的油墨固化,辐射光源可为UV光或者是LED等日光灯发出的光。当然,油墨层2完全形成后,也可再次采用光固化或者热固化的方式使油墨层2完全固化,使其具有较高的结构强度和绝缘电气性能。Further, an inkjet printer includes an inkjet head and a radiation source. The ink jet head is smaller in size than the wiring board 1, and it is impossible to print the desired ink layer 2 by one-way motion. The printing path of the inkjet head may specifically be: after the inkjet head is printed in the horizontal positive direction, the inkjet head moves a certain distance toward the vertical direction, and then moves the inkjet in the horizontal reverse direction until the single layer printing layer is printed. In the process of inkjet printing, the radiation source illuminates the printed protective ink to cure or semi-cure the ink. After the protective ink of each layer is printed, the protective ink of the layer is correspondingly in the radiation source. Cured or semi-cured under effect. The relative positions of the ink jet head and the radiation source are not limited herein. More specifically, the protective ink is semi-cured under conditions of light irradiation, and the protective ink after the semi-curing is kept in a non-flowing state at 250 ° C or less. It should be noted that the radiation source emits light as an initiation source to cure the ink of each layer, and the radiation source can be UV light or light emitted by a fluorescent lamp such as an LED. Of course, after the ink layer 2 is completely formed, the ink layer 2 can be completely cured by photocuring or heat curing to have high structural strength and insulating electrical properties.
需要说明的是,在该实施例中,油墨层2由第一打印层21、第二打印层22、直至第N打印层2组成,这里N为大于或者等于3的整数。当然,油墨层2也可只由第一打印层21和第二打印层22叠加而成,此时,第一打印层21和第二打印层22的厚度均为5µm,油墨层2的厚度则为10µm。It should be noted that, in this embodiment, the ink layer 2 is composed of the first print layer 21, the second print layer 22, and the Nth print layer 2, where N is an integer greater than or equal to 3. Of course, the ink layer 2 may also be formed by superposing only the first printing layer 21 and the second printing layer 22, in which case, the thickness of the first printing layer 21 and the second printing layer 22 are both 5 μm, and the thickness of the ink layer 2 is It is 10 μm.
请参阅图4,在本申请提供的印刷线路板保护层的另一种实施方式中,步骤S10包括:Referring to FIG. 4, in another implementation manner of the printed circuit board protection layer provided by the present application, step S10 includes:
使用丝印网板将保护油墨印刷至线路板1上;Printing the protective ink onto the circuit board 1 using a screen printing stencil;
使用固化辐射器固化保护油墨形成油墨层2。The ink layer 2 is formed by curing the protective ink using a curing radiator.
在该实施例中,保护油墨通过丝印网板一次性印刷至线路板1的表面上,然后采用固化辐射器固化保护油墨形成油墨层2。具体地,丝印网板印刷时,印刷头沿水平方向单向印刷,或者沿竖直方向单向印刷,一次印刷即可形成油墨层2。采用固化辐射器固化保护油墨时,具体步骤为:将线路板1放入紫外线固化炉等光辐射器中,光照保护油墨,使其半固化,形成非流动状态,然后将线路板1放入网带炉或者烘箱等热辐射器中,使保护油墨完全固化。In this embodiment, the protective ink is printed on the surface of the wiring board 1 at a time by a screen printing screen, and then the protective ink is cured by a curing radiator to form the ink layer 2. Specifically, when the screen printing screen is printed, the printing head is unidirectionally printed in the horizontal direction, or unidirectionally printed in the vertical direction, and the ink layer 2 is formed in one printing. When the protective ink is cured by the curing radiator, the specific steps are as follows: the circuit board 1 is placed in an optical radiator such as an ultraviolet curing oven, the ink is protected by light, semi-cured, and formed into a non-flowing state, and then the circuit board 1 is placed in the net. In the heat radiator with a furnace or an oven, the protective ink is completely cured.
请参阅图5,在步骤S20中:Referring to FIG. 5, in step S20:
使用激光雕刻机去除预设开窗201内边缘处多余的保护油墨,形成精雕开窗301。The excess protective ink at the inner edge of the preset opening window 201 is removed using a laser engraving machine to form a sculpted opening window 301.
其中激光雕刻机的横向分辨率小于或者等于5µm,所述激光雕刻机的纵向分辨率小于或者等于5µm,从而保证激光雕刻的精度,使精雕开窗301的精度满足设计需求。Wherein the lateral resolution of the laser engraving machine is less than or equal to 5 μm, the longitudinal resolution of the laser engraving machine is less than or equal to 5 μm, thereby ensuring the precision of laser engraving, so that the precision of the engraving window 301 satisfies the design requirements.
步骤S20包括:Step S20 includes:
将线路板1及精雕开窗301的尺寸信息发送至激光雕刻机的控制模块;Sending the size information of the circuit board 1 and the carved window 301 to the control module of the laser engraving machine;
激光雕刻机的识别模块识别涂覆于线路板1上的油墨层2的图像,并将其传送至控制模块与尺寸信息比对,计算激光雕刻的路径;The identification module of the laser engraving machine identifies the image of the ink layer 2 coated on the circuit board 1, and transmits it to the control module to compare with the size information to calculate the path of the laser engraving;
使激光雕刻机的激光头移动至预设开窗201的边缘处,根据激光雕刻的路径去除多余的保护油墨,形成保护层3。The laser head of the laser engraving machine is moved to the edge of the preset window 201, and the excess protective ink is removed according to the laser engraving path to form the protective layer 3.
激光雕刻机包括控制模块、识别模块以及激光头,识别模块与控制模块电连接,识别模块所获取的信息传送至控制模块后,控制模块可根据该信息计算出激光头的运动路径,并控制激光头的运动。具体地,当线路板1置于激光雕刻机的下方时,激光雕刻机的识别模块对线路板1及油墨层2的图像进行拍照,并将拍摄的照片发送至控制模块,控制模块分析后,将该照片信息中的线路板1的尺寸信息和预存的线路板1尺寸信息对比,并通过预存的精雕开窗301的尺寸信息定位所述精雕开窗301的位置,计算激光头精雕的路径,然后将激光头移至预设开窗201的上方,按照其计算的路径运动去除多余的保护油墨,形成保护层3。The laser engraving machine comprises a control module, an identification module and a laser head. The identification module is electrically connected with the control module. After the information acquired by the identification module is transmitted to the control module, the control module can calculate the movement path of the laser head according to the information, and control the laser. The movement of the head. Specifically, when the circuit board 1 is placed under the laser engraving machine, the identification module of the laser engraving machine takes a picture of the image of the circuit board 1 and the ink layer 2, and sends the taken photo to the control module, and after the control module analyzes, Comparing the size information of the circuit board 1 in the photo information with the pre-stored size information of the circuit board 1, and positioning the position of the engraving window 301 by the size information of the pre-stored engraving window 301, and calculating the laser head carving The path is then moved to the top of the preset window 201, and the excess protective ink is removed in accordance with its calculated path motion to form the protective layer 3.
在步骤S20后:After step S20:
该印刷线路板保护层的制作方法还包括清洗线路板上残留的保护油墨,以去除激光烧灼后残留下来的废弃油墨,进一步提高该线路板的表面质量。当然,在步骤S20后还可包括镀锡、焊接等步骤,此处不作限定。The manufacturing method of the printed circuit board protective layer further comprises cleaning the residual protective ink on the circuit board to remove the waste ink remaining after the laser burning, thereby further improving the surface quality of the circuit board. Of course, after the step S20, the steps of tin plating, soldering, etc. may be included, which are not limited herein.
以上所述仅为本申请的较佳实施例而已,并不用以限制本申请,凡在本申请的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本申请的保护范围之内。The above is only the preferred embodiment of the present application, and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection of the present application. Within the scope.

Claims (13)

  1. 印刷线路板保护层的制作方法,其特征在于,包括如下步骤:The manufacturing method of the printed circuit board protective layer is characterized in that the method comprises the following steps:
    S10:在线路板的表面涂覆保护油墨,并固化形成油墨层,所述油墨层具有预设开窗,且所述油墨层的厚度大于或者等于10µm;S10: coating a protective ink on the surface of the circuit board, and curing to form an ink layer, the ink layer has a predetermined opening window, and the thickness of the ink layer is greater than or equal to 10 μm;
    S20:使用激光雕刻机去除所述预设开窗内边缘处多余的保护油墨,形成具有精雕开窗的保护层。S20: removing excess protective ink at the inner edge of the preset window by using a laser engraving machine to form a protective layer with a carved window.
  2. 如权利要求1所述的印刷线路板保护层的制作方法,其特征在于,步骤S10包括:The method of manufacturing a protective layer of a printed wiring board according to claim 1, wherein the step S10 comprises:
    使用喷墨打印机将保护油墨打印并固化于所述线路板上,形成第一打印层;Printing and curing the protective ink on the circuit board using an inkjet printer to form a first print layer;
    使用喷墨打印机将保护油墨打印并固化于第一打印层上,形成第二打印层;Printing and curing the protective ink on the first printing layer using an inkjet printer to form a second printing layer;
    重复上述步骤,直至形成所述油墨层;Repeating the above steps until the ink layer is formed;
    其中,第一打印层、第二打印层至第N打印层的厚度范围均为3µm至5µm。The thickness of the first print layer, the second print layer to the Nth print layer ranges from 3 μm to 5 μm.
  3. 如权利要求2所述的印刷线路板保护层的制作方法,其特征在于,所述喷墨打印机包括喷墨头和设于所述喷墨头一侧用于固化保护油墨的辐射光源。A method of manufacturing a printed wiring board protective layer according to claim 2, wherein said ink jet printer comprises an ink jet head and a radiation source provided on one side of said ink jet head for curing the protective ink.
  4. 如权利要求1所述的印刷线路板保护层的制作方法,其特征在于,步骤S10包括:The method of manufacturing a protective layer of a printed wiring board according to claim 1, wherein the step S10 comprises:
    使用丝印网板将保护油墨印刷至线路板上;Printing the protective ink onto the circuit board using a screen printing screen;
    使用固化辐射器固化保护油墨形成所述油墨层。The ink layer is formed by curing the protective ink using a curing radiator.
  5. 如权利要求4所述的印刷线路板保护层的制作方法,其特征在于,所述固化辐射器包括光辐射器、热辐射器中的一种或两种。The method of fabricating a protective layer of a printed wiring board according to claim 4, wherein the curing radiator comprises one or both of a light radiator and a heat radiator.
  6. 如权利要求5所述的印刷线路板保护层的制作方法,其特征在于,所述光辐射器为紫外线固化炉,所述热辐射器为网带炉或者烘箱。The method of manufacturing a printed wiring board protective layer according to claim 5, wherein the light radiator is an ultraviolet curing furnace, and the heat radiator is a mesh belt furnace or an oven.
  7. 如权利要求1所述的印刷线路板保护层的制作方法,其特征在于,所述预设开窗的分辨率大于100µm,所述精雕开窗的分辨率均小于100µm。The method for manufacturing a protective layer of a printed wiring board according to claim 1, wherein the resolution of the predetermined window is greater than 100 μm, and the resolution of the window is less than 100 μm.
  8. 如权利要求1所述的印刷线路板保护层的制作方法,其特征在于,步骤S20包括:The method of manufacturing a protective layer of a printed wiring board according to claim 1, wherein the step S20 comprises:
    将所述线路板及精雕开窗的尺寸信息发送至激光雕刻机的控制模块;Sending the size information of the circuit board and the carved window to the control module of the laser engraving machine;
    激光雕刻机的识别模块识别涂覆于线路板上的保护层的图像,并将其传送至控制模块与所述尺寸信息比对,计算激光雕刻的路径;An identification module of the laser engraving machine identifies an image of the protective layer applied on the circuit board and transmits it to the control module to compare with the size information to calculate a path of the laser engraving;
    使激光雕刻机的激光头移动至预设开窗的边缘处,根据激光雕刻的路径去除多余的保护油墨,形成所述保护层。The laser head of the laser engraving machine is moved to the edge of the preset window, and the excess protective ink is removed according to the laser engraving path to form the protective layer.
  9. 如权利要求1所述的印刷线路板保护层的制作方法,其特征在于,所述激光雕刻机包括控制模块、识别模块以及激光头,所述识别模块与所述控制模块电连接,所述识别模块用于将所获取的信息传送至所述控制模块,所述控制模块用于控制所述激光头的运动。The method of manufacturing a printed circuit board protective layer according to claim 1, wherein the laser engraving machine comprises a control module, an identification module, and a laser head, wherein the identification module is electrically connected to the control module, and the identification A module is operative to communicate the acquired information to the control module, the control module for controlling movement of the laser head.
  10. 如权利要求1所述的印刷线路板保护层的制作方法,其特征在于,所述激光雕刻机的横向分辨率小于或者等于5µm,所述激光雕刻机的纵向分辨率小于或者等于5µm。The method of manufacturing a printed wiring board protective layer according to claim 1, wherein the laser engraving machine has a lateral resolution of less than or equal to 5 μm, and the laser engraving machine has a longitudinal resolution of less than or equal to 5 μm.
  11. 如权利要求1所述的印刷线路板保护层的制作方法,其特征在于,在步骤S20后,还包括清洗所述线路板残留的保护油墨。The method of manufacturing a printed wiring board protective layer according to claim 1, further comprising, after step S20, cleaning the protective ink remaining on the wiring board.
  12. 如权利要求1所述的印刷线路板保护层的制作方法,其特征在于,所述保护油墨由触变剂和环氧树脂组成。A method of fabricating a protective layer for a printed wiring board according to claim 1, wherein said protective ink is composed of a thixotropic agent and an epoxy resin.
  13. 如权利要求11所述的印刷线路板保护层的制作方法,其特征在于,所述触变剂为氢化蓖麻油衍生物、聚酰胺蜡类、聚脲类、气相二氧化硅、膨润土类、氧化聚乙烯类中的一种或多种。The method of manufacturing a printed wiring board protective layer according to claim 11, wherein the thixotropic agent is hydrogenated castor oil derivative, polyamide wax, polyurea, fumed silica, bentonite, and oxidation. One or more of the polyethylenes.
PCT/CN2018/095290 2018-05-09 2018-07-11 Fabrication method for protective layer of printed circuit board WO2019214051A1 (en)

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