WO2019214051A1 - Procédé de fabrication d'une couche protectrice de carte de circuit imprimé - Google Patents

Procédé de fabrication d'une couche protectrice de carte de circuit imprimé Download PDF

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Publication number
WO2019214051A1
WO2019214051A1 PCT/CN2018/095290 CN2018095290W WO2019214051A1 WO 2019214051 A1 WO2019214051 A1 WO 2019214051A1 CN 2018095290 W CN2018095290 W CN 2018095290W WO 2019214051 A1 WO2019214051 A1 WO 2019214051A1
Authority
WO
WIPO (PCT)
Prior art keywords
ink
layer
protective
protective layer
circuit board
Prior art date
Application number
PCT/CN2018/095290
Other languages
English (en)
Chinese (zh)
Inventor
胡军辉
王亮亮
郭冉
Original Assignee
深圳市百柔新材料技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市百柔新材料技术有限公司 filed Critical 深圳市百柔新材料技术有限公司
Priority to DE112018007569.9T priority Critical patent/DE112018007569T5/de
Publication of WO2019214051A1 publication Critical patent/WO2019214051A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material

Definitions

  • the present application belongs to the technical field of circuit board manufacturing, and more particularly to a method for manufacturing a printed circuit board protective layer.
  • the printed circuit board is a support for electronic components, referred to as PCB.
  • the PCB usually includes a single layer or a multi-layer circuit.
  • a protective layer needs to be applied on the surface of the PCB, commonly known as "green oil.”
  • the current method for making the protective layer is as follows: silkscreen green oil on the surface of the PCB or a semi-cured green oil is applied to completely cover the PCB, and then the green oil is firmly connected to the surface of the PCB by curing; The excess green oil is then removed by exposure to the wet chemical method used first to form a window.
  • the method is complicated in process and pollutes the water body.
  • the method also requires custom auxiliary materials and equipment, which is costly for small batch production.
  • the purpose of the present application is to provide a method for fabricating a protective layer of a printed wiring board, which aims to solve the technical problem of manufacturing a protective layer by using a wet chemical method of exposure and development in the prior art, which has a complicated process, environmental pollution, and high cost.
  • the application provides a method for manufacturing a protective layer of a printed circuit board, comprising the following steps:
  • step S10 includes:
  • the thickness of the first print layer, the second print layer to the Nth print layer ranges from 3 ⁇ m to 5 ⁇ m.
  • the inkjet printer includes an inkjet head and a radiation source provided on one side of the inkjet head for curing the protective ink.
  • step S10 includes:
  • the ink layer is formed by curing the protective ink using a curing radiator.
  • the curing radiator includes one or both of a light radiator and a heat radiator.
  • the light radiator is an ultraviolet curing furnace
  • the heat radiator is a mesh belt furnace or an oven.
  • the resolution of the preset window is greater than 100 ⁇ m, and the resolution of the window opening is less than 100 ⁇ m.
  • step S20 includes:
  • An identification module of the laser engraving machine identifies an image of the protective layer applied on the circuit board and transmits it to the control module to compare with the size information to calculate a path of the laser engraving;
  • the laser head of the laser engraving machine is moved to the edge of the preset window, and the excess protective ink is removed according to the laser engraving path to form the protective layer.
  • the laser engraving machine includes a control module, an identification module, and a laser head
  • the identification module is electrically connected to the control module
  • the identification module is configured to transmit the acquired information to the control module
  • a control module is used to control the movement of the laser head.
  • the laser engraving machine has a lateral resolution of less than or equal to 5 ⁇ m, and the laser engraving machine has a longitudinal resolution of less than or equal to 5 ⁇ m.
  • step S20 the cleaning ink remaining on the circuit board is further cleaned.
  • the protective ink is composed of a thixotropic agent and an epoxy resin.
  • the thixotropic agent is one or more of a hydrogenated castor oil derivative, a polyamide wax, a polyurea, a fumed silica, a bentonite, and an oxidized polyethylene.
  • the manufacturing method of the printed circuit board protective layer provided by the present application has the beneficial effects that the manufacturing method of the printed circuit board protective layer of the present application is first coated and solidified on the surface of the circuit board to form a preset opening window.
  • the ink layer is then taken out by the laser engraving machine to remove the excess protective ink at the inner edge of the preset window to ensure the precision of the window opening.
  • the method does not need to adopt a process such as exposure and development to make a protective layer, and the process is simple and pollution-free, and the ink is protected.
  • the material utilization rate is high, and the resolution of window opening is high, which is suitable for various volume production such as proofing, small batch, and large batch.
  • FIG. 1 is a flow chart of a method for fabricating a protective layer of a printed circuit board according to an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of a circuit board according to an embodiment of the present application.
  • FIG. 3 is a structural view of an ink coating layer provided by an embodiment of the present application.
  • FIG. 4 is a structural view of an ink coating layer according to another embodiment of the present application.
  • FIG. 5 is a structural diagram of a circuit board coated with a protective layer according to an embodiment of the present application.
  • first, second, and the like are used for the purpose of description only, and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” and “second” may include one or more of the features either explicitly or implicitly.
  • the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.
  • the manufacturing method of the printed circuit board protective layer comprises the following steps:
  • the circuit layer 11 and the insulating layer of the circuit board 1 have been completed, and the protective layer 3 protects the surface of the circuit board 1.
  • the carved window 301 on the protective layer 3 exposes the lines on the surface of the circuit board 1 for subsequent soldering, tin plating, and the like.
  • the manufacturing method of the protective layer of the printed circuit board provided by the present application is compared with the prior art, and the manufacturing method of the protective layer of the printed wiring board of the present application is first coated and solidified on the surface of the circuit board 1 to form the ink having the preset opening window 201.
  • Layer 2 then remove the excess protective ink at the inner edge of the preset window 201 by the laser engraving machine to ensure the precision of window opening.
  • the method does not need to adopt the process of exposure and development to make the protective layer 3, the process is simple, no pollution, and the ink is protected.
  • the material utilization rate is high, and the resolution of window opening is high, which is suitable for various volume production such as proofing, small batch, and large batch.
  • the resolution of the preset window 201 is greater than 100 ⁇ m, and the resolution of the window 301 is less than 100 ⁇ m.
  • the ink layer 2 is directly coated on the circuit board 1. Under the limitation of the printing and silk screen technology, the resolution of the preset window 201 is low.
  • the preset window 201 is carved by a laser engraving machine. The excess protective ink is removed to form a carved window 301 having a resolution of less than 100 ⁇ m, which satisfies the precision requirement of the circuit board 1 for the protective layer 3.
  • the protective ink is composed of a thixotropic agent, an epoxy resin or the like, and a thixotropic network can be formed between the thixotropic molecules, so that the ink has a pseudoplastic or thixotropic substance, and the thixotropic agent can be a hydrogenated castor oil derivative.
  • a polyamide wax, a polyurea, a fumed silica, a modified material thereof, a bentonite, an oxidized polyethylene, and the like After the epoxy resin is cured, its long-term heat resistance temperature is above 180oC, so that the ink layer 2 has better heat resistance.
  • the protective ink has photocuring or heat curing properties, and is rapidly cured under a certain light energy or thermal energy radiation, and the thickness of the protective layer is greater than or equal to 10 ⁇ m.
  • the protective ink has the following properties after being completely cured: the breakdown voltage is greater than 1000 V, and the surface hardness is Above 2H, the adhesion to the substrate is greater than 10N.
  • the organic monomer of the small molecule in the protective ink can be connected during the low-temperature photocuring process, and no waste discharge is generated in the subsequent process.
  • step S10 includes:
  • Printing ink is printed and cured on the circuit board 1 using an inkjet printer to form a first printed layer 21;
  • the thickness of the first printing layer 21, the second printing layer 22 to the Nth printing layer ranges from 3 ⁇ m to 5 ⁇ m.
  • an inkjet printer includes an inkjet head and a radiation source.
  • the ink jet head is smaller in size than the wiring board 1, and it is impossible to print the desired ink layer 2 by one-way motion.
  • the printing path of the inkjet head may specifically be: after the inkjet head is printed in the horizontal positive direction, the inkjet head moves a certain distance toward the vertical direction, and then moves the inkjet in the horizontal reverse direction until the single layer printing layer is printed.
  • the radiation source illuminates the printed protective ink to cure or semi-cure the ink. After the protective ink of each layer is printed, the protective ink of the layer is correspondingly in the radiation source. Cured or semi-cured under effect.
  • the relative positions of the ink jet head and the radiation source are not limited herein. More specifically, the protective ink is semi-cured under conditions of light irradiation, and the protective ink after the semi-curing is kept in a non-flowing state at 250 ° C or less.
  • the radiation source emits light as an initiation source to cure the ink of each layer, and the radiation source can be UV light or light emitted by a fluorescent lamp such as an LED.
  • the ink layer 2 can be completely cured by photocuring or heat curing to have high structural strength and insulating electrical properties.
  • the ink layer 2 is composed of the first print layer 21, the second print layer 22, and the Nth print layer 2, where N is an integer greater than or equal to 3.
  • the ink layer 2 may also be formed by superposing only the first printing layer 21 and the second printing layer 22, in which case, the thickness of the first printing layer 21 and the second printing layer 22 are both 5 ⁇ m, and the thickness of the ink layer 2 is It is 10 ⁇ m.
  • step S10 includes:
  • the ink layer 2 is formed by curing the protective ink using a curing radiator.
  • the protective ink is printed on the surface of the wiring board 1 at a time by a screen printing screen, and then the protective ink is cured by a curing radiator to form the ink layer 2.
  • the screen printing screen is printed, the printing head is unidirectionally printed in the horizontal direction, or unidirectionally printed in the vertical direction, and the ink layer 2 is formed in one printing.
  • the protective ink is cured by the curing radiator, the specific steps are as follows: the circuit board 1 is placed in an optical radiator such as an ultraviolet curing oven, the ink is protected by light, semi-cured, and formed into a non-flowing state, and then the circuit board 1 is placed in the net. In the heat radiator with a furnace or an oven, the protective ink is completely cured.
  • step S20 Referring to FIG. 5, in step S20:
  • the excess protective ink at the inner edge of the preset opening window 201 is removed using a laser engraving machine to form a sculpted opening window 301.
  • the lateral resolution of the laser engraving machine is less than or equal to 5 ⁇ m
  • the longitudinal resolution of the laser engraving machine is less than or equal to 5 ⁇ m, thereby ensuring the precision of laser engraving, so that the precision of the engraving window 301 satisfies the design requirements.
  • Step S20 includes:
  • the identification module of the laser engraving machine identifies the image of the ink layer 2 coated on the circuit board 1, and transmits it to the control module to compare with the size information to calculate the path of the laser engraving;
  • the laser head of the laser engraving machine is moved to the edge of the preset window 201, and the excess protective ink is removed according to the laser engraving path to form the protective layer 3.
  • the laser engraving machine comprises a control module, an identification module and a laser head.
  • the identification module is electrically connected with the control module. After the information acquired by the identification module is transmitted to the control module, the control module can calculate the movement path of the laser head according to the information, and control the laser. The movement of the head.
  • the identification module of the laser engraving machine takes a picture of the image of the circuit board 1 and the ink layer 2, and sends the taken photo to the control module, and after the control module analyzes, Comparing the size information of the circuit board 1 in the photo information with the pre-stored size information of the circuit board 1, and positioning the position of the engraving window 301 by the size information of the pre-stored engraving window 301, and calculating the laser head carving
  • the path is then moved to the top of the preset window 201, and the excess protective ink is removed in accordance with its calculated path motion to form the protective layer 3.
  • the manufacturing method of the printed circuit board protective layer further comprises cleaning the residual protective ink on the circuit board to remove the waste ink remaining after the laser burning, thereby further improving the surface quality of the circuit board.
  • the steps of tin plating, soldering, etc. may be included, which are not limited herein.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

L'invention concerne un procédé de fabrication d'une couche de protection d'une carte de circuit imprimé, comprenant les étapes suivantes : application d'une encre de protection sur une surface d'une carte de circuit imprimé (1) et son durcissement pour former une couche d'encre (2), la couche d'encre (2) ayant une fenêtre ouverte prédéfinie (201) et l'épaisseur de la couche d'encre (2) étant supérieure ou égale à 10 µm ; puis utilisation d'une machine de gravure au laser pour éliminer l'excès d'encre de protection des bords internes de la fenêtre ouverte prédéfinie (201) de manière à former une couche de protection qui comprend une fenêtre ouverte gravée finement (301). Le procédé de fabrication d'une couche de protection d'une carte de circuit imprimé selon la présente invention n'exige pas l'utilisation de processus tels que l'exposition et le développement pour fabriquer une couche de protection, et la technique associée est par conséquent simple et non polluante ; le taux d'utilisation du matériau d'encre de protection est élevé, la résolution de la fenêtre ouverte est élevée et la présente invention est appropriée pour la production de diverses dimensions, telles que la production d'épreuves, de petits lots et de grands lots.
PCT/CN2018/095290 2018-05-09 2018-07-11 Procédé de fabrication d'une couche protectrice de carte de circuit imprimé WO2019214051A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112018007569.9T DE112018007569T5 (de) 2018-05-09 2018-07-11 Verfahren zum Herstellen einer Leiterplattenschutzschicht

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810438086.4A CN108419378B (zh) 2018-05-09 2018-05-09 印刷线路板保护层的制作方法
CN201810438086.4 2018-05-09

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Publication Number Publication Date
WO2019214051A1 true WO2019214051A1 (fr) 2019-11-14

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PCT/CN2018/095290 WO2019214051A1 (fr) 2018-05-09 2018-07-11 Procédé de fabrication d'une couche protectrice de carte de circuit imprimé

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Country Link
CN (1) CN108419378B (fr)
DE (1) DE112018007569T5 (fr)
WO (1) WO2019214051A1 (fr)

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CN109511230B (zh) * 2018-09-20 2020-10-23 通元科技(惠州)有限公司 一种线路板阻焊喷印加工方法
CN111208669A (zh) * 2018-11-21 2020-05-29 深圳市百柔新材料技术有限公司 发光二极管背光板及其制造方法
CN111299842B (zh) * 2018-12-11 2022-04-05 深圳市百柔新材料技术有限公司 高精度激光雕刻阻焊层的方法
TWI741370B (zh) * 2019-09-17 2021-10-01 李家銘 具有層間導孔的線路結構的製法
CN111417263A (zh) * 2020-04-30 2020-07-14 上海创功通讯技术有限公司 电路板结构制造方法、电路板结构及电子设备
CN112571976A (zh) * 2020-11-26 2021-03-30 中国电子科技集团公司第五十八研究所 一种用于陶瓷封装产品表面的直写式油墨标识涂覆方法
CN112672533B (zh) * 2020-12-09 2022-09-09 惠州市特创电子科技股份有限公司 线路板、板体及其开窗加工方法
CN114267777B (zh) * 2021-12-17 2023-12-12 Tcl华星光电技术有限公司 一种显示面板的制备方法、显示面板及显示装置
CN114698252A (zh) * 2022-03-18 2022-07-01 信丰迅捷兴电路科技有限公司 一种利用挠性油墨的挠性线路板焊盘开窗制作工艺

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Publication number Publication date
CN108419378A (zh) 2018-08-17
CN108419378B (zh) 2019-12-20
DE112018007569T5 (de) 2021-01-21

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