GB2384119B - A printed circuit board - Google Patents

A printed circuit board

Info

Publication number
GB2384119B
GB2384119B GB0200509A GB0200509A GB2384119B GB 2384119 B GB2384119 B GB 2384119B GB 0200509 A GB0200509 A GB 0200509A GB 0200509 A GB0200509 A GB 0200509A GB 2384119 B GB2384119 B GB 2384119B
Authority
GB
United Kingdom
Prior art keywords
circuit board
printed circuit
printed
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0200509A
Other versions
GB0200509D0 (en
GB2384119A (en
Inventor
Anthony Banks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Technologies UK Ltd
NEC Corp
Original Assignee
NEC Technologies UK Ltd
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Technologies UK Ltd, NEC Corp filed Critical NEC Technologies UK Ltd
Priority to GB0200509A priority Critical patent/GB2384119B/en
Publication of GB0200509D0 publication Critical patent/GB0200509D0/en
Publication of GB2384119A publication Critical patent/GB2384119A/en
Application granted granted Critical
Publication of GB2384119B publication Critical patent/GB2384119B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB0200509A 2002-01-10 2002-01-10 A printed circuit board Expired - Fee Related GB2384119B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0200509A GB2384119B (en) 2002-01-10 2002-01-10 A printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0200509A GB2384119B (en) 2002-01-10 2002-01-10 A printed circuit board

Publications (3)

Publication Number Publication Date
GB0200509D0 GB0200509D0 (en) 2002-02-27
GB2384119A GB2384119A (en) 2003-07-16
GB2384119B true GB2384119B (en) 2006-03-01

Family

ID=9928870

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0200509A Expired - Fee Related GB2384119B (en) 2002-01-10 2002-01-10 A printed circuit board

Country Status (1)

Country Link
GB (1) GB2384119B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108419378B (en) * 2018-05-09 2019-12-20 深圳市百柔新材料技术有限公司 Method for manufacturing protective layer of printed circuit board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09331154A (en) * 1996-06-11 1997-12-22 Nec Corp Photo viahole and forming method thereof
JP2000151111A (en) * 1998-08-31 2000-05-30 Toppan Printing Co Ltd Substrate for semiconductor device
EP1026928A2 (en) * 1999-02-08 2000-08-09 Ford Motor Company Bond pads for fine-pitch applications on air bridge circuit boards
US6218630B1 (en) * 1997-06-30 2001-04-17 Fuji Photo Film Co., Ltd. Printed circuit board having arrays of lands arranged inside and outside of each other having a reduced terminal-pitch
JP2002064274A (en) * 2000-08-21 2002-02-28 Toppan Printing Co Ltd Via hole structure, forming method therefor and multilayer wiring board using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09331154A (en) * 1996-06-11 1997-12-22 Nec Corp Photo viahole and forming method thereof
US6218630B1 (en) * 1997-06-30 2001-04-17 Fuji Photo Film Co., Ltd. Printed circuit board having arrays of lands arranged inside and outside of each other having a reduced terminal-pitch
JP2000151111A (en) * 1998-08-31 2000-05-30 Toppan Printing Co Ltd Substrate for semiconductor device
EP1026928A2 (en) * 1999-02-08 2000-08-09 Ford Motor Company Bond pads for fine-pitch applications on air bridge circuit boards
JP2002064274A (en) * 2000-08-21 2002-02-28 Toppan Printing Co Ltd Via hole structure, forming method therefor and multilayer wiring board using the same

Also Published As

Publication number Publication date
GB0200509D0 (en) 2002-02-27
GB2384119A (en) 2003-07-16

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20080110